Chapter 3_1-5è¬-義-1
Chapter 3_1-5è¬-義-1
Semiconductor Science
and Light-Emitting Diodes
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3.1 Review of Semiconductor
Concepts and Energy Bands
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A. Energy Band Diagrams, Density of States,
Fermi-Dirac Functions of Metals
(圖3.1)
When brining together ~1023 Li atoms to form the metal crystal, the 2s energy level
slits into ~1023 closely spaced energy levels that effectively form 2s band.
Fermi energy EF – Highest occupied energy level at 0 K.
Work function Φ – Minimum energy required to move an electron from the metal.
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E
州 只
T>0K EF
(圖3.2)
0
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。
Fermi-Dirac function
3-D potential energy well Density of states
1
g ( E ) 4 (2me ) 3/ 2
h E 3 1/ 2
AE 1/ 2 f (E)
E EF
1 exp
(3.1.1) k BT
1
(3.1.2)
(
AVE . 1
EF
texpm
n
Total number of electrons
per unit volume in the band g ( E ) f ( E ) dE (3.1.3)
0
2/3
h 3n 2
At T = 0 K EFO (3.1.4)
8me
At T > 0 K, EF decreases slightly with T, but this change is minor and can be ignored!
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B. Energy Band Diagrams of Semiconductors
(圖3.3)
(圖3.4)
A photon with an energy h greater than Eg can excite an electron from the VB to the
CB. When a photon breaks a Si-Si bond, a free electron and a hole in the Si-Si bond
is created, resulting in the photogeneration of an electron—hole pair (EHP). Note that
in some semiconductors, like Si and Ge, the photon absorption process also involves
lattice vibrations (not shown in Fig. 3.4). The electron in the CB moves with an
effective mass me*, which is not the same as the electron moving in vacuum.
Thermal energy may also rupture bonds and create electron—hole pairs.
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Hole Motion in a Semiconductor
(圖3.5)
Illustration of a hole in the valence band (VB) wandering around the crystal due to
the tunneling of electrons from neighboring bonds; and its eventual recombination
with a wandering electron in the conduction band.
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3.2 Semiconductor Statistics
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drpiny
oo
√
√
(圖3.6)
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Electron Concentration in CB
Ec
n gCB ( E ) f ( E ) dE (3.2.2)
Ec
3/ 2
Effective DOS at CB Edge 2m k T *
N c 2 e B
2
me* = Effective mass of
(depends on T and material) h an electron in the CB
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Hole Concentration in VB
( EF Ev )
p N v exp (3.2.4)
k BT
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Fermi Energy in Intrinsic Semiconductors EFi
( Ec E F ) ( E F Ev )
n p N c exp
k T N v exp
k T
B B
1 1 Nc
EFi Ev E g k BT ln
2 2 Nv
1 3 me*
Ev E g k BT ln *
2 4 (3.2.5)
mh
1
Ev E g
2
me* = Electron effective mass (CB), mh* = Hole effective mass (VB)
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Mass Action Law
Eg
np n N c N v exp 2
i (3.2.6)
k BT
ni = intrinsic concentration
Ec
ECB
Ec
EgCB ( E ) f ( E ) dE 3
EC k BT
Ec
2
Ec
gCB ( E ) f ( E ) dE
EF = eV (3.2.7)
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3.3 Extrinsic Semiconductor
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A. n-Type and p-Type semiconductors
n-type Si doped with As p Type
=
(圖3.7)
(donor impurity)
a
(a) The four valence electrons of As allow it to bond just like Si but the fifth electron is
left orbiting the As site. The energy required to release to free fifth-electron into the CB
is very small. (b) Energy band diagram for an n-type Si doped with 1 ppm As. There are
donor energy levels just below Ec around As+ sites.
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Extrinsic Semiconductors: n-Type
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Conductivity of a Semiconductor
or vp
eN d e e h eN d e (3.3.2)
Nd
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二
一
型
p-type Si doped with Boron
(圖3.8)
(acceptor impurity)
ci 顆申 接收
e
& 卧
(a) Boron doped Si crystal. B has only three valence electrons. When it substitutes for a
Si atom one of its bonds has an electron missing and therefore a hole. (b) Energy band
diagram for a p-type Si doped with 1 ppm B. There are acceptor energy levels just
above Ev around B sites. These acceptor levels accept electrons from the VB and
therefore create holes in the VB.
