FLEX SOLUTIONS

DESIGN GUIDE
EN
CONTENTS

The trend towards miniaturization in electronics continues unabated. Efficient

use of the ever-shrinking package volume in all three dimensions with a
mechatronic PCB solution is becoming increasingly popular. At the same time,
system benefits in terms of reliability, signal integrity and system cost are
becoming increasingly important.

Flexible polyimide films with a typical thickness of 50 µm are high temperature

resistant materials and can be used with copper lamination as base material for
PURE.flex or in combination with rigid base materials as RIGID.flex PCBs using
all common soldering methods. Thin FR4 layers are also bendable and are used
in SEMI.flex and BEND.flex printed circuit boards. Finally, thermoplastic poly­
urethane is used in STRETCH.flex stretchable PCBs.

Over the past decades, Würth Elektronik has accumulated extensive know-how
through the projects and orders it has already realized for a wide range of
structures and applications, from aerospace to dental equipment, and currently
supplies more than 600 customers. Due to the broad technology spectrum
offered, the best possible selection in terms of performance and cost can be
made for every requirement.

In the following, you will find system considerations that explain the
different variants of Flex Solutions and give practical advice on design:

1 Flex solutions in system considerations  3

2 Innovative Flex Solutions  4

3 Application examples  5

4 Project checklist for system requirements  6

5 Choosing the right technology  7

6 Materials and build-up parameters - standards  10

7 Mechanical design  15

8 Layout und routing  17

9 The RIGID.flex printed circuit board documentation  18

10 Further processing  18

11 Costs, system costs  19

Basically, standards must be observed such as IPC-2223,

IPC-6013, Basic Design Rules from Würth Elektronik as well
as variant-specific design rules and our drying regulations. !
02 WÜRTH ELEKTRONIK CIRCUIT BOARD TECHNOLOGY | 09/23
 1 FLEX SOLUTIONS
IN THE SYSTEM VIEW

A SYSTEM CAN BASICALLY BE FORMED IN DIFFERENT WAYS

Inhomogeneous system Homogeneous system Partially homogeneous system

LP1 LP2

LP1 LP2 LP1 LP1 LP1 LP2

LP1 LP2
LP1 LP2 LP1 LP2
4 Lagen HDI 10 Lagen

Rigid printed circuit board + cable Identical stackup in all rigid Subsystems vary greatly in terms
harness/flex soldered or plugged areas and integrated flex layer(s) of technology and size: e.g.
(detachable) throughout RIGID.flex/connector combination

• Only a few connections • Significantly higher wiring density • Separable

• Non critical applications only • Saves valuable space by elimi- • Suitable for modular systems
• Wiring errors possible nating connection points (solder
• Many individual components pads or footprint of connectors)
• High test and assembly effort • Best wiring reliability

TIP:
The smaller and simpler part
PCB1 should be provided with
the integrated wiring.

Flex solutions are mechatronic components. In addition Because the design phase determines the later cost
to the electronic function, great attention must be paid structure, consideration of all electrical and mechanical
to the mechanical constraints. intersections must already be made in the concept phase.

Comp. A Comp. B Comp. A Comp. B Comp. C

2D

3D
Comp. D Comp. E Comp. C Comp. D Comp. E

In addition, a precise selection of the optimum compo-

nents and substrate technology is necessary in order to
reliably meet the required operating conditions. Product
development also includes having a precise idea of the
assembly, soldering process, testing and device assembly.

WÜRTH ELEKTRONIK CIRCUIT BOARD TECHNOLOGY | 09/23 03

 2 INNOVATIVE FLEX SOLUTIONS

Reliability Signal integrity

Dynamic
Miniaturization
bending

ADVANTAGES OF USING HOMOGENEOUS FLEX SOLUTIONS

Miniaturization Reliability
• Additional layers for components • Fewer contacts in the overall system
• Possibility of folding • Wiring errors are eliminated
• Saving of area for connector footprints • Less mass (weight)
• Weight reduction • Shock and vibration resistant
• Integration of interfaces • Easier testability
• Ultra-thin structures • Easy mounting

Signal integrity Dynamic bending

• Elimination of impedance jumps at • Flexibility and stability are opposing
connectors / cables / solder joints • Properties
• Reference layers are possible • Dynamic flexes are ideally
• Reference layers with grid advantageous, • Only 1-layer in the bending area
calculation is possible • Special copper grades are sometimes available
• Project specific stackup
System cost reduction with
improved performance
• Simple assembly
• Smaller housing
• Savings in cables and connectors
• Simplified testability
• Reduced complexity and cost for
assembly and logistics

Idea Mechanics Software Electronics

Specification PCB design
Concept development development development

Projects with Flex solutions:

Interdisciplinary collaboration during development is essential!

