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INTERFERENCE TECHNOLOGY GUIDE SERIES | interferencetechnology.com

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TABLE OF CONTENTS
4 TECHNICAL EDITORIAL BOARD MEMBERS

7 2024 EMC SUPPLIER GUIDE

11 FEATURED ARTICLES

11 DESIGN FOR COMPLIANCE ESSENTIALS

KENNETH WYATT
Wyatt Technical Services

20 BASIC EMC CONCEPTS

KENNETH WYATT
Wyatt Technical Services

23 REFERENCE SECTION

23 Common Commercial EMC Standards

28 EMC Standards Organizations
29 Equations, Tools, & Calculators
32 LinkedIn Groups
33 Common Symbols & Acronyms
37 Recommended EMC Books, Magazines and Journals

39 INDEX OF ADVERTISERS

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TECHNICAL EDITORIAL BOARD MEMBERS
Meet the 2024 Editorial Board

GHERY PETTIT | PRESIDENT, PETTIT EMC CONSULTING LLC

Ghery S. Pettit received the BSEE degree from Washington State University in 1975. He has
worked in the areas of TEMPEST and EMC for the past 47 years. Employers were the US Navy,
Martin Marietta Denver Aerospace, Tandem Computers and Intel Corporation, prior to retiring
from industry in 2015 and becoming an independent consultant.

Mr. Pettit is presently serving as Chair of CISPR SC I and is one of CISPR’s representatives on
the Advisory Council on EMC (ACEC) within the IEC. He has been involved in CISPR activities
since 1998, both as a member of the US Technical Advisory Groups to CISPR SC G and CISPR
SC I and as an active member of CISPR SC I and its maintenance teams, CISPR SC I MT7 (CISPR 32 maintenance) and
CISPR SC I MT8 (CISPR 35 maintenance). He is also a member of the working groups preparing the next editions of
ANSI C63.4, C63.9 and C63.16.

ZACHARIAH PETERSON | PCB DESIGN EXPERT & ELECTRONICS DESIGN CONSULTANT

Zachariah Peterson received multiple degrees in physics from Southern Oregon University
and Portland State University, and he received his MBA from Adams State University. In 2011,
he began teaching at Portland State University while working towards his Ph.D. in Applied
Physics. His research work originally focused on topics in random lasers, electromagnetics in
random materials, metal oxide semiconductors, sensors, and select topics in laser physics;
he has also published over a dozen peer reviewed papers and proceedings. Following his
time in academia, he began working in the PCB industry as a designer and technical content
creator. As a designer, his experience focuses on high-speed digital systems and RF systems
for commercial and mil-aero applications. His company also produces technical content for major CAD vendors and
consults on technology strategies for these clients. In total, he has produced over 2,000 technical articles on PCB
design, manufacturing, simulation, modeling, and analysis. Most recently, he began working as CTO of Thintronics,
an innovative PCB materials startup focusing on high-speed, high-density systems.

He is a member of IEEE Photonics Society, IEEE Electronics Packaging Society, American Physical Society, and the
Printed Circuit Engineering Association (PCEA). He previously served as a voting member on the INCITS Quantum
Computing Technical Advisory Committee working on technical standards for quantum computing and quantum
electronics. He now sits on the IEEE P3186 Working Group focused on Port Interface Representing Photonic Signals
Using SPICE-class Circuit Simulators.

interferencetechnology.com | 4 | Interference Technology Guide Series

TECHNICAL EDITORIAL BOARD MEMBERS
Meet the 2024 Editorial Board

MIKE VIOLETTE | iNARTE CERTIFIED EMC ENGINEER

Mike is President of Washington Laboratories and Director of American Certification Body. He

has over 35 years of experience in the field of EMC evaluation and product approvals and has
overseen the development of engineering services companies in the US, Europe and Asia. Mike
is currently on the Board of Directors of the IEEE EMC Society.

He is a Professional Engineer, registered in the State of Virginia. He has given numerous

presentations on compliance topics and is a regular contributor to technical and trade magazines.

DAVID A. WESTON | iNARTE EMC ENGINEER

David A. Weston is an electromagnetic compatibility (EMC) consultant and certified National

Association of Radio and Telecommunications Engineers (iNARTE) EMC engineer at EMC
Consulting Inc. Merrickville, Ontario, Canada. A life member of the Institute of Electrical and
Electronics Engineers, Weston has worked in electronic design for 55 years, specializing in
the control, prediction, measurements, problem solving, analysis, and design aspects of EMC
for the last 44 years.

He is the author of the third edition of the 1,157-page book Electromagnetic Compatibility,
Methods, Analysis, Circuits, and Measurement published by CRC press in 2017, as well as numerous papers of a
practical nature.

interferencetechnology.com | 5 | Interference Technology Guide Series

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2024 EMC SUPPLIER GUIDE

Introduction
In this section, we provide a quick guide to some of the top suppliers in each EMC category–test equipment,
components, materials, services, and more. To find a product that meets your needs for applications, frequencies,
standards requirements, etc., please search these individual supplier websites for the latest information and
availability. If you have trouble finding a particular product or solution, email [email protected] for
further supplier contacts.

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2024 EMC FUNDAMENTALS GUIDE

TRAINING SEMINARS & WORKSHOPS

TEST EQUIPMENT RENTALS
TEST EQUIPMENT OTHER
SEALANTS & ADHESIVES

TESTING LABORATORIES
CABLES & CONNECTORS

SPECTRUM ANALYZERS
DESIGN / SOFTWARE

LIGHTNING & SURGE

FILTERS / FERRITE'S

SHIELDED ROOMS

TEST EQUIPMENT
EMI RECEIVERS
CERTIFICATION
CONSULTANTS
COMPONENTS
AMPLIFIERS

SHIELDING
ANTENNAS

TESTING
MEDIA
COMPANY WEBSITE

Aaronia AG www.aaronia.com X X X X
Advanced Test Equipment
www.atecorp.com X X X X X X X X X X X X
Corp. (ATEC)
AH Systems, Inc. www.ahsystems.com X X X X X X
Altair- US www.altair.com X X
A
American Certification Body Inc. https://acbcert.com/ X X X X X X
Ametek- CTS Compliance Test
www.ametek-cts.com X X X X X
Solutions
Anritsu Company www.anritsu.com X X X X X
AR RF/Microwave
www.arworld.us X X X X X X
Instrumentation
Beehive Electronics www.beehive-electronics.com X
B
Bulgin www.bulgin.com X
Captor Corporation (EMC Div.) www.captorcorp.com X
Coilcraft www.coilcraft.com X X
C
CPI- Communications & Power
www.cpii.com/emc X
Industries (USA)
Dassault System Simulia Corp www.3ds.com/ X
D Delta Electronics (Americas) Ltd. www.delta-americas.com X
DLS Electronic Systems, Inc. www.dlsemc.com X X
Electro Rent www.electrorent.com X X X X X
Elite Electronic Engineering Co. www.elitetest.com X
EMC Live www.emc.live X
EMC Partner www.emc-partner.com X
E Empower RF Systems, Inc. www.empowerrf.com X X
EM TEST USA www.emtest.com X
Exemplar Global (iNarte) www.exemplarglobal.org X
EXODUS Advanced
www.exoduscomm.com X X X X
Communications
F2 Labs www.f2labs.com X X X X X
Fair-Rite Products Corp. www.fair-rite.com X X
F Fischer Custom
www.fischercc.com X
Communications
Frankonia Solutions www.frankonia-solutions.com X X X X
Gauss Instruments www.gauss-instruments.com X X
G
Gowanda Electronics www.gowanda.com X
www.pfiffner-group.com/
Haefely AG X X X
about-pfiffner-group/haefely
H Heilind Electronics, Inc www.heilind.com X
HV TECHNOLOGIES, Inc. www.hvtechnologies.com X X X X X X X X

