AW-AM457-D

IEEE 802.11 1X1 a/b/g/n Wireless LAN

+ Bluetooth 5.2
Combo LGA Module

Datasheet

Rev. E

DF

For Standard

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Features
WLAN Bluetooth
 Support 802.11 a/b/g/n  Full Bluetooth 5.2 features
 Dual bands: 2.4 GHz and 5 GHz  Long range - 4x coverage
 Single stream 802.11n with 20/40 MHz  2 Mbps data rate - 2x faster
channels for 5G and 20 MHz only for  Connection/connectionless AoA
2.4G  Connection/connectionless AoD
 Up to MCS7 data rates (150 Mbps)  Improved advertisement capacity-
 Support 802.11mc for location enables more IoT services
 Dynamic Rapid Channel Switching  Audio interface: I2S and PCM
(DRCS) for simultaneous and power  Security: AES
efficient operation in 2.4 GHz and 5 GHz
bands
 Interface to coexist with 802.15.4, LTE, or
other radios.
 Security: WPA3 and WPA.

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Revision History
Document NO: R2-2457-DST-01
Revision
Version DCN NO. Description Initials Approved
Date
Renton
A 2020/01/21 DCN016710  Draft version N.C Chen
Tao
 Modify model name
 Add specification table and
operating temperature
 Add ESD information
B 2020/12/10 DCN018928  Modify pin table(Pin 19) Roger Liu N.C Chen
 Add power sequence
 Add Power Consumption
 Modify operating conditions
 Modify datasheet form
 Modify Host Interface
 Modify Bluetooth specification
C 2021/02/18 DCN020661  Update box label information Roger Liu N.C Chen
 Modify 2.4G n mode bandwidth
 Update packing information
 Modify pin table for GPIO and
D 2021/09/26 DCN023395 pin 59~68 to NC Roger Liu N.C Chen
 Remove USB interface
 Update power consumption
E 2021/12/24 DCN025025  Update BT feature to 5.2
Roger Liu N.C Chen

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Table of Contents
Revision History .................................................................................................................................. 3
Table of Contents ................................................................................................................................ 4
1. Introduction ...................................................................................................................................... 5
1.1 Product Overview .......................................................................................................................... 5
1.2 Block Diagram................................................................................................................................ 6
1.3 Specifications Table ...................................................................................................................... 7
1.3.1 General .................................................................................................................................... 7
1.3.2 WLAN ....................................................................................................................................... 7
1.3.3 Bluetooth ................................................................................................................................. 9
1.3.4 Operating Conditions ............................................................................................................. 9
2. Pin Definition ................................................................................................................................. 10
2.1 Pin Map ......................................................................................................................................... 10
2.2 Pin Table....................................................................................................................................... 11
3. Electrical Characteristics ............................................................................................................. 13
3.1 Absolute Maximum Ratings ........................................................................................................ 13
3.2 Recommended Operating Conditions ........................................................................................ 13
3.3 Digital IO Pin DC Characteristics ................................................................................................ 13
3.3.1 1.8V Operation (VIO) ........................................................................................................... 13
3.3.2 3.3V Operation (VIO) ........................................................................................................... 14
3.3.3 1.8V Operation (VIO_SD) ................................................................................................... 14
3.3.4 3.3V Operation (VIO_SD) ................................................................................................... 14
3.4 Host Interface ............................................................................................................................... 15
3.4.1 SDIO Interface ...................................................................................................................... 15
3.4.2 SDIO Protocol Timing .......................................................................................................... 16
3.4.3.High-Speed UART Interface............................................................................................... 20
3.4.4 PCM Interface ....................................................................................................................... 21
3.5 Timing Sequence ......................................................................................................................... 23
3.6 Power Consumption .................................................................................................................... 24
3.6.1 WLAN ..................................................................................................................................... 24
3.6.2 Bluetooth ............................................................................................................................... 27
3.7 Sleep Clock .................................................................................................................................. 28
4. Mechanical Information ................................................................................................................ 29
4.1 Mechanical Drawing .................................................................................................................... 29
5. Packing Information ...................................................................................................................... 30

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1. Introduction
1.1 Product Overview
AzureWave Technologies, Inc. introduces the IEEE 802.11a/b/g/n WLAN, BT, combo module –
AW-AM457-D. With four advanced radio technologies integrated into a module, AW-AM457-D
provides the best and most convenient SMT process. The module is targeted to mobile devices
including, Tablet PC, Portable Media Players (PMPs), Portable Navigation Devices (PNDs),
Personal Digital Assistants (PDAs), Tracking Devices, Gaming Devices which need convenient
SMT process, low power consumption.
By using AW-AM457-D, the customers can easily integrate the Wi-Fi, BT, by a combo module with
the benefits of high design flexibility, high success rate on SMT process, short development
cycle, and quick time-to-market.
Compliance with the IEEE 802.11a/b/g/n standard, the AW-AM457-D uses DSSS, OFDM, DBPSK,
DQPSK, CCK and QAM baseband modulation technologies. A high level of integration and full
implementation of the power management functions specified in the IEEE 802.11 standard minimize
the system power requirements by using AW-AM457-D.

