RF Modules (Tx–Rx) with Multifunctional MMICs

Martin Oppermann, Ralf Rieger

HENSOLDT Sensors GmbH
Wörthstr. 85, 89077 Ulm, Germany
e-mail: [email protected]

Abstract — Next generation RF sensor modules for multi- transmit path to the antenna (Tx mode), from the antenna
function active electronically steered antenna (AESA) to the module’s receive path (Rx mode) and additionally
systems will need a combination of different operating isolates both directions. This T/R module uses the
modes, such as radar, electronic warfare (EW) chip&wire technology on an LTCC based multilayer
functionalities and communications/datalinks within the package with a soldered baseplate and frame. A final

Downloaded from http://meridian.allenpress.com/imaps-conferences/article-pdf/2017/NOR/1/2260820/2017-nor-oppermann.pdf by guest on 03 January 2023

same antenna frontend. They typically operate in C-Band, laser welding process of a lid onto the frame ensures a
X-Band and Ku-Band and imply a bandwidth requirement hermetic isolation of the single channel TRM.
of more than 10 GHz. For the realisation of modern active
electronically steered antennas, the transmit/receive (T/R) Looking at military phased array radar systems, detailed
modules have to match strict geometry demands. A major cost figures of the main segments are indicating that the
challenge for these future multifunction RF sensor phased array antenna accounts for nearly 50% of the
modules is dictated by the half-wavelength antenna grid cost, whereas remaining segments like the segment-units
spacing, that limits the physical channel width to < 12 mm processor, the receiver/exciter and mechanical/thermal
or even less, depending on the highest frequency of issues filling up the other 50%.
operation with accordant beam pointing requirements. A Observing the cost distribution for the phased array
promising solution to overcome these geometry demands antenna itself, the T/R modules cover more than 45%
is the reduction of the total monolithic microwave
cost, whereas structure, sssembly/test and RF
integrated circuit (MMIC) chip area, achieved by
integrating individual RF functionalities, which are
boards/cabling determine the residual cost [2].
commonly achieved through individual integrated circuits Two main options allowing a decrease of TR module cost
(ICs), into new multifunctional (MFC) MMICs. Various in future are identified here:
concepts, some of them already implemented, towards
next generation RF sensor modules will be discussed and (1) The reduction of the total active chip/MMIC area,
explained in this work. representing the main cost driver of TR modules, and
(2) the use of packaged MMICs in low-cost commercially
Keywords—Multifunctional (MFC) MMIC; GaN; Si/SiGe available quad flat no lead (QFN) packages for assembly
BiCMOS; T/R Module (TRM); Multilayer ceramic (MLC, on RF printed circuit boards (PCBs).
LTCC, HTCC); MMIC packaging; Tile array;
It is quite evident that the applicability of these options
I. INTRODUCTION depend on the target application (airborne/space vs.
T/R modules (TRM) are key building blocks for modern ground/naval). Within the last years, the development of
phased arrays with active electronically steered antennas disruptive semiconductor technologies like GaN and
(AESA). Often hundreds or even thousands of TRMs are Si/SiGe BiCMOS has reached a high level of
used in different platforms, like airborne fighter nose performance that enables the replacement of GaAs
radars, satellite based synthetic aperture radar (SAR) based components in future RF modules. The key
antennas or ground surveillance and security radars [1]. characteristics of GaN based components and MMICs,
As a typical example, Fig.1 shows the SMTR®, a compared to GaAs, are an increased power density,
standardized modular X-Band T/R module developed at higher supply voltages (up to 50V) and an impressive
Hensoldt during the last decade, which is employed in robustness. This allows not only the design of small size
many applications since then. high output power amplifiers, it also enables the
realisation of compact high power handling RF switches,
thus making the bulky circulator obsolet.
Furthermore, with SiGe/BiCMOS technologies, much
higher levels of integration are possible. Combining RF
control functions (e.g. phase-shifting, amplitude control
and low power RF switching) with the control logic for the
complete T/R-module, the chip and hence the module
Fig. 1. SMTR® Module size can greatly be reduced.

