TS5A3154

www.ti.com SCDS191C – MARCH 2005 – REVISED FEBRUARY 2012

0.9-Ω SPDT ANALOG SWITCH

5-V/3.3-V SINGLE-CHANNEL 2:1 MULTIPLEXER/DEMULTIPLEXER
Check for Samples: TS5A3154

1FEATURES APPLICATIONS
•
2 Specified Make-Before-Break Switching • Cell Phones
• Low ON-State Resistance (0.9 Ω) • PDAs
• Control Inputs Are 5.5-V Tolerant • Portable Instrumentation
• Low Charge Injection • Audio and Video Signal Routing
• Excellent ON-State Resistance Matching • Low-Voltage Data-Acquisition Systems
• Low Total Harmonic Distortion (THD) • Communication Circuits
• 1.65-V to 5.5-V Single-Supply Operation • Modems
• Latch-Up Performance Exceeds 100 mA Per • Hard Drives
JESD 78, Class II • Computer Peripherals
• ESD Performance Tested Per JESD 22 • Wireless Terminals and Peripherals
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)

DCU PACKAGE YZP PACKAGE

(TOP VIEW) (BOTTOM VIEW)

Logic
COM 1 8 V+ GND D1 4 5 D2 IN
Control
EN 2 7 NC GND C1 3 6 C2 NO
GND 3 6 NO EN B1 2 7 B2 NC
Logic
GND 4 5 IN COM A1 1 8 A2 V+
Control

DESCRIPTION/ORDERING INFORMATION
The TS5A3154 is a single-pole double-throw (SPDT) analog switch that is designed to operate from 1.65 V to
5.5 V. The device offers a low ON-state resistance and an excellent channel-to-channel ON-state resistance
matching. The device has excellent total harmonic distortion (THD) performance and consumes very low power.
These features make this device suitable for portable audio applications.

Table 1. ORDERING INFORMATION

TA PACKAGE (1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING (3)
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP Reel of 3000 TS5A3154YZPR _ _ _JX_
–40°C to 85°C (Pb-free)
SSOP – DCU Reel of 3000 TS5A3154DCUR JCF_

(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(3) DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date. Copyright © 2005–2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TS5A3154

SCDS191C – MARCH 2005 – REVISED FEBRUARY 2012 www.ti.com

Table 2. FUNCTION TABLE

NC TO COM, NO TO COM,
EN IN
COM TO NC COM TO NO
L L ON OFF
L H OFF ON
H X OFF OFF

Table 3. Summary of Characteristics (1)

Single-Pole, Double-Throw
Configuration
2:1 Multiplexer/Demultiplexer (SPDT)
Number of channels 1
ON-state resistance (ron) 0.9 Ω
ON-state resistance match (Δron) 0.1 Ω
ON-state resistance flatness (ron(flat)) 0.15 Ω
Turn-on/turn-off time (tON/tOFF) 8 ns/12.5 ns
Make-before-break time (tMBB) 12 ns
Charge injection (QC) 10 pC
Bandwidth (BW) 100 MHz
OFF isolation (OISO) –64 dB at 1 MHz
Crosstalk (XTALK) –64 dB at 1 MHz
Total harmonic distortion (THD) 0.004%
Leakage current (ICOM(OFF)/INC(OFF)) ±20 nA
Power-supply current (I+) 0.1 μA
Package option 8-pin SSOP or DSBGA

(1) V+ = 5 V, TA = 25°C

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Absolute Minimum and Maximum Ratings (1) (2)

over operating free-air temperature range (unless otherwise noted)

MIN MAX UNIT
(3)
V+ Supply voltage range –0.5 6.5 V
VNC,
VNO, Analog voltage range (3) (4) (5)
–0.5 V+ + 0.5 V
VCOM
IK Analog port diode current VNC, VNO, VCOM < 0 or VNO, VNC, VCOM > V+ –50 50 mA
INC, On-state switch current –200 200
ICOM, VNC, VNO, VCOM = 0 to V+ mA
INO On-state peak switch current (6) –400 400
VI Digital input voltage range (3) (4)
–0.5 6.5 V
IIK Digital input clamp current VI < 0 –50 mA
I+ Continuous current through V+ 100 mA
IGND Continuous current through GND –100 100 mA
DCU package 227
θJA Package thermal impedance (7) °C/W
YZP package 102
Tstg Storage temperature range –65 150 °C

(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
(3) All voltages are with respect to ground, unless otherwise specified.
(4) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(5) This value is limited to 5.5 V maximum.
(6) Pulse at 1-ms duration < 10% duty cycle.
(7) The package thermal impedance is calculated in accordance with JESD 51-7.