The AW-AM457-D supports standard interface SDIO3.0 for WLAN, UART for BT. AW-AM457-D is
suitable for multiple mobile processors for different applications. With the combo functions and the
good performance, the AW-AM457-D is the best solution for the consumer electronics and the tablet
PC.

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1.2 Block Diagram

A simplified block diagram of the AW-AM457-D module is depicted in the figure below.

AW-AM457-D Block Diagram

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1.3 Specifications Table
1.3.1 General
Features Description
Product Description IEEE 802.11 a/b/g/n Wi-Fi with Bluetooth 5.2 Combo Module
Major Chipset NXP IW416 (68-pin HVQFN)
WiFi + BT
Host Interface
 SDIO + UART
Dimension 15 mm X 15 mm x 2.5 mm(Max)
Form factor LGA module, 76 pins
For LGA, “1T1R, external
Antenna ANT1：WiFi  TX/RX
ANT2：Bluetooth  TX/RX
Weight 0.5 g

1.3.2 WLAN
Features Description
WLAN Standard IEEE 802.11 a/b/g/n 1T1R
WLAN VID/PID NA
WLAN SVID/SPID NA
2.4 GHz ISM Bands 2.412-2.472 GHz
5.15-5.25 GHz (FCC UNII-low band) for US/Canada and Europe
Frequency Rage 5.25-5.35 GHz (FCC UNII-middle band) for US/Canada and Europe
5.47-5.725 GHz for Europe
5.725-5.825 GHz (FCC UNII-high band) for US/Canada
Modulation DSSS, OFDM, DBPSK, DQPSK, CCK, 16-QAM, 64-QAM

2.4GHz:
 USA, NORTH AMERICA, Canada and Taiwan - 1 ~ 11
 China, Australia, Most European Countries - 1 ~ 13
 Japan, 1 ~ 13
Number of Channels
5GHz:
 USA, Canada, Most European Countries -
36,40,44,48,52,56,60,64,100,104,108,112,116,120,124,128,132,1
36,140,149,153,157,161,165
 Japan -
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 36,40,44,48,52,56,60,64,100,104,108,112,116,120,124,128,132,1
36,140
China - 36,40,44,48,52,56,60,64, 149,153,157,161,165
2.4G

Min Typ Max Unit

11b (11Mbps)
15.5 17 18.5 dBm
@EVM<35%
11g (54Mbps)
14.5 16 17.5 dBm
@EVM≦-30 dB
11n (HT20 MCS7)
12.5 14 15.5 dBm
Output Power @EVM≦-30 dB
(Board Level Limit)*
5G
Min Typ Max Unit
11a (54Mbps)
14 16 18 dBm
@EVM≦-27 dB
11n (HT20 MCS7)
13 15 17 dBm
@EVM≦-28 dB
11n (HT40 MCS7)
12 14 16 dBm
@EVM≦-28 dB
2.4G
Min Typ Max Unit
11b (11Mbps) - -86 -83 dBm
11g (54Mbps) - -73 -70 dBm
11n (HT20 MCS7) - -69 -66 dBm
Receiver Sensitivity
5G
Min Typ Max Unit
11a (54Mbps) - -71 -68 dBm
11n (HT20 MCS7) - -68 -65 dBm
11n (HT40 MCS7) - -66 -63 dBm
WLAN:
802.11b : 1, 2, 5.5, 11Mbps
Data Rate 802.11a/g : 6, 9, 12, 18, 24, 36, 48, 54Mbps
802.11n : Maximum data rates up to 72 Mbps (20 MHz channel), 150
Mbps (40 MHz channel)
 WiFi: WPA/WPA3
Security
 BT: AES
* If you have any certification questions about output power please contact FAE directly

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1.3.3 Bluetooth
Features Description
Bluetooth Standard Full Bluetooth 5.2 features
Bluetooth VID/PID NA
Frequency Rage 2402MHz~2483MHz
Header GFSK
Modulation Payload 2M: π/4-DQPSK
Payload 3M: 8DPSK
Min Typ Max Unit
BDR 0 2 4 dBm
Output Power
EDR 0 2 4 dBm
Low Energy 0 2 4 dBm
Min Typ Max Unit
BDR(DH1) - -83 -80 dBm
EDR(2DH5) - -88 -85 dBm
Receiver Sensitivity
EDR(3DH5) - -83 -80 dBm
Low Energy - -96 -93 dBm
BT Sensitivity (BER<0.1%)

