Received: 11 August 2020 Revised: 3 October 2020 Accepted: 23 October 2020

DOI: 10.1002/er.6215

RESEARCH ARTICLE

Thermal performance of phase change material–based heat

sink for passive cooling of electronic components: An
experimental study

Rohit Kothari1 | Santosh K. Sahu1 | Shailesh I. Kundalwal1 | Pawan Mahalkar2

1
Discipline of Mechanical Engineering,
Indian Institute of Technology Indore,
Summary
Indore, India Present paper reports the thermal performance of various phase change mate-
2
Department of Mechanical Engineering, rial (PCM)-based heat sinks during melting process for cooling of portable
P.E.S's Modern College of Engineering,
electronic devices through experimental investigations. Heat sink configura-
Pune, India
tions include unfinned with pure PCM, finned with pure PCM, unfinned with
Correspondence metallic foam (MF)–PCM composite, and finned with MF–PCM composite.
Rohit Kothari, Discipline of Mechanical
Engineering, Indian Institute of
Paraffin wax is used as PCM, and tests have been carried out for various input
Technology Indore, Indore, Madhya heat flux values (1.3, 2.0, and 2.7 kW/m2) at different volume fractions of PCM
Pradesh 453552, India. (0, 0.50, 0.86, and 1). The effect of various parameters such as PCM volume
Email: [email protected]
fraction, heat sink type, and heat flux on the stretching of operating time to
Funding information achieve a set point temperature (SPT) is studied. Results obtained from the
DST/TMD/MES/2k17/65, Grant/Award
current experimental investigation are compared with the existing test results.
Number: IF170534
Also, unfinned heat sink without and with PCM is used for baseline compari-
son. The evolution and propagation of melt front inside the heat sink are
studied through photographic observation. The enhancement in operating
time is found to vary with the SPT and heat flux values. MF–PCM-based heat
sinks are more advantageous for higher value of input heat flux (2.0 and
00
2.7 kW/m2). For q = 1.3 and 2.0 kW/m2, four-finned MF–PCM-based heat
sink exhibits better performance; while three-finned MF–PCM-based heat
00
sink shows best performance at q = 2.7 kW/m2. The highest enhancement
ratio of 2.97 is obtained at 1.3 and 2.7 kW/m2 for four-finned MF–PCM
heat sink and three-finned MF–PCM heat sink, respectively. Also, three-
finned heat sink provides higher heat transfer rate and highest thermal con-
00
ductance at q = 2.7 kW/m2.

KEYWORDS
heat sink, metallic foam (MF), phase change materials (PCMs), thermal conductivity
enhancer (TCE)

1 | INTRODUCTION modern society. The heat generated by electronic devices

such as laptop, cellular phones, battery modules of elec-
Integration and miniaturization of electronic components tric vehicles, light emitting diodes (LEDs), and control
and devices with improved performance is the need of systems in missiles has gone many folds because of

Int J Energy Res. 2021;45:5939–5963. wileyonlinelibrary.com/journal/er © 2020 John Wiley & Sons Ltd 5939
 1099114x, 2021, 4, Downloaded from https://onlinelibrary.wiley.com/doi/10.1002/er.6215 by Indian Institute of Technology Indore, Wiley Online Library on [19/01/2025]. See the Terms and Conditions (https://onlinelibrary.wiley.com/terms-and-conditions) on Wiley Online Library for rules of use; OA articles are governed by the applicable Creative Commons License
5940 KOTHARI ET AL.

various reasons. Consequently, temperature of the com- experimentally investigated different configurations of
ponents increases which in turn leads to its failure.1,2 heat sinks such as no fin, and circular pin fins with vary-
Hence, effective thermal management of electronic com- ing thickness (2-4 mm) for a fixed volume fraction (9%)
ponents is required to prevent failures that take place due of TCE. It was reported that heat sink with 3 mm thick-
to higher operating temperature and improve long-term ness provides maximum enhancement ratio, higher
reliability of electronic components/devices. Generally, thermal capacity, higher thermal conductance, and
cooling methods are categorized as passive and active best thermal performance. The effect of fin thickness
cooling methods. Active thermal cooling methods such as (1, 2, and 3 mm) and PCM volume fraction (0, 0.33, 0.66,
liquid and air cooling methods are not promising and 1) corresponding to constant 9% volume fraction of
methods owing to large space requirement, high mainte- TCE was experimentally studied by Arshad et al21 The
nance, power requirement, and noise resulting in higher authors reported that pin fin with 2 mm thickness and
operating cost.3-6 Whereas passive cooling techniques PCM volume fraction of 1 result in maximum operating
have no rotating parts and thus external power is not time. Leong et al22 analyzed the thermal performance of
required. This necessitates the development of new and different cross-fin heat sinks such as no fin, 9-square
innovative passive thermal management solution which cross fins, and 16-square cross fins filled with different
can keep up the safe operating temperature of critical PCM volume fraction through experimental investiga-
components. tion. The authors used 1-Hexadecanol and paraffin wax
Phase change material (PCM) cooling is considered as in their study. Paraffin wax–based heat sink involving
a favorable passive cooling method because of high 16-square cross fins exhibits better heat transfer perfor-
enthalpy of fusion of PCM.7 In such technique, latent mance compared to heat sink with other configurations
heat thermal storage system stores heat using PCM dur- involving 1-hexadecanol.
ing constant and transient power loads and subsequently In addition, various studies were devoted on geomet-
release it to ambient and thus keeping safe and uniform ric optimization of finned heat sinks.23-30 Saha et al27,28
temperature of vital components. Enthalpy of fusion and examined the optimum distribution of fins as TCE inside
phase change temperature are the main criteria for selec- the heat sink and reported that 8% volume fraction of
tion of PCM. PCM to be selected must have lower melt- TCE was found to provide improved thermal manage-
ing temperature than maximum operating temperature ment in comparison to other volume fraction of TCE. In
of the components. PCMs especially organic PCMs have another study, various correlations were proposed involv-
excellent features particularly high enthalpy of fusion, ing Stefan, Reynolds, Fourier, and Nusselt numbers by
chemical stability, high heat capacity, nontoxicity, non- the same authors. These correlations are function of the
corrosive, congruent melting, repeated use, and small characteristic length of various configurations of plate fin
volume change. These PCMs have extremely poor ther- enclosure.28 Pakrouh et al29 carried out optimization
mal conductivity, which makes slow discharging and analysis on pin fin heat sink filled with PCM through
charging of PCM.8 In order to overcome this drawback, numerical investigation. Also, the authors adopted the
various thermal conductivity enhancers (TCE) such as genetic algorithm (GA) technique30-32 for optimization of
high thermal conductivity material fins,9 metallic heat sink configuration. Baby and Balaji performed opti-
foams,10-12 and nanoparticles9,13-17 in conjunction with mization by employing artificial neural network for plate
PCM were studied by numerous researchers. fin30 and pin fin31 heat sinks of different volume frac-
Many experimental studies were conducted with tions. The volume fractions of TCE in pin and plate fin
extended fins as the TCE in PCM-based heat sinks.18-22 heat sinks with 9% and 15%, respectively, provide better
Baby and Balaji18 performed experimental study on ther- thermal performance for PCM-based heat sink.
mal performance of PCM-based heat sink with no fin, Apart from fins, high-porosity metallic foams (MFs)
3-plate fins and 72-pin fins at various power input values are considered to be excellent candidates to enhance the
(2 to 7 W). They reported that highest enhancement in heat removal. MFs provide extended surface area and
operating time of 18 can be obtained at higher power enhance the rate of transfer of heat due to high thermal
input values for heat sink with fins. In another study,19 conductivity of the webbed ligaments. MFs have different
the same authors did experimental analysis to obtain the porosities and available in different pore sizes which are
thermal performance of heat sinks with pin fins (33, 72, usually characterized by PPI (pores per inch).
and 120) and reported that the maximum enhancement Several studies were carried out based on different
can be obtained with 72-pin fins heat sink. It was argued porous structures as TCEs such as carbon fibers,33 graph-
that there must be critical fin number above which the ite flakes,34 MFs,35-43 etc. Gharbi et al36 analyzed differ-
increase in fin numbers leads to decrease in heat transfer ent configurations of heat sink such as graphite, silicon
performance of heat sink. Ali and Arshad20 matrix, and fins. Graphite matrix provides improved
 1099114x, 2021, 4, Downloaded from https://onlinelibrary.wiley.com/doi/10.1002/er.6215 by Indian Institute of Technology Indore, Wiley Online Library on [19/01/2025]. See the Terms and Conditions (https://onlinelibrary.wiley.com/terms-and-conditions) on Wiley Online Library for rules of use; OA articles are governed by the applicable Creative Commons License
KOTHARI ET AL. 5941

