Workstation W30 Rev2

Mainboard
Technical Product Specification
Contents

1 Product Description
1.1 Overview ......................................................................................... 11
1.1.1 Feature Summary ................................................................. 11
1.1.2 Board Layout ........................................................................ 13
1.1.3 Block Diagram ...................................................................... 15
1.2 Legacy Considerations ....................................................................... 16
1.3 Online Support ................................................................................. 16
1.4 Processor ........................................................................................ 16
1.4.1 PCI Express x16 Graphics ....................................................... 17
1.5 System Memory ............................................................................... 17
1.5.1 Memory Configurations .......................................................... 19
1.6 Intel® X79 Express Chipset ................................................................ 21
1.6.1 USB ..................................................................................... 21
1.6.2 SATA Interfaces .................................................................... 22
1.7 Real-Time Clock Subsystem ............................................................... 23
1.8 Legacy I/O Controller ........................................................................ 23
1.8.1 Consumer Infrared (CIR) ........................................................ 23
1.9 Audio Subsystem .............................................................................. 24
1.9.1 Audio Subsystem Software ..................................................... 24
1.9.2 Audio Subsystem Components ................................................ 24
1.10 LAN Subsystem ................................................................................ 26
1.10.1 Intel® 82579L and Intel® 82574L Gigabit Ethernet Controllers .... 26
1.10.2 LAN Subsystem Software ....................................................... 27
1.10.3 RJ-45 LAN Connector with Integrated LEDs .............................. 27
1.11 Bluetooth*/WiFi Module ..................................................................... 28
1.11.1 Bluetooth Technology ............................................................ 28
1.11.2 WiFi 802.11 Wireless ............................................................. 29
1.12 Hardware Management Subsystem ..................................................... 29
1.12.1 Hardware Monitoring and Fan Control ...................................... 29
1.12.2 Fan Monitoring ...................................................................... 30
1.12.3 Chassis Intrusion and Detection .............................................. 30
1.12.4 Thermal Monitoring ............................................................... 31

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Workstation W30 Rev2 Board Technical Product Specification

1.13 Power Management .......................................................................... 32

1.13.1 ACPI .................................................................................... 32
1.13.2 Hardware Support ................................................................. 35
1.14 Board Status LEDs ............................................................................ 38
1.15 Onboard Power and Reset Buttons ...................................................... 41
2 Technical Reference
2.1 Memory Resources ........................................................................... 43
2.1.1 Addressable Memory.............................................................. 43
2.1.2 Memory Map ......................................................................... 45
2.2 Connectors and Headers .................................................................... 45
2.2.1 Back Panel Connectors ........................................................... 46
2.2.2 Component-side Connectors and Headers................................. 48
2.3 Jumper Block ................................................................................... 58
2.4 Mechanical Considerations ................................................................. 60
2.4.1 Form Factor .......................................................................... 60
2.5 Electrical Considerations .................................................................... 61
2.5.1 Power Supply Considerations .................................................. 61
2.5.2 Fan Header Current Capability ................................................ 62
2.5.3 Add-in Board Considerations ................................................... 62
2.6 Thermal Considerations ..................................................................... 63
2.7 Reliability ........................................................................................ 65
2.8 Environmental .................................................................................. 65
3 Overview of BIOS Features
3.1 Introduction ..................................................................................... 67
3.2 BIOS Flash Memory Organization ........................................................ 68
3.3 Resource Configuration ..................................................................... 68
3.3.1 PCI Autoconfiguration ............................................................ 68
3.4 System Management BIOS (SMBIOS) ................................................. 69
3.5 Legacy USB Support ......................................................................... 69
3.6 BIOS Updates .................................................................................. 70
3.6.1 Language Support ................................................................. 70
3.6.2 Custom Splash Screen ........................................................... 71
3.7 BIOS Recovery ................................................................................. 71
3.8 Boot Options .................................................................................... 72
3.8.1 Optical Drive Boot ................................................................. 72
3.8.2 Network Boot........................................................................ 72
3.8.3 Booting Without Attached Devices ........................................... 72
3.8.4 Changing the Default Boot Device During POST......................... 72
3.9 Adjusting Boot Speed ........................................................................ 73
3.9.1 Peripheral Selection and Configuration ..................................... 73
3.9.2 BIOS Boot Optimizations ........................................................ 73
3.10 BIOS Security Features ..................................................................... 74
3.11 BIOS Performance Features ............................................................... 75

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4 Error Messages and Beep Codes

4.1 Speaker .......................................................................................... 77
4.2 BIOS Beep Codes ............................................................................. 77
4.3 Front-panel Power LED Blink Codes ..................................................... 78
4.4 BIOS Error Messages ........................................................................ 78
4.5 Port 80h POST Codes ........................................................................ 79
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance ...................................................................... 85
5.1.1 Safety Standards................................................................... 85
5.1.2 European Union Declaration of Conformity Statement ................ 86
5.1.3 Product Ecology Statements ................................................... 87
5.1.4 EMC Regulations ................................................................... 89
5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 92
5.1.6 Regulatory Compliance Marks (Board Level) ............................. 93
5.2 Battery Disposal Information.............................................................. 94

Figures
1. Major Board Components .................................................................. 13
2. Block Diagram .................................................................................. 15
3. Memory Channel and DIMM Configuration............................................ 20
4. Back Panel Audio Connectors ............................................................. 25
5. LAN Connector LED Locations ............................................................. 27
6. Bluetooth/WiFi Module ...................................................................... 28
7. Thermal Sensors and Fan Headers ...................................................... 31
8. Location of Board Status LEDs ............................................................ 39
9. Location of the Onboard Power and Reset Buttons ................................ 41
10. Detailed System Memory Address Map ................................................ 44
11. Back Panel Connectors ...................................................................... 46
12. I/O Shield Reference Diagram ............................................................ 47
13. Component-side Connectors and Headers ............................................ 48
14. Connection Diagram for Front Panel Header ......................................... 55
15. Connection Diagram for Front Panel USB 2.0 Headers ........................... 57
16. Location of the Jumper Block ............................................................. 58
17. Board Dimensions ............................................................................. 60
18. Localized High Temperature Zones ..................................................... 64

Tables
1. Feature Summary ............................................................................. 11
2. Components Shown in Figure 1 .......................................................... 14
3. Supported Memory Configurations ...................................................... 18
4. Audio Jack Support ........................................................................... 24
5. LAN Connector LED States ................................................................. 27
6. Effects of Pressing the Power Switch ................................................... 32
7. Power States and Targeted System Power ........................................... 33

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Workstation W30 Rev2 Board Technical Product Specification

8. Wake-up Devices and Events ............................................................. 34

9. Board Status LEDs ............................................................................ 40
10. System Memory Map......................................................................... 45
11. Component-side Connectors and Headers Shown in Figure 13 ................ 49
12. Front Panel Audio Header for Intel HD Audio ........................................ 50
13. Front Panel Audio Header for AC ’97 Audio ........................................... 50
14. IEEE 1394a Header ........................................................................... 51
15. SATA Connectors .............................................................................. 51
16. S/PDIF Header ................................................................................. 51
17. USB 2.0 Headers .............................................................................. 51
18. USB 3.0 Connector ........................................................................... 52
19. Chassis Intrusion Header ................................................................... 52
20. Processor, Front and Rear Chassis, and Auxiliary (4-Pin) Fan Headers ..... 52
21. Processor Core Power Connector ........................................................ 54
22. Main Power Connector ....................................................................... 54
23. Front Panel Header ........................................................................... 55
24. States for a One-Color Power LED....................................................... 56
25. States for a Two-Color Power LED....................................................... 56
26. BIOS Setup Configuration Jumper Settings .......................................... 59
27. Recommended Power Supply Current Values........................................ 61
28. Fan Header Current Capability ............................................................ 62
29. Thermal Considerations for Components .............................................. 64
30. Environmental Specifications .............................................................. 65
31. BIOS Setup Program Menu Bar........................................................... 68
32. BIOS Setup Program Function Keys .................................................... 68
33. Acceptable Drives/Media Types for BIOS Recovery................................ 71
34. Boot Device Menu Options ................................................................. 72
35. Supervisor and User Password Functions ............................................. 74
36. BIOS Beep Codes ............................................................................. 77
37. Front-panel Power LED Blink Codes ..................................................... 78
38. BIOS Error Messages ........................................................................ 78
39. Port 80h POST Code Ranges .............................................................. 79
40. Port 80h POST Codes ........................................................................ 80
41. Typical Port 80h POST Sequence ........................................................ 84
42. Safety Standards .............................................................................. 85
43. EMC Regulations ............................................................................... 89
44. Regulatory Compliance Marks ............................................................ 93

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1 Product Description

1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor ATX (12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters])
Processor • Intel® Core™ i7 and Intel® Xeon® processors in an LGA 2011 socket:
― Two PCI Express 3.0 x16 graphics interfaces
― One PCI Express 3.0 x16 graphics interface (x8 electrical)
― Four DDR3 memory channels (Quad Channel total of 8 DIMMs)
Memory • Eight 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
arranged as four channels
• Support for DDR3 2400 MHz, 2133 MHz, 1866 MHz, 1600 MHz, 1333 MHz, and
1066 MHz DIMMs
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 64 GB of system memory with eight DIMMs using 4 Gb
memory technology
• Support for non-ECC and ECC memory
• Support for 1.35 V low voltage JEDEC memory
• Support for XMP memory
• Support for manual memory over clocking (voltage, clock, ratio)
Chipset Intel® X79 Express Chipset consisting of the Intel® X79 Platform Controller
Hub (PCH)
Audio Intel® High Definition Audio subsystem using the Realtek* ALC892 audio codec
Legacy I/O Control Nuvoton* legacy I/O controller for Consumer Infrared (CIR)
Peripheral Six USB 3.0 ports:
Interfaces • Four USB 3.0 ports are implemented with stacked back panel connectors
(blue)
• Two front panel USB 3.0 ports are implemented through one internal connector
(blue)
• Fourteen USB 2.0 ports:
― Six ports are implemented with stacked back panel connectors (black)
― Eight front panel ports implemented through four internal headers
Eight Serial ATA (SATA) ports:
• Two SATA 6.0 Gb/s interfaces through the Intel X79 Express Chipset with
Intel® Rapid Storage Technology RAID support (blue)
• Two Serial ATA (SATA) 6.0 Gb/s interfaces through a Marvell 88SE9128
controller (gray)
• Four internal SATA 3.0 Gb/s interfaces through the Intel X79 Express Chipset
with Intel Rapid Storage Technology RAID support (black)
• Two IEEE 1394a ports:
― One port via a back panel connector
― One port via a front-panel header (blue)
Wireless Module • Separate module that provides both Bluetooth* and WiFi is included

continued

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Workstation W30 Rev2 Board Technical Product Specification

Table 1. Feature Summary (continued)

BIOS • Intel® BIOS resident in the SPI Flash device
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
• Fast Boot
• Support for advanced over clocking
Instantly Available • Support for PCI* Local Bus Specification Revision 2.3
PC Technology • Support for PCI Express* Revision 3.0
• Suspend to RAM support
• Wake on PCI, PCI Express, LAN, front panel, CIR, and USB ports
LAN Support Dual-Gigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel® 82579L and
Intel® 82574L Gigabit Ethernet Controllers
Expansion • Two PCI Express 3.0 x16 connectors
Capabilities • One PCI Express 3.0 x16 connector (x8 electrical)
• Two PCI Express 2.0 x1 bus add-in card connectors from the PCH
• One Conventional PCI bus add-in card connector from the PCH
Hardware Monitor • Hardware monitoring and fan control through the Nuvoton I/O controller
Subsystem • Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Four fan headers using PWM control
• Four fan sense inputs used to monitor fan activity
• Fan speed control using voltage control (4-pin fan headers for processor, front,
rear, and auxiliary) with selectable support in BIOS for 3 wire fans
• Support for Platform Environmental Control Interface (PECI)

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 Product Description

1.1.2 Board Layout

Figure 1 shows the location of the major components on Workstation W30 Rev2 Board.

Figure 1. Major Board Components

Table 2 lists the components identified in Figure 1.

