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Final Exam Surface Eng_WS22_23

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19 views

Final Exam Surface Eng_WS22_23

To improve study

Uploaded by

Parth Gondaliya
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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Final Exam „Surface Engineering of Semiconductor Materials“ Master Electrical

and Microsystems Engineering (M. Eng.), Date: 10.02.2023, Time: 08:30 – 10:00
1st Examiner: Prof. Dr. C. Kaulen 2nd Examiner: Prof. Dr. M. Kammler
Name and Given Name: _______________________________________________________
Matriculation Number: ____________________ Signature: ___________________________
Page Achieved Points Maximum Points
1 5
2 10
3 6
4 8
5 9
6 7
Bonus points 5
Total Points 50
Grade

More than
Points 47.5 45.0 42.5 40 37.5 35.0 32.5 30.0 27.5 25.0
Grade 1 1,3 1,7 2 2,3 2,7 3 3,3 3,7 4

1. Silane-molecules are frequently used for the modification of silica surfaces.


a. Describe the four steps in which a silane monolayer is formed. [4]

b. Which headgroup of the silane would you choose to engineer a hydrophilic


silica surface? [1]

Page 1 achieved points [ ]


c. Make a statement on the stability of silane monolayers and give a reason for
your answer. [2]

2. Which surface structure is fabricated on the surface by photolithography. Mark the


correct image, no explanation needed.

a. With utilization of a positive resist and subsequent development, etching and


removal of remaining resist? [2]

b. Using a positive resist and a subsequent lift-off procedure? (initial


composition without functional layer) [2]

3. Which chemical reactions occurs in a positive resist during UV-irradiation? (just a


general answer required, no reaction equation needed) [2]

4. Give one disadvantage of conventional photolithography [2]

Page 2 achieved points [ ]


5. The following 6 questions are all single choice questions, please mark the correct
answer, each correct answer gives 1 point.
a. Which of the following statements is not true for Thiol-SAMs? [1]
o The number of the carbon atoms in the tail is relevant for the orientation
of the head group.
o During self-assembly a head-to-tail orientation can form.
o The crystallinity of the gold surface has no influence on the quality of the
monolayer
o Thiol SAMs can be investigated by scanning tunneling microscopy (STM)

b. The Langmuir-Blodget-Method is not used to [1]


o form monomolecular layers
o form artificial membrane bilayers
o attach molecules covalently to the substrate surface
o modify a large variety of planar substrates

c. Which of the following statement is true for deposition of metal layers by


sputtering? [1]
o Sputtering is performed under ambient pressure
o Sputtering is only suitable for deposition of gold layers
o The metal to be deposited is evaporated by contact heating
o The thickness of the deposited layer relates to the deposition time

d. Which statement about Microcontact Printing is not true? Microcontact


Printing is [1]
o a method with resolution smaller than 100 nm
o a parallel method
o suitable for patterning of curved substrates
o a method where a cleanroom is needed for structuring of the substrates

e. Which of the following methods to structure a surface is serial? [1]


o E-beam lithography
o Nanoimprint lithography
o Nanosphere lithography

f. Which of the following statements is true: Infrared reflection absorption


spectroscopy … [1]
o Can be applied generally on solid surfaces
o Is not applicable to investigate the crystallinity of a thiol monolayer
o Is not a very sensitive method
o Can give you information on the orientation of the molecules of the SAM

Page 3 achieved points [ ]


6. X-Ray Photoelectron Spectroscopy is a surface sensitive analysis method. Give a
definition of a photoelectron and describe in your own words which information we
can acquire from X-Ray Photoelectron Spectroscopy. [4]

7. Explain in your own words how you would proceed to generate the following
structure on a silicon chip to fabricate a microfluidic channel (diameter = 5 µm, depth
= 1,5 µm): [4]

Page 4 achieved points [ ]


8. Name the defects illustrated in the following scheme: [5]

a.
b.
c.
d.
e.
f.
g.
h.
i.

9. Describe how a standard clean 1 (SC1) is performed. Which reagents are applied?
Which kind of contaminants can be removed by a SC1? [4]

Page 5 achieved points [ ]


10. A mixture of nitric acid and hydrofluoric acid is applied in many routine processes in
microsystems engineering. [4]
a. Describe which reactions are performed with this mixture and give the
respective chemical equations.

b. For which application is the treatment with this mixture used?

11. Besides semiconducting materials, metals are frequently used in microsystems


fabrication. [3]
a. Give one example for an application of metals in microsystems engineering.

b. Several dry and wet etching solutions exist to structure a metallic film on the
surface of a substrate. Give one example each for dry and wet etching of a
chosen metal.

Page 6 achieved points [ ]


12. Bonus question: In plasma enhanced chemical vapor deposition (PECVD) often
inhomogeneous surface coverage is observed (see image) on structured surfaces. [5]

a. Explain why such an inhomogeneous coverage occurs.

b. Which method would you suggest to achieve a more homogeneous surface


coverage.

Page 7 achieved points [ ]

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