thermal control and longer fin with appropriate pitch considered. Chamkha et al52 analyzed heat transfer
leads to higher operating time. Mahmoud et al37 carried characteristic of MF–PCM in L-shaped heat sink for
out experimental investigation on cross- and parallel- pulse load condition through numerical investigation. It
finned heat sinks with honey-comb matrix for six differ- was reported that MF–PCM enhances the heat sink effi-
ent PCMs. They reported that honey-comb structure is ciency during pulse load condition. Also, the heat sink
more advantageous than machined finned heat sink. efficiency enhances with the rise in the pulse heat load.
Wide varieties of experimental and analytical studies Similar results were reported by Veismoradi et al53 in
were performed to investigate the heat transfer character- their numerical investigation to analyze heat transfer
istics of PCM-based MF heat sink.38-62 Baby and Balaji38 characteristic of MF–PCM for thermal management of
analyzed the orientation effect on PCM-based copper Li-ion battery pack. They reported that strong pulse load
porous foam on heat transfer performance and reported can increase the efficiency of MF–PCM heat sink by
that role of orientation is insignificant on the thermal seven times. Rehman and Ali55 did experimental study
performance of heat sink. Fan and Jin39 performed exper- to analyze the performance of MF–PCM at variable heat
imental investigations on paraffin-based open-cell load with RT-54HC as the PCM and copper and nickel
MF. They visualized the local thermal nonequilibrium as foam materials. It was reported that the reduction in
effect at pore scale and reported that as the melting pro- base temperature (Tb) is 26% higher in case of copper
ceeds the local thermal nonequilibrium effect increases foam in comparison to nickel foam at PCM volume frac-
from 0 C to 10 C. Jackson and Fisher40 did experimental tion of 0.8. In another study, Bhattacharya and
study and reported that size of pores of the MF signifi- Mahajan56 did experimental investigation on MF-finned
cantly affects heat transfer for rapid pulse load. The ther- heat sink without PCM with aluminum foam of differ-
mal conductivity of paraffin–MF composite was found to ent porosity (5 and 20 PPIs) inserted between different
be 15 times greater compared to pure paraffin.41 Zhang numbers of fins (one and four fins) for forced convec-
et al42 reported that more uniformity in temperature can tion electronic cooling. It was reported that heat transfer
be obtained for paraffin and copper foam composite com- is significantly enhanced with finned MF heat sink.
pared to pure paraffin. They also reported the enhanced Table 1 shows the summary of experimental investiga-
thermal performance of copper foam and paraffin com- tions performed by several researchers on PCM-based
posite. Zhu et al44 did numerical investigation on the electronic cooling.
thermal performance of MF–PCM composite and Numerous studies have been made to study the ther-
reported that high PPI aluminum foam can augment the mal performance of various heat sink configurations.
heat transfer performance of MF–PCM composite. Wang These include PCM-based unfinned, PCM-based finned,
et al45 performed experimental study of the thermal per- and MF–PCM-based unfinned heat sinks. The enhance-
formance of the paraffin and porous MF sintered felt ment in operating time was found for PCM-based finned
(PMFSF) composite PCM. They reported that PMFSF heat sink assemblies. In addition to this, MF-embedded
embedded with PCM provides higher thermal perfor- PCM-based heat sink exhibits better performance com-
mance compared to pure PCM and MF–PCM. Local ther- pared to unfinned heat sinks with PCM- and MF-based
mal nonequilibrium effect and thermal response heat sinks without PCM. It is observed that different
characteristics are also analyzed by Yao et al47 in their mode of heat transfer such as conduction and convection
visualization study of melting of pure PCM and MF– plays a crucial role to determine the thermal perfor-
PCM. It was reported that incorporating MF with PCM mance. The thermal performance of heat sink assemblies
enhances the melting rate of PCM by two times. Also, is found to depend on various parameters such as set
correlation for melting time of PCM embedded in MF at point temperature, input heat flux values, PCM volume
the pore scale was developed. In another study, Yao and fraction, and TCE volume fraction. It is expected that the
Wu48 carried out experimental investigation on the effect combination of fins, PCM, and MF in heat sink assembly
of density and MF porosity on the thermal transport can provide better thermal performance as the fin struc-
through MF–PCM. Further, it was reported that lower ture acts as heat conduction path. To the best of author's
porosity and density of MF increases the thermal diffu- knowledge, no significant study has been reported that
sion and temperature uniformity of MF–PCM. Zheng considered all the parameters such as fin, MF, and PCM
et al49 did numerical and experimental investigations to in the heat sink assembly during melting of PCM. Here,
analyze the melting of PCM inside the MF and reported efforts have been made to study the thermal performance
that complete melting time of PCM inside the MF is of heat sink assemblies such as unfinned with pure PCM,
20.5% higher compared to pure PCM. However, the melt- finned with pure PCM, unfinned with MF–PCM compos-
ing rate depends on the heating position, and therefore, ite, and finned with MF–PCM composite. The objectives
the effect of free convection inside the PCM must be of the present study are detailed below.
 5942