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Workstation W30 Rev2 Board Technical Product Specification

Table 2. Components Shown in Figure 1

Label Description
A Front panel audio header
B PCI Express x1 add-in card connector
C S/PDIF out header
D PCI Express 3.0 x16 add-in card connector (x8 electrical)
E Piezoelectric speaker
F Conventional PCI add-in card connector
G PCI Express 3.0 x16 add-in card connector
H PCI Express x1 add-in card connector
I PCI Express 3.0 x16 add-in card connector
J Rear chassis fan header
K Battery
L Back panel connectors
M Processor fan header
N DIMM 1 (Channel A, DIMM 0)
O DIMM 5 (Channel A, DIMM 1)
P DIMM 2 (Channel B, DIMM 0)
Q DIMM 6 (Channel B, DIMM 1)
R LGA 2011 processor socket
S 12 V processor core voltage connector (2 x 4 pin)
T DIMM 8 (Channel D, DIMM 1)
U DIMM 4 (Channel D, DIMM 0)
V DIMM 7 (Channel C, DIMM 1)
W DIMM 3 (Channel C, DIMM 0)
X Main power connector (2 x 12 pin)
Y Remote thermal probe header
Z Front chassis fan header
AA SATA 6.0 Gb/s connectors through the PCH (blue)
BB SATA 3.0 Gb/s connectors through the PCH (black)
CC SATA 6.0 Gb/s connectors through a Marvell 88SE9128 controller (gray)
DD Intel X79 Express Chipset
EE Front panel USB 2.0 headers (4)
FF Consumer IR emitter (output) header
GG BIOS Setup configuration jumper block
HH Power Fault LED
II Front panel USB 3.0 connector
JJ Alternate front panel power LED header
KK Consumer IR receiver (input) header
LL Voltage measurement test points
MM Front panel header
NN Post Code LED display
OO Front panel IEEE 1394a header
PP Onboard Reset button
QQ Onboard Power button
RR Chassis intrusion header
SS Auxiliary fan header
TT Board Status LEDs

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 Product Description

1.1.3 Block Diagram

Figure 2 is a block diagram of the major functional areas of the board.

Figure 2. Block Diagram

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Workstation W30 Rev2 Board Technical Product Specification

1.4 Processor
The board is designed to support Intel Core i7 and Intel Xeon processors in an
LGA 2011 socket.
Other processors may be supported in the future. This board is designed to support
processors with a maximum wattage of 130 W with margin to allow for greater than
200 W operation. The processors listed above are only supported when falling within
the wattage requirements of the Workstation W30 Rev2 Board. See the Intel web site
listed below for the most up-to-date list of supported processors.

For information about… Refer to:

Supported processors http://processormatch.intel.com

CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.

NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.5.1 on page 61 for information on power supply requirements for this board.

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 Product Description

1.4.1 PCI Express x16 Graphics

Intel Core i7 and Intel Xeon processors in an LGA2011 package support PCI Express
add-in graphics cards via the board’s PCI Express x16 connectors. These processors
support the following generations of PCI Express:
• PCI Express 3.0 with a raw bit rate of 8.0 GT/s results in an effective bandwidth of
8.0 Gb/s each direction per lane. The maximum theoretical bandwidth of the x16
interface is 16 GB/s in each direction, simultaneously, for a bandwidth of 32 GB/s.
• PCI Express 2.x with a raw bit rate of 5.0 GT/s results in an effective bandwidth of
4.0 Gb/s each direction per lane. The maximum theoretical bandwidth of the x16
interface is 8 GB/s in each direction, simultaneously, for a bandwidth of 16 GB/s.
• PCI Express 1.x with a raw bit rate of 2.5 GT/s results in an effective bandwidth of
2.0 Gb/s each direction per lane. The maximum theoretical bandwidth of the x16
interface is 4 GB/s in each direction, simultaneously, for a bandwidth of 8 GB/s.
For information about Refer to
PCI Express technology http://www.pcisig.com

1.5 System Memory

The board has eight DIMM sockets and supports the following memory features:
• 1.35 V DDR3 SDRAM DIMMs (JEDEC Specification)
• Four independent memory channels with interleaved mode support
• Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMs with x16 organization are not supported.
• 64 GB maximum total system memory (using 4 Gb memory technology). Refer to
Section 2.1.1 on page 43 for information on the total amount of addressable
memory.
• Minimum total system memory: 1 GB using 512 MB x16 module
• Non-ECC and ECC DIMMs
• Serial Presence Detect
• DDR3 2400 MHz, 2133 MHz, 1866 MHz, 1600 MHz, 1333 MHz, and 1066 MHz
SDRAM DIMMs
• XMP performance profile support for memory speeds above 1600 MHz
• Full support for over clocking memory (see
www.intel.com/support/motherboards/desktop/sb/CS-031689.htm for more
information about over clocking)
• DIMM slots are numbered in installation order

NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance.

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Workstation W30 Rev2 Board Technical Product Specification

CAUTION
1.5 V is the recommended and default setting for DDR3 memory voltage. The other
memory voltage settings in the BIOS Setup program are provided for performance
tuning purposes only. Altering the memory voltage may (i) reduce system stability
and the useful life of the system, memory, and processor; (ii) cause the processor
and other system components to fail; (iii) cause reductions in system performance;
(iv) cause additional heat or other damage; and (v) affect system data integrity.

Table 3 lists the supported DIMM configurations.

Table 3. Supported Memory Configurations

DIMM SDRAM SDRAM Organization Number of SDRAM
Capacity Configuration (Note) Density Front-side/Back-side Devices
512 MB SS 1 Gbit 64 M x16/empty 4
1024 MB SS 1 Gbit 128 M x8/empty 8
1024 MB SS 2 Gbit 128 M x16/empty 4
2048 MB DS 1 Gbit 128 M x8/128 M x8 16
2048 MB SS 2 Gbit 128 M x16/empty 8
4096 MB DS 2 Gbit 256 M x8/256 M x8 16
4096 MB SS 4 Gbit 512 M x8/empty 8
8192 MB DS 4 Gbit 512 M x8/512 M x8 16
Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to

1.5.1 Memory Configurations

The Intel Core i7 and Intel Xeon processors support the following types of memory
organization:
• Quad channel (Interleaved) mode. This mode offers the highest throughput for
real world applications.
• Tri channel (Interleaved) mode. Tri channel mode is enabled when the installed
memory capacities of any three DIMM channels are equal.
• Dual channel (Interleaved) mode. Dual channel mode is enabled when the
installed memory capacities of both DIMM channels are equal. Technology and
device width can vary from one channel to the other but the installed memory
capacity for each channel must be equal. If different speed DIMMs are used
between channels, the slowest memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.

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 Product Description

1.5.1 Memory Configurations

The Intel Core i7 and Intel Xeon processors support the following types of memory
organization:
• Quad channel (Interleaved) mode. This mode offers the highest throughput for
real world applications.
• Tri channel (Interleaved) mode. Tri channel mode is enabled when the installed
memory capacities of any three DIMM channels are equal.
• Dual channel (Interleaved) mode. Dual channel mode is enabled when the
installed memory capacities of both DIMM channels are equal. Technology and
device width can vary from one channel to the other but the installed memory
capacity for each channel must be equal. If different speed DIMMs are used
between channels, the slowest memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.

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Workstation W30 Rev2 Board Technical Product Specification

Figure 3 illustrates the memory channel and DIMM configuration.

Figure 3. Memory Channel and DIMM Configuration

NOTE
For best memory performance always install memory into the blue DIMM memory
sockets if installing four DIMMs or less in your configuration.

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 Product Description

1.6 Intel® X79 Express Chipset

The Intel X79 Express Chipset consisting of the Intel X79 Platform Controller Hub
(PCH) provides interfaces to the processor and the USB, SATA, LAN, PCI, and PCI
Express interfaces. The PCH is a centralized controller for the board’s I/O paths.

For information about Refer to

The Intel X79 Express Chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2

1.6.1 USB
The board supports up to 14 USB 2.0 ports and six USB 3.0 ports.
The Intel X79 Express Chipset provides the USB controller for the 2.0 ports. The six
USB 3.0 ports are provided by two NEC* UPD720200 controllers. The port
arrangement is as follows:
• Four USB 3.0 ports are implemented with stacked back panel connectors (blue)
• Two USB 3.0 front panel ports implemented through one internal connector (blue)
• Six USB 2.0 ports are implemented with stacked back panel connectors (black)
• Eight USB 2.0 front panel ports implemented through four internal headers
All 20 USB ports are high-speed, full-speed, and low-speed capable. The USB 3.0 ports
are super-speed capable.

NOTE
Computer systems that have an unshielded cable attached to a USB port may not
meet FCC Class B requirements, even if no device is attached to the cable. Use a
shielded cable that meets the requirements for full-speed devices.

For information about Refer to

The location of the USB connectors on the back panel Figure 11, page 46
The location of the front panel USB headers Figure 13, page 48

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Workstation W30 Rev2 Board Technical Product Specification

1.6.2 SATA Interfaces

The board provides eight SATA connectors which support one device per connector:
• Two internal SATA 6.0 Gb/s connectors through the PCH (blue)
• Two internal SATA 6.0 Gb/s connectors through a Marvell 88SE9128 controller
(gray)
• Four internal SATA 3.0 Gb/s connectors through the PCH (black)
The PCH provides independent SATA ports with a theoretical maximum transfer rate of
6.0 Gb/s for four ports and 3.0 Gb/s for four ports. A point-to-point interface is used
for host to device connections.
The underlying SATA functionality is transparent to the operating system. The SATA
controller can operate in both legacy and native modes. In legacy mode, standard IDE
I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI
Conventional bus resource steering is used. Native mode is the preferred mode for
configurations using the Microsoft Windows* XP, Windows Vista*, and Windows 7
operating systems.

NOTE
Many SATA drives use new low-voltage power connectors and require adapters or
power supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/.

For information about Refer to

The location of the SATA connectors Figure 13, page 48

1.6.2.1 SATA RAID

The board supports the following RAID (Redundant Array of Independent Drives) levels
via the PCH:
• RAID 0 - data striping
• RAID 1 - data mirroring
• RAID 0+1 (or RAID 10) - data striping and mirroring
• RAID 5 - distributed parity

NOTE
In order to use supported RAID features, you must first enable RAID in the BIOS. Also,
during Microsoft Windows XP installation, you must press F6 to install the RAID
drivers. See your Microsoft Windows XP documentation for more information about
installing drivers during installation. Both Microsoft Windows Vista and Microsoft
Windows 7 include the necessary RAID drivers for both AHCI and RAID without the
need to install separate RAID drivers using the F6 switch in the operating system
installation process.

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 Product Description

1.7 Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at
25 ºC with 3.3 VSB applied via the power supply 5V STBY rail.

NOTE
If the battery and AC power fail, date and time values will be reset and the user will be
notified during POST.

When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.

1.8 Legacy I/O Controller

The I/O controller provides the following features:
• Consumer Infrared (CIR) headers
• Serial IRQ interface compatible with serialized IRQ support for PCI systems
• Intelligent power management, including a programmable wake-up event interface
• PCI power management support
The BIOS Setup program provides configuration options for the I/O controller.

1.8.1 Consumer Infrared (CIR)

The Consumer Infrared (CIR) feature is designed to comply with Microsoft Consumer
Infrared usage models. Microsoft Windows Vista and Microsoft Windows 7 are the
supported operating systems.
The CIR feature is made up of two separate pieces: the receiving (receiver) header,
and the output (emitter) header. The receiving header consists of a filtered translated
infrared input compliant with Microsoft CIR specifications, and also a “learning”
infrared input. This learning input is simply a high pass input which the computer can
use to “learn” to speak the infrared communication language of other user remotes.
The emitter header consists of two output ports which the PC can use to emulate
“learned” infrared commands in order to control external electronic hardware.
Customers are required to buy or create their own interface modules to plug into Intel
Desktop Boards for this feature to work.

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Workstation W30 Rev2 Board Technical Product Specification

1.9 Audio Subsystem

The board supports the Intel High Definition Audio subsystem based on the Realtek
ALC892 audio codec. The audio subsystem supports the following features:
• Advanced jack sense for the back panel audio jacks that enables the audio codec to
recognize the device that is connected to an audio port. The back panel audio
jacks are capable of retasking according to the user’s definition, or can be
automatically switched depending on the recognized device type.
• Stereo input and output for all back panel jacks
• Line out and Mic in functions for front panel audio jacks
• A signal-to-noise (S/N) ratio of 90 dB
Table 4 lists the supported functions of the front panel and back panel audio jacks.

Table 4. Audio Jack Support

Micro- Head- Front Rear Center/ Side
Audio Jack phone phones Speaker Line In Surround Sub Surround
FP Green Default
FP Pink Default
Rear Blue Default
Rear Green Ctrl panel Default
Rear Pink Default Ctrl panel
Rear Black Default
Rear Orange Default

1.9.1 Audio Subsystem Software

Audio software and drivers are available from Intel’s World Wide Web site.

For information about Refer to

Obtaining audio software and drivers Section 1.3, page 16

1.9.2 Audio Subsystem Components

The audio subsystem includes the following components:
• Intel X79 Express Chipset
• Realtek ALC892 audio codec
• Front panel audio header that supports Intel HD audio and AC ’97 audio (a 2 x 5-
pin header that provides mic in and line out signals for front panel audio
connectors) (yellow)
• S/PDIF digital audio out header (1 x 4-pin header) (yellow)
• S/PDIF digital audio out connector on the back panel
• 5-port analog audio input/output stack on the back panel
The back panel audio connectors are configurable through the audio device drivers.
The available configurable back panel audio connectors are shown in Figure 4.

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 Product Description

Item Description
A Rear surround
B Center channel and LFE
(subwoofer)
C Line in
D Line out/front speakers
E Mic in/side surround
F S/PDIF digital audio out
(optical)

Figure 4. Back Panel Audio Connectors

NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.