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一
一
子
Extrinsic Semiconductors: p-Type
(acceptor concentration Na) If Na >> ni, then at room temperature, the
hole concentration in the VB will nearly
be equal to Na, i.e. p ≈ Nd
ni2
eN a h e e eN a h
Na 州 \ a
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《
Semiconductor Energy Band Diagrams
(圖3.9)
(圖3.9)
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B. Compensation Doping
A semiconductor doped with both donors and acceptors to control the properties.
√
p = Na Nd >> ni n = ni2/(Na Nd)
We cannot simultaneously increase the electron and hole concentrations
because that leads to an increase in the recombination rate which returns the
electron and hole concentrations to values that satisfy mass action law np = ni2.
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C. Nondegenerate and Degenerate
Semiconductors
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Degenerate Semiconductors (Heavily Doped)
(圖3.10)
(圖3.11)
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一十
Example 3.3.1 Fermi levels in semiconductors
An n-type Si wafer has been doped uniformly with 1016 phosphorus (P) atoms
cm–3. Calculate the position of the Fermi energy with respect to the Fermi energy
EFi in intrinsic Si. The above n-type Si sample is further doped with 21017
boron atoms cm–3. Calculate position of the Fermi energy with respect to the
Fermi energy EFi in intrinsic Si at room temperature (300 K), and hence with
respect to the Fermi energy in the n-type case above.
Solution
hri =
np
expt)
P (Group V) gives n-type doping with Nd = 1016 cm–3, and since Nd >> ni in
intrinsic Si (1010 cm–3 from Table 3.1), we have n = Nd = 1016 cm–3.
For intrinsic Si, ni = Ncexp[(Ec EFi)/kBT] √
√
EFi and EFn are the Fermi energies in the intrinsic and n-type Si.
落籲
p = Na Nd = 210171016 = 1.91017 cm–3.
For intrinsic Si,
p = ni = Nv exp[ (EFi Ev)/kBT], √
For doped Si,
p = Nv exp[ (EFp Ev)/kBT] = Na Nd
EFp is the Fermi energy in the p–type Si.
p/ni = exp[ (EFp EFi)/kBT]
EFp EFi = kBT ln(p/ni) = (0.0259 eV)ln(1.91017/1.01010)
= 0.434 eV
V
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己
Example 3.3.2 Conductivity of n-Si σ= eMuuteMpp
Solution
The intrinsic concentration ni = 1×1010 cm-3, so that the intrinsic conductivity is
= eni(e + h) = (1.6×10-19 C)( 1×1010 cm-3)(1450 + 490 cm2 V-1 s-1)
= 3.1×10-6 -1 cm-1 or 3.1×10-4 -1 m-1
Consider n-type Si. Nd = 1016 cm-3 > ni (= 1010 cm-3)
electron concentration n = Nd = 1016 cm-3
hole concentration p = ni2/Nd = (1010 cm-3)2/(1016 cm-3) = 104 cm-3 << n
The conductivity is
eN d e (1.6 1019 C)(11016 cm 3 )(1200 cm 2 V1s 1 ) 1.92 Ω1cm 1
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3.4 Direct and Indirect Bandgap
Semiconductors: E-k Diagrams √
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Electrons in 1D Semiconductor Crystals
The electron potential energy (PE), V(x), inside the crystal is periodic with the
same periodicity as that of the Crystal, a. Far away outside the crystal, by choice,
V = 0 (the electron is free and PE = 0).
(圖3.12)
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Electrons in 1D Semiconductor Crystals
d 2 2me
2
2 [ E V ( x )] 0 (3.4.1)
dx
k(x,t) = Uk(x)exp(jkx)×exp(jEkt)
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E-k Diagram of a 1D Direct Bandgap
Semiconductor
(圖3.13)
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E vs. k Diagrams and Direct and
Indirect Bandgap Semiconductors
(圖3.14)
0
E 導健
ㄟ
m
Recombination centers
may be crystal defects
or impurities.