04 WÜRTH ELEKTRONIK CIRCUIT BOARD TECHNOLOGY | 09/23

 3 EXAMPLES OF APPLICATIONS

Rigid-flexible printed circuit board Dynamic printed circuit board system Sensor application with maximum
in a camera with high-resolution used in the control system of a patient miniaturization for most demanding
sensors, USB3 interface and a data couch for medical radiation therapy. environment (top) and high-tech cable
transfer rate of 420 MByte per harness (bottom).
second. • RIGID.flex 1Ri-2F+2F+2F-1Ri
• SLIM.flex 4F (top) and
• RIGID.flex 3Ri-2F-3Ri SLIM.flex 6F (bottom)

Heart of a pneumatic valve for Semi-flexible printed circuit board Sensor electronics for medical
digitized pneumatics. Robust and around the battery box of a compact technology in flexible PCB technology
cost-effective alternative to RIGID.flex. and powerful system flash unit. with local stiffener.

• BEND.flex 2Ri-4Ri + HDI 2-2-2 • SEMI.flex 1Ri-3Ri • PURE.flex 2F-Ri

!
Your challenges drive us
We support you in the early development phase of your
products and develop customized solutions together with
you in projects. Contact us by mail ([email protected])
or by phone at +49 7940 946-flex (3539).

WÜRTH ELEKTRONIK CIRCUIT BOARD TECHNOLOGY | 09/23 05

 4 PROJECT CHECKLIST
FOR SYSTEM REQUIREMENTS

a) Technical requirements for the end product: g) Mechanical requirements PCB:

Target market, key features, unique selling proposition Static or dynamic application, PCB thickness, stability,
if applicable, life cycle, size, visual appearance. aspect ratio drill diameter/PCP thickness, bending radii,
ratio bending radius/flex thickness, bending shape,
b) Commercial requirements: number of bending cycles, bending frequency.
Unit quantities, cost targets, schedule prototypes,
pre-production, production release, ramp-up, second h) Electrical requirements PCB:
source, audit planning if applicable. Power, dielectric strength, current, insulation and
shielding, EMC, number of signals over the flex area,
c) Regulatory requirements: number of flex layers, signal integrity, impedance
Approvals, regulated market medical technology, BAFA requirements, surface resistance
relevance, UL: Check UL Guidelines for the application:
check minimum requirement for the PCB – no over- Number of flex layers 1 2 4 6 8 10 12
specification! PURE.flex
RIGID.flex Flex outside
d) Reliability requirements: SLIM.flex
E.g. classification according to IPC class 1/2/3, failure
RIGID.flex Flex inside
risk analysis, product liability, quality management
SEMI.flex / BEND.flex
agreement, industry-specific requirements e.g. APQP
(Advanced Product Quality Planning) or PPAP (Produc­ STRETCH.flex
tion Parts Approval Process), Traceability.
i) Type and placement of components,
e) Product operating conditions: packaging and connection technology:
Environmental conditions such as temperature, thermal Viatechnology-determining components such as BGA,
cycling, heat dissipation, humidity, shock and vibration, stackup, PTH, microvia, buried via, anylayer via, filling,
flame resistance, assembly/soldering/repair, test bare chip technology, solder surface, delivery panel,
procedures for environmental and reliability tests. legend print, press-fit technology, embedded compo-
nents.
f) Casing size, material and shape:
Analysis of all mechanical and electrical interfaces, j) T
 esting and packaging:
display, switches, connectors, interfaces to other Electrical and mechanical test of the PCB, documen­
devices or modules. Construction of a 3D model tation product test (detailed initial sample test report
(paper+scissors / mCAD+eCAD) with the aim to find recommended for complex stackup, specify test
an area optimum for the 2D development of the circuit criteria), packaging.
carrier.
k) Further processing of the PCB:
Design-for-drying, options of drying prior to soldering,
logistics, dry storage, depaneling, handling, bending
tools, casing assembly, installation tolerances and
fastening options.

! "L" shape better than "T"!

Würth Elektronik is happy to offer the
optimum benefit (best price!)

