CompTIA A+ 220-901 Notes

Module 1: Intro
PC Concepts 1

Every piece of hardware need 3 things:

Electricity to power device, software to control it and A method to comms with CPU

Software to control device – device drivers & app software

Elec – 12V or 5V

Communications – data pathway called a bus and other configurable options IRQs, I/O addy & DMA channels.

PCs use Binary numbering system

Module 2: Internal HW Components

Motherboards

Main circuit board in PC. Provides connections for all devices.

Primary connection is called a bus or data pathway

FSB Front Side Bus or System Bus
Backside bus
Divided into Address, Data & Control Bus
Expansion Bus
Size of bus controls amount of data

Chipset – one of more chips embedded on M/B providing: mem control, sys bus functions, audio, video display, systems
mgmt.

2 most important are Northbridge and Southbridge which together with CPU define functions and capabilities of PC.

Northbridge - connected directly to CPU and responsible for tasks that require highest level of performance. Directly
connected to memory and graphics bus

Southbridge – implements slower capabilities on M/B. interacts with I/O devices. Drive controllers, USB, PCI devices

M/B provides connections for: RAM, CPU, HDD, DVD, mouse, sound, expansion cards.

Riser cards – connects to m/b to provide expansion slots usually in a horizontal for smaller cases

Daughter boards – connects to another circuit board to provide specific functionality eg additional video or sound

Form Factor – size and shape of M/B as well as describing power supply and case to be used
ATX – created in 96 still popular: mini-atx, micro-atx, flexatx
ITX, mini-itx, pico-itx ()used to support ARTOM & corei3-7 CPUs

Firmware
2 integral parts on M/B are BIOS & CMOS chips

BIOS – Basic Input Output System – set of software instructions stored on a chip on M/B that enables basic PC functions

CMOS – Complementary Metal Oxide Semiconductor – stores BIOS config info

UEFI – Unified Extensible Firmware Interface – replaces BIOS as standard firmware interface for PCs

Advantages:

 better security incl secure pre-boot process

 faster startup times and resuming from hibernation
 supports drives >2TB
 support for 64-bit architecture
 backward compatible

BIOS Settings – date/time, integrated devices, plug n play, power mgmt., boot order, virtualization support

BIOS/UEFI Security settings

BIOS passwords – supervisor/boot

Trusted platform Module (TPM)

 security chip on M/B used for full volume encryption

 prevents tampering with hardware components
 can be combined with a PIN number required to start the system
 think MS bitlocker

UEFI Settings

 Secure Boot
o Standard requiring OS to check integrity of system file before boot process proceeds
 LoJack
o Allows remote location, remote locking and remote wipe
o Allows tracking

BIOS performs POST – Power On Self Test as built-in diagnostics of the system

POST checks

 CPU, BIOS, CMOS

 Video
 BIOS itself
 Test main system memory
 Locates boot device according to boot order executes Master Boot Record on boot sector

Most modern systems firmware allows monitoring options – temp, fan speeds, voltage, etc.
BIOS upgrades are possible by “flashing” info stored on flash ROM chip.

BIOS upgrades allow: Higher content memory chips, updated instructions sets for CPUs, more recent USB support

Power supply

Converts AC to DC but also drops voltage from 220V – 3.3,5 & 12V

Rated by Watts they output

Must supply ample wattage for all components & provide correct connectors

Molex connector – 4 pin large used for older HDDs and DVD drives Yellow(12V), Red 5V , Black Ground

5-15W for IDE

SATA Serial ATA power 3 pins for 3.3V, 5V & 12V with each pin carrying 1.5A – total draw of 30W

M/B connectors – Single P1 20/24 pin on recent M/Bs

4/8 pin 12V used for supplemental power

PCIe 6/8 pin – connects higher end video cards

Also

 Dual rail power supplies use multiple wires (rails)

o Do not increase power
o Decrease chance of overheating
 Size must match the chassis
 Number of connectors
 ATX vs micro ATX
 Dual voltage options
Replace rather than repair PSU – never open a power supply

Before replacing PSU – use multimeter to measure power from connectors, check fan

Replacing PSU – remove connectors from components, unscrew, replace and reconnect

CPU

Responsible for controlling activities between components and processing all data

CPU components: Arithmetic Logic Unit ALU, Control Units & Registers

Packaging contains CPU microchip and made from plastic or ceramic

PGA Pin Grid Array – old tech

LGA Land Grid Array

Ceramic Pin Grid Array

Intel (Memorize these)

LGA 775

1156 – Socket H

1155 – Socket H2

1366 – Socket B

1150

2011

AMD

940

AM2 & AM2+

Athlon 64 & Opetron

AM3 3+

Phenom & Sempron

FM1

Fm2 – AMD Trinity

FM2+ AMD Keveri

CPU characteristics

Speeds – frequency or clock cycles, Cores – single or multiple that act as multiple processors so more is better

Cache and type

 Extremely fast memory used to store data as it enters or leaves CPU

 L1 – holds data waiting to enter CPU, called Front Side Cache and built into CPU or on-die
 L2 – holds data exiting CPU called backside cache – in same packaging but on separate chip
 L3 – external to CPU

Hyperthreading

 Feature that enables a PC to multitask more efficiently

 Allows multiple threads to run simultaneously

Virtualization support

 CPUs support virt. Along with BIOS to achieve max benefits

 Allows Hypervisor to dynamically allocate CPU to the VMs as required

Architechture

 32-bit – x86 or 64 bit – x64

Integrated Graphics Unit GPU

 Specialized circuit to rapidly manipulate and alter mem

 Accelerates image building for display output
 Improves graphic abilities of PC if on CPU
 Required by latest Oss for their visual effects

Disable Execute Bit

 The NX( No eXecure) bit used in CPS to segregate areas of mem for storing instruction or storing data
 EDB is present on Intel chips to reduce malware vulnerability
 Called Enhanced Virus Protection on AMD

CPU generate lots of heat and requires cooling

 Heat sink designed to absorb and transfer heat away from CPU
 CPUs require heat sink and cooling units
 Thermal compound is glue that transmits heat from CPU to heat sink
 Fan assemblies are active cooling

Liquid based cooling cases circulate water around components

 More pricey & difficult to install

 Makes lease noise
 Problems arise from pump failure, leaks, corrosion or hoses or fittings
Fanless/Passive

 Use an alternate mechanism to ensure cooling

 Efficient heat sink
 Liquid based cooling
 Thermal heat pipe
o Liquid turned to vapour, vapour moved down pipe, turned back into liquid to cool, cycled around to
restart process

Memory

RAM called primary storage

 RAM for running applications

 ROM – chips on M/B and devices store instructions permanently

RAM affects performance and software support

Storage locations in mem chips are called cells and each store a single bit of data

Basic Units

 Bit – 1 bit, Nibble – 4 bits, Byte – 8 bits

 Kilobyte – 1024 bytes, MB 1024 KB, GB – 1024 MB, TB – 1024 GB

Mem Types

 Volitile vs Non-volatile
 Staic vs Dynamic – static is faster
 Asynchronous v Synchronous

Each cell in mem has an address

Mem controller in Northbridge and CPU access data at different addresses

DDR – Double Data Rate SDRAM, DDR2 64 bits twice on each clock cycle, DDR3 twice data rate over previous

Mem characteristics

 Access Time
o Latency time between requesting address and when data is ready to be sent back to CPU
o Mem speed – MHz frequency
o Bandwidth – actual amount of data transferred to/from mem
 Buffered vs unbuffered
o Buffered is mem that has register between it and mem controller
o Reduces load on controller and allows device to support more mem