In the SMTR, all receive-, transmit- and low-power-

functions are realized with single GaAs- and Si-MMICs. A
three-port-circulator routes the signal from the module’s
A block diagram (artist´s view) in Fig. 2 shows an The combination of a custom designed GaN based
arrangement for a new generation of RF modules. single-chip frontend MMIC with a size of less than 13mm²
[3] in combination with a compact Si/SiGe BiCMOS
based core chip [4], allows the design and realization of a
compact dual polarisation T/R module even within the
geometry demands of a half-wavelength grid at X-Band
frequencies. Fig.3 shows the schematic overview of the
dual polarisation module.

Fig. 2. 2-chip arrangement (RF module)

Downloaded from http://meridian.allenpress.com/imaps-conferences/article-pdf/2017/NOR/1/2260820/2017-nor-oppermann.pdf by guest on 03 January 2023

Following the world-wide challenges in technology trends
of SWAP-C (i.e. lower size, weight, power and cost), this
arrangement minimizes the number of MMICs to one
GaN-Frontend-MMIC (green frame) and one SiGe-MMIC Fig. 3. Schematic overview of a dual polarisation
(red frame). module
Within the GaN-part, all TRM frontend functionalities
(HPA, LNA, Switch) are integrated into one single MMIC.
Within the SiGe-part, the RF control components (i.e. This type of module can be realized with the mentioned
phaseshifter and variable attenuators, T/R switch) and all MFC MMICs assembled on a multilayer LTCC enabling
digital functions such as e.g. a two wire control interface highest density of RF, control and supply routing.
are integrated into another single SiGe/BiCMOS MMIC. Due to GaN's superior physical properties and the large
Focusing on the lower size demand, one approach (as thermal conductivity of the SiC-substrate, power densities
shown above) is to integrate more electrical functions into five times higher than in GaAs technologies can be
one MMIC, such that the amount of components will be achieved by GaN-devices. However, this increased
reduced. These compact MFC MMICs can then be power density and dissipation demands for optimized
mounted on substrates resp. packages with high routing chip assembly techniques.
densities, as e.g. the case in LTCC-based approaches, Hensoldt therefore developed the following two-step
which in turn allows to design very compact T/R modules. approach for assembling MFC GaN MMICs:
Further, these MFC MMICs can be put into packages and
assembled by surface mount techniques (SMTs) on low (1) The MFC MMICs are mounted on a coefficient of
cost PCBs in high volume assembly lines. These thermal expansion (CTE) matched CuW heatsink with an
approaches can be done both in the so called brick-style optimized, pressure-less, automatic silver based sintering
architecture (module orientation perpendicular to the process. Based on detailed X-ray inspections, a high
antenna plane), an SMD based slat array or plank quality of the MMIC/heatsink-interface was confirmed.
configuration or a modern AESA tile array approach with
(2) This so-called drop-in is soldered with AuSn into a
the module orientation parallel to the antenna surface [2].
cavity of the LTCC, which in turn is mounted directly on a
metal baseplate that spreads the dissipated heat of the
drop-in. As a final step, all required RF- and DC-
II. MFC MMIC BASED RF MODULES interconnects of the MMIC are realized using wire bonds.
This chapter describes various approaches for next
generation RF modules based on multifunctional MMICs.
B. TRM multipack baseline for wideband applications
A. Compact dual polarization X-Band T/R module
Wideband T/R modules for multifunctional AESA systems
This type of module will allow a simultaneous operation in shall operate in different modes and dedicated frequency
Tx and Rx with 2 polarisation modes, e.g. H- (horizontal) bands, e.g. radar in C- and X-band, data-link in Ku-band
and V- (vertical) polarisation. An excellent linear and and jamming resp. sensing (EW) in a frequency range
circular performance can be achieved by nearly identical covering almost DC to 20GHz. So, a main challenge is
RF performances of both TRM channels. Furthermore, the very high bandwidth of more than 10 GHz to be
single, dual and even quad-polarisation operational covered, whereas the highest frequency determines the
modes are enabled by such an arrangement. AESA maximum allowed grid spacing. This immediately
shows that the geometry of a classic circulator working at
the lowest frequency within the required band cannot be
harmonized with the wideband grid requirement. Hence,
the replacement of circulators by compact GaN based RF
switches becomes inevitable.
A wideband multipack partitioning design approach is
shown in Fig. 4.

