312316 manual ELECTRONICS COMPONENTS
312316 manual ELECTRONICS COMPONENTS
To ensure that the Diploma level Technical Education constantly matches the latest requirements
of technology and industry and includes the all-round personal development of students including
MISSION-
To provide high quality technical and managerial manpower, information and consultancy servicesto
the industry and community to enable the industry and community to face the changingtechnological
QUALITY POLICY
We, at MSBTE are committed to offer the best in class academic services to the students and
institutes to enhance the delight of industry and society. This will be achieved through continual
implementation, evaluation and monitoring system along with adequate faculty development
programmes.
CORE VALUES
MSBTE believes in the followings:
for
Maharashtra State
Board of Technical Education, Mumbai
(Autonomous) (ISO 9001:2015) (ISO/IEC 27001:2013)
Maharashtra State
Board of Technical Education, Mumbai
(Autonomous) (ISO 9001:2015) (ISO/IEC 27001:2013)
4th Floor, Government Polytechnic Building, 49, Kherwadi,
Bandra (East), Mumbai - 400051.
MAHARASHTRA STATE
BOARD OF TECHNICAL EDUCATION
Certificate
Seal of the
Institute
Electronics Materials & Components (312316)
Preface
The primary focus of any engineering laboratory/field work in the technical education system is
to develop the much needed industry relevant competencies and skills. With this in view, MSBTE
embarked on this innovative ‘K’ Scheme curricula for engineering diploma programmes with outcome-
based education as the focus and accordingly, a relatively large amount of time is allotted for the
practical work. This displays the great importance of laboratory work, making each teacher, instructor
and student realize that every minute of the laboratory time needs to be effectively utilized to develop
these outcomes, rather than doing other mundane activities. Therefore, for the successful
implementation of this outcome-based curriculum, every practical has been designed to serve as a
‘vehicle’ to develop this industry identified competency in every student. The practical skills are
difficult to develop through ‘chalk and duster’ activity in the classroom situation. Accordingly, the ‘K’
scheme laboratory manual development team designed the practicals to focus on the outcomes, rather
than the traditional age old practice of conducting practicals to ‘verify the theory’ (which may become
a byproduct along the way).
This laboratory manual is designed to help all stake holders, especially the students, teachers and
instructors to develop in the student the pre-determined outcomes. It is expected from each student that
at least a day in advance, they have to thoroughly read through the concerned practical procedure that
they will do the next day and understand the minimum theoretical background associated with the
practical. Every practical in this manual begins by identifying the competency, industry relevant skills,
course outcomes and practical outcomes which serve as a key focal point for doing the practical. The
students will then become aware about the skills they will achieve through the procedure shown there
and necessary precautions to be taken, which will help them to apply in solving real-world problems in
their professional life.
This manual also provides guidelines to teachers and instructors to effectively facilitate student-
centered lab activities through each practical exercise by arranging and managing necessary resources
in order that the students follow the procedures and precautions systematically ensuring the achievement
of outcomes in the students.
The course Electronic Materials & Components (312316) is intended to help the students of
Diploma Engineering to get an idea of various Electronic Materials and Components employed in
electronic industries. It will make the students familiar with the suitability of various electronic
materials and components for different applications. This course is intended to develop skills of testing
components that will be needed for the project and setting up of many experiments in basic and applied
technology courses.
Although best possible care has been taken to check for errors (if any) in this laboratory manual,
perfection may elude us as this is the first edition of this manual. Any errors and suggestions for
improvement are solicited and highly welcome.
Following programme outcomes are expected to be achieved through the practical of the course.
PO1: Basic and Discipline specific knowledge: Apply knowledge of basic mathematics, science and
engineering fundamentals and engineering specialization to solve the broad based Electronics &
Communication engineering problems.
PO2: Problem analysis: Identify and analyze well-defined Electronics & Communication engineering
problems using codified standard methods.
PO3: Design/ development of solutions: Design solutions for well-defined technical problems and
assist with the design of Electronics & Communication systems components or processes to meet
specified needs.
PO4: Engineering Tools, Experimentation and Testing: Apply modern Electronics &
Communication engineering tools and appropriate technique to conduct standard tests and
measurements.
PO5: Engineering practices for society, sustainability and environment: Apply appropriate
Electronics & Communication technology in context of society, sustainability, environment and ethical
practices.
PO6: Project Management: Use Electronics & Communication engineering management principles
individually, as a team member or a leader to manage projects and effectively communicate about well-
defined engineering activities.
PO7: Life-long learning: Ability to analyze individual needs and engage in updating in the context of
Electronics & Communication technological changes.
Program Specific Outcomes (PSOs) (What s/he will be able to do in the Electronics engineering
specific industry soon after the diploma programme)
PSO1: Electronics and Telecommunication Systems: Maintain various types of Electronics
&Telecommunication systems
PSO2: EDA Tools Usage: Use EDA Tools to develop simple Electronics and Telecommunication
Engineering related circuits.
The following industry relevant skills of the competency “Use of various Electronic Materials
and Components for relevant electronic applications" are expected to be developed in the student by
undertaking the practical of this laboratory manual
CO CO CO CO CO
Sr. Title of the Practical
No. 1 2 3 4 5
1. Determination of resistivity - - - -
9. Soldering of SMD - - - -
Guidelines to Teachers
1. Teacher should provide the guideline with demonstration of practical to the students with all features.
2. Teacher shall explain prior concepts to the students before starting of each practical.
4. Teacher should ensure that the respective skills and competencies are developed in the students after
the completion of the practical exercise.
5. Teachers should give opportunities to students for hands-on experience after the demonstration.
6. Teacher is expected to share the skills and competencies to be developed in the students.
7. Teacher may provide additional knowledge and skills to the students even though not covered in the
manual but are expected of the students by the industry.
8. Finally give practical assignments and assess the performance of students based on tasks assigned to
check whether it is as per the instructions.
9. Teacher is expected to refer complete curriculum document and follow guidelines for implementation
10. At the beginning of the practical which is based on the simulation, teacher should make the students
1. Listen carefully to the lecture given by the teacher about course, curriculum, learning structure, skills
to be developed.
2. Organize the work in the group and make a record of all observations.
3. Do the calculations and plot the graph wherever it is required in the practical
5. Student shall attempt to develop related hand-on skills and gain confidence.
6. Student shall develop the habits of evolving more ideas, innovations, skills etc. those included in scope
of manual
7. Student should develop the habit to submit the practical on date and time.
Content Page
List of Practicals and Progressive Assessment Sheet
Page
Sr. Title of the practical Date of Date of Assessment Dated sign. Remarks
No. No. performance submission marks(25) Of teacher (if any)
1. Determination of resistivity 1
Determination of photoelectric
2.* 9
cell characteristics
Identification of various
4.* electronic components in the 26
given circuit
7. Testing of different IC 52
Determination of SMD
8.* 62
component value
9. Soldering of SMD 69
Total
I Practical significance:
The property of a material by which it offers an opposition in the flow of current is called
resistivity. Metals are good conductors of electricity; hence they have low resistivity. Insulators
are bad conductors of electricity; hence they have very high resistivity. Resistivity of a material
is used in various applications such as quality control test, selection of right material for
manufacturing of a resistor for a specific use etc.
II Industry / Employer Expected outcome(s)
The aim of this practical is to help the student to attain the following industry identified outcome
through various teaching learning experiences: Use of various Electronic Materials and
Components for relevant electronic applications.
