IPC-4922

Requirements for
Sintering Materials for
Electrical and Thermal
Interconnects

Developed by the Sintering Materials for Electronic Assemblies

Task Group (5-21p) of the Assembly & Joining Committee (5-20) of IPC

Users of this publication are encouraged to participate in the

development of future revisions.

Contact:

IPC
2024 – January IPC-4922

Table of Contents
1 SCOPE.................................................................................. 1 3.6 Shear Strength..............................................................6
1.1 Purpose ........................................................................1 3.7 Fillet Height / Sidewall Coverage................................7
1.2 Classification ...............................................................1 3.8 Electromigration (EM), Electrochemical Migration
1.3 Measurement Units......................................................1 (ECM) and Surface Insulation Resistance (SIR).........7
1.4 Definition of Requirements..........................................1 3.8.1 ECM and EM Differentiation...................................7
1.5 Process Control Requirements.....................................1 3.9 Wetting / Surface Tension............................................7
1.6 Order of Precedence ....................................................2 3.10 Fluid Density..............................................................8
1.6.1 Conflict.....................................................................2 3.11 Shelf-Life ..................................................................8
1.6.2 Clause References.....................................................2 3.12 Sintered Material Nomenclature................................8
1.6.3 Appendices................................................................2 3.13 Standards for Tensiometers........................................8
1.7 Use of “Lead” .............................................................2 4 QUALIFICATION AND QUALITY ASSURANCE ................. 9
1.8 Abbreviations and Acronyms ......................................2 4.1 Responsibility for Inspection. .....................................9
1.9 Terms and Definitions .................................................2 4.1.1 Responsibility for Compliance ................................9
1.9.1 Sintering....................................................................2 4.1.1.1 Quality Assurance Program ..................................9
1.9.2 Electrochemical Migration (ECM)...........................3 4.1.2 Test Equipment and Inspection Facilities ................9
1.9.3 Electromigration (EM)..............................................3 4.1.3 Inspection Conditions ..............................................9
2 APPLICABLE DOCUMENTS ............................................... 3 4.2 Types of Inspections ....................................................9
2.1 IPC ..............................................................................3 4.3 Qualification Inspection ..............................................9
2.2 ASTM...........................................................................3 4.3.1 Sample Size ..............................................................9
2.3 International Electrotechnical Commission (IEC).......3 4.3.2 Requalification .........................................................9
2.4 British Standards..........................................................3 4.3.2.1 Formula Variations Constituting Material
2.5 International Organization for Standards.....................3 Change ..................................................................9

2.6 National Conference of Standards Laboratories 4.3.2.2 Manufacturing Site Change.................................10

(NCSL).........................................................................4 4.4 Quality Conformance Inspection...............................10
2.7 IEEE.............................................................................4 4.4.1 Sampling Plan.........................................................10
2.8 JEDEC ........................................................................4 4.4.2 Rejected Lots..........................................................10
4.5 Performance Inspection.............................................10
3 REQUIREMENTS................................................................. 4
4.6 Statistical Process Control (SPC)..............................10
3.1 General Requirements..................................................4
3.2 Broad Categories of Sintering Materials Under 5 PREPARATION FOR DELIVERY........................................ 10
Consideration...............................................................4
6 NOTES............................................................................... 10
3.3 Description of Product.................................................4
6.1 Applicability...............................................................10
3.3.1 Metal Composition...................................................5
6.2 Shelf Life...................................................................10
3.3.1.1 Percent Solid Metal Content..................................5
6.3 Acquisition Requirements..........................................10
3.3.2 Organic Carrier Vehicle (OCV)................................5
APPENDIX A Abbreviations and Acronyms.............. 11
3.3.3 Requirements on Contamination
and Contaminants. ....................................................5 APPENDIX B Differentiating Electromigration
and Electrochemical Migration...........12
3.4 Metal Powder Size and Size Distribution....................5
3.5 Rheology......................................................................6 APPENDIX C Cleaning Testing for Materials
Following Sintering Processes ...........14

