Facilitating NASA's use of

GEIAwSTDmw0005mwI Y Performance Standard

for Aerospace and High Performance
Electronic Systems Containing
Lead-free Solder

Jeannette Plante
NASA Workmanship Standards Program
Quality Leadership Forum
!March 2010

1^ 8.1
Iw
 -RoHS Movement in Europe in mid 1990's a.

-solderable surfaces and solder itself must be Pb-free

-Worldwide suppliers offer pure tin as alternative

-Researchers and users are reminded of the tin whisker hazard
-Industry searches for new solder formulations
SnAg 3.0 Cu O.5 SnAg3.SCuO.7Sbo.25 SnZn g
SnAg 3.5Cu O.7 SnAg3.aCuo.7Sbo.25 SnZnsBi3
SnAg 3.5CuO.9 Sn3.5A9o.74Cuo.21Zn SnAg2.5Cuo.aSbo.5
SnAg 3.SCu 0 .7 Sn3.5A9o.S5CuOO.1 Mn Sn Ina.oAg3.58io.5
SnAg 3.9Cu O.6 SnCu O.7 SnBi 57A9 1

-New formulations come with known and unknown risks

-Sensitivity to physical shock
-Some test methods do not "translate"
-Higher processing temperatures can affect boards and parts
-Assemblies may mix solders
-Logistics may not be set up to identify Pb-free materials
-Solder joints have "dull" appearance

a. SnPb solder, b. Pb-free solder, Source: Lead Free Surface Mount

Technology, Ian WiJding, Henkel Technologies, 2005
 -Industry groups worked to fill void in best-practice standards
-Technical basis of emerging standards questioned
-New standards did not recognize supply chain issues
-Part suppliers starting to advertise "whisker-free" per these standards

-ELF IPT and LEAP WG formed by engineering leaders in DoD Prime

Contractor community to focus efforts in research, best practices, and
policy. (NASA begins participation in /larch 2006)
Aerospace industries Association (AIA)-Avionics Maintenance Conference (AMC)-
Government Electronics and Information Technology Association (GEIA) Lead-free Electronics
in Aerospace Project Working Group (WG)

Examples of projects.
Component re-processing (BGAs, Lead Dipping)
Solder joint reliability characterization
Fundamentals of whisker growth
Mined alloys systems (original and repaired)
Supply chain requirements flow down
Assembly and part identification and traceability
Training

Photo source: "Tin Whiskers Pound on ATVC SN 0034'; Don

McCorvey, 2006
GEIA-STD-0005-1 Performance Standard for Aerospace and High
Performance Electronic Systems Containing Lead-free Solder
GEIA-STD-0005-2 Standard for Mitigating the Effects of Tin in
Aerospace and High Performance Electronic Systems
GEIA-STD-0005-3 Performance Testing for Aerospace and High
Performance Electronics Containing Lead-free Solder and Finishes

GEIA_HB-0005-1 Program Management / Systems Engineering

Guidelines for Managing the Transition to Lead-free Electronics
GEIA-HB-0005-2 Technical Guidelines for Aerospace and High
Performance Electronic Systems containing Lead-free Solder
GEIA-HB-0005-3 Rework and Repair Handbook To Address the
Implications of Lead-Free Electronics and Mixed Assemblies in
Aerospace and High Performance Electronic Systems
GEIA-STD-0005-1 Performance Standard for
Aerospace and High Performance Electronic
Systems Containing Lead-free Solder

- Communicates requirements for a Lead-free Control Plan ..F to assist

suppliers in the development of their own Plans. The Plan documents the Plan
owner's (supplier's) processes, assure them` customers, and all other
stakeholders that the Plan owner's productss will continue to meet their
requirements.
- This standard does not contain tailed descriptions of the processes
be documented but listshigh-level requirements tints for such processes, and
areas of concern to the AHP industries that must be addressed by the processes.