1.3.4 Operating Conditions

Features Description
Operating Conditions
Voltage 3.3V +-5%
Operating Temperature 0 oC to +70 oC
Operating Humidity less than 85% R.H.
Storage Temperature -40 oC to +125 oC
Storage Humidity less than 60% R.H.
ESD Protection
Human Body Model +-2kV
Changed Device Model +-500V

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2. Pin Definition
2.1 Pin Map
AW-AM457-D pin out drawing (top view).

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2.2 Pin Table
Pin No Definition Basic Description Voltage Type
1 NC Floating Pin, No connect to anything. --- Floating
2 NC Floating Pin, No connect to anything. --- Floating
WCI interface serial output pin, for coexistence with
3 WCI_SOUT 1.8V O
LTE, 802.15.4 radio, or other external radios
WCI interface serial input pin, for coexistence with
4 WCI_SIN 1.8V I
LTE, 802.15.4 radio, or other external radios
5 NC Floating Pin, No connect to anything. --- Floating
6 GND Ground --- ---
7 SLP_CLK_IN External Low Power Clock input (32.768KHz) 1.8V I
8 GND Ground --- ---
9 GPIO[1] GPIO Mode : GPIO[1]/WiFi to Host Wake VDDIO I/O
10 GPIO[4] GPIO Mode : GPIO[4]/PCM_DOUT VDDIO I/O
11 GPIO[5] GPIO Mode : GPIO[5]/PCM_DIN VDDIO I/O
12 GPIO[6] GPIO Mode : GPIO[6]/PCM_CLK VDDIO I/O
13 GPIO[7] GPIO Mode : GPIO[7]/PCM_SYNC VDDIO I/O
14 GND Ground --- ---
15 3V3 3.3V power voltage source input 3.3V P
16 3V3 3.3V power voltage source input 3.3V P
17 GND Ground --- ---
18 Reserved Reserved(Do not connect to anything) --- Floating
19 Reserved Reserved(Do not connect to anything) --- Floating
20 NC Floating Pin, No connect to anything. --- Floating
21 1V8_IN AVDD18 input 1.8V P
22 VIO 1.8V/3.3V Digital I/O Power Supply 1.8V/3.3V P
23 GND Ground --- ---
24 GND Ground --- ---
25 NC Floating Pin, No connect to anything. --- Floating
26 NC Floating Pin, No connect to anything. --- Floating
27 NC Floating Pin, No connect to anything. --- Floating
28 NC Floating Pin, No connect to anything. --- Floating
Full Power-down input pin (active low)
29 PDn 0 = full power-down mode 1.8V I
1 = normal mode
30 SDIO_DATA_CMD SDIO Command VIO_SD I/O
31 GND Ground --- ---
32 SDIO_DATA_CLK SDIO Clock input VIO_SD I
33 SDIO_DATA_0 SDIO Data line Bit[0] VIO_SD I/O
34 SDIO_DATA_1 SDIO Data line Bit[1] VIO_SD I/O
35 SDIO_DATA_2 SDIO Data line Bit[2] VIO_SD I/O
36 SDIO_DATA_3 SDIO Data line Bit[3] VIO_SD I/O
37 VIO_SD 1.8V/3.3V SDIO Power Supply 1.8V/3.3V P
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 38 GND Ground --- ---
39 Reserved Reserved(Do not connect to anything) --- Floating
40 Reserved Reserved(Do not connect to anything) --- Floating
41 GND Ground --- ---
42 UART_RX UART SIN pin VDDIO I
43 UART_TX UART SOUT.pin VDDIO O
44 UART_RTSn UART Mode: UART_RTSn (output) (active low) VDDIO O
45 UART_CTSn UART Mode: UART_CTSn input pin (active low) VDDIO I
46 GPIO[3] GPIO Mode : GPIO[3]/JTAG_TDO VDDIO I/O
47 GPIO[2] GPIO Mode : GPIO[2]/JTAG_TDI VDDIO I/O
48 GPIO[14] GPIO Mode : GPIO[14]/JTAG_TCK VDDIO I/O
49 GPIO[15] GPIO Mode : GPIO[15]/JTAG_TMS VDDIO I/O
50 GPIO[12] GPIO Mode : GPIO[12]/Host to BT Wake VDDIO I/O
51 GPIO[0] GPIO Mode : GPIO[0]. VDDIO I/O
52 GPIO[13] GPIO Mode : GPIO[13]/Host to WiFi Wake VDDIO I/O
Firmware Boot Options for Host interface. See
53 CON[0] 3.3V I
below table*
Firmware Boot Options for Host interface. See
54 CON[1] 3.3V I
below table*
55 GND Ground --- ---
56 BT_ANT BT RF pin --- I/O
57 GND Ground --- ---
58 GND Ground --- ---
59 NC Floating Pin, No connect to anything. --- Floating
60 NC Floating Pin, No connect to anything. --- Floating
61 NC Floating Pin, No connect to anything. --- Floating
62 NC Floating Pin, No connect to anything. --- Floating
63 NC Floating Pin, No connect to anything. --- Floating
64 NC Floating Pin, No connect to anything. --- Floating
65 NC Floating Pin, No connect to anything. --- Floating
66 NC Floating Pin, No connect to anything. --- Floating
67 NC Floating Pin, No connect to anything. --- Floating
68 NC Floating Pin, No connect to anything. --- Floating
69 GND Ground --- ---
70 GND Ground --- ---
71 WL_ANT WLAN RF pin --- I/O
72 GND Ground --- ---
73 GND Ground --- ---
74 GND Ground --- ---
75 GND Ground --- ---
76 GND Ground --- ---