06 WÜRTH ELEKTRONIK CIRCUIT BOARD TECHNOLOGY | 09/23

 5 THE CHOICE
OF THE RIGHT TECHNOLOGY

POSSIBLE VARIANTS:

PURE.flex RIGID.flex outside RIGID.flex inside

2F (PURE.flex) 1F-3Ri 3Ri-2F-3Ri

2F-Ri (PURE.flex with stiffener) 2Ri-4F 2Ri-4F-2Ri + HDI 1-6b-1

• Very thin flex film polyimide 1F-5Ri + 2-2(4b)-2

• Up to two copper layers
• Partially reinforced 3Ri-2F+2F+2F+2F-3Ri
by "stiffener"
• Photosensitive solder mask or
cover foil (Polyimide Coverlay)
• Delivered individually or as
panel array

Note
Stackup RIGID.flex 1F-0Ri can be
cheaper than a PURE.flex 1F-Ri

For comparison
1F-Ri (PURE.flex with stiffener)

• Place components on stable rigid section

stiffener • Flexible area 1 to 12 layers, bonded/unbonded (with airgap)
• Flexible layers outside or symmetrical inside made of polyimide
• Rigid area: with standard solder mask
• Flex area: highly flexible flex solder mask or cover film
(polyimide coverlay)
1F-0Ri (RIGID.flex with depth milling)

FR4 core

WÜRTH ELEKTRONIK CIRCUIT BOARD TECHNOLOGY | 09/23 07

POSSIBLE VARIANTS:

SEMI.flex / BEND.flex SLIM.flex STRETCH.flex

SEMI.flex 1Ri-3Ri SLIM.flex 4F-Ri in Anylayer

microvia technology

stiffener

Top

Bottom

SEMI.flex 2Ri-4Ri solder carrier STRETCH.flex 1S-Ri

• FR-4.0 printed circuit board • Anylayer HDI flex technology • Stretchable circuit carriers
with bending area by deep • Very thin made of thermoplastic poly­
milling process, bendable in • Highly resilient, robust urethane
one direction • Flexible and reliable • Conductors in e.g. meander
• Cost-effective • Impedance-defined structure or snake shape for extreme
possible flexibility
• Optionally with solder carrier • Dynamic extensibility depen-
BEND.flex and stiffener ding on design from 5 – 20%.
• FR-4.1 PCB with bending • Almost any shape can be
area, manufactured like Applications realized
RIGID.flex without polyimide • Vision Technology • Skin friendly
foil, bendable in both direc- • Medical technology • Can be combined with textiles
tions • Sensor technology • Thermoformable
• High-tech cable harness
Notes
• Often cheaper than a plug-
cable-connector solution
• Significantly better and
cheaper than shielded cables
and connectors

08 WÜRTH ELEKTRONIK CIRCUIT BOARD TECHNOLOGY | 09/23

INDICATORS FOR PREFERRED USE OF INDIVIDUAL VARIANTS:
Variant Indicators for Comments
Very small, dense circuits Microvias and contour possible by laser
Very limited installation space Flex foil 50 µm thick
Use in vacuum Practically no outgassing
PURE.flex / SLIM.flex xF High operating temperatures PI can be used up to 200 °C (without solder mask)
Good thickness tolerance,
High frequency applications
Cu treatment flat, small loss factor
Vias in flex area ATTENTION: elaborate, (see table ff)
PURE.flex / SLIM.flex Reinforce placement areas mech. / solder carrier,
Stability for placement and use
with Stiffener xF-Ri heat dissipation problem / metal heatsink bonded
Flex-to-install with large bending radii Inexpensive solution, miniaturization
SEMI.flex Large PCB with angled connector Only bendability required
Flex material not allowed Only rigid base materials
Unprocessed glass mats can be
BEND.flex Bending direction arbitrary
loaded in tension and compression
Large area Flex Laser cut panels very stable
1:1 wiring over flex area Less expensive compared to xRi-2F-xRi
RIGID.flex 1F-xRi
Small bending radii Flex area Thin, highly flexible flex coating or cover film
Short drying times Flex layer outside
High-frequency connection component-to-
No vias required for layer change
connector via flex area with reference layer
RIGID.flex 2F-xRi
In flex area only layout on layer 2 -
High dynamic continuous bending
No metallization of the flex area

Copper in neutral phase ideal,

RIGID.flex xRi-1F-xRi High dynamic continuous bending
no metallization of the flex area

Polyimide also with 75 or 100 µm

Reference layer in flex area due to signal integrity
RIGID.flex xRi-2F-xRi possible for impedance control
High reliability requirements Robust technology, mechanical stability
RIGID.flex xRi-4F-xRi Coaxial impedance structures in flex area Air gap xRi-2F+2F-xRi is not suitable here

INDICATORS AGAINST THE USE OF INDIVIDUAL VARIANTS:

Variant Indicator against Remarks
PURE.flex / SLIM.flex Wired components or connectors Low mechanical stability
PURE.flex with stiffener Many individual reinforcements Better use RIGID.flex 1F-xRi
Bending with milled surface outside,
Do not load glass mat in tension
SEMI.flex S-shaped bending in one surface
Fastening to multi-part housing Mounting tolerances affect Semiflex area
RIGID.flex 1F-xRi - -
Due to buckling during bending, this is made more
RIGID.flex xRi-2F+2F-xRi Length of flex area shorter than 50 mm
difficult or impossible if the flex area is too short.

