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Lecture 1- 2.0 Die Packaging

The document outlines the die packaging process, detailing steps such as wafer dicing, die attach, die bonding, and package molding. It discusses key concepts including input/output connections, pitch, and line/spacing, as well as materials used for bond pads on both die and substrate. Additionally, it describes the wire bonding process and solder bump formation on die.

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5 views

Lecture 1- 2.0 Die Packaging

The document outlines the die packaging process, detailing steps such as wafer dicing, die attach, die bonding, and package molding. It discusses key concepts including input/output connections, pitch, and line/spacing, as well as materials used for bond pads on both die and substrate. Additionally, it describes the wire bonding process and solder bump formation on die.

Uploaded by

quân tiến
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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2D Packaging & Assembly

2.0 Die Packaging

Hongbin Yu
Oct. 8 5:30pm AZ time
2D Packaging & Assembly

Die Packaging – Process Steps


• Wafer & Chip Fabrication
• Lead-Frame or Substrate Manufacture
• Die Packaging
• Wafer dicing to extract die
• Die Attach
• Lead-Frame or
• Substrate
• Die Bonding
• Wire Bond or
• Flip-Chip Bond
• Package Molding
• Transfer
• Underfill for flip-chip
• Finishing
2D Packaging & Assembly

I/O, Pitch and Line/Spacing (L/S)

• Input/Output (I/O): Number of connections


(Bond-Pads) from die to substrate Semiconductor
• Pitch (P): Distance between bond pads Die
• Line/Spacing (L/S): Distance between trace
lines (L+S) L S
P
2D Packaging & Assembly

Bond Pads - Die


• Bond Pads on the semiconductor chip provide Semiconductor
route for I/O connections to outside Die

• Materials
• Copper
• Aluminum
Bond
• Gold
Pads
• At edge of the semiconductor chip.

• Passivation: Coating on wafer/die surface for


protection (e.g. corrosion)

Source: Nolet et-al, Electronic Letters, V56, 2020


2D Packaging & Assembly

Bond Pads - Substrate


• Bond Pads on the substrate chip provide route
for connection to the die
• Materials
• Copper
• Aluminum
• Gold

Ceramic Substrate with Wirebonds on Aluminium Pads


Source: Thinfilm.com

Organic Substrate with Bumps on Copper Pads


Source: Shinko.com
2D Packaging & Assembly

Wire bonding
• Bonding equipment provides friction between
wire and bond pads

• Mechanical deformation and friction between


materials provides atomic diffusion between
materials to form the bond.
2D Packaging & Assembly

Solder Bump Fomation on Die

UBM sputtered onto the bond pad region


Die/Wafer with passivation Photo resist added

Solder electroplated Photo resist etched away Solder reflowed to form bump

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