INDIAN TELEPHONE INDUSTRIES

LIMITED,BANGALORE

A WINTER INTERN REPORT

Submitted by
SIVAKUMAR N
(913122106101)

VIJAY NK
(913122106127)

GOVARTHANAN R
(913122106030)

YUVAN SHANKAR RAJA S

(913122106130)

in partial fulfilment for the award of the degree of

BACHELOR OF ENGINEERING
Department of Electronics and Communication Engineering

Of

Velammal College of Engineering and Technology, (Autonomous)

JANUARY 2024
 REPORT OUTLINE

◆ Title Page

◆ Certificate from the Company

◆ Bonafide from Academic Mentor and HoD

◆ Acknowledgements

◆ Abstract

◆ List of Contents

◆ List of Figures

◆ List of Tables

◆ Chapter I - Introduction

◆ Chapter II – About the company

◆ Chapter III – Internship Overview

◆ Chapter IV – Conclusions & Outcome

◆ References
 TITLE PAGE

INTERNSHIP AT

DATE:(01.01.2024-15.01.2024)

HEAD OFFICE:
ITI LIMITED,
ITI BHAVAN
DOORAVANI NAGAR,
BANGALORE,
KARNATAKA-560016
 ACKNOWLEDGEMENT

We are sincerely grateful for the enriching opportunity .We had to undertake our
internship at ITI Limited, a distinguished organization in the field of telecommunications.
Throughout this internship, We had the privilege of immersing myself in various aspects
of telecommunication technologies, including 4G, research and development, EMC lab
operations, data centre management, PCB design, and SMT processes.

We would like to express our heartfelt gratitude to the entire team at ITI Limited for their
unwavering guidance, support, and mentorship during this journey. The experience of
working on real-world projects and collaborating with professionals who are experts in
their respective domains has been invaluable. It has not only deepened our theoretical
understanding but also provided us with practical insights that will undoubtedly shape our
future Career.

The exposure to cutting-edge technologies and the opportunity to contribute to meaningful

projects have significantly contributed to our personal and professional growth. We are
truly appreciative of the trust and confidence that ITI Limited placed in us, allowing us to
explore and learn under their esteemed guidance.

We would also like to extend our gratitude to Mr. R S Yadav, Mr Girish M E, Parimal
Badra who made this internship period not just educational, but also enjoyable. Their
camaraderie and willingness to share knowledge created a conducive learning
environment that we will cherish.
 ABSTRACT

This internship report provides a comprehensive overview of the experiences and

insights gained during a tenure at Indian Telephone Industries Limited (ITI Limited)
in Bangalore. The report focuses on two primary aspects – the operational efficiency
of ITI Limited and the integration of technological advancements within the
organization.

The operational efficiency analysis delves into the various departments and functions
of ITI Limited, aiming to identify key strengths and areas for improvement. The
report examines the company's workflow, communication channels, and resource
allocation strategies, offering recommendations for optimizing operational
processes.

Furthermore, the report explores the technological landscape within ITI Limited,
investigating the incorporation of cutting-edge technologies in the
telecommunication sector. Emphasis is placed on emerging trends, such as 5G
technology, Internet of Things (IoT), and artificial intelligence, and their impact on
ITI Limited's products and services.

The methodology employed during the internship, including data collection

methods, interviews with key personnel, and hands-on experiences, is detailed to
provide transparency and context for the findings. Key findings are presented with a
critical analysis, offering insights into the company's current standing and potential
areas for growth.

The internship experience at ITI Limited has not only provided practical exposure to
the telecommunications industry but has also fostered a deeper understanding of the
company's vision, mission, and values. The report concludes with a reflection on the
overall internship experience, highlighting personal and professional growth, as well
as the transferable skills gained during the tenure.