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Electrical Characteristics for 5-V Supply (1)

V+ = 4.5 V to 5.5 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS TA V+ MIN TYP MAX UNIT
Analog Switch
Analog signal VCOM, VNO,
0 V+ V
range VNC
Peak ON 0 ≤ (VNO or VNC) ≤ V+, Switch ON, 25°C 0.9 1.1
rpeak 4.5 V Ω
resistance ICOM = –100 mA, See Figure 13 Full 1.3
ON-state VNO or VNC = 2.5 V, Switch ON, 25°C 0.8 0.9
ron 4.5 V Ω
resistance ICOM = –100 mA, See Figure 13 Full 1.1
ON-state 25°C 0.05 0.1
resistance
VNO or VNC = 2.5 V, Switch ON,
matching Δron 4.5 V Ω
ICOM = –100 mA, See Figure 13 Full 0.1
between
channels
0 ≤ (VNO or VNC) ≤ V+, Switch ON, 25°C 0.15
ON-state ICOM = –100 mA, See Figure 13 Full
resistance ron(flat) 4.5 V Ω
VNO or VNC = 1 V, 1.5 V, 25°C 0.09 0.15
flatness Switch ON,
2.5 V,
See Figure 13 Full 0.15
ICOM = –100 mA,
VNC or VNO = 1 V, 25°C –20 2 20
VCOM = 4.5 V,
INC(OFF), Switch OFF,
or 5.5 V nA
NC, NO INO(OFF) See Figure 14 Full –150 150
VNC or VNO = 4.5 V,
OFF leakage
VCOM = 1 V,
current
INC(PWROFF), VNC or VNO = 0 to 5.5 V, Switch OFF, 25°C –5 0.7 5
0V μA
INO(PWROFF) VCOM = 5.5 V to 0, See Figure 14 Full –25 25
VNC or VNO = 1 V, 25°C –20 2 20
NC, NO VCOM = Open,
INC(ON), Switch ON,
ON leakage or 5.5 V nA
INO(ON) See Figure 15 Full –150 150
current VNC or VNO = 4.5 V,
VCOM = Open,
VCOM = 1 V, VNC or 25°C –20 2 20
VNO = 4.5 V,
Switch OFF,
ICOM(OFF) or 5.5 V nA
COM See Figure 14 Full –150 150
VCOM = 4.5 V,
OFF leakage
VNC or VNO = 1 V,
current
VNC or VNO = 0 to 5.5 V, Switch OFF, 25°C –5 0.7 5
ICOM(PWROFF) 0V μA
VCOM = 5.5 V to 0, See Figure 14 Full –25 25
VCOM = 1 V, 25°C –20 2 20
COM VNC or VNO = Open,
Switch ON,
ON leakage ICOM(ON) or 5.5 V nA
See Figure 15 Full –150 150
current VCOM = 4.5 V,
VNC or VNO = Open,
Digital Control Inputs (IN, EN) (2)
Input logic high VIH Full 2.4 5.5 V
Input logic low VIL Full 0 0.8 V
Input leakage 25°C –100 25 100
IIH, IIL VI = 5.5 V or 0 V 5.5 V nA
current Full –100 100

(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
(2) All unused digital inputs of the device must be held at V+ or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

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Electrical Characteristics for 5-V Supply(1) (continued)

V+ = 4.5 V to 5.5 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS TA V+ MIN TYP MAX UNIT
Dynamic
25°C 5V 1 5.2 8
Turn-on time, VCOM = V+, CL = 35 pF,
tON 4.5 V to ns
IN or OE RL = 50 Ω, See Figure 17 Full 1 9
5.5 V
25°C 5V 5 9.5 12.5
Turn-off time, VCOM = V+, CL = 35 pF,
tOFF 4.5 V to ns
IN or OE RL = 50 Ω, See Figure 17 Full 4 13.5
5.5 V
25°C 5V 4 6.3 12
Make-before- VCOM = V+, CL = 35 pF,
tMBB 4.5 V to ns
break time RL = 50 Ω, See Figure 18 Full 4 13
5.5 V
VGEN = 0, CL = 1 nF,
Charge injection QC 25°C 5V 10 pC
RGEN = 0, See Figure 22
NC, NO
CNC(OFF), Switch OFF,
OFF VNC or VNO = V+ or GND, 25°C 5V 19 pF
CNO(OFF) See Figure 16
capacitance
NC, NO
CNC(ON), Switch ON,
ON VNC or VNO = V+ or GND, 25°C 5V 57 pF
CNO(ON) See Figure 16
capacitance
COM OFF Switch ON,
CCOM(OFF) VCOM = V+ or GND, 25°C 5V 36 pF
capacitance See Figure 16
COM ON Switch ON,
CCOM(ON) VCOM = V+ or GND, 25°C 5V 57 pF
capacitance See Figure 16
Digital input
CI VI = V+ or GND, See Figure 16 25°C 5V 2 pF
capacitance
Switch ON,
Bandwidth BW RL = 50 Ω, 25°C 5V 100 MHz
See Figure 19
RL = 50 Ω, Switch OFF,
OFF isolation OISO 25°C 5V –64 dB
f = 1 MHz, See Figure 20
RL = 50 Ω, Switch ON,
Crosstalk XTALK 25°C 5V –64 dB
f = 1 MHz, See Figure 21
Total harmonic RL = 600 Ω, f = 20 Hz to 20 kHz,
THD 25°C 5V 0.004 %
distortion CL = 50 pF, See Figure 23
Supply
Positive supply 25°C 0.02 0.1
I+ VI = V+ or GND, Switch ON or OFF 5.5 V μA
current Full 0.5

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Electrical Characteristics for 3.3-V Supply (1)

