Dell PowerEdge R760xs

Technical Guide

Regulatory Model: E88S

Regulatory Type: E88S001
February 2024
Rev. A02
Notes, cautions, and warnings

NOTE: A NOTE indicates important information that helps you make better use of your product.

CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid
the problem.

WARNING: A WARNING indicates a potential for property damage, personal injury, or death.

© 2023 Dell Inc. or its subsidiaries. All rights reserved. Dell Technologies, Dell, and other trademarks are trademarks of Dell Inc. or its
subsidiaries. Other trademarks may be trademarks of their respective owners.
 Contents

Chapter 1: System overview.......................................................................................................... 5

Key workloads...................................................................................................................................................................... 5
New technologies................................................................................................................................................................ 5

Chapter 2: System features and generational comparison............................................................. 7

Chapter 3: Chassis views and features.......................................................................................... 9

Chassis views....................................................................................................................................................................... 9
Front view of the system.............................................................................................................................................9
Rear view of the system.............................................................................................................................................12
Inside the system ........................................................................................................................................................ 14
System diagnostics and indicator codes................................................................................................................ 15
Quick Resource Locator............................................................................................................................................. 17

Chapter 4: Processor................................................................................................................... 19
Processor features ........................................................................................................................................................... 19
Supported processors................................................................................................................................................. 19
Chipset.................................................................................................................................................................................20
Chipset features.......................................................................................................................................................... 20

Chapter 5: Memory subsystem.....................................................................................................21

Supported memory............................................................................................................................................................ 21
General memory module installation guidelines.......................................................................................................... 21

Chapter 6: Storage...................................................................................................................... 23
Storage controllers........................................................................................................................................................... 23
Storage controller feature matrix............................................................................................................................ 23
Server storage controllers User Guide...................................................................................................................25
RAID - Redundant Array of Independent Disks....................................................................................................25
Datasheets and PERC performance scaling decks............................................................................................. 25
Boot Optimized Storage Solution (BOSS)............................................................................................................ 25
Supported Drives............................................................................................................................................................... 27
External Storage................................................................................................................................................................ 27

Chapter 7: Networking................................................................................................................ 28
Overview............................................................................................................................................................................. 28
OCP 3.0 support................................................................................................................................................................28
Supported OCP cards................................................................................................................................................ 28
OCP NIC 3.0 vs. rack Network Daughter Card comparisons........................................................................... 29
OCP form factors........................................................................................................................................................29

Chapter 8: Slot priority matrix..................................................................................................... 31

Expansion card installation guidelines........................................................................................................................... 31

Contents 3
 Chapter 9: Power, thermal, and acoustics................................................................................... 38
Power................................................................................................................................................................................... 38
PSU specifications...................................................................................................................................................... 39
Thermal.................................................................................................................................................................................41
Acoustics..............................................................................................................................................................................41
Acoustical configurations of R760xs ......................................................................................................................41

Chapter 10: Rack, rails, and cable management........................................................................... 43

Rails information................................................................................................................................................................ 43
A11 Sliding Rails features summary..........................................................................................................................43
A8 Static Rails features summary........................................................................................................................... 44
Cable Management Arm.................................................................................................................................................. 45
Strain Relief Bar ............................................................................................................................................................... 46
Rack Installation.................................................................................................................................................................46

Chapter 11: Supported operating systems.................................................................................... 51

Chapter 12: Dell OpenManage Systems Management................................................................... 52

Integrated Dell Remote Access Controller (iDRAC)................................................................................................. 52
Systems Management software support matrix....................................................................................................... 53

Chapter 13: Appendix A. Standards compliance........................................................................... 55

Chapter 14: Appendix B: Additional resources..............................................................................56

Customer kits..................................................................................................................................................................... 56
Dell Upgrades............................................................................................................................................................... 56
Upgrades portfolio...................................................................................................................................................... 56
Upgrades reference links...........................................................................................................................................58
Documentation...................................................................................................................................................................58

Chapter 15: Appendix C: Additional specifications....................................................................... 59

Chassis dimensions ..........................................................................................................................................................59
System weight................................................................................................................................................................... 60
Video specifications..........................................................................................................................................................60
USB ports specifications.................................................................................................................................................. 61
Environmental specifications...........................................................................................................................................61
Thermal restriction matrix......................................................................................................................................... 62

Chapter 16: Appendix D: Services................................................................................................ 67

Default service levels........................................................................................................................................................67
ProDeploy Infrastructure Suite...................................................................................................................................... 67
Supplemental Deployment Services............................................................................................................................. 69
Unique Deployment Scenarios........................................................................................................................................70
DAY 2 - Automation Services with Ansible................................................................................................................. 72
ProSupport Infrastructure Suite.................................................................................................................................... 72
Specialty Support Services............................................................................................................................................. 73
Consulting Services.......................................................................................................................................................... 75
Resources............................................................................................................................................................................76

4 Contents
 1
System overview
The Dell PowerEdge R760xs is Dell’s latest two-socket, rack server that is designed to run complex workloads using highly
scalable memory, I/O, and network options. The systems feature the 4 th and 5 th Gen Intel® Xeon® Scalable Processor (Socket
E1/LGA4677-1), up to 16 DIMMs, PCI Express® (PCIe) 5.0 enabled expansion slots , and a broad selection of network interface
technologies.
Topics:
• Key workloads
• New technologies

Key workloads
The target workloads for the PowerEdge R760xs include virtualization, medium density VM and VDI, and scale-out database. .

New technologies
Table 1. New technologies
Technology Detailed Description
Up to 2 x 5th Gen Intel(R) Xeon(R) Scalable Processors Core count: Up to 28 per processor
(Emerald Rapids)
Up to 3.9 GHz

UPI speed: Up to 3x UPIs/Socket at 12.8 GT/s or 14.4 or 16

GT/s or 20 GT/s

Maximum number of PCIe lanes: Integrated 80 PCIe 5.0 lanes

@ 32 GT/s PCIe Gen5

Maximum TDP: 250 W

Up to 2 x 4th Gen Intel(R) Xeon(R) Scalable Processors Core count: Up to 32 per processor
(Sapphire Rapids)
UPI speed: Up to 3x UPIs/Socket at 12.8 GT/s or 14.4 or 16
GT/s

Maximum number of PCIe lanes: Integrated 80 PCIe 5.0 lanes

@ 32 GT/s PCIe Gen5

Maximum TDP: 250 W

DDR5 ECC memory up to 5200 MT/s Max 8 DIMMs per processor and 16 DIMMs per system
Supports DDR5 ECC RDIMM
GPUs Max 2 x 75 W SW GPUs (NVIDIA A2)
Flex I/O LOM: 2x1GbE with BCM5720 LAN controller
Rear I/O with:
● 1x Dedicated iDRAC Ethernet port (1 GbE)
● 1 x USB 3.0
● 1 x USB 2.0
● 1 x VGA port

System overview 5
Table 1. New technologies (continued)
Technology Detailed Description
Serial Port option
Optional OCP Mezz 3.0 (supported by x8 PCIe lanes)
Front I/O with:
● 1 x USB 2.0
● 1x iDRAC Direct (Micro-AB USB) port
● 1 x VGA port
CPLD 1-wire Support payload data of Front PERC, Riser, BP and Rear IO to
BOSS-N1 and iDRAC
Dedicated PERC Front Storage module PERC with Front PERC11 & PERC12
Software RAID OS RAID / S160
Power Supplies 60 mm dimension is the new PSU form factor on 16G design
● 600 W Platinum 100–240 VAC/ 240 VDC
● 700 W Titanium 200–240 VAC/240 VDC
● 800 W Platinum 100–240 VAC/ 240 VDC
● 1100 W DC/-48–(-60) V
● 1100 W Titanium 100–240 VAC/ 240 VDC
● 1400 W Platinum 100–240 VAC/ 240 VDC
● 1400 W Titanium 277 VAC/ 336 VDC
● 1800 W Titanium 200–240 VAC/ 240 VDC

6 System overview
 2
System features and generational
comparison
The following table shows the comparison between the PowerEdge R760xs with the PowerEdge R750xs.

Table 2. Features comparison

Feature PowerEdge R760xs PowerEdge R750xs
Processor ● Up to 2 x 4th Gen Intel(R) Xeon(R) Scalable Maximum two 3 rd Generation Intel ® Xeon ® Scalable
Processors (Sapphire Rapids) with up to 32 processors with maximum 32 cores per processor
cores
● Up to 2 x 5th Gen Intel(R) Xeon(R) Scalable
Processors (Emerald Rapids) with up to 28
cores
Processor Intel Ultra Path Interconnect (UPI) , up to 3 links Intel Ultra Path Interconnect (UPI)
Interconnect per CPU
Memory 16 DDR5 DIMM slots 16 DDR4 DIMM slots
Supports RDIMM 1.5 TB max Supports RDIMM 1 TB max
Speed maximum 5200 MT/s for 5th generation Speed maximum 3200 MT/s
and 4800 MT/s for 4th generation processors
Supports registered ECC DDR4 DIMMs only
Supports registered ECC DDR5 DIMMs only
Apache Pass : No
NVDIMM : No
NVDIMM : No

Storage Drives Front bays: Front bays:

● 0 drive bay ● 0 drive bay
● Maximum 8x 3.5-inch SAS/SATA (HDD/ ● Maximum 8x 3.5-inch SAS/SATA (HDD/SSD)
SSD) max 160 TB max 128 TB
● Maximum 12x 3.5-inch SAS/SATA (HDD/ ● Maximum 12x 3.5-inch SAS/SATA (HDD/SSD)
SSD) max 240 TB maximum 192 TB
● Maximum 8x 2.5-inch SAS/SATA/NVMe ● Maximum 8x 2.5-inch SAS/SATA/NVMe (HDD/
(HDD/SSD) max 122.88 TB SSD) maximum 61.44 TB
● Maximum 16x 2.5-inch SAS/SATA (HDD/ ● Maximum 16x 2.5-inch SAS/SATA (HDD/SSD)
SSD) max 121.6 TB maximum 122.88 TB
● Maximum 16x 2.5-inch (SAS/SATA) + 8x 2.5- ● Maximum 16x 2.5-inch (SAS/SATA) + 8x 2.5-
inch (NVMe) (HDD/SSD) max 244.48 TB inch (NVMe) (HDD/SSD) maximum 184.32 TB

Rear bays: Rear bays:

● Maximum 2x 2.5-inch SAS/SATA/NVMe ● Maximum 2x 2.5-inch SAS/SATA/NVMe (HDD/
(HDD/SSD) max 30.72 TB SSD) maximum 15.36 TB

Storage Controllers Internal controllers: H965i, HBA465i ( post RTS), Internal controllers: PERC H345, PERC H355,
H755, H755N, H355, HBA355i PERC H745, PERC H755, PERC H755N, HBA355i
Internal Boot: Boot Optimized Storage Internal Boot: Internal Dual SD Module or Boot
Subsystem (BOSS N1): HWRAID 2x M.2 SSDs Optimized Storage Subsystem (BOSS S2): HWRAID
and Internal USB 2x M.2 SSDs or Internal USB
External: HBA355e, H965e and HBA465e (post External PERC (RAID): PERC H840, HBA355e
RTS)
Software RAID: S150
Software RAID: S160

System features and generational comparison 7

Table 2. Features comparison (continued)
Feature PowerEdge R760xs PowerEdge R750xs
PCIe SSD Front: Maximum 8 x 2.5-inch (NVMe drives) Maximum 8 x 2.5-inch (NVMe drives)
Rear: Up to 2 x 2.5-inch NVMe
PCIe Slots Up to 6 PCIe slots (2 x Gen5, 4 x Gen4) Up to 6 PCIe slots (5 x Gen4, 1 x Gen3)
Embedded NIC 2x 1GbE LOM 2x 1GbE LOM
(LOM)
Networking Options Rear: 1 x OCP 3.0 (x8 PCIe lanes) Maximum 1 OCP 3.0 (x16 PCIe lanes)
(OCP 3.0)
GPU Nvidia A2 (60 W, LP) Not supported
I/O Ports Front ports Front ports
● 1x Dedicated iDRAC micro-USB ● 1x Dedicated iDRAC micro-USB
● 1x USB 2.0 ● 1x USB 2.0
● 1x VGA ● 1x VGA

Rear ports: Rear ports:

● 1 x Dedicated iDRAC Ethernet port ● 1 x Dedicated iDRAC Ethernet port
● 1x USB 2.0 ● 1x USB 2.0
● 1x USB 3.0 ● 1x USB 3.0
● 1x Serial (optional) ● 1x Serial (optional)
● 1x VGA ● 1x VGA
● 2x Ethernet ● 2x Ethernet

Internal port: Internal port:

● 1x USB 3.0 (optional) ● 1x USB 3.0 (optional)

Rack Height 2U rack server 2U rack server

Power Supplies ● 1800 W Titanium 200–240 VAC/ 240 VDC ● 1800 W Platinum 100–240 VAC/ 240 VDC
● 1400 W Platinum 100–240 VAC/ 240 VDC ● 1400 W Platinum 100–240 VAC/ 240 VDC
● 1400 W Titanium 277 VAC/ 336 VDC ● 1100 W Titanium 100–240 VAC/ 240 VDC
● 1100 W Titanium 100–240 VAC/ 240 VDC ● 1100 W DC/-48–(-60) V
● 1100 W DC/-48–(-60) V ● 800 W Platinum 100–240 VAC/ 240 VDC
● 800 W Platinum 100–240 VAC/ 240 VDC ● 700 W Titanium 200–240 VAC/240 VDC
● 700 W Titanium 200–240 VAC/240 VDC ● 600 W Platinum 100–240 VAC/ 240 VDC
● 600 W Platinum 100–240 VAC/ 240 VDC
System Management ● Lifecycle Controller 3.x ● Lifecycle Controller 3.x
● OpenManage ● OpenManage
● QuickSync 2.0 ● QuickSync 2.0
● OpenManage Enterprise Power Manager ● OpenManage Enterprise Power Manager
● Digital License Key ● Digital License Key
● iDRAC Direct (dedicated micro-USB port) ● iDRAC Direct (dedicated micro-USB port)
● Easy Restore ● Easy Restore
Availability Hot-plug drives Hot-plug drives

Hot-plug redundant cooling Hot-plug redundant cooling

Hot-plug redundant power supplies Hot-plug redundant power supplies

BOSS-N1 IDSDM

BOSS S2

8 System features and generational comparison

 3
Chassis views and features
Topics:
• Chassis views

Chassis views

Front view of the system

Figure 1. Front view of 16 x 2.5-inch SAS/SATA + 8 x 2.5-inch NVMe drive system

Figure 2. Front view of 16 x 2.5-inch SAS/SATA drive system

Figure 3. Front view of 8 x 2.5-inch SAS/SATA or NVMe drive system

Figure 4. Front view of 12 x 3.5-inch SAS/SATA drive system

Chassis views and features 9

Figure 5. Front view of 8 x 3.5-inch SAS/SATA drive system

Figure 6. Front view of no backplane configuration (0 drive system)

Left control panel view

Figure 7. Left control panel

Table 3. Left control panel

Item Indicator, button, or Icon Description
connector
1 Status LED indicators NA Indicates the status of the system. For more information, see the
Status LED indicators section.
2 System health and system Indicates the system health. For more information, see the System
ID health and system ID indicator codes section.