TABLE 1 Summary of experimental investigation

Maximum
S. PCM type Heat flux/ Dimensions Configurations enhancement
No. Source (M.P. in oC) Temperature (mm3) of the heat sink SPT ( C) ratio Observations
1. Baby and n-Eicosane (36.5) 0.794 to 80 × 62 × 25 0, 3 plate, 72 pin fins 45, 50, 18 Improved operational
Balaji18 2.77 kW/m2 and 55 performance with
heat sink filled with
PCM but the
effectiveness criteria
include TCE and PCM
volume fractions, fin
configurations and
power input.
2. Ali and n-Eicosane (36.5) 0.8 to 114 × 114 × 25 0, 2, 3, and 40, 45, 4.78 Improved result with
Arshad20 2.8 kW/m2 4 mm fins and 50 3 mm pin fin
3. Arshad Paraffin wax (56-58) 1.58 to 114 × 114 × 25 0, 2 and 3 mm fins 60 and 70 2.64 PCM amount and
et al21 3.174 kW/m2 number of fins are
major effectiveness
criteria.
4. Leong Paraffin wax (54.8), 0.81 kW/m2 110 × 110 × 26 0, 9, and 16 cross-fins - - 16 cross-fins heat sinks
et al22 1-Heaxdecanol (50.6) filled with paraffin
wax is more effective
compared to heat sink
filled with
1-hexadecanol.
5. Saha et al27 n-Eicosane (35) 4 and 42 × 42 × 30 3-plate fins and 0, 9, 36, - - 8% volume fraction of
8 kW/m2 81, and 121 pin fins TCE provides better
result.
6. Baby and n-Eicosane (36.5) 0.99 to 80 × 62 × 25 3, 5, and 7 plate fins 45, 50, 15 PCM-based heat sink is
Balaji30 2.78 kW/m2 and 55 not advisable at very
low power level
7. Baby and Paraffin wax 1.587 to 80 × 62 × 25 33, 72, and 120 pin fins 42, 47 24 Pin fins are superior
Balaji31 (53-57) 3.968 kW/m2 and 52 compared to without
n-Eicosane fins. Also, uniform
(36.5) distribution of fins
results in heat transfer
enhancement.
8. Gharbi Paraffin (51.75) 4.7 kW/m2 51.5 × 25.5 × 16.5 No fin, Si matrix, 60 - Well-spaced and long
et al36 graphite matrix, 14 fins provides high
copper fins, 6 copper enhancement ratio
KOTHARI ET AL.

fins

1099114x, 2021, 4, Downloaded from https://onlinelibrary.wiley.com/doi/10.1002/er.6215 by Indian Institute of Technology Indore, Wiley Online Library on [19/01/2025]. See the Terms and Conditions (https://onlinelibrary.wiley.com/terms-and-conditions) on Wiley Online Library for rules of use; OA articles are governed by the applicable Creative Commons License
 TABLE 1 (Continued)

Maximum
S. PCM type Heat flux/ Dimensions Configurations enhancement
No. Source (M.P. in oC) Temperature (mm3) of the heat sink SPT ( C) ratio Observations
KOTHARI ET AL.

9. Mahmoud Paraffin wax 1.2, 1.6, and 50 × 50 × 25 Single cavity, parallel - - Honeycomb insert can
et al37 (42) 2 kW/m2 fin and cross fin, replace machined fin
Honeycomb inserts structures
10. Baby and N-Eicosane 1.984 to 80 × 62 × 25 No fin with metal foam 52 3 Role of orientation is
Balaji38 3.968 kW/m2 insignificant on
thermal performance
of heat sink
11. Fan and Paraffin wax (52-54) 71 C 26 × 14 × 10 No fin with metal foam - - As melting proceeds, the
Jin39 local thermal
nonequilibrium between
PCM and copper
ligament increases
12. Zhang Paraffin (54.43-64.11) 6.208 kW/m2 100 × 100 × 10 No fin with metal foam - - Better heat transfer
et al42 performance using
MF–PCM
13. Zheng Paraffin (50-58) 1.15 kW/m2 100 × 100 × 30 No fin with metal foam - 20.5% shorter melting >Uniformity in
et al49 time of MF–PCM distribution of
than pure paraffin temperature
distribution of the
PCM using MF–PCM
14. Rehman RT-54HC paraffin 0.8, 1.6, 114 × 114 × 25 No fin with metal foam - 26% reduction in base Lesser base temperature
and Ali55 (52–54) 2.4 kW/m2 temperature was obtained with
copper foam–based
heat sink compared to
nickel foam based
heat sink
15. Tauseef-ur- RT-35HC (34-36), RT- 0.8 to 114 × 114 × 25 No fin with metal foam 40, 50 8 RT-35HC and RT-54HC
Rehman 44HC (41-44), RT- 2.4 kW/m2 and 60 provides better
et al58 54HC (53-54), paraffin enhancement at low
wax (56-58) and high heat flux
values, respectively
16. Rehman RT-35HC (34-36) 0.8 to 114 × 114 × 25 No fin with metal foam - 7.88 Low porosity foam
and Ali59 2.4 kW/m2 (copper and iron– provides better
nickel foam) enhancement. Also,
copper foam (95%)
reported higher
enhancement ratio
5943

compared to Iron-
Nickel foam
(Continues)
1099114x, 2021, 4, Downloaded from https://onlinelibrary.wiley.com/doi/10.1002/er.6215 by Indian Institute of Technology Indore, Wiley Online Library on [19/01/2025]. See the Terms and Conditions (https://onlinelibrary.wiley.com/terms-and-conditions) on Wiley Online Library for rules of use; OA articles are governed by the applicable Creative Commons License
 1099114x, 2021, 4, Downloaded from https://onlinelibrary.wiley.com/doi/10.1002/er.6215 by Indian Institute of Technology Indore, Wiley Online Library on [19/01/2025]. See the Terms and Conditions (https://onlinelibrary.wiley.com/terms-and-conditions) on Wiley Online Library for rules of use; OA articles are governed by the applicable Creative Commons License
5944 KOTHARI ET AL.

• Compare thermal performance of various heat sink

thermal performance
obtained with Bi-Pb-
during charging and

Large pore density of

Copper foam having
assemblies such as unfinned with pure PCM, finned

performs better
porosity of 0.95

performance is

MF has higher
Observations with pure PCM, unfinned with MF–PCM composite,

Sn-Cd alloy
discharging
Best thermal
and finned with MF–PCM composite.
• Study the effect of various input heat flux values (1.3,
2.0, and 2.7 kW/m2) on the operating time to achieve
different SPT and base temperature.
• Estimate various thermal performance parameters
such as enhancement ratio and thermal conductance.
• Study the effect of different volume fraction of PCM
enhancement

(0, 0.5, 0.86, and 1) on the operating time to achieve

Maximum

the SPT and base temperature.

• Study the melt front propagation during melting of
ratio

1.53

PCM through photographic observation.