For information about Refer to

The locations of the front panel audio header and S/PDIF audio header Figure 13, page 48
The signal names of the front panel audio header and S/PDIF audio header Section 2.2.2.1, page 50
The back panel audio connectors Section 2.2.1, page 46

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Workstation W30 Rev2 Board Technical Product Specification

1.10 LAN Subsystem

The Intel GbE Dual LAN subsystem consists of the following:
• Intel 82579L and Intel 82574L Gigabit Ethernet Controllers (10/100/1000 Mbits/s)
• Intel X79 Express Chipset
• RJ-45 LAN connectors with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• LAN connect interface between the PCH and the LAN controller
• Conventional PCI bus power management
 ACPI technology support
 LAN wake capabilities (only the Intel 82579L Gigabit Ethernet Controller
supports PXE)
• LAN subsystem software

For information about Refer to

LAN software and drivers http://downloadcenter.intel.com

1.10.1 Intel® 82579L and Intel® 82574L Gigabit Ethernet

Controllers
The Intel 82579L and Intel 82574L Gigabit Ethernet Controllers support the following
features:
• 10/100/1000 BASE-T IEEE 802.3 compliant
• Energy Efficient Ethernet (EEE) IEEE802.3az support [Low Power Idle (LPI) mode]
• Dual interconnect between the Integrated LAN Controller and the Physical Layer
(PHY):
 PCI Express-based interface for active state operation (S0) state
 SMBUS for host and management traffic (Sx low power state)
• Compliant to IEEE 802.3x flow control support
• 802.1p and 802.1q
• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)
• Full device driver compatibility
• Provides lower power usage to meet Energy Star 5.0 and ErP specifications

26
 Product Description

1.10.2 LAN Subsystem Software

LAN software and drivers are available from Intel’s World Wide Web site.

For information about Refer to

Obtaining LAN software and drivers http://downloadcenter.intel.com

1.10.3 RJ-45 LAN Connector with Integrated LEDs

Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5).

Item Description
A Link LED (Green)
B Data Rate LED (Green/Yellow)
C Link LED (Green)
D Data Rate LED (Green/Yellow)

Figure 5. LAN Connector LED Locations

Table 5 describes the LED states when the board is powered up and the LAN
subsystem is operating.

Table 5. LAN Connector LED States

LED LED Color LED State Condition
Off LAN link is not established.
Link Green On LAN link is established.
Blinking LAN activity is occurring.
Off 10 Mbits/s data rate is selected.
Data Rate Green/Yellow Green 100 Mbits/s data rate is selected.
Yellow 1000 Mbits/s data rate is selected.

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Workstation W30 Rev2 Board Technical Product Specification

1.11 Bluetooth*/WiFi Module

The Bluetooth*/WiFi module is supplemental hardware that is optional (see Figure 6).

Figure 6. Bluetooth/WiFi Module

1.11.1 Bluetooth Technology

The Bluetooth/WiFi Module enables the user to connect with a variety of Bluetooth
enabled devices. Driver support is provided by Microsoft operating systems like
Microsoft Vista and Microsoft Windows 7. The basic Bluetooth driver stack is supplied
by Microsoft but additional features are available using the driver supplied with the
motherboard.
• CSR Bluetooth module (BC0401PC08)
• Maximum data rate 3.0 Mb/s
• Forward and backward compatibility with Bluetooth v1.1, v1.2, v2.0, and v2.1
• Integrated antenna
• Operating system support (Windows XP, Windows Vista, and Windows 7 both 32 bit
and 64 bit)

For information about Refer to

Obtaining Bluetooth information and drivers http://downloadcenter.intel.com
http://msdn.microsoft.com/en-
us/library/aa362932(VS.85).aspx

28
 Product Description

1.11.2 WiFi 802.11 Wireless

The Bluetooth/WiFi Module enables the user to connect with a variety of WiFi enabled
networks, access points and allows peer to peer connections. Driver support is
provided by Microsoft operating systems like Microsoft Vista and Microsoft Windows 7
with additional support provided by the supplied WiFi driver included on the Driver
DVD and online.
• Ralink WiFi 802.11 (RT8070)
• Range up to 300 meters
• Supports the following:
 IEEE 802.11B supports up to 11 Mb/s data rate
 IEEE 802.11G supports up to 54 Mb/s data rate
 IEEE 802.11N supports up to 150 Mb/s data rate
• Integrated Antenna
• Operating system support (Windows XP, Windows Vista, and Windows 7 both 32 bit
and 64 bit)
For information about Refer to
Obtaining WiFi information and drivers http://msdn.microsoft.com/en-
us/library/aa362932(VS.85).aspx
http://downloadcenter.intel.com

1.12 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including the following:
• Fan monitoring and control
• Thermal and voltage monitoring
• Chassis intrusion detection

1.12.1 Hardware Monitoring and Fan Control

The hardware monitoring and fan control subsystem is based on the Winbond
W83677HG-I device, which supports the following:
• Processor and system ambient temperature monitoring
• Chassis fan speed monitoring
• Power monitoring of +12 V, +5 V, +3.3 V, V_SM1, V_SM2, 3.3V_Standby and
+VCCP
• SMBus interface

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Workstation W30 Rev2 Board Technical Product Specification

1.12.2 Fan Monitoring

Fan monitoring can be implemented using Intel® Extreme Tuning Utility, Intel®
Desktop Utility, or third-party software.

For information about Refer to

The functions of the fan headers Section 1.13.2.2, page 36

1.12.3 Chassis Intrusion and Detection

The board supports a chassis security feature that detects if the chassis cover is
removed. The security feature uses a mechanical switch on the chassis that attaches
to the chassis intrusion header. When the chassis cover is removed, the mechanical
switch is in the closed position.

For information about Refer to

The location of the chassis intrusion header Figure 13, page 48

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 Product Description

1.12.4 Thermal Monitoring

Figure 7 shows the locations of the thermal sensors and fan headers.

Item Description
A Rear chassis fan header
B Processor fan header
C Thermal diode, located on processor die
D Remote thermal probe header
E Front chassis fan header
F Intel X79 Express Chipset
G Auxiliary fan header

Figure 7. Thermal Sensors and Fan Headers

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Workstation W30 Rev2 Board Technical Product Specification

1.13 Power Management

Power management is implemented at several levels, including:
• Software support through Advanced Configuration and Power Interface (ACPI)
• Hardware support:
 Power connector
 Fan headers
 LAN wake capabilities
 Instantly Available PC technology
 Wake from USB
 PME# signal wake-up support
 WAKE# signal wake-up support
 Wake from Consumer IR
 Wake from S5
 Power Supervisor
 +5 V Standby Power Indicator LED

1.13.1 ACPI
ACPI gives the operating system direct control over the power management and Plug
and Play functions of a computer. The use of ACPI with this board requires an
operating system that provides full ACPI support. ACPI features include:
• Plug and Play (including bus and device enumeration)
• Power management control of individual devices, add-in boards (some add-in
boards may require an ACPI-aware driver), video displays, and hard disk drives
• Methods for achieving less than 15-watt system operation in the power-on/standby
sleeping state
• A Soft-off feature that enables the operating system to power-off the computer
(refer to the Advanced Configuration and Power Interface Specification at
http://www.acpi.info/)
• Support for multiple wake-up events (see Table 8 on page 34)
• Support for a front panel power and sleep mode switch
Table 6 lists the system states based on how long the power switch is pressed,
depending on how ACPI is configured with an ACPI-aware operating system.
Table 6. Effects of Pressing the Power Switch
If the system is in this …and the power switch is
state… pressed for …the system enters this state
Off Less than four seconds Power-on
(ACPI G2/G5 – Soft off) (ACPI G0 – working state)
On Less than four seconds Soft-off/Standby
(ACPI G0 – working state) (ACPI G1 – sleeping state)
On More than six seconds Fail safe power-off
(ACPI G0 – working state) (ACPI G2/G5 – Soft off)
Sleep Less than four seconds Wake-up
(ACPI G1 – sleeping state) (ACPI G0 – working state)
Sleep More than six seconds Power-off
(ACPI G1 – sleeping state) (ACPI G2/G5 – Soft off)

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 Product Description

1.13.1.1 System States and Power States

Under ACPI, the operating system directs all system and device power state
transitions. The operating system puts devices in and out of low-power states based
on user preferences and knowledge of how devices are being used by applications.
Devices that are not being used can be turned off. The operating system uses
information from applications and user settings to put the system as a whole into a
low-power state.
Table 7 lists the power states supported by the board along with the associated
system power targets. See the ACPI specification for a complete description of the
various system and power states.

Table 7. Power States and Targeted System Power

Processor Targeted System
Global States Sleeping States States Device States Power (Note 1)
G0 – working S0 – working C0 – working D0 – working Full power > 30 W
state state.
G1 – sleeping S3 – Suspend to No power D3 – no power Power < 5 W (Note 2)
state RAM. Context except for
saved to RAM. wake-up logic.
G1 – sleeping S4 – Suspend to No power D3 – no power Power < 5 W (Note 2)
state disk. Context except for
saved to disk. wake-up logic.
G2/S5 S5 – Soft off. No power D3 – no power Power < 5 W (Note 2)
Context not saved. except for
Cold boot is wake-up logic.
required.
G3 – No power to the No power D3 – no power for No power to the system.
mechanical off system. wake-up logic, Service can be performed
AC power is except when safely.
disconnected provided by
from the battery or
computer. external source.

Notes:
1. Total system power is dependent on the system configuration, including add-in boards and peripherals
powered by the system chassis’ power supply.
2. Dependent on the standby power consumption of wake-up devices used in the system.

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Workstation W30 Rev2 Board Technical Product Specification

1.13.1.2 Wake-up Devices and Events

Table 8 lists the devices or specific events that can wake the computer from specific
states.

Table 8. Wake-up Devices and Events

Devices/events can wake up the computer… …from this state …from this global state
(Note 1)
Power switch S3, S4, S5 G1, G2, G3
(Note 1) (Note 3)
RTC alarm S3, S4, S5 G1, G2
(Note 1) (Note 3)
LAN S3, S4, S5 G1, G2
USB S3 G1
(Note 1) (Note 3)
PME# signal S3, S4, S5 G1, G2
(Note 1) (Note 3)
WAKE# S3, S4, S5 G1, G2
(Note 2)
Consumer IR S3, S4, S5
Notes:
1. S4 implies operating system support only.
2. Wake from S4 and S5 is recommended by Microsoft.
3. Wake from device/event not supported immediately upon return from AC loss.

NOTE
The use of these wake-up events from an ACPI state requires an operating system
that provides full ACPI support. In addition, software, drivers, and peripherals must
fully support ACPI wake events.

34
 Product Description

1.13.2 Hardware Support

CAUTION
Ensure that the power supply provides adequate +5 V standby current if LAN wake
capabilities and Instantly Available PC technology features are used. Failure to do so
can damage the power supply. The total amount of standby current required depends
on the wake devices supported and manufacturing options.
The board provides several power management hardware features, including:
• Power connector
• Fan headers
• LAN wake capabilities
• Instantly Available PC technology
• Wake from USB
• PME# signal wake-up support
• WAKE# signal wake-up support
• Wake from Consumer IR
• Wake from S5
• Power Supervisor
• +5 V Standby Power Indicator LED
LAN wake capabilities and Instantly Available PC technology require power from the
+5 V standby line.

NOTE
The use of Wake from USB from an ACPI state requires an operating system that
provides full ACPI support.

1.13.2.1 Power Connector

ATX12V-compliant power supplies can turn off the system power through system
control. When an ACPI-enabled system receives the correct command, the power
supply removes all non-standby voltages.
When resuming from an AC power failure, the computer returns to the power state it
was in before power was interrupted (on or off). The computer’s response can be set
using the Last Power State feature in the BIOS Setup program’s Boot menu.

For information about Refer to

The location of the main power connector Figure 13, page 48
The signal names of the main power connector Table 22, page 54

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Workstation W30 Rev2 Board Technical Product Specification

1.13.2.2 Fan Headers

The function/operation of the fan headers is as follows:
• The fans are on when the board is in the S0 state
• The fans are off when the board is off or in the S3, S4, or S5 state
• Each fan header is wired to a fan tachometer input of the hardware monitoring and
fan control SIO
• All fan headers support closed-loop fan control that can adjust the fan speed or
switch the fan on or off as needed
• All fan headers have a +12 V DC connection
• 4-pin fan headers are controlled by Pulse Width Modulation

For information about Refer to

The location of the fan headers Figure 13, page 48
The location of the fan headers and sensors for thermal monitoring Figure 7, page 31

1.13.2.3 LAN Wake Capabilities

CAUTION
For LAN wake capabilities, the +5 V standby line for the power supply must be capable
of providing adequate +5 V standby current. Failure to provide adequate standby
current when implementing LAN wake capabilities can damage the power supply.
LAN wake capabilities enable remote wake-up of the computer through a network.
The LAN subsystem PCI bus network adapter monitors network traffic at the Media
Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem
asserts a wake-up signal that powers up the computer. Depending on the LAN
implementation, the board supports LAN wake capabilities with ACPI in the following
ways:
• The PCI Express WAKE# signal
• The PCI bus PME# signal for PCI 2.3 compliant LAN designs
 By Ping
 Magic Packet
• The onboard LAN subsystem

36
 Product Description

1.13.2.4 Instantly Available PC Technology

CAUTION
For Instantly Available PC technology, the +5 V standby line for the power supply must
be capable of providing adequate +5 V standby current. Failure to provide adequate
standby current when implementing Instantly Available PC technology can damage the
power supply.
Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to-
RAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the
power supply is off, and the front panel LED is amber if dual colored, or off if single
colored.) When signaled by a wake-up device or event, the system quickly returns to
its last known wake state. Table 8 on page 34 lists the devices and events that can
wake the computer from the S3 state.
The board supports the PCI Bus Power Management Interface Specification. Add-in
boards that also support this specification can participate in power management and
can be used to wake the computer.
The use of Instantly Available PC technology requires operating system support and
PCI 2.2 compliant add-in cards, PCI Express add-in cards, and drivers.