This report serves as a valuable resource for both academic and professional
audiences, offering a nuanced perspective on the operational and technological
aspects of Indian Telephone Industries Limited, Bangalore, and providing
recommendations for its continuous improvement and innovation in the dynamic
telecommunication landscape.
CHAPTER-I: INTRODUCTION

It should include

(A) Duties & Responsibilities assigned to the intern:

As an intern at Indian Telephone Industries Limited,the following duties and

responsibilities were assigned to the intern :

1. Research: Conduct research on PCB Boards, Surface Mount Technology, 4G

Network, and

2. Development: Work on developing and implementing algorithms for

enhancement,radiation detection, and PCB layering.

3. Data Collection and learning: Collect and organize tele radiation datasets for
testing and evaluation purposes, and ensure data quality.

4. Documentation: Document the research findings, algorithm development, and

testing results in technical reports.

(B)Duration:

The internship duration was 15 days.

(C)Brief detailing about the whole internship:

Main areas of business of ITI:

➢ Manufacture of telecom equipment
➢ Research and development
➢ Joint development of projects
➢ Network management
➢ Software applications
➢ IT products & service
➢ Transfer of technologies

Objective:
The objective of our intern at Indian Telephone Industries Limited was to gain
practical experience and knowledge in the field of PCB Technology specifically
focusing on Surface Mount Technology,4g Network ,CAD Design, and 3D
Printing The intern aimed to contribute actively to ongoing research and
development projects within the Telephone communication Department.
CHAPTER-II:ABOUT THE COMPANY

ITI Limited, formerly known as the Indian Telephone Industry Limited was the first
public sector enterprise in India, established in 1948.What began as a modest venture
has evolved into a vast multiunit organization, with manufacturing facilities situated
in Dooravani Nagar and Electronic City in Bangalore, Karnataka. In 1964, the
company embarked on the production of crossbar automatic exchange equipment,
and in 1971, it expanded its operationsto Naini and Srinagar in Jammu and Kashmir.

In addition to providing turnkey telecommunications solutions and personalized

support, ITI also has a network system unit that specializes in implementing turnkey
telecommunications network installation and operation projects. The company
intends to modernize and invest in technology, through technology acquisitions from
strategic partners, focusing on high-growth industrial segments. The company
operates a data centre in Bengaluru and is currently expanding it to provide cloud-
based services to government organizations/departments, banks, etc.

The company manufactures a diverse range of Information of and Communication

Technology (ICT) products/solutions to enhance its competitive edge in the
converging market by deploying rich telecommunications expertise and broad
infrastructure everywhere. The company is diversifying into IOT, smart cities and
other telecommunications products and services, including undertaking turnkey
projects to provide solutions in diverse sectors. Encryption products are the
company's strong point. Extensive in-house R&D work is dedicated to the design
and development of encryption solutions for the Indian Defense Forces.

Quality is a paramount concern for the company and is treated as a fundamental

corporate management function, overseen by an independent executive director
reporting to the Chairman and Managing Director. A significant portion of ITI
Limited's products, approximately 95%, is supplied the Department of
Telecommunication, now known as BSNL (Bharat Sanchar Nigam Limited).
CHAPTER-III: INTERNSHIP OVERVIEW

➢ We were assigned with the following various task during our internship in Avian
Aerospace

Weekly Activity Report:

Internship in Indian Telephone Industries Limited: -

Date from: 01.01.2024 Date to:15.01.2024

Day & Time Tasks assigned and Observations

Date completed

01.01.2024- 8.00am to Telecom Testing Center Gain the knowledge about

03.01.2024 4pm TTL
04.01.2024- 8.00am to Reserach & Development Lab Gain the knowledge about
06.01.2024 4pm Research power circuits

09.01.2024- 8.00am to Surface Mount Technology Gain the knowledge about

11.01.2024 4pm Components placement in
PCBs

12.01.2024- 8.00am to PCB Layering Gain the knowledge about

13.01.2024 4pm Research PCB Formation

14.01.2024 8.00am to 4G Lab,3D Printing Gain the knowledge about

4pm Networks and Printing
Technology
 PCB (Printed Circuit Board)