Mem

Type Tech (Type/8) Bandwidth (Tech*8) Speed

 PC2-6400 DDR2-800 6.4BG/sec 400MHz
PC3-10600 DDR3-1333 10.6GB/sec 667MHz

Packaging

 Mem chips called modules

 Early mem modules were single sided
 Only have DIMMS now Dual Inline Mem Module 168, 184 & 240 pins
 SODIMMS Small Outline DIMMS – used in laptops etc 144, 200 & 204 pins

Error Recovery

 Parity – enables detection of mem errors using even or odd parity schemes. Used by both mem controller and
CPU
 ECC – Error Correcting Code  Permits PC not only to detect errors in mem but also correct them

RAM configs

 Can use single channel or multiple channels

 Multiple channels will increase transfer speed between RAM and controller
 Dual channel will create two 64 bit paths by using 2 or more mem modules installed into different mem banks
 Triple channel uses a third module and interleaving to reduce mem latency

Installation and handling techniques

 Banking requirements or slots

 Proper handling – hold on edges don’t touch chips or electrical contacts
 Slot insertion – 90 degrees
 RAM compatibility – Mem always operates at speed of slowest module
 Cleaning

Module 3 - Storage
Overview

 HDD secondary permanent storage

 Different types with varying characteristics
o Access time, capacity, physical media used – magnetic, optical or solid state/flash
 Various drive interfaces – how communicate with drive
 Controller is adaptor that plugs into the motherboard
 Drive standards – PATA/IDE, SATA, eSATA, SCSI (Small Computer Systems Interface)
 SATA
 3 SATA standards
 SATA1 – orig spec with 150Mbps transfer rate
 SATA2 – 300 Mbps, SATA3 – 600Mbps

eSATA standardized in 2004 for external connectivity

eSATA cables and connectors

 max length of 2m
 have 7 pins but lacks the L shape
 additional shielding and has retention features to prevent accidental unplugging

Magnetic drives

 Fixed disk drive has components

 Platters – metal or plastic disc coated with magnetic material
 Spindle – axis or central hub platters connected to
 Read/write heads – sit on actuator that do data writing/reading

HDD Geometry

 Tracks – concentric circles written on platter

 Sectors – each track is divided into sectors
 Cylinder – logical collection of all tracks at a given distance from axis
 Cluster – logical grouping of sectors

Sectors typically 512 bytes and is smallest physical space that can be written on drive.

Each cluster contains between 4-64 sectors and represent the smallest logical space the OS can write files

Mech drives spin at between 5400 – 7200 rpm

Some drives support hot-swappable config – USB, Firewire, SATA

SSDs

 Use nonvolatile mem chips with no moving parts

 Faster startup and access, noiseless, high reliability

SSD differ from flash media meant to be permanent replacement for mag drives

Different technique used to retain data

 Non volatile flash, volatile RAM and external power or batteries

Heavily used in smartphones, tablets, laptops

Hybrid Drives

 Combines speed of SSD and cost effectiveness of mag drives

 Dual drive hybrid – 2 drives in the same machine
 SS hybrid – includes solid state flash in traditional HDD

Flash drives – high storage capacity, hot swappable, small form factor

 More features – security: password protection, fingerprint scanners, encryption

 LED indicates activity, write protection switch
  Flash mem cards – SD, xD, Compact flash

Compact Flash

Widely use form of solid storage, type 1 & type 2

SD Secure Digital

 Max capacity of standard is 512GB

 Types: SDHC – 32GB, SDXC – 2TB, micro-sd & mini-sd

xD picture card – older type, 16MB – 2GB

eMMC – Embedded Multi-Media Controller

 type of flash mem, slower and SSD, cheaper than SSD

 embedded on board of device and similar to SD

Optical Drives

 Use a laser to change chars of their media. CD, DVD, Blu-Ray

 CD-R & RW, etc

CD – Compact Disc

 Provide read only long terms storage, 7/800MB capacity, combo drives can read/write

Components

 Drive motor to spin discs, laser lens and laser pickup – focus in and read data, tracking drive and motor – moves
laser to follow tracks on CD
 Optional components – nav buttons, vol dials, headphone jacks, small hole to eject media

DVD digital versatile disc

 Higher density, different laser, higher capacity

Blu-ray – shorter wavelength blue-violet laser allows for 6x storage over DVD

 BD-R, -RE, -J (bd live, picture in picture)

 Capacitites 25GB original

Could use IDE or SATA connections or USB, firewire if external

RAID - Redundant array of independent discs

 Either software or hardware implementation

 HW uses dedicated controller, SW uses OS resources
 Redundancy provided using parity and mirroring

Levels

 RAID 0 – disk striping – have backup cos not redundant

 1 – disc mirroring
  5 – striping with parity
 6 – striping with double parity
 1 + 0 – mirrored stripe sets, min 4 drives

Tape Drive

 Used for backups – low cost, high capacity

 Slow performance cos of sequential access. Have compression ratio of at least 2:1
 Formats: QIC, DDS, DLT, LTO, AIT

Installing Drives

 Locate open space in chassis, insert drive, screw in place or use plastic assembly, clips
 Connect power, data connector, audio for optical drive, device id for IDE or SCSI

Module 4: Expanding HW
Bus is comms pathway in PC and each system has many

 Address bus carries mem locations

 Data bus carries info between CPU and mem
 Video bus carries info between CPU and video circuitry
 Expansion bus carries data from add on cards
 Riser bus can be used instead of expansion bus at a cheaper cost

Peripheral Component Interconnect (PCI) replaced all previous bus standards in 1992

 33MHz or 66MHz
 Supports 32 (133MBps tf rate) & 64 bit (533MBps transfer) arch
 Slots are white by convention and PCI devices are plug n play by design

PCIe developed in 2014 replaced PCI

 Uses serial comms

 Connection between device & sys known as a link
 Each link can use 1 or more lanes supporting dedicated bidirectional traffic at 250MBps
 PCIe devices & slots come based on the number of lanes pronounced “by x” eg by-16
 Smaller devices like modems, sound & network cards are often x1 or x2
 Video cards using PCIe always x16

Video buses

 Has own data pathway to Northbridge cos of high graphics requirements

For devices to comms with host, SW & HW must work together

 Have an Interrupt Request IRQ

 Access shared mem locations I/O Address
 Transfer data across bus
  Interact with OS using device driver

Expansion tech

 Factors - Internal or external, age of device, required comms speeds

 USB & PCIe most common options

Universal Serial Bus USB

 Hot swapping and self config

 Multi device support – up to 127 devices on the bus
 High speed data tf depending on version

USB Versions

 1.1 – tf rate up to 12MBps – cable up to 3m

 2.0 – High Speed USB @ 480MBps backward compatible with 1.1 – cable up to 5m
 3.0 – Superspeed tf rates up to 5.0Gbps – no real cable length limit
 3.1 - tf speeds up to 10 Gbps

USB Classes

 Host – one host per bus & provides power to devices & manages config
 Device – function device & USB hubs (provide additional USB ports)

USB physical chars

 Type A most common

 Type B on devices with removable cables
 Mini A & mini B in phones and cameras

USB Power

 Host provides 5V power @ 6A

 Smaller devices can use this amount
 Larger devices needing 12V need external power

Firewire

 Developed by Apple as high speed peripheral interconnection bus for serial comms

Features

 Hot swapping and self config

 Supports up to 63 devices (1/2 of USB)
 Data tf rates of 800MBps and up
 Asynchronous & isochronous data tf supporting time-critical tf like video

Institute of Electrical and Electronics Engineers (IEEE) as IEEE1394 also called i.Link