! Rules for copper structures, via sizes and solder mask can
be found in BASIC Design Rules from Würth Elektronik.

! A more detailed analysis of the requirements from the

project checklist (chapter 4) should be made in a project
discussion with our specialists.

WÜRTH ELEKTRONIK CIRCUIT BOARD TECHNOLOGY | 09/23 09

 6 MATERIALS AND DESIGN PARAMETERS –
STANDARDS

IPC CLASS 2, USE A (FLEX-TO-INSTALL)

Flex material Polyimide core 50 µm standard, up to 70 µm copper, adhesiveless, coverlay film 25 µm partial or flexible solder mask
Rigid material FR-4.1 Tg150°C, filled, halogen free: IPC-4101C / 128 (92,94,127)
inner layers 18(standard)/35/70 µm // outer layers 12/18/35 µm +
Copper thickness
plating (for 1F-xRi Flex on outer layer)
PCB thickness depending on number of layers: PURE.flex / SLIM.flex > 100 µm, RIGID.flex / SEMI.flex ≥ 0.8 mm
Solder surface ENIG and optionally nickel-free immersion solder surface

Further requirements e.g. regarding materials, stackup, use case Use B etc. on request!

STANDARD STACKUPS FLEX SOLUTIONS SOLDER SURFACES

Standards make our lives easier, ensure the quality of To ensure solderability, exposed copper surfaces are
products and services and reduce costs. That's why we provided with a solder surface.
offer standard stackups for many technologies that are When making your selection, please consider, among
customary in the market and cost-optimized. other things, the suitability with regard to
You can use these standards as a basis for your solutions
and modify them according to your requirements. • drying processes: Aging due to temperature stress
• bending: Nickel containing surfaces such as ENIG are
• PURE.flex (www.we-online.com/pureflex-stackups) not suitable for bends.
• RIGID.flex (www.we-online.com/rigidflex-stackups)
• SLIM.flex (www.we-online.com/slimflex-stackups)

Of course, we also produce stackups according to your

individual, project-specific requirements, after we have
checked them for technical feasibility. Please contact us!

COMBINATION WITH OTHER TECHNOLOGIES

It is possible to combine Flex solutions with other techno-

logies, for example with
• High Density Interconnect MICROVIA.hdi Combination
• DEVICE.embedding RIGID.flex 1F-5Ri + HDI 1-4b-1
• Printed Polymer and Heatsink
• Heatsink
An adaptation of the individual design rules is usually
necessary.

MINIATURIZATION TO THE POWER OF TWO: DIVERSE COMBINATIONS OF RIGID.FLEX AND HDI

Little space in the housing and micro-BGA components on • The HDI design rules must be adapted to the stackups
the circuit: Miniaturization to the power of two? and processes of the RIGID.flex technology and cannot
be transferred 1:1. The aspect ratio between hole depth
WE HAVE THE SOLUTION: and hole diameter has to be considered.
With combinations of RIGID.flex and elements from High Click here for the HDI Design Guide.
Density Interconnect, you can alleviate even tight spaces. • Standard RIGID.flex stackups with HDI 1-x-1: All higher
layer stackups are suitable for microvias on the outer
Microvias, filled holes, locally finest copper structures and layers.
thus a clever unbundling of BGA footprints save a lot of
space. RIGID.flex technology also saves installation space
for connectors and cable harnesses, and the circuit can be
folded into the housing to save space.

10 WÜRTH ELEKTRONIK CIRCUIT BOARD TECHNOLOGY | 09/23

from left: 1F-xRi / 2F-xRi / xRi - 2F - xRi / xRi - 4F - xRi
• For the use of multiple microvia layers and buried vias, EXAMPLE FROM PRACTICE
the stackup must always be adapted. Here we are hap-
py to make a suggestion. The cooperation of the PCB designer with the specialists
• After selecting the via strategy, the stackup must be of our technical project management led to a reliable and
adjusted accordingly. well manufacturable product by small adjustments of the
• IMPORTANT: In addition, the following must be taken design rules. For example, stacked microvias with copper
into account: filling could be avoided.
• The minimum possible copper structures in the PCB
design depend on the copper layer thickness.
The requirements for minimum copper layer
thicknesses are based, among other things, on the IPC
class specification.
Filling and plating processes generate additional
copper buildup and thus limit the use of ultra-fine
structures.
The combination of different via types can lead to
multiple plating processes and thus defines or limits
the smallest possible structures in the PCB design.
UFBGA 169 P 0.5 mm W-CSP138 P 0.4 mm