10 Chassis views and features

Figure 8. Left control panel with optional iDRAC Quick Sync 2 indicator

Table 4. Left control panel with optional iDRAC Quick Sync 2 indicator
Item Indicator, button, or Icon Description
connector
1 Status LED indicators N/A Indicates the status of the system. For more information, see the
Status LED indicators section.
2 System health and system Indicates the system health. For more information, see the
ID indicator System health and system ID indicator codes section.
3 iDRAC Quick Sync Indicates if the iDRAC Quick Sync 2 wireless option is
2 wireless indicator activated. The Quick Sync 2 feature allows management of the
(optional) system using mobile devices. This feature aggregates hardware/
firmware inventory and various system level diagnostic/error
information that can be used in troubleshooting the system. You
can access system inventory, Dell Lifecycle Controller logs or
system logs, system health status, and also configure iDRAC,
BIOS, and networking parameters. You can also launch the virtual
Keyboard, Video, and Mouse (KVM) viewer and virtual Kernel-
based Virtual Machine (KVM), on a supported mobile device.
For more information, see the Integrated Dell Remote Access
Controller User's Guide at www.dell.com/poweredgemanuals.

NOTE: For more information about the indicator codes, see the System diagnostics and indicator codes section.

Right control panel view

Figure 9. Right control panel

Chassis views and features 11

Table 5. Right control panel
Item Indicator or button Icon Description
1 Power button Indicates if the system is powered on or off. Press the power button to
manually power on or off the system.
NOTE: Press the power button to gracefully shut down an ACPI-compliant
operating system.

2 USB 2.0 port The USB port is 4-pin, 2.0-compliant. This port enables you to connect USB
devices to the system.
3 iDRAC Direct The iDRAC Direct (Micro-AB USB) port enables you to access the iDRAC
(Micro-AB USB) direct Micro-AB USB features. For more information, see the Integrated Dell
port Remote Access Controller User's Guide at www.dell.com/poweredgemanuals.
NOTE: You can configure iDRAC Direct by using a USB to micro USB (type
AB) cable, which you can connect to your laptop or tablet. Cable length
should not exceed 3 feet (0.91 meters). Performance could be affected by
cable quality.

4 VGA port Enables you to connect a display device to the system.

Rear view of the system

Figure 10. Rear view of the system

Figure 11. Rear view of the system with no riser and one CPU

Figure 12. Rear view of the system with no riser and two CPUs

12 Chassis views and features

Figure 13. Rear view of the system with Riser 1c

Figure 14. Rear view of the system with Riser 1d

Chassis views and features 13

Inside the system

Figure 15. Inside the system without rear drive and riser
1. Rear mounted front PERC 2. Cooling fan assembly
3. Memory module slots 4. Power interposer board
5. Intrusion switch 6. OCP
7. PSU 1 and PSU 2 8. System board
9. Processor heat sink 10. SAS/SATA backplane
11. NVMe backplane 12. Information tag

14 Chassis views and features

Figure 16. Inside the system with rear drive cage and riser
1. Rear mounted front PERC 2. Cooling fan assembly
3. Memory module slots 4. Power interposer board
5. Intrusion switch 6. Rear drive cage
7. PSU 1 and PSU 2 8. Riser
9. System board 10. Processor heat sink
11. SAS/SATA backplane 12. NVMe backplane
13. Information tag

System diagnostics and indicator codes

The diagnostic indicators on the system front panel display system status during system startup.

Status LED indicators

NOTE: The indicators display solid amber if any error occurs.

Chassis views and features 15

Figure 17. Status LED indicators

Table 6. Status LED indicators and descriptions

Icon Description Condition Corrective action
● Check the System Event Log to determine if the
drive has an error.
● Run the appropriate Online Diagnostics test.
The indicator turns solid amber if Restart the system and run embedded
Drive indicator
there is a drive error. diagnostics (ePSA).
● If the drives are configured in a RAID array,
restart the system, and enter the host adapter
configuration utility program.
Ensure that none of the following conditions exist:
The indicator turns solid amber if ● A cooling fan has been removed or has failed.
the system experiences a thermal ● System cover, air shrouds, or back filler bracket
Temperature
error (for example, the ambient has been removed.
indicator
temperature is out of range or ● Ambient temperature is too high.
there is a fan failure). ● External airflow is obstructed.
If the problem persists, see the Getting help section.
Check the System Event Log or system messages
The indicator turns solid amber for the specific issue. If it is due to a problem with
if the system experiences an the PSU, check the LED on the PSU. Reseat the
Electrical electrical error (for example, PSU.
indicator voltage out of range, or a failed
power supply unit (PSU) or If the problem persists, see the
voltage regulator). Getting help section.

Check the System Event Log or system messages

for the location of the failed memory. Reseat the
memory module.
The indicator turns solid amber if a
Memory indicator
memory error occurs. If the problem persists, see the
Getting help section.

Restart the system. Update any required drivers for

the PCIe card. Reinstall the card.

If the problem persists, see the

Getting help section.
The indicator turns solid amber if a
PCIe indicator
PCIe card experiences an error.
NOTE: For more information about the
supported PCIe cards, see the Expansion cards
and expansion card risers > Expansion card
installation guidelines section.

16 Chassis views and features

System health and system ID indicator codes
The system health and system ID indicator is located on the left control panel of the system.

Figure 18. System health and system ID indicator

Table 7. System health and system ID indicator codes

System health and system Condition
ID indicator code
Solid blue Indicates that the system is powered on, is healthy, and system ID mode is not active. Press
the system health and system ID button to switch to system ID mode.
Blinking blue Indicates that the system ID mode is active. Press the system health and system ID button to
switch to system health mode.
Solid amber Indicates that the system is in fail-safe mode. If the problem persists, see the Getting help
section.
Blinking amber Indicates that the system is experiencing a fault. Check the System Event Log for specific
error messages. For information about the event and error messages generated by the
system firmware and agents that monitor system components, go to qrl.dell.com > Look
Up > Error Code, type the error code, and then click Look it up.

Quick Resource Locator

The QRL on everything (SILs, GSG, Owner's Manual except on the EST) is a generic QRL for R760xs that leads to a webpage
for that product. That webpage has links for things like setup and service videos, iDRAC manual, and other things that apply to
the platform. The QRL on the EST is unique and specific to that service tag and will contain the Service Tag number and the
iDRAC password. The label and the QRL code within it are printed on demand at the L10 factories. This QRL links to a webpage
that shows the exact configuration as built for that customer, and the specific warranty purchased. It is one click away from the
same content of generic information that applies to R760xs that is available in the other QRLs.

Chassis views and features 17

Figure 19. Quick Resource Locator for PowerEdge R760xs system

18 Chassis views and features

 4
Processor
Topics:
• Processor features
• Chipset

Processor features
The Intel 4 th and 5 th Generation Xeon ® Scalable Processors stack is the next generation data center processor offering with
significant performance increases, integrated acceleration, and next generation memory and I/O. Sapphire Rapids and Emerald
Rapids accelerate customer usage with unique workload optimizations.
The following lists the features and functions that are in the upcoming 4 th and 5 th Generation Intel ® Xeon Scalable Processor
offering:
● Faster UPI with up to three Intel Ultra Path Interconnect (Intel UPI) at up to 20 GT/s, increasing multisocket bandwidth.
● More, faster I/O with PCI Express 5 and up to 80 lanes (per CPU)
● Enhanced Memory Performance with DDR5 support and memory speed up to 5200 MT/s in one DIMM per channel (1DPC).
● New onboard accelerators for data analytics, networking, storage, crypto, and data compression
● Enhanced security for virtualized environments with Intel Trust Domain Extensions (IntelR TDX) for confidential computing

Supported processors
The following table shows the Intel Sapphire Rapids and Emerald Rapids SKUs that are supported on the R760xs.

Table 8. Supported Processors for R760xs

Processor Clock Speed Cache (M) UPI (GT/s) Cores Turbo Memory TDP
(GHz) Speed (MT/s)
6534 3.9 22.5 20 8 Turbo 4800 195 W
6526Y 2.8 37.5 20 16 Turbo 5200 195 W
5512U 2.1 52.5 N/A 28 Turbo 4800 185 W
4514Y 2.0 30 16 12 Turbo 4400 150 W
4510 2.4 30 16 12 Turbo 4400 150 W
4509Y 2.6 23 16 8 Turbo 4400 125 W
6448Y 2 .2 60 16 32 Turbo 4800 225 W
6442Y 2.6 45 16 24 Turbo 4800 225 W
6438Y+ 2 60 16 32 Turbo 4800 205 W
6426Y 2.6 30 16 16 Turbo 4800 185 W
6414U 2 60 16 32 Turbo 4800 250 W
5420+ 2 53 16 28 Turbo 4400 205 W
5418Y 2 45 16 24 Turbo 4400 185 W
5416S 2 30 16 16 Turbo 4400 150 W
5415+ 2.9 15 16 8 Turbo 4400 150 W

Processor 19
Table 8. Supported Processors for R760xs (continued)
Processor Clock Speed Cache (M) UPI (GT/s) Cores Turbo Memory TDP
(GHz) Speed (MT/s)
5412U 2.1 45 16 24 Turbo 4400 185 W
4416+ 2 38 16 20 Turbo 4000 165 W
4410Y 2 23 16 12 Turbo 4000 150 W
4410T 2.7 19 16 10 Turbo 4000 150 W
3408U 1.8 15 16 8 Turbo 4000 125 W

Chipset
The system supports Intel ® C741 series chipset.
DMI - 3.0 speed (port width x8, x4)
USB ports - up to 10 superspeed (USB 3.1), 14 highspeed (USB 2.0)
SATA ports - up to 20 SATA port
PCIe Express - Up to 20 lanes, PCIe 3.0

Chipset features
● PCI-E interfaces
○ Integrated PCI Express Gen5 for improved bandwidth and connectivity
○ Up to 80 lanes per processor
○ Connect PCIe x1 to iDRAC- integrated VGA chip
● Integrated USB - maximum of 10 SuperSpeed (USB 3.1), 14 highspeed (USB 2.0)
○ One front port (USB 2.0 / Right front I/O)
○ Two rear ports (USB 2.0/3.0)

20 Processor
 5
Memory subsystem
Topics:
• Supported memory
• General memory module installation guidelines

Supported memory
Table 9. Memory technology comparison
Feature PowerEdge R760xs (DDR5)
DIMM type RDIMM
Transfer speed 5200 MT/s (1DPC)
NOTE: Maximum DIMM transfer speed support depends
on CPU SKU and DIMM population.

Voltage 1.1 V

Table 10. Supported memory matrix

DIMM type Rank Capacity DIMM rated voltage Operating Speed
and speed
1 DIMM per channel
(DPC)
RDIMM 1R 16 GB DDR5 (1.1 V), 4800 Up to 4800 MT/s
MT/s
Up to 5200 MT/s
DDR5 (1.1 V), 5600
MT/s

2R 32 GB, 64 GB, 96 GB DDR5 (1.1 V), 4800 Up to 4800 MT/s

MT/s
Up to 5200 MT/s
DDR5 (1.1 V), 5600
MT/s

NOTE: 5600 MT/s RDIMMs are applicable for 5th Gen IntelR XeonR Scalable Processors.

NOTE: The processor may reduce the performance of the rated DIMM speed.

General memory module installation guidelines

To ensure optimal performance of your system, observe the following general guidelines when configuring your system memory.
If your system's memory configuration fails to observe these guidelines, your system might not boot, stop responding during
memory configuration, or operate with reduced memory.
The memory bus may operate at speeds of 5200 MT/s, 4800 MT/s, 4400 MT/s or 4000 MT/s depending on the following
factors:
● System profile selected (for example, Performance, Performance Per Watt Optimized (OS), or Custom [can be run at high
speed or lower])
● Maximum supported DIMM speed of the processors

Memory subsystem 21
● Maximum supported speed of the DIMMs
NOTE: MT/s indicates DIMM speed in MegaTransfers per second.

The system supports Flexible Memory Configuration, enabling the system to be configured and run in any valid chipset
architectural configuration. The following are the recommended guidelines for installing memory modules:
● All DIMMs must be DDR5.
● Memory mixing is not supported for different DIMM capacities.
● If memory modules with different speeds are installed, they operate at the speed of the slowest installed memory module(s).
● Populate memory module sockets only if a processor is installed.
○ For single-processor systems, sockets A1 to A8 are available.
○ For dual-processor systems, sockets A1 to A8 and sockets B1 to B8 are available.
○ A minimum of 1 DIMM must be populated for each installed processor.
● In Optimizer Mode, the DRAM controllers operate independently in the 64-bit mode and provide optimized memory
performance.

Table 11. Memory population rules

Processor Configuration Memory population Memory population
information
Single processor Optimizer (Independent A{1}, A{2}, A{3}, A{4}, A{5}, A{6}, 1, 2, 4, 6, 8 DIMMs are
channel) population order A{7}, A{8} allowed.
Dual processor (Start with Optimizer (Independent A{1}, B{1}, A{2}, B{2}, A{3}, B{3}, 2, 4, 8, 12, 16 DIMMs are
processor1. Processor 1 channel) population order A{4}, B{4}, A{5}, B{5}, A{6}, B{6}, supported per system .
and processor 2 population A{7}, B{7} A{8}, B{8} NOTE: Optimizer
should match) population order is not
traditional for 8 and 16
DIMMs installations for
dual processor.

