CONTENT

Serial Table Of Contents Page

No. no.
1. Introduction
2. Circuit Design & Simulation
2. PCB CAD Design & Simulation

3. Cutting of PCB

4. Soldering of design component

5. Wiring and Fitting

6. Testing of Project
 INTRODUCTION
BUILDING A COMMON EMITTER AMPLIFIER WITH 2N3904
This project delves into the practical realization of a common emitter amplifier
utilizing the readily available 2N3904 NPN transistor. We'll embark on a
comprehensive journey, transitioning from theoretical knowledge of amplifier principles
to the construction and testing of a functional electronic circuit. The project will
encompass the following key stages:
• Design and Simulation :
1. We'll explore designing the amplifier circuit using schematic capture
software.
2. You'll learn to select appropriate component values and perform circuit
simulations to analyze its behavior before building.
3. Simulation tools will help visualize the amplifier's response to input
signals and ensure it meets design specifications.

• PCB Design and Fabrication :

1. For a permanent and professional build, this stage involves designing a
Printed Circuit Board (PCB) using PCB design software.
2. We'll explore layout considerations, component placement, and creating
the necessary artwork for PCB manufacturing. (You can choose to buy
pre-made PCBs if desired).
• Wiring and Assembly :
1. This hands-on phase involves soldering the electronic components onto
the PCB (or perfboard if not using a PCB) following the designed layout.
2. Proper soldering techniques and component identification will be crucial
for a successful build.
• Testing and Verification :
1. Finally, we'll power up the circuit and employ various testing methods to
verify its functionality.
2. This stage involves measuring voltages, currents, and observing the
amplifier's response to input signals using tools like multimeters and
signal generators.

Throughout the project, we'll provide detailed instructions, component lists, and
troubleshooting tips to ensure a successful build. This project serves as a stepping
stone to mastering common emitter amplifier design, construction, and understanding
its practical applications in the world of electronics.
 EXPERIMENT NO. 1
Circuit Design & Simulation

Aim : To design and simulate a “ Common Emitter Amplifier “ using 2N3904 NPN
transistor.

Apparatus: The apparatus required for this experiment are given below :-

1. Proteus software : A powerful simulation tool for electronic circuit design.

2. 2N3904 Transistor : The 2N3904 is an extremely popular NPN transistor that is
used as a simple electronic switch or amplifier that can handle 200 mA
(absolute maximum) and frequencies as high as 100 MHz when used as an
amplifier .
3. Resistor : For defining value of Beta.
4. Polarized capacitor : Capacitor for filtering and stabilization of current wave.
5. AC & DC power supply : Use to power amplifier circuit.
6. Oscilloscope : To display and analyze the waveform of electric signal.

Introduction :-
The common emitter amplifier is one of the fundamental building blocks of analog
electronic circuits, extensively used in various applications ranging from audio amplification
to signal processing. It operates by amplifying the voltage difference between the input signal
applied to the base terminal and the ground potential, producing an output signal across the
collector terminal. It harnesses the power of a bipolar junction transistor (BJT) to amplify
a weak input voltage signal into a robust output voltage signal.
This report delves into the design, construction, testing, and applications of a CE
amplifier circuit, highlighting its advantages over other amplifier configurations.

Theory :-
The BJT common emitter amplifier is a general-purpose BJT-based amplifier that it
typically used for voltage amplification. It offers great voltage gain and normal
current gain. The input impedance is moderate but unfortunately it has high output
impedance. The output is inverted with respect to the input. It is commonly followed
with a buffer circuit such as a common-collector amplifier to reduce the output
impedance.

1. Voltage Gain High

2. Current Gain High
3. Power Gain Medium
4. Input Impedance Medium
5. Input Impedance Medium
6. Output Impedance High
7. Phase Shift 180o
Table 1.1
The CE amplifier leverages the current gain (β) of a BJT to achieve voltage
amplification. By biasing the transistor in its active region, a small change in the base
voltage triggers a significant change in the collector current. This magnified current
variation flows through the collector resistor, generating a proportionally larger voltage
change at the output.
The design process revolves around selecting appropriate biasing resistors to
establish a stable operating point (Q-point) for the transistor. Additionally, the values
of the emitter resistor (Re) and collector resistor (Rc) determine the amplifier's gain,
input and output impedance, and frequency response.

Amplifier Circuit :

Figure 1.1

The figure 1.1 shows the basic diagram of a common emitter amplifier circuit .