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2024 EMC FUNDAMENTALS GUIDE

TRAINING SEMINARS & WORKSHOPS

TEST EQUIPMENT RENTALS
TEST EQUIPMENT OTHER
SEALANTS & ADHESIVES

TESTING LABORATORIES
CABLES & CONNECTORS

SPECTRUM ANALYZERS
DESIGN / SOFTWARE

LIGHTNING & SURGE

FILTERS / FERRITE'S

SHIELDED ROOMS

TEST EQUIPMENT
EMI RECEIVERS
CERTIFICATION
CONSULTANTS
COMPONENTS
AMPLIFIERS

SHIELDING
ANTENNAS

TESTING
MEDIA
COMPANY WEBSITE

Interference Technology www.interferencetechnology.com X

Intertek www.intertek.com X
ITG Electronics www.itg-electronics.com X
Keysight Technologies www.keysight.com X X X X
www.kikusuiamerica.com/
Kikusui America, Inc. X X
K solution/
Krieger Specialty Products www.kriegerproducts.com X
Kyocera AVX www.kyocera-avx.com X X X X
Laird a DuPont Business www.laird.com X X X
L
Langer EMV-Technik www.langer-emv.de/en/index X
Magnetic Shield Corp. www.magnetic-shield.com X
Master Bond Inc. www.masterbond.com X
MBP Srl www.mbp.it/en/ X X
M
MILMEGA www.ametek-cts.com X
Montrose Compliance Services www.montrosecompliance.com X
MVG Microwave Vision Group www.mvg-world.com X X X X X
Narda Safety Test Solutions www.narda-sts.com X X X X X
N Noise Laboratory Co., Ltd. www.noiseken.com X
NTS www.nts.com X
Ohmite www.ohmite.com X
o
Ophir RF www.ophirrf.com X
Parker Chomerics www.chomerics.com X
Pearson Electronics www.pearsonelectronics.com X
Polymer Science, Inc. www.polymerscience.com X X
PPG Cuming Lehman
P www.cuminglehman.com X X X
Chambers
PPG Engineering Materials www.dexmet.com X
Prana www.prana-rd.com X
Pulse Power & Measurement https://ppmtest.com/ X
Q Quell Corporation www.eeseal.com X X X X
Radiometrics www.radiomet.com X
R&B Laboratory, Inc. www.rblaboratory.com X
Retlif Testing Laboratories www.retlif.com X X X
R
RECOM Power GmbH www.recom-power.com X X
RIGOL Technologies www.rigolna.com X X X X X
R&K Company Limited www.rk-microwave.com X X

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2024 EMC FUNDAMENTALS GUIDE

TRAINING SEMINARS & WORKSHOPS

TEST EQUIPMENT RENTALS
TEST EQUIPMENT OTHER
SEALANTS & ADHESIVES

TESTING LABORATORIES
CABLES & CONNECTORS

SPECTRUM ANALYZERS
DESIGN / SOFTWARE

LIGHTNING & SURGE

FILTERS / FERRITE'S

SHIELDED ROOMS

TEST EQUIPMENT
EMI RECEIVERS
CERTIFICATION
CONSULTANTS
COMPONENTS
AMPLIFIERS

SHIELDING
ANTENNAS

TESTING
MEDIA
COMPANY WEBSITE

Rohde & Schwarz GmbH & Co. KG www.rohde-schwarz.com/de X X X X X X X

R
Rohde & Schwarz USA, Inc. www.rohde-schwarz.com X X X X X X X
Schaffner EMC, Inc. www.schaffner.com X X X X
Schurter, Inc. www.schurter.com X X X X
Schwarzbeck Mess-Elektronik www.schwarzbeck.com X
Select Fabricators www.select-fabricators.com X X
Siglent Technologies www.siglentna.com X
S
Signal Hound www.signalhound.com X X X X
Solar Electronics www.solar-emc.com X
Spectrum Control www.spectrumcontrol.com X X X X X X
Spira Manufacturing Corp. www.spira-emi.com X
Standex Electronics www.standexelectronics.com X
TDK www.tdk.com X X X X
Tektronix www.tek.com X
Teledyne LeCroy www.teledynelecroy.com X
TESEQ Inc. www.teseq.com X
Test Equity www.testequity.com X X X X
Thurlby Thandar (AIM-TTi) www.aimtti.com X X
T
www.toyotechus.com/emc-
Toyotech (Toyo) X X X X
electromagnetic-compatibility/
TPI www.rf-consultant.com X
Transient Specialists www.transientspecialists.com X
www.trsrentelco.com/
TRSRenTelCo categories/spectrum- X X X X X X X
analyzers/emc-test-equipment
Vectawave Technology www.vectawave.com X
V
V Technical Textiles / Shieldex US www.vtechtextiles.com X
Washington Laboratories www.wll.com X X X X X X X
Windfreak Technologies www.windfreaktech.com X X
W Würth Elektronik eiSos GmbH
www.we-online.com X X X X X X X X
& Co. Kg
Wyatt Technical Services www.wyatt-tech.net X X
X XGR Technologies www.xgrtec.com X

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DESIGN FOR COMPLIANCE ESSENTIALS
Kenneth Wyatt
Wyatt Technical Services

INTRODUCTION
While unrealistic to discuss all aspects of product design in a single article, I’ll try to describe the most common design
issues I find in the hundreds of client products I’ve had a chance to work on. These issues generally include PC board
design, cables, shielding, and filtering. More detailed information may be found in the reference section at the end of
this article.

The top three product failures I run into include (1) radiated emissions, (2) radiated susceptibility, and (3) electrostatic
discharge. Other failures can include things like conducted emissions, electrically fast transient, conducted suscepti-
bility, and electrical surge. Most of these last items are also the result of the same poor product designs, which cause
the top three failures.

NOTE: I prefer to avoid the word “ground” in this article or in my consulting practice. The reason is that there are too
many misinterpretations, which can also lead to EMC failures. It’s much clearer to use power and power return, and
signal and signal return – or just “return plane” or reference plane. Finally, cable shields or shielded enclosures are
“bonded” together – not “grounded”. The only exception is the so called “safety ground” or earth ground. But these
have nothing at all to do with proper EMC design – just personal safety against electrical shock. I suppose the one
exception would be the earth ground connection on a three-wire power line filter. Also, occasionally, there will be an
earth ground on a PC board, especially for power supplies. However, connecting a product or system to earth ground
will not improve EMI due to the very high inductance (length) of the wire.

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2024 EMC FUNDAMENTALS GUIDE

PC BOARD DESIGN cases, the path is broken. Breaks or gaps in the return
The single most important factor in achieving EMC/EMI path are major causes of radiated emissions, radiated
compliance involves the printed circuit board design. It’s susceptibility, and ESD failures.
important to note that not all information sources (books,
magazine articles, or manufacturer’s application notes) Correspondingly, electric fields on PC boards exist be-
are correct when it comes to designing PC boards for tween two pieces of metal, such as a microstrip, over a
EMC compliance – especially sources older than ten return plane (or trace). If the return path is broken, the
years, or so. In addition, many “rules of thumb” are based electric field will “latch on” to the next closest metal and
on specific designs, which may not apply to future or will not likely be the return path you want. When the re-
leveraged designs. Some rules of thumb were just plain turn path is undefined, then the electromagnetic field will
lucky to have worked. “leak” throughout the dielectric space and cause com-
mon mode currents to flow all over the board, as well
PC boards must be designed from a physics point of view as cause cross-coupling of clocks or other high speed
and the most important consideration is that high fre- signals to dozens of other circuit traces and vias within
quency signals, clocks, and power distribution networks that same dielectric.
(PDNs) must be designed as transmission lines. This
means that the signal or energy transferred is propagated Figure 1 shows a propagating wave within the dielec-
as an electromagnetic wave. PDNs are a special case, tric space between the signal trace and return plane (or
as they must carry both DC current and be able to supply trace). This shows both the conduction current flowing in
energy for switching transients with minimal simultane- the signal trace and back on the return plane (or trace)
ous switching noise (SSN). The characteristic impedance and the displacement current “through” the dielectric.
of PDNs is designed with very low impedance (0.1 to 1.0
Ohms, typically). Signal traces, on the other hand, are The signal wave front travels at some fraction of the
usually designed with a characteristic impedance of 50 speed of light as determined by the dielectric constant. In
to 100 Ohms. air, signals travel at about 12 inches per nanosecond. In
the typical FR4 dielectric, the speed is about half that at
The previous article introduced the concept of the cir- 6 inches per nanosecond. Refer to Reference 1, 2, and 3
cuit theory and field theory viewpoints. A successful PC for more information on the physics of signal propagation
board design accounts for both viewpoints. Circuit theory through PC boards.
suggests that current flows in loops from source to load
and back to the source. In many cases of product failure, In order to satisfy both the circuit and field theory view-
the return path has not been well defined and, in some points, we now see the importance of adjacent power

Figure 1: Cross section of a propagating wave guided by a microstrip and reference plane.

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2024 EMC FUNDAMENTALS GUIDE

and power return planes, as well as adjacent signal and If the two planes are differing potentials (for example, pow-
signal return planes. PDN design also requires both bulk er and return), then stitching capacitors must be placed
and decoupling “energy storage” capacitors. adjacent to the signal via. Lack of a defined return path will
cause the electromagnetic wave to propagate throughout
The bulk capacitors 4.7 to 10 μF, typ.) are usually placed the dielectric, causing cross coupling to other signal vias
near the power input connector and the decoupling ca- and leakage and radiation out the board edges as shown.
pacitors (1 to 10 nF, typ) nearest the noisiest switch-
ing devices – and, most importantly, with minimal trace
length connecting these from the power pins to signal
return plane. Ideally, all decoupling capacitors should be
mounted right over (or close to) the connecting vias and
multiple vias should be used for each capacitor to reduce
series inductance.

Signal or power routed referenced to a single plane will

always have a defined return path back to the source. Figure 3: A signal trace passing through two reference planes. If the reference planes are
Figure 2 shows how the electromagnetic field stays with- the same potential (signal or power returns, for example), then stitching vias next to the
in the dielectric on both sides of the return plane. The signal via should be sufficient. However, if the planes are different potentials (power and
dielectric is not shown for clarity. return, for example), then stitching capacitors must be installed very close to the signal
via. Lack of a defined return path will cause the electromagnetic field to leak through the
dielectric, as shown, and couple into other signal vias or radiate out board edges.