Versions

 1394 Firewire 400 – data tf up to 400Mbps cable length 4.5m

  1394b Firewire 800 – data tf 800Mbps, cable length 4.5m

Connectors

 FW400 use 4/6 pin connector

 FW800 use 9 pin

Firewire bus provides 30V power – much more than USB

Video Cards

 Can be embedded on M/B – basic functionality, expansion card give higher performance
 Factors for choosing card: Bandwidth, mem (gaming, CAD, Video editing), 3D requirements
 Terminology: Refresh rate, resolution, pixel depth, onboard mem
 Installing is similar to other expansion cards
 Remember to disable onboard video card

Video Electronics Stands Assoc created standard VESA BIOS Extensions like SuperVGA and UXGA & WUXGA (wide ultra
extended graphics array)

Video connectors

VGA - 15 pin VGA called DB-15 – analog signal

DVI – Digital Visual Interface

 DVI-I (Integrated) supports both analog and digital has 4 pins and flat connector on left if looking at it
 DVI-D (Digital only) has flat connector only
 DVI-A analog only has 4 pins and flat connector and a lot less other pin slots

DisplayPort

 Digital interface to replace DVI and VGA

 Max 8.64Gb/s data rate over 2m cable
 Current version 1.2a

High Definition Multimedia Interface (HDMI) transmits uncompressed digital data

 Carries video and 8 channels of audio over single cable

 Type A connector has 19pins
 Type B , Type C - Mini and Type D - Micro
 MiniHDMI used in mobile devices

MiniDIN-6 is older connector – 6 pins in a circle with plastic inner rectangular piece like PS2

BNC Bayonette Niel-Concelman – used in place of RCAs for video

Multiple adaptors to change between standards

DVI-HDMI (could be cable or inline connector), USB A to B, USB to Ethernet, DVI to VGA, Thunderbolt to DVI,
HDMI to VGA
Sound Cards

Multifunction devices that convert analog signals to digital and vice versa to play sounds on speakers

Components

 Digital signal processor (DSP)

 Analog to digital convertor (ADC)
 Digital to analog convertor (DAC)
 Jacks for connecting devices

Types – PCI, PCIe, intergrated

Integrated cards don’t always provide all capabilities

Installing is similar to other expansion cards, just rem to connect 4 pin audio connectors on card

Network cards

Network Interface Card NIC

 Connect PC to network and contain transceiver

 Mostly embedded on M/B
 Expansion cards could add wireless capabilities
 Entirely software configurable – require a network client and protocol for comms to occur

Wired NIcs are usually Gigabit Ethernet & wireless NICS use 802.11 g/n/ac

Wireless NICs

 Bluetooth - radio signal to create PAN, operates on 2.4GHz frequency but incompatible with 802.11, offer
3Mbps tf over 30-35 feet
 Infrared – Direct line of sight, older tech

Radio Frequency (RF) – describes both Bluetooth & wireless standards like 802.11

Near Field Comms (NFC) – no pairing requires, slower than Bluetooth, operates at 20cm at data rates of .424Mbps

Thunderbolt

o Expansion cards envisioned to use fibre optic cable

o Adapted by intel and apple to use copper

Thunderbolt chars

 Controller treats thunderbolt and non-thunderbolt devices differently. 5.4Gbps throughput of non- Thunderbolt
and 10Gbps for Thunderbolt
 Restricted to apple devices and provides unique advantages over USB
 Wireless/Cellular Cards
 Provides mobile phone connection using cell data networks and usually USB devices
Modem – modulator demodulator – changes analog to digital signals and reverse too

TV Tuners – allows tv signals to be received by PC and can capture video. Types: PCI, PCIe, USB & Firewire

Riser cards – helps decrease costs, usually used on low cost PCs. Puts multiple capabilities on 1 card like NIC, audio, etc

RS-232 defines older serial and parallel standards

Module 5: Peripheral Devices

Input Devices

Anything outside the chassis is a peripheral device like mouse, keyboard. 2 cats: input & output

Need a physical port & resources handled by PnP (Plug n Play)

Mouse, keyboard, webcams, barcode readers, biometrics, microphones, speakers, cameras

Legacy mouse n keyboard used PS2 or 6 pin mini-DIN connector – not hot swappable, colour coded, replaced by USB

Mice – optical, mechanical, wireless (infrared, radio), trackball

Can control speed, style, double click options through OS for mouse. Surface affects quality of movement too.

Maintenance varies on mice

 Mech require cleaning IPA

 Optical require clean reflective surface
 Wireless use batteries and wireless sensor
 Additional buttons may require programming

Keyboard – PS2 and USB connection, 110 keys in qwerty layout

 Ergonomic option, wireless using infrared or radio. Some special types like gaming or membrane
 Kb’s can be configured with alternate layouts, specialty keys add functionality

Biometric devices – fingerprint & iris & retina scanners, facial and voice recognition – provide “who you are” security

Security factors: what you know, what you have and who you are.

Mic – connects to sound card, speech input and recognition

Sound quality based on cost and type, direction of speech, gain, pnp possible

Digitizers – convert analog signals to digital. Easy way to input info into PC. Often used on mobile systems.

Other devices: Barcode readers, credit card scanners, gaming joysticks, game pads, web cams

KVM switch – kb, video, mouse. Connects a single monitor, kb, mouse to multiple Pcs.

Motion Sensors could be used to control PC using hand gestures, no mouse of kb required

Touchpad – performs basic mouse functions

Smartcard readers – accepts a smart card that contains a cryptographic chip. Higher security scenarios require an
additional logon

Digital cameras – capture digital images and transfer to Pc or cloud

 Software can organize, index, transfer

 Camcorders capture video, but all new cameras capture video and still images
 Chars – quality of images expressed as megapixels, mem cards and flash mem used as storage
 Connects to PC in various ways – USB, Firewire, HDMI

Card readers – cards appear as disk drives like a USB flash drive

Webcam – transfers image and video across internet, included in all mobile devices

Video recording and conferencing, used by apps like skype, etc. usb connection and could have a mic

Midi-enabled devices

Musical Instrument Digital Interface for encoding, storing, syncing musical info

Digital recording of instruments like keyboards etc

Output Devices

Video Monitors: CRT, LCD, Plasma, LED, Touch screens

Cathode Ray Tube (CRT)

Images created using 3 separate electron streams to produce RGB colours. Beams paint the video picture on the
back of the monitor screen many times per second called refresh rate.

Chars

 Screen size measured diagonally

 Aspect ratio is horizontal to vertical relationship
 Resolution – no of pixels on monitor – horiz rows x vert columns
 Refresh rate explained earlier
 Dot pitch – distance in mm between dots of same colour

Troubleshooting and maintenance

 Ensure proper ventilation

 Clean screen with wipes designed for monitors
 Never open monitor
 Check power if screen black
 Flickering or distorted images check surrounding equipment that may be causing EMI or check video connectors
have proper contact

Liquid Crystal Display LCDs use Thin-Film Transistor (TFT) tech

Uses less power, create less heat, use less space, less glare, less radiation
Works

 Liquid crystals are chemicals whose molecules can be aligned by presence of an electric field
 When aligned they let light through
 LCDs have several layers including liquid crystal, light source and colour layers
 Individual transistors control transparency of each pixel

LCDs could use LED or fluorescent backlighting

2 major LCD tech

 Twisted Nematic (TN) – older tech, short response time, high brightness, less power, narrow image angles
with colour distortion at higher angles
 In Plan Switching (IPS) - - better colour qual, slower response times, more expensive

Chars

 Screen size measure diagonally

 Viewing angle – max angle at which display is completely visible
 Response rate – how quickly pixels are able to change colours measure in millisconds
 Contrast ratio – ratio between brightest white and darkest black
 Native resolution – num of individually addressable pixels in the screen matrix
 Brightness/lumens – brightness of monitor
 Aspect ratio – 4:3 is original, 16:9 is defacto today

LCD resolution standards

SXGA 1280x1024, WSXGA 1440x990, … WUXGA 1920x1200 is native resolution of 22” and over

Troubleshooting LCDs

 Indicator lights on front are good indicator

 Shaky images usually caused by analog connectors could be fixed by auto adjust
 Fuzzy images usually caused by not running the LCD at native resolution
 If no image check cables and power
 Heat and cold can cause discoloration

LED (Light Emitting Diode) monitors

 Superior quality to previous LCDs

  Differences to LCD – backlighting, energy consumption, viewing angle, price

LEDs are LCDs using different backlight

 WLEDs (white LEDs) use special diffuser to spread light

 RGD LED – more expensive, RGB aligned over entire panel matrix, more accurate colour

Organic LED

 Uses layer of organic compound with emissive electroluminescent qualities

 Emits light in response to electic current
 Does not use backlight
 Organic layer resides between electrodes

Plasma

 Advantages: high contrast ratio, wide viewing angles, less visible motion blur
 Disads: heavier and bulkier, use more power, susceptible to screen burn

Touch screen – contain capacitive touch-sensitive surfaces for input

 Found on POS terminals, ATMs, etc.