E
=
薑尖
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水
3.5 pn Junction Principles
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A. Open Circuit
Due to the hole(/electron) concentration
gradient, hole(/electron) diffuse toward the
n-region(/p-region) and recombine with the
electrons(/holes) near the junction, resulting
in the depletion region.
①
←
Total width of depletion region Wo = Wpo +
Wno. For overall charge neutrality,
0 NaWpo = NdWno (3.5.1)
(圖3.15)
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Gauss’s law
dE d 2V net ( x )
2
dx dx
(Assume a step form of net (x), = o r)
eN dWno eN aW po
Eo (3.5.2)
EoWo eN a N dWo2
Vo (3.5.3)
2 2 ( N a N d )
N2 ( E 2 E1 )
exp (3.5.4)
N1 k B T
nEJaexp-
)(Na)
n po eVo N1 (Nd)
exp
nno k BT
(3.5.5) (ni2/Na) N2
pno eVo (ni2/Nd)
exp
p po k BT
k BT p po k BT N a N d
Vo ln ln 2
e pno e ni
(3.5.6)
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B. Forward Bias and the Shockley Diode Equation
空全變窄 Bamdgp }
更多裁
Un .
擴散
(圖3.16)
The applied voltage V drops mostly across the depletion region and reduces the built-in
field and potential barrier against diffusion to be Vo-V, resulting in the injection of
excess minority carriers.
There is a large hole (electron) concentration gradient in the n-side (p-side) due to
minority carrier injection, resulting in two minority carrier diffusion fluxes constitute
the forward bias pn junction current.
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子
Law of the Junction
ppo
Boltzmann Statistics
N2 ( E2 E1 )
exp
N1 k B T
婚新久地
e(Vo V )
-
pn (0)
exp
p po k B T
eVo eV
exp exp
k BT k BT
pno/ppo
eV eV
pn 0 pno exp
n p 0 n po exp
k BT k BT
(3.5.8&9)
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方
Forward Bias: Diffusion Current
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Forward Bias: Diffusion Current (Long Diode)
刊始未擴散濃度
dpn ( x ' ) eDh x'
~
dpn ( x ' )
J D ,hole eDh eDh pn (0) exp
dx ' dx ' Lh Lh
eV ni2 eV
pn (0) pn (0) pno pno exp 1 exp 1
k BT N d k BT
√
At x’ = 0 J D ,hole
eDh ni2 eV
exp 1
c =
eq
(3.5.12)
[exp ]
Lh N d k BT √
陜州
S.O. Kasap, Optoelectronics and Photonics: Principles and Practices, Second Edition, © 2013 Pearson Education
© 2013 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This publication is protected by Copyright and w ritten permission should be obtained from the
publisher prior to any prohibited reproduction, storage in a retrieval system, or transmission in any form or by any means, electronic, mechanical, photocopying, recording, or
likewise. For information regarding permission(s), write to: Rights and Permissions Department, Pearson Education, Inc., Upper Saddle River, NJ 07458.
子
儿
Forward Bias: Diffusion Current (Short Diode)
hor
lay scage
eV
pno exp pno
dpn ( x ' ) p (0) pno k BT
J D ,hole eDh eDh n eDh
dx ' ln ln
eDh ni2 eV
exp 1
ln N d k B T
S.O. Kasap, Optoelectronics and Photonics: Principles and Practices, Second Edition, © 2013 Pearson Education
© 2013 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This publication is protected by Copyright and w ritten permission should be obtained from the
publisher prior to any prohibited reproduction, storage in a retrieval system, or transmission in any form or by any means, electronic, mechanical, photocopying, recording, or
likewise. For information regarding permission(s), write to: Rights and Permissions Department, Pearson Education, Inc., Upper Saddle River, NJ 07458.
Forward Bias: Total Diffusion Current
√
Shockley
√ long diode equation
eDh eDe 2 eV
J ni exp 1 (3.5.13)
Lh N d Le N a k BT
Jso
Shockley short diode equation
√
eDh eD 2 eV
J e ni exp
1 (3.5.14)
l N
n d l p N a k BT
Jso depends on the doping and materials (e.g. bandgap) and temperature,
and is known as the reverse saturation current density. When a
reverse bias V = -Vr (>> kBT ) is applied, J = -Jso .