V+ = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS TA V+ MIN TYP MAX UNIT
Analog
Switch
Analog signal VCOM, VNO,
0 V+ V
range VNC
Peak ON 0 ≤ (VNO or VNC) ≤ V+, Switch ON, 25°C 1.3 1.6
rpeak 3V Ω
resistance ICOM = –100 mA, See Figure 13 Full 1.9
ON-state VNO or VNC = 2 V, Switch ON, 25°C 1.2 1.5
ron 3V Ω
resistance ICOM = –100 mA, See Figure 13 Full 1.7
ON-state 25°C 0.08 0.15
resistance
VNO or VNC = 2 V, 0.8 V Switch ON,
match Δron 3V Ω
ICOM = –100 mA, See Figure 13 Full 0.15
between
channels
0 ≤ (VNO or VNC) ≤ V+, Switch ON, 25°C 0.3
ON-state ICOM = –100 mA, See Figure 13 Full
resistance ron(flat) 3V Ω
flatness VNO or VNC = 2 V, 0.8 V, Switch ON, 25°C 0.09 0.15
ICOM = –100 mA, See Figure 13 Full 0.15
VNC or VNO = 1 V, VCOM = 3 V, 25°C –20 2 20
INC(OFF), Switch OFF,
or 3.6 V nA
NC, NO INO(OFF) See Figure 14 Full –50 50
VNC or VNO = 3 V, VCOM = 1 V,
OFF leakage
current INC(PWROFF), VNC or VNO = 0 to 3.6 V, Switch OFF, 25°C –1 0.2 1
0V μA
INO(PWROFF) VCOM = 3.6 V to 0 V, See Figure 14 Full –15 15
NC, NO VNC or VNO = 1 V, VCOM = Open, 25°C –20 2 20
INC(ON), Switch ON,
ON leakage or 3.6 V nA
INO(ON) See Figure 15 Full –50 50
current VNC or VNO = 3 V, VCOM = Open,
VCOM = 1 V, VNC or VNO = 3 V, 25°C –20 2 20
Switch OFF,
ICOM(OFF) or 3.6 V nA
COM See Figure 14 Full –50 50
VCOM = 3 V, VNC or VNO = 1 V,
OFF leakage
current VNC or VNO = 0 to 3.6 V, Switch OFF, 25°C –1 0.2 1
ICOM(PWROFF) 0V μA
VCOM = 3.6 V to 0, See Figure 14 Full –15 15
COM VCOM = 1 V, VNC or VNO = Open, 25°C –20 2 20
Switch ON,
ON leakage ICOM(ON) or 3.6 V nA
See Figure 15 Full –50 50
current VCOM = 3 V, VNC or VNO = Open
Digital Control Inputs (IN, EN) (2)
Input logic high VIH Full 2 5.5 V
Input logic low VIL Full 0 0.8 V
Input leakage 25°C –100 25 100
IIH, IIL VI = 5.5 V or 0 3.6 V nA
current Full –100 100

(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
(2) All unused digital inputs of the device must be held at V+ or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

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Electrical Characteristics for 3.3-V Supply(1) (continued)

V+ = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS TA V+ MIN TYP MAX UNIT
Dynamic
25°C 3.3 V 3 6 10
Turn-on time, VCOM = V+, CL = 35 pF,
tON 3 V to ns
IN or OE RL = 50 Ω, See Figure 17 Full 2 10.5
3.6 V
25°C 3.3 V 5 10 15
Turn-off time, VCOM = V+, CL = 35 pF,
tOFF 3 V to ns
IN or OE RL = 50 Ω, See Figure 17 Full 4 17
3.6 V
25°C 3.3 V 4 5.7 12
Make-before- VCOM = V+, CL = 35 pF,
tMBB 3 V to ns
break time RL = 50 Ω, See Figure 18 Full 4 13
3.6 V
Charge VGEN = 0, CL = 1 nF,
QC 25°C 3.3 V 9 pC
injection RGEN = 0, See Figure 22
NC, NO
CNC(OFF), Switch OFF,
OFF VNC or VNO = V+ or GND, 25°C 3.3 V 19 pF
CNO(OFF) See Figure 16
capacitance
NC, NO
CNC(ON), Switch ON,
ON VNC or VNO = V+ or GND, 25°C 3.3 V 57 pF
CNO(ON) See Figure 16
capacitance
COM OFF Switch ON,
CCOM(OFF) VCOM = V+ or GND, 25°C 3.3 V 36 pF
capacitance See
COM
Switch ON,
ON CCOM(ON) VCOM = V+ or GND, 25°C 3.3 V 57 pF
See Figure 16
capacitance
Digital input
CI VI = V+ or GND, See Figure 16 25°C 3.3 V 2 pF
capacitance
Switch ON,
Bandwidth BW RL = 50 Ω, 25°C 3.3 V 100 MHz
See Figure 19
RL = 50 Ω, Switch OFF,
OFF isolation OISO 25°C 3.3 V –64 dB
f = 1 MHz, See Figure 20
RL = 50 Ω, Switch ON,
Crosstalk XTALK 25°C 3.3 V –64 dB
f = 1 MHz, See Figure 21
f = 20 Hz to 20
Total harmonic RL = 600 Ω, 0.01
THD kHz, 25°C 3.3 V %
distortion CL = 50 pF, 0
See Figure 23
Supply
Positive supply Switch ON or 25°C 0.01 0.1
I+ VI = V+ or GND, 3.6 V μA
current OFF Full 0.25

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Electrical Characteristics for 2.5-V Supply (1)