• R1 and R2 are used to provide a DC bias point for the base of the transistor,
using the standard resistor divider technique.

• C1 is used to AC couple the input signal to the DC bias point – it’s value is
chosen so that it appears as a short for the AC signal frequencies of interest
but blocks DC.
• RE adds emitter degeneration and makes the amplifier gain more stable with
variations in β. CE is the emitter bypass capacitor and is used to bypass RE so
that the AC signal essentially sees the emitter connected directly to ground.
 • Rc is the collector resistor which helps set the voltage gain of the amplifier.
Sometimes this is called the load resistor, however this can be confusing, as
typically the “load” is placed after the output AC coupling capacitor.
• Rl is the load resistance. You may see this and Cout omitted from some diagrams
of the common emitter amplifier.
• Cout is the AC coupling capacitor on the output, which blocks the DC
component, similarly to Cin.

Circuit Design In Proteus :-

Procedure :-

1. Launch Proteus software and create a new project.

2. Select components from the Proteus library, including the 2N3904 transistor,
capacitors, resistors, bridge rectifier, and potentiometer.
The required components are as follows :-

Component Value Pieces

1. 2N3904 Transistor ________ 1
2. Generic Resistor 10k , 4.7k , 1k , 330 2 , 1 , 1 , 1 , 1
100 ( in ohm )
3. Polarized capacitor 1uF , 47uF 2,1
4. DC voltage source 12v 1
5. AC voltage source 300mV at 1kHz 1
6. Oscilloscope 1

Table - 1.2

3. Place components on the schematic canvas according to the circuit diagram, ensuring
proper connections.
4. Now connect the components using wire carefully , ground the negative terminal .
5. Check for possible errors and run the simulation , note down the reading shown by
oscilloscope about load terminal.
6. Connect ammeter across input , output and terminals of bjt.
7. Also connect voltmeter to measure output voltage across load.
8. Note down all the values ( Figure 1.4 ) .
The figure – 1.2 shows the circuit diagram of Common Emitter Amplifier Designed In proteus
software .
The figure – 1.3 shows the output wave of amplifier about load terminal proteus software .

• Channel A shows ‘input waveform’ .

• Channel B shows ‘output waveform’ .
Figure – 1.2

Figure – 1.3
Result :-
The simulation in Proteus successfully demonstrates the functionality of the Common Emitter
Amplifier circuit. Simulation results validate the design and provide confidence in its
performance before physical fabrication.

Figure – 1.4

Observation:-

• Collector current – 5.52mA

• Base Current – 3.30 mA
• Emitter Current – 8.61mA
• Output Voltage- 3.81 V
 EXPERIMENT NO. 2
PCB CAD DESIGN AND SIMULATION IN PROTEUS

Aim :- To design and simulate the PCB of Common Emitter Amplifier circuit in
Proteus.

Apparatus Required :-

• Computer system with Proteus software install in it.

Procedure :-

Proteus offers a powerful suite for designing and simulating electronic circuits,
including the creation of Printed Circuit Boards (PCBs).

1. Schematic Capture:

• Launch Proteus and choose "ISIS" (schematic capture) environment.

• Select the required components from the library by browsing categories or
searching by name. Ensure the 2N3904 transistor and other components have
a PCB footprint (indicated by a PCB preview).
• Place the components on the workspace and connect them using the "Wire"
tool. Follow your circuit design to establish proper connections between
components.
• Double-click on placed components to adjust their values, orientation, or
reference designators.
• Utilize the "Power" symbol for voltage and ground connections.

2. Design Rule Check :

• Before proceeding, it's recommended to perform a Design Rule Check (DRC)

to identify potential errors in component placement and connection rules.

3. PCB Layout :

• Navigate to the PCB design environment (usually named "ARES").

• Use the "Netlist" tool to transfer component information and connections from
the schematic to the PCB layout.
• Define the PCB outline using the "2D Graphics" tool with the "Board Edge" layer
selected.
• Place the components within the board outline, ensuring proper spacing and
orientation for efficient routing.
• Use the "Auto router" tool (optional) for automatic trace routing, although
manual routing often provides more control and optimization.
• Utilize the "Routing" tools to manually connect components with copper traces
on designated layers (typically "Top Copper" and "Bottom Copper").
• Pay attention to trace width and clearance rules to avoid electrical shorts and
ensure proper signal integrity.
4. Simulation:

• After completing the PCB layout, use the "Back annotate" option to update the
schematic with any changes made during PCB design.
• With an updated schematic, you can perform simulations in ISIS to analyze the
circuit's behaviour with real or simulated components.