In the PCB plant we were taught about the various steps involved in manufacturing the PCB
boards then explained the various types of PCB like multi layered and single layered, then
we were shown the individual steps of the PCB manufacturing process we were shown all
the machines work the end product after each step and the cost associated with each step.
Below is the detailed description on PCB manufacturing. Printed circuit boards (PCBs) are
important parts of electronic devices, helping to communicate and support various electronic
components. The PCB manufacturing process includes several main steps:

1. Design: The cycle begins with the PCB plan, where specialists use PC Helped Plan
(computer aided design) programming to make an advanced outline of the circuit board,
determining the format of parts, follows, and openings.

2. Substrate Determination: Engineers pick the substrate material for the PCB,ordinarily
fiberglass-supported epoxy cover. The substrate gives mechanical help and protection.

3. Layering: For multi-facet PCBs, a few copper-clad sheets are stacked together. Each layer
has a particular circuit example, and they are adjusted to make an interconnected framework.

4. Lamination: The layered board is exposed to high intensity and strain to bond the layers
together. A glue called prepreg is utilized to guarantee areas of strength for a bond.

5. Etching: A layer of copper foil covers the whole board, and afterward undesirable copper
is eliminated utilizing a synthetic carving process. This leaves behind the copper follows that
associate the parts.

6. Drilling: Openings are bored through the PCB to make spaces for parts also,vias
(interconnections between layers).

7. Plating: Copper is electroplated onto the internal layers and opening walls to make
conductive pathways and guarantee electrical network.

8. Bind Veil Application: A patch veil is applied to the board to protect furthermore,
safeguard the copper follows while leaving just the ideal contact focuses uncovered.

9. Silkscreen Printing: A layer of ink with part names, logos, and reference markings is
imprinted on the board's surface to help with part arrangement.

10. Part Arrangement: Electronic parts, like resistors, capacitors, and incorporated circuits,
are mechanically or physically positioned onto the PCB following the plan format.
 3D PRINTING

In the 3D printing lab, we were shown different models they already made using the 3D
printer and their uses in respective field. Then we were shown the two different 3D printers
and how they work and their cost.

GRABCAD:

The product used to create the 3D model is GRABCAD, which is a cloud- based step that
helps understand: implement computer-aided planning (computer aided design), design, and
collaborative systems. Computerized material stacking and pouring for proficient operation
Energy efficiency with profound power Circuit board, easy-to-use client interface and high-
level control capabilities. Plus, industrial motor warranty, expert help. Incorporate
consistently into existing workflows and creative cycles. ULTEMTM is a registered
trademark of SABIC, a leading global supplier of thermoplastics, composites and specialty
materials. SABIC's ULTEM is a premium exhibition thermoplastic, in many cases used in
aerospace and protective applications due to its high durability, heat resistance and fire
resistance. When it comes to 3D printing, ULTEMT is a well-known choice as a 3D printing
material due to its nature and suitability for end-use parts, etc., models in companies in Need.

POLYJET Innovation:

Poly Stream 3D printing technology is a type of 3D printing that usesphotopolymer materials

and intense light (UV) to create parts with exceptional precision and accuracy. Unlike FDM
3D printing, which uses thermoplastic filaments and an extruder to fabricate parts layer by
layer, Poly Stream 3D printing uses a flying head to permanently store photopolymer material
according to the design specified in the brief. turn off printing. The photopolymer material
hardens when exposed to UV light, allowing the tip to grow layer by layer. This cycle allows
Poly Fly 3D printing to produce dishes with high precision,high delicacy, and smooth
surfaces. Poly Fly 3D printing is commonly used for a variety of applications, including item
planning and prototyping. Manufacturing and instruments, dental and. Clinical utility and
more. With the ability to print different materials at any time, Poly Stream 3D printing also
enables the production of multi-materials that leave real-world changes in properties, making
it ideal for the project is complex and confusing. Poly Stream 3D printing innovation is an
exceptionally flexible and precise 3D printing strategy, suitable for a variety of uses across
different businesses.
APPLICATION: -

3D printing, also known as additive manufacturing, has many applications in various

businesses, including:

Medical services: -
3D printing is used to make clinical inserts, prosthetics, and neat instruments. It is also used
to create models of human life systems for educational and research Purposes.