V+ = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS TA V+ MIN TYP MAX UNIT
Analog Switch
Analog signal VCOM, VNO,
0 V+ V
range VNC
Peak ON 0 ≤ (VNO or VNC) ≤ V+, Switch ON, 25°C 1.9 2.5
rpeak 2.3 V Ω
resistance ICOM = –8 mA, See Figure 13 Full 2.7
ON-state VNO or VNC = 1.8 V, Switch ON, 25°C 1.6 2.1
ron 2.3 V Ω
resistance ICOM = –8 mA, See Figure 13 Full 2.5
ON-state 25°C 0.12 0.2
resistance
VNO or VNC = 1.8 V, Switch ON,
matching Δron 2.3 V Ω
ICOM = –8 mA, See Figure 13 Full 0.2
between
channels
0 ≤ (VNO or VNC) ≤ V+, Switch ON, 25°C 0.65
ON-state ICOM = –8 mA, See Figure 13 Full
resistance ron(flat) 2.3 V Ω
flatness VNO or VNC = 0.8 V, 1.8 V, Switch ON, 25°C 0.5 1
ICOM = –8 mA, See Figure 13 Full 1
VNC or VNO = 0.5 V, 25°C –20 2 20
VCOM = 2.3 V,
INC(OFF), Switch OFF,
or 2.7 V nA
NC, NO INO(OFF) See Figure 14 Full –50 50
VNC or VNO = 2.3 V,
OFF leakage
VCOM = 0.5 V,
current
INC(PWROFF), VNC or VNO = 0 to 2.7 V, Switch OFF, 25°C –1 1
0V μA
INO(PWROFF) VCOM = 2.7 V to 0, See Figure 14 Full –10 10
VNC or VNO = 0.5 V, 25°C –20 20
NC, NO VCOM = Open,
INC(ON), Switch ON,
ON leakage or 2.7 V nA
INO(ON) See Figure 15 Full –50 50
current VNC or VNO = 2.3 V,
VCOM = Open,
VCOM = 0.5 V, VNC or 25°C –20 20
VNO = 2.3 V,
Switch OFF,
ICOM(OFF) or 2.7 V nA
COM See Figure 14 Full –50 50
VCOM = 2.3 V, VNC or
OFF leakage
VNO = 0.5V,
current
VNC or VNO = 0 to 2.7 V, Switch OFF, 25°C –1 1
ICOM(PWROFF) 0V μA
VCOM = 2.7 V to 0, See Figure 14 Full –10 10
VCOM = 0.5 V, VNC or 25°C –20 20
COM VNO = Open,
Switch ON,
ON leakage ICOM(ON) or 2.7 V nA
See Figure 15 Full –50 50
current VCOM = 2.3 V, VNC or
VNO = Open,
Digital Control Inputs (IN, EN) (2)
Input logic high VIH Full 1.8 5.5 V
Input logic low VIL Full 0 0.6 V
Input leakage 25°C –100 25 100
IIH, IIL VI = 5.5 V or 0 2.7 V nA
current Full –100 100

(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
(2) All unused digital inputs of the device must be held at V+ or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

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Electrical Characteristics for 2.5-V Supply(1) (continued)

V+ = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS TA V+ MIN TYP MAX UNIT
Dynamic
25°C 2.5 V 4 7.0 11.5
Turn-on time, VCOM = V+, CL = 35 pF,
tON 2.3 V to ns
IN or OE RL = 50 Ω, See Figure 17 Full 3.5 12
2.7 V
25°C 2.5 V 5 11.5 18.5
Turn-off time, VCOM = V+, CL = 35 pF,
tOFF 2.3 V to ns
IN or OE RL = 50 Ω, See Figure 17 Full 4 21
2.7 V
25°C 2.5 V 4 6.3 15
Make-before- VCOM = V+, CL = 35 pF,
tMBB 2.3 V to ns
break time RL = 50 Ω, See Figure 18 Full 4 16
2.7 V
VGEN = 0, CL = 1 nF,
Charge injection QC 25°C 2.5 V 7 pC
RGEN = 0, See Figure 22
NC, NO
CNC(OFF), Switch OFF,
OFF VNC or VNO = V+ or GND, 25°C 2.5 V 19 pF
CNO(OFF) See Figure 16
capacitance
NC, NO
CNC(ON), Switch ON,
ON VNC or VNO = V+ or GND, 25°C 2.5 V 57 pF
CNO(ON) See Figure 16
capacitance
COM OFF Switch ON,
CCOM(OFF) VCOM = V+ or GND, 25°C 2.5 V 36 pF
capacitance See Figure 16
COM ON Switch ON,
CCOM(ON) VCOM = V+ or GND, 25°C 2.5 V 57 pF
capacitance See Figure 16
Digital input
CI VI = V+ or GND, See Figure 16 25°C 2.5 V 2 pF
capacitance
Switch ON,
Bandwidth BW RL = 50 Ω, 25°C 2.5 V 100 MHz
See Figure 19
RL = 50 Ω, Switch OFF,
OFF isolation OISO 25°C 2.5 V –64 dB
f = 1 MHz, See Figure 20
RL = 50 Ω, Switch ON,
Crosstalk XTALK 25°C 2.5 V –64 dB
f = 1 MHz, See Figure 21
Total harmonic RL = 600 Ω, f = 20 Hz to 20 kHz,
THD 25°C 2.5 V 0.020 %
distortion CL = 50 pF, See Figure 23
Supply
Positive supply 25°C 0.001 0.05
I+ VI = V+ or GND, Switch ON or OFF 2.7 V μA
current Full 0.15