k
 Quality Assurance Requirements Traceability
NPD 8730.2, NASA Parts Policy

Attachment A: Criteria to Mitigate Risks Associated with Lead-Free Solder and

Surface Finishes
(paraphrased)
a. Sn-Pb shall be used whenever possible. Use of Pb-free (<3% Pb) may be
used by special approval on technical need and risk mitigation.
b. A GBIA-STD-0005-1 Pb-free control plan is required which addresses:
design considerations manufacturing process controls
test & qualification requirements quality inspection & screening
marking & identification maintenance & repair
risk mitigation application uniqueness's
c. GEIA-STD-0005-2 "2C" level whisker risk mitigation. "213" level allowed in
special circumstances and with PCB approval.
d. Use of Pb-free Sn-based solders and surface finishes, in applications below
13.2°C, shall be assessed for the risk of the damaging effects of tin pest
formation (allotropic phase transformation of tin).
 Quality Assurance Requirements Traceability
J-STD -oo DS. 1 Joint Industry Standard, Space Applications Electronic
Hardware Addendum to J-STD-001 D Requirements for Soldered
Electrical and Electronic Assemblies

1. Scope is surfaces to be soldered and solder used

2. The following are specifically prohibited without

meeting additional requirements:

Pb-free tin platings or metallization on external surfaces of

EEE parts, mechanical parts, including on parts inside of
modules (e.g. MCM, Relays)

• Pb-free solder alloy except Sn96.2Ag3.7

Quality Assurance Requirements Traceability
Cont. J.,STD,-001DS. 7
3. The cases above are allowed only with a USER approved lead-
free control plan (L1= CP) which accomplishes:
a. Replating or hot solder dip replacement of Pb-free
surfaces with SnPb -or-
b. Minimum of 2 other risk mitigation methods employed

4. L1= CP shall ensure functionality of hardware in intended

application wlrlsolder, platings, soldering processes
a. Document every incidence of use
b. Minimum of two mitigation methods
c. Document special design requirements, processes,
testing, inspections, marking, repair
 .. .. ......
I.. View TECHAMERICA GEIA - STD-0005 - 1 Active 0 6/01/20 06 P e rformance S t andard for Aerospace and High

GEIA
STANDARD

Performance Standard for Aerospace and

High Perfonuance Electronic Systems
Containii^g Lead-free Solder
 s
ea e Objectives. rR .............r^....................-..................................................................................... ...... 4

5A y t?..
i1.eliabilitv
{ ^
P ^'`
......... ,..<..-,...,.......m.....»....,.»...................... ....,..,....... .......... . ....................,.., «..... u....a., ..F'

Configuration control avA product identification ...a....,x..,...,..a..,.........w„^....,.....,^...a.., «...

53 Risks mid limitations, ofwe__' ... , — , ...... ................................., .....,...........,..........A....,..... 5