III Course Level Learning outcome(s)
Identify the relevant material for the Electronic Applications.
IV Laboratory Learning outcome(s)
Determine resistivity for a given length of wire keeping area constant.
V Relevant Affective Domain related outcome(s)
1. Follow safe practices.
2. Handle electronic components and instruments carefully.
VI Relevant Theoretical Background
Resistivity of a material is defined as the resistance between the two opposite faces of a meter
cube of that material.
Also, Resistivity is equal to resistance of a wire of unit length and unit cross sectional area of
that material.
At a constant temperature, the resistance (R) of a given conductor is directly proportional to its
length (L) and inversely proportional to its cross-sectional area (A).
Resistivity of the material of the coil of wire (ρ) is,
𝑅𝐴
ρ= 𝐿
IX Precautions to be followed:
1. Do not switch on the power supply unless you have checked the circuit connections as per
the circuit diagram.
2. Connect voltmeter and ammeter in correct polarities.
3. All electrical connections should be neat and tight.
X Procedure:
1. Connect the battery, ammeter, given wire, rheostat and key in series, as shown in the circuit
diagram.
2. Connect the voltmeter in parallel to the unknown resistance wire.
3. Close the key and hence the circuit is closed.
4. Measure the length of the wire using meter scale
5. Measure voltage across the wire with a voltmeter and the current through the wire with an
ammeter.
6. Tabulate the observations.
7. Calculate resistance of a wire as R=V/I.
8. Vary the length of the wire (from say 25 cm to 100 cm in 25 cm intervals) using moving
contact (crocodile pin can be used)
9. Adjust the variable resistor to keep a low fixed current flowing through the wire (to minimize
errors from heating effect)
10. Repeat step 4 to 7 for different lengths of wire.
11. Measure the diameter of the wire using a micrometer screw gauge.
12. Calculate the cross-sectional area as A = π*d2/4.
13. Calculate resistivity of material of given wire as ρ=R*A/L.
14. Plot a graph of resistance R in Ω on the y-axis against length L in cm on the x-axis.
XI Observation table:
Table 1: Determination of resistivity
Sr.
Length(m) Current(A) Voltage(V) Resistance(Ω) Resistivity(Ω-m)
No
1
2
3
4
Mean value
Calculations:
1. Resistance of wire as R=V/I=__________ Ω
XII Result(s)
Observe the plotted graph and write:
1. Resistivity of a given wire, keeping cross sectional area constant =………………Ω m.
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1. https://en.wikipedia.org/wiki/Electrical_resistivity_and_conductivity
2. https://www.electronics-notes.com/articles/basic_concepts/resistance/electrical-
resistivity.php
3. https://www.digimat.in/nptel/courses/video/105103182/L11.html
XVII Assessment Scheme
2 Interpretation of result 05 %
3 Conclusions 05 %
1. ……………………………......
2. ……………………………......
3. ……………………………......
4. ……………………………......
I Practical significance:
The main function of a photocell is photoelectric detection which can convert light signals into
electrical signals under the condition of no bias voltage. Due to numerous advantages like wide
linear range, high sensitivity, spectral response, appropriate good stability and long service life.
Photoelectric cells are widely used in precision measurement. For obtaining accurate results,
study of photoelectric cell characteristics is essential.
II Industry / Employer Expected outcome(s)
The aim of this course is to help the student to attain the following industry identified outcome
through various teaching learning experiences: Use of various Electronic Materials and
Components for relevant electronic applications.
III Course Level Learning outcome(s)
Identify the relevant material for the Electronic Applications.
IV Laboratory Learning outcome(s)
Use photo electric cell to study I-V characteristics.
V Relevant Affective Domain related outcome(s)
1. Follow safe practices.
2. Handle electronic components and instruments carefully.
VI Relevant Theoretical Background
A device used to convert light energy into electrical energy is called Photoelectric Cell.
Photocell is based on the phenomenon of Photoelectric effect. Photocells are of three types.
1. Photo-Emissive Cell.
2. Photo-Voltaic Cell.
3. Photo-Conductive Cell.
All three types of photoelectric cell can detect light or convert it into electricity.
The important observations on Photoelectric effect are:
● The Photoelectric effect is an instantaneous phenomenon. There is no time delay between
the incidence of light and emission of photoelectrons.
● The number of photoelectrons emitted is proportional to the intensity of incident light.
● Energy of emitted photoelectrons is independent of the intensity of incident light. Also, the
energy of emitted photoelectrons is directly proportional to the frequency of incident light.
Characteristic Curve:
1. Current (I) vs Voltage (V)
Sr.
Instrument / Components Specification Quantity Remark
No.
1 Photocell Selenium, mounted in the metal box 1
2 Micro ammeter 0-100 µA 1
3 Variable power supply (0 -12V), 500mA 1
4 Light source 12V/35W tungsten lamp 1
5 Voltmeter 0-10 V 1
6 Scale 0-30cm 1
IX Precautions to be followed
1. Stray light should be avoided.
2. Very sensitive micro ammeter should be used.
X Procedure:
Connect the apparatus as shown in the circuit diagram.
1. Keep the distance between lamp and photocell constant and record the current for different
voltages.
2. Now keep the applied voltage to the photocell constant and record the currents for
different values of distances.
3. Plot the following graphs showing characteristic curves of the photocell,
1. Current (I) vs Voltage (V)
2. Current (I) vs 1/d2
XI Observation table
Table 1: Current reading for different voltages.
Distance between lamp and photocell = 20 cm
1 2
2 4
3 6
4 8
5 12
XII Result(s)
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XVI References/Suggestions for further reading: include websites/links
1. https://www.britannica.com/technology/photoelectric-cell
2. https://curiophysics.com/photoelectric-cell/
3. https://www.explainthatstuff.com/how-photoelectric-cells-work.html
2 Interpretation of result 05 %
3 Conclusions 05 %
1. ……………………………......
2. ……………………………......
3. ……………………………......
4. ……………………………......
I Practical Significance:
Understanding charging and discharging curves of capacitors with different dielectric materials
is essential in exploring the effects of dielectric on the performance of capacitors. This
experiment aims to provide insights into time constants and behaviour of capacitors with distinct
dielectric properties.
II Industry / Employer Expected outcome(s)
The aim of this practical is to help the student to attain the following industry identified outcome
through various teaching learning experiences: Use of various Electronic Materials and
Components for relevant electronic applications.
III Course Level Learning outcome(s)
Identify the relevant material for the Electronic Applications.
IV Laboratory Learning outcome(s)
Plot the charging and discharging curve of two different capacitors each having different
dielectric material.
V Relevant Affective Domain related outcome(s)
1. Follow safe practices.
2. Handle electronic components and instruments carefully.
VI. Relevant Theoretical Background
Capacitor-A capacitor is formed by keeping two metallic plates parallel to each other. By
applying a potential across the two plates, an electric field is produced between the two plates.
By placing an electrically insulated material within the plates the capacitance can be increased.
The resulting capacitance of the parallel plate capacitor is given by,
When the capacitor discharges through R, the voltage across the capacitor starts decreasing until
it becomes zero. The instantaneous voltage across the capacitor during discharge is given by ,
V = Vmax [e- (t / RC)] ………. (3)
where, R is resistance in ohms.
C is capacitance in farad.
t is the instantaneous time.
Vmax is the maximum voltage to which the capacitor is charged.