● Always populate memory channels identically with equal DIMMs for best performance.
● Supported RDIMM configurations are 1, 2, 4, 6, and 8 DIMMs per processor.
● Supported 96 GB RDIMM configurations are 1, 6 and 8 DIMMs per processor.
● Populate eight equal memory modules per processor (one DIMM per channel) at a time to maximize performance.
NOTE: Equal memory modules refer to DIMMs with identical electrical specification and capacity that may be from
different vendors.

22 Memory subsystem
 6
Storage
Topics:
• Storage controllers
• Supported Drives
• External Storage

Storage controllers
Dell RAID controller options offer performance improvements, including the fPERC solution. fPERC provides a base RAID HW
controller without consuming a PCIe slot by using a small form factor and high-density connector to the base planar.
16G PERC Controller offerings are a heavy leverage of 15G PERC family. The Value and Value Performance levels carry over
to 16G from 15G. New to 16G is the Avenger-based Premium Performance tier offering. This high-end offering drives IOPs
performance and enhanced SSD performance.

Table 12. PERC Series controller offerings

Performance Level Controller and Description
Entry S160
Value H355, HBA355e, HBA355i, (internal/external)
Value Performance H755, H755N
Premium Performance H965i,

Avenger 1

Memory: 8GB DDR4 NV cache

72-bit memory 2133 MHz

Low profile form factors

Dual A15 1.2 GHz CPU

X8PCIe 3.0, x8 12Gb SAS

NOTE: For more information about the features of the Dell PowerEdge RAID controllers (PERC), Software RAID
controllers, or BOSS card, and on deploying the cards, see the storage controller documentation at www.dell.com/
storagecontrollermanuals.

NOTE: From December 2021, H355 replaces H345 as the entry raid controller. H345 is deprecated in January 2022.

Storage controller feature matrix

Table 13. Storage controller feature matrix
Model & Interface Support PCI SAS Cach Write Back RAID Max Drive RAID
Form Suppo Connection e Cache Levels Support Support
Factors rt Mem
ory
Size
PowerEdge Server-Storage Controllers (PERC) Series 12

Storage 23
Table 13. Storage controller feature matrix (continued)
Model & Interface Support PCI SAS Cach Write Back RAID Max Drive RAID
Form Suppo Connection e Cache Levels Support Support
Factors rt Mem
ory
Size
H965i Front 24Gb/s SAS PCIe 16 ports/lanes 8GB Flash 0,1,5,6,10,50 16 Hardware
Gen 4 - 2x8 Internal NV ,60
6Gb/s SAS/SATA Backed

Gen3 (8 GT/s) NVMe Cache

Gen4 (16 GT/s)

NVMe

H965i 24Gb/s SAS PCIe 16 ports/lanes 8GB Flash 0,1,5,6,10,50 16 Hardware

Adapter Gen 4 - 2x8 Internal NV ,60
6Gb/s SAS/SATA Backed

Gen3 (8 GT/s) NVMe Cache

Gen4 (16 GT/s)

NVMe

S160 Gen4 (16 GT/s) PCIe N/A No No Cache 0,1,5,10 8 Software

Software NVMe Gen 4 Cach RAID -
RAID e Windows
only
PowerEdge Server-Storage Controllers (PERC & SAS HBA) Series 11
H755 12Gb/s SAS PCIe 16 ports- 2x8 8GB Flash 0,1,5,6,10,50 16/ Hardware
Adapter Gen 4 Internal NV ,60 controller
6Gb/s SAS/SATA Backed
50 with SAS
3Gb/s SAS/SATA Cache Expander
Gen3 (8 GT/s) NVMe

Gen4 (16 GT/s)

NVMe

H755N Gen3 (8 GT/s) NVMe PCIe 16 ports- 2x8 8GB Flash 0,1,5,6,10,50 8/ controller Hardware
Front Gen 4 Internal NV ,60
(NVMe Gen4 (16 GT/s) Backed
Only) NVMe
Cache

H755 Front 12Gb/s SAS PCIe 16 ports- 2x8 8GB Flash 0,1,5,6,10,50 16/ Hardware
( SAS/ Gen 4 Internal NV ,60 controller
SATA only) 6Gb/s SAS/SATA Backed
50 with SAS
3Gb/s SAS/SATA Cache Expander

HBA355i 12Gb/s SAS PCIe 16 ports- 2x8 N/A N/A N/A 16/ N/A
Adapter Gen 4 Internal controller
6Gb/s SAS/SATA
50 with SAS
3Gb/s SAS/SATA Expander

HBA355i 12Gb/s SAS PCIe 16 ports- 2x8 N/A N/A N/A 16/ N/A
Front Gen 4 Internal controller
6Gb/s SAS/SATA
50 with SAS
3Gb/s SAS/SATA Expander

24 Storage
Table 13. Storage controller feature matrix (continued)
Model & Interface Support PCI SAS Cach Write Back RAID Max Drive RAID
Form Suppo Connection e Cache Levels Support Support
Factors rt Mem
ory
Size
HBA355e 12Gb/s SAS PCIe 16 ports- 4x4 N/A N/A N/A 240 N/A
Adapter Gen 4 external
6Gb/s SAS/SATA

3Gb/s SAS/SATA

H355 12Gb/s SAS PCIe 16 ports- 2x8 No No Cache 0,1, 10 Up to 32 Hardware

Adapter Gen 4 Internal Cach RAID, or 32
6Gb/s SAS/SATA e Non- RAID

H355 Front 12Gb/s SAS PCIe 16 ports- 2x8 No No Cache 0,1, 10 Up to 32 Hardware
Gen 4 Internal Cach RAID, or 32
6Gb/s SAS/SATA e Non- RAID

NOTE:
1. RAID 5/50 removed from entry RAID card
2. SWRAID support for Linus provides a pre-boot configuration utility to configure MDRAID and degraded boot capability.
3. For information, post-RTS, see the Storage controller documentation at www.dell.com/stroagecontrollermanuals.
This document is updated as changes happen, so for the latest version be sure to bookmark it rather than downloading an
offline copy or refer to the Storage Controller Matrix on sales portal.

Server storage controllers User Guide

● Server-Storage Controllers User's Guides, click here

RAID - Redundant Array of Independent Disks

● Link to Help Me Choose: RAID Configuration here

Datasheets and PERC performance scaling decks

● Resource Page for Server-Storage (Sales Portal) click here
● PERC & SAS HBA Datasheets (To be updated)

Boot Optimized Storage Solution (BOSS)

BOSS is a RAID solution that is designed to boot operating systems and segregate operating system boot drives from data on
server-internal storage.

Storage 25
BOSS feature matrix
Table 14. BOSS feature matrix
BOSS Drive RAID Stripe Virtual Maxim Maxim Drive PCIe Disk Suppor Crypto Hot
card Size levels size disk um um types suppor cache t for graphi Plug
cache numbe numbe t policy Non- c
functio r of r of RAID digital
n virtual drives disks signatu
disks suppor re to
ted verify
firmwa
re
payloa
d
BOSS- M.2 RAID1 Support None 1 2 M.2 Gen3 Drive No Yes Yes
N1 devices and s NVMe default
Monolit are RAID0 default SSDs
hic read- 64K
intensiv stripe
e with size
480 GB only
or 960
GB
capacit
y

BOSS-N1

BOSS-N1 is offered as a means of booting 16G servers to a full OS when the target OS is a full OS (not just a hypervisor), or the
user does not wish to trade off standard hot plug drive slots for OS install.
The HW RAID BOSS-N1 card is a RAID controller with a limited feature set that presents M.2 NVMe-only SSDs as either a
RAID0 disk or a single RAID1 volume with 2 disks. BOSS-N1 enables support for 480/960 GB Disks from Factory Install.
Hardware: BOSS-N1 Controller and Carrier (x2)
Reliability: Enterprise-Class M.2 NVMe SSDs
Supports dual 80 mm, Read Intensive (1DWPD), M.2 devices 480 GB/960 GB Standard - 1.92 TB QNS
Accessibility: Front Facing
Serviceability: Full Hot-Plug Support
Supports Hardware RAID1 and RAID0
Supports UEFI boot
Marvell 88NR2241 NVMe RAID Controller
Controlled Firmware Upgrade through iDRAC

Figure 20. BOSS-N1 Controller

26 Storage
Datasheets
● BOSS-N1 (to be updated)

BOSS User Guides

● BOSS-N1

Supported Drives
The table shown below lists the internal drives supported by the R760xs. Refer to Agile for the latest SDL

Table 15. Supported Drives

Form Factor Type Speed Rotational Capacities
Speed
2.5 inches vSAS 12 Gb SSD 1.92 TB, 3.84 TB, 960 GB, 7.62 TB
2.5 inches SAS 24 Gb SSD 1.92 TB, 1.6 TB, 800 GB, 3.84 TB, 960 GB, 7.68 TB
2.5 inches SATA 6 Gb SSD 1.92 TB, 480 GB, 960 GB, 3.84 TB
2.5 inches NVMe Gen4 SSD 1.6 TB, 3.2 TB, 6.4 TB, 1.92 TB, 3.84 TB, 15.63 TB, 7.68 TB
2.5 inches DC NVMe Gen4 SSD 3.84 TB, 960 GB
2.5 inches SAS 12 Gb 10 K 600 GB, 1.2 TB, 2.4 TB
3.5 inches SATA 6 Gb 7.2 K 2 TB, 4 TB, 8 TB, 12 TB, 16 TB, 20 TB
3.5 inches SAS 12 Gb 7.2 K 2 TB, 4 TB, 8 TB, 12 TB, 16 TB, 20 TB

External Storage
The R760xs support the external storage device types listed in the table below.

Table 16. Support External Storage Devices

Device Type Description
External Tape Supports connection to external USB tape products
NAS/IDM appliance software Supports NAS software stack
JBOD Supports connection to 12 Gb MD-series JBODs

Storage 27
 7
Networking
Topics:
• Overview
• OCP 3.0 support

Overview
PowerEdge offers a wide variety of options to get information moving to and from our servers. Industry best technologies are
chosen, and systems management features are added by our partners to firmware to tie in with iDRAC. These adapters are
rigorously validated for worry-free, fully supported use in Dell servers.

OCP 3.0 support

Table 17. OCP 3.0 feature list
Feature OCP 3.0
Form factor SFF
PCIe Gen Gen4
Max PCIe width x8
Max no. of ports 4
Port type BT/SFP/SFP+/SFP28
Max port speed 25 GbE
NC-SI Yes
SNAPI No
WoL Yes
Power consumption 15 W–35 W

Supported OCP cards

Table 18. Supported OCP cards

Form Vendor Port speed Port type Port count DPN
factor
OCP 3.0 Broadcom 10 GbE BT 2 RN1M5
25 GbE SFP28 2 24FG6
25 GbE SFP28 4 3Y64D
1 GbE BT 4 VJWVJ
10 GbE BT 4 W5HC8
Intel 1 GbE BT 4 HY4CV

28 Networking
Table 18. Supported OCP cards (continued)
Form Vendor Port speed Port type Port count DPN
factor
10 GbE BT 2 F6X1R
10 GbE BT 4 XC0M4
25 GbE SFP28 2 PWH3C
25 GbE SFP28 4 Y4VV5

OCP NIC 3.0 vs. rack Network Daughter Card comparisons

Table 19. OCP 3.0, 2.0, and rNDC NIC comparison
Form Factor Dell rNDC OCP 2.0 (LOM Mezz) OCP 3.0 Notes
PCIe Gen Gen 3 Gen 3 Gen 4 Supported OCP3 are
SFF (small form factor)
Max PCIe Lanes x8 Up to x16 Up to x8 See server slot priority
matrix
Shared LOM Yes Yes Yes This is iDRAC port
redirect
Aux Power Yes Yes Yes Used for Shared LOM

OCP form factors

Figure 21. OCP 3.0 Small Card Form Factor (LS)

The process of installing the OCP card in R760xs system:

1. Open the blue latch on the system board.
2. Slide the OCP card into the slot in the system.
3. Push until the OCP card is connected to the connector on the system board.
4. Close the latch to lock the OCP card to the system.

Networking 29
Figure 22. Installing the OCP Card in R760xs

The process of removing the OCP card in R760xs system:

1. Open the blue latch to unlock the OCP card.
2. Push the OCP card towards the rear end of the system to disconnect from the connector on the system board.
3. Slide the OCP card out of the slot on the system.

Figure 23. Removing the OCP Card in R760xs

30 Networking
 8
Slot priority matrix
For add-in cards that can be mapped to the R760xs and guidelines for installing expansion cards, see the R760xs slot priority
matrix file on Sales Portal.
Link:https://www.delltechnologies.com/resources/en-us/auth/products/servers/category.htm
Topics:
• Expansion card installation guidelines

Expansion card installation guidelines

Figure 24. Expansion card slot connectors

1. SL9_CPU2_PB5 (PCIe cable connector for Riser 1C and Riser 1D)

2. SL10_CPU2_PA5 (PCIe cable connector for Riser 1C and Riser 1D)
3. SIG_PWR_0 (Power connector for Riser 1C and Riser 1D)
4. SL11_CPU1_PA6 (PCIe cable connector for Riser 1D)
5. SL12_CPU1_PB6 (PCIe cable connector for Riser 1D)
The following table describes the expansion card riser configurations:

Slot priority matrix 31

Table 20. Expansion card riser configurations
Configuratio Expansion PCIe Slots Controlling Height Length Slot width Power
ns card risers processor
Config 0-1. No riser 1, 2 Processor 1 Low profile Half length x16, x8 75 W
Config 0-2. No riser 1, 2 Processor 1 Low profile Half length x16, x8 75 W
5, 6 Processor 2 Low profile Half length x16, x16 75 W
Config 1. R1C 1, 2, 3 Processor 1 Low profile Half length x16, x8, x16 75 W
4, 5, 6 Processor 2 Low profile Half length x16, x16, x16 75 W
Config 2. R1D 1, 2, 3, 4 Processor 1 Low profile Half length x16, x8, x8, 75 W
x8

NOTE: Only one cable riser can be installed at a time in any given configuration.

NOTE: The slots 1, 2, 5 and 6 are Gen4 slots, slot 3 and 4 located on risers are Gen5 slots.

Figure 25. Riser 1C

1. Slot 3
2. Slot 4

32 Slot priority matrix

Figure 26. Riser 1D
1. Slot 3
2. Slot 4

NOTE: The expansion-card slots are not hot-swappable.

The following table provides guidelines for installing expansion cards to ensure proper cooling and mechanical fit. The expansion
cards with the highest priority should be installed first using the slot priority indicated. All the other expansion cards should be
installed in the card priority and slot priority order.