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*Firmware Boot options for Host Interface
Strap WLAN Bluetooth/LE Firmware Firmware Number of SDIO
Value Download Download Functions
[1:0] Mode
10 SDIO UART SDIO+UART Parallel 1(WLAN)

3. Electrical Characteristics
3.1 Absolute Maximum Ratings
Symbol Parameter Minimum Typical Maximum Unit
3V3 DC supply for the 3.3V input - 3.3 3.96 V
- 3.3 4.0
VIO I/O power supply V
- 1.8 2.2
- 3.3 4.0
VIO_SD SDIO power supply V
- 1.8 2.2

3.2 Recommended Operating Conditions

Symbol Parameter Minimum Typical Maximum Unit
3.3V DC supply for the 3.3V input 3.14 3.3 3.46 V
1.8V/3.3V digital I/O power 2.97 3.3 3.47
VIO V
supply 1.62 1.8 1.98
2.97 3.3 3.47
VIO_SD 1.8V/3.3V SDIO power supply V
1.62 1.8 1.98

3.3 Digital IO Pin DC Characteristics

3.3.1 1.8V Operation (VIO)
Symbol Parameter Minimum Typical Maximum Unit
VIH Input high voltage 0.7*VIO - VIO+0.4
VIL Input low voltage -0.4 - 0.3*VIO
V
VOH Output high voltage VIO-0.4 - -
VOL Output low voltage - - 0.4
VHYS Input Hysteresis 100 mV

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3.3.2 3.3V Operation (VIO)
Symbol Parameter Minimum Typical Maximum Unit
VIH Input high voltage 0.7*VIO - VIO+0.4
VIL Input low voltage -0.4 - 0.3*VIO
V
VOH Output High Voltage VIO-0.4 - -
VOL Output Low Voltage - - 0.4
VHYS Input Hysteresis 100 mV

3.3.3 1.8V Operation (VIO_SD)

Symbol Parameter Minimum Typical Maximum Unit
VIH Input high voltage 0.7*VIO_SD - VIO_SD+0.4
VIL Input low voltage -0.4 - 0.3*VIO_SD
V
VOH Output High Voltage VIO_SD-0.4 - -
VOL Output Low Voltage - - 0.4
VHYS Input Hysteresis 100 mV

3.3.4 3.3V Operation (VIO_SD)

Symbol Parameter Minimum Typical Maximum Unit
VIH Input high voltage 0.7*VIO_SD - VIO_SD+0.4
VIL Input low voltage -0.4 - 0.3* VIO_SD
V
VOH Output High Voltage VIO_SD-0.4 - -
VOL Output Low Voltage - - 0.4
VHYS Input Hysteresis 100 mV

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3.4 Host Interface
3.4.1 SDIO Interface
The AW-AM457-D supports a SDIO device interface that conforms to the industry SDIO Full-Speed
card specification and allows a host controller using the SDIO bus protocol to access the Wireless
SoC device.
The AW-AM457-D acts as the device on the SDIO bus. The host unit can access registers of the
SDIO interface directly and can access shared memory in the frvice through the use of BARs and a
DMA engine.
 Support SDIO 3.0 Standard.
 On-chip memory used for CIS.
 Supports 4-bit SDIO and 1-bit SDIO transfer modes.
 Special interrupt register for information exchange.
 Allows card to interrupt host.