EXAMPLE Technology: HDI-RIGID.flex with BGA component pitch 0.4 mm

• RIGID.flex 4Ri-2F-4Ri + HDI 3+4b+3
• Special design rules local in µBGA area
Microvia pad smaller : 250 µm
µBGA pad smaller: 240 µm
Solder resist clearances 50 µm, partly 40 µm
basically Microvia-in-Pad
partial conductor width / spacing: 70 µm / 90 µm asym-
metric (layers 2/3/8/9 with plating)

• Layers 1 and 12 (top and bottom): PTH (IPC class 2) +

PTH Filled&Capped (type VII) + Microvia
• Layers 2 and 11: Microvia with copperfilling
• Layers 3 and 10: Microvia + Buried Via Filled&Capped
(IPC-4761 type VII) (IPC class 2)
• Layers 4 to 9: inner layer copper without plating left stackup RIGID.flex 4Ri-2F-4Ri + HDI 3+4b+3, right
spatial via structure

!
For all via combinations, individual
coordination on the stackup and
structures with the FLEXperts is
­required. Please contact us as early
as possible! [email protected]

WÜRTH ELEKTRONIK CIRCUIT BOARD TECHNOLOGY | 09/23 11

RIGID.FLEX WITH IMPEDANCE-DEFINED STACKUPS, IMPEDANCE MEASUREMENT WITH RIGID.FLEX.
The variants within the RIGID.flex technologies allow the selection of different impedance models in the design phase.
By tuning and adapting the stackups and the design parameters, all common interface specifications can be simulated
and measured.

BASIC ADVANTAGES OF RIGID.FLEX REGARDING STACKUP AND COPPER DESIGN:

SIGNAL INTEGRITY HATCH
A cross-shaped rasterization of the reference layers
• Reproducible impedance behavior between rigid leads to
areas, elimination of impedance jumps at connectors, • Improvement of bendability
­cables and solder joints as well as fluctuations due to • improvement of drying possibilities before soldering
manufacturing tolerances • Increase impedance, thinner, less expensive polyimide
• Flexible areas as cable harness with reference or foils can be used.
­shielding, coplanar is also possible
• Higher flexibility in comparison with cables, can be Screening should always be used in non-critical areas and
­designed with copper pitches. up to 5 to 6 GHz. As a compromise, non-screened copper
can be used locally for an undisturbed return path under
VARIANT-SPECIFIC ADVANTAGES OF THE RIGID. critical signals.
FLEX VARIANT 2F-XRI

This design has some specific advantages

• 1:1 transmission of signals over the flex area without
layer change, thus no impedance jumps and reflections
• Contacting of the reference layer via microvias possible
without major additional effort
• Signal routing optionally also possible on inner layer /
layer 2 without plating tolerances.

IMPEDANCE CALCULATION

With the specifications of the impedance values and the

relevant signal or reference layers, we can modify a
stackup for you according to production requirements as
left stackup RIGID.flex 2F-6Ri - HDI 1-6-1, right printed well as determine the necessary design parameters.
circuit board As a result, you will receive the calculation and documen-
tation as shown below using the example of a RIGID.flex
2F-4Ri + HDI 1-4-1 stackup.

12 WÜRTH ELEKTRONIK CIRCUIT BOARD TECHNOLOGY | 09/23

COMPARISON OF FLEXIBLE SOLDERMASK VERSUS COVERLAY
RIGID.flex circuit boards often differ not only in their application-specific design but also in the structure and coating of
the flex areas. While the rigid areas are covered with a standard green solder resist, as with rigid PCBs, two different
coatings are used for the flexible areas:

EXAMPLES

Flex outside: left flex solder resist Center coverlay Right: Flex inside with Coverlay

FLEXIBLE SOLDER RESIST OR COVERLAY OR COVER FILM

COVERCOAT Coverlay is a composite film consisting
Flex soldermask is a varnish, i.e. a of polyimide film and adhesive layer.
mixture of binder, solvent and Polyimide film thickness standard 25
pigments. In contrast to solder resist µm, adhesive thickness matching the
for rigid printed circuit boards, flex copper layer thickness. Other polyimi-
resist remains flexible after curing, de film thicknesses optional. Cutting or
ideally resistant to folding. Flex varnish laser, manual registration and tacking,
is applied by inkjet or screen printing. pressing in vacuum press.

!
WHEN CAN I CHOOSE BETWEEN FLEXIBLE
SOLDERMASK AND COVERLAY?
Are you looking for a special solution?
The choice is only possible for the variants with 1F-xRi and
Talk to our FLEXperts!
2F-xRi outer flex layers - and even then only for the outer
layer. With Stackup 2F-xRi, copper layer 2 is always
protected with a Coverlay, as are all copper layers with
inner flex layers.
With PURE.flex, it is also possible to choose between flex
coating and overlay.