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Electrical Characteristics for 1.8-V Supply (1)

V+ = 1.65 V to 1.95 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS TA V+ MIN TYP MAX UNIT
Analog
Switch
Analog signal VCOM, VNO,
0 V+ V
range VNC
Peak ON 0 ≤ (VNO or VNC) ≤ V+, Switch ON, 25°C 5.5 25
rpeak 1.65 V Ω
resistance ICOM = –2 mA, See Figure 13 Full 30
ON-state VNO or VNC = 1.5 V, Switch ON, 25°C 2 2.7
ron 1.65 V Ω
resistance ICOM = –2 mA, See Figure 13 Full 3.1
ON-state 25°C 0.16 0.3
resistance
VNO or VNC = 1.5 V, Switch ON,
matching Δron 1.65 V Ω
ICOM = –2 mA, See Figure 13 Full 0.3
between
channels
0 ≤ (VNO or VNC) ≤ V+, Switch ON,
25°C 3
ON-state ICOM = –2 mA, See Figure 13
resistance ron(flat) 1.65 V Ω
VNO or VNC = 0.6 V, 1.5 V, Switch ON, 25°C 3 20
flatness
ICOM = –2 mA, See Figure 13 Full 25
VNC or VNO = 0.3 V, 25°C –20 1.5 20
VCOM = 1.65 V,
INC(OFF), Switch OFF,
or 1.95 V nA
NC, NO INO(OFF) See Figure 14 Full –50 50
VNC or VNO = 1.65 V,
OFF leakage
VCOM = 0.3 V,
current
INC(PWROFF), VNC or VNO = 0 to 1.95 V, Switch OFF, 25°C –1 0.1 1
0V μA
INO(PWROFF) VCOM = 1.95 V to 0, See Figure 14 Full –10 10
VNC or VNO = 0.3 V, 25°C –20 1.5 20
NC, NO VCOM = Open,
INC(ON), Switch ON,
ON leakage or 1.95 V nA
INO(ON) See Figure 15 Full –50 50
current VNC or VNO = 1.65 V,
VCOM = Open,
VNC or VNO = 1.65 V, 25°C –20 1.5 20
VCOM = 0.3 V,
Switch OFF,
ICOM(OFF) or 1.95 V nA
COM See Figure 14 Full –50 50
VNC or VNO = 0.3 V,
OFF leakage
VCOM = 1.65 V,
current
VNC or VNO = 1.95 V to 0, Switch OFF, 25°C –1 0.06 1
ICOM(PWROFF) 0V μA
VCOM = 0 to 1.95 V, See Figure 14 Full –10 10
VNC or VNO = Open, 25°C –20 1.5 20
COM VCOM = 0.3 V,
Switch ON,
ON leakage ICOM(ON) or 1.95 V nA
See Figure 15 Full –50 50
current VNC or VNO = Open,
VCOM = 1.65 V,
Digital Control Inputs (IN, EN) (2)
Input logic high VIH Full 1.5 5.6 V
Input logic low VIL Full 0 0.6 V
Input leakage 25°C –100 25 100
IIH, IIL VI = 5.5 V or 0 1.95 V nA
current Full –100 100

(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
(2) All unused digital inputs of the device must be held at V+ or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

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Electrical Characteristics for 1.8-V Supply(1) (continued)

V+ = 1.65 V to 1.95 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS TA V+ MIN TYP MAX UNIT
Dynamic
25°C 5V 5 20.5
Turn-on time, VCOM = V+, CL = 35 pF,
tON 1.65 V to ns
IN or OE RL = 50 Ω, See Figure 17 Full 4.5 21
1.95 V
25°C 5V 7 16.5 27.5
Turn-off time, VCOM = V+, CL = 35 pF,
tOFF 1.65 V to ns
IN or OE RL = 50 Ω, See Figure 17 Full 5 30
1.95 V
25°C 5V 4 8.3 15
Make-before- VCOM = V+, CL = 35 pF,
tMBB 1.65 V to ns
break time RL = 50 Ω, See Figure 18 Full 4 16
1.95 V
Charge VGEN = 0, CL = 1 nF,
QC 25°C 1.8 V 5 pC
injection RGEN = 0, See Figure 22
NC, NO
CNC(OFF), Switch OFF,
OFF VNC or VNO = V+ or GND, 25°C 1.8 V 19 pF
CNO(OFF) See Figure 16
capacitance
NC, NO
CNC(ON), Switch ON,
ON VNC or VNO = V+ or GND, 25°C 1.8 V 57 pF
CNO(ON) See Figure 16
capacitance
COM OFF Switch ON,
CCOM(OFF) VCOM = V+ or GND, 25°C 1.8 V 36 pF
capacitance See Figure 16
COM ON Switch ON,
CCOM(ON) VCOM = V+ or GND, 25°C 1.8 V 57 pF
capacitance See Figure 16
Digital input
CI VI = V+ or GND, See Figure 16 25°C 1.8 V 2.0 pF
capacitance
Switch ON,
Bandwidth BW RL = 50 Ω, 25°C 1.8 V 100 MHz
See Figure 19
RL = 50 Ω, Switch OFF,
OFF isolation OISO 25°C 1.8 V –64 dB
f = 1 MHz, See Figure 20
RL = 50 Ω, Switch ON,
Crosstalk XTALK 25°C 1.8 V –64 dB
f = 1 MHz, See Figure 21
f = 20 Hz to 20
Total harmonic RL = 600 Ω,
THD kHz, 25°C 1.8 V 0.060 %
distortion CL = 50 pF,
See Figure 23
Supply
Positive supply 25°C 0.001 0.05
I+ VI = V+ or GND, Switch ON or OFF 1.95 V μA
current Full 0.1