 Some use stylus , others use finger input

Touch screen types

 Additional layer over screen or

 Capacitors between layers over screen or
 Acoustic waves

Maintenance

 Connections could be damaged by hard pressing to sharp objects

 Screen can be cracked – sensors would be disoriented
 Calibration required for pinpoint accuracy

Projectors

 Optical device produces image on flat surface or projection screen

 VGA, DVI or wireless connection options

Video properties of OS adjust all the options or buttons on monitor

Degaussing – automatic demagnetization of a monitor

Printers

Dot Matrix – impact style printer using pins that strike paper through ink ribbon to produce image

Continuous form paper pulled through tractor feed

Components

 Print head – usually 9 or 24 pins pushed forward in a pattern to produce nums, letters, shapes
  Inked ribbon
 Tractor feed for paper
 Interface usually serial or parallel

Print quality comparable to typewriter called Near Letter Quality (NLQ)

Maintenance

 Keep clean to extend lifespan

 Use compressed air to remove dust and debris
 Rollers cleaned with rubbing alcohol (IPA) iso propyl alcohol
 Print head cleaned with special oil
 Tractor feed can be dangerous is loose clothing or jewelry get caught

Inkjet - use ink dispersion to make images by forcing ink through tiny nozzles out onto paper

2 types: Thermal bubble or Piezoelectric

Chars

 Cartridges – ink reservoirs for black and other colours

 Print heads – component that contains very small nozzles and contained on ink cartridge making them expensive
 Number of nozzles affect printer DPI rating

Installation and maintenance

 USB connections with PnP

 May have additional software for management
 Possible to use ink refilling kits but not recommended
 Be aware of dust and proper airflow

Spooler takes jobs sent to printer, writes them to file to free memory then prints from there

Troubleshooting

 Nothing prints
o Check if jobs are making it to the print queue – comms problem
o Check power and connections
o Check ink cartridges
 Poor print quality or stray lines
o Clogged heads, dust
o Maybe incorrect drivers

Laser Printers

 Most popular for biz or any high volume printing

 Produce high quality docs at high speeds
 Use an electrophotographic process using laser, toner & electrostatic charges
 Contain FRU (Field Replaceable Unit) or components that can be replaced
o Toner cartridge, laser assembly, power supplies, paper control and transport assembly, transfer corona
assembly, fusing assembly
Print Process – Cleaning, conditioning, writing, developing, transferring, fusing

 Cleaning – cleaning blade cleans residual toner and charge from drum
 Conditioning - Corona charges drum negatively -600V
 Writing – Laser writes image on drum by charging those points on drum to -100V
 Developing – Toner is negatively charged and is attracted to more positively charged areas of drum
 Transferring – Toner attracted to positively charged paper
 Fusing – 350 degrees of heat on rollers melt toner onto paper

Maintenance

 Require more maintenance than other printers

 Replacing toner cartridges
 Cleaning internal components
 Cleaning toner out of inside of printer when replacing components
 Ensure proper ventilation to prevent overheating

Troubleshooting

 Wear gloves and masks when working with toner

 Be careful of High Voltage Power Supplies (HVPS) and corona and fusing assembly cos they’re hot
 Paper jams can be cause by humidity and faulty corona wiring
 Partial prints/smudges
o Light prints – low toner
o Indistinct images – HPVS or corona wiring problem
o Toner flaking off paper indicates problem with fuser
 Repeating/Stray marks
o Continuous marks – scratch in the drum
o Repeating marks – dirty rollers
o Random stray dots or wavy output – bad formatter board

Thermal Printers - produce output with heat where image created using heating mechanism and special paper either by

 Thermal wax transfer

 Direct thermal
 Thermal autochrome

Virtual Printing

Converts doc into certain file format. Print to file - .prn; PDF, XPS, Image

Installing Printers

 Printer driver – software that converts OS commands into printer language

 Physical connection and cabling
 Logical printer
Connection types – serial, parallel, SCSI, USB, Firewire, Ethernet or wireless

Network printers that are shared can be installed by standard users

Only power users or admins can install local printer. Choices include connection type, device driver, shared status

Use Universal Naming Convention (UNC), URL or search directory to install network printer

Scanners

Convert pictures and text into digital data. Come as standalone or part of multifunction device

Stand alone or hand held. High end scanners support OCR (Optical Character Recognition) to distinguish text

Connection – USB, firewire, SCSI

Installation – similar to other devices, sometimes 3rd party software allows more functionality over OS included app

Multifunction Devices – print, scan, copy

Various configs

 Duplex – optional setting that lets you print on both sides of paper
 Collate – arranging print job in proper order
 Quality – sharpness, colour depth
 Orientation – page layout

Connectivity – USB, Ethernet, wireless (Bluetooth, 802.11 (infrastructure or ad hoc))

Print Server on MFD

Sending jobs directly to printer and not via another device. Is faster and more efficient

Remote printing over internet is available

Cloud-based printing – connects a person’s printer to a corporations cloud then when printer is available use it???

Printers can be shared over network using various technologies

 Windows file and print sharing

 TCP printers accessed directly using IP address
 Bonjour service from Apple
 AirPrint for wireless printing iOS

Input/Output Devices

Touchscreen monitors allow both

Smart TV

 Integrated internet & web 2.0 features

 Provide internet TV as well as online interactive media
 On demand streaming
 Connections via Ethernet, wireless or access via gaming console
Set-top box

 Appliance that contains tv tuner and display output to tv – amazon fire, roku, apple tv
 Input from multiple sources – cable, satellite, internet

Module 6: Mobile Devices

Overview

Laptops – Desktop replacement

Subnotebooks – netbook, smartbook, ultrabook

Tablets – Mobile internet devices, phablets

Pocket PCs, PDAs, E-readers

Internet appliances

Form factor varies on components found in laptops over desktops.

Laptops

Components designed to limit size, power & heat efficiency

Power – notebooks use batteries which last from 1 – 4 hours

 Li-Ion – (Lithium Ion) lightweight with long life

 NiMH – Nickel Metal Hydride
 NiCad – Nickel Cadnium

Processors –

CPUs

AMD, Intel, Apple PowerPC

Power management – more important on laptops to prolong battery life

 Suspend – lower power state where everything not required to maintain running apps is shutdown. Lid is shut
 Hibernate – low power state where contents of RAM are saved to HDD
 Standby – user config power saving mode

Mem

 Small Outline DIMM SODIMM has become standard with same data tf rates as desktop DDR
 144 pin DDR, 200 pin DDR2, 204 pin DDR3
 Some laptops use microDIMM

Drives

 HDD is just smaller form factor than desktop – 2.5” SATA usually
  Accessed from bottom of laptop

Input mechanisms

 Most have keyboard with additional functions, but higher end or 17” would have full size keyboards
 Trackpad, trackpoint, input buttons

Function, FN key allows usage of additional “keys”

Wireless on/off, cellular, Bluetooth, dual display, brightness, volume control, media options, etc.