For example, let’s take a look at a poor (but very typical)

board stack-up that I often see. See Figure 4.
Figure 2: A signal trace passing through a single reference plane.
Notice the power and power return planes are three
layers apart. Any PDN transients will tend to cross
On the other hand, referring to Figure 3, if a signal pass- couple to the two signal layers in between. Similarly,
es through two reference planes, things get a lot trickier. few of the signal layers have an adjacent return plane.
If the two planes are the same potential (e.g., both are re- Therefore, the propagating wave return path will jump
turn planes), then simple connecting vias may be added all over to whatever is the closest metal on the way
adjacent to the signal via. These will form a nice, defined back to the source. Again, this will tend to couple clock
return path back to the source. noise throughout the board.

Figure 4: A six-layer board stack-up with very poor EMI performance.

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2024 EMC FUNDAMENTALS GUIDE

Figure 5: A six-layer board stack-up with good EMI performance. Each signal layer has an adjacent return plane and the power and power return planes are adjacent.

A better design is shown in Figure 5. Here, we lose two impedance) path back to the source. The electromagnet-
signal layers, but we see the power and power return ic field is forced out and the field will “leak” throughout the
planes are adjacent, while each signal layer and routed board. I have an article and good demonstration video of
power has an adjacent signal (or power) return plane. It’s this and how it affects common mode currents and, ulti-
also a good idea to run multiple connecting vias between mately, EMI. See Figure 6 and Reference 4.
the two return planes in order to guarantee the lowest im-
pedance path back to the source. The EMI performance
will be significantly improved using this or similar designs.
In many cases, simply rearranging the stack-up is enough
to pass emissions.

Note that when running signals between the top and bot-
tom layers, you’ll need to include “stitching” vias between
the return planes and stitching capacitors between the
power and power return planes right at the point of signal
penetration in order to minimize the return path. Ideally,
these stitching vias should be located within 1 to 2 mm of
Figure 6: A demonstration test board with transmission lines terminated in 50 Ohms.
each signal via.
One transmission line has a gap in the return plane and the other doesn’t. A 2 ns pulse
generator is connected to one of the two BNC connectors in turn and the harmonic currents
Other Tips - Other design tips include placement of all
in a wire clipped to the return plane are measured with a current probe
power and I/O connectors along one edge of the board.
This tends to reduce the high frequency voltage drop
between connectors, thus minimizing cable radiation. The difference between the gapped and un-gapped trac-
Also, segregation of digital, analog, and RF circuits is es is shown in Figure 7. Note the harmonic currents are
a good idea, because this minimizes cross coupling be- 10 to 15 dB higher for the gapped trace (in red). Failing
tween noisy and sensitive circuitry. to pay attention to the signal and power return paths is a
major cause of radiated emissions failures.
Of course, high-speed clocks, or similar high-speed sig-
nals, should be run in as short and as direct a path as SHIELDING
possible. These fast signals should not be run long board The two issues with shielded enclosures are getting all
edges or pass near connectors. pieces well-bonded to each other and to allow power
or I/O cable to penetrate it without causing leakage of
Gaps in Return Plane - I’d like to come back to the gap common mode currents. Bonding between sheet metal
or slot in the return plane mentioned earlier and show may require EMI gaskets or other bonding techniques.
an example of why it’s bad news for EMI. When the re- Slots or apertures in shielded enclosures become is-
turn path is interrupted, the conduction current is forced sues when the longest dimension approaches a half
around the slot, or otherwise finds the nearest (lowest wavelength.

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2024 EMC FUNDAMENTALS GUIDE

Figure 7: The resulting common mode currents on an attached wire as measured with a current probe. The trace in aqua is the un-gapped return path and the trace in red, the gapped
return path. The difference is 10 to 15 dB higher for the gapped return path. These harmonic currents will tend to radiate and will likely cause radiated emissions failures.

Figure 8 shows a handy chart for determining the 20-dB Figure 9 is a chart of wavelength versus frequency. For
attenuation of a given slot length. For example, if a prod- example, a 6-inch (15 cm) slot has a half-wave reso-
uct design requires at least a 20-dB shielding effective- nance at 1000 MHz.
ness, then the longest slot length at 1000 MHz can be
just one-half inch. See References 5 and 6 for more de-
tail on shielding. Interference Technology also has a free
downloadable 2016 EMI Shielding Guide with excellent
information (Reference 7).

Figure 9: A handy chart for determining resonant frequency versus cable or slot length in
free space. Half-wavelength slots simulate dipole antennas and are particularly trouble-
some. Figure courtesy of Patrick André.

Cable Penetration - The number one issue I find when

tracking down a radiated emissions problem is cable ra-
diation. The reason cables radiate is that they penetrate
a shielded enclosure without some sort of treatment –
Figure 8: A chart of attenuation versus slot length. Figure courtesy of Henry Ott either bonding the cable shield to the metal enclosure

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2024 EMC FUNDAMENTALS GUIDE

Figure 10: Penetrating the shield with a cable defeats the shield. This example shows how external energy sources can induce noise currents in I/O cables, which can potentially disrupt
internal circuitry. The reverse is also true, where internal noise currents can flow out the cable and cause emissions failures. Figure courtesy of Henry Ott.

Figure 11: Result of a penetrating cable through a shielded enclosure, because of un-bonded I/O connectors to the shielded enclosure.

or common mode filtering at the I/O or power connector point of penetration or at the I/O connector of the PC
(Figure 10 and 11). This occurs frequently, because most board. Figure 11 shows the usual result when connectors
connectors are attached directly to the circuit board and simply poke through a shielded enclosure.
are then poked through holes in the shield. Once the ca-
ble is plugged in, it is “penetrating the shield” and EMI is Cable Shield Terminations - Another potential issue is
the usual result. if the I/O cable uses a “pigtail” connection to the con-
nector shell. Ideally, cable shields should be terminat-
There are four combinations or cases that must be con- ed in a 360-degree bond for lowest impedance. Pigtails
sidered: shielded or unshielded products, and shielded or degrade the cable shield effectiveness by introducing a
unshielded cables. Power cables are usually unshielded relatively high impedance. For example, a 1-inch pigtail
for consumer/commercial products and so require power connection has 12 Ohms impedance at 100 MHz and
line filtering at the point of penetration or at the connector gets worse the higher you go in frequency. This is espe-
of the circuit board. Shielded cables must have the shield cially problematic for HDMI cables, because the HDMI
bonded (ideally in a 360-degree connection) to the prod- working group (http://www.hdmi.org) originally failed to
uct’s shielded enclosure. If the product does not have a specify the method for terminating the cable shield to
shielded enclosure, then filtering must be added at the the connector.

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2024 EMC FUNDAMENTALS GUIDE

FILTERING Power supply input filters are generally designed to sup-

I won’t go into very much detail here, because Interfer- press both differential and common mode currents. A typ-
ence Technology has an excellent EMI Filter Guide free ical topology is shown in Figure 13. The “X” capacitor in
for the downloading (see Reference 8). Suffice to say, combination with the differential inductance is designed
filters, as well as transient protection, are important at to filter differential mode, while the CM choke and “Y” ca-
power and I/O connectors. Typically, these will be com- pacitors are designed to filter common mode. The resis-
mon mode topologies, as shown in Figure 12. Most sig- tor shown is usually 100 kΩ and the purpose is merely to
nal-level common mode chokes may be obtained in sur- quickly bleed off the line voltage stored on the capacitors
face mount packaging. Power chokes are much larger to to a safe level when unplugged from the line outlet
handle the current and may be obtained as either surface
mount or through-hole mount, depending on the current For general purpose filtering of signals, the handy chart of
rating. Many Ethernet connectors have built-in common possible filter topologies may be found in Reference 9 and
mode filtering. is reproduced here in Figure 14. The appropriate topology

Figure 12: A typical common mode filter used for I/O filtering. The two windings are wound in opposite directions and so tend to cancel the common mode currents. Figure courtesy
of Clayton Paul.

Figure 13: A general purpose filter typically used for power supply input filtering.

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2024 EMC FUNDAMENTALS GUIDE

depends on the source and load impedances. If these im- associated impedance versus frequency characteristic,
pedances are not known, then either the “PI” or “T” topolo- often peaking around 100 to 300 MHz. Some materi-
gy may be used (#3 or #5 on the chart, respectively). als are designed to peak below 100 MHz for lower fre-
quency applications. Maximum impedances can range
Ferrite or inductive components should not be used in se- from 25 to 1000 Ohms, depending on the ferrite material
ries with the power pins of ICs, as this will only reduce the used and style of choke. An example of various ferrite
ability of the local decoupling capacitors to supply required materials and associated impedance curves are shown
energy during simultaneous switching of the IC output in Figure 15.
stages with the resulting higher power supply noise.
Sometimes, clipping a ferrite choke onto a cable has no
effect. This is usually due to the fact the choke has the
same, or lower, effective impedance than the cable itself.
The attenuation of a ferrite choke is easily calculated.