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TYPICAL PERFORMANCE
TA = 25°C
ron (Ω)

ron (Ω)
TA = 85°C
TA = 25°C
TA = –40°C

Figure 1. ron vs VCOM Figure 2. ron vs VCOM (V+ = 3 V)

ron (Ω)

TA = 85°C
TA = 25°C
TA = –40°C

TA (°C)
Figure 3. ron vs VCOM (V+ = 5 V) Figure 4. Leakage Current vs Temperature
(V+ = 5.5 V)

Figure 5. Charge Injection (QC) vs VCOM Figure 6. tON and tOFF vs Supply Voltage

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TYPICAL PERFORMANCE (continued)

TA (°C)
Figure 7. tON and tOFF vs Temperature (V+ = 5 V) Figure 8. Logic-Level Threshold vs V+

Figure 9. Bandwidth (V+ = 5 V) Figure 10. OFF Isolation and Crosstalk (V+ = 5 V)

TA (ºC)
Figure 11. Total Harmonic Distortion (THD) Figure 12. Power Supply Current vs Temperature
vs Frequency (V+ = 5 V)

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PIN DESCRIPTION
PIN NO. NAME DESCRIPTION
1 COM Common
2 EN Enable control input
3 GND Digital ground
4 GND Digital ground
5 IN Digital control to connect the COM to NO or NC
6 NO Normally open
7 NC Normally closed
8 V+ Power supply

PARAMETER DESCRIPTION
SYMBOL DESCRIPTION
VCOM Voltage at COM
VNC Voltage at NC
VNO Voltage at NO
ron Resistance between COM and NC or COM and NO ports when the channel is ON
Δron Difference of ron between channels in a specific device
ron(flat) Difference between the maximum and minimum value of ron in a channel over the specified range of conditions
INC(OFF) Leakage current measured at the NC port, with the corresponding channel (NC to COM) in the OFF state
INO(OFF) Leakage current measured at the NO port, with the corresponding channel (NO to COM) in the OFF state
Leakage current measured at the NC port, with the corresponding channel (NC to COM) in the ON state and the output
INC(ON)
(COM) open
Leakage current measured at the NO port, with the corresponding channel (NO to COM) in the ON state and the output
INO(ON)
(COM) open
Leakage current measured at the COM port, with the corresponding channel (COM to NO or COM to NC) in the ON state and
ICOM(ON)
the output (NC or NO) open
VIH Minimum input voltage for logic high for the control input (IN)
VIL Maximum input voltage for logic low for the control input (IN)
VI Voltage at the control input (IN)
IIH, IIL Leakage current measured at the control input (IN)
Turn-on time for the switch. This parameter is measured under the specified range of conditions and by the propagation delay
tON
between the digital control (IN) signal and analog output (COM, NC, or NO) signal when the switch is turning ON.
Turn-off time for the switch. This parameter is measured under the specified range of conditions and by the propagation delay
tOFF
between the digital control (IN) signal and analog output (COM, NC, or NO) signal when the switch is turning OFF.
Break-before-make time. This parameter is measured under the specified range of conditions and by the propagation delay
tBBM
between the output of two adjacent analog channels (NC and NO) when the control signal changes state.
Charge injection is a measurement of unwanted signal coupling from the control (IN) input to the analog (NC, NO, or COM)
QC output. This is measured in coulomb (C) and measured by the total charge induced due to switching of the control input.
Charge injection, QC = CL × ΔVCOM, CL is the load capacitance and ΔVCOM is the change in analog output voltage.
CNC(OFF) Capacitance at the NC port when the corresponding channel (NC to COM) is OFF
CNO(OFF) Capacitance at the NO port when the corresponding channel (NO to COM) is OFF
CNC(ON) Capacitance at the NC port when the corresponding channel (NC to COM) is ON
CNO(ON) Capacitance at the NO port when the corresponding channel (NO to COM) is ON
CCOM(ON) Capacitance at the COM port when the corresponding channel (COM to NC or COM to NO) is ON
CI Capacitance of control input (IN)
OFF isolation of the switch is a measurement of OFF-state switch impedance. This is measured in dB in a specific frequency,
OISO
with the corresponding channel (NC to COM or NO to COM) in the OFF state.
Crosstalk is a measurement of unwanted signal coupling from an ON channel to an OFF channel (NC to NO or NO to NC).
XTALK
This is measured in a specific frequency and in dB.
BW Bandwidth of the switch. This is the frequency where the gain of an ON channel is –3 dB below the DC gain.
Total harmonic distortion describes the signal distortion caused by the analog switch. This is defined as the ratio of root mean
THD
square (RMS) value of the second, third, and higher harmonic to the absolute magnitude of fundamental harmonic.