Table 21. Configuration 0-1: No riser configuration

Card type Slot priority Maximum number of cards
Dell Serial port module (LP) 2 1
fPERC Integrated slot 1
InterN/Al PERC adapter 1 1
Dell ExterN/Al Adapter 2, 1 2
Mellanox (NIC: 400Gb) Not supported N/A
Mellanox (NIC: 200Gb) Not supported N/A
Mellanox (NIC: 100Gb) 1 1
Mellanox HDR100 VPI 1 1
Mellanox HDR VPI 1 1
Broadcom (NIC: 100Gb) 1 1
Intel (NIC: 100Gb) 1 1
Broadcom (SFP: 25Gb) 2, 1 2
Intel (NIC: 25Gb) 2, 1 2
Qlogic (NIC: 25Gb) Not supported N/A
Qlogic (NIC: 10Gb) Not supported N/A
SolarFlare (NIC: 25Gb) Not supported N/A
Broadcom (HBA: FC64) 2,1 2
Broadcom (HBA: FC32) 2, 1 2
Marvell (HBA: FC32) 2, 1 2

Slot priority matrix 33

Table 21. Configuration 0-1: No riser configuration (continued)
Card type Slot priority Maximum number of cards
Emulex (HBA: FC32) Not supported N/A
Avago (HBA: FC16) Not supported N/A
Qlogic (HBA: FC16) Not supported N/A
Broadcom (NIC: 10Gb) 2, 1 2
Intel (NIC: 10Gb) 2, 1 2
Qlogic (NIC: 10Gb) Not supported N/A
Broadcom (NIC: 1Gb) 2, 1 N/A
Intel (NIC: 1Gb) 2, 1 2
Intel (OCP: 100Gb) Integrated slot 1
Broadcom (OCP: 25Gb) Integrated slot 1
Intel (OCP: 25Gb) Integrated slot 1
Marvell (OCP: 25Gb) Not supported N/A
SolarFlare (OCP: 25Gb) Not supported N/A
Broadcom (OCP: 10Gb) Integrated slot 1
Marvell (OCP: 10Gb) Not supported N/A
Intel (OCP: 10Gb) Not supported N/A
Broadcom (OCP: 1Gb) Integrated slot 1
Intel (OCP: 1Gb) Not supported N/A
Dell BOSS N1 Module Integrated slot 1

Table 22. Configuration 0-2: No riser configuration

Card type Slot priority Maximum number of cards
Dell Serial port module (LP) 2 1
fPERC Integrated slot 1
InterN/Al PERC adapter 1 1
Dell ExterN/Al Adapter 6, 2, 1, 5 4
Mellanox (NIC: 400Gb) Not supported N/A
Mellanox (NIC: 200Gb) Not supported N/A
Mellanox (NIC: 100Gb) 6, 1, 5 3
Mellanox HDR100 VPI 6, 1, 5 3
Mellanox HDR VPI 6, 1, 5 3
Broadcom (NIC: 100Gb) 6, 1, 5 3
Intel (NIC: 100Gb) 6, 1, 5 3
Broadcom (SFP: 25Gb) 6, 2, 1, 5 4
Intel (NIC: 25Gb) 2, 1 2
Qlogic (NIC: 25Gb) Not supported N/A
Qlogic (NIC: 10Gb) Not supported N/A
SolarFlare (NIC: 25Gb) Not supported N/A

34 Slot priority matrix

Table 22. Configuration 0-2: No riser configuration (continued)
Card type Slot priority Maximum number of cards
Broadcom (HBA: FC64) 6, 2, 1, 5 4
Broadcom (HBA: FC32) 6, 2, 1, 5 4
Marvell (HBA: FC32) 6, 2, 1, 5 4
Emulex (HBA: FC32) Not supported N/A
Avago (HBA: FC16) Not supported N/A
Qlogic (HBA: FC16) Not supported N/A
Broadcom (NIC: 10Gb) 6, 2, 1, 5 4
Intel (NIC: 10Gb) 6, 2, 1, 5 4
Qlogic (NIC: 10Gb) Not supported N/A
Broadcom (NIC: 1Gb) 6, 2, 1, 5 4
Intel (NIC: 1Gb) 6, 2, 1, 5 4
Intel (OCP: 100Gb) Integrated slot 1
Broadcom (OCP: 25Gb) Integrated slot 1
Intel (OCP: 25Gb) Integrated slot 1
Marvell (OCP: 25Gb) Not supported N/A
SolarFlare (OCP: 25Gb) Not supported N/A
Broadcom (OCP: 10Gb) Integrated slot 1
Marvell (OCP: 10Gb) Not supported N/A
Intel (OCP: 10Gb) Not supported N/A
Broadcom (OCP: 1Gb) Integrated slot 1
Intel (OCP: 1Gb) Not supported N/A
Dell BOSS N1 Module Integrated slot 1

Table 23. Configuration 1: R1C

Card type Slot priority Maximum number of cards
Dell Serial port module (LP) 2 1
InterN/Al PERC adapter 1 1
Dell exterN/Al PERC adapter 6, 2, 1, 3, 5, 4 6
12Gbps SAS HBA 1 1
Mellanox (NIC: 400Gb) 4, 3 2
Mellanox (NIC: 200Gb) 4, 3 2
Broadcom (NIC: 100Gb) 6, 1, 3, 5, 4 5
Intel (NIC: 100Gb) 6, 1, 3, 5, 4 5
Mellanox (NIC: 100Gb) 6, 1, 3, 5, 4 5
Mellanox HDR100 VPI 6, 1, 3, 5, 4 5
Mellanox HDR VPI 6, 1, 3, 5, 4 5
Intel (NIC: 25Gb) 6, 2, 1, 3, 5, 4 6
Mellanox (NIC: 25Gb) 6, 1, 3, 5, 4 5

Slot priority matrix 35

Table 23. Configuration 1: R1C (continued)
Card type Slot priority Maximum number of cards
Qlogic (NIC: 25Gb) Not Supported N/A
Broadcom (NIC: 10Gb) 6, 2, 1, 3, 5, 4 6
Broadcom (NIC: 25Gb) 6, 2, 1, 3, 5, 4 6
SolarFlare (NIC: 25Gb) Not Supported N/A
Broadcom (HBA: FC64) 6, 2, 1, 3, 5, 4 6
Broadcom (HBA: FC32) 6, 2, 1, 3, 5, 4 6
QLogic (HBA: FC32) 6, 2, 1, 3, 5, 4 6
Marvell (HBA: FC32) 6, 2, 1, 3, 5, 4 6
Emulex (HBA: FC32) Not Supported N/A
Avago (HBA: FC16) Not Supported N/A
QLogic (HBA: FC16) Not Supported N/A
Intel (NIC: 10Gb) 6, 2, 1, 3, 5, 4 6
Qlogic (NIC: 10Gb) Not Supported N/A
Intel (NIC: 1Gb) 6, 2, 1, 3, 5, 4 6
Intel (OCP: 100Gb) Integrated slot 1
Broadcom (OCP: 25Gb) Integrated slot 1
Intel (OCP: 25Gb) Integrated slot 1
Marvell (OCP: 25Gb) Not supported N/A
SolarFlare (OCP: 25Gb) Not supported N/A
Broadcom (OCP: 10Gb) Integrated slot 1
Marvell (OCP: 10Gb) Not supported N/A
Intel (OCP: 10Gb) Not supported N/A
Broadcom (OCP: 1Gb) Integrated slot 1
Intel (OCP: 1Gb) Not supported N/A
Dell BOSS N1 Module Integrated slot 1

Table 24. Configuration 2: R1D

Card type Slot priority Maximum number of cards
Dell Serial port module (LP) 2 1
InterN/Al PERC adapter 1 1
Dell exterN/Al PERC adapter 4, 3, 2, 1 4
12Gbps SAS HBA 1 1
Mellanox (NIC: 400Gb) Not supported N/A
Mellanox (NIC: 200Gb) Not supported N/A
Broadcom (NIC: 100Gb) 1 1
Intel (NIC: 100Gb) 1 1
Mellanox (NIC: 100Gb) 1 1
Mellanox HDR100 VPI 1 1

36 Slot priority matrix

Table 24. Configuration 2: R1D (continued)
Card type Slot priority Maximum number of cards
Mellanox HDR VPI 1 1
Intel (NIC: 25Gb) 4, 3, 2, 1 4
Mellanox (NIC: 25Gb) 4, 3, 2, 1 4
Qlogic (NIC: 25Gb) Not Supported N/A
Broadcom (NIC: 10Gb) 4, 3, 2, 1 4
Broadcom (NIC: 25Gb) 4, 3, 2, 1 4
SolarFlare (NIC: 25Gb) Not Supported N/A
Broadcom (HBA: FC64) 4, 3, 2, 1 4
Broadcom (HBA: FC32) 4, 3, 2, 1 4
QLogic (HBA: FC32) 4, 3, 2, 1 4
Marvell (HBA: FC32) 4, 3, 2, 1 4
Emulex (HBA: FC32) Not Supported N/A
Avago (HBA: FC16) Not Supported N/A
QLogic (HBA: FC16) Not Supported N/A
Intel (NIC: 10Gb) 4, 3, 2, 1 4
Qlogic (NIC: 10Gb) Not Supported N/A
Intel (NIC: 1Gb) 4, 3, 2, 1 4
Intel (OCP: 100Gb) Integrated slot 1
Broadcom (OCP: 25Gb) Integrated slot 1
Intel (OCP: 25Gb) Integrated slot 1
Marvell (OCP: 25Gb) Not supported N/A
SolarFlare (OCP: 25Gb) Not supported N/A
Broadcom (OCP: 10Gb) Integrated slot 1
Marvell (OCP: 10Gb) Not supported N/A
Intel (OCP: 10Gb) Not supported N/A
Broadcom (OCP: 1Gb) Integrated slot 1
Intel (OCP: 1Gb) Not supported N/A
Dell BOSS N1 Module Integrated slot 1

NOTE: The serial COM card is not a real PCIe add-in card and has a dedicated slot on the system board.

Slot priority matrix 37

 9
Power, thermal, and acoustics
PowerEdge servers have an extensive collection of sensors that automatically track thermal activity, which helps to regulate
temperature by reducing server noise and power consumption. The table below lists the tools and technologies Dell offers to
lower power consumption and increase energy efficiency.
Topics:
• Power
• Thermal
• Acoustics

Power
Table 25. Power tools and technologies
Feature Description
Power Supply Units(PSU) Dell's PSU portfolio includes intelligent features such as dynamically optimizing efficiency while
portfolio maintaining availability and redundancy. Find additional information in the Power supply units
section.
Tools for right sizing Enterprise Infrastructure Planning Tool (EIPT) is a tool that can help you determine the most
efficient configuration possible. With Dell's EIPT, you can calculate the power consumption
of your hardware, power infrastructure, and storage at a given workload. Learn more at
www.dell.com/calc.
Industry Compliance Dell's servers are compliant with all relevant industry certifications and guide lines, including 80
PLUS, Climate Savers and ENERGY STAR.
Power monitoring accuracy PSU power monitoring improvements include:

● Dell's power monitoring accuracy is currently 1%, whereas the industry standard is 5%
● More accurate reporting of power
● Better performance under a power cap
Power capping Use Dell's systems management to set the power cap limit for your systems to limit the output
of a PSU and reduce system power consumption. Dell is the first hardware vendor to leverage
Intel Node Manager for circuit-breaker fast capping.
Systems Management iDRAC Enterprise and Datacenter provides server-level management that monitors, reports and
controls power consumption at the processor, memory and system level.

Dell OpenManage Power Center delivers group power management at the rack, row, and data
center level for servers, power distribution units, and uninterruptible power supplies.

Active power management Intel Node Manager is an embedded technology that provides individual server-level power
reporting and power limiting functionality. Dell offers a complete power management solution
comprised of Intel Node Manager accessed through Dell iDRAC9 Datacenter and OpenManage
Power Center that allows policy-based management of power and thermal at the individual
server, rack, and data center level. Hot spare reduces power consumption of redundant power
supplies. Thermal control off a speed optimizes the thermal settings for your environment to
reduce fan consumption and lower system power consumption.

Idle power enables Dell servers to run as efficiently when idle as when at full workload.

Rack infrastructure Dell offers some of the industry's highest-efficiency power infrastructure solutions, including:

38 Power, thermal, and acoustics

Table 25. Power tools and technologies (continued)
Feature Description
● Power distribution units (PDUs)
● Uninterruptible power supplies (UPSs)
● Energy Smart containment rack enclosures
Find additional information at: https://www.delltechnologies.com/en-us/servers/power-and-
cooling.htm.

PSU specifications
The PowerEdge R760xs system supports up to two AC or DC power supply units (PSUs).

Table 26. R760xs PSU specifications

PSU Class Heat Frequ AC Voltage DC -48 V DC 277 V AC and HVDC
dissipation ency Voltage
(maximum (Hz)
) (BTU/ Low Line High Line 240 V DC -40 V to 277 V AC 336 V (260
hr) AC (100– AC (200– -72 V DC (249 V AC– V DC–400
120 V) 240 V) 305 V AC) V DC)
600 W Platinu 2250 600 W 600 W 600 W N/A N/A N/A
50/60
mixed mode m
700 W Titaniu 2625 50/60 N/A 700 W 700 W N/A N/A N/A
mixed mode m
HLAC
800 W Platinu 3000 800 W 800 W 800 W N/A N/A N/A
50/60
mixed mode m
1100 W -48 N/A 4265 N/A N/A N/A 1100 W N/A N/A
N/A
V DC
1100 W Titaniu 4125 1050 W 1100 W 1100 W N/A N/A N/A
50/60
mixed mode m
1400 W Platinu 5250 1050 W 1400 W 1400 W N/A N/A N/A
50/60
mixed mode m
1400 W 277 Titaniu 5250 N/A N/A N/A N/A 1400 W 1400 W
V AC and m 50/60
HVDC
1800 W Titaniu 6610 50/60 N/A 1800 W 1800 W N/A N/A N/A
mixed mode m
HLAC

NOTE: Heat dissipation is calculated using the PSU wattage rating.

NOTE: HLAC stands for High-Line AC, with a range of 200 - 240V AC. HVDC stands for High-Voltage DC, with 336 V DC.

NOTE: When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system
power consumption with the Enterprise Infrastructure Planning Tool available at Dell.com/calc.