Monitors – integrated LCD/LED cos of lower power consumption and heat generation

 LCD, LED, OLED

 Some are rotating or removable

Comm connections

 IEEE1394 & Ethernet

 Wireless networking like Wifi
 Infrared & Bluetooth

Locks – laptops come with a lock slot called Kensington Lock

Wireless antenna is located in the display

Webcams built-in

Microphones – builtin next to webcam

Inverter – converts DC power to AC for screen use

Digitizer – read pressure to surface of display and are what makes touchscreens work

Expansion Capabilities

Expansion Cards

 PCMCIA Types 1-3

 ExpressCard replaced PC Cards and Cardbus
o Open standard supports USB 2, 3 & PCIe 34 & 54 mm varieties

Other expansion options – Flash for storage, SODIMM for mem, additional adaptors

 Thunderbolt – video/audio
 Display port – digital video interface
 USB to x (x=RJ45, Wifi, Bluetooth, optical drive, etc)

Older laptops used port replicators or docking stations to expand capabilities

Replacing Components

Certain components are easily and cheaply replaced- HDD, mem, keyboards
Others more expensive – video cards, M/B, LCD

Best Practices for replacement

 Consult manuals for disassembly & replacement advice

 Some require special Torx T-8 screwdriver – get a good toolkit
 Clean, well-lit flat work space
 Have replacement parts
 Shut down PC and disconnect
 Always be grounded
 Use plastic containers for screws and other parts

Keyboards

 Do not damage the cable connector from kb to M/B

 Steps
o Power off
o Remove screws holding kb on bottom and/or top
o Remove any plastic holding the kb
o Remove kb and check on data cable
o Take pick and lift the plastic connectors that hold data cable in place and remove
o Install in reverse

HDD

 Turn laptop upside down and remove panel of drive release mechanism or screws
 Remove any rails or caddy holding the drive then drive itself
 Install drive in reverse order

Mem

 Laptops usually have panel to access mem

 Remove screws and panel
 Pop spring loaded pins and remove module at 45 degree angle
 Reinstall in opposite way

Smart card readers

Typically have to remove hdd, optical drive and kb to get this done

Optical drive

Wireless cards

 Some near mem, otherwise more components need to be removed

 When found
o Disconnect 2 antennae contacts
 Remove screws and card
 Insert replacement at 45 degree angle and replace antennae

Mini-PCIe
 See wireless card without antennae

Screens

Complex and expensive replacement procedures

DC jack

May require soldering otherwise may need to replace M/B

Battery

Remove from storage bay using little levers, replace and re-engage locking levers

Touchpad

Complex replacement procedure – covers, kb, video antenna, LCD then touchpad

Other replacements

Plastics and frames, all these that follow are extremely difficult as well (speakers, system board, CPU)

Other Mobile Devices

Tablets, smartphones, wearable tech, phablets, e-readers, Smart cameras, GPS

Tablets - Run similar OS to desktop PCs but most common OS are: iOS, Android, Win8/10

Features

Camera, GPS, handwriting recog, SSD HDDs, 3/4G mobile support, touchscreen kbs, detachable kbs, apps

Common tabs – iPad, Galaxy Tab, MS Surface

Smartphones

 Touchscreen interfaces, onscreen kb, mobile data & internet, payment mechanisms, HQ photo and video, etc
 Same OS as tablets

Wearable tech

 Smartwatches – typically paired to smartphone and could answer calls, send messages, have GPS and personal
sensors, etc
 Fitness monitors – read body temp, heart rate, blood pressure. Come in wristband or chest strap
 Glasses/Headsets – Google Glass most popular, HC1. Typically respond to voice commands and body movement

Phablets

Middle-class device with screen-size exceeding 5” less than 7” and usually come with stylus for input

E-readers

 All tablets contain the same functionality, but e-readers are simpler in design and run on more restrictive OS
  Read books, surf net, email capabilities
 Amazon Kindle or Barne’s and Noble Nook
 Chars: touchscreens, editing tools, wireless tech, text to speech support, DRM support

Smart Cameras

 Capture images, extract info from it and even make decisions based on that info
 Used is unattended surveillance, noncontact measurements, code reading and verification, biometric recog and
access control, automated inspection for QA

Global Positioning System (GPS)

 Uses sat info to plot location of object

 Can be used to determine route
 Integrated into most mobile devices
 Standalone devices exist like garmin and tom tom
 Can locates points of interest close to their location

Mobile Device Ports and Connectors

Connection Types

 Near Field Comm (NFC) 20cm

o Short range tech allows close proximity RF comms
o Used in RFID tagging
o Implemented in mobile devices for data sharing, POS, payments
 Proprietary and vendor specific ports – dwindling
o Common egs: Apple lightning, Sony Eriksson power connector, Nokia & Motorola
 Lightning connector cable has advantages over USB
o Supplies more power, inserted either way, more durable, detects and adapts to connected device

Most common type is USB – mini & micro B

Bluetooth – requires pairing, can share media. used in headsets, handsfree driving - not compatible with 802.11 tech

PAN with 100m reach

Infrared – line of sight

Hotspot/Tethering – can share mobile device cell connection with other devices using standard wifi

Mobile Device accessories

Headsets, speakers, gamepads, docking stations, chargers, additional battery packs, protective covers, credit
card readers, memory/microSD

Module 7: Networking
Networking allows sharing of resources: files, folders, appls, printers, internet connections

Network models: Workgroup or Domain

Workgroup (Peer to peer)

 No dedicated servers, resources shared on individual PC

 Usually small number of PCs
 User accounts are located on each individual machine and authentication happens locally
 Admin hassle if more than 10 PCs

Client/Server – Domain

 Has dedicated servers running Network OS and directory services

 A domain database has list of use and PC accounts used for authentication
 Authenticated users have access to domain resources once on domain
 Admin and security are both centralized
 Generally require dedicated admin personnel

3 basic components to connect to a network: connection (NIC), Client (Client for MS networks), protocol (TCP/IP)

Connections – NICs included on M/B or added via expansion

 Contain transceiver
 Matched up with connection medium used on network
 Capable of half-duplex (1 comms in 1 direction at a time), full duplex (comms in both direction simultaneously)

Clients – client must have appropriate tech to comms with servers to use resources

 Client for MS networks

 File and print sharing for MS networks
 Client for Netware Networks
 File and print services for Mac

Network Protocols – language that PCs, servers and other net devices

TCP/IP, IPX/SPX, AppleTalk, NetBeui

Network Topologies – physical layout of network

Bus, ring, star (99% networks use this), mesh, tree, hybrid

Network architecture – Ethernet, token ring, wireless

Network Categories

Local Area Network (LAN) – group of PCs or devices in the same geo area like building or office

Wide Area Network (WAN) – grouping of multiple LANs to create single org network

 Internet is largest WAN

 Connections achieved using leased data o shared lines
Metropolitan Area Net – MAN uses external connections like wireless and fiber, smaller than a WAN

Personal Area Network (PAN) – home or small biz, uses Bluetooth and wireless tech

Wireless LAN (WLAN)

Network Devices

Connect computer systems together for info sharing

Open Systems Interconnection (OSI) Model – conceptual framework based on layers for network comms

Devices

 Layer 1 devices are unintelligent and provide no filtering capabilities

 Layer 2 devices provide filtering based on the MAC address
 Layer 3 devices provide filtering on protocol addresses and network routing