Capacitor charging and discharging curves are as shown in figure 3.1 and 3.2 respectively. RC
time constant (τ) is the product of circuit resistance (R) and circuit capacitance (C).
Figure 3.1: Capacitor charging curve Figure 3.2: Capacitor discharging curve
IX Precautions to be followed:
1. Do not switch on the power supply unless you have checked the circuit connections as per
the circuit diagram.
2. Connect voltmeter and ammeter in correct polarities.
3. Ensure that capacitors are fully discharged before starting the experiment.
4. Use appropriate resistors to control the charging and discharging currents.
5. Safely handle capacitors and avoid overcharging.
X Procedure:
1. Make the connections as shown in figure 3.3.
2. Reset the stopwatch.
3. Press the switch in the circuit and also stopwatch.
4. Note down the voltage across capacitor C after an equal interval of time of 10 seconds till it
reaches maximum charging voltage.
XI Observation table:
Table 1: Charging and discharging curve of two different capacitors.
Capacitor 1 Capacitor 2
Sr. R= C= R= C=
Time in Seconds
No.
Charging Discharging Charging Discharging
10
Calculations:
XII Result(s)
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XIV Conclusions and recommendation
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XV Practical related questions
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2 Interpretation of result 05 %
3 Conclusions 05 %
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4. ……………………………......
I Practical significance:
In industries, to build any hardware, it is necessary to identify electronic components, their
terminals, values and packaging. Depending on the application appropriate components need to
be selected for better performance. In this experiment students will identify active and passive
electronic components on the basis of physical verification and basic knowledge about the
components.
II Industry / Employer Expected outcome(s)
The aim of this course is to help the student to attain the following industry identified outcome
through various teaching learning experiences: Use of various Electronic Materials and
Components for relevant electronic applications.
Active components:
Different active components are:
1. Diode
A diode is a semiconductor device that essentially acts as a one-way switch for current. It allows
current to flow easily in one direction, but severely restricts current from flowing in the opposite
direction. A PN junction is the simplest form of the semiconductor diode.
2. Integrated Circuit ( IC )
An integrated circuit (IC), commonly called a chip which is made up of a semiconductor material
called silicon, in which small electronic components called transistors are formed within the
silicon and then wired together with interconnects layered on top of the silicon surface.
1. Passive Components
i. Capacitor
iii. Inductor
2. Active Components
i. Diode
IX Precautions to be followed
1. Ensure that the circuit is powered off before attempting to identify components. This reduces
the risk of electric shock and prevents damage to sensitive components.
2. Handle electronic components with care. Avoid bending leads excessively and be gentle when
inserting or removing components from the circuit.
X Procedure:
1. Begin with passive components like resistors, capacitors, and inductors.
2. Look for symbols representing resistors (usually a zigzag line), capacitors (two parallel lines)
and inductors (coils).
3. Identify active components such as transistors, diodes and integrated circuits.
4. Transistors are often represented by three terminals
5. Diodes are represented by a triangle with an arrow pointing out.
6. Integrated circuits (ICs) are usually represented by rectangles with pins extending from the
sides.
7 Identify the various active and passive components in the given circuit and note down the
observations in observation Table 2. Any electronic circuit from the laboratory consisting of
active and passive components can be used.
Active or passive
Name Symbol Application
Component
Resistor
Diode
Transistor
Inductor
Electrolytic
Capacitor
LDR
LED
FET
Draw the circuit used for component identification from the laboratory
Type of component
Sr. No. Name of Component Active / Passive
XII Result(s)
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2 Interpretation of result 05 %
3 Conclusions 05 %
1. ……………………………......
2. ……………………………......
3. ……………………………......
4. ……………………………......
I Practical Significance:
Light dependent resistors or in other words photo resistors are very useful especially in light
/dark sensor circuits. They can also be referred to as photoconductors. Normally the resistance
of an LDR is very high, but when they are illuminated with light, resistance drops significantly.
Light dependent resistors are a vital component in any electric circuit which is to be turned on
and off automatically according to the level of ambient light. For example, solar powered garden
lights and night security lighting.
II Industry / Employer Expected outcome(s)
The aim of this practical is to help the student to attain the following industry identified
outcome through various teaching learning experiences: Use of various Electronic Materials and
Components for relevant electronic applications.
III Course Level Learning outcome(s)
An electronic component like LDR or light-dependent resistor is responsive to light. Once light
rays drop on it, then immediately the resistance will be changed. The resistance values of LDR
in darkness are several mega ohms whereas in bright light it will be dropped to hundred ohms.
Thus the resistance changes according to the intensity of light. Its resistance decreases with an
increase in the intensity of light. It is often used as a light sensor, light meter, Automatic street
light, and in areas where we need to have light sensitivity. LDR is also known as a Light Sensor.
IX Precautions to be followed:
1. Do not switch on the power supply unless you have checked the circuit connections as per
the circuit diagram.
2. No stray light should fall on the LDR.
X Procedure:
1. Connect circuit as shown in figure 5.4.
2. Before starting the experiment, ensure that the room is dark or use a dark enclosure to control
the light conditions.
3. Note the status of LED under different light conditions.
XI Observation table:
Table 1: Performance of Light Dependent Resistor (LDR)
XII Result(s)
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XVI References/Suggestions for further reading: include websites/links
1. https://www.electronics-tutorials.ws/io/io_4.html
2. https://www.instructables.com/Building-a-Simple-Darkness-Detector-Using-LDR/
3. https://makeabilitylab.github.io/physcomp/sensors/photoresistors.html
2 Interpretation of result 05 %
3 Conclusions 05 %
1. ……………………………......
2. ……………………………......
3. ……………………………......
4. ……………………………......
I Practical significance
The practical significance of the reverse bias characteristic of a photodiode lies in its impact on
the device's performance and its application in various industries. This knowledge is essential
for engineers and researchers working across various industries to develop more efficient and
reliable photodetectors for specific requirements. Knowledge of the reverse bias characteristic
is crucial in designing circuits around photodiodes. Engineers need to consider these
characteristics to ensure stable and reliable operation, especially in applications where the
photodiode is part of a larger system.
II Industry / Employer Expected outcome(s)
The aim of this course is to help the student to attain the following industry identified outcome
through various teaching learning experiences: Use of various Electronic Materials and
Components for relevant electronic applications
III Course Level Learning outcome(s)
Suggest relevant electronic component(s) for the given application.
IV Laboratory Learning outcome(s)
Plot reverse bias characteristic of Photo-diode for different intensity of incident light on it.
V Relevant Affective Domain related outcome(s)
1 Handle components and equipment carefully.
2. Select instruments of required range.
VI Relevant Theoretical Background
A photodiode is a two terminal PN-junction diode that is operated by first reverse biasing
the junction and then illuminating it by light energy to produce electric current. It is also called
a photo-detector/ light detector/ photo-sensor. These diodes are designed to work in reverse bias
condition, it means that the P-side of the photodiode is associated with the negative terminal of
the battery and N-side is connected to the positive terminal of the battery. This diode is very
sensitive to light so when light falls on the diode it changes light into electric current.
IX Precautions to be followed
1. Switch ON the power supply only after checking the circuit connections as per the circuit
diagram.
2. Do not exceed the input voltage of the diode beyond the rated voltage of the diode. This may
damage the diode.
3. Connect voltmeter and ammeter in correct polarities as shown in the circuit diagram.
X Procedure:
I] Test performance of photodiode by varying the light intensity.