S.O. Kasap, Optoelectronics and Photonics: Principles and Practices, Second Edition, © 2013 Pearson Education
© 2013 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This publication is protected by Copyright and w ritten permission should be obtained from the
publisher prior to any prohibited reproduction, storage in a retrieval system, or transmission in any form or by any means, electronic, mechanical, photocopying, recording, or
likewise. For information regarding permission(s), write to: Rights and Permissions Department, Pearson Education, Inc., Upper Saddle River, NJ 07458.
C. Minority Carrier Charge Stored in Forward Bias
戴 ↓+ 外部电路補
freae f
“
ax
re = =
σ z √ (4)
Je = -
ebudpuaxs
ㄍㄨ
Ciet
Je = e e
是 = - enve
veditf _ Det
, =
上
不 定為等速運动
∂
抵 =
皆婆
shazt diode lineur h X -
nu4) =
hl
.
步
≈ 此
政 = 吃
c -涉
ㄨ
= } ih
e
③ L .
…
- tt
↓x
.
上 吃了
=
品 liz芒了 dx
=
Di { Ʃx)u4 -
= () ≥
D
擴散運动若爪涉及複合
也不 定是等速運 D
日
一
。
」。
。
一
一
一
D. Recombination Current and the Total Current
(圖3.18)
擴久打 打量擴散 1 1 →
洞罩
eABC eBCD e 2 W p nM e 2 Wn pM
J recom
所合平均時膩
e h e h (3.5.16)
S.O. Kasap, Optoelectronics and Photonics: Principles and Practices, Second Edition, © 2013 Pearson Education
© 2013 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This publication is protected by Copyright and w ritten permission should be obtained from the
publisher prior to any prohibited reproduction, storage in a retrieval system, or transmission in any form or by any means, electronic, mechanical, photocopying, recording, or
likewise. For information regarding permission(s), write to: Rights and Permissions Department, Pearson Education, Inc., Upper Saddle River, NJ 07458.
里
子
Forward Bias: Recombination Current in SCL
e(Vo V )
pM p po exp
2 k BT
p po N a
k BT N a N d
Vo ln 2
e ni
Assume Na = Nd
eV
pM ni exp nM (圖3.18)
2 k BT
General form
eni W p Wn eV eV
J recom exp J recom J ro exp 1
2 e h 2 k BT 2 k BT
Jro (3.5.17)
S.O. Kasap, Optoelectronics and Photonics: Principles and Practices, Second Edition, © 2013 Pearson Education
© 2013 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This publication is protected by Copyright and w ritten permission should be obtained from the
publisher prior to any prohibited reproduction, storage in a retrieval system, or transmission in any form or by any means, electronic, mechanical, photocopying, recording, or
likewise. For information regarding permission(s), write to: Rights and Permissions Department, Pearson Education, Inc., Upper Saddle River, NJ 07458.
Total Current = Diffusion + Recombination Current
SCL recombination
eV
I recom I ro exp 1
2 k BT
Surface recombination
eV
I surf I sro exp 1 (3.5.18)
2 k BT
General diode equation
eV
I I o exp 1 (3.5.19)
k BT
: diode ideality factor (1 for diffusion-controlled, 2 for recombination-controlled)
S.O. Kasap, Optoelectronics and Photonics: Principles and Practices, Second Edition, © 2013 Pearson Education
© 2013 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This publication is protected by Copyright and w ritten permission should be obtained from the
publisher prior to any prohibited reproduction, storage in a retrieval system, or transmission in any form or by any means, electronic, mechanical, photocopying, recording, or
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Typical I-V characteristics of Ge, Si and GaAs
pn junctions
(圖3.20)
2 Eg
Eg: Ge (0.66 eV), Si (1.12 eV), GaAs (1.42 eV) ni exp
k BT
S.O. Kasap, Optoelectronics and Photonics: Principles and Practices, Second Edition, © 2013 Pearson Education
© 2013 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This publication is protected by Copyright and w ritten permission should be obtained from the
publisher prior to any prohibited reproduction, storage in a retrieval system, or transmission in any form or by any means, electronic, mechanical, photocopying, recording, or
likewise. For information regarding permission(s), write to: Rights and Permissions Department, Pearson Education, Inc., Upper Saddle River, NJ 07458.