5A Deleterious effects oftinhick- ' ................ ....« ................. ....,.................. ..
.5 Repair, reivor , maintenance. n suppol- ...........>.............,...^........,«..4^..... . .....................n
6 ^^Y }
i ethnic al requirements . .... . ................................. . ....................... ........:...... . ........... ..M.......... . .... 5
6n1 Reliability—.- ... — ....... .............»........,..eu.....4.....,.............,......o..,a........e.axa.v.,...an.......s.,.. r.e 5
6«1.1 Test m awls methods _.. .....-------------------------------- ..--_.-___._...__..__.............. ._....«------------ .____,«_
6.1. E Eillr*i3 Clumental and operating conditions .............
6.1..E Data,« - ._..-.._. ............. ......... _ _.........__ ............. ___ ....... .- .......... ........ ._.......v__.....__........_. -.a_.. 7
6.1 .E Cou'version of results froin available data to applicable conditions ...__..««...
6.2 Configuration contTol wid product identification . ........... .... — ...... ___ .... .,...... ....,........r,., ,
6. `x ..1 Tei imtton material and ash alloy compositions of piece p arts . ----- ..... ... .......
. 2 _? Solder alloys its iii. ^e assembly process .................... ___ ....... .__+,.«... ------ ._.._. _--------.-...
6.22.1 Assembl ies containing a ale solder alloy ......... ____ --------------------------- ____ ----------------- .....
6«2.2.2 Assemblies containnig more than € ne solder alloy ........ ............ ..v_...- .................. _..._..
6.2.3 .Aircraft x izi ng, ..............
62. Changes in solder ........... ..................... .__.,..«._,...._.,...._._............ ..P..,,...__....__^
6 .2.5 Identification..._-. -----_---_ ___ .............. .............. _..... -..._ _..._......_............_....._.-._.__....-
6.2.6 Fart s wnber changes ................... .... ___ ._........ ....... .------- .. ._.......«............. _... .... _-..
63 Risks and limitations of use. ___ ....................... .._ ........... .............._.._.._......_.._._.___.._._,_..._ 9
6_3_2 1wompatible materials ........... ................... ... ---------- ___ ----....._.._.._..------ _. --- ---_ ........ .__._...._
6.3 2 Liiillitatiom on systems ii e-.«_.._.... ............... ....._....__................. ___ ----------- ____ ------- .._.___._._
6.3.3 Li rm' tations on environowntal condit ions .... ..... ........ .... ____ .................. ._.«_.._._,....__ »-__._...
6.3.4 Lin nations on maintenance. rework_ and reiiair ................«__._.........____.._.._..__. ............... .__.
 INSTRUCTIONS AND TEMPLATE
FOR CREATING
A LEAD-FREE CONTROL PLAN

TABLE OF CONTENTS
SECTION
1 PURPOSE AND APPUCABlUTY.. . _ _ _ '__',,_0<_ _ _ _ _____ • __

2 lNSTR UCTlONS FOR USE OF THtS TErvlPLATE _____ _

APPENDIXA TEMPLATE FOR CREATING A lEAD-FREE CONTROL PLAN
 LFCP Template Instructions
Template has same section numbers and headings as GEIA-STa--0005-1.
Green Shading :short reminder of requirement statement from GEIA-STD-0005-7, removed
by author

Blue font :fill in information on materials, reliability, configuration management,

procedures, etc.

Theinstructions assume that the author access to the

information, either through personal knowledge, or through other knowledgeable
personnel. (- can "standard" methods be provided ?

[Supplier name) :fill in the name of the organization responsible for implementing the Lead-
free Control Flan

[LFCP] :fill in supplier's formal name or doc number

[Bold Italicized] :fill in additional or custom information

Prior to review, remove the Ist section break and ail
text on pgs i through iv and remainder will be the
CFCP.
 LFCP Template
1. Cover Page
2. Table of Contents
I Configuration Management table
4. Forward: 2 examples given, choose one or make your own
6. Purpose and Applicability: fill in LFCP name, fill in supplier name
6. Exclusions: describe exclusions from scope of the plan
7. References. GEIA provided
8. Terms, Definitions and Acronyms: 89 IPC and GEIA terms included
9. Objectives: author is instructed to address the following:
Reliability: how will this be demonstrated?
Configuration control and product identification
Caveats: remaining risks and limitations of use
- Deleterious effects of tin whiskers: how mitigated?
- Repair, rework, maintenance, and support

How to prefer supplkiirs who

are using this approach.?
 Summary

• PERM Consortium established standardized minimum

baseline for Pb-free control in form of GEIA (TechAmerica)
document set

• NASA policy requires Pb-free control per GEIA-STD-0005-1

• where used, how used, logistics control, meets/exceeds

reliability needs is emphasis
• NASA will provide a template for facilitating the use of GEIA-
STD-0005-1
• Author should be process owner. one-size-fits-all may not
work for establishing the reliability piece