1. Make the connections as per circuit diagram.
2. Apply the reverse voltage and measure the current in absence of light
3. Increase the reverse voltage and light intensity in step and note down the photo current.
4. Change the light intensity and repeat the steps.
5. Plot the graph of reverse voltage (negative X-Axis) versus reverse photo current (negative
Y-Axis) for various light intensity.
II] Test performance of photodiode by varying the distance of the light source.
1. Make the connections as per circuit diagram.
2. Apply the reverse voltage and measure the current when light is not incident.
3. Keep the input voltage constant at which we get sufficient light intensity and vary the
distance of the light source from the photodiode in step and note down the photocurrent.
4. Plot the graph of reverse voltage (negative X-Axis) versus reverse photo current
(negative Y-Axis) for different distances.
XI Observation table
Table 1: Measurement of Photodiode current when light intensity is varied
2 4
3 6
4 8
5 10
2 4
3 6
4 8
5 10
XII Result(s)
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2 Interpretation of result 05 %
3 Conclusions 05 %
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I Practical Significance
Testing integrated circuits (ICs) is crucial for ensuring the proper functioning of electronic
devices. Faulty ICs can lead to malfunction, incorrect outputs or even damage to other
components. Testing helps to identify and eliminate these issues before they cause problems
in real world applications.
II Industry / Employer Expected outcome(s)
The aim of this practical is to help the student to attain the following industry identified
outcome through various teaching learning experiences: Use of various Electronic Materials
and Components for relevant electronic applications.
III Course Level Learning outcome(s)
Suggest relevant electronic component(s) for the given application.
IV Laboratory Learning outcome(s)
Test the identified analog IC’s, digital IC’s.
V Relevant Affective Domain related outcome(s)
1. Follow safe practices
2. Handle electronic components and instruments carefully
VI Relevant Theoretical Background:
1. Manufacturing Company name: Prefix is the first part of the nomenclature of IC. It
consists of two or three alphabets. Prefix indicates name of manufacturer. For
example SN is used for Texas instruments, HEF for Philips, DM for National
semiconductors and μA for Fairchild.
2. Logic family: This code consists of two numbers. 74 signifies TTL logic family with
commercial temperature range 00C to 700C , 54 signifies military temperature range
-550C to 1250C
3. Logic series: This code signifies logic subfamily. For example L is Low Power TTL
and LS is Low power Schottky
4. Device type: This indicates device function/type, For example 04 is for hex inverter,
and 08 is for quad two input AND gate.
5. Package type: It signifies the package type of IC for example, N is for plastic dual in
line and J is for ceramic dual in line package.
Figure 7.2 shows IC 741, which is a linear or analog IC and its identification.
Figure 7.3 explains the basic 74XX series code numbers. Which is a digital IC series.
Figure 7.4 explains the basic 74XX series code elaborated with a manufacturer’s prefix
and/or suffix
Figure 7.4 74XX series code elaborated with a manufacturer’s prefix and/or suffix.
IC packages: ICs may have different packages as flat type, Transistor pack, DIP pack, metal
can type. The pins are numbered anti-clockwise around the IC starting near the notch or dot.
The diagram shows the numbering for 8-pin and 14-pin ICs, but the principle is the same for
all sizes.
IC tester: Universal IC tester is used to test analog and digital (TTL, CMOS) ICs. IC tester
internally compare the output of an IC (truth table) with a software program which is already
in tester and accordingly display testing results of IC as Good or Bad.
VII. Actual Equipment/ Circuit diagram used in laboratory with equipment specifications:
Sr. Instrument/
Specification Quantity Remark
No. Components
1 IC tester Universal IC Tester 1
IX Precautions to be followed
1. Care should be taken while handling pins of ICs.
X Procedure:
1. Switch on the IC tester.
2. Observe test message "HELLO" displayed on screen which is flashing for three times.
Then it is followed by the message "IC no -?"
3. If the message "IC no-??" is displayed on the display, it means that the instrument is
ready for testing.
4. Insert IC to be tested in TEST socket properly. While inserting IC under test in TEST
socket, care should be taken to align bottom edge of IC under test with bottom edge of
test socket.
5. Now enter the IC no. using keyboard.
6. Press the test key.
7. If the message "IC GOOD" is displayed alternating with the IC number then it means
that the IC under test is good and can be used in circuit.
8. If the message " No ERROR" is displayed, it means that the IC cannot be checked on
this IC tester.
9. If the message "IC BAD" is displayed it means that the IC is faulty and cannot be used.
XI Observation table:
Table 1: Testing of ICs
XII Result(s)
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XVI References/Suggestions for further reading: include websites/links
1. https://en.wikipedia.org/wiki/Integrated_circuit
2. https://onlinecourses.nptel.ac.in/noc24_ee73/preview
2 Interpretation of result 05 %
3 Conclusions 05 %
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I Practical significance:
Accurate identification of SMD component values is essential in circuit design. Engineers and
technicians often work with SMD components in compact electronic devices. In the field of
electronics repair and maintenance, technicians frequently encounter SMD components. Being
able to determine the values of resistors, capacitors and inductors through their nomenclature is
essential for effective troubleshooting and replacement in faulty devices.
II Industry / Employer Expected outcome(s)
The aim of this course is to help the student to attain the following industry identified outcome
through various teaching learning experiences: Use of various Electronic Material and
Components for relevant electronic applications
III Course Level Learning outcome(s)
Identify the Surface Mount Devices for specific applications.
IV Laboratory Learning outcome(s)
Determine SMD component value (Resistor, Capacitor and Inductor) using their nomenclature.
V Relevant Affective Domain related outcome(s)
1. To handle and measure SMD components accurately.
2. Use the required tools and techniques for measuring SMD components
3. Follow proper safety protocols to prevent accidents and ensure a secure working environment
during the practical.
VI Relevant Theoretical Background
A surface-mount device or SMD is an electronic device for which the components are mounted
or placed directly onto the surface of the PCB. Surface-mount technology, or SMT, is the name
of the method used for producing an SMD. In the industry it has largely replaced the through-
hole technology construction method of fitting components with wire leads into holes in the
circuit board. An SMT component is usually smaller than its through-hole counterpart because
it has either smaller leads or no leads at all.
● SMD Resistor
Surface-mount resistors are typically small and rectangular in design, and they are black in
colour. On the other side of the terminal is a tiny, gleaming silver terminal with conductive edges.
These resistors are designed to be mounted on top of PCBs and soldered to mating landing pads.
SMD resistors are available in a variety of sizes, including 0805 (0.8mm long by 0.5mm broad),
0603 and 0402. They're ideal for bulk circuit board manufacture or designs in which space is
limited.
SMD resistors are labelled with a three-digit code, with the first two digits representing the
resistance value's first two integers and the third digit representing the multiplier, such as x1,
x10, x100, and so on. As an example,
103 = 10 * 1,000 ohms = 10 kΩ (kilo ohms)
392 = 39 * 100 ohms = 3.9 kΩ
563 = 56 * 1,000 ohms = 56 kΩ
105 = 10 * 100,000 ohms = 1 MΩ (Mega ohms)
● SMD Capacitors
SMD capacitors are PCB parts consisting of two metal pieces separated by an insulator and
mainly used to store energy. “C" stands for capacitance, and the unit of capacitance is Farad (F).
The unit F is too big for SMDs' capacitance, and we usually use the smaller units μF, nF, and pF.