1.13.2.5 Wake from USB

USB bus activity wakes the computer from an ACPI S3 state.

NOTE
Wake from USB requires the use of a USB peripheral that supports Wake from USB
and is supported by the operating system.

1.13.2.6 PME# Signal Wake-up Support

When the PME# signal on the Conventional PCI bus is asserted, the computer wakes
from an ACPI S3, S4, or S5 state (with Wake on PME enabled in the BIOS).

1.13.2.7 WAKE# Signal Wake-up Support

When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from
an ACPI S3, S4, or S5 state.

1.13.2.8 Wake from Consumer IR

CIR activity wakes the computer from an ACPI S3, S4, or S5 state.

1.13.2.9 Wake from S5

When the RTC Date and Time is set in the BIOS, the computer will automatically wake
from an ACPI S5 state.

37
Workstation W30 Rev2 Board Technical Product Specification

1.13.2.10 Power Supervisor

The Power Supervisor actively monitors the input voltages from the power supply and
protects the board and any attached peripherals from electrical overstress and possible
physical damage. The Power Supervisor will activate if it detects the power supply
voltage rails have deviated outside the current ATX power supply specification and safe
operating levels.
If the Power Supervisor detects an out of spec voltage, the following will happen:
1. The board will be powered down immediately to protect circuits from electrical
overstress and possible physical damage.
2. A red warning LED on the board will activate as a visual cue.
3. During the next power on, a message will be displayed on the screen to notify the
user that the power supply voltage rails have deviated outside the current ATX
power supply specification and safe operating levels.
4. A message will be added to the BIOS Event Log for each event that takes place
until the BIOS Event Log is cleared.

1.13.2.11 +5 V Standby Power Indicator LED

The +5 V standby power indicator LED shows that power is still present even when the
computer appears to be off.

1.14 Board Status LEDs

The Desktop Board provides eight board status LEDs that allow you to monitor the
board’s progress through the BIOS Power-on Self-Test. At initial power on, all the
LEDs are off. When the BIOS starts an activity such as memory initialization, the
corresponding LED starts flashing. Once the activity has completed, the LED will
remain on. Six additional LEDs can be used to monitor board functions such as hard
drive activity, processor errors, and power faults. Refer to Table 9 for a description of
all of the LEDs. Figure 8 shows the location of the LEDs.

38
 Product Description

Figure 8. Location of Board Status LEDs

39
Workstation W30 Rev2 Board Technical Product Specification

Table 9. Board Status LEDs

Item in Supported
Figure 8 LED Name LED Color Modes Control Source
A OS Start Green On/Off/Flash BIOS
B Storage Green On/Off/Flash BIOS
Initialization
C USB Initialization Green On/Off/Flash BIOS
D Option ROM Green On/Off/Flash BIOS
Initialization
E Video Green On/Off/Flash BIOS
Initialization
F Memory Green On/Off/Flash BIOS
Initialization
G CPU Initialization Green On/Off/Flash BIOS
H Hard Drive Blue On/Off Hard drive controller(s)
Activity
I CPU Hot Red On/Off Discrete circuit
J VR Hot Red On/Off Discrete circuit
K Watch Dog Red On/Off/Flash BIOS
Fire/Back to BIOS
L +5 V standby Green On/Off Power Supply
power indicator
M CPU Error Red On/Off Processor
N Power Fault LED Red On/Off Power Supply

40
 Product Description

1.15 Onboard Power and Reset Buttons

The lighted onboard power button has the same behavior as the front panel power
button connected via the front panel header. The onboard power button does NOT
remove standby power. This button is intended for use at integration facilities for
testing purposes. The power button on the front panel is recommended for all other
instances of turning the computer on or off. To turn the computer off using the
onboard power button, keep the button pressed down for three seconds.
The lighted onboard reset button can be used to reset the board. This button
duplicates the function of the front panel reset button. Figure 9 shows the location of
the onboard power and reset buttons.

Item Description
A Onboard power
B Onboard reset

Figure 9. Location of the Onboard Power and Reset Buttons

CAUTION
Electrostatic discharge (ESD) can damage components. The onboard power and reset
buttons should be used only at an ESD workstation using an antistatic wrist strap and
a conductive foam pad. If such a station is not available, some ESD protection can be
provided by wearing an antistatic wrist strap and attaching it to a metal part of the
computer chassis.

41
Workstation W30 Rev2 Board Technical Product Specification

42
2 Technical Reference

2.1 Memory Resources

2.1.1 Addressable Memory
The board utilizes 64 GB of addressable system memory. Typically the address space
that is allocated for Conventional PCI bus add-in cards, PCI Express configuration
space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM
(total system memory). On a system that has 64 GB of system memory installed, it is
not possible to use all of the installed memory due to system address space being
allocated for other system critical functions. These functions include the following:
• BIOS/SPI Flash device (64 Mbit)
• Local APIC (19 MB)
• Direct Media Interface (40 MB)
• PCI Express configuration space (256 MB)
• PCH base address registers PCI Express ports (up to 256 MB)
• Memory-mapped I/O that is dynamically allocated for Conventional PCI and PCI
Express add-in cards (256 MB)
The board provides the capability to reclaim the physical memory overlapped by the
memory mapped I/O logical address space. The board remaps physical memory from
the top of usable DRAM boundary to the 4 GB boundary to an equivalent sized logical
address range located just above the 4 GB boundary. Figure 10 shows a schematic of
the system memory map. All installed system memory can be used when there is no
overlap of system addresses.

43
Workstation W30 Rev2 Board Technical Product Specification

Figure 10. Detailed System Memory Address Map

44
 Technical Reference

2.1.2 Memory Map

Table 10 lists the system memory map.

Table 10. System Memory Map

Address Range (decimal) Address Range (hex) Size Description
1024 K - 67100672 K 100000 – FFFFFFFFFH 65528 MB Extended memory
960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS
896 K - 960 K E0000 - EFFFF 64 KB Reserved
800 K - 896 K C8000 - DFFFF 96 KB Potential available high DOS
memory (open to the Conventional
PCI bus). Dependent on video
adapter used.
640 K - 800 K A0000 - C7FFF 160 KB Video memory and BIOS
639 K - 640 K 9FC00 - 9FFFF 1 KB Extended BIOS data (movable by
memory manager software)
512 K - 639 K 80000 - 9FBFF 127 KB Extended conventional memory
0 K - 512 K 00000 - 7FFFF 512 KB Conventional memory

2.2 Connectors and Headers

CAUTION
Only the following connectors and headers have overcurrent protection: back panel
and front panel USB, as well as IEEE 1394a.
The other internal connectors and headers are not overcurrent protected and should
connect only to devices inside the computer’s chassis, such as fans and internal
peripherals. Do not use these connectors or headers to power devices external to the
computer’s chassis. A fault in the load presented by the external devices could cause
damage to the computer, the power cable, and the external devices themselves.
Furthermore, improper connection of USB or 1394 header single wire connectors may
eventually overload the overcurrent protection and cause damage to the board.
This section describes the board’s connectors. The connectors can be divided into
these groups:
• Back panel I/O connectors
• Component-side I/O connectors and headers (see page 48)

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Workstation W30 Rev2 Board Technical Product Specification

2.2.1 Back Panel Connectors

Figure 11 shows the location of the back panel connectors for the board.

Item Description
A Back to BIOS button
B USB 3.0 ports
C USB 3.0 ports
D LAN connector
E USB 2.0 ports
F IEEE 1394a connector
G USB 2.0 ports
H LAN connector
I USB 2.0 ports
J Rear surround
K Center channel and LFE (subwoofer)
L S/PDIF digital audio out (optical)
M Line in
N Line out/front speakers
O Mic in/side surround

Figure 11. Back Panel Connectors

NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.

46
 Technical Reference

2.2.1.1 I/O Shield

The I/O shield provided with the board allows access to all back panel connectors and
is compatible with standard mini-ITX and ATX chassis. Figure 12 shows an I/O shield
reference diagram.

Figure 12. I/O Shield Reference Diagram

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Workstation W30 Rev2 Board Technical Product Specification

2.2.2 Component-side Connectors and Headers

Figure 13 shows the locations of the component-side connectors and headers.

Figure 13. Component-side Connectors and Headers

Table 11 lists the component-side connectors and headers identified in Figure 13.

48
 Technical Reference

Table 11. Component-side Connectors and Headers Shown in Figure 13

Item/callout
from Figure 13 Description
A Front panel audio header
B PCI Express x1 add-in card connector
C S/PDIF out header
D PCI Express 3.0 x16 add-in card connector (x8 electrical)
E Conventional PCI add-in card connector
F PCI Express 3.0 x16 add-in card connector
G PCI Express x1 add-in card connector
H PCI Express 3.0 x16 add-in card connector
I Rear chassis fan header
J Processor fan header
K 12 V processor core voltage connector (2 x 4 pin)
L Main power connector (2 x 12 pin)
M Remote thermal probe header
N Rear chassis fan header
O SATA 6.0 Gb/s connectors through the PCH (blue)
P SATA 3.0 Gb/s connectors through the PCH (black)
Q SATA 6.0 Gb/s connectors through a Marvell 88SE9128 controller (gray)
R Front panel USB 2.0 header
S Front panel USB 2.0 header
T Front panel USB 2.0 header
U Front panel USB 2.0 header
V Consumer IR emitter (output) header
W Front panel USB 3.0 connector
X Consumer IR receiver (input) header
Y Alternate front panel power LED header
Z Front panel header
AA Front panel IEEE 1394 a header
BB Chassis intrusion header
CC Auxiliary fan header

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Workstation W30 Rev2 Board Technical Product Specification

2.2.2.1 Signal Tables for the Connectors and Headers

Table 12. Front Panel Audio Header for Intel HD Audio

Pin Signal Name Description
1 PORT_1L Analog Port 1 – left channel (microphone)
2 GND Ground
3 PORT_1R Analog Port 1 – right channel (microphone)
4 PRESENCE# Active low signal that signals BIOS that an Intel HD Audio
dongle is connected to the analog header. PRESENCE#=0
when an Intel HD Audio dongle is connected
5 PORT_2R Analog Port 2 – right channel (headphone)
6 SENSE1_RETURN Jack detection return for front panel (JACK1)
7 SENSE_SEND Jack detection sense line from the Intel HD Audio CODEC
jack detection resistor network
8 KEY No pin
9 PORT_2L Analog Port 2 – left channel (headphone)
10 SENSE2_RETURN Jack detection return for front panel (JACK2)

Table 13. Front Panel Audio Header for AC ’97 Audio

Pin Signal Name Description
1 MIC Front panel microphone input signal (biased when supporting
stereo microphone)
2 AUD_GND Ground used by analog audio circuits
3 MIC_BIAS Microphone power/additional MIC input for stereo
microphone support
4 PRESENCE# Active low signal that signals BIOS that an Intel HD Audio
dongle is connected to the analog header. PRESENCE#=0
when an Intel HD Audio dongle is connected.
5 FP_OUT_R Right channel audio signal to front panel (headphone drive
capable)
6 AUD_GND Ground used by analog audio circuits
7 RESERVED Reserved
8 KEY No pin
9 FP_OUT_L Left channel audio signal to front panel (headphone drive
capable)
10 AUD_GND Ground used by analog audio circuits

50
 Technical Reference

Table 14. IEEE 1394a Header

Pin Signal Name Pin Signal Name
1 Data A (positive) 2 Data A (negative)
3 Ground 4 Ground
5 Data B (positive) 6 Data B (negative)
7 +12 V DC 8 +12 V DC
9 Key (no pin) 10 Ground

Table 15. SATA Connectors

Pin Signal Name
1 Ground
2 TXP
3 TXN
4 Ground
5 RXN
6 RXP
7 Ground

Table 16. S/PDIF Header

Pin Signal Name
1 Ground
2 S/PDIF out
3 Key (no pin)
4 +5 VDC

Table 17. USB 2.0 Headers

Pin Signal Name
1 +5 V DC
2 D−
3 D+
4 Ground
5 Key (no pin)

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Workstation W30 Rev2 Board Technical Product Specification

Table 18. USB 3.0 Connector

Pin Signal Name Description
1 Vbus Power
2 IntA_P1_SSRX− USB3 ICC Port1 SuperSpeed Rx−
3 IntA_P1_SSRX+ USB3 ICC Port1 SuperSpeed Rx+
4 GND Ground
5 IntA_P1_SSTX− USB3 ICC Port1 SuperSpeed Tx−
6 IntA_P1_SSTX+ USB3 ICC Port1 SuperSpeed Tx+
7 GND Ground
8 IntA_P1_D− USB3 ICC Port1 D− (USB2 Signal D−)
9 IntA_P1_D+ USB3 ICC Port1 D+ (USB2 Signal D+)
10 ID Over Current Protection
11 IntA_P2_D+ USB3 ICC Port2 D+ (USB2 Signal D+)
12 IntA_P2_D− USB3 ICC Port2 D− (USB2 Signal D−)
13 GND Ground
14 IntA_P2_SSTX+ USB3 ICC Port2 SuperSpeed Tx+
15 IntA_P2_SSTX− USB3 ICC Port2 SuperSpeed Tx−
16 GND Ground
17 IntA_P2_SSRX+ USB3 ICC Port2 SuperSpeed Rx+
18 IntA_P2_SSRX− USB3 ICC Port2 SuperSpeed Rx+
19 Vbus Power

Table 19. Chassis Intrusion Header

Pin Signal Name
1 Intruder#
2 Ground

Table 20. Processor, Front and Rear Chassis, and Auxiliary

(4-Pin) Fan Headers
Pin Signal Name
1 Ground (Note)
2 +12 V
3 FAN_TACH
4 FAN_CONTROL
Note: These fan headers use Pulse Width Modulation control for fan speed.