Layers

Physical, Data Link, Network, Transport, Session, Presentation, Application

1 7

Repeater/Extender

 Used to connect network segments of the same cabling type

 Extend range of signal past distance limitations of cable type
 Most common modern repeaters are for wireless or fiber optic connectors

Hub

 Layer 1 device that simply connects multiple systems

 Also known as multiport repeater
 Active or passive – powered or powerless
 Switching hubs or intelligent hubs are technically layer 2 devices

Bridge

 Used to connect network segments of the same or dissimilar architectures

 Provides filtering based on MAC addresses
 Existed because of inabilities of Hub

Switch

 Layer 2/3 device depending on capabilities

 Layer 2 have largely replaced Hubs cos they have multiple advantages
 Layer 3 provide VLAN and routing capabilities
 Some switches offer additional options like Power over Ethernet (PoE)

Router

 Connects multiple network segments creating subnets

  Functions at layer 3 providing network routing based on protocol addresses
 Most networks will contain a single router interfacing with the WAN or internet

WAP Wireless Access Point

 Provides functionality like switch or router

 Extend wired signal using radio frequencies
 Identified via Service Set ID (SSID) – network name
 Requires additional config

Other devices operate at higher levels of OSI model such as application layer services

Network Attached Storage (NAS)

 Network devices that offers high levels of storage

 Could be running Win
 Complete storage solution that needs to be connected to a network

Firewall

 Responsible for controlling traffic flowing between networks

 Allowed traffic defined by firewall rules and policies
 HW & SW firewalls available
 Protects internal systems or entire networks

Voice over IP (VOIP)

 Tech that provides audio over digital data networks

 Referred to as convergence tech
 Use regular VOIP phone of softphones
 Uses special protocols for comms
 Session Initiation Protocol (SIP)
 Real Time Transport Protocol (RTP)

Modem – modulator / demodulator that converts digital signals to analog and vice versa

Patch Panel

 Device to which the cables running though the wall from the individual PCs are connected
 Cables connecting device to wall are called drop cables
 Cables connecting the patch panel to switch are called patch cables

Ethernet over Power

 Tech used to send Ethernet frames/packets over power lines

 Device called power line Ethernet plugs into the wall outlet then devices or a switch plugged into that bridge
 Eliminates need to install additional outlets leveraging existing power lines of building

Power over Ethernet (PoE) Injector

 Uses Ethernet lines to send power to remote devices

 Supporting Switches can supply power on the same data cable that connect devices
  PoE injector is a device that can be used to provide PoE where switch does not support the tech

Cables and Connectors

Most common are Unshielded Twisted Pair (UTP) & Shielded Twisted Pair (STP)

Twisted Pair categories

 Cat 3 – operates at 10MBps with 2/3 twists per foot

 Cat 5 – 100MBps up to 20 twists per foot
 Cat 5e – 1Gbps -20 twists per foot
 Cat 6 – higher quality material with potential for 10Gbps tf rate
 Cat 6a – double transmission freq
 Cat 7 – not recognized as standard but adds shielding to extend length limits

All type of twisted pair suffer attenuation and are limited to 100m except Cat 7

Attenuation is degredation or loss of signal over a certain distance

Know cats, speeds and distance limitations

Composite cables – coax, fibreoptic, Cat5 enclosed in a single PVC casing to make installation easier

Plenum – enclosure in building used for heating, cooling and aircon but has additional use of containing high or low
voltage wiring

 Cables that run in plenums must meet certain fire protection in environ req
 Usually use conduits or special cable jackets which are non-toxic at high temps
 Plenum cabling is more expensive and often coated with Teflon

Twisted pair cables use EIA/TIA 568A or 568B wiring and RJ-45 connector

Co-ax cabling used to be used in networks but more so for video installations

Co-ax cables contain a layer of braided wire or foil between the core and an outside insulation layer which helps protect
data from EMI

Thinnet – RG-58 10MBps 185m, ThickNet – RG-8 also 10MBps up to 500m

Co-ax implementations usually used in satellite feeds – primary connections RG-59 & RG-6

Co-ax connectors

 F-connector used in modern video like DSTV

 BNC connectors for older Ethernet implementations has Barrel or T-connector
 Co-ax use bus topology

Fiber optic – cables which carry light based data through strands of glass instead of electrical signals

Features and benefits

 Not affected by EMI

 Fastest transmission medium available
  Covers very long distances
 Expensive
 Most delicate type of wiring

Fiber cable types – core made up of glass or plastic surrounded by reflective layer to keep light based data inside

 Single mode carries data beyond 1GBps for up to 10miles

 Multimode – shorter distances but similar speeds and can carry multiple data transmissions simultaneously

Used for network backbones, telco companies running longs distance lines

Fiber optic connectors

 ST (Straight Tip) most popular

 SC ()
 MT-RJ ()
 LC (Little Connector)
 FC

Network tools

 Crimper – used to attach RJ-45 connectors to UTP

 Punchdown tool – attaches cables to back of patch panel
 Cable tester
 Toner probe – can help locate cables
 Multimeter
 Wifi analyzer
 Loopback plug

TCP/IP

Transmission Control Protocol / Internet Protocol

 Suite of protocols is foundation for network comms

 Provides 4 layer arch loosely based on OSI model
 Application, Transport, Internet, Network Interface

TCP/IP Suite

 Transport Layer – TCP & UDP

 Internet Layer – IP, ICMP, IGMP, ARP
 Application Layer
Software used sits above the application layer and interacts with application layer protocols

App Layer protocols – identified by socket (combination of iP addy and port number)

 DNC- 53
 DHCP – 67
 HTTP – 80
 SMTP – 25
 FTP – 20/21
 RDP – 3389
 TELNET – 23
 POP - 110
 IMAP - 43
 LDAP, SNMP, SMB, SSH, SFTP, Kerberos, Apple Filing Protocol

TCP/IP is a routable network protocol that provides comms for networked PCs regardless of location

Routable protocols include an addressing scheme capable of identifying the network segment as well as individual
addresses

This provide a means to comm within a network segment as well as across segments connected by network routing
devices

IPv4 addresses

 32 bit binary address

 Written in dot decimal notation – 146.141.15.21
 Divided into 2 parts – network ID & host ID

Subnet masks

 32 bit binary numbers – 255.0.0.0

 Differentiate between network and host portions
 Contiguous 1’s followed by contiguous 0’s
  Parts masked are network id (1’s) and 0’s host id

Basic Config for node - IP addy, subnet mask, default gateway, DNS server

Simple IP config

Private address spaces

10.x.x.x cannot be used on internet – class A

172.16-31.x.x – class B

192.168.x.x – class C

Default subnet masks

255.0.0.0 ; 255.255.0.0; 255.255.255.0

Provides various network sizes

Access to internet through NAT (Network Address Translation) devices

Classful system wasted IP addys

Classless Inter-Domain Routing (CIDR) notation

192.168.1.25/24

/24 signifies number of bits in subnet mask set to 1

/24 – 255.255.255.0

Other bit notations are possible providing a network that is much closer to the required number of addresses

Advanced IP config

Private or public spaces

Subnet masks do not stop at decimal point

 255.255.224.0 or
255.240.0.0 or
255.255.255.128

Written in CIDR notation

172.16.100.17/19 or
10.12.100.100/10
192.168.13.32/25

Subnets are separate network segments uniquely identified

IPv4 design addressing has run out of space so IPv6 developed to address need for more

IPv6 benefits

 Larger address space due to 128 bit addresses

 Hierarchical addressing and routing infrastructure
 Simplified automatic config
 Enhanced security
 Prioritized delivery
 Extensibility

IPv6 address space

 Addresses divided into eight 16 bit groups written in HEX

 HEX number base 16 allows each group of 4 binary digits to be expressed as single digit
 Zeroes can be compressed in each 16-bit block and multiple goups of zeroes are compresses using ::