WÜRTH ELEKTRONIK CIRCUIT BOARD TECHNOLOGY | 09/23 13

COMPARISON OF SELECTED PROPERTIES
Flexible soldermask Coverlay
Colour Green Amber / brown
Composition Mixture of binder, solvent and pigments Composite film of ­polyimide film and
adhesive layer
Registration Automatic, optical mechanical
Application Liquid by inkjet or screen printing Manual application, vacuum lamination
Structuring Partial application, photo process Cutting, lasering
Design Very variable, small individual areas possible Small individual areas must be connected
in the PCB and/or in the delivery array
Dynamic bending application No Yes
Applicable to inner layers No Yes
Applicable to outer layers Yes Yes
Maximum copper thickness up to 70 µm up to 70 µm
Minimum distance vias and Smaller, see Design Rules parameter "G" Larger, see Design Rules parameter "G"
pads to rigid-flex intersection
Use in vacuum Limited Very good
Mechanical robustness Lacquer with pencil hardness ≥ 3H Resistant film
Dielectric strength Approx. 150 V at 5 µm thickness Approx. 3500 V/mil (1 mil = 25.4 µm)
Tenting of microvias Limited Yes
UL Listing Yes Yes
Effort and cost Low effort, inexpensive High effort, more expensive

COVERLAY AS INSULATION FOIL

Coverlay foil can be used as a protective and
insulating foil, both on the rigid areas of a
STARR.flex PCB and on rigid BASIC or HDI
PCBs.

PROPERTIES OF
COVERLAY / COVER FOIL
• Polyimide thickness typically 25 µm,
­adhesive thickness 25 µm or 50 µm
• Flame retardant with rating V-0
• Thermal conductivity 0.2 W m-1 K -1
• Dielectric strength ≥ 4 kV/mil
• Low outgassing

AREAS OF APPLICATION
• Electrical insulation
• Thermal conductivity
• Mechanical protection
• Tight spaces
• Safe spanning of bores

APPLICATIONS
• Engine control units

!
• Busbars
• High current
• Sensors Find here our Design Rules:
https://we-online.com/designrulesisolationfoil

14 WÜRTH ELEKTRONIK CIRCUIT BOARD TECHNOLOGY | 09/23

 7 THE MECHANICAL DESIGN

• Design suitable for plastics: Always provide large cont- Gefalteter Endzustand

our radii on inner and outer radii in the flex areas

• If necessary, provide registration holes for bonding
reinforcements or heatsinks
• Arrange flex extensions to save space, combine several
extensions if possible, use folding technology

• RIGID.flex: • For RIGID.flex with flex inside, a change to the outside

components and connectors always on rigid areas layer by means of vias is recommended near to the
• Contacts for ZIF connectors: ZIF area
- Standard thickness 0.3 mm ± 0.05 mm,
made by depth milling process
- Handling aids and latching hooks possible
- Increased requirement: tolerance +/- 0.03 mm
with polyimide stiffener possible after consultation
(additional costs!)
- Outline cut with laser, micro-bridges allow separation
without cutting tools

Design bending radii depending on flex thickness

Bending radius [mm] 1 2 3 4 5 6 7

IPC-2223:
Flex area 1-layer thickness x 10 Use A

Flex area 2-layers thickness x 10 Flex-to-

install
Flex area 4-layers thickness x 20

SEMI.flex
BEND.flex

• RIGID.flex: use "key and slot" design or plastic holding

frames

WÜRTH ELEKTRONIK CIRCUIT BOARD TECHNOLOGY | 09/23 15

• "Flex Lift-off" – Technique • Fixings: For attachments of flexible areas in RIGID.flex,
Attention: NO copper layout under the flex use small integral rigid areas
and NO vias allowed! - with metallized or non-metallized holes
for fastening to the housing
- as a bending aid and for fastening bent / folded flex areas.

• Lift-off technique with contact and roll-off surface

ideal for continuous bending loads

• Calculation of the flex length

Flex length L
Thickness T
• Option adhesive fillets for stress relief
Case 1 Case 2 Case 3 Case 4 according to IPC-2223 5.2.9

R
Distance A Distance B

Distance C
L ≥ A + π · R + 2 (T – R) L ≥ A + T + R (π – 2)
L ≥ A + R (π – 2) L ≥ B + C + T 0,43 · R

Geometric conditions:
A + 2T ≥ 2R A ≥ 2R A + T ≥ 2R R > T/2

• With short flexible areas, four bonded flex layers are

easier to bend than 2+2 flex layers with airgap

Compression of the inner

flex core at tight bend radii

Air gap designs must have a sufficient length of the flex

area, we recommend at least 50 mm.