-

2 | EXPERIMENTAL SETUP
47 and 50
SPT ( C)

100

Figure 1A depicts schematic diagram of our test facility

-

for analyzing the thermal performance of PCM-based

No fin with metal foam

No fin with metal foam

heat sink. It consists of numerous modules such as PCM-

(copper foam of 0.95
and 0.97 porosity)

based heat sink assembly, data acquisition system (DAS),

Finned metal foam
of the heat sink
Configurations

thermocouples, DC power supply, and computer. The

schematic of PCM-based heat sink assembly is presented
in Figure 1B. Heat sink assembly comprises of (a) heat
sink enclosure insulated by using ceramic glass wool to
minimize heat losses to the ambient and (b) a plate
heater (Sunrise products, India) with dimension of
100 × 100 mm2 to simulate the heat generated by the
114 × 114 × 25

104 × 104 × 25

120 × 120 × 35
Dimensions

electronic devices, adhered to the base of heat sink. The

maximum heat flux that can be generated by plate heater
(mm3)

is 15.0 kW/m2. A DC power supply (Aplab L3260,

0-32V/0-60A, India) provides necessary electrical power
to the plate heater. Many studies available in the litera-
Temperature

2.4 kW/m2

4.0 kW/m2

3.2 kW/m2
2.0, 3.0 and

2.0, 2.6 and

Heat flux/

ture on thermal management of portable electronic

devices using PCMs have reported the heat flux values
0.8 to

ranging from 0.79 to 4.7 kW/m2 (Table 1). Based on the

literature, the heat flux values such as 1.3, 2.0, and
2.7 kW/m2 have been chosen in the present analysis.
Among other parameters, PCM selection plays a vital
(69.59) and stearic
Paraffin wax (47-57)

Lauric acid (42-44)

role in the design of thermal energy storage system. This

Bi-Pb-Sn-Cd alloy

is because of the fact that PCM melting point must be

acid (68.77)
(M.P. in oC)
PCM type

lesser than the maximum operating temperature of the

component. In addition to this, PCM should have high
(Continued)

specific heat capacity and enthalpy of fusion per unit vol-

ume that can decrease the size of the system. Also, PCM
and Ali60

should be corrosion resistant, chemically stable, and non-

Rehman

et al61

et al62
Source

toxic. In order to obviate the confinement problem of

Huang
Zhao

PCM, the change in volume during phase change and

TABLE 1

vapor pressure at working temperature must be low.

No.

Here, paraffin wax (Sigma Aldrich, USA) with melting

17.

18.

19.
S.

temperature range of 58 C-62 C, thermal conductivity of

 1099114x, 2021, 4, Downloaded from https://onlinelibrary.wiley.com/doi/10.1002/er.6215 by Indian Institute of Technology Indore, Wiley Online Library on [19/01/2025]. See the Terms and Conditions (https://onlinelibrary.wiley.com/terms-and-conditions) on Wiley Online Library for rules of use; OA articles are governed by the applicable Creative Commons License
KOTHARI ET AL. 5945

0.21 W/m-K (solid), and density of 900 kg/m3 (solid) is lower thermal conductivity (two times lower than cop-
used as PCM. Different volume fractions of PCM such as per) but also has lower density (three times lower than
(a) ψ = 0, 0.50, 0.86, and 1 for unfinned and finned heat aluminum), which makes it suitable for thermal manage-
sink with pure PCM, (b) ψ = 0.90 for unfinned heat sink ment applications. In the present investigation, E350
with MF–PCM composite, and (c) ψ = 0.86 for finned CNC milling machine (Emcomill E350, Emco group,
heat sink with MF–PCM composite are used in this study Austria) has been used to fabricate the heat sinks. Mate-
to investigate the effect of PCM volume fractions on dif- rial is removed from the heat sink with help of HSS end
ferent configurations of heat sinks. Earlier, Ganatra mill cutter (Addision & Co. Ltd., Chennai, India) with
et al63 utilized paraffin wax (Sigma Aldrich, USA) in their 10 mm diameter and 22 mm cutting edge length.
experimental investigation. The thermophysical proper- Figure 2 shows the photographs of various heat sinks
ties of paraffin wax (PCM), aluminum (TCE), plexiglass used in this investigation. Plate heater having same
(heat sink enclosure), and ceramic glass wool (insulator) dimensions and 4 mm thickness is attached at the heat
are summarized in Table 2. sink base. Each heat sink assembly is enclosed with
transparent plexiglass sheet of 5 mm thickness, which
acts as an insulator. Similar plexiglass sheet is used to
2.1 | Heat sink configurations cover the heat sink from the top. A gap of 2 mm is
maintained between the heat sink and top plexiglass sur-
The overall internal dimensions of each heat sink of face to allow volume expansion of PCM. All four side
100 × 100 × 22 mm3 are kept constant in this study. walls, bottom surface of heater, and top surface of heat
Here, aluminum is selected as the material for heat sink sink are again insulated with ceramic glass wool of thick-
due to its low density, good thermal conductivity, corro- ness 25 mm to minimize heat losses from test assembly.
sion resistant, and light weight. Although aluminum has Various configurations of heat sinks such as pure

F I G U R E 1 A, Schematic of experimental setup. B, Schematic of PCM-based heat sink assembly [Colour figure can be viewed at
wileyonlinelibrary.com]
 1099114x, 2021, 4, Downloaded from https://onlinelibrary.wiley.com/doi/10.1002/er.6215 by Indian Institute of Technology Indore, Wiley Online Library on [19/01/2025]. See the Terms and Conditions (https://onlinelibrary.wiley.com/terms-and-conditions) on Wiley Online Library for rules of use; OA articles are governed by the applicable Creative Commons License
5946 KOTHARI ET AL.

TABLE 2 Thermophysical properties of paraffin wax, TCE, and insulator

Properties Paraffin wax (PCM) Aluminum (TCE) Plexiglass Ceramic glass wool

Melting temperature ( C) 58–62 (Datasheet) 660.37 - -
61.5
(DSC curve)
Latent heat (kJ/kg) 194.2 - - -
Specific heat (kJ/kg-K) 2.89 0.896 1.470 -
3
Density (kg/m ) 750 (liquid) 2719 - 128
900 (solid)
Thermal conductivity (W/m-K) 0.12 (liquid) 218 0.19 0.12
0.21 (solid)

record temperature during the experiments. The diameter

of the bare Chromel–Alumel wire is 0.19 mm. The bare
wires are Teflon sheathed, and the entire assembly is
insulated with Teflon and leads to an overall diameter of
1.5 mm. Araldite epoxy resin is applied to mount the
thermocouples at different location. The thermocouple
location in various positions in the heat sink is presented
in Figure 4. Three thermocouples T1, T2, and T3 are fixed
at the junction of heater and heat sink. Thermocouples
T4 to T6 are fixed at the three-side walls, and T7 is placed
at the top surfaces of heat sink enclosure. Thermocouples
T8 to T10 are placed over the side wall insulations, and
T11 and T12 are placed over top and bottom insulations
to analyze the heat losses after the insulation. T13 is used
to record the temperature of environment. The exact
position of each thermocouple for different heat sink con-
figurations is summarized in Table 4. Each thermocouple
is connected to laptop through DAS (Agilent 34972A,
USA). The readings of thermocouples are recorded after
every 10 seconds.