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PARAMETER DESCRIPTION (continued)

SYMBOL DESCRIPTION
I+ Static power-supply current with the control (IN) pin at V+ or GND

PARAMETER MEASUREMENT INFORMATION

V+

VNC NC
COM VCOM
+
VNO NO Channel ON
VCOM * VNO or VNC
r on + W
IN or EN I COM
VI ICOM
VI = VIH or VIL
+
GND

Figure 13. ON-State Resistance (ron)

V+

VNC NC
COM VCOM
+
VNO NO + OFF-State Leakage Current
Channel OFF
VI = VIH or VIL
IN or EN
VI
+
GND

Figure 14. OFF-State Leakage Current (INC(OFF), INO(OFF), INO(PWROFF), ICOM(PWROFF))

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PARAMETER MEASUREMENT INFORMATION (continued)

V+

VNC NC
COM
+ VCOM
VNO NO
ON-State Leakage Current
Channel ON
IN or EN VI = VIH or VIL
VI
+
GND

Figure 15. ON-State Leakage Current (ICOM(ON), INC(ON), INO(ON))

V+

VNC NC
Capacitance
Meter VBIAS = V+ or GND
VNO NO
VI = VIH or VIL
VCOM COM
VBIAS Capacitance is measured at NC,
VI NO, COM, and IN inputs during
ON and OFF conditions.
IN or EN
GND

Figure 16. Capacitance (CI, CCOM(OFF), CCOM(ON), CNC(OFF), CNO(OFF), CNC(ON), CNO(ON))
V+
TEST RL CL VCOM

NC or NO VNC or VNO tON 50 Ω 35 pF V+

VCOM COM
NC or NO CL(2) RL tOFF 50 Ω 35 pF V+

IN or EN
Logic V+
VI
Input 50% 50%
Logic (VI) 0
GND
Input(1) tON tOFF
Switch
Output 90% 90%
(VNC or VNO)

(1) All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns, tf < 5 ns.
(2) CL includes probe and jig capacitance.

Figure 17. Turn-On (tON) and Turn-Off Time (tOFF)

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PARAMETER MEASUREMENT INFORMATION (continued)

V+

Logic V+
NC VNC Input 50%
(VI) 0
VCOM COM
NO VNO CL(2) RL
VNC
0.8 VOUT
Switch
IN or EN
Output 0.8 VOUT
VI
CL(2) RL VNO
Logic
GND
Input(1) VCOM = V+ tMBB
RL = 50 Ω
CL = 35 pF

(1) All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns, tf < 5 ns.
(2) CL includes probe and jig capacitance.

Figure 18. Make-Before-Break Time (tMBB)

V+
Network Analyzer

50 W VNC NC Channel ON: NC to COM

COM VCOM VI = V+ or GND
Source
NO
Signal
Network Analyzer Setup
INor EN
50 W VI Source Power = 0 dBm
+ (632-mV P-P at 50-W load)
GND
DC Bias = 350 mV

Figure 19. Bandwidth (BW)

V+
Network Analyzer

Channel OFF: NC to COM

50 W VNC NC
VI = V+ or GND
COM VCOM
Source
50 W NO
Signal Network Analyzer Setup
IN or EN
VI Source Power = 0 dBm
50 W (632-mV P-P at 50-W load)
+ GND
DC Bias = 350 mV

Figure 20. OFF Isolation (OISO)

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PARAMETER MEASUREMENT INFORMATION (continued)

V+
Network Analyzer
Channel ON: NC to COM
50 W VNC NC Channel OFF: NO to COM
VCOM VI = V+ or GND
Source
VNO NO
Signal
IN or EN 50 W Network Analyzer Setup
VI
50 W + Source Power = 0 dBm
GND (632-mV P-P at 50-W load)
DC Bias = 350 mV

Figure 21. Crosstalk (XTALK)

V+ Logic VIH
Input
OFF ON OFF V
(VI) IL
RGEN
NC or NO
COM VCOM
+ VCOM ∆VCOM
VGEN NC or NO
CL(2)
IN or EN VGEN = 0 to V+
VI
RGEN = 0
CL = 0.1 nF
Logic
Input(1) GND QC = CL × ∆VCOM
VI = VIH or VIL

(1) All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns, tf < 5 ns.
(2) CL includes probe and jig capacitance.

Figure 22. Charge Injection (QC)

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www.ti.com SCDS191C – MARCH 2005 – REVISED FEBRUARY 2012

PARAMETER MEASUREMENT INFORMATION (continued)

Channel ON: COM to NC VI = VIH or VIL RL = 600 Ω

V+/2
VSOURCE = V+ P-P fSOURCE = 20 Hz to 20 kHz CL = 50 pF
V+
Audio Analyzer
RL
10 mF
NC
10 mF
Source
COM
Signal
600 W NO CL(1)
600 W
VI IN
+
GND
600 W

(1) CL includes probe and jig capacitance.