SDIO Interface Signals

AW-AM457-D Type Description

SDIO Pin Name
SDIO 4-bit mode: Clock
SDIO_DATA_CLK I
SDIO 1-bit mode: Clock
SDIO 4-bit mode: Command line
SDIO_DATA_CMD I/O
SDIO 1-bit mode: Command line
SDIO 4-bit mode: Data line Bit[3]
SDIO_DATA_3 I/O
SDIO 1-bit mode: Not used
SDIO 4-bit mode: Data line Bit[2] or Read Wait (optional)
SDIO_DATA_2 I/O
SDIO 1-bit mode: Read Wait (optional)
SDIO 4-bit mode: Data line Bit[1]
SDIO_DATA_1 I/O
SDIO 1-bit mode: Interrupt
SDIO 4-bit mode: Data line Bit[0]
SDIO_DATA_0 I/O
SDIO 1-bit mode: Data line

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3.4.2 SDIO Protocol Timing
3.4.2.1 Default Speed, High-Speed Modes (3.3V)

SDIO protocol timing Diagram - Default mode. (3.3V)

SDIO protocol timing Diagram - High Speed mode. (3.3V)

Symbol Parameter Condition Min Typ Max Units

Normal 0 -- 25 MHz
fpp CLK Frequency
High Speed 0 -- 50 MHz
Normal 10 -- -- ns
TWH CLK High Time
High Speed 7 -- -- ns
Normal 10 -- -- ns
TWL CLK Low Time
High Speed 7 -- -- ns
Normal 5 -- -- ns
TISU Input Setup Time
High Speed 6 -- -- ns
Normal 5 -- -- ns
TIH Input Hold Time
High Speed 2 -- -- ns
Output Delay Time Normal -- -- 14 ns
TODLY
CL ≦ 40pF (1 card) High Speed -- -- 14 ns
TOH Output Hold Time High Speed 2.5 -- -- ns
SDIO Timing Data – Default Speed / High-Speed modes. (3.3V)

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3.4.2.2 SDR12, SDR25, SDR50 Modes (up to 100MHz) (1.8V)

SDIO Protocol Timing Diagram - SDR12, SDR25, SDR50 Modes (up to 100 MHz)(1.8V)

Symbol Parameter Condition Min Typ Max Units

Fpp CLK Frequency SDR12/25/50 25 - 100 MHz
TCLK Clock Time SDR12/25/50 10 - 40 ns
TIS Input Setup Time SDR12/25/50 3 - - ns
TIH Input Hold Time SDR12/25/50 0.8 - - ns
Rise time, fail time
TCR ,TCF TCR ,TCF <2ns(max) at 100MHz SDR12/25/50 - - 0.2*TCLK ns
CCARD =10pF
Output Delay Time
TODLY SDR12/25/50 - - 7.5 ns
CL ≦ 30pF
Output Hold Time
TOH SDR12/25/50 1.5 - - ns
CL =15pF

SDIO Timing Data - SDR12/25/50 modes. (1.8V)

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3.4.2.3 DDR50 Mode (50MHz) (1.8V)

SDIO CMD Timing Diagram - DDR50 Mode (50 MHz)

SDIO DAT[3:0] Timing Diagram - DDR50 Mode1 (50 MHz)

1
In DDR50 mode, DAT[3:0] lines are sampled on both edges of the clock (not applicable for CMD line).

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 Symbol Parameter Condition Min Typ Max Units
Clock
TCLK Clock time DDR50 20 - - ns
TCR, TCF Rise time, fall time DDR50 - - 0.2*TCLK Ns
Clock Duty DDR50 45 - 55 %
CMD Input
TIS Input setup time DDR50 6 - - ns
TIH Input hold time DDR50 0.8 - - ns
CMD Output
Output delay time during
TODLY DDR50 - - 13.7 ns
data transfer mode
TOHLD Output hold time DDR50 1.5 - - ns
DAT [3:0] Input
TIS2X Input setup time DDR50 3 - - ns
TIH2X Input hold time DDR50 0.8 - - ns
DAT [3:0] Output
Output delay time during
TODLY2X(max) DDR50 - - 7 ns
data transfer mode
TODLY2X(min) Output hold time DDR50 1.5 - - ns

SDIO Timing Data - DDR50 Mode (50MHz)

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3.4.3.High-Speed UART Interface
The AW-AM457-D supports a high-speed Universal Asynchronous Receiver/Transmitter (UART)
interface, compliant to the industry standard 16550 specification. High-speed baud rates are
supported to provide the physical transport between the device and the host for exchanging
Bluetooth data.

