Introduction to MEMS

Prof. Dong-Weon Lee

MEMS & Nanotechnology Laboratory
School of Mechanical Systems Engineering
Chonnam National University
 Definition of MEMS
MicroElectroMechanical System

Micro는 10-6 m
Batch fabrication Ultimate goal (ideal):
not just a device
Energy conversion:
Electrical to and from non-electrical

Why batch fabrication is a critical part of the definition!!!

Someone gave a nickname for the 2nd stage:

MEMS is Miniaturized Everything Making Sense
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 Silicon for MEMS
Silicon: the dominant substrate material for transducers
Properties:
• Extensive studies and documentation
• Suitable for electronic, mechanical, thermal, and optical integration
• Can sustain harsh (mechanical) handling conditions
• Crystalline: mechanical properties are uniform across wafer lots
• Elementary semiconductor
• Plentiful element (occupy 24% on earth)

Structure:
• Crystalline,
• Polycrystalline-polysilicon
• amorphous

Conductivity:
• Semiconductor

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 Metals: Making Wires and Pads
Aluminum
• Basic electrical interconnections (common and easy to deposit)
• Non-corrosive environment only
• T < 300 °C (melting temperature = ? )
• Good light reflector (visible light)

Gold/ titanium/tungsten
• Better for higher temperature
• Harsher environments
• Gold is good light reflector in the IR

Platinum and palladium

• Stable for electrochemistry

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 Polymers
Properties
• Spin coated with varying thickness; few nm – hundreds of microns
• Used in sensing of chemical gases and humidity
• Used as Photoresists,
• SU8: Epoxy based photoresist can form layers up to 100 μm
• Polyimide

Fabrication
• Spin-on,molding

Cost
• Low: PDMS
• Depends on materials

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 Basic processes

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Brief history in MEMS

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Engineering project(Ex.)

LEGO construction using Si pieces

Mechanical Engineering project in 2004

Engineering project(Ex.)

Mechanical Engineering project in 2004

Engineering project(Ex.)
Advantages and disadvantages

Pyrex glass

Si wafer Au/Cr electrode

Mechanical Engineering project in 2006

Engineering project(Ex.)

silicon

+ Al

Pyrex glass

II
silicon
R

Pyrex glass

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Engineering project(Ex.)
Advantages and disadvantages

Mechanical Engineering project in 2006

Engineering project(Ex.)

(a) (b)

Mechanical Engineering project in 2006

Engineering project(Ex.)

Mechanical Engineering project in 2006

Micromachined pressure sensor

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Wheatstone bridge
저항을 보다 정밀하게 측정하기 위해서 사용 알고 있는 저항을
이용하여 모르는 저항을 정밀하게 측정하는 장치 1 k
1 k
Known quantities: 12 V
Source voltage, resistance value, bridge voltage
12 mV
Find:
Unknown resistance value Rx 1 k

This result is very useful and quite general

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Wheatstone bridge: Ex.

SPECIFY THE ASSUMED POLARITY OF THE

VOLTAGE BETWEEN NODES A AND B

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Gauge factor
L

압축(Compression): 길이감소와 단면적 증가  저항감소

인장(Tension): 길이증가와 단면적 감소  저항증가

저항변화와 길이변화 사이의 관계

Gauge factor (GF)

Since the strain is defined as

R0: zero strain resistance

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Gauge factor
Ex) foil strain gauge (GF: metal foil is usually about 2)

maximum strain: 0.4 ~ 0.5 %

for a 120 gauge  0.96 ~ 1.2 , it can be measured by electrical circuits

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Force measurement

Al cantilevered beam loaded by the force

 Tensile stress on the top of the beam

 Compressive stress on the bottom

This causes a voltage of 50 mV at node R4

B with respect to node A.

Determine the applied force to the free R3

end of the cantilever

R0=1k, VS=12V, L=0.3m, w=25mm, h=100mm, Y=69GPa(N/m2)

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Force measurement
R0=1k, VS=12V, L=0.3m, w=25mm, h=100mm, Y=69GPa(N/m2)
tension: R1 and R4, compression: R2 and R3

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Micromachining(Ex.)

Micromachined gears (Sandia Lab.) Optical mirror (Bell Lab.)

Writing on a human hair Nano-guitar

Nanomachining(Ex.)

Atomic Resolution on
Si(111) 7x7;
I(t) = 2.0 nA,
5.4 nm x 5.4 nm

5.4 nm
1 mm MEMS

100 m

머리카락 직경
The challenge to the God’s world

How to make a functional device at micro or nanoscale

Nature and engineering

Biological world MEMS Mechanics

Function 高(H) 中(M) 低(L)

# of
多 (complicate) 中 (intermediate) 少 (simple)
elements
Element size 極小(molecular) (nm) 小 (mm) 大 (mm)

Material Protein S/C (silicon) Metal etc.

Batch process
Fabrication self assembly Assembly
(free assembly)

Shape three dimension two dimension three dimension

Power low low high

Reliability self recovery - -

자연물 인공물, 처리기능뿐,

Etc 인공물
부드럽다 설계 검사가 과제

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 Advantages of the MEMS
IC technology Integrated Multiple Functions

Precision Improved Performance

Batch fabrication Reduced Manufacturing Cost & Time

Miniaturization Portability

Ruggedness

Low Power Consumption

Easily Maintained & Replaced

Easily & Massively Deployed

Little Harm to Environment

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MEMS: Design
Device design:
Cadence, L-Edit, P-Spice, Matlab Cadence
MyCAD, SX-9000
Process design:
TCAD suprem (fab cross section)
Intellisense AnisE (Bulk silicon etch)
Analysis:
FEM systems (ANSYS), MEMCAD

ANSYS

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MEMS: Simulation
Switch

Accelerometer

Mirror

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MEMS: Fabrication

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Characterization

Measurement techniques are also very important.

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Useful reference
 NadimMaluf, “An Introduction to Microelectromechanical Systems
Engineering,” ArtechHouse, Boston, 2000.
 Stephen D. Senturia, “Microsystems Design,” Kluwer Academic
Publishers, New York, November 2000
 S. M. Sze, “VLSI Technology,” McGraw-Hill International Editions,
Singapore, 1988.
 M. Elwenspoekand H. Jansen, “Silicon Micromachining,” Cambridge
University Press, Cambridge, UK, 1998.
 Norio Taniguchi, editor “Nanotechnology,” Oxford University Press,
Oxford, UK, 2003.
 Joseph McGeough, editor “Micromachining of Engineering Materials,”
Marcel Dekker, Inc., New York, 2002.
 Marc Madou, “Fundamentals of Microfabrication: The science of
miniaturization,” CRC Press, LLC, 2002.

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