Figure 23. Total Harmonic Distortion (THD)

Copyright © 2005–2012, Texas Instruments Incorporated Submit Documentation Feedback 19

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SCDS191C – MARCH 2005 – REVISED FEBRUARY 2012 www.ti.com

REVISION HISTORY

Changes from Revision B (May 2009) to Revision C Page

• Changed ORDERING INFORMATION Table. ...................................................................................................................... 1

20 Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated

Product Folder Link(s): TS5A3154

 PACKAGE OPTION ADDENDUM

www.ti.com 30-Aug-2021

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

TS5A3154DCUR ACTIVE VSSOP DCU 8 3000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 85 (CF, JCFQ, JCFR)
JZ
TS5A3154DCURE6 PREVIEW VSSOP DCU 8 3000 TBD Call TI Call TI -40 to 85
TS5A3154DCURG4 ACTIVE VSSOP DCU 8 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 JCFR

TS5A3154YZPR ACTIVE DSBGA YZP 8 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 JXN

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 30-Aug-2021

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 20-Mar-2024

TAPE AND REEL INFORMATION

REEL DIMENSIONS TAPE DIMENSIONS

K0 P1

B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2 Q1 Q2

Q3 Q4 Q3 Q4 User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TS5A3154DCUR VSSOP DCU 8 3000 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3
TS5A3154DCUR VSSOP DCU 8 3000 178.0 9.5 2.25 3.35 1.05 4.0 8.0 Q3
TS5A3154DCURG4 VSSOP DCU 8 3000 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3
TS5A3154YZPR DSBGA YZP 8 3000 178.0 9.2 1.02 2.02 0.63 4.0 8.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 20-Mar-2024

TAPE AND REEL BOX DIMENSIONS

Width (mm)
H
W

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TS5A3154DCUR VSSOP DCU 8 3000 202.0 201.0 28.0
TS5A3154DCUR VSSOP DCU 8 3000 202.0 201.0 28.0
TS5A3154DCURG4 VSSOP DCU 8 3000 202.0 201.0 28.0
TS5A3154YZPR DSBGA YZP 8 3000 220.0 220.0 35.0

Pack Materials-Page 2
 PACKAGE OUTLINE
DCU0008A SCALE 6.000
VSSOP - 0.9 mm max height
SMALL OUTLINE PACKAGE

3.2
TYP C
3.0
A
0.1 C
PIN 1 INDEX AREA SEATING
6X 0.5 PLANE
8
1

2X
2.1
1.5
1.9
NOTE 3

4
5
0.25
8X
0.17
2.4
B 0.08 C A B
2.2
NOTE 3

SEE DETAIL A

0.12 0.9
GAGE PLANE 0.6

0.1
0 -6 0.35 0.0
(0.13) TYP
0.20

DETAIL A
A 30

TYPICAL

4225266/A 09/2014

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MO-187 variation CA.

www.ti.com
 EXAMPLE BOARD LAYOUT
DCU0008A VSSOP - 0.9 mm max height
SMALL OUTLINE PACKAGE

SEE SOLDER MASK

8X (0.85) SYMM DETAILS

(R0.05) TYP

8X (0.3) 1 8

SYMM
6X (0.5)

4 5

(3.1)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE: 25X

SOLDER MASK METAL UNDER SOLDER MASK

METAL
OPENING SOLDER MASK OPENING

EXPOSED METAL EXPOSED METAL

0.05 MAX 0.05 MIN

ALL AROUND ALL AROUND

NON-SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED)
SOLDER MASK DETAILS
15.000

4225266/A 09/2014
NOTES: (continued)

5. Publication IPC-7351 may have alternate designs.

6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
 EXAMPLE STENCIL DESIGN
DCU0008A VSSOP - 0.9 mm max height
SMALL OUTLINE PACKAGE

8X (0.85)
SYMM
(R0.05) TYP

8X (0.3) 1 8

SYMM
6X (0.5)

4 5

(3.1)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL
SCALE: 25X

4225266/A 09/2014
NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.

www.ti.com
 PACKAGE OUTLINE
YZP0008 SCALE 8.000
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY

B E A

BALL A1
CORNER

C
0.5 MAX

SEATING PLANE
0.19
0.15 0.05 C
BALL TYP

0.5 TYP

C
SYMM
1.5
TYP
D: Max = 1.918 mm, Min =1.858 mm
B
E: Max = 0.918 mm, Min =0.858 mm
0.5
TYP
A

0.25
8X 1 2
0.21
0.015 C A B
SYMM

4223082/A 07/2016
NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.

www.ti.com
 EXAMPLE BOARD LAYOUT
YZP0008 DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY

(0.5) TYP
8X ( 0.23)
1 2

(0.5) TYP

B
SYMM

SYMM

LAND PATTERN EXAMPLE

SCALE:40X

SOLDER MASK 0.05 MAX 0.05 MIN ( 0.23)

OPENING SOLDER MASK
OPENING

( 0.23)
METAL METAL UNDER
SOLDER MASK
NON-SOLDER MASK SOLDER MASK
DEFINED DEFINED
(PREFERRED)

SOLDER MASK DETAILS

NOT TO SCALE

4223082/A 07/2016

NOTES: (continued)

3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).

www.ti.com
 EXAMPLE STENCIL DESIGN
YZP0008 DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY

(0.5) TYP

8X ( 0.25)
(R0.05) TYP
1 2

(0.5)
TYP

B
SYMM

METAL
TYP

SYMM

SOLDER PASTE EXAMPLE

BASED ON 0.1 mm THICK STENCIL
SCALE:40X

4223082/A 07/2016

NOTES: (continued)

4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.

www.ti.com
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