Attenuation (dB) = 20 * log((Zin + Zferrite + Zload) / (Zin

+ Zload))

For example, if we add a 100 Ohm ferrite choke to a pow-

er supply cable with system impedance of 10 Ohms, the
attenuation would be:

Attenuation = 20 * log((10 + 100 + 10) / (10 + 10)) = 15.5 dB

Refer to Reference 9 for much additional detail on ferrite

chokes and general filter design.

TRANSIENT PROTECTION
In order to protect internal circuitry from electrical tran-
sients, such as ESD, electrically fast transient (EFT), or
power line surge, due to lightning, transient protective
devices should be installed at all power and I/O ports.
Figure 14: Five common filter topologies, depending on the source and load impedances. These devices sense the transient and “clamp” the tran-
Figure courtesy of Würth Electronik. sient pulse to a specified clamp voltage.

Transient protectors in signal lines must generally have a

very low parallel capacitance (0.2 to 2 pF, typical) to the
return plane, depending on the data rate in order to main-
tain signal integrity. These silicon-based devices may be
purchased in very small surface mount packaging.

Power line surge protection usually requires much larger

transient protection devices and they can come in a va-
riety of types. Gas discharge or metal oxide varistors are
the most common, but larger silicon-based devices are
also available. More information on the design of surge
protection may be found in Reference 6.

SUMMARY
Figure 15: Impedance versus frequency for various types of ferrite materials. Figure, Most EMC/EMI failures are due to poor shielding, pene-
courtesy Fair-Rite Corp. tration of cables through shields, poor cable shield termi-
nation, poor filtering, and above all, poor PC board layout
Ferrite Chokes - One common filter element usually and stack-up. Paying attention to these common design
added to I/O cables is the ferrite choke. Ferrite chokes faults will pay off with a lower risk of compliance failures
come in either the clamp-on types or solid cores meant and result in lower project costs and schedule slippage.
to be assembled along with the cable assembly. Often,
these are used as a last resort to reduce cable emis-
sions or susceptibility. Most ferrite chokes have an

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2024 EMC FUNDAMENTALS GUIDE

REFERENCES
1. Bogatin, Signal and Power Integrity - Simplified (3rd Edition), Prentice-Hall, 2018.
2. Morrison, Grounding and Shielding - Circuits and Interference, Wiley, 2016.
3. Morrison, Fast Circuit Boards - Energy Management, Wiley, 2018.
4. Wyatt, Gaps in Return Planes - Bad News for EMI (with video demo), https://interferencetechnology.com/gaps-return-
planes-bad-news-emi/
5. Ott, Electromagnetic Compatibility Engineering, Wiley, 2010.
6. André and Wyatt, EMI Troubleshooting Cookbook for Product Designers, SciTech, 2014.
7. ITEM, 2016 EMI Shielding Guide, https://interferencetechnology.com/wp-content/uploads/2016/10/2016-IT-EMI-
Shielding-Guide.pdf
8. ITEM, 2017 EMC Filters Guide, https://interferencetechnology.com/wp-content/uploads/2017/05/2017-IT_EMC_Fil-
ters_Guide_Low-Res.pdf
9. Würth Electronik, Trilogy of Magnetics (5th Edition), 2018.

interferencetechnology.com | 19 | Interference Technology Guide Series

BASIC EMC CONCEPTS

Kenneth Wyatt
Wyatt Technical Services

Understanding EMC is all about two important con- line (circuit trace over return plane, for example), and the
cepts: (1) digital signals are propagated in circuit trac- wave front induces a conduction current in the copper
es as electromagnetic waves traveling in the dielectric trace and back along the return plane. Of course, this
space between the circuit trace and adjacent return conduction current cannot flow through the PC board di-
plane and (2) the induced currents flow in a loop back electric, but the charge at the wave front repels a like
to the source. charge on the return plane, which “appears” as if current
is flowing. This is the same principle for capacitors and
HOW DIGITAL SIGNALS MOVE Maxwell called this effect “displacement current”.
At frequencies greater than about 100 kHz, digital signals
start to propagate as electromagnetic waves in trans- The signal’s wave front travels at some fraction of the
mission lines formed by the circuit trace or stripline and speed of light, as determined by the dielectric constant
the nearest solid return plane. As shown in Figure 1, a of the material (about half light speed, or 6 inches/ns in
high frequency signal propagates along a transmission FR4), while the conduction current is comprised of a high

Figure 1: A digital signal propagating along a microstrip with currents shown. Propagation is left-to-right.

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2024 EMC FUNDAMENTALS GUIDE

density of free electrons moving at the “drift” velocity (<<1 in the next article. More on PDN design may be found in
mm/second). The actual physical mechanism of near References 5, 6, and 7.
light speed propagation is due to a “kink” in the E-field,
which propagates within the dielectric and guided by the CURRENTS FLOW IN LOOPS
molecules of copper. Refer to References 1 through 4 for The problem we circuit designers miss is defining the re-
further details. turn path back to the source. We’re very careful to show
all the interconnects on the schematic and as traces on
The important thing is that this combination of conduction the PC board layout, but If you think about it, we don’t
and displacement current must have an uninterrupted draw the return paths on the schematic diagram – we just
path back to the source. If it is interrupted in any way, the show this as a series of various “ground” symbols.
propagating electromagnetic wave will “leak” all around
inside the PC board layers and cause “common mode” Where we really get in trouble is if there are more than
currents to form, which then couple to other signals one ground symbol on the schematic. In the case where
(cross-coupling) or to “antenna-like structures”, such as we need isolated ground returns, great care must be tak-
I/O cables or slots/apertures in shielded enclosures and en to ensure the signal return paths are uninterrupted
cause radiated emissions. and that large signals don’t use the same return plane
(dielectric space) as low-level signals.
Most of us were taught the “circuit theory” point of view
and it is important when we visualize how return currents So, what is “high frequency”? Basically, anything higher
want to flow back to the source. However, we also need than 100 kHz. For frequencies less than this, the return
to consider the fact that the energy of the signal is not current will spread out and tend to follow the shortest
only the current flow, but an electromagnetic wave front path back to the source (path of least resistance). For
moving through the dielectric, or a “field theory” point of frequencies above this, the return current tends to fol-
view. Keeping these two concepts in mind just reinforc- low directly under the signal trace and back to the source
es the importance of designing transmission lines (signal (path of least impedance).
trace with return path directly adjacent), rather than just
simple circuit trace routing. The circuit trace can also be Where some board designs go wrong is when high dV/
defined as a “waveguide”. dt return signals, such as large voltage swings from DC-
DC switch mode converters, or high current di/dt return
It is very important to note that all power distribution net- signals get comingled with I/O circuit return currents or
works (PDNs) and high frequency signal traces are really sensitive analog return currents. We’ll dive deeper into
transmission lines and the energy is transferred as elec- PC board design in the next article. Just be aware of the
tromagnetic waves. We’ll show what happens when the importance of designing defined signal and power con-
return path or return plane is interrupted by a gap or slot version return paths. That’s why the use of solid return

Figure 2: An example of differential and common mode currents.

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2024 EMC FUNDAMENTALS GUIDE

planes under high frequency signals and then segregat- Besides SSN, common mode currents can also be cre-
ing (or partitioning) digital, power, and analog circuitry on ated by gaps in return planes, poorly terminated cable
your board is so important. shields, or unbalanced transmission line geometry. The
problem is that these harmonic currents tend to escape
DIFFERENTIAL MODE VERSUS out along the outside of shielded I/O or power cables con-
COMMON MODE CURRENTS nected to the board and radiate. These currents can be
Referring to Figure 2, the differential mode current (in very small and It takes just 3 to 5 μA of current to fail the
blue) is the digital signal itself (in this case, shown in a FCC class B radiated emission test limit.
ribbon cable). As described above, the conduction cur-
rent and associated return current flow simultaneously as SUMMARY
the signal wave front moves along the transmission line To summarize product design for EMI compliance, a prop-
formed by the microstrip and return plane. erly designed PC board with adjacent return planes to
all signals and PDNs, properly bonded I/O cable shields,
The common mode current (in red) is a little more com- well bonded shielded enclosures with minimal slots or
plex in that it may be generated in a number of ways. In gaps, and common mode filtering on all I/O and power
the figure, the impedance of the return plane results in cables for unshielded products is generally required for
small voltage drops due to multiple simultaneous switch- best EMI performance. Paying attention to these factors
ing noise (SSN) by the ICs (ground bounce). These volt- early in the design greatly reduces the risk of EMC and
age drops induce common noise currents to flow all over EMI compliance failures. These design details will be
the return (or reference) plane and hence, couple into the covered in the next article.
various signal traces.