FOOD: -
3D printing is used to create nutritious and transformative foods, such as chocolate and ice
cream.

Develop: -
3D printing is used to produce building components, such as wall and roof tiles,as well as
completely waterproof designs and houses.

Advantages of 3D printing: -
Rapid Prototyping With 3D printing, models can be created quickly and simply,
allowing designers and architects to iterate and refine their plans faster.Sometimes, 3D
printing can be faster than conventional assembly techniques,given the time needed to get
back to the faster creative cycle.3D printing creates virtually nothing, it's all about specifically
measuring the material needed to make a product, as opposed to cutting and shaping
materialfrom a larger part.

COMPLEX SHAPE: -
3D printing can create complex and confusing shapes that are unimaginable with
conventional assembly techniques, taking into account the formation of new and innovative
objects.

ECONOMIES OF SCALE FOR SMALL VOLUMES: -

3D printing can be a wise solution for small manufacturing operations becauseit eliminates
the need for expensive tooling and allows for the production of low-demand items. The 3D
printing division's services are used by ITI Limited's own product development team as well
as other manufacturers and suppliers in the telecommunications industry. The department's
services primarily ensure that 3D printed parts used in telecommunications equipment meet
detail and durability expectations.Besides 3D printing, the department also recruits talented
professionals who can handle post-processing and finishing processes such as sanding,
painting and cleaning. These strategies are used to improve the aesthetic appearance of 3D
printed parts and ensure they meet essential quality and safety guidelines
 TELECOM TESTING LAB

The first department we visited was the telecom testing lab where we were made familiar
with, and the lab equipment and machines and we were clearly explained about all the tests
that take place in the telecom testing lab such as insulation resistance test, Electromagnetic
Impedance Testing etc. Then we were taught how to work with the Multimeter and take few
readings with it. We were shown all the labs -EMI/C lab, Safety lab, SAR lab and telecom
security lab. Below is a detailed description of what happens in the Telecommunications
testing laboratory. The testing lab is an office that involves:

• Safety Lab
• Electromagnetic Impedance Testing
• Electromagnetic Similarity Testing

Electromagnetic Impedance Testing:

This is a test that measures the level of electromagnetic excitement generatedby the device
during normal operation. The reason for this test is to ensure that any flow from the device
is, wherever possible, less specific to that type of device. This therefore provides reasonable
confirmation that the device will not cause destructive interference to other devices operating
in its normal working environment.

Electromagnetic Similarity Testing:

This is a testing that is finished to check if the framework functions admirably when presented
to electromagnetic clamour and other unsettling influences. The motivation behind these tests
is to acquire a sensible confirmation that the gadget will work as planned when utilized .

Safety Lab:

In this lab, the equipment is subjected to ecological conditions such as sudden high voltage
spikes, impact testing, drop testing, acceleration testing, and testing if the system meets the
requirements. expected activity.EMI/EMC testing is fundamental to ensuring the reliable and
safe operation of electronic devices, especially in businesses such as automotive, aviation,
media communications and medical services. During my time at ITI, I was able to see first-
hand the various cycles performed during EMI/EMC testing. The various cycles required for
EMI testing are documented below:

Pre-Test Preparation:

• The particular guidelines and guidelines appropriate to the gadget are recognizes also, tried.
Various enterprises and locales might have shifting prerequisites. Setting up the test plan,
indicating the test techniques, frequencies, and test limits.
Test Setup:

The device or system under test is placed in an EMI test chamber. These chambers are
designed to isolate the test environment from external electromagnetic influences. Connect
the system to the necessary measurement equipment, including spectrum analysers, antennas,
and power meters.