5. Design for Manufacturability Check :

• Proteus might offer DFM checks to identify potential manufacturing issues with
your PCB layout, such as excessively thin traces or drill hole size limitations.

6. Gerbers and Bill of Materials (BOM):

• Once satisfied with your design, generate Gerber files for PCB manufacturing.
These files represent the different layers of your PCB for fabrication.
• Additionally, generate a Bill of Materials (BOM) listing all the components
needed to assemble the circuit.

Result :

We have successfully designed the PCB of our Amplifier circuit .

• The Figure 2.1 shows the schematic of our Amplifier circuit .

• The Figure 2.2 shows the 3-D visualization of our Amplifier circuit

Figure – 2.1 Figure – 2.2

 Experiment No. 3

Cutting And Etching Of PCB

Aim :- To fabricate the PCB of Amplifier circuit using Ferric Chloride ( FeCl3 ).

Creating a PCB (Printed Circuit Board) involves transferring your circuit design onto a
copper-clad board and etching away unwanted copper to form the desired traces.

Safety Precautions:

• Ferric chloride is corrosive and can irritate skin and eyes. Wear gloves, eye
protection, and work in a well-ventilated area.
• Ferric chloride solution should be disposed of properly according to local
regulations. Never pour it down the drain.

Materials:

• PCB blank (copper-clad laminate) with appropriate dimensions for your circuit
• Safety gear: Gloves, eye protection, respirator (recommended)
• Cutting tool: Rotary tool with cutting disc or hacksaw
• Sandpaper: Various grits (around 120 to 600 grit)
• Tape: Heat-resistant Kapton tape or similar high-temperature tape
• Printer (laserjet recommended) for toner transfer method OR
• Inkjet printer for transparencies and UV exposure method (alternative)
• Laser jet toner transfer paper OR Transparency film (for UV exposure)
• Ferric chloride solution (etchant) in a suitable container
• Tray or container large enough to hold the PCB submerged in solution
• Optional: Hot water bath (to accelerate etching)
• Acetone or rubbing alcohol
• Multimeter (for continuity check after etching Procedure )

Procedure:

1. Cutting the PCB Board:

• Use a rotary tool with a cutting disc or a hacksaw to cut the blank PCB
to your desired size.
• Sand the edges smooth with sandpaper (around 120 grit).
2. Transferring the Circuit Design :
• Laser Toner Transfer Method:
o Print your circuit layout mirrored onto a sheet of laserjet toner
transfer paper.
o Iron the toner onto the cleaned copper surface following the
transfer paper's instructions. This creates a resist mask on the
copper.
 • UV Exposure Method :
o Print your circuit layout onto a transparency film using an inkjet
printer. Ensure high-quality ink for better definition.
o Apply a layer of photoresist onto the cleaned copper surface
according to the photoresist's instructions (usually involves
spinning it onto the board).
o Carefully place the transparency film with the circuit layout on top
of the photoresist-coated copper, ensuring good contact.
o Expose the photoresist to UV light (sunlight with UV blocking filter
or UV lamp) for the recommended duration based on the
photoresist's specifications.
o Develop the photoresist according to the manufacturer's
instructions. This removes photoresist in areas not exposed to
UV light, creating the resist mask
3. Drilling of PCB :
• With the help of a Drill Press create holes for components on PCB before
etching.
4. Etching the PCB:
• Wear gloves and eye protection throughout this step.
• Apply heat-resistant tape to the edges of the PCB to protect them from
the etchant.
• Prepare the ferric chloride solution according to the manufacturer's
instructions (usually involves mixing with water).
• Etching time can be reduced by using a pre-heated ferric chloride
solution (around 50°C) in a hot water bath. However, ensure the
container and solution can withstand the temperature.
• Place the PCB in the ferric chloride solution, ensuring the copper side is
fully submerged.
• Gently agitate the solution periodically to facilitate even etching.
5. Monitoring Etching Progress:
• The etching time depends on the thickness of the copper and the
strength of the ferric chloride solution. It can take anywhere from 10
minutes to several hours.
• Regularly inspect the PCB. The copper areas not covered by the resist
mask will be etched away, revealing the desired circuit traces.
• Once the etching is complete, remove the PCB from the solution and
rinse thoroughly with clean water.
6. Cleaning and Inspection:
• Remove the resist mask using acetone or rubbing alcohol. Be gentle to
avoid damaging the traces.
• Clean the PCB surface with isopropyl alcohol to remove any residue.
• Visually inspect the etched traces for continuity and any imperfections.
Use a multimeter for continuity checks between designated points on the
circuit.