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 Technical Reference

Table 20. Back Panel CIR Emitter (Output) Header

Pin Signal Name
1 Emitter out 1
2 Emitter out 2
3 Ground
4 Key (no pin)
5 Jack detect 1
6 Jack detect 2

Table 21. Front Panel CIR Receiver (Input) Header

Pin Signal Name
1 Ground
2 LED
3 NC
4 Learn-in
5 5 V standby
6 VCC
7 Key (no pin)
8 CIR Input

2.2.2.2 Add-in Card Connectors

The board has the following add-in card connectors:
• PCI Express 3.0 x16: three PCI Express 3.0 x16 connectors supporting
simultaneous transfer speeds up to 16 GB/s of peak bandwidth per direction and
up to 32 GB/s concurrent bandwidth.
• PCI Express 2.0 x1: two PCI Express 2.0 x1 connectors. The x1 interface supports
simultaneous transfer speeds up to 500 MB/s of peak bandwidth per direction and
up to 1.0 GB/s concurrent bandwidth.
• Conventional PCI (rev 2.3 compliant) bus: one Conventional PCI bus add-in card
connector.
Note the following considerations for the Conventional PCI bus connector:
• The Conventional PCI bus connectors are bus master capable.
• SMBus signals are routed to the Conventional PCI bus connectors. This enables
Conventional PCI bus add-in boards with SMBus support to access sensor data on
the desktop board. The specific SMBus signals are as follows:
 The SMBus clock line is connected to pin A40.
 The SMBus data line is connected to pin A41.

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Workstation W30 Rev2 Board Technical Product Specification

2.2.2.3 Power Supply Connectors

The board has the following power supply connectors:
• Main power – a 2 x 12 connector. This connector is compatible with 2 x 10
connectors previously used on Intel Desktop boards. The board supports the use
of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When
using a power supply with a 2 x 10 main power cable, attach that cable on the
leftmost pins of the main power connector, leaving pins 11, 12, 23, and
24 unconnected.
• Processor core power – a 2 x 4 connector. This connector provides power
directly to the processor voltage regulator and must always be used. Failure to do
so will prevent the board from booting.

Table 21. Processor Core Power Connector

Pin Signal Name Pin Signal Name
1 Ground 2 +12 V
3 Ground 4 +12 V
5 Ground 6 +12 V
7 Ground 8 +12 V

Table 22. Main Power Connector

Pin Signal Name Pin Signal Name
1 +3.3 V 13 +3.3 V
2 +3.3 V 14 -12 V
3 Ground 15 Ground
4 +5 V 16 PS-ON# (power supply remote on/off)
5 Ground 17 Ground
6 +5 V 18 Ground
7 Ground 19 Ground
8 PWRGD (Power Good) 20 No connect
9 +5 V (Standby) 21 +5 V
10 +12 V 22 +5 V
11 +12 V (Note) 23 +5 V (Note)
12 2 x 12 connector detect (Note) 24 Ground (Note)
Note: When using a 2 x 10 power supply cable, this pin will be unconnected.

For information about Refer to

Power supply considerations Section 2.5.1 on page 61

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 Technical Reference

2.2.2.4 Front Panel Header

This section describes the functions of the front panel header. Table 23 lists the signal
names of the front panel header. Figure 14 is a connection diagram for the front panel
header.

Table 23. Front Panel Header

In/ In/
Pin Signal Out Description Pin Signal Out Description
Hard Drive Activity LED Power LED
1 HD_PWR Out Hard disk LED 2 HDR_BLNK_GRN Out Front panel green
pull-up to +5 V LED
3 HDA# Out Hard disk active 4 HDR_BLNK_YEL Out Front panel yellow
LED LED
Reset Switch On/Off Switch
5 Ground Ground 6 FPBUT_IN In Power switch
7 FP_RESET# In Reset switch 8 Ground Ground
Power Not Connected
9 +5 V Power 10 N/C Not connected

Figure 14. Connection Diagram for Front Panel Header

2.2.2.4.1 Hard Drive Activity LED Header

Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is
being read from or written to a hard drive. Proper LED function requires a SATA hard
drive or optical drive connected to an onboard SATA connector.

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Workstation W30 Rev2 Board Technical Product Specification

2.2.2.4.2 Reset Switch Header

Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type
switch that is normally open. When the switch is closed, the board resets and runs the
POST.
2.2.2.4.3 Power/Sleep LED Header
Pins 2 and 4 can be connected to a one- or two-color LED. Table 24 shows the
possible states for a one-color LED. Table 25 shows the possible states for a two-color
LED.

Table 24. States for a One-Color Power LED

LED State Description
Off Power off/sleeping
Steady Green Running

Table 25. States for a Two-Color Power LED

LED State Description
Off Power off
Steady Green Running
Steady Yellow Sleeping

NOTE
The colors listed in Table 24 and Table 25 are suggested colors only. Actual LED colors
are chassis-specific.

2.2.2.4.4 Power Switch Header

Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The
switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power
supply to switch on or off. (The time requirement is due to internal debounce circuitry
on the board.) At least two seconds must pass before the power supply will recognize
another on/off signal.

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 Technical Reference

2.2.2.5 Front Panel USB 2.0 Headers

Figure 15 is a connection diagram for the front panel USB 2.0 headers.

NOTE
• The +5 V DC power on the headers is fused.
• Use only a front panel USB 2.0 connector that conforms to the USB 2.0
specification for high-speed USB devices.

Figure 15. Connection Diagram for Front Panel USB 2.0 Headers

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Workstation W30 Rev2 Board Technical Product Specification

2.3 Jumper Block

CAUTION
Do not move the jumper with the power on. Always turn off the power and unplug the
power cord from the computer before changing a jumper setting. Otherwise, the
board could be damaged.
Figure 16 shows the location of the jumper block. The 3-pin jumper block determines
the BIOS Setup program’s mode. Table 26 describes the jumper settings for the three
modes: normal, configure, and recovery. When the jumper is set to configure mode
and the computer is powered-up, the BIOS compares the processor version and the
microcode version in the BIOS and reports if the two match.

Figure 16. Location of the Jumper Block

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 Technical Reference

Table 26. BIOS Setup Configuration Jumper Settings

Function/Mode Jumper Setting Configuration
Normal 1-2 The BIOS uses current configuration information and
passwords for booting.
Configure 2-3 After the POST runs, Setup runs automatically. The
maintenance menu is displayed.

Note that this Configure mode is the only way to clear the
BIOS/CMOS settings. Press F9 (restore defaults) while in
Configure mode to restore the BIOS/CMOS settings to their
default values.

Recovery None The BIOS attempts to recover the BIOS configuration. A

recovery CD or flash drive is required.

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Workstation W30 Rev2 Board Technical Product Specification

2.4 Mechanical Considerations

2.4.1 Form Factor
The board is designed to fit into an ATX-form-factor chassis. Figure 17 illustrates the
mechanical form factor for the board. Dimensions are given in inches [millimeters].
The outer dimensions are 12.00 inches by 9.60 inches [304.80 millimeters by
243.84 millimeters]. Location of the I/O connectors and mounting holes are in
compliance with the ATX specification.

Figure 17. Board Dimensions

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 Technical Reference

2.5 Electrical Considerations

2.5.1 Power Supply Considerations

CAUTION
The +5 V standby line from the power supply must be capable of providing adequate
+5 V standby current. Failure to do so can damage the power supply. The total
amount of standby current required depends on the wake devices supported and
manufacturing options.
Additional power required will depend on configurations chosen by the integrator.
The power supply must comply with the indicated parameters of the ATX form factor
specification.
• The potential relation between 3.3 VDC and +5 VDC power rails
• The current capability of the +5 VSB line
• All timing parameters
• All voltage tolerances
For example, for a system consisting of a supported 130 W processor (see section 1.4
on page 16 for a list of supported processors), 8 GB DDR3 RAM, one high end video
card, one hard disk drive, one optical drive, and all board peripherals enabled, the
minimum recommended power supply is 460 W. Table 27 lists the recommended
power supply current values.

Table 27. Recommended Power Supply Current Values

Output Voltage 3.3 V 5V 12 V1 12 V2 -12 V 5 VSB
Current 22 A 20 A 16 A 16 A 0.3 A 1.5 A

For information about Refer to

Selecting an appropriate power supply http://support.intel.com/support/motherboards/desktop/sb
/CS-026472.htm

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2.5.2 Fan Header Current Capability

CAUTION
The processor fan must be connected to the processor fan header, not to a chassis fan
header. Connecting the processor fan to a chassis fan header may result in onboard
component damage that will halt fan operation.
Table 28 lists the current capability of the fan headers.

Table 28. Fan Header Current Capability

Fan Header Maximum Available Current
Processor fan 2.0 A
Front chassis fan 1.5 A
Rear chassis fan 1.5 A
Auxiliary fan 1.5 A

2.5.3 Add-in Board Considerations

The board is designed to provide 2 A (average) of current for each add-in board from
the +5 V rail. The total +5 V current draw for add-in boards for a fully loaded board
(all six expansion slots filled) must not exceed the system’s power supply +5 V
maximum current or 14 A in total.

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2.6 Thermal Considerations

CAUTION
A chassis with a maximum internal ambient temperature of 38 oC at the processor fan
inlet is a requirement. Use a processor heat sink that provides omni-directional airflow
to maintain required airflow across the processor voltage regulator area. If a non
omni-directional thermal solution is used customer might need to provide
supplemental cooling to the processor voltage regulator area.

CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the
processor and/or voltage regulator or, in some instances, damage to the board. For a
list of chassis that have been tested with Intel desktop boards please refer to the
following website:
http://www3.intel.com/cd/channel/reseller/asmo-na/eng/tech_reference/53211.htm
All responsibility for determining the adequacy of any thermal or system design
remains solely with the reader. Intel makes no warranties or representations that
merely following the instructions presented in this document will result in a system
with adequate thermal performance.

CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating
temperature, see the environmental specifications in Section 2.8.

CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit.
Failure to do so may result in damage to the voltage regulator circuit. The processor
voltage regulator area (shown in Figure 18) can reach a temperature of up to 85 oC in
an open chassis.

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Workstation W30 Rev2 Board Technical Product Specification

Figure 18 shows the locations of the localized high temperature zones.

Item Description
A Processor voltage regulator area
B Processor

Figure 18. Localized High Temperature Zones

Table 29 provides maximum case temperatures for the components that are sensitive
to thermal changes. The operating temperature, current load, or operating frequency
could affect case temperatures. Maximum case temperatures are important when
considering proper airflow to cool the board.

Table 29. Thermal Considerations for Components

Component Maximum Case Temperature
Processor For processor case temperature, see processor datasheets and
processor specification updates

Intel X79 Express Chipset 104 oC (under bias)

For information about Refer to

Processor datasheets and specification updates Section 1.3, page 16

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2.7 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using a parts count
method. The calculation is based on the Telcordia SR-332, Method I Case 1 50%
electrical stress, 55 ºC ambient. The MTBF prediction is used to estimate repair rates
and spare parts requirements. The MTBF data is calculated from predicted data at
55 ºC. The MTBF for the board is 134,526 hours.

2.8 Environmental
Table 30 lists the environmental specifications for the board.

Table 30. Environmental Specifications

Parameter Specification
Temperature
(Note)
Non-Operating -20 °C to +70 °C
Operating 0 °C to +55 °C
The operating temperature of the board may be determined by measuring the
air temperature from within 1 inch of the edge of the chipset/PCH heatsink and
1 inch above the board, in a closed chassis, while the system is in operation.
Shock
Unpackaged 50 g trapezoidal waveform
Velocity change of 170 inches/second²
Packaged Half sine 2 millisecond
Product Weight (pounds) Free Fall (inches) Velocity Change (inches/sec²)
<20 36 167
21-40 30 152
41-80 24 136
81-100 18 118
Vibration
Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
Packaged 5 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz
Note: Before attempting to operate this board, the overall temperature of the board must be above the
minimum operating temperature specified. It is recommended that the board temperature be at least
room temperature before attempting to power on the board.