1μF equals 1000nF, 1nF equals 1000pF.
SMD capacitors are classified into different types based on the dielectric material used like the
following.
● Multilayer Ceramic Capacitor
● Tantalum Capacitor
● Electrolytic Capacitor
Sr.
Instruments /Components Specifications Quantity Remark
No.
IX Precautions to be followed
1. Handle SMD components with care to prevent damage.
X Procedure:
1. Identify the SMD Component.
2. Inspect the SMD component for any markings or codes.
3. Use a magnifying glass if necessary.
4. Decode resistor values:
● For SMD resistors, the codes typically include a three-digit or four-digit number.
● Decode the digits to determine the resistance value.
● The first two numbers indicate the absolute numbers of the resistance value, and the last
number means the power of 10.
● For example, if the code is "473," it represents a 47kΩ resistor.
XI Observation table
Table 1: Determine SMD component value
XII Result(s)
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2 Interpretation of result 05 %
3 Conclusions 05 %
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I Practical significance:
SMD (Surface Mount Device) soldering is a method of soldering electronic components
directly onto the surface of a printed circuit board (PCB). It involves soldering Tiny
components with small solder pads, eliminating the need for drilling holes in the board.
Figure 9.2 Soldering station Figure 9.3 Flux cord solder wire
Sr. Instrument
Specification Quantity Remark
No. /Components
Soldering iron with
1 15, 18 W iron 1
soldering station
Flux cord solder
2 63/27 flux 1
wire
IX Precautions to be followed:
X Procedure:
1. Ensure the work area is clean and well-ventilated.
2. Inspect and Clean the PCB with some isopropyl alcohol.
3. After cleaning and drying, inspect it under the microscope. Compare the pads, the vias
and the traces, to ensure it matches with the board layout provided to the manufacturer.
Also ensure the pads are nicely and firmly on the board, and not lifted.
4. Apply Solder Paste (flux)to PCB pads.
5. Place the components on the designated pads. using tweezers.
6. Check that its orientation is correct, and apply flux to the component pads/leads before
placement if needed. Place the component in alignment with the
corresponding PCB Pads under the microscope’s magnification, taking care to precisely
align the component, and realign if necessary.
7. Once the first lead is tacked, solder the remaining leads by working out from
the tacked lead, and applying the soldering iron to form a good joint on each lead.
8. When finished soldering all leads, thoroughly inspect each solder joint under
magnification to check for any shorts or poor wetting that require rework, reflowing or
reheating any questionable joints.
9. After soldering is complete, use iso-propyl alcohol and a brush or cotton swabs to clean
away any remaining flux residues.
XI Observation table:
Table 1: Process-Soldering of Surface Mounted Devices
Sr. No. Steps followed in the process of Soldering of Surface Mounted Devices
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
XII Result(s)
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2 Interpretation of result 05 %
3 Conclusions 05 %
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4. ……………………………......
I Practical significance:
In industries where electronic devices are manufactured, identifying SMD components accurately
is crucial for quality control. Even a small mistake in identifying or placing components can lead
to malfunctioning or failure of the electronic device. Understanding SMD components and their
characteristics enables students to innovate and design efficient electronic circuits
II Industry / Employer Expected outcome(s)
The aim of this course is to help the student to attain the following industry identified outcome
through various teaching learning experiences: Use of various Electronic Material and
Components for relevant electronic applications
III Course Level Learning outcome(s)
Identify the Surface Mount Devices for specific applications.
IV Laboratory Learning outcome(s)
o SOT-23 is a small outline transistor package with three leads. It is commonly used for
small signal transistors, diodes, and voltage regulators.
o SOT-89 is a surface-mount transistor package with three leads. It's often used for
medium-power transistors and voltage regulators.
o Identification: SOT-89 transistors are also marked with alphanumeric codes for part
number and other information. The pin configuration varies depending on the specific
component but is typically available in datasheets. It usually has a larger size compared
to SOT-23.
o SO-8 is a small outline integrated circuit package with eight leads (pins). It's commonly
used for various ICs, including operational amplifiers, voltage regulators and
microcontrollers.
o Identification: ICs in SO-8 packages are marked with alphanumeric codes indicating the
part number, manufacturer and sometimes additional information like date codes. The
pin configuration is standardized with specific pins designated for power supply
connections, inputs, outputs, and other functions.
o Description: SO-14 is another small outline integrated circuit package, but with fourteen
leads (pins). It's often used for ICs requiring more connections than SO-8, such as certain
analog-to-digital converters, operational amplifiers and digital logic ICs.
o Identification: Similar to SO-8 ICs, ICs in SO-14 packages are marked with alphanumeric
codes indicating the part number, manufacturer and other relevant information. The pin
configuration is also standardized and can be found in datasheets specific to the
component.
Figure 10.1: Transistor SOT-23 Package Figure 10.2: Transistor SOT-89 Package
Suggested
Sr. No. Instrument /Components Quantity Remark
Specifications
SMD of different packages like
transistor SOT23 pack, transistor SMD components of
1. 3 Each
SOT89 Pack, IC SO8 Pack, IC SO14 suitable specification
pack.
IX Precautions to be followed
1. Handle SMD components with care to prevent damage.
2. Use tweezers or a vacuum pen to handle SMD components carefully and avoid static
discharge.
X Procedure:
1. Observe the given SMD Component.
2. Carefully examine the SMD component under good lighting conditions. Use magnifying
glass if required
3. Measure the length, width, and height of the component in millimetres (mm).
4. Describe the arrangement of pins on the component (e.g. number of pins, their positions).
5. Note any codes or markings printed on the component.
6. Note the shape, size, and overall appearance of the component.
7. Note down the observations.
XI Observation table
Table 1: SMD component Identification
XII Result(s)
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2 Interpretation of result 05 %
3 Conclusions 05 %
1. ……………………………......
2. ……………………………......
3. ……………………………......
4. ……………………………......
I Practical Significance:
Testing circuits is crucial for ensuring the proper functioning of electronic systems. Faulty
circuits can lead to malfunction, incorrect outputs, or even damage to other parts of the system.
Testing helps to identify and eliminate these issues before they cause problems in real world
applications.
II Industry / Employer Expected outcome(s)
The aim of this practical is to help the student to attain the following industry identified outcome
through various teaching learning experiences: Use of various Electronic Materials and
Components for relevant electronic applications.
III Course Level Learning outcome(s)
Develop the PCB for the given application.
IV Laboratory Learning outcome(s)
Test any small electronic circuit/system assembled on general purpose PCB and test it.
V Relevant Affective Domain related outcome(s)
1. Follow safe practices
2. Handle electronic components and instruments carefully.
VI. Relevant Theoretical Background:
General Purpose PCB:
Printed Circuit Boards commonly abbreviated as PCB is the base of electronics. The PCB
provides support as well as electrically connects various Electronic Components in the circuit.
General Purpose PCB or Zero PCB or Dotted PCB are perfect for quick prototyping and can be
used by students for projects. These PCB's are also used in Industries for Research and
Development and Testing of small circuits.
A general purpose PCB is a board that has a grid of holes and pads that can be used to connect
various components without a specific layout. You can use wires, jumpers or solder to make the
connections.
Soldering:
Soldering is a process of joining two metal surfaces together using a filler metal called solder.
The soldering process involves heating the surfaces to be joined and melting the solder, which is
then allowed to cool and solidify, creating a strong and durable joint. Figure 11.2 indicates
soldering material required.