Copyright 2023 by IPC International, Inc. All rights reserved. v

IPC-4922 2024 – January

Figures Tables

Figure 1-1. Mechanism for Sintering Powders..................2 Table 3-1 Categories of Sintering Materials......................4
Figure 3-1 Diagram of Finished Test Specimen for Shear Table 3-2 Percent Metal Composition Designators for
Strength Test.....................................................6 Different Examples of Sintering Material
Figure 3-2 Paste Sidewall Coverage by Group..................7 Types..................................................................5
Figure A-1. Schematic Showing Cation Movement........12 Table 3-3Designation of PSD for Solid Metal Content
Figure A-2 Schematic Showing Electron/Metal/Atom of Sintering Materials.........................................6
Flow...............................................................13 Table 3-4 Comparison of Sintering Inks versus
Sintering Pastes / Preforms................................7
Table 3-5 General System for Designating Sintering
Materials............................................................8
Table 3-6 Standards for Tensiometers /
Optical Tensiometer...........................................8
Table 3-7 Standards for Tensiometers –
Force Tensiometer..............................................9

vi Copyright 2024 by IPC International, Inc. All rights reserved.

2024 – January IPC-4922

Requirements for Sintering Materials for

Electrical and Thermal Interconnects

1 SCOPE
This standard prescribes general minimum requirements for the classification and testing of sintering materials for reliable
electrical and thermal interconnects. This standard is a sintering materials classification, quality assurance and procurement
document for sintering materials.

1.1 Purpose This standard defines the characteristics of sintering materials through the definitions of properties and
specifications of test methods and inspection criteria. The materials include both:
1) Fluid and semifluid paste and ink materials (in this section collectively designated “pastes”) made from a combination of
solid metal particles combined with a continuous phase of material designated an “organic carrier vehicle” (OCV). The
OCV may or may not contain dissolved or dispersed organometallics (OMC) or similar materials, and a broad means of
their characterization is within the scope of this document.
2) Solid and semi-solid predried preforms and films (hereinafter collectively designated “preforms”) of various shapes and
sizes.
Detailed OCV characterization remains out of the scope of this standard, since the OCV itself will not be used as a material
separate from the sintering paste. However, cleanliness remains within the scope of the standard and shall be addressed as
agreed between user and supplier (AABUS) concerning the determination of the residues after sintering, characterization
of the same and cleaning processes.
The requirements for sintering materials are defined in general terms. In practice, where more stringent requirements are
necessary, additional requirements shall be as agreed between user and supplier (AABUS).
The standard is explicitly not designed to cover liquid phase or transient liquid phase materials or their associated principles,
methodologies, and techniques, as their joint formation mechanism is not by sintering.

1.2 Classification

CLASS 1 General Electronic Products

Includes products suitable for applications where the major requirement is function of the completed assembly.

CLASS 2 Dedicated Service Electronic Products

Includes products where continued performance and extended life is required, and for which uninterrupted service is desired
but not critical. Typically, the end-use environment would not cause failures.

CLASS 3 High Performance/Harsh Environment Electronic Products

Includes products where continued high performance or performance-on-demand is critical, equipment downtime cannot be
tolerated, end-use environment may be uncommonly harsh, and the equipment must function when required, such as life
support or other critical systems.

1.3 Measurement Units This Standard uses International System of Units (SI) units per ASTM SI10, IEEE/ASTM SI 10,
Section 3 [Imperial English equivalent units are in brackets for convenience]. The SI units used in this Standard are millimeters
(mm) [in] for dimensions and dimensional tolerances, Celsius (°C) [°F] for temperature and temperature tolerances, grams (g)
[oz] for weight, and lumens (lm) [footcandles] for illuminance.
Note: This Standard uses other SI prefixes (ASTM SI10, Section 3.2) to eliminate leading zeroes (for example, 0.0012 mm
becomes 1.2 μm) or as an alternative to powers-of-ten (3.6 x 103 mm becomes 3.6 m).

1.4 Definition of Requirements The words shall or shall not are used in the text of this document wherever there is a
requirement for materials, preparation, process control or acceptance. The word “should” reflects recommendations and is
used to reflect general industry practices and procedures for guidance only. Line drawings and illustrations are depicted herein
to assist in the interpretation of the written requirements of this Standard. The text takes precedence over the figures.

1.5 Process Control Requirements The primary goal of process control is to continually reduce variation in the processes,
products, or services to provide products or processes meeting or exceeding User requirements. Process control tools such as
IPC-9191, JESD557 or other User-approved system may be used as guidelines for implementing process control.

Copyright 2024 by IPC International, Inc. All rights reserved. 1