Symbol Parameter Condition Min Typ Max Units

TBAUD Baud rate 26MHz input clock 250 - - ns

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3.4.4 PCM Interface
3.4.4.1 PCM Timing Specification – Master Mode

Symbol Parameter Condition Min Typ Max Units

FBCLK -- -- -- 2/2.048 -- MHz
Duty CycleBCLK -- -- 0.4 0.5 0.6 --
TBCLK rise/fall -- -- -- 3 -- ns
TDO -- -- -- -- 15 ns
TDISU -- -- 20 -- -- ns
TDIHO -- -- 15 -- -- ns
TBF -- -- -- -- 15 ns

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3.4.4.2 PCM Timing Specification – Slave Mode

Symbol Parameter Condition Min Typ Max Units

FBCLK -- -- -- 2/2.048 -- MHz
Duty CycleBCLK -- -- 0.4 0.5 0.6 --
TBCLK rise/fall -- -- -- 3 -- ns
TDO -- -- -- -- 30 ns
TDISU -- -- 15 -- -- ns
TDIHO -- -- 10 -- -- ns
TBFSU -- -- 15 -- -- ns
TBFHO 10 -- ns

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in whole or in part without prior written permission of AzureWave.
3.5 Timing Sequence
AW-AM457-D power up timing sequence.
• VDD33 must be good (90%) before +1.8V starts ramping up.
• +1.8Vmust be good (90%) before PDn starts ramping up.

VIO
Power_good (90%)

3V3
Power_good (90%)

1V8

PDn

Internal POR

Boot ROM execution starts

Strap/Internal and firmware download
RESETn begins

23
FORM NO.: FR2-015_ A Responsible Department：WBU Expiry Date: Forever
The information contained herein is the exclusive property of AzureWave and shall not be distributed, reproduced, or disclosed
in whole or in part without prior written permission of AzureWave.
3.6 Power Consumption
3.6.1 WLAN
Test Condition
1. All results are with the Bluetooth off .(hciconfig hci0 down)
2. All results are run to take 3 minutes then record the test average and maximum value.
VDD=3.3 V
No. Item
Max. Avg.
1 WLAN OFF *(1) 535.8uA 524.2uA
2 Sleep *(3) 590.8uA 576.0uA
3 Power Save DTIM1 (2.4GHz) *(4) (6) 580.5uA 529.3uA
4 *
Power Save DTIM3 (2.4GHz) (5) (6) 581.4uA 529.2uA
5 Power Save DTIM1 (5GHz) * (4) (6) 563.7uA 530.8uA
6 Power Save DTIM3 (5GHz) *(5) (6) 614.2uA 529.0uA
VDD=3.3 V
No. Item
Max. Avg.
Transmit
Band BW RF Power
Mode Duty
(GHz) (MHz) (dBm) Max. Avg.
(%)
11b@1Mbps 20 17 181.3mA 179.5mA 99 %
11g@54Mbps 20 16 142.6mA 142.4mA 81 %
2.4
11n@MCS7 20 14 120.2mA 119.7mA 76 %
11n@MCS7 40 14 111.6mA 111.2mA 64 %
11a@54Mbps 20 16 175.1mA 174.5mA 78 %
5 11n@MCS7 20 15 158.7mA 158.6mA 79 %
11n@MCS7 40 14 128.1mA 128.0mA 66%
Band Receive
Mode BW(MHz)
(GHz) Max. Avg.
11b@1Mbps 20 898.9uA 679.8uA
2.4
11n@MCS7 20 942.3uA 679.9uA
11a@54Mbps 20 967.1uA 679.8uA
5 11n@MCS7 20 905.2uA 680.3uA
11n@MCS7 40 920.4uA 680.3uA
VIO=3.3 V
No. Item
Max. Avg.
1 WLAN OFF *(1) 4.43uA 3.85uA
2 Sleep *(3) 43.1uA 42.4uA
3 Power Save DTIM1 (2.4GHz) *(4) (6) 84.1uA 49.6uA
4 Power Save DTIM3 (2.4GHz) *(5) (6) 96.3uA 42.3uA
5 Power Save DTIM1 (5GHz) *(4) (6) 84.6uA 44.8uA
6 Power Save DTIM3 (5GHz) *(5) (6) 97.9uA 41.2uA