Instrument/
Sr. No. Specification Quantity Remark
Components
1 General purpose PCB (5 X 7 cm) or Available size 1
IX Precautions to be followed
1. Handle the soldering iron safely
2. Avoid touching heated components and solder joints with bare fingers
3. Be cautious when soldering near heat-sensitive components such as plastic connectors and
ICs
X Procedure:
1. Assemble LED Circuit on General Purpose PCB using following steps of soldering
a) Set Up Your Space:
Before you start, get a clean and organized workspace. Arrange your tools—soldering iron,
solder wire, flux, and stand. Good ventilation is crucial to clear fumes produced during
soldering.
b) Check Your Components:
Examine what you're soldering. Look for damage, proper orientation and correct positioning
on the board. This step prevents errors during soldering.
c) Choose Your Tools:
Pick the right soldering iron tip based on component size. Use a fine tip for small parts and a
broader one for larger ones. Choose quality solder with the right flux for a clean, reliable
joint.
d) Heat Up the Iron:
Let the soldering iron reach its operating temperature, which usually takes a few minutes. A
well-heated iron ensures efficient heat transfer for effective soldering.
e) Apply Flux:
Add a bit of flux to the joint area. Flux enhances solder wetting and creates a strong
connection. It also reduces oxidation, improving the soldering process.
f) Tin the Iron Tip:
Coat the iron tip with a thin layer of solder. This tinning process boosts heat transfer and aids
soldering. Wipe off excess solder on a damp sponge to keep the tip clean.
g) Heat the Joint:
Place the iron tip on the joint, heating both the component lead and the board pad. Heat the
components evenly for smooth solder flow.
h) Apply Solder:
Introduce solder to the joint, allowing it to melt and form a smooth connection. Avoid excess
solder, as it can cause issues. A steady hand is crucial during this step.
i) Inspect the Joint:
After soldering, visually inspect the joint. A well-soldered joint appears shiny and smooth.
Check for irregularities and touch up joints if needed for a reliable connection.
2. Test LED Circuit on General Purpose PCB by Continuity Testing using Multimeter
XI Observation table:
Table 1-Circuit Continuity Test
1 Battery
2 LED
3 Resistor
XII Result(s)
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XVI References/Suggestions for further reading: include websites/links
1. https://www.aixuntech.com/newsinfo/basic-steps-of-hand-soldering-operation/
2 Interpretation of result 05 %
3 Conclusions 05 %
2. ……………………………......
3. ……………………………......
4. ……………………………......
Practical No.12: Use of open source PCB design simulation software and tools
I Practical significance:
Use of open source PCB design simulation software and tools like eagle, Kicad, PCB, Dip trace,
DesignSpark PCB has significant practical importance in modern electronic design. These tools
empower designers and engineers to create detailed printed circuit board layouts. Accessibility
of open source PCB design simulation software not only reduces cost but also accelerates
innovation. Use of open source PCB design software promotes a more inclusive and dynamic
environment for electronics development.
4. KiCad runs on all major operating systems and a wide range of computer hardware. It
supports PCBs with up to 32 copper layers and is suitable for creating designs of all
complexities.
7. The reverse can often happen: any design changes made in the board layout can be pushed
back to the schematic to keep the two consistent.
8. When the board layout is complete and the board has passed the Design Rules Check (DRC),
fabrication outputs are generated so that the board can be manufactured by a PCB fabricator.
VII Actual Circuit diagram used in laboratory with equipment specifications.
Sr.
Instrument/Components Specification Quantity Remark
No.
Any desktop or laptop computer
with basic configuration and One
installed with software with computer
1 Computer System operating system Windows-7 & System for
Windows-10 or 11 (for latest each student
version of KiCad software )
Open source- KiCad software
2 KiCad software -
version 5.1.4_1 / latest version
IX Precautions to be followed
1. Handle computer with care.
2. Do not turn off the computer while installation is in progress.
X Procedure:
1. Download and install KiCad
● KiCad is available for Windows, macOS, Ubuntu, and many other platforms. Find the
platform alternatives and download the installation files for KiCad here:
http://kicad.org/download/
● Your new project will be empty. It is now your job to first create a schematic, then later draw
the board layout.
● You create the schematic from the Schematic Layout Editor, also called Eeschema.
● Open the editor by double-clicking on the schematic file on the left, or by clicking on the
Schematic Layout Editor button (Figure 12.4).
● From the component chooser, you can search for the component you want to add. Just type
in what you are looking for. For example, if you need a resistor, type in “resistor.” Look
through the list of results and choose a good match.
● Leave the default options and click on the Annotate button. Then close the window.
● Now you can see that the components have numbers: BT1, R1, and D1.
7. Adding Footprints
● Before you can move on to drawing your board, there is one more thing you need to do;
add footprints to your components.
● The footprint is what will be printed onto the board for each component.
● For example, for a through-hole resistor, you will choose a footprint with two holes, so that
you will get two holes for soldering the resistor onto your board.
● Click on the Tools menu and choose Assign footprints
Figure 12.14 An example of a footprint for a resistor. The yellow circles represent holes.
● If you filter by pin count you will only see footprints that have the same number of pins as
your component.
● If you filter by library you will only see footprints from the library that you have selected on
the left.
● The schematic symbol footprint filter will filter based on filtering rules set by the symbol.
What footprint to choose for the battery?
● There are many ways to connect a battery. You can use a battery holder that is fixed onto the
board. You can use a barrel connector. Or how about two pins?
● For 9V batteries though, prefer using a battery clip. It is a clip you fasten to the top of the
battery that has two wires going from it.
● You will find two resistor libraries among the standard KiCad
libraries: Resistor_THT and Resistor_SMD.
● THT stands for Through-Hole Technology. That’s the type of component where you put the
legs into holes on the board and solder on the other side as shown in Figure 12.17. It is the
classic type of component, often used by students as it is a bit simpler to solder.
● The last component is the LED. Choose the LED_THT library to add a through-hole LED.
● A typical LED is 5mm in diameter. There are many 5mm options in the library. A lot of them
have the same footprint but different 3D models. Have a look at the 3D version of a couple
of them to get an idea of the difference. (Right-click and select View Footprint. Then click
on the 3D Display button.)
● Double-click to choose one. You can see sample footprint selections in Figure 12.19
● If there are no errors, you have finished the first phase of drawing the schematic. You can
move on to the second phase – designing your board.
● Click at the beginning of an air-wire to start drawing a track. Click again where the air-wire
ends to finish drawing the track.
● When there are no more white lines, you are done routing the tracks.
Figure 12.31 The button for running the Design Rules Checker (DRC)
● Select the Edge.Cuts layer.
● Click on the Design Rules Checker button, shown in Figure 12.31, or find it under
the Inspect menu. Leave the default options and click on Run DRC button.
● Check both the Problems tab and the Unconnected Items tab. The Problems tab will list any
design issues, such as a track being too close to another track. The Unconnected Items tab
will list any air-wires that you have not yet connected by drawing a track.
Figure 12.32 The Design Rules Checker window without any errors
● If you see any items on any of these tabs, make sure you fix them before moving on.
● If you have errors, fix them and run the DRC again.
● When you have zero errors listed here, Your board is finished!
● Click on the View menu and select 3D Viewer to see your finished board.