Result :- We have successfully created a PCB board for our project.

 EXPERIMENT NO. 4
Assembling And Soldering Of Components On PCB
Aim :- To assemble and solder the component on PCB board.
Having successfully etched your PCB, the next step is to populate it with electronic
components and establish electrical connections through soldering.

Apparatus :-
• Soldering iron with appropriate tip size and temperature for the
components you'll be using (typically lead-free solder)
• Solder (lead-free recommended)
• Rosin core solder is preferred for ease of use
• Fume extractor (recommended)
• Helping hands or PCB holder (optional, but helpful)
• Diagonal cutters or wire snips
• Component lead bender (optional, but recommended)
• Isopropyl alcohol or cleaning wipes
• Safety glasses
• Multimeter for continuity checks after soldering

Procedure :-
1. Preparation :-
• Wash your hands thoroughly to remove any dirt or oils that could affect
solder joints.
• Ensure your workspace is well-ventilated, and preferably use a fume
extractor to remove soldering fumes.
• Inspect your PCB for any etching imperfections or shorts between
traces. You can use a multimeter for continuity checks.
• Organize your components based on their size and placement on the
PCB. Refer to your bill of materials (BOM) and component placement
guide.
2. Bending Component Leads :-
• For through-hole components, you may need to bend their leads slightly
using a component lead bender or pliers to ensure proper placement
through the PCB holes.
• Bend the leads to form an "L" shape with a short leg on the component
side and a longer leg for soldering on the bottom side of the PCB.
3. Soldering Through-Hole Components :- ( Used in this Project )
• Heat your soldering iron to the recommended temperature for the solder
you're using (usually between 300°C and 350°C).
• Apply a small amount of solder to the tip of the iron (tinning the tip).
• Place the component lead through the designated hole on the PCB. The
shorter leg of the "L" bend should rest against the pad on the top side of
the PCB.
 • Position the component body according to your layout and hold it firmly
with helping hands or tweezers (if necessary).
• Touch the soldering iron tip briefly to the pad on the top side of the PCB,
simultaneously applying a small amount of solder from the spool to the
joint. The solder should flow smoothly, creating a shiny and continuous
connection between the component lead and the PCB pad.
• Once the solder joint is formed, remove the soldering iron tip and allow
the joint to cool slightly before moving the component.
4. Soldering Surface Mount Components (SMD) :-
• SMD components require a different soldering technique due to their
smaller size and placement on the surface of the PCB.
• Apply a small amount of solder paste to the designated pads on the PCB
where the SMD component will be placed. You can use a stencil or a
fine-tipped needle for precise application.
• Carefully place the SMD component onto the pads with the solder paste.
Use tweezers for handling and positioning.
• Heat your soldering iron to the recommended temperature for lead-free
solder used with SMD components.
• Touch the soldering iron tip briefly to each pad connected to the SMD
component, allowing the solder paste to melt and form a connection
between the component and the pads.
• Ensure good solder flow and avoid excessive heating that could damage
the component.
5. Cleaning and Inspection:-
• After soldering all the components, clean any flux residue from the PCB
surface using isopropyl alcohol and cleaning wipes.
• Visually inspect your soldering joints for proper connections. A good
solder joint should be shiny, smooth, and form a complete connection
between the component lead and the PCB pad.
• You can use a multimeter for continuity checks between components
and designated points on the circuit to verify proper connections.
6. Additional Precaution :-
• Practice soldering on scrap material before working on your actual PCB.
• Use the correct tip size for your soldering iron to ensure proper heat
transfer and efficient soldering.
• Avoid overheating components during soldering, as it can damage them.
• If you make a mistake, you can remove excess solder using a solder
sucker or desoldering braid. Be careful not to lift the component pad
while removing solder.
• Work in a well-lit area for better visibility during soldering.

Result :- We have successfully assembled and soldered all components on PCB

board . Now our circuit is ready to use .