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66
3 Overview of BIOS Features

3.1 Introduction
The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash
Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash
contains the BIOS Setup program, POST, the PCI auto-configuration utility, LAN
EEPROM information, and Plug and Play support.
The BIOS displays a message during POST identifying the type of BIOS and a revision
code. The initial production BIOSs are identified as SIX7910J.86A.
When the BIOS Setup configuration jumper is set to configure mode and the computer
is powered-up, the BIOS compares the CPU version and the microcode version in the
BIOS and reports if the two match.
The BIOS Setup program can be used to view and change the BIOS settings for the
computer. The BIOS Setup program is accessed by pressing the <F2> key after the
Power-On Self-Test (POST) memory test begins and before the operating system boot
begins. The menu bar is shown below.

Maintenance Main Configuration Performance Security Power Boot Exit

NOTE
The maintenance menu is displayed only when the board is in configure mode.
Section 2.3 on page 58 shows how to put the board in configure mode.

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Workstation W30 Rev2 Board Technical Product Specification

Table 31 lists the BIOS Setup program menu features.

Table 31. BIOS Setup Program Menu Bar

Configura-
Maintenance Main tion Performance Security Power Boot Exit
Clears Displays Configures Configures Sets Configures Selects Saves or
passwords and processor advanced Memory, Bus passwords power boot discards
displays and memory features and Processor and management options changes to
processor configuration available overrides security features and Setup
information through the features power supply program
chipset controls options

Table 32 lists the function keys available for menu screens.

Table 32. BIOS Setup Program Function Keys

BIOS Setup Program
Function Key Description
<←> or <→> Selects a different menu screen (Moves the cursor left or right)
<↑> or <↓> Selects an item (Moves the cursor up or down)
<Tab> Selects a field (Not implemented)
<Enter> Executes command or selects the submenu
<F9> Load the default configuration values for the current menu
<F10> Save the current values and exits the BIOS Setup program
<Esc> Exits the menu

3.2 BIOS Flash Memory Organization

The Serial Peripheral Interface Flash Memory (SPI Flash) includes a 32 Mbit (4096 KB)
flash memory device.

3.3 Resource Configuration

3.3.1 PCI Autoconfiguration
The BIOS can automatically configure PCI devices. PCI devices may be onboard or
add-in cards. Autoconfiguration lets a user insert or remove PCI cards without having
to configure the system. When a user turns on the system after adding a PCI card,
the BIOS automatically configures interrupts, the I/O space, and other system
resources. Any interrupts set to Available in Setup are considered to be available for
use by the add-in card.

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 Overview of BIOS Features

3.4 System Management BIOS (SMBIOS)

SMBIOS is a Desktop Management Interface (DMI) compliant method for managing
computers in a managed network.
The main component of SMBIOS is the Management Information Format (MIF)
database, which contains information about the computing system and its
components. Using SMBIOS, a system administrator can obtain the system types,
capabilities, operational status, and installation dates for system components. The
MIF database defines the data and provides the method for accessing this information.
The BIOS enables applications such as third-party management software to use
SMBIOS. The BIOS stores and reports the following SMBIOS information:
• BIOS data, such as the BIOS revision level
• Fixed-system data, such as peripherals, serial numbers, and asset tags
• Resource data, such as memory size, cache size, and processor speed
• Dynamic data, such as event detection and error logging
Non-Plug and Play operating systems require an additional interface for obtaining the
SMBIOS information. The BIOS supports an SMBIOS table interface for such operating
systems. Using this support, an SMBIOS service-level application running on a
non-Plug and Play operating system can obtain the SMBIOS information. Additional
board information can be found in the BIOS under the Additional Information header
under the Main BIOS page.

3.5 Legacy USB Support

Legacy USB support enables USB devices to be used even when the operating
system’s USB drivers are not yet available. Legacy USB support is used to access the
BIOS Setup program, and to install an operating system that supports USB. By
default, Legacy USB support is set to Enabled.
Legacy USB support operates as follows:
1. When you apply power to the computer, legacy support is disabled.
2. POST begins.
3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to
enter and configure the BIOS Setup program and the maintenance menu.
4. POST completes.
5. The operating system loads. While the operating system is loading, USB
keyboards and mice are recognized and may be used to configure the operating
system. (Keyboards and mice are not recognized during this period if Legacy USB
support was set to Disabled in the BIOS Setup program.)
6. After the operating system loads the USB drivers, all legacy and non-legacy USB
devices are recognized by the operating system, and Legacy USB support from the
BIOS is no longer used.
7. Additional USB legacy feature options can be access by using Intel Integrator
Toolkit.

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Workstation W30 Rev2 Board Technical Product Specification

To install an operating system that supports USB, verify that Legacy USB support in
the BIOS Setup program is set to Enabled and follow the operating system’s
installation instructions.

3.6 BIOS Updates

The BIOS can be updated using either of the following utilities, which are available on
the Intel World Wide Web site:
• Intel® Express BIOS Update utility, which enables automated updating while in the
Windows environment. Using this utility, the BIOS can be updated from a file on a
hard disk, a USB drive (a flash drive or a USB hard drive), an optical drive, or from
the file location on the Web.
• Intel® Flash Memory Update Utility, which requires booting from DOS. Using this
utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash
drive or a USB hard drive), or an optical drive.
• Intel® F7 switch allows a user to select where the BIOS .bio file is located and
perform the update from that location/device. Similar to performing a BIOS
Recovery without removing the BIOS configuration jumper.
Both utilities verify that the updated BIOS matches the target system to prevent
accidentally installing an incompatible BIOS.

NOTE
Review the instructions distributed with the upgrade utility before attempting a BIOS
update.

For information about Refer to

BIOS update utilities http://support.intel.com/support/motherboards/desktop/sb
/CS-022312.htm.

3.6.1 Language Support

The BIOS Setup program and help messages are supported in US English. Check the
Intel web site for support.

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 Overview of BIOS Features

3.6.2 Custom Splash Screen

During POST, an Intel® splash screen is displayed by default. This splash screen can
be augmented with a custom splash screen. The Intel Integrator’s Toolkit that is
available from Intel can be used to create a custom splash screen.

NOTE
If you add a custom splash screen, it will share space with the Intel branded logo.

For information about Refer to

Intel® Integrator Toolkit http://developer.intel.com/design/motherbd/software/itk/
Additional Intel® software tools http://developer.intel.com/design/motherbd/software.htm

3.7 BIOS Recovery

It is unlikely that anything will interrupt a BIOS update; however, if an interruption
occurs, the BIOS could be damaged. Table 33 lists the drives and media types that
can and cannot be used for BIOS recovery. The BIOS recovery media does not need
to be made bootable.

Table 33. Acceptable Drives/Media Types for BIOS Recovery

Media Type Can be used for BIOS recovery?
Optical drive connected to the SATA interface Yes
USB removable drive (a USB Flash Drive, for example) Yes
USB diskette drive (with a 1.44 MB diskette) No
USB hard disk drive No

For information about Refer to

BIOS recovery http://www.intel.com/support/motherboards/desktop/sb/
cs-023360.htm

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Workstation W30 Rev2 Board Technical Product Specification

3.8 Boot Options

In the BIOS Setup program, the user can choose to boot from a diskette drive, hard
drive, USB drive, USB flash drive, optical drive, or the network. The default setting is
for the diskette drive to be the first boot device, the hard drive second, and the optical
drive third. If enabled, the last default boot device is the network.

3.8.1 Optical Drive Boot

Booting from the optical drive is supported in compliance to the El Torito bootable
CD-ROM format specification. Under the Boot menu in the BIOS Setup program, the
optical drive is listed as a boot device. Boot devices are defined in priority order.
Accordingly, if there is not a bootable CD in the optical drive, the system will attempt
to boot from the next defined drive.

3.8.2 Network Boot

The network can be selected as a boot device. This selection allows booting from the
onboard LAN or a network add-in card with a remote boot ROM installed.
Pressing the <F12> key during POST automatically forces booting from the LAN. To
use this key during POST, the User Access Level in the BIOS Setup program's Security
menu must be set to Full.

3.8.3 Booting Without Attached Devices

For use in embedded applications, the BIOS has been designed so that after passing
the POST, the operating system loader is invoked even if the following devices are not
present:
• Video adapter
• Keyboard
• Mouse

3.8.4 Changing the Default Boot Device During POST

Pressing the <F10> key during POST causes a boot device menu to be displayed. This
menu displays the list of available boot devices (as set in the BIOS setup program’s
Boot Device Priority Submenu). Table 34 lists the boot device menu options.

Table 34. Boot Device Menu Options

Boot Device Menu Function Keys Description
<↑> or <↓> Selects a default boot device
<Enter> Exits the menu, saves changes, and boots from the selected
device
<Esc> Exits the menu without saving changes

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 Overview of BIOS Features

3.9 Adjusting Boot Speed

These factors affect system boot speed:
• Selecting and configuring peripherals properly
• Optimized BIOS boot parameters

3.9.1 Peripheral Selection and Configuration

The following techniques help improve system boot speed:
• Choose a hard drive with parameters such as “power-up to data ready” in less than
eight seconds to minimize hard drive startup delays.
• Select an optical drive with a fast initialization rate. This rate can influence POST
execution time.
• Eliminate unnecessary add-in adapter features, such as logo displays, screen
repaints, or mode changes in POST. These features may add time to the boot
process.
• Try different monitors. Some monitors initialize and communicate with the BIOS
more quickly, which enables the system to boot more quickly.

3.9.2 BIOS Boot Optimizations

Use of the following BIOS Setup program settings reduces the POST execution time.
• In the Boot Menu, set the hard disk drive as the first boot device. As a result, the
POST does not first seek a diskette drive, which saves about one second from the
POST execution time.
• In the Peripheral Configuration submenu, disable the LAN device if it will not be
used. This can reduce up to four seconds of option ROM boot time.
• The BIOS will automatically not load the option ROM for the SATA controller if no
drives are installed in it during POST.

NOTE
It is possible to optimize the boot process to the point where the system boots so
quickly that the Intel logo screen (or a custom logo splash screen) will not be seen.
Monitors and hard disk drives with minimum initialization times can also contribute to
a boot time that might be so fast that necessary logo screens and POST messages
cannot be seen.
This boot time may be so fast that some drives might be not be initialized at all. If
this condition should occur, it is possible to introduce a programmable delay ranging
from zero to 30 seconds by 5 second increments (using the Hard Disk Pre-Delay
feature of the Advanced Menu in the Drive Configuration Submenu of the BIOS Setup
program).

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Workstation W30 Rev2 Board Technical Product Specification

3.10 BIOS Security Features

The BIOS includes security features that restrict access to the BIOS Setup program
and who can boot the computer. A supervisor password and a user password can be
set for the BIOS Setup program and for booting the computer, with the following
restrictions:
• The supervisor password gives unrestricted access to view and change all the
Setup options in the BIOS Setup program. This is the supervisor mode.
• The user password gives restricted access to view and change Setup options in the
BIOS Setup program. This is the user mode.
• If only the supervisor password is set, pressing the <Enter> key at the password
prompt of the BIOS Setup program allows the user restricted access to Setup.
• If both the supervisor and user passwords are set, users can enter either the
supervisor password or the user password to access Setup. Users have access to
Setup respective to which password is entered.
• Setting the user password restricts who can boot the computer. The password
prompt will be displayed before the computer is booted. If only the supervisor
password is set, the computer boots without asking for a password. If both
passwords are set, the user can enter either password to boot the computer.
• For enhanced security, use different passwords for the supervisor and user
passwords.
• Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to
16 characters in length.
Table 35 shows the effects of setting the supervisor password and user password.
This table is for reference only and is not displayed on the screen.

Table 35. Supervisor and User Password Functions

Password Password
Password Supervisor to Enter During
Set Mode User Mode Setup Options Setup Boot
Neither Can change all Can change all None None None
options (Note) options (Note)
Supervisor Can change all Can change a Supervisor Password Supervisor None
only options limited
number of
options
User only N/A Can change all Enter Password User User
options Clear User Password
Supervisor Can change all Can change a Supervisor Password Supervisor or Supervisor or
and user set options limited Enter Password user user
number of
options
Note: If no password is set, any user can change all Setup options.

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 Overview of BIOS Features

3.11 BIOS Performance Features

The BIOS includes the following options to provide custom performance enhancements
when using an Intel Core i7 and Intel Xeon processor in an LGA2011 socket.
• Processor frequency adjustment
• Processor voltage adjustment
• Memory clock adjustments
• Memory voltage adjustments
• QPI Bus voltage adjustment
• PCI Bus speed adjustment
• Fast Boot

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Workstation W30 Rev2 Board Technical Product Specification

76
4 Error Messages and Beep Codes

4.1 Speaker
The board-mounted speaker provides audible error code (beep code) information
during POST.

For information about Refer to

The location of the onboard speaker Figure 1, page 13

4.2 BIOS Beep Codes

Whenever a recoverable error occurs during POST, the BIOS causes the board’s
speaker to beep an error message describing the problem (see Table 36).