XI Observations:
Picture of the designed circuit in KiCad (eagle/ PCB/ Dip trace/ DesignSpark PCB):
Picture of the designed PCB in KiCad(eagle/ PCB/ Dip trace/ Design Spark PCB):
XII Result(s)
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2 Interpretation of result 05 %
3 Conclusions 05 %
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4. ……………………………......
I Practical Significance:
The acronym PCB stands for Printed Circuit Board. PCBs are the backbone of most electronics
industries. PCBs offer several advantages including compact design, improved reliability,
reduced electronic noise, ease of mass production and efficient heat dissipation. They streamline
the assembly process, enhance electrical performance, and enable miniaturization of electronic
devices. PCBs enhance reliability by minimizing loose connections and reducing the risk of short
circuits. The standardized design and automated manufacturing processes ensure consistent
quality. Additionally, the soldering of components onto the PCB improves their stability and
durability.
II Industry / Employer Expected outcome(s)
The aim of this practical is to help the student to attain the following industry identified outcome
through various teaching learning experiences: Use of various Electronic Materials and
Components for relevant electronic applications.
III Course Level Learning outcome(s)
Develop the PCB for the given application.
IV Laboratory Learning outcome(s)
Identification of types of PCB.
V Relevant Affective Domain related outcome(s)
1. Follow safe practices.
2. Handle electronic components and instruments carefully.
VI Relevant Theoretical Background
PCB- A printed circuit board (PCB) is a non-conductive substrate used to mechanically support
and electrically connect electronic components using conductive pathways or traces etched from
copper sheets laminated onto the substrate. PCBs provide the foundation for almost all modern
electronic equipment and enable the physical implementation, connectivity and packaging of
circuit designs. PCBs are most commonly made from fiberglass, composite epoxy or another
composite material.
Key elements of a PCB include:
1. Substrate material – commonly FR-4 glass epoxy or other insulating material
2. Conductive layers – copper foils laminated on substrate to create signal traces
3. Pads/lands – widened areas of copper traces for soldering components
4. Plated through holes (PTHs) – plated barrel interconnects between layers
5. Solder mask – insulating layer covering exposed copper from oxidation and short circuits
6. Silkscreen – printed component outlines and identifiers
PCBs are designed to meet specific requirements and applications for industrial, consumer and
other appliances. Different Types of PCBs are as follows.
3. Multilayer PCB:
According to the nature of the PCB substrate, PCBs are classified as,
1. Rigid PCB
2. Flexible PCB
3. Rigid-Flexible PCB
1. Rigid PCB :
Rigid PCBs are made out of a solid and inflexible substrate material such as fiberglass that
prevents the board from twisting. Example of a rigid PCB is a computer motherboard. The
motherboard is a multilayer PCB designed to allocate electricity from the power supply while
simultaneously allowing communication between all of the many parts of the computer, such as
CPU, GPU and RAM.
All Rigid PCBs have single-layer, double-layer or multilayer constructions, so they all share the
same applications.
2. Flexible PCB:
Flexible PCBs can flex and move or twisted without damaging the circuits. This means they can
be folded over edges and wrapped around corners. Flexible PCB is made of flexible substrate
materials such as plastic (thin insulating polymer film), polyimide etc. Lower thickness, space
saving, reduced weight and size, increased freedom in designing, low number of device
interconnects, shock and vibration resistant, easy transportation, these benefits make flexible
PCBs ideally fit for a wide range of applications in industries such as Military, Transportation,
Medical, Consumer Electronics, Automotive, Aerospace, Communications.
VII Actual tools / Circuit diagram used in a laboratory with equipment specifications.
Figure 13.11 3x2 inches Phenolic Single Sided Plain Copper Clad Board (PCB)
Sr. Instrument/
Specification Quantity Remark
No. Components
3x2 inches or available size Phenolic Single
Single Sided Sided Plain Copper Clad Board (PCB),
1 1 each
PCB 5x7 cm or available size Single Side
Prototype Board.
Double Sided 5x7 cm or available size Double Sided
2 1
PCB Universal PCB Prototype Board
3 Flexible PCB Available size or used in any application 1
IX Precautions to be followed:
1. Handle PCBs with care.
X Procedure:
A. Steps for PCB Identification
1. Observe the given PCB.
2. Identify solder side and component side.
3. Observe base material.
4. Observe the tracks.
5. Identify the type of PCB.
XI Observation table:
Table 1: Identification of types of PCBs
Sr. PCB Type of PCB (Single Sided Plain PCB/ Single Sided prototype/
No No. Double Sided/ Flexible)
1 1
2 2
3 3
4 4
XII Result(s)
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2 Interpretation of result 05 %
3 Conclusions 05 %
1. ……………………………......
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3. ……………………………......
4. ……………………………......
I Practical significance:
Solar cells, also known as photovoltaic cells, are devices that convert light energy directly into
electricity through the photovoltaic effect. They are a key technology in renewable energy
systems, allowing for the harnessing of sunlight to generate electricity.
Solar cells are often grouped together to form solar panels or solar arrays, which can be installed
on rooftops, in solar farms, or integrated into various devices to provide clean and renewable
electricity. They play a crucial role in the transition to sustainable energy sources and reducing
dependence on fossil fuels.
II Industry / Employer Expected outcome(s)
The aim of this practical is to help the student to attain the following industry identified outcome
through various teaching learning experiences: Use of various Electronic Materials and
Components for relevant electronic applications.
III Course Level Learning outcome(s)
Use specific components for roof top Solar Energy Systems
IV Laboratory Learning outcome(s)
Plot V-I Characteristics of the solar cell.
V Relevant Affective Domain related outcome(s)
1. Follow safe practices.
2. Handle electronic components and instruments carefully.
VI Relevant Theoretical Background
Solar cells are typically made of semiconductor materials such as silicon, which are capable of
absorbing photons (light particles) and releasing electrons, creating an electric current. When
sunlight hits the solar cell, photons transfer their energy to electrons in the semiconductor
material, causing them to become mobile and generate an electric current.
There are several types of solar cells, including monocrystalline, polycrystalline, and thin-film
solar cells, each with its own advantages and disadvantages in terms of efficiency, cost, and
manufacturing process.
The V-I (voltage-current) characteristics of a solar cell describe its behavior in terms of voltage
and current under different conditions of load resistance.
Open Circuit Condition (Voc): When no load is connected to the solar cell, the voltage across
the terminals is at its maximum value, known as the open-circuit voltage (Voc). At this point,
the current is zero because there is no external circuit for the electrons to flow through.
Short Circuit Condition (Isc): In the short circuit condition, where the terminals of the solar
cell are directly connected without any load resistance, the current is at its maximum value,
known as the short-circuit current (Isc). At this point, the voltage across the terminals is zero
because the circuit is effectively shorted.
Operating Point (Vmp, Imp): In practical applications, the solar cell operates at a point between
the open-circuit and short-circuit conditions, known as the maximum power point (MPP). At this
point, both the voltage and current are at intermediate values, denoted as Vmp (voltage at
maximum power) and Imp (current at maximum power). The solar cell delivers the maximum
power output to the load at this operating point.
Understanding the V-I characteristics is crucial for designing and optimizing solar photovoltaic
systems to ensure maximum efficiency and power output under varying operating conditions.
These characteristics help engineers and researchers evaluate the performance of solar cells and
predict their behaviour in different environments.