24
FORM NO.: FR2-015_ A Responsible Department：WBU Expiry Date: Forever
The information contained herein is the exclusive property of AzureWave and shall not be distributed, reproduced, or disclosed
in whole or in part without prior written permission of AzureWave.
 VIO=3.3 V
No. Item
Max. Avg.
Transmit
Band BW RF Power
Mode Duty
(GHz) (MHz) (dBm) Max. Avg.
(%)
11b@1Mbps 20 17 163.6uA 137.8uA 68 %
11g@54Mbps 20 16 159.8uA 137.0uA 60 %
2.4
11n@MCS7 20 14 164.9uA 135.7uA 68 %
11n@MCS7 40 14 155.7A 135.6uA 64 %
11a@54Mbps 20 16 161.5uA 139.4uA 60 %
5 11n@MCS7 20 15 161.0uA 139.3uA 67 %
11n@MCS7 40 14 159.5uA 138.4uA 61 %
Band Receive
Mode BW(MHz)
(GHz) Max. Avg.
11b@1Mbps 20 148.6uA 130.5uA
2.4
11n@MCS7 20 157.9uA 131.0uA
11a@54Mbps 20 156.8uA 131.6uA
5 11n@MCS7 20 162.2uA 131.4uA
11n@MCS7 40 157.5uA 132.4uA

VIO SD=3.3 V
No. Item
Max. Avg.
1 PDN *(1) 4.23mA 4.20mA
2 Sleep *(2) (3) 4.33mA 4.20mA
3 Power Save DTIM 1 (2.4GHz)* (3) (4) 4.24mA 4.21mA
4 Power Save DTIM 3 (2.4GHz)* (3) (4) 4.25mA 4.21mA
5 Power Save DTIM 1 (5 GHz)* (3) (4) 4.26mA 4.21mA
6 Power Save DTIM 3 (5 GHz)* (3) (4) 4.28mA 4.21mA
VIO SD=3.3 V
No. Item
Max. Avg.
Transmit
Band BW RF Power
Mode Duty
(GHz) (MHz) (dBm) Max. Avg.
(%)
11b@1Mbps 20 17 4.22mA 4.22mA 64 %
11g@54Mbps 20 16 4.22mA 4.22mA 66 %
2.4
11n@MCS7 20 14 4.22mA 4.22mA 63 %
11n@MCS7 40 14 4.22mA 4.21mA 64 %
11a@54Mbps 20 16 4.22mA 4.22mA 66 %
5 11n@MCS7 20 15 4.22mA 4.22mA 69 %
11n@MCS7 40 14 4.22mA 4.22mA 51 %
Band Mode BW(MHz) Receive

25
FORM NO.: FR2-015_ A Responsible Department：WBU Expiry Date: Forever
The information contained herein is the exclusive property of AzureWave and shall not be distributed, reproduced, or disclosed
in whole or in part without prior written permission of AzureWave.
 (GHz) Max. Avg.
11b@1Mbps 20 4.21mA 4.21mA
2.4
11n@MCS7 20 4.21mA 4.21mA
11a@54Mbps 20 4.22mA 4.21mA
5 11n@MCS7 20 4.21mA 4.21mA
11n@MCS7 40 4.21mA 4.21mA

VDD=1.8 V
No. Item
Max. Avg.
1 PDN *(1) 158.8uA 142.7uA
2 Sleep *(2) (3) 604.1uA 580.5uA
3 Power Save DTIM 1 (2.4GHz)* (3) (4) 75.4mA 3.4mA
4 Power Save DTIM 3 (2.4GHz)* (3) (4) 67.2mA 1.5mA
5 Power Save DTIM 1 (5 GHz)* (3) (4) 68.1mA 864.7uA
6 Power Save DTIM 3 (5 GHz)* (3) (4) 67.7mA 1.1mA
VDD=1.8 V
No. Item
Max. Avg.
Transmit
Band BW RF Power
Mode Duty
(GHz) (MHz) (dBm) Max. Avg.
(%)
11b@1Mbps 20 17 223.5 mA 215.5 mA 99%
11g@54Mbps 20 16 221.5 mA 221.2 mA 88%
2.4
11n@MCS7 20 14 219.5 mA 219.3 mA 85%
11n@MCS7 40 14 221.1 mA 220.9 mA 80%
11a@54Mbps 20 16 282.5 mA 282.2 mA 88%
5 11n@MCS7 20 15 281.2 mA 280.7 mA 87%
11n@MCS7 40 14 278.2 mA 277.9 mA 80%
Band Receive
Mode BW(MHz)
(GHz) Max. Avg.
11b@1Mbps 20 73.0 mA 72.9 mA
2.4
11n@MCS7 20 72.6mA 72.5mA
11a@54Mbps 20 75.7 mA 75.6 mA
5 11n@MCS7 20 97.8 mA 96.2mA
11n@MCS7 40 95.6mA 95.4mA