2.3 | Uncertainty in measurement

F I G U R E 2 Photographs of various heat sinks used in this
investigation. A, One fin. B, Two plate fin. C, Three plate fins. Temperature at different positions of heat sink assem-
D, Four plate fins. E, Four plate fins [Colour figure can be viewed bly is measured using precalibrated Chromel–Alumel
at wileyonlinelibrary.com] K-type thermocouples. The thermocouples are cali-
brated for the temperature range of 0 C-100 C follow-
PCM-based-unfinned heat sink, pure PCM-based-finned ing the ASTM standards,64 and the error in
heat sink, MF–PCM composite–based unfinned heat sink, measurement of temperature is found to be ±0.2 C.
and MF–PCM composite–finned heat sink are used in this Standard calibrated multimeter is used to verify the
study. Figure 3 shows the plate fin heat sinks with different readings of current and voltage measurements dis-
dimensions and Table 3 summarizes the dimensions of fins. played by DC power source. The errors in current and
voltage measurements are calculated as ±0.1 A and
±0.1 V, respectively. The procedure given in Reference
2.2 | Thermocouple position 65 has been used to obtain the uncertainty in measure-
ment of heat flux and is found as ±6.02%. Table 5
Thirteen Chromel–Alumel K-type thermocouples are shows the uncertainty in measured and estimated
located at various positions of heat sink assembly to parameters.
 1099114x, 2021, 4, Downloaded from https://onlinelibrary.wiley.com/doi/10.1002/er.6215 by Indian Institute of Technology Indore, Wiley Online Library on [19/01/2025]. See the Terms and Conditions (https://onlinelibrary.wiley.com/terms-and-conditions) on Wiley Online Library for rules of use; OA articles are governed by the applicable Creative Commons License
KOTHARI ET AL. 5947

F I G U R E 3 Dimensions of various plate fin heat sinks: A, one fin, B, two fins, C, three fins, D, four fins (fin thickness 1.06 mm), and E,
four fins (fin thickness 1.59 mm)

T A B L E 3 Fin dimensions for

Heat sink Total volume fraction Volume fraction Dimensions of
different configurations of heat sink configurations of TCE (%) of fins (%) fin (mm3)
One fin 13.825 4.25 100 × 4.25 × 20
Two fin 100 × 2.12 × 20
Three fin 100 × 1.41 × 20
Four fin 100 × 1.06 × 20
Four fin 15.825 6.38 100 × 1.59 × 20

2.4 | Fabrication of metallic foam investigation. The microscopic picture of MF used in this
samples investigation is presented in Figure 5. The copper foam
sample purchased from Nanoshel LLC, USA, in the form
An open-cell copper foam (Nanoshel LLC, USA) having of block is cut into precise geometry with the help of
pore size 10 PPI and 90% porosity is used in the present sharp blade band saw within the tolerance limits of
 1099114x, 2021, 4, Downloaded from https://onlinelibrary.wiley.com/doi/10.1002/er.6215 by Indian Institute of Technology Indore, Wiley Online Library on [19/01/2025]. See the Terms and Conditions (https://onlinelibrary.wiley.com/terms-and-conditions) on Wiley Online Library for rules of use; OA articles are governed by the applicable Creative Commons License
5948 KOTHARI ET AL.

+0.1 mm. After the cutting of foam pieces into required PCM is premelted for 24 hours at 105 C, simultaneously;
geometry, the lateral surfaces are smoothed using a liquid PCM is dried and degassed. The MF–PCM composite
sander. The copper foam pieces are then cleaned with is prepared by liquid infiltration process. In this process, the
acetone, ethanol, and water and placed in vacuum oven copper foam pieces are immersed in liquid PCM under a
for 72 hours at 105 C for drying. Subsequently, the pieces vacuum environment that ensures the removal of
are cooled down to ambient temperature before use. entrapped air bubbles from the liquid PCM. Later on, the
PCM–copper foam composite is allowed to solidify till it
attains the environmental temperature. The precise geome-
try of PCM and copper foam composite having same
dimensions as copper foam pieces is obtained by removing
extra PCM surrounded in the copper foam pieces. Identical
process was adopted by Fan and Jin39 to obtain MF–PCM
composite. Thermal paste (OT-201, OMEGATHERM,
Omega India) having thermal conductivity of 2.30 W/m-K
is employed to bond the foam to the base and fin surface.
Thermal paste minimizes the thermal resistance between
MF-fin and MF-heat sink base interfacial surfaces. Because
of high cost associated with the brazing of MF with heat
sinks, the foam is pressed forcibly between the fin gaps so
that good contact can be ensured between all the surfaces.
Similar procedure was reported by Baby and Balaji38 and
Bhattacharya and Mahajan56 in their experimental investi-
gations. Figure 6 shows the photographic view of four-
finned MF heat sink without PCM.

3 | CHAR AC TER IZ ATION OF TCE

AND PC M

3.1 | SEM analysis of aluminum

Different grades of aluminum are available in the market.

FIGURE 4 A, Isometric and B, top views of location of Therefore, it is required to observe the metallurgical com-
thermocouples on heat sink positions of the material of heat sink and TCE before its

TABLE 4 Thermocouples location on respective walls

Thermo- Height from bottom of heat Position from side Location on Location on the heat sink
couple sink (mm) walls walls assembly
T1 0.75 25 × 50 mm2 Base Heat sink surface
T2 0.75 25 × 50 mm2 Base Heat sink surface
T3 0.75 25 × 50 mm 2
Base Heat sink surface
T4 15 50 mm Side 1 Heat sink surface
T5 20 25 mm Side 2 Heat sink surface
T6 25 50 mm Side 3 Heat sink surface
T7 32 50 × 50 mm 2
Top Heat sink surface
T8 15 10 mm Side 1 Insulation
T9 20 15 mm Side 2 Insulation
T10 25 20 mm Side 3 Insulation
T11 32 50 × 50 mm 2
Top Insulation
T12 25 (Downward) 50 × 50 mm 2
Base Insulation
 1099114x, 2021, 4, Downloaded from https://onlinelibrary.wiley.com/doi/10.1002/er.6215 by Indian Institute of Technology Indore, Wiley Online Library on [19/01/2025]. See the Terms and Conditions (https://onlinelibrary.wiley.com/terms-and-conditions) on Wiley Online Library for rules of use; OA articles are governed by the applicable Creative Commons License
KOTHARI ET AL. 5949

TABLE 5 Uncertainty in measurement

Quantity measured Uncertainty

Temperature ±0.2 C
Voltage ±0.1 V
Current ±0.1 A
Length ±0.02 mm
Heat flux ±6.02%

F I G U R E 7 Metallurgical composition of heat sink and TCE

material [Colour figure can be viewed at wileyonlinelibrary.com]

Figure 7 shows peak of the elements present in the mate-

rial. It has been observed from the SEM analysis that the
heat sink and TCE material used in this investigation is
almost pure aluminum.

3.2 | DSC analysis of paraffin wax

F I G U R E 5 Microscopic image of metallic foam (10 PPI) Here, latent heat, and melting temperature of the PCM
[Colour figure can be viewed at wileyonlinelibrary.com] are determined using differential scanning calorimeter
(DSC). Figure 8 shows the DSC heating curve of paraffin
wax obtained by using DSC214 Polyma (Netzch, Ger-
many). The DSC thermal analysis is performed in the
temperature range of 30 C to 80 C with the heating rate
of 20 C/min. Two peaks are obtained during the endo-
thermic melting of PCM. The phase change of solid to liq-
uid (ie, melting) is identified as a primary peak that
occurs at higher temperature of 60 C. The solid–solid
phase change is presented by secondary peak that occurs
at lower temperature of 40 C. It may be noted from the
curve that the onset and peak point of melting are mea-
sured as 50 ± 0.5 C and 61 ± 0.5 C, respectively. The
melting of PCM occurs between this two temperature
points. Also, the primary peak value is in agreement with
the value specified by the supplier.