REFERENCES
1. Bogatin, Signal and Power Integrity - Simplified (3rd Edition), Prentice-Hall, 2018.
2. Morrison, Grounding and Shielding - Circuits and Interference, Wiley, 2016.
3. Morrison, Fast Circuit Boards - Energy Management, Wiley, 2018.
4. Drift velocity (wikipedia), https://en.wikipedia.org/wiki/Drift_velocity
5. Smith and Bogatin, Principles of Power Integrity for PDN Design, Prentice-Hall, 2017.
6. Sandler, Power Integrity - Measuring, Optimizing, and Troubleshooting Power Related Parameters in Electronic Sys-
tems, McGraw Hill, 2014.
7. Novak and Miller, Frequency-Domain Characterization of Power Distribution Networks, Artech House, 2007.

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2024 EMC FUNDAMENTALS GUIDE

COMMON COMMERCIAL EMC STANDARDS

REFERENCE SECTION
►COMMERCIAL STANDARDS
The following are some of the most common commercial EMC standards. Most standards have a fee associated and
most on the list are linked back to the source where they’re available. If you’re purchasing the printed version of this
guide, then refer to the Standards Organizations in the References section for standards purchase information. Note
that many Euro Norm (EN) versions of IEC standards may be purchased at a considerable discount from the Estonian
Centre for Standardization, https://www.evs.ee.

FCC
https://www.ecfr.gov

Electronic Code of Federal Regulations (e-CFR)

CFR 47 - Part 15 (Radio Frequency Devices)

ANSI
http://webstore.ansi.org

Document Number Title

Methods of Measurement of Radio-Noise Emissions from Low-Voltage Electrical and
C63.4
Electronic Equipment in the Range of 9 kHz to 40 GHz

IEC
https://webstore.iec.ch

Document Number Title

Electromagnetic compatibility (EMC) - Part 3-2: Limits - Limits for harmonic current
IEC 61000-3-2
emissions (equipment input current ≤ 16 A per phase)

Electromagnetic compatibility (EMC) - Part 3-3: Limits - Limitation of voltage changes,

IEC 61000-3-3 voltage fluctuations and flicker in public low-voltage supply systems, for equipment with
rated current ≤ 16 A per phase and not subject to conditional connection

Electromagnetic compatibility (EMC) - Part 4-2: Testing and measurement techniques -

IEC 61000-4-2
Electrostatic discharge immunity test

Electromagnetic compatibility (EMC) - Part 4-3 : Testing and measurement techniques -

IEC 61000-4-3
Radiated, radio-frequency, electromagnetic field immunity test

Electromagnetic compatibility (EMC) - Part 4-4 : Testing and measurement techniques -

IEC 61000-4-4
Electrical fast transient/burst immunity test

Electromagnetic compatibility (EMC) - Part 4-5: Testing and measurement techniques -

IEC 61000-4-5
Surge immunity test
Electromagnetic compatibility (EMC) - Part 4-6: Testing and measurement techniques -
IEC 61000-4-6
Immunity to conducted disturbances, induced by radio-frequency fields

Electromagnetic compatibility (EMC) - Part 4-7: Testing and measurement techniques -

IEC 61000-4-7 General guide on harmonics and interharmonics measurements and instrumentation, for
power supply systems and equipment connected thereto

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Electromagnetic compatibility (EMC) - Part 4-8: Testing and measurement techniques -

IEC 61000-4-8
Power frequency magnetic field immunity test

REFERENCE SECTION
Electromagnetic compatibility (EMC) - Part 4-9: Testing and measurement techniques -
IEC 61000-4-9
Impulse magnetic field immunity test

Electromagnetic compatibility (EMC) - Part 4-10: Testing and measurement techniques -

IEC 61000-4-10
Damped oscillatory magnetic field immunity test

Electromagnetic compatibility (EMC) - Part 4-11: Testing and measurement techniques -

IEC 61000-4-11
Voltage dips, short interruptions and voltage variations immunity tests

Electromagnetic compatibility (EMC) - Part 4-12: Testing and measurement techniques -

IEC 61000-4-12
Ring wave immunity test

Electromagnetic compatibility (EMC) - Part 6-1: Generic standards - Immunity standard

IEC 61000-6-1
for residential, commercial and light-industrial environments

Electromagnetic compatibility (EMC) - Part 6-2: Generic standards - Immunity standard

IEC 61000-6-2
for industrial environments

Electromagnetic compatibility (EMC) - Part 6-3: Generic standards - Emission standard

IEC 61000-6-3
for residential, commercial and light-industrial environments

Electromagnetic compatibility (EMC) - Part 6-4: Generic standards - Emission standard

IEC 61000-6-4
for industrial environments

Electromagnetic compatibility (EMC) - Part 6-5: Generic standards - Immunity for power
IEC 61000-6-5
station and substation environments

Electromagnetic compatibility (EMC) - Part 6-7: Generic standards - Immunity requirements

IEC 61000-6-7 for equipment intended to perform functions in a safety-related system (functional safety) in
industrial locations

Electrical equipment for measurement, control and laboratory use – EMC requirements –
IEC 61326-1
Part 1: General requirements

Electrical equipment for measurement, control and laboratory use - EMC requirements
- Part 2-1: Particular requirements - Test configurations, operational conditions and
IEC 61326-2-1
performance criteria for sensitive test and measurement equipment for EMC unprotected
applications

Electrical equipment for measurement, control and laboratory use - EMC requirements
- Part 2-2: Particular requirements - Test configurations, operational conditions and
IEC 61326-2-2
performance criteria for portable test, measuring and monitoring equipment used in low-
voltage distribution systems

Electrical equipment for measurement, control and laboratory use - EMC requirements
IEC 61326-2-3 - Part 2-3: Particular requirements - Test configuration, operational conditions and
performance criteria for transducers with integrated or remote signal conditioning

Electrical equipment for measurement, control and laboratory use - EMC requirements
- Part 2-4: Particular requirements - Test configurations, operational conditions and
IEC 61326-2-4
performance criteria for insulation monitoring devices according to IEC 61557-8 and for
equipment for insulation fault location according to IEC 61557-9

Electrical equipment for measurement, control and laboratory use - EMC requirements
IEC 61326-2-5 - Part 2-5: Particular requirements - Test configurations, operational conditions and
performance criteria for field devices with field bus interfaces according to IEC 61784-1

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Electrical equipment for measurement, control and laboratory use - EMC requirements -
IEC 61326-2-6
Part 2-6: Particular requirements - In vitro diagnostic (IVD) medical equipment
Electrical equipment for measurement, control and laboratory use - EMC requirements -

REFERENCE SECTION
IEC 61326-3-1 Part 3-1: Immunity requirements for safety-related systems and for equipment intended
to perform safety-related functions (functional safety) - General industrial applications
Electrical equipment for measurement, control and laboratory use - EMC requirements -
Part 3-2: Immunity requirements for safety-related systems and for equipment intended
IEC 61326-3-2
to perform safety-related functions (functional safety) - Industrial applications with
specified electromagnetic environment
Electrostatics - Part 3-1: Methods for simulation of electrostatic effects - Human body
IEC 61340-3-1
model (HBM) electrostatic discharge test waveforms

CISPR
https://webstore.iec.ch

Document Number Title

Industrial, scientific and medical (ISM) radio-frequency equipment - Electromagnetic
CISPR 11
disturbance characteristics - Limits and methods of measurement
Vehicles, boats and internal combustion engines - Radio disturbance characteristics -
CISPR 12
Limits and methods of measurement for the protection of off-board receivers
Sound and television broadcast receivers and associated equipment - Radio disturbance
CISPR 13
characteristics - Limits and methods of measurement
Electromagnetic compatibility - Requirements for household appliances, electric tools
CISPR 14-1
and similar apparatus - Part 1: Emission
Electromagnetic compatibility - Requirements for household appliances, electric tools
CISPR 14-2
and similar apparatus - Part 2: Immunity - Product family standard
Limits and methods of measurement of radio disturbance characteristics of electrical
CISPR 15
lighting and similar equipment
Specification for radio disturbance and immunity measuring apparatus and methods -
CISPR 16-1-1
Part 1-1: Radio disturbance and immunity measuring apparatus - Measuring apparatus
Specification for radio disturbance and immunity measuring apparatus and methods -
CISPR 16-1-2 Part 1-2: Radio disturbance and immunity measuring apparatus - Coupling devices for
conducted disturbance measurements
Specification for radio disturbance and immunity measuring apparatus and methods -
CISPR 16-1-3 Part 1-3: Radio disturbance and immunity measuring apparatus - Ancillary equipment -
Disturbance power
Specification for radio disturbance and immunity measuring apparatus and methods -
CISPR 16-1-4 Part 1-4: Radio disturbance and immunity measuring apparatus - Antennas and test sites
for radiated disturbance measurements

Specification for radio disturbance and immunity measuring apparatus and methods -
CISPR 16-1-5 Part 1-5: Radio disturbance and immunity measuring apparatus - Antenna calibration
sites and reference test sites for 5 MHz to 18 GHz
Specification for radio disturbance and immunity measuring apparatus and methods
CISPR 16-1-6 - Part 1-6: Radio disturbance and immunity measuring apparatus - EMC antenna
calibration
Specification for radio disturbance and immunity measuring apparatus and methods
CISPR 16-2-1 - Part 2-1: Methods of measurement of disturbances and immunity - Conducted
disturbance measurements