The electromotive force (e.m.f.) generated by the photo-voltaic cell in the open circuit, i.e. when
no current is drawn from it is denoted by VOC (V-open circuit). This is the maximum value of
electromotive force (e.m.f.).When a high resistance is introduced in the external circuit, a small
current flows through it and the voltage decreases.
The voltage goes on falling and the current goes on increasing as the resistance in the external
circuit is reduced. When the resistance is reduced to zero the current rises to its maximum value
known as saturation current and is denoted as ISC, the voltage becomes zero.
Determination of fill factor:
The product of open circuit voltage VOC and short circuit current ISC is known as an ideal power.
Ideal Power = VOC × ISC
The maximum useful power is the area of the largest rectangle that can be formed under the V-I
curve. If Vmp and Imp are the values of voltage and current under this condition, then,
Maximum useful power, Pmax= Vmp × Imp
The ratio of the maximum useful power to ideal power is called the fill factor.
Fill factor = (VOC × ISC)/ (Vmp × Imp)
IX Precautions to be followed:
1. Connect voltmeter and ammeter in correct polarities.
2. Light from the lamp should fall normally on the cell.
3. A resistance in the cell circuit should be introduced so that the current does not exceed the
safe operating limit.
X Procedure:
1. Place the solar cell and the light source (100 watt lamp) opposite to each other on a wooden
plank. Connect the circuit as shown in Figure 14.3
2. Select the voltmeter range to 5V, current meter range to 100mA
3. Switch ON the lamp to expose the light on the Solar Cell
4. Set the distance between the solar cell and lamp in such a way that the current meter shows
maximum deflection.
5. Keep resistance maximum (disconnect the resistance, make open circuit) and note down open
circuit voltage, VOC.
6. Keep load resistance minimum and note down short circuit current, ISC.
7. Vary the load resistance and note down the current and voltage readings in Table1.
8. Plot a graph between output voltage vs. output current by taking voltage along X-axis and
current along the Y-axis.
XI Observation table:
1. Voltage reading for open circuit, VOC = ………..Volts.
Sr. Load
Voltage (V) Current (mA) Power(mW)
No. Resistance (RL)
1 10 Ω
2 20 Ω
3 50 Ω
4 100Ω
5 200Ω
6 400Ω
7 700Ω
8 1KΩ
Calculations:
From the Graph:
1. Value of Vmp = ……. volts
XII Result(s)
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XVI References/Suggestions for further reading: include websites/links
1. https://en.wikipedia.org/wiki/Solar_cell
2. https://www.electrical4u.com/characteristics-and-parameters-of-a-solar-cell/
3. https://www.britannica.com/technology/solar-cell
2 Interpretation of result 05 %
3 Conclusions 05 %
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I Practical significance:
Solar panels can be particularly useful in remote or off-grid areas where traditional power sources
are impractical or unavailable. The experiment demonstrates the potential for solar energy to
provide electricity in such locations, promoting energy access and development. By successfully
using solar panels to drive a small load, the experiment demonstrates the feasibility of solar
energy applications. This can inspire further research and investment in larger-scale solar
projects.
Solar panels operate on the principle of the photovoltaic effect, where certain materials generate
an electric current when exposed to sunlight. Photons from sunlight excite electrons in the
material, creating an electric potential. This potential can be harnessed to generate electricity.
Solar cells are typically made of semiconductors like silicon. Solar panels are usually arranged
in groups called arrays or systems. A photovoltaic system consists of one or more solar panels,
an inverter that converts DC electricity to alternating current (AC) electricity, and sometimes
other components such as controllers, meters, and trackers. Solar panels are used in various
industries as per the necessity and requirement.
Figure: 15.2 Use of Solar Panel to drive small load (LED circuit)
IX Precautions to be followed:
1. Remove any electronic equipment you are doing testing or working on from the power
source.
2. Never assume the power circuit is off.
3. Don’t connect power to a circuit until you’re done working on it and rechecked the work.
4. Always ensure that all electronics equipment are properly grounded.
X Procedure:
1. Set up a workspace in a well-lit area or use a controlled light source.
2. Place the solar panel in direct sunlight or under the light source.
3. Ensure all electrical components are in good working condition.
4. Connect the positive (+) and negative (-) terminals of the solar panel to the positive and
negative rails on a breadboard.
5. Use connecting wires to link the solar panel to the breadboard securely.
6. Connect the small electrical load (LED bulb, fan or DC motor) to the breadboard.
7. Ensure proper polarity when connecting the load to the breadboard.
8. Check the status of the LED for high light and low light conditions..
XI Observation table:
Table 1: LED driven by Solar panel cell
XII Result(s)
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XVI References/Suggestions for further reading: include websites/links
1 https://www.literoflightusa.org/how-are-solar-panels-made/
2 https://www.slideshare.net/salmansmd/procedure-sheet-for-the-experiment-solar-cell
3 https://www.alternative-energy-tutorials.com/photovoltaics/solar-cell-i-v-characteristic.html
2 Interpretation of result 05 %
3 Conclusions 05 %
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Practical No.16: Voltage and current measurement using series and parallel
connection of batteries
I Practical significance:
Series connection of solar cells is needed to increase the voltage output of the solar panel. By
connecting solar cells in series, the voltage of each cell adds up, resulting in a higher total voltage
output. This is important for many applications where higher voltage is required, such as charging
batteries or connecting to inverters for grid-tied systems.
Parallel connection of solar cells is needed to increase the current output of the solar panel. By
connecting solar cells in parallel, the current produced by each cell adds up, resulting in a higher
total current output. This is useful in applications where high current is required, such as
powering high-current devices or systems with low-voltage but high-current requirements.
Additionally, parallel connection helps reduce the impact of shading or mismatch between cells,
as each cell operates independently.
II Industry / Employer Expected outcome(s)
The aim of this practical is to help the student to attain the following industry identified outcome
through various teaching learning experiences: Use of various Electronic Materials and
Components for relevant electronic applications.
III Course Level Learning outcome(s)
Use specific components for roof top Solar Energy Systems.
IV Laboratory Learning outcome(s)
Measure voltage and current by connecting three batteries first in series and then parallel each
having rating of 6V, 2A.
V Relevant Affective Domain related outcome(s)
1. Follow safe practices.
2. Handle electronic components and instruments carefully.
Solar cells can be connected in series to increase the output voltage, shown in Figure 16.1.Total
voltage is equal to the sum of individual voltages. Solar cells in series are termed string. Because
solar cells are not perfectly identical, the total current flowing through a string is equal to the
lowest value of the solar cell.
Figure 16.3 V-I Characteristics of Series and parallel combinations of Solar cell
By strategically combining solar cells in series, parallel, or a combination of both, PV system
designers can tailor the system to meet specific voltage, current, and power requirements for
various applications, maximizing the efficiency and effectiveness of the solar power generation
system
Instrument
Sr. No. /Components Specification Quantity Remark
Sunlight/Lamp-
1 Light Source irradiance 1000W/m2 1
X Procedure:
XI Observation table:
Table 1: Voltage and current measurement for Solar cells in series
2 0.1
3 0.3
4 0.5
5 1
6 5
7 10
8 100
9 1K
10 10K
2 0.1
3 0.3
4 0.5
5 1
6 5
7 10
8 100
9 1K
10 5K
2. I series=__________________
B. When solar cells are connected in parallel
1. V parallel=_______________
2. I parallel=________________
XII Result(s)
Observe the plotted graphs and write:
A. When solar cells are connected in series
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2 Interpretation of result 05 %
3 Conclusions 05 %
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