NOTE: If a system with AC 1400 W or 1100 W PSUs operates at low line 100-120 Vac, and then the power rating per PSU is
degraded to 1050 W.

Power, thermal, and acoustics 39

Figure 27. PSU power cords

Figure 28. APP 2006G1 power cord

Figure 29. Lotes DC PSU connector

Table 27. PSU power cords

Form factor Output Power cord
Redundant 60 mm 600 W Mixed Mode C13
700 W Mixed Mode HLAC C13
800 W Mixed Mode C13
1100 W Mixed Mode C13
1100 W -48 V DC Lotes DC PSU connector
1400 W Mixed Mode C13
1400 W 277 VAC and 336 APP 2006G1
VDC
1800 W Mixed Mode HLAC C15

NOTE: C13 power cord combined with C14 to C15 jumper power cord can be used to adapt 1800 W PSU.

40 Power, thermal, and acoustics

Thermal
PowerEdge servers have an extensive collection of sensors that automatically track thermal activity, which helps regulate
temperature thereby reducing server noise and power consumption.

Acoustics
Acoustical configurations of R760xs
Dell PowerEdge R760xs is a rack server appropriate for attended data center environment. However, lower acoustical output is
attainable with proper hardware or software configurations.

Table 28. Configurations tested for acoustical experience

Configuration Quietest 12 x 3.5-inch Quietest - GPU Volume 1 - 2.5- Volume 2 - 3.5-
configuration inch inch with Rear
Storage
CPU TDP 125 W 185 W 150 W 185 W 185 W
CPU Quantity 1 2 2 2 2
RDIMM Memory 16 GB DDR5 32 GB DDR5 16 GB DDR5 16 GB DDR5 32 GB DDR5
Memory Quantity 2 16 4 16 16
Backplane Type 8 x 2.5-inch BP 12 x 3.5-inch BP 8 x 2.5-inch BP 8 x 2.5-inch + 8 x 12 x 3.5-inch + rear
2.5-inch NVMe BP 2 x 2.5-inch BP
HDD Type SATA 2.5-inch 480 SATA 3.5-inch 12 SATA 2.5-inch 480 SAS 2.5-inch + SATA 3.5-inch 12
GB TB GB NVMe 2.5-inch TB + rear 2.5-inch
U.2 NVMe
HDD Quantity 1 12 4 8+8 12+2
Flash Drives X X X X X
Flash Quantity X X X X X
PSU Type 600 W 1400 W 800 W 800 W 1400 W
PSU Quantity 1 2 2 2 2
OCP 1G 10/25 2-port 1G 10/25 2-port 10/25 2-port
PCI 1 X X X X X
PCI 2 X 2-port 25Gb X 2-port 25Gb 2-port 25Gb
PCI 3 X X X X X
PCI 4 X X A2 X X
PCI 5 X 2-port 25 Gb X 2-port 25 Gb 2-port 25 Gb
PCI 6 X X X X X
PERC Front H355i Front H755 Front H355i Front H755 Rear H755

Table 29. Acoustical experience of R760 configurations

Configuration Quietest 12 x 3.5-inch Quietest - Volume 1 - 2.5- Volume 2 -
configuration GPU inch 3.5-inch with
Rear Storage
Acoustical Performance: Idle/ Operating @ 25°C Ambient
L wA,m (B) Idle (4) 4.6 7.0 6.4 6.4 7.2

Power, thermal, and acoustics 41

Table 29. Acoustical experience of R760 configurations (continued)
Configuration Quietest 12 x 3.5-inch Quietest - Volume 1 - 2.5- Volume 2 -
configuration GPU inch 3.5-inch with
Rear Storage
Operating/Customer 4.6 7.0 8.0 6.4 7.2
usage operating (5)(6)
K (B) Idle (4) 0.4 0.4 0.4 0.4 0.4
v

Operating/Customer 0.4 0.4 0.4 0.4 0.4

usage operating (5)(6)
L pA,m (dB) Idle (4) 32 56 50 49 57
Operating/Customer 32 56 64 50 58
usage operating (5)(6)
Prominent discrete tones (3) Prominence Prominence ratio < 15 dB
ratio ＜
ECMA-74
Acoustical Performance: Idle @ 28°C Ambient
L (1) (B) 4.8 7.2 6.6 6.6 7.4
wA,m

K v (B) 0.4 0.4 0.4 0.4 0.4

L (2) (dB) 33 56 52 52 58
pA,m

Acoustical Performance: Max. loading @ 35°C Ambient

L (1) (B) 5.4 8.0 8.6 8.1 8.1
wA,m

K v (B) 0.4 0.4 0.4 0.4 0.4

L (2) (dB) 38 66 70 65 65
pA,m

(1) LwA,m:The declared mean A-weighted sound power level (LwA) is calculated per section 5.2 of ISO 9296 with data collected
using the methods described in ISO 7779 (2010). Engineering data presented here may not be fully compliant with ISO 7779
declaration requirements.
(2) LpA,m: The declared mean A-weighted emission sound pressure level is at the bystander position per section 5.3 of ISO 9296
and measured using methods described in ISO 7779. The system is placed in a 24U rack enclosure, 25cm above a reflective
floor. Engineering data presented here may not be fully compliant with ISO 7779 declaration requirements.
(3) Prominenttones: Criteria of Annex D of ECMA-74 & Prominence Ratio method of ECMA-418 are followed to determine if
discrete tones are prominent and to report them, if so.
(4) Idle mode: Idle mode is the steady-state condition in which the server is energized but not operating any intended function.
(5) Operating mode: Operating mode is represented by the maximum of the steady state acoustical output at 50% of CPU TDP
or active storage drives for the respective sections of Annex C of ECMA-74.
(6)Customer Usage Operating mode: The operating mode is represented by the maximum of the steady state acoustical output
at 10%~25% of CPU TDP, 0%~10% IOPs load, and >80% GPU load as the components showed in the above configurations.

42 Power, thermal, and acoustics

 10
Rack, rails, and cable management
Topics:
• Rails information
• Cable Management Arm
• Strain Relief Bar
• Rack Installation

Rails information
The rail offerings for the R760xs consist of two general types: sliding and static. The cable management offerings consist of an
optional cable management arm (CMA) and an strain relief bar (SRB).
See the Dell Enterprise Systems Rail Sizing and Rack Compatibility Matrix available at rail-rack-matrix for information regarding:
● Specific details about rail types.
● Rail adjustability ranges for various rack mounting flange types
● Rail depth with and without cable management accessories
● Rack types that are supported for various rack mounting flange types
Key factors governing proper rail selection include the following:
● Identifying the type of rack in which they will be installed.
● The spacing between the front and rear mounting flanges of the rack.
● The type and location of any equipment mounted in the back of the rack such as power distribution units (PDUs), and the
overall depth of the rack
● Overall depth of the rack

A11 Sliding Rails features summary

The sliding rails allow the system to be fully extended out of the rack for service. The sliding rails have a Cable Management Arm
(CMA) and a Strain Relief Bar (SRB) option.
There are one types of sliding rails available:
● Stab-in/Drop-in sliding rails

A11 Stab-in/Drop-in sliding rails for 4-post racks

● Supports Drop-in or Stab-in installation of the chassis to the rails
● Supports tool-less installation in 19-inch EIA-310-E compliant square, unthreaded round hole racks including all generations of
Dell racks.
Also supports tool-less installation in threaded round hole 4-post racks
● Support for tool-less installation in Dell Titan or Titan-D racks
● Supports full extension of the system out of the rack to allow serviceability of key internal components
● Supports optional Cable Management Arm (CMA)
NOTE: For situations where CMA support is not required, the outer CMA mounting brackets can be uninstalled from
the sliding rails. This reduces the overall length of the rails and eliminates the potential interferences with rear mounted
PDUs or the rear rack door.
● Supports optional Strain Relief Bar (SRB)

Rack, rails, and cable management 43

 NOTE: Scan the QRL code for the documentation and troubleshooting information regarding the installation procedures for
Drop-in/Stab-in rail types.

Figure 30. Quick resource locator for combo rails

A8 Static Rails features summary

The static rails, shown in the figure below, support a wider variety of racks than the sliding rails, but do not support
serviceability in the rack. The static rails are not compatible with the CMA and SRB.
● Supports Stab-in installation of the chassis to the rails
● Supports tool-less installation in 19-inch EIA-310-E compliant square or unthreaded round hole 4-post racks including all
generations of Dell racks
● Supports tooled installation in 19-inch EIA-310-E compliant threaded hole 4-post and 2-post racks
● Supports tooled installation in Dell Titan or Titan-D rack
NOTE:
● Screws are not included with the static rail kit since racks are offered with various thread types.
● Screw head diameter should be 10mm or less.

Figure 31. Static rails

2-Post racks installation

If installing to 2-Post (Telco) racks, the ReadyRails II static rails (A8) must be used. Sliding rails support mounting in 4-post
racks only.

44 Rack, rails, and cable management

Figure 32. Static rails in 2-post center mount configuration

Installation in the Dell Titan or Titan-D racks

For tool-less installation in Titan or Titan-D racks, the Stab-in/Drop-in sliding rails (A11) must be used. This rail collapses down
sufficiently to fit in the rack with mounting flanges that are spaced about 24 inches apart from front to back. The Stab-in/
Drop-in sliding rail allows bezels of the servers and storage systems to be aligned when installed in these racks. For tooled
installation, Stab-in Static rails (A8) must be used for bezel alignment with storage systems.

Cable Management Arm

The optional Cable Management Arm (CMA) for the system organizes and secures the cords and cables exiting the back of the
server and unfolds to allow the server to extend out of the rack without having to detach the cables.
Some key features of the CMA include:
● Large U-shaped baskets to support dense cable loads
● Open vent pattern for optimal airflow
● Support for mounting on either side by swinging the spring-loaded brackets from one side to the other
● Utilizes hook-and-loop straps rather than plastic tie wraps to eliminate the risk of cable damage during cycling
● Includes a low-profile fixed tray to both support and retain the CMA in its fully closed position
● Both the CMA and the tray mount without the use of tools through simple and intuitive snap-in designs
The CMA can be mounted to either side of the sliding rails without the use of tools or the need for conversion. For systems
with one power supply unit (PSU), it is recommended to mount on the side opposite to that of the power supply to allow easier
access to it and the rear drives (if applicable) for service or replacement.

Rack, rails, and cable management 45

Strain Relief Bar
The optional strain relief bar (SRB) for the R760xs organizes and supports cable connections at the rear end of the server to
avoid damage from bending.

Figure 33. Cabled strain relief bar

Sliding rails with optional SRB:

● Support tool-less attachment to rails
● Support two depth positions to accommodate various cable loads and rack depths
● Support cable loads and controls stress on server connectors
● Support cables can be segregated into discrete, purpose-specific bundles

Rack Installation
Drop-in design means that the system is installed vertically into the rails by inserting the standoffs on the sides of the system
into the J-slots in the inner rail members with the rails in the fully extended position. The recommended method of installation
is to first insert the rear standoffs on the system into the rear J-slots on the rails to free up a hand and then rotate the system
down into the remaining J-slots while using the free hand to hold the rail against the side of the system.
Stab-in design means that the inner (chassis) rail members must first be attached to the sides of the system and then inserted
into the outer (cabinet) members installed in the rack.

Installing system into the rack (option A: Drop-In)

1. Pull the inner rails out of the rack until they lock into place.

46 Rack, rails, and cable management

 Figure 34. Pull out inner rail
2. Locate the rear rail standoff on each side of the system and lower them into the rear J-slots on the slide assemblies.
3. Rotate the system downward until all the rail standoffs are seated in the J-slots.

Figure 35. Rail standoffs seated in J-slots

4. Push the system inward until the lock levers click into place.
5. Pull the blue side release lock tabs forward or backward on both rails and slide the system into the rack until the system is in
the rack.

Rack, rails, and cable management 47

 Figure 36. Slide system into the rack

Installing the system into the rack (option B: Stab-In)

1. Pull the intermediate rails out of the rack until they lock into place.
2. Release the inner rail lock by pulling forward on the white tabs and sliding the inner rail out of the intermediate rails.

Figure 37. Pull out the intermediate rail

Table 30. Rail component label

Number Component
1 Intermediate rail
2 Inner rail
3. Attach the inner rails to the sides of the system by aligning the J-slots on the rail with the standoffs on the system and
sliding forward on the system until they lock into place.

48 Rack, rails, and cable management

 Figure 38. Attach the inner rails to the system
4. With the intermediate rails extended, install the system into the extended rails.

Figure 39. Install system into the extended rails

5. Pull blue slide release lock tabs forward or backward on both rails, and slide the system into the rack.

Rack, rails, and cable management 49

 Figure 40. Slide system into the rack

50 Rack, rails, and cable management

 11
Supported operating systems
The PowerEdge R760xs system supports the following operating systems:
● Canonical Ubuntu Server LTS
● Microsoft Windows Server with Hyper-V
● Red Hat Enterprise Linux
● SUSE Linux Enterprise Server
● VMware vSAN/ESXi
For more information, go to www.dell.com/ossupport.