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Specification for radio disturbance and immunity measuring apparatus and methods
CISPR 16-2-2 - Part 2-2: Methods of measurement of disturbances and immunity - Measurement of
disturbance power

REFERENCE SECTION
Specification for radio disturbance and immunity measuring apparatus and methods -
CISPR 16-2-3 Part 2-3: Methods of measurement of disturbances and immunity - Radiated disturbance
measurements
Specification for radio disturbance and immunity measuring apparatus and methods
CISPR 16-2-4 - Part 2-4: Methods of measurement of disturbances and immunity - Immunity
measurements
Specification for radio disturbance and immunity measuring apparatus and methods -
CISPR TR 16-2-5 Part 2-5: In situ measurements for disturbing emissions produced by physically large
equipment
Specification for radio disturbance and immunity measuring apparatus and methods -
CISPR TR 16-3
Part 3: CISPR technical reports
Specification for radio disturbance and immunity measuring apparatus and methods - Part
CISPR TR 16-4-1
4-1: Uncertainties, statistics and limit modelling - Uncertainties in standardized EMC tests
Specification for radio disturbance and immunity measuring apparatus and methods
CISPR 16-4-2 - Part 4-2: Uncertainties, statistics and limit modelling - Measurement instrumentation
uncertainty

Specification for radio disturbance and immunity measuring apparatus and methods -
CISPR TR 16-4-3 Part 4-3: Uncertainties, statistics and limit modelling - Statistical considerations in the
determination of EMC compliance of mass-produced products

Specification for radio disturbance and immunity measuring apparatus and methods
CISPR TR 16-4-4 - Part 4-4: Uncertainties, statistics and limit modelling - Statistics of complaints and a
model for the calculation of limits for the protection of radio services
Specification for radio disturbance and immunity measuring apparatus and methods
CISPR TR 16-4-5 - Part 4-5: Uncertainties, statistics and limit modelling - Conditions for the use of
alternative test methods
CISPR 17 Methods of measurement of the suppression characteristics of passive EMC filtering devices
Radio interference characteristics of overhead power lines and high-voltage equipment -
CISPR TR 18-1
Part 1: Description of phenomena
Radio interference characteristics of overhead power lines and high-voltage equipment -
CISPR TR 18-2
Part 2: Methods of measurement and procedure for determining limits
Radio interference characteristics of overhead power lines and high-voltage equipment -
CISPR TR 18-3
Part 3: Code of practice for minimizing the generation of radio noise

Sound and television broadcast receivers and associated equipment - Immunity

CISPR 20
characteristics - Limits and methods of measurement
Information technology equipment - Radio disturbance characteristics - Limits and
CISPR 22
methods of measurement (Withdrawn and replaced by CISPR 32:2015)
Information technology equipment - Immunity characteristics - Limits and methods of
CISPR 24
measurement (Withdrawn and replaced by CISPR 35:2016)
Vehicles, boats and internal combustion engines - Radio disturbance characteristics -
CISPR 25
Limits and methods of measurement for the protection of on-board receivers

CISPR 32 Electromagnetic compatibility of multimedia equipment – Emission requirements

CISPR 35 Electromagnetic compatibility of multimedia equipment - Immunity requirements

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OTHER RELEVANT STANDARDS

https://webstore.iec.ch

REFERENCE SECTION
Document Number Title

IEC 60601-1 General requirements for basic safety and essential performance

IEC TR 60601-4-2 Electromagnetic immunity performance

IEC TR 60601-4-3 Considerations of unaddressed safety aspects in the third edition of IEC 60601-1

IEC TR 62354 General testing procedures for medical electrical equipment

ISO 14708-1 Active implantable medical devices

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EMC STANDARDS ORGANIZATIONS

REFERENCE SECTION
American National Standards Institute Gosstandart (Russia)
www.ansi.org https://gosstandart.gov.by/en/

ANSI Accredited C63 IEC

www.c63.org https://www.iec.ch/homepage

Asia Pacific Laboratory Accreditation Cooperation IEEE Standards Association

(APLAC) https://standards.ieee.org/
https://www.apac-accreditation.org/
IEEE EMC Society Standards Development
BSMI (Taiwan) Committee (SDCOM)
http://www.bsmi.gov.tw/wSite/mp?mp=95 https://standards.ieee.org/develop/index.html

Canadian Standards Association (CSA) Industry Canada (Certifications and Standards)

www.csa.ca http://www.ic.gc.ca/eic/site/smt-gst.nsf/eng/h_sf06165.
html
CISPR
http://www.iec.ch/dyn/www/f?p=103:7:0::::FSP_ORG_ ISO (International Organization for Standards)
ID,FSP_LANG_ID:1298,25 http://www.iso.org/iso/home.html

CNCA (China) RTCA

https://carbonneutralcities.org/ https://www.rtca.org

Electromagnetic Compatibility Industry Association UK SAE EMC Standards Committee

http://www.emcia.org www.sae.org

FDA Center for Devices & Radiological Health (CDRH) SAE EMC Standards
https://www.fda.gov/MedicalDevices/default.htm http://www.sae.org/servlets/works/committeeHome.
do?comtID=TEVEES17
Federal Communications Commission (FCC)
www.fcc.gov VCCI (Japan, Voluntary Control Council for Interference)
http://www.vcci.jp/vcci_e/
Federal Standards
https://quicksearch.dla.mil/qsSearch.aspx

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EQUATIONS, TOOLS, & CALCULATORS

REFERENCE SECTION
COMMON EMC-RELATED EQUATIONS

OHMS LAW VSWR AND RETURN LOSS

VSWR given forward/reverse power

VSWR given reflection coefficient (ρ)

Reflection coefficient (ρ), given Z1,Z2 Ohms

Reflection coefficient (ρ), given fwd/rev power

Ohms Law “formula wheel” for calculating resistance (R),

voltage (V), current (I) or power (P), given at least two of
the other values.
RETURN LOSS, GIVEN
FORWARD/REVERSE POWER

BANDWIDTH VERSUS CLOCK FREQUENCY

Assuming the rise time of a clock is 7% of the period, we

EIRP (EFFECTIVE ISOTROPIC RADIATED
can approximate the bandwidth as shown.
POWER)
The antenna transmitted power. Equal to the transmitted
Example, for a clock frequency of 100 MHz, the band-
output power minus cable loss plus the transmitting an-
width is 500 MHz. That is, the highest significant sine-
tenna gain.
wave frequency component in a clock wave is the fifth
harmonic.
EIRP = Pout - Ct + Gt
Pr = Pout - Ct + Gt - Pl + Gr - Cr

PERIOD VERSUS FREQUENCY Where Pout = Output power of transmitted in dBm

Ct = Transmitter cable attenuation in dB
Gt = Transmitting antenna gain in dBi
Gr = Receiving antenna gain in dBi
Pl = Path loss in dB
Cr = Receiver cable attenuation in dB
Pr = Received power level at receiver input in dBm
Ps = Receiver sensitivity in dBm

SPEED OF SIGNALS

In air: 12 inches/nsec
In most PC board dielectrics: 6 inches/nsec

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EQUATIONS, TOOLS, & CALCULATORS

REFERENCE SECTION
RETURN LOSS, GIVEN VSWR ANTENNA (FAR FIELD) RELATIONSHIPS
Gain, dBi to numeric

Return Loss, given reflection coefficient (ρ) Gain, numeric to dBi

Gain,dBi-to-Antenna Factor

Antenna Factor-to-gain indBi

E-FIELD FROM Field Strength given watts, numeric gain, distance in meters
DIFFERENTIAL-MODE CURRENT

Field Strength given watts, dBi gain, distance in meters

ID = differential-mode current in loop (A)

f = frequency (Hz)

L = length of loop (m)

Transmit power required, given desired V/m, antenna nu-
s = spacing of loop (m) meric gain, distance in meters

d = measurement distance (3 m or 10 m, typ.)