26
FORM NO.: FR2-015_ A Responsible Department：WBU Expiry Date: Forever
The information contained herein is the exclusive property of AzureWave and shall not be distributed, reproduced, or disclosed
in whole or in part without prior written permission of AzureWave.
3.6.2 Bluetooth
Test Condition
1. The Bluetooth is in test mode run transmit or receive with a specified output power measure current
consumption.
2. All results are run to take 3 minutes then record the test average and maximum value.
RF VDD=3.3 V VDD=1.8V VIO=3.3V VIO SD=3.3V
Packet Powe
Mode
Type r Max. Avg. Max. Avg. Max. Avg. Max. Avg.
(dBm)
Sleep N/A N/A 641.1uA 630.5uA 12.9mA 12.6mA 125.4uA 115.uA 4.33mA 4.21mA

Transmit DH5 1.1 691.9uA 681.6uA 38.9mA 31.8mA 149.0uA 141.1uA 4.19mA 4.18mA

Receive 3DH5 N/A 689.7uA 681.0uA 43.9mA 37.9mA 150.7uA 138.1uA 4.19mA 4.18mA

27
FORM NO.: FR2-015_ A Responsible Department：WBU Expiry Date: Forever
The information contained herein is the exclusive property of AzureWave and shall not be distributed, reproduced, or disclosed
in whole or in part without prior written permission of AzureWave.
3.7 Sleep Clock
An external crystal is used for generating all radio frequencies and normal operation clocking. As an
alternative, an external frequency reference driven by a temperature-compensated crystal oscillator
(TCXO) signal may be used. No software settings are required to differentiate between the two. In
addition, a low-power oscillator (LPO) is provided for lower power mode timing.
External 32.768KHz Low-Power Oscillator
Symbol Parameter Min Typ Max Units
Clock frequency range/ accuracy 32.768
 CMOS input clock signal type
CLK - - kHz
 ±250 ppm (initial, aging,
temperature)
PN Phase noise requirement (@ 100KHz) - -125 - dBc/Hz
ns
JC Cycle jitter - 1.5 -
(RMS)
SR Slew rate limit (10-90%) - - 100 ns
DC Duty cycle tolerance 20 - 80 %

28
FORM NO.: FR2-015_ A Responsible Department：WBU Expiry Date: Forever
The information contained herein is the exclusive property of AzureWave and shall not be distributed, reproduced, or disclosed
in whole or in part without prior written permission of AzureWave.
4. Mechanical Information
4.1 Mechanical Drawing

29
FORM NO.: FR2-015_ A Responsible Department：WBU Expiry Date: Forever
The information contained herein is the exclusive property of AzureWave and shall not be distributed, reproduced, or disclosed
in whole or in part without prior written permission of AzureWave.
5. Packing Information
1. One reel can pack 750pcs modules
2. One production label is pasted on the reel, one desiccant and one humidity indicator card are put
on the reel

One desiccant

One production label

One humidity indicator card

3. One reel is put into the anti-static moisture barrier bag, and then one label is pasted on the bag

One production label

4. A bag is put into the anti-static pink bubble wrap

One anti-static pink bubble wrap

30
FORM NO.: FR2-015_ A Responsible Department：WBU Expiry Date: Forever
The information contained herein is the exclusive property of AzureWave and shall not be distributed, reproduced, or disclosed
in whole or in part without prior written permission of AzureWave.
5. A bubble wrap is put into the inner box and then one label is pasted on the inner box

生產標籤
Production label
One production label

6. 4 inner boxes could be put into one carton

7. Sealing the carton by AzureWave tape

31
FORM NO.: FR2-015_ A Responsible Department：WBU Expiry Date: Forever
The information contained herein is the exclusive property of AzureWave and shall not be distributed, reproduced, or disclosed
in whole or in part without prior written permission of AzureWave.
8. One carton label and one box label are pasted on the carton. If one carton is not full, one balance
label pasted on the carton

One carton label

One box label

Example of carton label

Example of box label

32
FORM NO.: FR2-015_ A Responsible Department：WBU Expiry Date: Forever
The information contained herein is the exclusive property of AzureWave and shall not be distributed, reproduced, or disclosed
in whole or in part without prior written permission of AzureWave.
 Example of production label

Example of balance label

Note:
 1 reel = 1 inner box = 750pcs
 1 carton = 4 inner boxes = 4 * 750pcs = 3,000pcs

33
FORM NO.: FR2-015_ A Responsible Department：WBU Expiry Date: Forever
The information contained herein is the exclusive property of AzureWave and shall not be distributed, reproduced, or disclosed
in whole or in part without prior written permission of AzureWave.