Supported operating systems 51

 12
Dell OpenManage Systems Management
Dell delivers management solutions that help IT administrators effectively deploy, update, monitor, and manage IT assets.
OpenManage solutions and tools enable you to quickly respond to problems by helping them to manage Dell servers efficiently;
in physical, virtual, local, and remote environments; all without the need to install an agent in the operating system.
The OpenManage portfolio includes:
● Innovative embedded management tools - integrated Dell Remote Access Controller (iDRAC)
● Consoles - OpenManage Enterprise
● Extensible with plug-ins - OpenManage Power Manager
● Update tools - Repository Manager
Dell has developed comprehensive systems management solutions that are based on open standards and has integrated with
management consoles from partners such as Microsoft and VMware, allowing advanced management of Dell servers. Dell
management capabilities extend to offerings from the industry's top systems management vendors and frameworks such as
Ansible, Splunk, and ServiceNow. OpenManage tools automate the full span of server life cycle management activities along
with powerful RESTful APIs to script or integrate with your choice of frameworks.
For more information about the entire OpenManage portfolio, see:
● The latest Dell Systems Management Overview Guide.
Topics:
• Integrated Dell Remote Access Controller (iDRAC)
• Systems Management software support matrix

Integrated Dell Remote Access Controller (iDRAC)

iDRAC9 delivers advanced, agent-free, local and remote server administration. Embedded in every PowerEdge server, iDRAC9
provides a secure means to automate a multitude of common management tasks. Because iDRAC is embedded within every
PowerEdge server, there is no additional software to install; just plug in power and network cables, and iDRAC is ready to go.
Even before installing an operating system (operating system) or hypervisor, IT administrators have a complete set of server
management features at their fingertips.
With iDRAC9 in-place across the Dell PowerEdge portfolio, the same IT administration techniques and tools can be applied
throughout. This consistent management platform allows easy scaling of PowerEdge servers as an organization's infrastructure
grows. Customers can use the iDRAC RESTful API for the latest in scalable administration methods of PowerEdge servers. With
this API, iDRAC enables support for the Redfish standard and enhances it with Dell extensions to optimize at-scale management
of PowerEdge servers. By having iDRAC at the core, the entire OpenManage portfolio of Systems Management tools allows
every customer to tailor an effective, affordable solution for any size environment.
Zero Touch Provisioning (ZTP) is embedded in iDRAC. ZTP - Zero Touch Provisioning is Intelligent Automation Dell's agent-free
management puts IT administrators in control. Once a PowerEdge server is connected to power and networking, that system
can be monitored and fully managed, whether you're standing in front of the server or remotely over a network. In fact,
with no need for software agents, an IT administrator can: • Monitor • Manage • Update • Troubleshoot and remediate Dell
servers With features like zero-touch deployment and provisioning, iDRAC Group Manager, and System Lockdown, iDRAC9 is
purpose-built to make server administration quick and easy. For those customers whose existing management platform utilizes
in-band management, Dell does provide iDRAC Service Module, a lightweight service that can interact with both iDRAC9 and
the host operating system to support legacy management platforms.
When ordered with DHCP enabled from the factory, PowerEdge servers can be automatically configured when they are
initially powered up and connected to your network. This process uses profile-based configurations that ensure each server is
configured per your specifications. This feature requires an iDRAC Enterprise license.
iDRAC9 offers following license tiers:

52 Dell OpenManage Systems Management

Table 31. iDRAC9 license tiers
License Description
iDRAC9 Basic ● Available only on 100-500 series rack/tower
● Basic instrumentation with iDRAC web UI
● For cost conscious customers that see limited value in management
iDRAC9 ● Default on 600+ series rack/tower, modular, and XR series
Express ● Includes all features of Basic
● Expanded remote management and server life-cycle features
iDRAC9 ● Available as an upsell on all servers
Enterprise ● Includes all features of Basic and Express. Includes key features such as virtual console, AD/LDAP
support, and more
● Remote presence features with advanced, Enterprise-class, management capabilities
iDRAC9 ● Available as an upsell on all servers
Datacenter ● Includes all features of Basic, Express, and Enterprise. Includes key features such as telemetry streaming,
Thermal Manage, automated certificate management, and more
● Extended remote insight into server details, focused on high end server options, granular power, and
thermal management

For a full list of iDRAC features by license tier, see Integrated Dell Remote Access Controller 9 User's Guide at Dell.com.
For more details on iDRAC9 including white papers and videos, see:
● Support for Integrated Dell Remote Access Controller 9 (iDRAC9) on the Knowledge Base page at Dell.com

Systems Management software support matrix

Table 32. Systems Management software support matrix
Categories Features PE mainstream
Embedded Management and In-band iDRAC9 (Express, Enterprise, and Datacenter licenses) Supported
Services
OpenManage Mobile Supported
OM Server Administrator (OMSA) Supported
iDRAC Service Module (iSM) Supported
Driver Pack Supported
Change Management Update Tools (Repository Manager, DSU, Catalogs) Supported
Server Update Utility Supported
Lifecycle Controller Driver Pack Supported
Bootable ISO Supported
Console and Plug-ins OpenManage Enterprise Supported
Power Manager Plug-in Supported
Update Manager Plug-in Supported
SupportAssist Plug-in Supported
CloudIQ Supported
Integrations and connections OM Integration with VMware Vcenter/vROps Supported
OM Integration with Microsoft System Center (OMIMSC) Supported
Integrations with Microsoft System Center and Windows Supported
Admin Center (WAC)

Dell OpenManage Systems Management 53

Table 32. Systems Management software support matrix (continued)
Categories Features PE mainstream
ServiceNow Supported
Ansible Supported
Third-party Connectors (Nagios, Tivoli, Microfocus) Supported
Security Secure Enterprise Key Management Supported
Secure Component Verification Supported
Standard operating system Red Hat Enterprise Linux, SUSE, Windows Server 2019 or Supported (Tier-1)
2022, Ubuntu, CentOS

54 Dell OpenManage Systems Management

 13
Appendix A. Standards compliance
The system conforms to the following industry standards.

Table 33. Industry standard documents

Standard URL for information and specifications
ACPIAdvance Configuration and Power Interface https://uefi.org/specsandtesttools
Specification, v6.4
Ethernet IEEE Std 802.3-2022 https://standards.ieee.org/
MSFT WHQL Microsoft Windows Hardware Quality Labs microsoft.com/whdc/system/platform/pcdesign/desguide/
serverdg.mspx
IPMI Intelligent Platform Management Interface, v2.0 intel.com/design/servers/ipmi
DDR5 Memory DDR5 SDRAM Specification jedec.org/standards-documents/docs/jesd79-4.pdf
PCI Express PCI Express Base Specification, v5.0 pcisig.com/specifications/pciexpress
PMBus Power System Management Protocol Specification, http://pmbus.org/Assets/PDFS/Public/
v1.2 PMBus_Specification_Part_I_Rev_1-1_20070205.pdf
SAS Serial Attached SCSI, 3 (SAS-3) (T10/INCITS 519) http://www.t10.org/
SATA Serial ATA Rev. 3.3 sata-io.org
SMBIOS System Management BIOS Reference Specification, DMTF SMBIOS
v3.3.0
TPM Trusted Platform Module Specification, v1.2 and v2.0 trustedcomputinggroup.org
UEFI Unified Extensible Firmware Interface Specification, v2.7 uefi.org/specifications
PI Platform Initialization Specification, v1.7
USB Universal Serial Bus v2.0 and SuperSpeed v3.0 (USB 3.1 USB Implementers Forum, Inc. https://usb.org/documents
Gen1)
NVMe Express Base Specification. Revision 2.0c https://nvmexpress.org/specifications/
NVMe Command Set Specifications
1. NVM Express NVM Command Set Specification. Revision
1.1c
2. NVM Express Zoned Namespaces Command Set. Revision
1.0c
3. NVM Express® Key Value Command Set. Revision 1.0c
NVMe Transport Specifications
1. NVM Express over PCIe Transport. Revision 1.0c
2. NVM Express RDMA Transport Revision. 1.0b
3. NVM Express TCP Transport. Revision 1.0c
NVMe NVM Express Management Interface. Revision 1.2c
NVMe NVMe Boot Specification. Revision 1.0

Appendix A. Standards compliance 55

 14
Appendix B: Additional resources
Topics:
• Customer kits
• Documentation

Customer kits

Dell Upgrades
It is not always possible to plan for new applications, future workloads, and business needs. Unleash the full power of your
Dell Technologies Infrastructure. When budget does not permit the purchase of new servers, Dell Upgrades is a cost-effective
method to repurpose and unleash the full power of existing server, storage, and networking infrastructure.
● Protect your mission-critical operations by using only genuine Dell OEM-validated Upgrades and the technical expertise of
Dell ProSupport
● Flex and scale existing infrastructure by upgrading, adding memory or storage drives to cost-effectively and quickly meet
new workloads and demands
● Dell Upgrades are the same peripheral commodities that your customer may improve or maintain their server after the initial
point of sale

Upgrades portfolio
Table 34. Upgrade category
Dell Upgrade Category Sample Picture Dell Upgrade Category Offerings
Memory DDR5 5600 MT/s and 4800 MT/s
Memory upgrades are essential for
keeping your customers operating at
peak performance as their business
needs grow and their workloads
increase. We tend to see strong demand
for server memory because it is the
easiest and most cost-effective way to
improve system performance.

Storage HDD: SATA, SAS interface

Dell offers both solid-state drive and SSD: SATA, SAS, PCI
hard disk drive storage options for
enterprise systems with SATA, SAS or NVMe interface Tape Drive or Media
NVMe interfaces. SSDs excel in speed,
high-performance I/O requirements, and
high reliability due to the lack of spinning
disks. Hard Disk Drives (HDDs) store
data on spinning disks and offer value for
the amount of data storage for the price.

Dell offers both solid-state drive and

hard disk drive storage options for
enterprise systems with SATA, SAS

56 Appendix B: Additional resources

Table 34. Upgrade category (continued)
Dell Upgrade Category Sample Picture Dell Upgrade Category Offerings

interfaces. SSDs excel in speed, high-

performance I/O requirements, and high
reliability due to the lack of spinning
disks. Hard Disk Drives (HDDs) store
data on spinning disks and offer value for
the amount of data storage for the price.

Processor Processors (Intel)

Processor upgrades help customers Heat sinks
perform and accomplish more tasks
overall, saving them valuable time.
Our processor upgrades include Intel®
Xeon® Scalable processors to meet
your customers workload needs with
increased cores and improved security.

Networking and Optics Network cards

Our networking and optics components Transceivers (Optics)
—network interface cards, transceivers,
optical cables, and more—are key in
today’s data center environment, helping
customers to improve bandwidth to
better manage increase in workloads,
devices, users, and interconnected
systems.

Accessories: Dell sells accessories like Controller cards

power supplies, cables and power cables,
bezels, controller cards, GPU, PERC and Power supplies
other components to complete the Dell
Upgrades portfolio and redundancies. Cables

Rail kits

Bezels

Power cords
GPU
PERC
BOSS
Power cords
Cable Management Arm (CAM)
Fans
Serial board
Internal USB

Appendix B: Additional resources 57

Upgrades reference links
● Main Upgrades Page
● Customer Kit Selector
● Dell Parts Finder Tool (Customer Facing Tool)

Documentation
This section provides information about the documentation resources for your system.

Table 35. Documentation resources

Document Location
Factory Configuration Matrix Sales Portal
SPM (Slot Priority Matrix) Sales Portal
NDA Deck Sales Portal
Installation and Service Manual (ISM) https://www.dell.com/poweredgemanuals
Field Service Manual (FSM) https://www.dell.com/poweredgemanuals > Sing in
Technical Guide Dell.com > Product page > Product Details
Spec Sheet Dell.com > Product page > Product Details

58 Appendix B: Additional resources

 15
Appendix C: Additional specifications
Topics:
• Chassis dimensions
• System weight
• Video specifications
• USB ports specifications
• Environmental specifications

Chassis dimensions

Figure 41. Chassis dimensions

Table 36. PowerEdge R760xs chassis dimensions

Xa Xb Y Za Zb Zc
482.0 mm (18.97 inches) 434.0 mm (17.08 86.8 mm (3.41 22.0 mm (0.86 677.44 mm (26.67 685.78 mm
inches) inches) inches) Without inches) Ear to L (26.99 inches)
bezel bracket housing Ear to PSU
handle without
velcro strap

Appendix C: Additional specifications 59

Table 36. PowerEdge R760xs chassis dimensions
Xa Xb Y Za Zb Zc

35.84 mm (1.41 650.24 mm (25.6

inches) With inches) Ear to PSU
bezel surface

NOTE: Zb is the nominal rear wall external surface where the system board I/O connectors reside.

System weight
Table 37. PowerEdge R760xs systemweight
System configuration Maximum weight (with all drives/SSDs/bezel)
16+8 x 2.5-inch 25.92 kg (57.14 lb)
16 x 2.5-inch 24.58 kg (54.18 lb)
12 x 3.5-inch 28.82 kg (63.53 lb)
8 x 3.5-inch 25.84 kg (54.96 lb)
8 x 2.5-inch 21.56 kg (47.53 lb)
No backplane configuration 19.40 kg (42.76 lb)

Video specifications
The PowerEdge R760xs system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.

Table 38. Supported video resolution options for the system

Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32

60 Appendix C: Additional specifications

USB ports specifications
Table 39. PowerEdge R760xs USB specifications
Front Rear Internal (Optional)
USB port type No. of ports USB port type No. of ports USB port type No. of ports
USB 2.0- One USB 2.0- One Internal USB 3.0- One
compliant port compliant port compliant port

iDRAC Direct port One USB 3.0- One

(Micro-AB USB compliant port
2.0- compliant
port)

NOTE: The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

NOTE: The USB 2.0 specifications provide a 5 V supply on a single wire to power connected USB devices. A unit load is
defined as 100 mA in USB 2.0, and 150 mA in USB 3.0. A device may draw a maximum of 5 unit loads (500 mA) from a port
in USB 2.0; 6 (900 mA) in USB 3.0.

NOTE: The USB 2.0 interface can provide power to low-power peripherals but must adhere to USB specification. An
external power source is required for higher-power peripherals to function, such as external CD/DVD Drives.

Environmental specifications
NOTE: For additional information about environmental certifications, refer to the Product Environmental Datasheet located
with the Documentation on www.dell.com/support/home.

Table 40. Continuous Operation Specifications for ASHRAE A2

Temperature, humidity and, operational Allowable continuous operations
altitude
Temperature range for altitudes <= 900 m (<= 10–35°C (50–95°F) with no direct sunlight on the equipment
2953 ft)
Humidity percent range (non-condensing at all 8% RH with -12°C (10.4°F) minimum dew point to 80% RH with 21°C
times) (69.8°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900
m (2953 Ft)

Table 41. Continuous Operation Specifications for ASHRAE A3

Temperature, humidity and, operational Allowable continuous operations
altitude
Temperature range for altitudes <= 900 m (<= 5–40°C (41–104°F) with no direct sunlight on the equipment
2953 ft)
Humidity percent range (non-condensing at all 8% RH with -12°C (10.4°F) minimum dew point to 85% RH with 24°C
times) (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/175 m (1.8°F/574 Ft) above 900
m (2953 Ft)

Table 42. Continuous Operation Specifications for ASHRAE A4

Temperature, humidity and, operational Allowable continuous operations
altitude
Temperature range for altitudes <= 900 m (<= 5–45°C (41–113°F) with no direct sunlight on the equipment
2953 ft)

Appendix C: Additional specifications 61

Table 42. Continuous Operation Specifications for ASHRAE A4 (continued)
Temperature, humidity and, operational Allowable continuous operations
altitude
Humidity percent range (non-condensing at all 8% RH with -12°C (10.4°F) minimum dew point to 90% RH with 24°C
times) (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900
m (2953 Ft)

Table 43. Continuous Operation Specifications for Rugged Environment

Temperature, humidity and, operational Allowable continuous operations
altitude
Temperature range for altitudes <= 900 m (<= 5–45°C (41–113°F) with no direct sunlight on the equipment
2953 ft)
Humidity percent range (non-condensing at all 8% RH with -12°C (10.4°F) minimum dew point to 90% RH with 24°C
times) (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900
m (2953 Ft)

Table 44. Common Environmental Specifications for ASHRAE A2, A3, A4 and Rugged
Temperature, humidity and, operational Allowable continuous operations
altitude
Maximum temperature gradient (applies to both 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15
operation and non-operation) minutes), 5°C in an hour* (9°F in an hour) for tape
NOTE: * - Per ASHRAE thermal guidelines for tape hardware, these are
not instantaneous rates of temperature change.