MEMS GaN‐FE SiGe‐

SPDT (2‐4 chips) CC

MEMS GaN‐FE SiGe‐ Central

SPDT (2‐4 chips) CC
DC & Ctrl
l ≈ 10mm
~10
mm

Fig. 5. Corresponding half-wavelength vs. frequency;

MEMS GaN‐FE SiGe‐ for 4 geometry needs for 2D AESA

Downloaded from http://meridian.allenpress.com/imaps-conferences/article-pdf/2017/NOR/1/2260820/2017-nor-oppermann.pdf by guest on 03 January 2023

SPDT (2‐4 chips) CC
Channels For S- and C-Band applications, the resulting grid
MEMS GaN‐FE SiGe‐ geometry may allow design and manufacturing
SPDT (2‐4 chips) CC processes of tile arrays with packaged single function
components on PCBs using one mounting layer. An
accordant approach in X-band or above requires the use
Fig. 4. Wideband multipack partitioning design approach of several (stacked) mounting layers, bare dies, highly
The main challenge to realise the wideband T/R channels integrated MFCs or even a combination of it.
suitable to the antenna grid (here about 10 mm) is In 2005, R. Rieger et al. presented an X-band T/R
overcome by a quadpack approach. With a standard module to be used in a tile array configuration [5]. This
arrangement of single modules with separate frames, the cubic module was built of three specific multilayer HTCC-
remaining space for placing chips and wire bonds would substrates including cavities and offering four mounting
be sufficient. Therefore, an arrangement of four channels layers. All single function GaAs MMICs (HPA, driver-
into one common module has been identified as a amplifier, LNA, RF control) and the circulator were pre-
sensible trade-off between size constraint and the assembled and tested on single-layer level. All multilayer
inherent multipack drawbacks with regard to flexibility in substrates were soldered onto each other, resulting in a
antenna size (four is the smallest unit) and production single-channel TRM. On top of the final multilayer, a
yield (if one channel fails four are rejected). Omitting patch antenna could be realised. Like illustrated in Fig. 6,
frames was not an option for the RF part as channel these cubic modules can be arranged on a flat signal
crosstalk and coupling have to be kept as low as distribution baseplate or even on a shaped board
possible. As for the DC and control part, the channel structure to build a conformal array.
separation is not an issue as combining digital functions
for multiple channels into common control devices
minimizes the required the area of these functions.
III. TILE ARRAY ARCHITECTURE
Low weight 2D antenna arrays with shallow installation
depths are of steady growing interest e.g. for systems to
be installed on unmanned aerial vehicles UAVs. Such
requirement can be met with tile modules, where the
module resp. the mounting layer(s) are orientated in
parallel to the antenna surface. In such approach, all
components of a TR channel have to be arranged and
interconnected within an area of the squared antenna Fig.6. Cubic T/R modules with HTCC package for tile
grid. arrays

The corresponding half-wavelength (i.e. the antenna grid

for a full array) geometry vs. frequency is shown in Fig. 5. In [6], Leonardo UK demonstrated for an airborne X-Band
application a similar module approach with an LTCC
package containing bare dies on (at least) two mounting
layers. On the backside of the hermetically sealed LTCC
package, there is a ball grid arrays (BGA)-interface via
which these TRMs can be mounted onto a multilayer
PCB which contains the manifolds (DC, RF and control),
provides the cooling channels and on the opposite side
exhibits the patch antennas.
A 2-chip TRM approach with our previously shown MFC IV. CONCLUSIONS
MMICs will allow similar compact tile arrays. With the Based on highly integrated, multifunctional MMICs, a new
scheme shown in Fig.7, the bare die MMICs can be generation of compact transmit-receive modules was
assembled in one mounting layer of the multilayer presented in this paper. All TRM frontend functionalities
substrate (LTCC or HTCC). (HPA, LNA, Switch) are realized in one GaN/SiC MFC
MMIC, the RF control components and digital functions
are integrated in another Si/SiGe BiCMOS MFC MMIC.
MFC based RF modules are key building blocks for
future multifunction AESA systems and will allow to
increase additional system functionality due to a high
level of miniaturisation. The design approach for a dual
polarization X-Band T/R module and a wideband TRM
Fig.7. Flat tile array with MFC MMICs multipack was described. These high-end modules are
based on chip&wire technology and for typical