Address types

 Global Unicast addresses – equal to public IPv4 addresses available from ISP
 Link Local Unicast Addresses – used for comms on local network, broadcasts would have been used in IPv4
 Unique Local Unicast addresses – equal to IPv4 private addresses

Internet Connectivity

Dial Up

 Uses analog phone lines as low cost option to connect to net

 Uses modem
 Almost universally available due to penetration of telephones
 56kbps and protocols like Point to Point Protocol PPP and Serial Line Internet Protocol SLIP used to encapsulate
TCP/IP

Cable Modem

 Uses existing cable telephone lines to provide data service

 Conversion from digital to analog if existing lines are analog
 Cable internet is a point to multi point tech
 Security risk is increased cos of shared line
Digital Subscriber Lines (DSL)

 Fast data transmission using ordinary copper for voice and data at same time
 All DSL is point to point
 DSL has hard limit of 18000 feet

Satellite

 High speed using satellites

 Technically 2 connections – 1 to send and 1 to receive
 Needs satellite dish mounted
 Affected by environmental interference

Integrated Services Digital Network (ISDN)

 Uses regular phone lines

 Has 2 channels capable of 64 Kbps with combined bandwidth of 128Kbps
 Been replaced by cable and DSL

Wireless

 Several possible techs used to connect to ISP

 Not synonymous with WiFi and WiMAX tech
 popular applications of wireless internet access
o Fixed point wireless
o Mobile wireless using cell tech

Wireless Networks

Wireless LAN (WLAN) use radio waves or infrared light instead of cables

 Using wireless NIC with antenna to send and receive signals

 Portable and flexible
 Devices can communicate directly with each other (ad hoc mode) or through a wireless access point
(infrastructure mode)
 Disadvantages are security related

Wireless Protocols

 Wi-Fi (Wireless Fidelity) 802.11 standard

 Bluetooth – short range tech used for wireless headsets, mics, PDAs Smartphones
 802.11a – improved version of original and uses different freq and signaling methods to eliminate interference
 WiMAX (802.16) – point to multipoint broadband wireless access

802.11

 b – original wifi spec 2.4GHz, up to 11 Mbps throughput

 g – backwards compatible with b, up to 54Mbps
 a – intended replacement for other wifi operates at 5GHz and up to 54Mbps
 n – replaces all 3. Provides higher data rates using multiple antennas and MIMO. Up to 600Mbps 2.4 or 5GHz
 ac – improves on n standard using wider channels, new modulation and improved MIMO
Wireless encryption

 WEP (Wired Equivalent Privacy)

 WPA (Wifi Protected Access) - TKIP (Temporal Key Integrity Protocol)
 WPA2 – AES (Advanced Encryption Standards)

Authentication options

 WEP keys
 WPA personal passphrase or pre-shared key (PSK)
 WPA 2 enterprise & 802.1x – allows centralized authentication. Access point forwards request to internal server
and server decides

Access Point Config

Security: encryption, MAC filtering, DMZ, Firewall, SSID broadcast

Channels, NAT (Network Address Translating)/DNAT (Destination NAT) and DHCP, Port forwarding / triggering,
WPS (Wi-Fi Protected Setup), Basic QoS (Quality of Service), Firmware. uPnP (universal Plug n Play)

Module 8: Troubleshooting
Troubleshooting Models

Troubleshooting attempts to determine the root cause and solution to problems applying a logical, consistent method
also known as t-sht methodology

Keys to effective tsht

 Choose a tsht model

 Use methodical approach to solve problems
 Learn as much as possible about systems and tech you are supporting
 Keep calm
 Be a pro

Basic stages of tsht theory

 Identify problem
 Establish a theory of probable cause
 Test theory to determine cause
 Establish a plan of action
 Implement solution
 Verify system functionality
 Document

Tsht models allow consistent resolving of issues efficiently

Methodology is important not actual model

Models: CompTIA A+, CompTIA Network+, Novell, ASID

ASID Tsht Model

 Acquire – collect info

o Have user reproduce activity
o Identify any recent changes
o Check event viewer and document msgs
 Simplify – remove non-critical components to fix or just simplify tsht
 Implement – identify and implement potentioal solutions one at a time
o Potential solutions can be obtained using reference material
o Use and installation manuals
o Internet or web resources
 Document

Info gathering

 Regardless of tsht model this is key 1st step

 Identify info about user environment like location and platform
 Always ask what the user has observed about problem such as visual symptoms or error codes
 Try understand the situation when the problem occurred
 Determine whether this is something the user has been able to do before or is a new task

HW or SW

 Use info gathered from user as starting point for isolating source of problem
 HW problems usually depict error codes or msgs
 SW problems can manifest as HW failure cos of faulty device drivers
 Refer to HW docs and web resources to analyze specific devices and their error checking capabilities

Info Resources

 Documentation
o Key to good tshting
o Manuals, manufac websites, kb forums
o Technicians should also actively doc various aspects of the problems they encounter as solve including
 Platforms, applications, HW devices, date and time and user
 o Various factors to consider for docs such as paper of software, level of details and process for tracking
that info
 Forums – online discussion groups
o Can be general or product specific
o May have experts as moderators
 Other resources
o Fellow employees
o Former coworkers
o Newsgroups
o Vendor help and support

Troubleshoot Physical Issues

HW – accurately diagnose and resolve issues, often replacement is resolution, but we need to correctly identify the
faulty component to reduce work and cost