16 WÜRTH ELEKTRONIK CIRCUIT BOARD TECHNOLOGY | 09/23

 8 LAYOUT AND ROUTING

SPECIAL FEATURES AND RECOMMENDATIONS DESIGN RULES

FOR RIGID.FLEX PCBS
• Use extra mechanical layer to describe flex Our Design Rules cover all important parameters you need
and rigid areas in EDA tool to make your project successful. Basically, the rules for line
widths, distances, via and pad sizes as well as for the solder
mask apply, which you will find in our BASIC Design Rules
C
(www.we-online.com/designrulesbasic).
G

Based on these rules, the sectional design rules for

R ≥ 1 mm
G • PURE.flex (www.we-online.com/designrulespureflex)
• SEMI.flex (www.we-online.com/designrulessemiflex)
• RIGID.flex (www.we-online.com/designrulesrigidflex)
• SLIM.flex (www.we-online.com/designrulesslimflex)
• STRETCH.flex
(www.we-online.com/designrulesstretchflex)

LAYOUT / ROUTING IN THE BENDING AREA

• Do not use vias in bending area Large

• Use teardrops contour radii
• Do not remove non functional / non used pads
on the flexible layers Rigid Notch –
• Copper areas on all layers must be hatched to allow area danger of tearing

drying. For more information, please visit

www.we-online.com/dryingspecification
• Impedance Design: • Line routing parallel and perpendicular to the
- Adjustment of the layout parameters in the flex area bending line
to the changed dielectric values is necessary • Right-angled line routing at the flex-rigid transition
- Hatching of the reference layer directly above or • No vias in the bending area on flex PCBs
below differential transmission lines can be omitted, • No change in width or direction of lines in the
but not in the entire reference layer bending area
- For further notes and explanations see chapter 6: • Use round line shapes and large contour radii
­RIGID.flex with impedance defined stackups, • Distribute conductors evenly, fill copper-free areas
­Impedance measurement for RIGID.flex • Offset conductors on TOP/bottom when routing on
• Flexible and rigid-flex PCBs must be dried before both sides (prevent "I-beam" effect)
assembly. Further information can be found at • Always provide full-surface copper reference layers
www.we-online.com/dryingprocess with copper openings to improve flexibility and dryability
in both flex and rigid areas

! !
Regard distances of drill holes For IPC-2223 "Use B" (dynamic
and SMD pads to the bending load) and "Use D"
flex-rigid transition, (UL listing) applications,
see Design Rules Würth Elektronik please consult our specialists!

WÜRTH ELEKTRONIK CIRCUIT BOARD TECHNOLOGY | 09/23 17

 9 THE DOCUMENTATION FOR THE
RIGID.FLEX PRINTED CIRCUIT BOARD

• Include all applicable items from the project checklist • Specify materials as generally as possible, e.g. accor-
(Chapter 4). As a matter of principle, please ensure that ding to IPC specification sheets. Do not dictate material
no over-specification with exaggerated safety margins designations of supplier X with material Y.
is formulated. Beware of copying specifications from • Adhesive layers should generally not be dimensioned,
other projects, this usually leads to excessive costs. but only the total thickness, copper thicknesses and
With regard to UL, a UL94 V-1 specification is almost necessary dielectric thicknesses (e.g. due to impedance
always sufficient. or insulation requirements).
• Define what is leading: drawing or data. Electronic data • General specifications for the creation of an optimal
(Gerber/ODB++, CAD data) already contain all geometric ­delivery panel and possible positions for webs. In the
dimensions. flex area, laser cutting offers a preferred alternative.
• No over-specification: a good drawing shows the flat A delivery array specified in the inquiry can then be
projection of the circuit (2D), a 3D view of the installa­ replaced by a more favorable one and leads to a more
tion situation and only critical dimensions. Every favorable price due to a better utilization.
redundant dimension on the drawing must be compared
with the electronic data and, if there are discrepancies,
will inevitably lead to clarifications, delays and additional
work resp. costs.

10 FURTHER PROCESSING

DRYING: PANEL SEPARATION NOTES:

As a matter of principle, printed circuit boards already have Please avoid introducing stresses during the separation
a certain moisture content directly after production due to process by using appropriate separation processes to
the manufacturing processes and ambient conditions. avoid damaging sensitive components as well as the PCB.
Thus, without special treatment, they are never free of For flexible and rigid-flex PCBs, the flex material must be
moisture that has diffused into the dielectric materials. cut at the lands before breaking to avoid delamination in
Over the storage period, the moisture content can increase the PCB. Predetermined breaking holes alone are not suffi-
further under unfavorable storage conditions. To avoid cient for this purpose! Please ask for these options, we will
damage during soldering processes, it may be necessary be pleased to make you an offer with a delivery array
to dry the PCBs in a suitable oven immediately before proposal.
assembly or to store them in a dry atmosphere for a
longer period (dry storage cabinet). Under no circumstances
For flexible and rigid-flexible PCBs, this drying is should you use side cutters
mandatory before soldering! for snipping off webs!