Table 36. BIOS Beep Codes

Type Pattern Frequency
F2 Setup/F10 Boot Menu One 0.5 second beep when BIOS is ready to 932 Hz
Prompt accept keyboard input
BIOS update in progress None
Video error On-off (1.0 second each) two times, then 932 Hz
2.5-second pause (off), entire pattern repeats When no VGA option ROM is
(beeps and pause) once and the BIOS will found.
continue to boot.
Memory error On-off (1.0 second each) three times, then 932 Hz
2.5-second pause (off), entire pattern repeats
(beeps and pause) until the system is powered
off.
Thermal trip warning Alternate high and low beeps (1.0 second each) High beep 2000 Hz
for 8 beeps, followed by system shut down. Low beep 1500 Hz

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Workstation W30 Rev2 Board Technical Product Specification

4.3 Front-panel Power LED Blink Codes

Whenever a recoverable error occurs during POST, the BIOS causes the board’s front
panel power LED to blink an error message describing the problem (see Table 37).

Table 37. Front-panel Power LED Blink Codes

Type Pattern Note
F2 Setup/F10 Boot Menu None
Prompt
BIOS update in progress Off when the update begins, then on for
0.5 seconds, then off for 0.5 seconds. The
pattern repeats until the BIOS update is
complete.
Video error On-off (1.0 second each) two times, then When no VGA option ROM is
2.5-second pause (off), entire pattern repeats found.
(blink and pause) until the system is powered
off.
Memory error On-off (1.0 second each) three times, then
2.5-second pause (off), entire pattern repeats
(blinks and pause) until the system is powered
off.
Thermal trip warning Each beep will be accompanied by the following
blink pattern: .25 seconds on, .25 seconds off,
.25 seconds on, .25 seconds off. This will result
in a total of 16 blinks.

4.4 BIOS Error Messages

Table 38 lists the error messages and provides a brief description of each.

Table 38. BIOS Error Messages

Error Message Explanation
CMOS Battery Low The battery may be losing power. Replace the battery soon.
CMOS Checksum Bad The CMOS checksum is incorrect. CMOS memory may have been
corrupted. Run Setup to reset values.
Memory Size Decreased Memory size has decreased since the last boot. If no memory
was removed, then memory may be bad.
No Boot Device Available System did not find a device to boot.

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 Error Messages and Beep Codes

4.5 Port 80h POST Codes

During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O
port 80h. If the POST fails, execution stops and the last POST code generated is left
at port 80h. This code is useful for determining the point where an error occurred.
Displaying the POST codes requires a PCI bus add-in card, often called a POST card.
The POST card can decode the port and display the contents on a medium such as a
seven-segment display.

NOTE
The POST card must be installed in PCI bus connector 1.
The following tables provide information about the POST codes generated by the BIOS:
• Table 39 lists the Port 80h POST code ranges
• Table 40 lists the Port 80h POST codes themselves
• Table 41 lists the Port 80h POST sequence

NOTE
In the tables listed above, all POST codes and range values are listed in hexadecimal.

Table 39. Port 80h POST Code Ranges

Range Subsystem
0x00 – 0x05 Entering SX states S0 to S5.
0x10, 0x20, 0x30, Resuming from SX states. 0x10 – 0x20 – S2, 0x30 – S3, etc.
0x40, 0x50
0x08 – 0x0F Security (SEC) phase
0x11 – 0x1F PEI phase pre MRC execution
0x21 – 0x29 MRC memory detection
0x2A – 0x2F PEI phase post MRC execution
0x31 – 0x35 Recovery
0x36 – 0x3F Platform DXE driver
0x41 – 0x4F CPU Initialization (PEI, DXE, SMM)
0x50 – 0x5F I/O Buses: PCI, USB, ATA etc. 0x5F is an unrecoverable error. Start with PCI.
0x60 – 0x6F BDS
0x70 – 0x7F Output devices: All output consoles.
0x80 – 0x8F For future use
0x90 – 0x9F Input devices: Keyboard/Mouse.
0xA0 – 0xAF For future use
0xB0 – 0xBF Boot Devices: Includes fixed media and removable media. Not that critical since
consoles should be up at this point.
0xC0 – 0xCF For future use
0xD0 – 0xDF For future use
0xF0 – 0xFF

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Workstation W30 Rev2 Board Technical Product Specification

Table 40. Port 80h POST Codes

Port 80 Code Progress Code Enumeration
ACPI S States
0x00,0x01,0x02,0x03,0x04,0x05 Entering S0, S2, S3, S4, or S5 state
0x10,0x20,0x30,0x40,0x50 Resuming from S2, S3, S4, S5
Security Phase (SEC)
0x08 Starting BIOS execution after CPU BIST
0x09 SPI prefetching and caching
0x0A Load BSP microcode
0x0B Load APs microcodes
0x0C Platform program baseaddresses
0x0D Wake Up All APs
0x0E Initialize NEM
0x0F Pass entry point of the PEI core
PEI before MRC
PEI Platform driver
0x11 Set bootmode, GPIO init
0x12 Early chipset register programming including graphics init
0x13 Basic PCH init, discrete device init (1394, SATA)
0x14 LAN init
0x15 Exit early platform init driver
PEI SMBUS
0x16 SMBUSriver init
0x17 Entry to SMBUS execute read/write
0x18 Exit SMBUS execute read/write
PEI CK505 Clock Programming
0x19 Entry to CK505 programming
0x1A Exit CK505 programming
PEI Over-Clock Programming
0x1B Entry to entry to PEI over-clock programming
0x1C Exit PEI over-clock programming
Memory
0x21 MRC entry point
0x23 Reading SPD from memory DIMMs
0x24 Detecting presence of memory DIMMs
0x27 Configuring memory
0x28 Testing memory
0x29 Exit MRC driver
PEI after MRC
0x2A Start to Program MTRR Settings
0x2B Done Programming MTRR Settings

continued

80
 Error Messages and Beep Codes

Table 40. Port 80h POST Codes (continued)

Port 80 Code Progress Code Enumeration
PEIMs/Recovery
0x31 Crisis Recovery has initiated
0x33 Loading recovery capsule
0x34 Start recovery capsule/ valid capsule is found
CPU Initialization
CPU PEI Phase
0x41 Begin CPU PEI Init
0x42 XMM instruction enabling
0x43 End CPU PEI Init
CPU PEI SMM Phase
0x44 Begin CPU SMM Init smm relocate bases
0x45 Smm relocate bases for APs
0x46 End CPU SMM Init
CPU DXE Phase
0x47 CPU DXE Phase begin
0x48 Refresh memory space attributes according to MTRRs
0x49 Load the microcode if needed
0x4A Initialize strings to HII database
0x4B Initialize MP support
0x4C CPU DXE Phase End
CPU DXE SMM Phase
0x4D CPU DXE SMM Phase begin
0x4E Relocate SM bases for all APs
0x4F CPU DXE SMM Phase end
I/O BUSES
0x50 Enumerating PCI buses
0x51 Allocating resources to PCI bus
0x52 Hot Plug PCI controller initialization
USB
0x58 Resetting USB bus
0x59 Reserved for USB
ATA/ATAPI/SATA
0x5A Resetting PATA/SATA bus and all devices
0x5B Reserved for ATA

continued

81
Workstation W30 Rev2 Board Technical Product Specification

Table 40. Port 80h POST Codes (continued)

Port 80 Code Progress Code Enumeration
BDS
0x60 BDS driver entry point initialize
0x61 BDS service routine entry point (can be called multiple times)
0x62 BDS Step2
0x63 BDS Step3
0x64 BDS Step4
0x65 BDS Step5
0x66 BDS Step6
0x67 BDS Step7
0x68 BDS Step8
0x69 BDS Step9
0x6A BDS Step10
0x6B BDS Step11
0x6C BDS Step12
0x6D BDS Step13
0x6E BDS Step14
0x6F BDS return to DXE core (should not get here)
Keyboard (PS/2 or USB)
0x90 Resetting keyboard
0x91 Disabling the keyboard
0x92 Detecting the presence of the keyboard
0x93 Enabling the keyboard
0x94 Clearing keyboard input buffer
0x95 Instructing keyboard controller to run Self Test (PS/2 only)
Mouse (PS/2 or USB)
0x98 Resetting mouse
0x99 Detecting mouse
0x9A Detecting presence of mouse
0x9B Enabling mouse
Fixed Media
0xB0 Resetting fixed media
0xB1 Disabling fixed media

0xB2 Detecting presence of a fixed media (IDE hard drive detection etc.)
0xB3 Enabling/configuring a fixed media

continued

82
 Error Messages and Beep Codes

Table 40. Port 80h POST Codes (continued)

Port 80 Code Progress Code Enumeration
Removable Media
0xB8 Resetting removable media
0xB9 Disabling removable media
0xBA Detecting presence of a removable media (IDE, CDROM detection
etc.)
0xBB Enabling/configuring a removable media
DXE Core
0xE4 Entered DXE phase
BDS
0xE7 Waiting for user input
0xE8 Checking password
0xE9 Entering BIOS setup
0xEB Calling Legacy Option ROMs
Runtime Phase/EFI OS Boot
0xF8 EFI boot service ExitBootServices ( ) has been called
0xF9 EFI runtime service SetVirtualAddressMap ( ) has been called

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Workstation W30 Rev2 Board Technical Product Specification

Table 41. Typical Port 80h POST Sequence

POST Code Description
21 Initializing a chipset component
22 Reading SPD from memory DIMMs
23 Detecting presence of memory DIMMs
25 Configuring memory
28 Testing memory
34 Loading recovery capsule
E4 Entered DXE phase
12 Starting application processor initialization
13 SMM initialization
50 Enumerating PCI buses
51 Allocating resourced to PCI bus
92 Detecting the presence of the keyboard
90 Resetting keyboard
94 Clearing keyboard input buffer
95 Keyboard Self Test
EB Calling Video BIOS
58 Resetting USB bus
5A Resetting PATA/SATA bus and all devices
92 Detecting the presence of the keyboard
90 Resetting keyboard
94 Clearing keyboard input buffer
5A Resetting PATA/SATA bus and all devices
28 Testing memory
90 Resetting keyboard
94 Clearing keyboard input buffer
E7 Waiting for user input
01 INT 19
00 Ready to boot

84
5 Regulatory Compliance and Battery
Disposal Information

5.1 Regulatory Compliance

This section contains the following regulatory compliance information for Workstation
W30 Rev2 Board:
• Safety standards
• European Union Declaration of Conformity statement
• Product Ecology statements
• Electromagnetic Compatibility (EMC) standards
• Product certification markings

5.1.1 Safety Standards

Workstation W30 Rev2 Board complies with the safety standards stated in Table
42 when correctly installed in a compatible host system.

Table 42. Safety Standards

Standard Title
CSA/UL 60950-1 Information Technology Equipment – Safety - Part 1: General
Requirements (USA and Canada)
EN 60950-1 Information Technology Equipment – Safety - Part 1: General
Requirements (European Union)
IEC 60950-1 Information Technology Equipment – Safety - Part 1: General
Requirements (International)

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Workstation W30 Rev2 Board Technical Product Specification

5.1.2 European Union Declaration of Conformity

Statement
We, Intel Corporation, declare under our sole responsibility that the product
Workstation W30 Rev2 Board is in conformity with all applicable essential
requirements necessary for CE marking, following the provisions of the European
Council Directive 2004/108/EC (EMC Directive), 2006/95/EC (Low Voltage
Directive), and 2002/95/EC (ROHS Directive).
The product is properly CE marked demonstrating this conformity and is for
distribution within all member states of the EU with no restrictions.

This product follows the provisions of the European Directives 2004/108/EC,

2006/95/EC, and 2002/95/EC.
Čeština Tento výrobek odpovídá požadavkům evropských směrnic 2004/108/EC,
2006/95/EC a 2002/95/EC.
Dansk Dette produkt er i overensstemmelse med det europæiske direktiv
2004/108/EC, 2006/95/EC & 2002/95/EC.
Dutch Dit product is in navolging van de bepalingen van Europees Directief
2004/108/EC, 2006/95/EC & 2002/95/EC.
Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC, ja 2006/95/EC ja
2002/95/EC kehtestatud nõuetele.
Suomi Tämä tuote noudattaa EU-direktiivin 2004/108/EC, 2006/95/EC & 2002/95/EC
määräyksiä.
Français Ce produit est conforme aux exigences de la Directive Européenne
2004/108/EC, 2006/95/EC & 2002/95/EC.
Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie
2004/108/EC, 2006/95/EC & 2002/95/EC.
Ελληνικά Το παρόν προϊόν ακολουθεί τις διατάξεις των Ευρωπαϊκών Οδηγιών
2004/108/EC, 2006/95/EC και 2002/95/EC.
Magyar E termék megfelel a 2004/108/EC, 2006/95/EC és 2002/95/EC Európai
Irányelv előírásainak.
Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer
2004/108/EC, 2006/95/EC, & 2002/95/EC.
Italiano Questo prodotto è conforme alla Direttiva Europea 2004/108/EC,
2006/95/EC & 2002/95/EC.
Latviešu Šis produkts atbilst Eiropas Direktīvu 2004/108/EC, 2006/95/EC un
2002/95/EC noteikumiem.
Lietuvių Šis produktas atitinka Europos direktyvų 2004/108/EC, 2006/95/EC, ir
2002/95/EC nuostatas.
Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej
2004/108/EC, 2006/95/EC u 2002/95/EC.
Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet
2004/108/EC, 2006/95/EC & 2002/95/EC.
Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej
2004/108/EC, 206/95/EC i 2002/95/EC.