Non-operational temperature limits -40 to 65°C (-104 to 149°F)

Non-operational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude 12,000 meters (39,370 feet)
Maximum operational altitude 3,048 meters (10,000 feet)

Table 45. Maximum vibration specifications

Maximum vibration Specifications
Operating 0.21 G rms at 5 Hz to 500 Hz for 10 minutes (all operation orientations)
Storage 1.88 G rms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)

Table 46. Maximum shock pulse specifications

Maximum shock pulse Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y,
and z axis of 6 G for up to 11 ms.
Storage Six consecutively executed shock pulses in the positive and negative x, y,
and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Thermal restriction matrix

Table 47. Processor and heat sink matrix
Heat sink Processor TDP
STD HSK < 185 W CPU SKUs

62 Appendix C: Additional specifications

Table 47. Processor and heat sink matrix (continued)
Heat sink Processor TDP
HPR HSK 185 W-250 W CPU SKUs (12 x 3.5-inch drive configuration
not supported)
125W-250W CPU SKUs (12 x 3.5-inch drive configuration
supported)

Table 48. Label reference

Label Description
STD Standard
HPR (Silver) High Performance Silver (HPR) fan
HPR (Gold) High Performance Gold (VHP) fan
HSK Heat sink

NOTE: The ambient temperature of the configuration is determined by the critical component in that configuration. For
example, if the processor's supported ambient temperature is 35°C, the DIMM is 35°C, and the GPU is 30°C, the
combined configuration can only support 30°C.

Table 49. Supported ambient temperature for processors for R760xs

R760xs
configuration No 8 x 3.5- 12 x 12 x 8 x 2.5- 8 x 2.5- 16 x 16 x
backpla inch 3.5- 3.5- inch inch 2.5- 2.5-
ne SAS inch inch SAS NVMe inch inch + 8
configu SAS configu configu configu SAS x 2.5-
ration configu ration ration ration configu inch
ration with ration NVMe
rear configu
drive ration
module
EMR 4514Y 150 W 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
MCC
CPU 5512U 185 W 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
6526Y/6534 195 W 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
6548Y+/ 250 W 35°C 35°C 30°C 30°C 35°C 35°C 35°C 35°C
6542Y/6548N
SPR 4509Y 125 W 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
LCC
CPU 4510 150 W 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C

SPR 3408U 125 W 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
MCC
CPU 5416S/ 150 W 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
4410T/
4410Y/5415+
4416 165 W 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
5418Y/ 185 W 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
5412U/6426Y
5420+/ 205 W 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
6438Y+
6448Y/6442Y 225 W 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
6414U 250 W 35°C 35°C 30°C 30°C 35°C 35°C 35°C 35°C
Memory 96 GB 8.1 W, 1DPC 35°C 35°C 30°C 30°C 35°C 35°C 35°C 35°C
RDIMM 5200

Appendix C: Additional specifications 63

Table 49. Supported ambient temperature for processors for R760xs (continued)
R760xs
configuration No 8 x 3.5- 12 x 12 x 8 x 2.5- 8 x 2.5- 16 x 16 x
backpla inch 3.5- 3.5- inch inch 2.5- 2.5-
ne SAS inch inch SAS NVMe inch inch + 8
configu SAS configu configu configu SAS x 2.5-
ration configu ration ration ration configu inch
ration with ration NVMe
rear configu
drive ration
module
64 GB 7.7 W, 1DPC 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
RDIMM 5200
32 GB 5.1 W, 1DPC 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
RDIMM 5200
64 GB 12 W, 1DPC 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
RDIMM 4800
32 GB 10 W, 1DPC 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
RDIMM 4800
PCIe 45°C 40°C 35°C 1 35°C 1 40°C 40°C 40°C 40°C
A2 GPU 6 35°C 30°C Not Not 35°C 35°C 30°C 30°C
supporte supporte
d d
OCP 45°C 40°C 35°C 2 35°C 2 40°C 40°C 40°C 40°C
BOSS 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C

NOTE:
1. Max supported thermal tier of PCIe card is Tier 5.
2. Max supported thermal tier of OCP is Tier 5.
3. HPR Sliver fan is required from fan zone 2 to fan zone 6 for 8 x 2.5-inch NVMe, 16 x 2.5-inch SAS/SATA + 8 x 2.5-inch
NVMe, 12 x 3.5-inch drives or GPU configurations.
4. Optional fan zone 1 has to be populated with HPR Gold fan is for BOSS, GPU or rear drive module populations.
5. PCIe slot priority of Nvidia A2 GPU is constrained on slot #3, #4, #6.
6. HPR heatsink is required for ≥ 185 W CPUs, 12 x 3.5-inch drives or 12 x 3.5-inch drives with rear storage module
configurations.
7. DIMM blank is required for 12 x 3.5-inch SAS/SATA with rear storage module.
8. Fan blank is required on fan zone 1 when no fan population.
9. OCP shroud is required for OCP card population without PCIe riser module installed.
10. CPU blank is required for single processor configuration.
11. Rear drive module does not support Kioxia CM6 series, Samsung PM1735 series, Hynix PE8010/PE8110 ≥ 7.68 TB,
Samsung PM1733a > 1.92 TB, Samsung PM1735a > 1.6 TB and Redtail NVMe drive.

NOTE: The fan speed in the 3.5-inch chassis is limited to 90% due to the drive dynamic profile.

Table 50. Fan population rule for R760xs

configuratio No 8 x 3.5-inch 12 x 3.5- 8 x 2.5-inch 8 x 2.5-inch 16 x 2.5-inch 24 x 2.5-inch
n backplane SAS inch SAS SAS NVMe SAS (16 x 2.5-inch
+ 8 x 2.5-inch
Optional NVMe)
HW
Default Fan 2 to Fan Fan 2 to Fan Fan 2 to Fan Fan 2 to Fan Fan 2 to Fan Fan 2 to Fan 6 Fan 2 to Fan 6
6 with STD 6 with STD 6 with HPR 6 with STD 6 with HPR with STD fan with HPR Silver
fan fan Silver fan fan Silver fan fan

64 Appendix C: Additional specifications

Table 50. Fan population rule for R760xs (continued)
configuratio No 8 x 3.5-inch 12 x 3.5- 8 x 2.5-inch 8 x 2.5-inch 16 x 2.5-inch 24 x 2.5-inch
n backplane SAS inch SAS SAS NVMe SAS (16 x 2.5-inch
+ 8 x 2.5-inch
Optional NVMe)
HW
Rear Module Not Not Fan 1 with Not Not Not supported Not supported
supported supported HPR Gold fan supported supported

Fan 2 to Fan
6 with HPR
Silver fan

BOSS N1 Fan 1 with Fan 1 with Fan 1 with Fan 1 with Fan 1 with Fan 1 with HPR Fan 1 with HPR
HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan Gold fan Gold fan

Fan 2 to Fan Fan 2 to Fan Fan 2 to Fan Fan 2 to Fan Fan 2 to Fan Fan 2 to Fan 6 Fan 2 to Fan 6
6 with STD 6 with STD 6 with HPR 6 with STD 6 with HPR with STD fan with HPR Silver
fan fan Silver fan fan Silver fan fan

GPU Fan 1 with Fan 1 with Not Fan 1 with Fan 1 with Fan 1 with HPR Fan 1 with HPR
HPR Gold fan HPR Gold fan supported HPR Gold fan HPR Gold fan Gold fan Gold fan

Fan 2 to Fan Fan 2 to Fan Fan 2 to Fan Fan 2 to Fan Fan 2 to Fan 6 Fan 2 to Fan 6
6 with HPR 6 with HPR 6 with HPR 6 with HPR with HPR Silver with HPR Silver
Silver fan Silver fan Silver fan Silver fan fan fan

Thermal Restrictions for PCIe adapter NIC and other network cards with iDRAC
● Cannot support PCIe cards with the cooling requirement more than 300LFM at 55C in a 12 x 3.5-inch SAS/SATA
configuration.
● Solarflare Melrose DP 25 GBE SFP28 (TTKWY) not supported with 12 x 3.5-inch SAS/SATA configuration.
● 100 Gb network adapter or 100 Gb OCP is not supported in the 12 x 3.5-inch SAS/SATA configuration.
● Few 25 GB OCP cards with the cooling requirement more than 250LFM at 55C (3Y64D/4TRD3 / GGGDF/R1KTR / Y4VV5)
is not supported in 12x3.5" SAS/SATA configuration.
● The 12 x 3.5-inch SAS/SATA configuration requires the optical transceiver with higher temperature spec (≥ 85°C) to
support (M14MK / N8TDR).
● Quad port OCP (3Y64D/Y4VV5) requires the optical transceiver with higher temperature spec (≥ 85°C) to support
(M14MK).
● 100 Gb network adapter cannot support the transceivers as 14NV5/9JKK2 / QSFP56 (MFS1S00-VxxxE/HxxxE).
● The H965e is limited to populate in PCI slot 3 in a 12 x 3.5-inch SAS/SATA configuration.
● Mellanox CX7 NDR200 card has few limitations of PCI slot locations.

Table 51. Mellanox CX7 NDR200 slot location limitations

Storage configuration Slots on 3.5-inch configuration Slots on 2.5-inch configuration
Gen5 PCIe sloit support for CX7 3, 4 3, 4
NDR200
Gen4 PCIe sloit support for CX7 6 5, 6
NDR200

Thermal restrictions for extended ambient support (ASHRAE A3/A4)

● Two PSUs are required in redundant mode. Single PSU failure is not supported.
● 12 x 3.5-inch SAS/SATA configuration is not supported.
● BOSS(M.2) module is not supported.
● CPU TDP > 185 W is not supported.
● PCIe card TDP > 25 W is not supported.

Appendix C: Additional specifications 65

● OCP cards with transmission rate higher than 25 GB is not supported.
● OCP transceiver spec ≤ 75°C is not supported.
● 8 x 3.5-inch SAS/SATA, 8 x 2.5-inch SAS/SATA, 8 x 2.5-inch NVMe, 16 x 2.5-inch SAS/SATA, 16 x 2.5-inch SAS/SATA + 8x
2.5-inch NVMe configurations are limited to support A3.
● 128 GB+ memory is not supported .
● The rear drive is not supported.

66 Appendix C: Additional specifications

 16
Appendix D: Services
Topics:
• Default service levels
• ProDeploy Infrastructure Suite
• Supplemental Deployment Services
• Unique Deployment Scenarios
• DAY 2 - Automation Services with Ansible
• ProSupport Infrastructure Suite
• Specialty Support Services
• Consulting Services
• Resources

Default service levels

ProDeploy Infrastructure Suite

ProDeploy Infrastructure Suite provides a variety of deployment offerings to satisfy a customer's unique needs. It is made up of
five sub-offers: Configuration Services, Rack Integration, Basic Deployment, ProDeploy, and ProDeploy Plus.

Figure 42. ProDeploy Infrastructure Suite

Factory Based Services

Pre-configured systems or complete racks, customized prior to shipping to the customer's site.

Appendix D: Services 67
ProDeploy Factory Configuration
Ideal for customers buying servers in volume and seeking pre-configuration prior to shipping such as: custom image, system
settings, and asset tagging so it arrives ready to use out of the box. Furthermore, servers are packaged and bundled to meet
specific shipping and distribution requirements for each customer location to facilitate the rollout process. Once the server is
onsite , Dell can install and configure the server to the environment using any of the field-based deployment services outlined in
the next section.

ProDeploy Rack Integration

Ideal for customers seeking to build out fully integrated racks prior to shipping. These rack builds include hardware install,
cabling, and full system configuration. You can also add-on a factory stress test and an optional on-site final rack configuration
to complete the rack installation.
● STANDARD SKUs for Rack Integration is available in the USA only and requires:
○ 20 or more devices (R and C series servers, VxRail, and all Dell or non-Dell switches)
○ Use Informational SKUs for Dell switches or 3rd party products.
○ Shipping to contiguous USA
● USE CUSTOM QUOTE for Rack Integration scenarios that require:
○ Shipment to any country or region outside USA or shipping outside contiguous USA
○ Shipping to multiple locations
○ Racks containing less than 20 servers
○ Any rack that includes Storage

Figure 43. ProDeploy Infrastructure Suite - Factory services

Field-based Services
Put PowerEdge servers to work faster with Dell field-based deployment services. Whether we are deploying one server to one
thousand – we have you covered. Dell provides versatile delivery options to fit every budget and operating model.

ProDeploy Plus
Elevate Infrastructure deployments with our most complete service from planning through onsite hardware installation and
software configuration including the implementation of cybersecurity best practices. ProDeploy Plus provides the skill and scale

68 Appendix D: Services
needed to successfully execute demanding deployments in today's complex IT . The deployment starts with a site readiness
review and implementation plan. Certified deployment experts perform the software configuration to include set up of leading
operating systems and hypervisors. Dell will also configure PowerEdge software tools to include iDRAC and OpenManage
system utilities as well as support AIOps platforms: MenvironmentsyService360, TechDirect, and CloudIQ. Unique to ProDeploy
Plus, the cybersecurity implementation helps customers understand potential security risks and make recommendations for
reducing product attack surfaces. The system is tested, validated prior to completion. The customer will also receive full project
documentation and knowledge transfer to complete the process.

ProDeploy
ProDeploy provides remote software configuration and choice of hardware installation (onsite or guided). ProDeploy is great for
customers who are price sensitive or willing to participate in some portion of the deployment to include providing remote access
to their network. The ProDeploy remote software implementation includes everything mentioned in ProDeploy Plus except it
does not include the added value, cybersecurity implementation and best practices.