The necessary drying parameters depend on the PCB

design (copper areas), the drying equipment and the
arrangement of the PCBs in it, the PCB material, the solde-
ring process and the soldering parameters, the latter if
necessary also multiple and combined from reflow, wave
and partial soldering technology. These drying parameters
must be determined and verified by the PCB assembler.
Particular importance must also be attached to logistics
and, in particular, waiting times, since the dried PCBs

!
absorb moisture again from the environment. Packaging
the PCBs in a moisture barrier bag (MBB) is not sufficient For further information on the subject of
for the supply chain and storage. "drying", please refer to
www.we-online.com/dryingspecification
www.we-online.com/dryingprocess

18 WÜRTH ELEKTRONIK CIRCUIT BOARD TECHNOLOGY | 09/23

11 COSTS, SYSTEM COSTS

Consideration of cost should take place primarily according to the decision to provide reliable electrophysical function of
the printed circuit board. Design and cost are directly related. It is essential to distinguish between PCB costs and system
costs. For a product, only the system costs are relevant, whereas for PCB buyers (only) the PCB costs are relevant. Thus,
a possible conflict of interest is already inherent in the system if the performance and cost targets are not defined before
the start of a development.

FLEXIBILITY AND COSTS IN RELATION – AN ASSESSMENT

Overview costs in % / bending cycles

1200

1000

800

600

500
400

300

310
280
200
175
125

200
100

100

100
20
10
0

0
Multilayer SEMI.flex BEND.flex 1F-xRi 2F-xRi xRi-2F-xRi xRi-2F-xRi
ED-copper RA-copper
costs relative bending cycles

System costs include not only PCB costs but also costs for • Material selection and stackup
components and assembly, installation, testing and Whenever possible, the use of standard stackups should
commissioning, and quality costs. For the overall system, be aimed for. This helps to avoid errors in the stackup
it can be favorable to use a higher-quality PCB technology and the use of exotic materials or material thicknesses.
and thereby achieve higher miniaturization, performance Standard materials are in stock and the PCB can usually
and reliability at the same or even lower system costs. This be delivered more quickly.
can often be seen, for example, in the use of RIGID.flex. Approvals must not be forgotten here. For example,
it can happen that no UL listing is available for designs
The following is a list of factors that influence PCB costs. that deviate from the standard and therefore no UL
marking is possible.
• PCB size and delivery array • Design Structures
Here, early coordination with the PCB manufacturer The finer the structures, the lower the yield in produc­
on the optimal design of the delivery array can bring tion. This increases the costs. Here, too, the (economi-
immense savings. cal) standard should be used as long as possible.
Better utilization can also be achieved through modi- • Mechanical processing
fied nesting, narrower spacing and panel frame and / or Small drills are more expensive and shorter. They can
alterna­tive contour machining. thus drill fewer plates in the stack and wear out faster.
Laser drilling is cheaper for many vias. Complex milling
contours with small diameters can significantly increase
board costs.

WÜRTH ELEKTRONIK CIRCUIT BOARD TECHNOLOGY | 09/23 19

• Multiple pressings are expensive because they require
virtually the entire production run to be repeated several
times. It is worth discussing via strategies and stackups
with the PCB manufacturer at an early stage.
• Other cost drivers are edge metallization, via filling and
thick gold layers.
• Dealing with X-out:
A certain amount of bad parts should be allowed in
multiple-delivery arrays. Too strict a delivery specifi­ca­
tion can jeopardize profitability and delivery capability,
not to mention the unnecessary burden on the environ-
ment from wasted resources.

PCB costs and the design influence on the same cannot

be generalized. However, it helps to know the trends.
One way to clarify these trends, or even to compare design
options, is to request comparative quotes from your
preferred PCB manufacturer. We will be happy to do so, if
we also get regular orders from you.

!
And finally, some good advice again:
Talk to your PCB manufacturer early and
regularly and profit from his experience.
In Europe, this is still possible.

Version 09.2023 / 504720 EN

Hotline to our "FLEXperts":

Phone +49 7940 946-FLEX (3539)
Würth Elektronik GmbH & Co. KG
[email protected] Circuit Board Technology
www.we-online.com/flex Salzstr. 21 · 74676 Niedernhall · Germany