(Assumption that the loop is electrically small and mea-

sured over a reflecting surface)
Transmit power required, given desired V/m, antenna dBi
gain, distance in meters

E-FIELD FROM
COMMON-MODE CURRENT

IC = common-mode current in wire (A) PC BOARD

f = frequency (Hz) 1 oz. copper = 1.4 mils = 0.036 mm

L = length of wire (m) 0.5 oz. copper = 0.7 mils = 0.018 mm

d = measurement distance (3 m or 10 m, typ.) (Assump- Convert mils to mm: multiply by 0.0254 mm/mil
tion that the wire is electrically short)
Convert mm to mils: multiply by 39.4 mil/mm

Signal velocity in free space: approx. 12 in/ns

Signal velocity in FR-4: approx. 6 in/ns

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EQUATIONS, TOOLS, & CALCULATORS

REFERENCE SECTION
WORKING WITH DB
FIELD STRENGTH EQUATIONS
The decibel is always a ratio
dBμV/m to V/m: V/m= 10(((dBμV/m)-120)/20)
Power Gain = Pout/Pin
V/m to dBμV/m: dBμV/m = 20log(V/m) + 120
Power Gain(dB) = 10log(Pout/Pin) dBμV/m to dBμA/m: dBμA/m = dBμV/m - 51.5
Voltage Gain(dB) = 20log(Vout/Vin) dBμA/m to dBμV/m: dBμV/m = dBμA/m + 51.5
dBμA/m to dBpT: dBpT = dBμA/m + 2
Current Gain(dB) = 20log(Iout/Iin)
dBpT to dBμA/m: dBμA/m = dBpT - 2
We commonly work with: μT to A/m: A/m = μT/1.25

dBm (referenced to 1 mW) A/m to μT: μT = 1.25 * A/m

dBμV (referenced to 1 μV)

DBM TO DBUV CHART
dBμA (referenced to 1 μA) dBm dBμV

Power Ratios 20 127

10 117
3 dB = double (or half) the power 0 107
-10 97
10 dB = 10X (or /10) the power
-20 87
Voltage/Current Ratios -30 77
6 dB = double (or half) the voltage/current -40 67

10 dB = triple the voltage or current -50 57

-60 47
20 dB = 10X (or /10) the voltage/current -70 37
-80 27
-90 17
-100 7
DBM, DBμV, DBμA (CONVERSION)
A common formula for converting default spectrum ana-
Volts to dBV: dBV = 20log(V)
lyzer amplitudes (dBm) to the limits as shown in the emis-
Volts to dBμV: dBμV = 20log(V) + 120 sions standards (dBμV):
dBV to Volts: V = 10(dBV/20)
dBm to dBμV, use: dBμV = dBm + 107
dBμV to Volts: V = 10((dBμV=120)/20)
dBV to dBμV: dBμV = dBV +120
dBμV to dBV: dBV = dBμV - 120

Note: For current relationships, substitute A for V

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2024 EMC FUNDAMENTALS GUIDE

EQUATIONS, TOOLS, & CALCULATORS

REFERENCE SECTION
WAVELENGTH EQUATIONS DIPOLE RADIATION
(FREE SPACE) VERSUS LENGTH

Wavelength(m) = 300/f(MHz)
Half wavelength(ft.) = 468/f(MHz)

RESONANCE OF STRUCTURES

Use this chart to for determining the relative radiation versus size in wavelength.
Image Source: Bruce Archambeault.

For example, a wire or slot whose length is 0.2 wave-

length at a particular frequency, would radiate about 15
dB down from the equivalent half-wavelength wire or slot.
Use this handy chart for determining the resonant frequency versus cable or slot
length in free space. Half-wavelength slots or cables simulate dipole antennas
and are particularly troublesome.

GAIN OF A HALF-WAVE DIPOLE ABOVE AN ISOTROPIC ANTENNA GAIN - GdBi:

GdBi = 10*log(Gr) = 10*log(1.64) = 2.15 dB

VOLTAGE AND POWER RECEIVED BY A HALF-WAVE DIPOLE:

(Assumes receiver input impedence is 50 Ohms)

V(µV) = E(µV/m) * 39.4667/f(MHz)

W(dBm) = -90 + 10*log[V2(µV)/50]

LINKEDIN GROUPS
Electromagnetic Compatibility Forum ESD Experts
Electromagnetics and Spectrum Engineering Group Signal & Power Integrity Community
EMC - Electromagnetic Compatibility EMI/EMC Testing
EMC Experts iNARTE
EMC Troubleshooters IEEE

interferencetechnology.com | 32 | Interference Technology Guide Series

2024 EMC FUNDAMENTALS GUIDE

COMMON SYMBOLS

REFERENCE SECTION
A Amperes, unit of electrical current

AC Alternating Current

AM Amplitude modulated

dBm dB with reference to 1 mW

dBμA dB with reference to 1 μA

dBμV dB with reference to 1 μV

DC Direct Current

E "E" is the electric field component of an electromagnetic field.

Ratio of the electric field (E) to the magnetic field (H), in the far-field this is the characteristic impedance of free
E/H
space, approximately 377 Ω

EM Electromagnetic

EMC Electromagnetic compatibility

EMI Electromagnetic Interference

FM Frequency modulated

GHz Gigahertz, one billion Hertz (1,000,000,000 Hertz)

H "H" is the magnetic field component of an electromagnetic field.

Hz Hertz, unit of measurement for frequency

I Electric current

kHz Kilohertz, one thousand Hertz (1,000 Hertz)

λ Lambda, symbol for wavelength

MHz Megahertz, one million Hertz (1,000,000 Hertz)

mil Unit of length, one thousandth of an inch

mW Milliwatt (0.001 Watt)

mW/cm2 Milliwatts per square centimeter, a unit for power density

Pd Power density, unit of measurement of power per unit area (W/m2 or mW/cm2)

R Resistance

RF Radio Frequency

RFI Radio Frequency Interference

V Volts, unit of electric voltage potential

V/m Volts per meter, unit of electric field strength

W/m2 Watts per square meter, a unit for power density, one W/m2 equals 0.1 mw/cm2

Ω Ohms, unit of resistance

Ref: ANSI/IEEE 100-1984, IEEE Standard Dictionary of Electrical and Electronics Terms, 1984.

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2024 EMC FUNDAMENTALS GUIDE

ACRONYMS

REFERENCE SECTION
(Antenna Factor) - The ratio of the received field strength to the voltage at the terminals of a receiving antenna.
AF
Units are 1/m.
(Absorber-Lined Chamber) - A shielded room with RF-absorbing material on the walls and ceiling. In many
ALC
cases, the floor is reflective.
(Amplitude Modulation) - A technique for putting information on a sinusoidal carrier signal by varying the
AM
amplitude of the carrier.
(Bulk Current Injection) - An EMC test where common-mode currents are coupled onto the power and
BCI
communications cables of an EUT.
CE (Conducted Emissions) - The RF energy generated by electronic equipment, which is conducted on power cables.
CE Marking The marking signifying a product meets the required European Directives.
CENELEC French acronym for the “European Committee for Electrotechnical Standardization”.
(Conducted Immunity) - A measure of the immunity to RF energy coupled onto cables and wires of an electronic
CI
product.
CISPR French acronym for “International Special Committee on Radio Interference”.
Conducted Energy transmitted via cables or PC board connections.
Coupling
A structure or medium that transmits energy from a noise source to a victim circuit or system.
Path
(Conducted Susceptibility) - RF energy or electrical noise coupled onto I/O cables and power wiring that can
CS
disrupt electronic equipment.
CW (Continuous Wave) - A sinusoidal waveform with a constant amplitude and frequency.
(Electromagnetic Compatibility) - The ability of a product to coexist in its intended electromagnetic environment
EMC
without causing or suffering disruption or damage.
(Electromagnetic Interference) - When electromagnetic energy is transmitted from an electronic device
EMI to a victim circuit or system via radiated or conducted paths (or both) and which causes circuit upset
in the victim.
(Electromagnetic Pulse) - Strong electromagnetic transients such as those created by lightning or
EMP
nuclear blasts.
(Electrostatic Discharge) - A sudden surge in current (positive or negative) due to an electric spark or
ESD secondary discharge causing circuit disruption or component damage. Typically characterized by rise
times less than 1 ns and total pulse widths on the order of microseconds.
(Equivalent Series Inductance) - Generally refers to the parasitic series inductance of a capacitor or
ESL
inductor. It could also include the extra series inductance of any connecting traces or vias on a PC board.
ESR (Equivalent Series Resistance) - Generally refers to the parasitic series resistance of a capacitor or inductor.
EU European Union.
EUT (Equipment Under Test) - The device being evaluated.
When you get far enough from a radiating source the radiated field can be considered planar (or
Far Field
plane waves).
FCC U.S. Federal Communications Commission.
(Frequency Modulation) - A technique for putting information on a sinusoidal “carrier” signal by varying
FM
the frequency of the carrier.
IEC International Electrotechnical Commission
(Industrial, Scientific and Medical equipment) - A class of electronic equipment including industrial
ISM
controllers, test & measurement equipment, medical products and other scientific equipment.
(Information Technology Equipment) - A class of electronic devices covering a broad range of equipment
ITE including computers, printers and external peripherals; also includes, telecommunications equipment,
and multi-media devices.

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2024 EMC FUNDAMENTALS GUIDE

ACRONYMS

REFERENCE SECTION
(Line Impedance Stabilization Network) - Used to match the 50-Ohm impedance of measuring
LISN
receivers to the power line.
(Multi-Layer Ceramic Capacitor) - A surface mount capacitor type often used as decoupling or energy
MLCC
storage capacitors in a power distribution network.
Near Field When you are close enough to a radiating source that its field is considered spherical rather than planar.
Noise Source A source that generates an electromagnetic perturbation or disruption to other circuits or systems.
OATS (Open Area Test Site) - An outdoor EMC test site free of reflecting objects except a ground plane.
(Power Distribution Network) - The wiring and circuit traces from the power source to the electronic
PDN circuitry. This includes the parasitic components (R, L, C) of the circuit board, traces, bypass
capacitance and any series inductances.
(Power Line Transient) - A sudden positive or negative surge in the voltage on a power supply input
PLT
(DC source or AC line).
(Power Integrity) - Refers to the quality of the energy transfer along the power supply circuitry from the
PI
voltage regulator module (VRM) to the die of the ICs. High switching noise or oscillations mean a low PI.
Radiated Energy transmitted through the air via antenna or loops.
(Radiated Emissions) - The energy generated by a circuit or equipment, which is radiated directly from the
RE
circuits, chassis and/or cables of equipment.