Basic Deployment
Basic Deployment delivers worry-free professional installation by experienced technicians. This service is often sold to
Competency Enabled Partners who will have Dell do the hardware installation while they complete the software configuration.
Furthermore, Basic Deployment tends to be purchased by large enterprises who have smart technical staff. These companies
just need Dell to install the hardware and they will perform the software configuration. The last use case for Basic Deployment
is when paired with Factory Configuration services. The servers are pre-configured in the factory and the basic deployment
service will install the system into the rack to finalize the deployment.

Figure 44. ProDeploy Infrastructure Suite - Field services

Supplemental Deployment Services

Additional ways to expand scope or deploy for unique scenarios.

Table 52. Expand scope and transition

Expand scope and transition Unique deployment scenarios
Two Host Adder (requires PD/PDP) "Custom" Service Engagement

Appendix D: Services 69
Table 52. Expand scope and transition (continued)
Expand scope and transition Unique deployment scenarios
Additional Deployment Time (ADT) (Sold with or without PD/ ProDeploy Add-on for HPC
PDP)
Data Migration ProDeploy Plus for Direct Liquid Cooling (DLC 3000)
Residency Services (onsite or remote) ProDeploy for TELCO
- ProDeploy FLEX

Two Host Adder (requires PD/PDP)

Deploying new storage, compute, or networking devices may require interconnection to other servers (also called hosts). The
Dell delivery team will set up four hosts per device as part of every ProDeploy service. For example, if the customer is buying
two storage arrays the ProDeploy service will automatically include connectivity of four hosts each (4x2=8 total hosts per
project since there are two devices). This supplemental “Two Host Adder” service provides for the configuration of additional
hosts above what is already provided as part of the ProDeploy service. In many cases, customers can work with us while we
set up the included hosts, so they may understand how to do the rest themselves. Always ask the customer how many hosts
are being connected and sell the host adder depending on the customer’s technology skillset. Note this service applies to the
connectivity of Dell devices not 3rd party devices.

Additional Deployment Services (ADT) - sold with or without PD/PDP

You can expand the scope of a ProDeploy engagement leveraging Additional Deployment Time (ADT). ADT will cover additional
tasks above the normal deliverables of the ProDeploy offers. ADT can also be used as a standalone service without ProDeploy.
SKUs are available for both Project Management and Technical Resource Expertise. SKUs are sold as blocks of four hours
remote or eight hours onsite. The delivery team can assist in scoping the number of hours required for additional tasks.

Data Migration Services

Migrating data sets is no easy task. Our experts use proven tools and process to streamline data migrations and avoid
compromising data. A customer project manager works with our experienced team of experts to create a migration plan. Data
migration is part of every technology upgrade, platform change, and shift to the cloud. You can rely on Dell data migration
services to perform a seamless transition.

Residency Services
Certified technical professionals act like an extension of your IT staff to enhance internal capabilities and resources and
help you realize faster adoption and maximized ROI of new technology. Residency Services help customers transition to new
capabilities quickly by leveraging specific technology skill sets. Residency experts can provide post implementation management
and knowledge transfer that is related to a new technology acquisition or day-to-day operational management of the IT
infrastructure.
● Global experts available to serve in-person (onsite) or virtual (remote)
● Engagements starting at 2 weeks with flexibility to adjust

Unique Deployment Scenarios

Custom Deployment Services
When a deployment is beyond the scope of the ProDeploy Infrastructure Suite, you can turn to the custom deployment services
team to address complex implementation scenarios and unique customer requirements. The Dell custom deployment team is
staffed with solution architects who assist with customer scoping calls to define the project and develop the statement of
work. Custom services can handle a wide range of deployments that can be performed in the factory or onsite. All custom
engagement services are requested through SFDC.

70 Appendix D: Services
ProDeploy FLEX
ProDeploy Flex is a new service and a powerful tool for you to attach more services and improve revenue and margins. The
ProDeploy Flex modular offer allows sales teams to build and better tailor services by mixing factory and field delivery options.
You can also select special deployment scenarios without going to the custom order desk. FLEX is ideal for unique deployments
where ProDeploy or ProDeploy Plus are not an adequate answer to the customer needs.

Key features of ProDeploy FLEX

● Build deployment quotes using modular, selectable features for both hardware and software.
● The system automatically scales pricing based on volume.
● Ideal for customers who require NativeEdge Orchestrator or edge deployments
● Ability to add deployment services to third-party networking devices

Deployment of HPC
High-Performance Computing (HPC) implementations require specialists that understand advanced feature sets. Dell deploys
the world's fastest systems and understands the nuances that make them perform. HPC deployments are most often scoped as
custom service engagements, however we can do smaller HPC clusters under 300 nodes using a standard ProDeploy SKU. Any
standard SKU for HPC deployment will be sold as one base SKU per cluster (ProDeploy for HPC Base) along with one ProDeploy
for HPC Add-on for each device in the cluster (server nodes and switches).
● Scope of ProDeploy for HPC: *Available as standard SKUs in the US and Canada. Custom Service would be required for all
other regions.

Figure 45. Standard deliverables of ProDeploy for HPC

Appendix D: Services 71
Figure 46. Visual view of HPC deployment options to include hardware and software

DAY 2 - Automation Services with Ansible

Dell solutions are built as "automation ready" with integrated APIs (Application Programming Interfaces) to allow customers
to programmatically call actions on the product through code. Although Dell has published Anisble automation use cases,
some customers need additional assistance with GitOps. By the end of the service, the customer will have the foundational
components required to accelerate automation and understand how the programming works together: Day 1 and Day 2 use case
automation scripts (ansible modules), CI/CD tool (Jenkins), and Version control (Git).

ProSupport Infrastructure Suite

ProSupport Infrastructure Suite is a set of support services that enable customers to build the solution that is right for
their organization. They choose support models that are based on how they use technology and where they want to allocate
resources. From the desktop to the data center, customers can address everyday IT challenges, such as unplanned downtime,
mission-critical needs, data and asset protection, support planning, resource allocation, software application management and
more. Optimize customer IT resources by choosing the right support model.

ProSupport Plus for Infrastructure

Service that caters to customers who require proactive, predictive, and personalized support for systems that manage
critical business applications and workloads. When customers purchase PowerEdge server, we recommend ProSupport Plus,
our proactive and preventative support service for business-critical systems. ProSupport Plus provides all the benefits of
ProSupport, including the following "Top five reasons to buy PSP".
1. Priority access to specialized support experts - immediate, advanced troubleshooting from an engineer that understands Dell
infrastructure solutions.
2. Mission Critical Support – when critical (Severity 1) support issues happen, the customer is assured that we will do all we
can to get them back up and running as quickly as possible.
3. Service Account Manager – a customer’s #1 support advocate, ensuring they get the best possible proactive and predictive
support experience.
4. Systems maintenance – on a semi-annual basis, we will keep a customer’s ProSupport Plus system(s) up to date by installing
the latest firmware, BIOS, and driver updates to improve performance and availability.
5. 3rd party software support – Dell is a customer’s single point of accountability for any eligible 3rd party software installed on
their ProSupport Plus system, whether they purchased the software from us or not.

72 Appendix D: Services
ProSupport for Infrastructure
Comprehensive 24x7 support for hardware and software - best for production, but not critical, workloads and applications. The
ProSupport service offers highly trained experts around the clock and around the globe to address IT needs. We help minimize
disruptions and maximize availability of PowerEdge server workloads with:
● 24x7 support through phone, chat and online
● A central point of accountability for all hardware and software issues
● Hypervisor, operating system and application support
● Dell security advisories
● Onsite response service levels 4 hour or Next Business Day options
● Proactive issue detection with automated case creation
● Predictive hardware anomaly detection
● Incident Manager assigned for Severity 1 cases
● Collaborative third-party support
● Access to AIOps Platforms - (MyService360, TechDirect, and CloudIQ)
● Consistent experience regardless of where customers are located or what language they speak.

Basic Hardware Support

Provides reactive hardware support during normal business hours, excluding local national holidays. No software support or
software related guidance. For improved levels of support choose ProSupport or ProSupport Plus.

Figure 47. ProSupport Enterprise Suite

Specialty Support Services

Optional specialty support services complement the ProSupport Infrastructure Suite to provide additional proficiencies that are
critical for modern data center operations.

Appendix D: Services 73
Hardware coverage add-ons to ProSupport
● Keep Your Hard Drive (KYHD) and Keep Your Component (KYC): Normally if a device fails under warranty, Dell replaces
it using a one-for-one exchange process. KYHD / KYC gives you the option to retain your device. It provides full control
of sensitive data and minimizes security risk by letting you retain possession of failed drives / components when receiving
replacement parts without incurring additional cost.
● Onsite Diagnosis Service: Ideal for sites with non-technical staff. Dell field technician performs initial troubleshooting
diagnosis onsite and transfers to Dell remote engineers to resolve the issue.
● ProSupport Add-on for HPC: Sold as an add-on to a ProSupport service contract, the ProSupport Add-on for HPC
provides solution-aware support to cover the additional requirements that are required to maintain an HPC environment such
as:
○ Access to senior HPC experts
○ Advanced HPC cluster assistance: performance, interoperability, and configuration
○ Enhanced HPC solution level end-to-end support
○ Remote pre-support engagement with HPC Specialists during ProDeploy implementation
● ProSupport Add-on for Telco (Respond & Restore): An add-on service designed for the top 31 TELCO customers
globally, Respond & Restore provides direct access to Dell solution experts who specialize in TELCO carrier-grade support.
This add-on also provides a hardware uptime guarantee, meaning if a system fails, Dell will have it installed and operational
within 4 hours for Severity 1 issues. Dell incurs penalties and fees if SLAs are not met.

Supplemental Site-wide Expertise

● Multivendor Support Service: Support your 3rd party devices as one service plan for servers, storage and networking
(includes coverage for: Broadcom, Cisco, Fujitsu, HPE, Hitachi, Huawei, IBM, Lenovo, NetApp, Oracle, Quanta, SuperMicro &
others).
● Technical Account Manager: Designated technology lead who monitors and manages performance and configuration of
specific technology sets.
● Designated Remote Support: Personalized support expert who manages all troubleshooting and resolution of IT assets

Services for large enterprises

● ProSupport One for Data Center: ProSupport One for Data Center offers flexible site-wide support for large and
distributed data centers with more than 1,000 assets (combined total of server, storage, networking, etc.). This offering
is built on standard ProSupport features that leverage our global scale and are tailored to specific customer needs. While
not for everyone, this service option offers a truly unique solution for our largest customers with the most complex
environments.
○ Team of assigned Services Account Managers with remote or onsite options
○ Assigned technical and field engineers who are trained on the customer’s environment and configurations
○ On-demand reporting and recommendations enabled by ProSupport AIOps tools (MyService360, TechDirect & CloudIQ)
○ Flexible onsite support and parts options that fit their operational model
○ A tailored support plan and training for their operations staff
● Logistics Online Inventory Solution (LOIS):Ideal for large organizations that have their own staff to support their
data center. Dell offers a service called Logistics Online Inventory Solution which is an onsite parts locker that provides
self-maintainers with a local inventory of common replacement components. Having access to these parts lockers allows
the self-maintainer to replace a failed component immediately without delay. Each replacement part would automatically
initiate a replenishment of the parts inventory that is shipped next day or delivered onsite by Dell during a regular scheduled
visit (called Scheduled Onsite Service). As part of the LOIS system, customers can integrate their systems directly to Dell
TechDirect using APIs to help streamline the support management process.

End-of-Life Services
● Post Standard Support (PSS): Extend service life beyond the initial seven years of ProSupport, adding up to five more
additional years of hardware coverage
● Data Sanitization & Data Destruction: Renders data unrecoverable on repurposed or retired products, ensuring security
of sensitive data and enabling compliance and provides NIST compliant certification.
● Asset Recovery Services:Recycle, resale, and disposal of hardware. Helps you securely and responsibly retire IT assets
that are no longer needed while protecting both your business and the planet.

74 Appendix D: Services
Consulting Services
Our expert consultants help customers transform faster, and quickly achieve business outcomes for the high value
workloads Dell PowerEdge systems can handle. From strategy to full-scale implementation, Dell Technologies Consulting can
help determine how to perform IT, workforce, or application transformation. We use prescriptive approaches and proven
methodologies that are combined with portfolio and partner ecosystem of Dell Technologies to help achieve real business
outcomes. We are here to help guide your next transformation that could address multi-cloud environments, business
applications, DevOps, business resiliency, data center modernization, analytics, workforce collaboration, and user experiences.

Managed Services
Some customers prefer Dell to manage the complexity and risk of daily IT operations. Dell Managed Services utilizes proactive,
artificial intelligence to improve operations and modern automation. This helps customers realize desired business outcomes
from their infrastructure investments. With these technologies, our experts run, update, and fine-tune customer environments.
You decide the service level requirements and we provide oversight of the environment. There are two types of managed
service offers. First the outsourcing model, or CAPEX model, where Dell manages customer owned assets using our people and
tools. The second is the "as-a-Service" model, or OPEX model, which we call APEX. In this service, Dell owns all technology
and all the management of it. Many customers will have a blend of the two management types depending on the goals of the
organization.

Figure 48. Dell Managed Services

● Managed Detection and Response (MDR): Dell Technologies Managed Detection and Response (MDR) is powered by
Secureworks Taegis XDR software platform. MDR is a managed service that secures the customer’s IT environment against
malicious actors and provides remediation if and when a threat is identified. When a customer purchases MDR, they will
receive the following features from our team:
○ Dell badge resources
○ Agent rollout assistance to help deploy the Secureworks Endpoint Agent.
○ 24x7 threat detection and investigation
○ Up to 40 hrs per quarter of response and active remediation activities
○ If the customer experiences a breach, we will provide up to 40 hrs per year of Cyber incident response initiation.
○ Quarterly reviews with the customer to review the data

Education Services
Build the IT skills required to influence the transformational outcomes of the business. Enable talent and empower teams with
the right skills to lead and perform transformational strategy that drives competitive advantage. Leverage the training and
certification required for real transformation.

Appendix D: Services 75
Dell Technologies Education Services offers PowerEdge server training and certifications that are designed to help customers
achieve more from their hardware investment. The curriculum delivers the information and the practical, firsthand skills that
their team must confidently install, configure, manage, and troubleshoot Dell servers.
To learn more or register for a class today, see Education.Dell.com

Resources
Services for PowerEdge.

76 Appendix D: Services