Emissions Testing:

Radiated Emissions Testing: The electromagnetic radiations emitted by the system are
measured. This may involve scanning the device over a range of frequencies and recording
emissions levels.

Data Analysis:

The data collected through testing is analyzed and determined whether the system complies
with the specified emissions limits and maintains proper functionality in the presence of
interference. Compare the test results with the predefined test criteria and regulatory
requirements.

Test Reporting:

A comprehensive test report is prepared that includes detailed information about the test
setup, procedures, measurements, and results. Ensure that the report includes pass/fail
determinations and any deviations from the test plan.

Documentation and Certification:

All documentation related to EMI testing is complied, including test reports.compliance

certificates, and supporting data.

INSULATION RESISTANCE TEST (IR test)

IR test is used for the protection of inner current IR is divided into two parts:basic insulation
resistance, double insulation resistance basic insulation resistance is used for basic
production from 0-2 M ohm double insulation resistance is used for higher voltage
protection from 0-4M ohm.

PROCEDURE FOR THE INSULATION TEST:

• set the input voltage 0 to 5 KV

• in this case we have used 1 kilowatt
• set the ramp equal to 5 second.
• time = 60 seconds
• High set = infinite ohm
• Low set = 1m oh
 4G Lab

The 4G lab in ITI assembles the various cards involved in a 4G architecture. The PCB cards
are manufactured by the PCB manufacturing and SMT departments and then arrive at the 4G
lab. These labs assemble the Base band units (BBU) and the radio resource units (RRU). The
major customer of ITI 4G labs is BSL. The entire 4G architecture and the codes in the units
are designed by C-dot Bangalore.

Each RRU can have one or more BBUS. Typically, in a centralized RAN (C-RAN) or Cloud
RAN (CRAN) architecture, multiple RRUS are connected to a central BBUpool. This
centralization of BUs is one of the key features of C-RAN/CRAN.Each Base band unit
consists of 6 cords

1) PLPK: Power supply card: -

The power supply cord converts the -48 Volt input AC signal to -12 Volt signal DC signal
and -3.3 Volt DC signal. The -l2V signal is used to operate the power supply cord and the net
output of the cord is the -3.3V DC supply. The cord consists of transformers, rectifiers, diodes,
filters, etc...

2)AMLK: Alarm card: -

The alarm cord alerts using an alarm in case there is anything wrong with the System. It
consists of alarms and power supply cord.

3) FLBK: Fan card: -

The input to the fan module is a 12V DC supply. The fan is used to cool the system. The
speed of the fan is automatically regulated by the system.

4) LBMK: Base Module: -

The LBMK cord connects the RRH to the BBU. It is used to communicate between the 2
systems. In order to achieve this LBMK consists 3 stages

• CPLD: Programming is done in Diamond software

• NOR and NAND gates
• FPGA

5)LCMK: Control cord: -

The LMK cord handles alarms and intercepts.

 CHAPTER-V: CONCLUSIONS & OUTCOMES

This internship has truly been one of the most enriching experiences of my life The internship
helped me gain valuable insights into my field of electronics and communication. It has
helped me realise how vast and interesting the scope of my field is. It has further increased
my motivation to work harder and expand in the field of electronics and communication.

Moreover, it has helped me gain invaluable insights and hands on training to the industry. I
gained valuable insights into research, telecom testing. PCB manufacturing, Surface mount
technology, Injection Moulding and 4G design. This internship also helped me to get in touch
with different experts and scholars in the field who have inspired as well as helped me gain
important connection that will help me in my career ahead. I am immensely grateful to Girish
sir who was constantly beside us and sully supporting us throughout the internship

REFERENCES:

• www.itiltd.in
• www.internshala.com