4 | DATA REDUCTION

F I G U R E 6 Photograph of heat sinks with four-plate fins used Various parameters are used to explain the thermal perfor-
in this study [Colour figure can be viewed at mance of heat sinks. These include volume fraction of PCM
wileyonlinelibrary.com] (ψ), enhancement ratio of the heat sink with TCE (ε),
enhancement ratio of heat sink with MF composite (ϕ), and
manufacturing. Energy dispersive X-ray spectroscopy thermal conductance of PCM-based heat sinks (G). The
(EDX) analysis is done using the field-emission scanning criteria for evaluation of various parameters are elaborated
electron microscope (FE-SEM, Supra55 Zeiss, Germany). below.
 1099114x, 2021, 4, Downloaded from https://onlinelibrary.wiley.com/doi/10.1002/er.6215 by Indian Institute of Technology Indore, Wiley Online Library on [19/01/2025]. See the Terms and Conditions (https://onlinelibrary.wiley.com/terms-and-conditions) on Wiley Online Library for rules of use; OA articles are governed by the applicable Creative Commons License
5950 KOTHARI ET AL.

The volume fraction (ψ) is described as the ratio of

volume of PCM filled inside the heat sink to the differ-
ence between the total volume of heat sink and volume
occupied by the fins20 and can be expressed as:

V PCM
ψ= : ð1Þ
V s −V f

The enhancement ratio of heat sink with TCE is

described as ratio of time taken to attain a critical set
point temperature (SPT) by the PCM-based heat sink
with TCE to PCM-based heat sink without TCE.20 This
can be expressed as:

t cr with TCE
ε= : ð2Þ
t cr without TCE

In addition to this, the enhancement ratio of heat

sink with MF (ϕ) is described as the time taken to attain
a critical SPT by MF–PCM composite–based heat sink to
heat sink without MF–PCM composite and is
expressed as:

t cr with MF −PCM
ϕ= : ð3Þ
t crwithout MF −PCM

Thermal conductance (G) of PCM-based heat sink is

described as the amount of heat exchange from the heat
sink surface.20,36

P F I G U R E 9 Comparison of temperature of heat sink base

G= : ð4Þ
T max −T amb obtained from present results with the existing results for A,
without PCM and B, with PCM-based heat sinks [Colour figure can
be viewed at wileyonlinelibrary.com]

F I G U R E 1 0 Comparison of time–temperature distribution of

FIGURE 8 Differential scanning calorimeter heating of base temperature for unfinned heat sink without and with PCM at
paraffin wax 2.0 kW/m2 [Colour figure can be viewed at wileyonlinelibrary.com]
 1099114x, 2021, 4, Downloaded from https://onlinelibrary.wiley.com/doi/10.1002/er.6215 by Indian Institute of Technology Indore, Wiley Online Library on [19/01/2025]. See the Terms and Conditions (https://onlinelibrary.wiley.com/terms-and-conditions) on Wiley Online Library for rules of use; OA articles are governed by the applicable Creative Commons License
KOTHARI ET AL. 5951

FIGURE 11 Time–temperature distribution filled with different ψ at 2.0 kW/m2 for different configuration of heat sinks: A,
Unfinned, B, one-finned, C, two-finned, D, three-finned, and E, four-finned heat sinks [Colour figure can be viewed at
wileyonlinelibrary.com]

5 | R ES U L T S A N D D I S C U S S I O N Arshad et al,21 Mahmoud et al,37 Tauseef‑ur‑Rehman

and Ali,55,59,60 and Tauseef-ur-Rehman et al58 (Figure 9A,
5.1 | Comparison of present results B). Most of the studies consider heat sink having dimen-
sion of 100 × 100 × 25 mm3,55,58-62 and the heat flux
In order to validate present experimental results, the base values are varied between 1.3 and 3.0 kW/m2. Most
temperature (Tb) of the heat sink obtained from the pre- of these studies consider paraffin wax with melting tem-
sent experimental study is compared with the test data of perature range varying between (47 C and 57 C),55,60
 1099114x, 2021, 4, Downloaded from https://onlinelibrary.wiley.com/doi/10.1002/er.6215 by Indian Institute of Technology Indore, Wiley Online Library on [19/01/2025]. See the Terms and Conditions (https://onlinelibrary.wiley.com/terms-and-conditions) on Wiley Online Library for rules of use; OA articles are governed by the applicable Creative Commons License
5952 KOTHARI ET AL.

F I G U R E 1 2 Time–temperature distribution at different input heat flux for different heat sinks: A, unfinned, B, one-finned, C, two-
finned, D, three-finned, and E, four-finned heat sinks [Colour figure can be viewed at wileyonlinelibrary.com]

(56 C-58 C)21,58,59 for the analysis. Studies also consider Aldrich, USA) having melting point of 58 C-62 C has
Rubitherm RT-42 with melting temperature of 42 C,37 been used. Comparison of present test results with avail-
stearic acid with melting temperature of 68.77 C61 and able experimental results21,37,55,58-62 for unfinned heat
lauric acid with melting temperature varying between sink without PCM and with PCM are shown in
42 C and 44 C62 for the analysis. The initial temperature Figure 9A,B, respectively. It can be seen from the figures
of PCM was varied between 20 C and 30 C in these that base temperature of heat sink obtained from the pre-
studies.21,37,55,58-62 sent study follows similar pattern as reported by various
In the present investigation, heat sink having dimen- researchers.21,37,55,58-62 However, the variation in the
sions of 100 × 100 × 22 mm3 and paraffin wax (Sigma results obtained from the present experimental
 1099114x, 2021, 4, Downloaded from https://onlinelibrary.wiley.com/doi/10.1002/er.6215 by Indian Institute of Technology Indore, Wiley Online Library on [19/01/2025]. See the Terms and Conditions (https://onlinelibrary.wiley.com/terms-and-conditions) on Wiley Online Library for rules of use; OA articles are governed by the applicable Creative Commons License
KOTHARI ET AL. 5953

F I G U R E 1 3 Photographs of the melt front propagation for different configurations of pure PCM-based heat sinks [Colour figure can be
viewed at wileyonlinelibrary.com]

investigation with the existing test results may be due to 1500 and 1820 seconds for heat sink without and with
the change in the heat sink design, the melting point PCM, respectively. The surface temperature is found to
temperature of PCM, and starting temperature of PCM in increase quickly for heat sink without PCM, which is not
the experimental investigation. desirable and has adverse effect on the life of portable
electronic components. The heat sink with PCM exhibits
sharp rise in temperature for initial 520 seconds. This
5.2 | Base line comparison shows the sensible heating phase. The temperature rise
takes place gradually during 520 to 1750 seconds. The
The comparison of Tb for the unfinned heat sink with PCM starts to melt during this period, and it is the latent
00
PCM and without PCM at q = 2.0 kW/m2 is shown in heating stage. It may be noted that extending the latent
Figure 10. The average value of temperature recorded by heating period and maintaining a constant temperature
thermocouples T1, T2, and T3 is considered as Tb. The during this phase is the key point for the thermal man-
time taken to attain Tb = 60 C is found to be 920 and agement. It can be noted that even in case of heat sink
1130 seconds for heat sink without and with PCM, with PCM, the temperature rise takes place during latent
respectively. While, to reach a higher Tb of 70 C, it takes heating period.
 1099114x, 2021, 4, Downloaded from https://onlinelibrary.wiley.com/doi/10.1002/er.6215 by Indian Institute of Technology Indore, Wiley Online Library on [19/01/2025]. See the Terms and Conditions (https://onlinelibrary.wiley.com/terms-and-conditions) on Wiley Online Library for rules of use; OA articles are governed by the applicable Creative Commons License
5954 KOTHARI ET AL.