Radio Frequency Interference) - The disruption of an electronic device or system due to electromagnetic
RFI
emissions at radio frequencies (usually a few kHz to a few GHz). Also EMI.

Radiated Immunity) - The ability of circuits or systems to be immune from radiated energy coupled to
RI
the chassis, circuit boards and/or cables. Also Radiated Susceptibility (RS).
(Radio Frequency) - A frequency at which electromagnetic radiation of energy is useful for
RF
communications.
(Radiated Susceptibility) - The ability of equipment or circuits to withstand or reject nearby radiated RF
RS
sources. Also Radiated Immunity (RI).

Spread Spectrum Clock Generation) - This technique takes the energy from a CW clock signal and
SSCG spreads it out wider, which results in a lower effective amplitude for the fundamental and high-order
harmonics. Used to achieve improved radiated or conducted emission margin to the limits.

SI (Signal Integrity) - A set of measures of the quality of an electrical signal.

(Simultaneous Switching Noise) - Fast pulses that occur on the power bus due to switching transient
SSN
currents drawn by the digital circuitry.
(Transverse Electromagnetic) - An electromagnetic plane wave where the electric and magnetic fields are
TEM perpendicular to each other everywhere and both fields are perpendicular to the direction of propagation. TEM
cells are often used to generate TEM waves for radiated emissions (RE) or radiated immunity (RI) testing.
An electronic device, component or system that receives an electromagnetic disturbance, which
Victim
causes circuit upset.

(Voltage Regulator Module) - A linear or switch-mode voltage regulator. Generally, there will be several
VRM
of these mounted to a PC board in order to supply different levels of required voltages.
(Voltage Standing Wave Ratio) - A measure of how well the load is impedance matched to its
VSWR transmission line. This is calculated by dividing the voltage at the peak of a standing wave by the
voltage at the null in the standing wave. A good match is less than 1.2:1.

(Crosstalk) - A measure of the electromagnetic coupling from one circuit to another. This is a common
XTALK
problem between one circuit trace and another.

interferencetechnology.com | 35 | Interference Technology Guide Series

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2024 EMC FUNDAMENTALS GUIDE

RECOMMENDED EMC BOOKS,

REFERENCE SECTION
MAGAZINES AND JOURNALS
ITEM 2023 ARRL,
(Interference Technology Engineer’s Master) The RFI Handbook
ITEM is an exhaustive guide full of invaluable EMC (3rd edition), 2010. Good practical book on radio
directories, standards, formulas, calculators, lists, and frequency interference with mitigation techniques. Some
“how-to” articles, compiled in easy-to-find formats. EMC theory.
https://learn.interferencetechnology.com/item-2023/
Bogatin,
2023 EMC Fundamentals Guide Signal & Power Integrity - Simplified
The Fundamentals Guide keeps your project running Prentice-Hall, 2009 (2nd Edition). Great coverage of
smoothly by better understanding how to address EMI signal and power integrity from a fields viewpoint.
and EMC in the early design phases.
https://learn.interferencetechnology.com/2023-emc- Brander, et al,
fundamentals-guide/ Trilogy of Magnetics - Design Guide for EMI Filter Design,
SMPS & RF Circuits
2020 Europe EMC Guide Würth Electronik, 2010. A comprehensive compilation
This guide features technical articles, reference materials, of valuable design information and examples of filter,
a company directory, and a products and services list for switch-mode power supply, and RF circuit design.
more than 10 countries.
https://learn.interferencetechnology.com/2020-europe- Goedbloed,
emc-guide/ Electromagnetic Compatibility
Prentice-Hall, 1990. Good general text on EMC with
2019 Components & Materials Guide practical experiments. May be out of print.
This guide is updated with the most critical changes in
standards, upcoming events, new product distributors, Kimmel and Gerke,
and more as they relate to EMI shielding and filtering. Electromagnetic Compatibility in Medical Equipment
https://learn.interferencetechnology.com/2019- IEEE Press, 1995. Good general product design
components-and-materials-guide/ information.

André and Wyatt, Mardiguian,

EMI Troubleshooting Cookbook for Product Designers Controlling Radiated Emissions by Design
SciTech Publishing, 2014. Includes chapters on product Springer, 2016. Good content on product design for
design and EMC theory & measurement. A major part of compliance.
the content includes how to troubleshoot and mitigate all
common EMC test failures. Kunkel,
Shielding of Electromagnetic Waves, Theory and Practice
Archambeault, Springer. 2019. Provides efficient ways for design
PCB Design for Real-World EMI Control engineers to apply electromagnetic theory in shielding of
Kluwer Academic Publishers, 2002. electrical and electronic equipment.

Armstrong, Hall, Hall, and McCall,

EMC Design Techniques For Electronic Engineers High-Speed Digital System Design - A Handbook of
Armstrong/Nutwood Publications, 2010. A comprehensive Interconnect Theory and Design Practices
treatment of EMC theory and practical product design Wiley, 2000.
and measurement applications.
Joffe and Lock,
Armstrong, Grounds For Grounding
EMC For Printed Circuit Boards - Basic and Advanced Wiley, 2010. This huge book includes way more topics on
Design and Layout Techniques product design than the title suggests. Covers all aspects
Armstrong/Nutwood Publications, 2010. A comprehensive of grounding and shielding for products, systems, and
treatment of PC board layout for EMC compliance. facilities.

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2024 EMC FUNDAMENTALS GUIDE

RECOMMENDED EMC BOOKS,

REFERENCE SECTION
MAGAZINES AND JOURNALS
Johnson and Graham, Slattery and Skinner,
High-Speed Digital Design - A Handbook of Black Magic Platform Interference in Wireless Systems - Models,
Prentice-Hall, 1993. Practical coverage of high speed Measurement, and Mitigation
digital signals and measurement. Newnes Press, 2008. The first publication to publicize the
issue of self-interference to on-board wireless systems.
Johnson and Graham,
High-Speed Signal Propagation - Advanced Black Magic Smith,
Prentice-Hall, 2003. Practical coverage of high speed High Frequency Measurements and Noise in Electronic
digital signals and measurement. Circuits
Springer, 1993. A classic book on high frequency mea-
Ott, surements, probing techniques, and EMC troubleshoot-
Electromagnetic Compatibility Engineering ing measurements.
Wiley, 2009. The “bible” on EMC measurement, theory,
and product design. Smith and Bogatin,
Principles of Power Integrity for PDN Design - Simplified
Paul, Prentice-Hall, 2017. Getting the power distribution net-
Introduction to Electromagnetic Compatibility work (PDN) design right is the key to reducing EMI.
Wiley, 2006 (2nd Edition). The one source to go to for an
upper-level course on EMC theory. Williams,
EMC For Product Designers
Mardiguian, Newnes, 2017. Completely updated text on product de-
EMI Troubleshooting Techniques sign for EMC compliance.
McGraw-Hill, 2000. Good coverage of EMI troubleshooting.
Weston,
Montrose, Electromagnetic Compatibility - Methods, Analysis,
EMC Made Simple Circuits, and Measurement
Montrose Compliance Services, 2014. The content CRC Press, 2017 (3rd Edition). A comprehensive text,
includes several important areas of EMC theory and encompassing both commercial and military EMC.
product design, troubleshooting, and measurement.
Witte,
Morrison, Spectrum and Network Measurements
Digital Circuit Boards - Mach 1 GHz (2nd edition), SciTech Publishing, 2014. The best text
Wiley, 2012. Important concepts of designing high around explaining the theory and usage of spectrum and
frequency circuit boards from a fields viewpoint. network analyzers.

Morrison, Wyatt and Jost,

Grounding And Shielding - Circuits and Interference Electromagnetic Compatibility (EMC) Pocket Guide
Wiley, 2016 (6th Edition). The classic text on grounding SciTech Publishing, 2013. A handy pocket-sized refer-
and shielding with up to date content on how RF energy ence guide to EMC.
flows through circuit boards.
Wyatt and Gruber,
Sandler, Radio Frequency (RFI) Pocket Guide
Power Integrity - Measuring, Optimizing, and Troubleshoot- SciTech Publishing, 2015. A handy pocket-sized refer-
ing Power Related Parameters in Electronics Systems ence guide to radio frequency interference.
McGraw-Hill, 2014. The latest information on measure-
ment and design of power distribution networks and how
the network affects stability and EMC.

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2024 EMC FUNDAMENTALS GUIDE

INDEX OF ADVERTISERS

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Schaffner EMC, Inc

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