Downloaded from http://meridian.allenpress.com/imaps-conferences/article-pdf/2017/NOR/1/2260820/2017-nor-oppermann.pdf by guest on 03 January 2023

The arrangement onto a distribution manifold, e.g. a PCB airborne/space applications the housing and package will
with an integrated cooling layer (thick cupper) and be hermetically sealed.
integrated connectors for RF and DC can be assembled
with single TRM devices or with multipack TRMs into a QFN packaged MFC MMICs will enable an arrangement
higher level “tile” forming an x by y-array (e.g. 2x2, 4x4, and interconnection within the frequency dependent grid
8x4, …) with the advantage that these arrays will be area of tile array architectures, up to higher frequency
scalable. Hence, application- and geometry-specific tile bands, such as X- and Ku-Band. In combination with
AESA arrays can be realised. standard RF substrate materials, this approach provides
a cost-effective solution for RF sub-systems.
Plastic QFN packaged devices for commercial, high
volume SMD assemblies form a key factor for lower cost
products, mainly in fields of RF applications. MACOM
demonstrated an impressive example with its ACKNOWLEDGMENT
multifunction phased array radar (MPAR) working in S- This work was partly funded by the German Bundeswehr
Band [7]. In this approach, 64 T/R-modules with a land Technical Center for Information Technology and
grid array (LGA)-interface are integrated together with Electronics (WTD81), Greding and the German Federal
PCBs and housed into an 8x8 antenna panel which forms Ministry of Defence (BAAINBw). This financial support is
a line-replaceable unit of a bigger antenna. gratefully acknowledged. The authors would like to thank
all involved colleagues from HENSOLDT Sensors in Ulm.
With regard to higher frequencies, today various vendors
are visible on the market, e.g. ANOKIWAVE and RFcore,
who are offering specific SMD-components for AESA
applications in X- and even in Ku-Band. Besides GaAs- REFERENCES
or GaN-based front-end MMICs, 4-channel SiGe core
chips are available in QFN-packages, here. [1] R. Rieger, P. Schuh, and M. Oppermann, “SMTR® Module –
evolution towards airborne applications,” Radar 2014, Lille
Furthermore, upcoming activities inside Hensoldt will (France).
cover GaN- and SiGe- MFC packaging activities. [2] J. S. Herd, and M. D. Conway, “The evolution to modern phased
array architectures,” Proceedings of the IEEE, vol. 104, no. 3, pp.
The integration of accordant SMD devices (RF MFC plus 519-529, March 2016.
standard circuitry as resistors, capacitances etc.) will be [3] P. Schuh, H. Sledzik, and R. Reber, “High performance GaN
done onto a so called integrated T/R active zone (3-D single-chip frontend for compact X-band AESA systems,”
stack) as part of the multilayer PCB tile (see Fig. 8.). European Microwave Integrated Circuit Conference 2017, in
press.
[4] P. Lohmiller, R. Reber, Patrick Schuh, M. Oppermann, and S.
Chartier, “SiGe BiCMOS X-band transceiver-chip for phased-
array systems,” European Microwave Conference 2017, in press.
[5] R. Rieger, and H.-P. Feldle, “T/R modules for spaceborne SAR
applications, evolution and trends,” Proceedings of the European
Microwave Association, vol. 1, no. 3, pp. 227-234, Sep. 2005.
[6] R. Lyon, A. Kinghorn, G. Morrison, A. Stonehouse, G. Byrne, and
M. Dugan, “Active electronically scanned tiled array antenna,” in
IEEE International Symposium on Phased Array Systems and
Technology, Oct. 2013, pp. 160–164.
[7] D. Carlson, C. Weigand, D. Curcio, and T. Boles, “Commercial
manufacturing practices applied to phased array radars,” in IEEE
International Microwave Symposium Digest, May 2010, pp. 676–
Fig.8. Tile array concept with packaged MFC MMICs 679.