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 Regulatory Compliance and Battery Disposal Information

Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC,

2006/95/EC & 2002/95/EC.
Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC,
2006/95/EC & 2002/95/EC.
Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív
2004/108/EC, 2006/95/EC a 2002/95/EC.
Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC,
2006/95/EC in 2002/95/EC.
Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC,
2006/95/EC & 2002/95/EC.
Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC, 2006/95/EC ve 2002/95/EC
yönergelerine uyar.

5.1.3 Product Ecology Statements

The following information is provided to address worldwide product ecology concerns
and regulations.

5.1.3.1 Disposal Considerations

This product contains the following materials that may be regulated upon disposal:
lead solder on the printed wiring board assembly.

5.1.3.2 Recycling Considerations

As part of its commitment to environmental responsibility, Intel has implemented the
Intel Product Recycling Program to allow retail consumers of Intel’s branded products
to return used products to selected locations for proper recycling.
Please consult the http://www.intel.com/intel/other/ehs/product_ecology for the
details of this program, including the scope of covered products, available locations,
shipping instructions, terms and conditions, etc.
中文
作为其对环境责任之承诺的部分，英特尔已实施 Intel Product Recycling Program
（英特尔产品回收计划），以允许英特尔品牌产品的零售消费者将使用过的产品退还至指定地点作恰
当的重复使用处理。
请参考http://www.intel.com/intel/other/ehs/product_ecology
了解此计划的详情，包括涉及产品之范围、回收地点、运送指导、条款和条件等。
Deutsch
Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel
Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel
Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für
ordnungsgemäßes Recycling zurückzugeben.
Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte,
verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der
http://www.intel.com/intel/other/ehs/product_ecology

87
Workstation W30 Rev2 Board Technical Product Specification

Español
Como parte de su compromiso de responsabilidad medioambiental, Intel ha
implantado el programa de reciclaje de productos Intel, que permite que los
consumidores al detalle de los productos Intel devuelvan los productos usados en los
lugares seleccionados para su correspondiente reciclado.
Consulte la http://www.intel.com/intel/other/ehs/product_ecology para ver los detalles
del programa, que incluye los productos que abarca, los lugares disponibles,
instrucciones de envío, términos y condiciones, etc.
Français
Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis
en œuvre le programme Intel Product Recycling Program (Programme de recyclage
des produits Intel) pour permettre aux consommateurs de produits Intel de recycler
les produits usés en les retournant à des adresses spécifiées.
Visitez la page Web http://www.intel.com/intel/other/ehs/product_ecology pour en
savoir plus sur ce programme, à savoir les produits concernés, les adresses
disponibles, les instructions d'expédition, les conditions générales, etc.
日本語
インテルでは、環境保護活動の一環として、使い終えたインテル
ブランド製品を指定の場所へ返送していただき、リサイクルを適切に行えるよう、インテル製品リサイクル
プログラムを発足させました。
対象製品、返送先、返送方法、ご利用規約など、このプログラムの詳細情報は、http://www.intel.com/in
tel/other/ehs/product_ecology （英語）をご覧ください。
Malay
Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran,
Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan
pengguna-pengguna runcit produk jenama Intel memulangkan produk terguna ke
lokasi-lokasi terpilih untuk dikitarkan semula dengan betul.
Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology untuk mendapatkan
butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi
tersedia, arahan penghantaran, terma & syarat, dsb.
Portuguese
Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o
Programa de Reciclagem de Produtos para que os consumidores finais possam enviar
produtos Intel usados para locais selecionados, onde esses produtos são reciclados de
maneira adequada.
Consulte o site http://www.intel.com/intel/other/ehs/product_ecology (em Inglês)
para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos,
os locais disponíveis, as instruções de envio, os termos e condições, etc.

88
 Regulatory Compliance and Battery Disposal Information

Russian
В качестве части своих обязательств к окружающей среде, в Intel создана
программа утилизации продукции Intel (Product Recycling Program) для
предоставления конечным пользователям марок продукции Intel возможности
возврата используемой продукции в специализированные пункты для должной
утилизации.
Пожалуйста, обратитесь на веб-сайт
http://www.intel.com/intel/other/ehs/product_ecology за информацией об этой
программе, принимаемых продуктах, местах приема, инструкциях об отправке,
положениях и условиях и т.д.
Türkçe
Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin
Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri
dönüştürmesini amaçlayan Intel Ürünleri Geri Dönüşüm Programı’nı uygulamaya
koymuştur.
Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve
şartlar v.s dahil bütün ayrıntılarını ögrenmek için lütfen
http://www.intel.com/intel/other/ehs/product_ecology
Web sayfasına gidin.

5.1.4 EMC Regulations

Workstation W30 Rev2 Board complies with the EMC regulations stated in Table
43 when correctly installed in a compatible host system.

Table 43. EMC Regulations

Regulation Title
FCC 47 CFR Part 15, Title 47 of the Code of Federal Regulations, Part 15, Subpart B, Radio
Subpart B Frequency Devices. (USA)
ICES-003 Interference-Causing Equipment Standard, Digital Apparatus. (Canada)
EN55022 Limits and methods of measurement of Radio Interference Characteristics
of Information Technology Equipment. (European Union)
EN55024 Information Technology Equipment – Immunity Characteristics Limits and
methods of measurement. (European Union)
EN55022 Australian Communications Authority, Standard for Electromagnetic
Compatibility. (Australia and New Zealand)
CISPR 22 Limits and methods of measurement of Radio Disturbance Characteristics of
Information Technology Equipment. (International)
CISPR 24 Information Technology Equipment – Immunity Characteristics – Limits and
Methods of Measurement. (International)
VCCI V-3, V-4 Voluntary Control for Interference by Information Technology Equipment.
(Japan)
KN-22, KN-24 Korean Communications Commission – Framework Act on
Telecommunications and Radio Waves Act (South Korea)
CNS 13438 Bureau of Standards, Metrology, and Inspection (Taiwan)

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Workstation W30 Rev2 Board Technical Product Specification

FCC Declaration of Conformity

This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) this device may not cause harmful interference, and (2)
this device must accept any interference received, including interference that may
cause undesired operation.
For questions related to the EMC performance of this product, contact:
Intel Corporation, 5200 N.E. Elam Young Parkway, Hillsboro, OR 97124
1-800-628-8686
This equipment has been tested and found to comply with the limits for a Class B
digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference in a residential installation.
This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not
occur in a particular installation. If this equipment does cause harmful interference to
radio or television reception, which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the interference by one or more of the
following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment to an outlet on a circuit other than the one to which the
receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications to the equipment not expressly approved by Intel
Corporation could void the user’s authority to operate the equipment.
Tested to comply with FCC standards for home or office use.
Canadian Department of Communications Compliance Statement
This digital apparatus does not exceed the Class B limits for radio noise emissions from
digital apparatus set out in the Radio Interference Regulations of the Canadian
Department of Communications.
Le présent appareil numerique német pas de bruits radioélectriques dépassant les
limites applicables aux appareils numériques de la classe B prescrites dans le
Réglement sur le broullage radioélectrique édicté par le ministére des Communications
du Canada.

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 Regulatory Compliance and Battery Disposal Information

Japan VCCI Statement

Japan VCCI Statement translation: This is a Class B product based on the standard of
the Voluntary Control Council for Interference from Information Technology Equipment
(VCCI). If this is used near a radio or television receiver in a domestic environment, it
may cause radio interference. Install and use the equipment according to the
instruction manual.

Korea Class B Statement

Korea Class B Statement translation: This equipment is for home use, and has
acquired electromagnetic conformity registration, so it can be used not only in
residential areas, but also other areas.

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Workstation W30 Rev2 Board Technical Product Specification

5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP

Compliance
The US Department of Energy and the US Environmental Protection Agency have
continually revised the ENERGY STAR requirements. Intel has worked directly with
these two governmental agencies in the definition of new requirements.
Workstation W30 Rev2 Board meets the following program requirements in an
adequate system configuration, including appropriate selection of an efficient
power supply:
• Energy Star v5.0, category B
• EPEAT*
• Korea e-Standby
• European Union Energy-related Products Directive 2009 (ErP) Lot 6

NOTE
Energy Star compliance is based at the system level not the board level. Use of an
Intel Desktop Board alone does not guarantee Energy Star compliance.

For information about Refer to

ENERGY STAR requirements and recommended configurations http://www.intel.com/go/energystar
Electronic Product Environmental Assessment Tool (EPEAT) http://www.epeat.net/
Korea e-Standby Program http://www.kemco.or.kr/new_eng/pg02/
pg02100300.asp
European Union Energy-related Products Directive 2009 (ErP) http://ec.europa.eu/enterprise/policies/s
ustainable-business/sustainable-
product-policy/ecodesign/index_en.htm

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 Regulatory Compliance and Battery Disposal Information

5.1.6 Regulatory Compliance Marks (Board Level)

Workstation W30 Rev2 Board has the regulatory compliance marks shown in Table

44. Table 44. Regulatory Compliance Marks

Description Mark
UL joint US/Canada Recognized Component mark. Includes adjacent UL file
number for Intel Desktop Boards: E210882.

FCC Declaration of Conformity logo mark for Class B equipment.

CE mark. Declaring compliance to the European Union (EU) EMC directive,

Low Voltage directive, and RoHS directive.

Australian Communications Authority (ACA) and New Zealand Radio

Spectrum Management (NZ RSM) C-tick mark. Includes adjacent Intel
supplier code number, N-232.

Japan VCCI (Voluntary Control Council for Interference) mark.

Korea Certification mark. Includes an adjacent KCC (Korean Communications

Commission) certification number:
KCC-REM-CPU-DX79SR.

Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark.

Includes adjacent Intel company number, D33025.

Printed wiring board manufacturer’s recognition mark. Consists of a unique V-0

UL recognized manufacturer’s logo, along with a flammability rating (solder
side).
China RoHS/Environmentally Friendly Use Period Logo: This is an example of
the symbol used on Intel Desktop Boards and associated collateral. The color
of the mark may vary depending upon the application. The Environmental
Friendly Usage Period (EFUP) for Intel Desktop Boards has been determined
to be 10 years.

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5.2 Battery Disposal Information

CAUTION
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be
recycled where possible. Disposal of used batteries must be in accordance with local
environmental regulations.

PRÉCAUTION
Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les
piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des
piles usagées doit respecter les réglementations locales en vigueur en matière de
protection de l'environnement.

FORHOLDSREGEL
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier
bør om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i
overensstemmelse med gældende miljølovgivning.

OBS!
Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier
bør kastes i henhold til gjeldende miljølovgivning.

VIKTIGT!
Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras
enligt de lokala miljövårdsbestämmelserna.

VARO
Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on
mahdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten
mukaisesti.

VORSICHT
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie
darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen
Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen
des Herstellers entsprechend.

AVVERTIMENTO
Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto.
Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per
disfarsi delle pile usate, seguire le istruzioni del produttore.

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PRECAUCIÓN
Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice
solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del
equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del
fabricante.

WAARSCHUWING
Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type
batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het
weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.

ATENÇÃO
Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto.
As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias
usadas deve ser feita de acordo com as regulamentações ambientais da região.

AŚCIAROŽZNAŚĆ
Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу.
Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых
акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі.

UPOZORNÌNÍ
V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné,
baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními
předpisy o životním prostředí.

Προσοχή
Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία
λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι
δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με
τους κατά τόπο περιβαλλοντικούς κανονισμούς.

VIGYÁZAT
Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket
lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi
előírásoknak megfelelően kell kiselejtezni.

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AWAS
Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri
sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi
peraturan alam sekitar tempatan.

OSTRZEŻENIE
Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu
baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi
przepisami ochrony środowiska.

PRECAUŢIE
Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător.
Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să
respecte reglementările locale privind protecţia mediului.

ВНИМАНИЕ
При использовании батареи несоответствующего типа существует риск ее взрыва.
Батареи должны быть утилизированы по возможности. Утилизация батарей должна
проводится по правилам, соответствующим местным требованиям.

UPOZORNENIE
Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu.
Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí
vykonávať v súlade s miestnymi predpismi na ochranu životného prostredia.

POZOR
Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo.
Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi
okoljevarstvenimi predpisi.

UYARI
Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri
dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır.

OСТОРОГА
Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху.
Якщо можливо, використані батареї слід утилізувати. Утилізація використаних
батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля.

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