FIGURE 14 Time–temperature distribution of different configurations of heat sinks at 2.0 kW/m2 for A, ψ = 0.50, B, ψ = 0.86, and C,
ψ = 1 [Colour figure can be viewed at wileyonlinelibrary.com]

5.3 | Effect of PCM volume fraction The latent heating phase time duration is found to
decrease with the rise in the input heat flux. A closer look
Figure 11A-E compare the value of Tb for various config- at four-finned MF–PCM-based heat sink revealed that for
00
urations; namely, unfinned, one-finned, two-finned, q = 1.3 kW/m2, the latent heating phase is continuous
three-finned, and four-finned heat sinks for different even after 6000 seconds of heating and Tb is recorded as
00
PCM volume fractions (ψ = 0, 0.50, 0.86, 1) and MF– 59.8 C. On the contrary, for q = 2.0 kW/m2, the latent
00
PCM composite at q = 2.0 kW/m2. The variation in tem- heat phase ends at 4000 seconds. While, for
00
perature follows a similar trend for all the configuration q = 2.7 kW/m2, the time duration for completion of
of heat sink. Tb is found to increase rapidly for ψ = 0 in latent heating phase is only 2970 seconds, after that tem-
all the cases. It is because of the absence of PCM in heat perature increases rapidly. It is evident from the figures
sink. It is noticed that the combination of TCE and PCM that PCM-based heat sinks are less advantageous at lower
provides better thermal performance. The extension of heat flux. This may be due to nonutilization of entire
latent heat phase is significant for heat sinks with four latent heat of PCM at lower heat flux. However, for
00
fins compared to other configurations. Also, the heat sink higher input heat flux values (q = 2.0 to 2.7 kW/m2),
with MF–PCM is found to exhibit better thermal perfor- where majority of portable electronic devices operate, Tb
mance compared to other configurations. Lower value of for heat sink without PCM quickly reaches to
Tb is obtained in case of four-finned heat sink at uncomfortable zone.
00
q = 2.0 kW/m2.

5.5 | Photographic evaluation of pure

5.4 | Effect of heat flux PCM-based heat sink

The variation of Tb for different heat sinks with various Melt front propagation of pure PCM with and without
00
heat flux values (q = 1.3, 2.0 and 2.7 kW/m2) for a given finned heat sink at different time steps are presented in
PCM volume fraction (ψ = 0.86) is shown in Figure 12. Figure 13. This would help to understand the heat
 1099114x, 2021, 4, Downloaded from https://onlinelibrary.wiley.com/doi/10.1002/er.6215 by Indian Institute of Technology Indore, Wiley Online Library on [19/01/2025]. See the Terms and Conditions (https://onlinelibrary.wiley.com/terms-and-conditions) on Wiley Online Library for rules of use; OA articles are governed by the applicable Creative Commons License
KOTHARI ET AL. 5955

F I G U R E 1 5 Time to attain
00
SPT at q = 1.3, 2.0, and
2.7 kW/m2 for ψ = 0.86, A, 65 C
and B, 70 C

transfer mechanism during the phase change operation unfinned heat sink, conduction remains prominent
in the heat sink. Digital camera (Sony RX10 MII) is used mode of heat transfer for initial time duration. As the
to take the images of the melt front propagation. The time progress, the interface of solid–liquid moves away
photographs are taken at every 10 minutes intervals, from the fin and base surface. In such a case, free con-
starting after 30 minutes from the start of experiment at vection starts to dominate the heat transfer process.
2.0 kW/m2 and ψ = 0.86. The photographs show the PCM is heated from both the surfaces such as fin and
black and white colors that represent the liquid and solid base which in turn increases the thickness of melted
phases of the PCM, respectively. For PCM-based layer. Also, the thickness of liquid PCM is found to
unfinned heat sink, it can be seen that the melt front decrease along the fin length. It is observed that higher
moves parallel to the hot surface which reveals that con- rate of melting takes place at the fin base compared to
duction is the prominent mode of transfer of heat within its tip. This may be because of the gradient of tempera-
the thin liquid layer. With the progress of time, the influ- ture along the fin length. Further, it may be noted that
ence of free convection increases, and waviness is devel- the interface shape remains symmetric to both the
oped at the interface due to the generation of three- sides of the fin due to the equal convective currents on
dimensional Benard convection cells in the liquid PCM.66 both the sides of the fins. It may be noted from the fig-
In case of finned heat sinks, the heat transfer from ure that melting rate increases with the increase in
the fin is directed by a continuous thermal boundary number of fins (zero to three fins) due to enhanced sur-
layer starting from the base and ending at the fin tip. Like face area. However, the melting rate decreases with the
 1099114x, 2021, 4, Downloaded from https://onlinelibrary.wiley.com/doi/10.1002/er.6215 by Indian Institute of Technology Indore, Wiley Online Library on [19/01/2025]. See the Terms and Conditions (https://onlinelibrary.wiley.com/terms-and-conditions) on Wiley Online Library for rules of use; OA articles are governed by the applicable Creative Commons License
5956 KOTHARI ET AL.

However, in case of MF–PCM, Tb is lower compared to

pure PCM cases. As the time progresses, Tb increases and
arrives at the PCM melting temperature. Subsequently,
the melting of PCM takes place. The phase change pro-
cess is dominated by two factors, namely, free convection
and heat conduction inside molten PCM. Conduction
dominated heat transfer occurs in MF–PCM composite as
the liquid PCM remains constrained in the MF pore,
which suppresses the natural convection and increases
the melting rate. This results in the lower value of Tb and
therefore suitable for better thermal management of MF–
PCM-based heat sinks compared to other configurations.
It may also be noted that four-finned heat sink main-
tains the value of Tb lower for extended duration com-
pared to unfinned heat sink at 2.0 kW/m2; this is due to
uniformity in PCM melting with the presence of TCE
(fins). Also, aluminum (218 W/m-K) has higher thermal
conductivity of about 20 times that of MF (10.1 W/m-K).
Therefore, fins made of solid aluminum inserted between
MF results in the increase in dissipation of heat by con-
duction. Also, greater heat transfer surface area is found
to be in contact with MF in case of four-finned MF–PCM
(base and fins) compared to unfinned heat sink
00
(only base).
FIGURE 16 Time to attain SPT at q = 1.3, 2.0, and
2.7 kW/m for different values of ψ in four-finned heat sink case, A,
2