Common components and associated problems

 Power
o Unexpected shutdowns
 maybe not enough power – identify any recent HW changes
o System lockups
 Could be PSU, process of elim
o Continuous reboots
 See point 1
o No power
 Check wall outlet, is there building power, tripped circuit breaker, faulty connectors
o Overheating
 Could be caused by PSU fan
o Fans spinning but no power to other devices
 Could be M/B or PSU
o Smoke
 Something fired
o Burning smell
 Too much power, short circuit, replace component where smell originates
 M/Bs
o No power
 Possibly PSU, M/B, connector – check M/B light as indicator, CPU fan unplugged, secondary
power connector not connected to M/B
o Intermittent device failure
 Circuitry issues, recently installed components, age of M/B, damaged
o BIOS time and settings
 Stored in CMOS RAM chip – perhaps change CMOS battery or replace M/B if chip is bad
o Blank screen on boot
 Did POST happen? Beeps, error codes? If past bios then SW issue. M/B speaker could be
disconnected. If no beeps then could be M/B
o System lock ups
  Potential power issue, maybe damaged sockets
o BSOD – Blue screen of death
 Read error msgs on screen then decide from there. Could be multiple issues
o Fans spinning but no power to devices
 Could be power connector, check M/B LED,
o Loud noises
 Isolate origin of noise, could be popped capacitors – replace M/B. What’s effect of loud noise on
system
o Indicator lights
 CPU
o POST code beeps
 CPUs replaced not repaired
o System lockups
 PC freezes – check task manager & whats maxing CPU, is particular app or when multiple apps
are running?
o Blank screen on boot
o Overheating
 Check cooling settings – heatsink, case fan, PSU fan, CPU fan
o Intermittent devices failure
 Check power, power connections, event logs,
o BSOD/Pinwheel continuously spinning on Mac OS
 When does it occur: on startup or when certain app is running or combo of apps – could be
software corruption and perhaps restore a backup
 Mem
o Unexpected shutdowns
 If happens when certain program launched then perhaps mem problem
o Applications crashing
 HEX code error msgs probably mem
o BSOD
 Check error msgs
o POST beep codes
 Listen to num beeps and consult docs
o System lockups
o Intermittent device failures
o Continuous reboots
 Generally a PSU or mem problem
 Tools for troubleshooting
o Multimeter
 Power or resistance
o PSU tester
o Loopback plugs
 Network issues
o POST cards
 BIOS – detailed logs messages
o Anti-static writs strap
 o Replacement components
 HDDs and RAID arrays
o Physical Issues
 Read/write failures
 Copy attempts result in messages could be faulty data cable, bad sectors – if so probably
need to backup and scrap drive
 Slow performance
 Older drive, load too high for drive, fragmentation
 Loud clicking sounds
 Could be actuator and read/write heads – impending drive failure
 BSOD
 Check error msgs
 RAID stops working
 Check controller and run diagnostics
 Drive not recognized
 Often data cable or M/B port, check seating, check BIOS picking up drive with auto
detect
o Logical Issues/software errors
 Read/write failure
 Checkdsk
 Booting to wrong drive
 BIOS boot sequence, check for plugged in flash drives
 OS not found
 Corrupt Master Boot Record (MBR)
 RAID not found
 Config issue – is controller listed, enabled, no mods, etc.
 Drive not recognized
 Faulty data cable or Master-Slave issue with IDEs
 S.M.A.R.T errors
 Check messages and react
 Tools for HDD and RAID
o Screwdriver
o CHKDSK
o FORMAT
o Disk and file recovery software
o Bootrec
o Diskpart
 fix boot sectors, rewrite partitions
o Defragmentation tool
 Video and Display
o Physical
 No image on screen
 No power, not turned on, indicator lights, data connection, brightness on 0
 Overheating shutdown
 Airflow, proper ventilation
 Dead pixels
  Artifacts
 Old images or remnants – check overheating on GPU or video card, fans if not then
corruption of mem
 Distorted image / Discoloration
 Degauss old CRTs, remove magnetic equipment, check VGA pins
 BSOD
o Software/Logical issues
 VGA mode
 Using incorrect driver, perhaps update driver or uninstall reinstall
 No image on screen
 Brightness turned completely down
 Artifacts
 Bad program
 Color patterns incorrect
 Driver or software issue
 Dim image
 OS or physical monitor control issue. Backlighting for desktop lcd is cheap
 Flickering image
 Incorrect resolutions, low refresh rate
 Distorted image
 Cabling or power or software
 Distorted geometry
 Check projector settings
 Burn-in
 Shut off monitor let it cool, degauss if crt, perhaps replace
 Oversized images/icons
 OS settings
 Tools for Video issues
o Display properties
o 3rd party utilities
o Replacement cards
o BIOS
o Advanced startup options

Networking Issues

Identify the scope of the problem as it can save significant time

 Who’s affected?
 What’s affected?
 What components can be eliminated?

Recognizing symptoms and understanding available tools is very important

Common symptoms

 No connectivity
 o Local or remote systems – check physical connections - link and activity lights, check port on wall, patch
panel lights, check config, what’s the windows msg, check if devices are disabled in OS
 APIPA address
o 169.xxx
o Key indicator that DHCP did not supply dynamic IP address, do ipconfig /release /renew
 Limited connectivity
o Disable & re-enable adaptor, try multiple sites
 Local only connectivity
o Default gateway maybe on diff segment or unavailable
 Intermittent connectivity
 IP conflict
o Perhaps multiple DHCP servers giving IPs, DHCP and static IP manually a
 Slow transfer speeds
o Software hogging PC systems, virus causing network slowdown, DDoS, could be switch issue
 Low RF signal
o Distance from WAP, interference, try wifi analyzer to check channels
 SSID not found
o Unnamed network, check config
 Some issues are beyond technician and require escalation – switch, backbone issues
 Tools
o Cable tester
o Loopback plug
o Punch down tool
o Toner probes
o Wire strippers
o Crimper
o Wireless locator aka wifi analyzer
 TCP/IP troubleshooting command line tools SUPER NB!!!
o IPCONFIG
o PING
o TRACERT
o NETSTAT
o NBSTAT
o NET
o NETDOM
o NSlookup
 Manage wireless networks

IPCONFIG

 Ethernet adaptor – Ipv4, IPv6 addresses, MAC address, DHCP, DNS, Subnet mask, default gateway
 /all – all info
 /release to release IP addy
 /renew to get another IP from DHCP
 /displayDNS – gives you cached DNS entries
PING

 Sends ICMP packets to a location specified

 Was there a result and how long it took
 Destination unreachable – no local connectivity, no name or IP address like that exists
 Couldn’t find name – name resolution issue
 Request timed out – system did not respond or system is down. Some systems configured not to respond to ping
 -t ping till stops

Tracert

 Wants response from each individual route on the way

 Uses ICMP also

NSLookup

 Name resolution

NBTstat

 Net BIOS names

Netstat

 Networks statistics
 -a active connections
 -b shows executable involved in connection
 Could be used for performance related issues

Net

 Use drive letter \\share to map network drives

 Start & stop start/stop services

Netdom

 Changes domain membership or name of PC

Toubleshooting Mobile Devices

Common Issues

 No display
o Is there power to the device, if laptop has the local display been turned off if connected to projector
 Dim display
o Check brightness settings
 Flickering display
o Check native resolution, refresh rate, check display settings
 Sticking keys
o Perhaps a spill, clean kb
  Intermittent wireless
o Check config
 Battery not charging
o Maybe replace battery
 Ghost cursor/pointer drift
o Touch pad issues, maybe replace it
 No power
o Check battery above
 Num-lock indicator lights
o Could cause number instead of letters to be typed
 No wireless/Bluetooth
o Check if radios have been disabled using buttons or via networking config, check indicator lights
 Can’t display to external monitor
o Perhaps user doesn’t know how to do it, check display properties in OS, check connections, Perhaps port
problem
 Touchscreen non-responsive
o Calibration issue, perhaps memory issue
 Apps not loading
o Uninstall and reinstall app – could lose saved or cached data
 Slow performance
o Perhaps low battery, storage full, malware, unoptimized apps
 Unable to decrypt email
o DRM issue and perhaps require security certificate
 Extremely short battery life
o Old battery, too many running apps
 Overheating
o Perhaps faulty charger maybe
 Frozen system
o Software bug
 No sound from speakers
o Volume turned down, on laptop speakers disabled or unplugged, disabled on settings
 GPS not functioning
o Location settings disabled, low signal, outside cell range
 Swollen battery
o Bad charger or port

Repairing laptops may involve dis and reassembly so follow best practices

 Doc and label cable and screw locations

 Organize parts
 Refer to manuf docs
 Use appropriate tools

Troubleshooting printers

Scope and target problem

  Local appl
 Driver
 Printer server
 Physical device

Common symptoms

 Streaks
o Clogged nozzles on inkjet, charging issues on laser
 Faded prints
o Too littler ink/toner
 Ghosted images
o Drum not cleaned properly on laser
 Toner not fused on paper
o Fusing assembly on laser
 Creased paper
o Paper feed issue, rollers, tractor feed,
 Paper not feeding
 Paper jam
 No connectivity
o Check networks are ok, check printer settings
 Garbled characters
o Device drivers
 Vertical lines
o Inkjet – nozzles, laserjet – scratch on drum
 Backup print queues
o Large print jobs, try delete 1st print job, if nothing deleting then spooler issue and restart service
 Low mem errors
o Clear mem or restart printer
 Access denied
o Check permissions
 Will not print
o Isolate problem, from another app, from printer itself, connections
 Color prints in wrong color
o Bad formatter board, lack of color on injet
 Cant install printer
o Admin rights or not detected
 Error codes
 Printing blank pages
o Out of ink
 No image on printer display
o Check power, perhaps display issue on printer

Tools

 Maintenance kit
 Toner vacuum
 Compressed air
 Printer spooler