65 C and B, 70 C

5.7 | Enhancement in operating time for
different critical SPTs
increases in number of fins from three to four fins; this
may be because higher number of fins create obstruc- The thermal performance of various heat sink configura-
tion in the path of circulation currents and decrease tions at two different critical SPTs (65 C and 70 C) for
00
the heat transfer rate. On comparing various heat varied range of heat flux values (q = 1.3, 2.0, and
sinks, it can be inferred that the rate of transfer of heat 2.7 kW/m2) is studied. The critical SPT is the maximum
is more for three-finned heat sink and also uniform operating temperature of electronic components above
melting is achieved with more number of fins. which the component may fail due to higher tempera-
ture. Figure 15A,B show the time to attain SPT of 65 C
and 70 C by various configurations of heat sinks for var-
5.6 | Effect of different heat sink ied range of input heat flux values at ψ = 0.86. It is evi-
configuration dent from the figures that operating time decreases with
00
the rise in q for a fixed value of SPT. Four-finned MF–
Figure 14 depicts the comparison of Tb for different heat PCM heat sink takes higher time compared to other con-
00
sink configurations with varied range of PCM volume figurations of heat sinks for q = 1.3 and 2.0 kW/m2.
00
fractions at q = 2.0 kW/m2. It may be seen from the fig- Three-finned MF–PCM heat sink takes higher time com-
ure that significant reduction in Tb is obtained with dif- pared to other configurations of heat sinks for
00
ferent ψ (0.5, 0.86, and 1). For ψ = 0.86, the time taken q = 2.7 kW/m2. The maximum value of enhancement in
by different heat sinks such as unfinned with PCM, four operating time for a given heat sink assembly depends on
finned with PCM, and four finned with MF–PCM com- the input heat flux values. The four-finned MF–PCM
posite to attain a set point temperature of 65 C is found takes maximum time of 125.33 and 138.67 minutes
to be 1420, 3120, and 4130 seconds, respectively. The to attain SPT of 65 C and 70 C, respectively, at
00 00
entire melting process is categorized into three regions, q = 1.3 kW/m2. For q = 2.7 kW/m2, three-finned MF–
namely, solid, partially molten, and completely molten. PCM heat sink takes maximum time of 45.83 and
Initially in solid region, the value of Tb for all the cases 54.16 minutes to attain SPT of 65 C and 70 C,
increases rapidly due to premelting sensible heat storage. respectively.
 1099114x, 2021, 4, Downloaded from https://onlinelibrary.wiley.com/doi/10.1002/er.6215 by Indian Institute of Technology Indore, Wiley Online Library on [19/01/2025]. See the Terms and Conditions (https://onlinelibrary.wiley.com/terms-and-conditions) on Wiley Online Library for rules of use; OA articles are governed by the applicable Creative Commons License
KOTHARI ET AL. 5957

F I G U R E 1 7 Enhancement
00
ratio at q = 1.3, 2.0, and
2.7 kW/m2 and ψ = 0.86 for
different SPT A, 65 C and B,
70 C [Colour figure can be
viewed at
wileyonlinelibrary.com]

to attain the SPT value of 65 C and 70 C. While, for

00
lower value of input heat flux (q = 1.3 kW/m2), four-
finned heat sink with pure PCM takes more time to
attain the SPT value of 65 C and 70 C. It may be inferred
that it is useful to use MF–PCM-based heat sink for elec-
tronic components cooling at higher input heat flux (2.0
and 2.7 kW/m2), which is a working range of most of the
electronic components.

5.8 | Enhancement ratio for different

heat sink configuration and heat flux
F I G U R E 1 8 MF–PCM composite enhancement ratio at values
00
q = 1.3, 2.0, 2.7 kW/m2 for four-finned MF–PCM at ψ = 0.86
[Colour figure can be viewed at wileyonlinelibrary.com] Enhancement in operating time to reach critical SPT is
expressed as enhancement ratio and is defined by Equa-
tion (2). Figure 17A,B represent the enhancement ratio of
Thermal performance of four-finned heat sink for dif- various heat sink configurations to attain the critical SPT
ferent ψ to attain SPT of 65 C and 70 C is shown in of 65 C and 70 C. The enhancement ratio for specific
00
Figure 16A,B. It may be noted that for q = 2.0 and SPT is found to depend on the heat flux value. Four-
2.7 kW/m2, MF–PCM-based heat sink takes longer time finned MF–PCM exhibits maximum value of
 1099114x, 2021, 4, Downloaded from https://onlinelibrary.wiley.com/doi/10.1002/er.6215 by Indian Institute of Technology Indore, Wiley Online Library on [19/01/2025]. See the Terms and Conditions (https://onlinelibrary.wiley.com/terms-and-conditions) on Wiley Online Library for rules of use; OA articles are governed by the applicable Creative Commons License
5958 KOTHARI ET AL.

F I G U R E 1 9 Thermal
conductance of various heat
sink configurations for different
heat flux values at ψ = 0.86

highest enhancement ratio of 2.97 is achieved for four-

finned MF–PCM heat sink and three-finned MF–PCM
00
heat sink at q = 1.3 and 2.7 kW/m2, respectively. The
thermal performance is found to be better at lower value
of SPT due to rapid increase in temperature in the post-
melting region. This phenomenon has been observed in
earlier research studies as well.20
The influence of different values of SPT (65 C and
70 C) on enhancement ratio of MF–PCM composite heat
sink (ϕ) for varied range of heat flux values at ψ = 0.86 is
shown in Figure 18. The enhancement ratios shown in
Figure 18 are estimated based on Equation (3). It is
00
observed that for q = 1.3 and 2.0 kW/m2, the value of ϕ
is highest at lower value of SPT. Also, ϕ decreases with
00
the increase in value of SPT. While, for q = 2.7 kW/m2,
ϕ is found to be higher for SPT of 70 C. At higher value
of heat flux, the enhancement ratio is higher for higher
value of SPT. This is due to the forward shifting in the
latent heating phase at higher heat flux.

5.9 | Comparison of thermal

00
conductance
FIGURE 20 Time to attain SPT at q = 1.3, 2.0, and
2.7 kW/m2 for different ξ in four-finned heat sink case, A, 65 C The thermal performance of a heat sink can be defined
and B, 70 C based on the thermal conductance (G). Here, G denotes
the rate of heat transfer per unit temperature difference
from the heat sink surface through the TCE/PCM and is
00
enhancement ratio for q = 1.3 and 2.0 kW/m2 to achieve expressed in Equation (4). Figure 19 depicts the thermal
SPT = 65 C. While, three-finned MF–PCM shows conductance values of different configurations of heat
the maximum value of enhancement ratio at sink assemblies for varied range of input heat flux values.
00
q = 2.7 kW/m2. For SPT of 65 C, the enhancement ratio Four-finned MF–PCM composite heat sink exhibits the
00
is more at q = 1.3 kW/m2. However, for SPT of 70 C, best thermal conductance value compared to other con-
00 00
higher enhancement ratio is obtained at q = 2.7 kW/m2. figurations of heat sink for the q = 1.3 and 2.0 kW/m2.
00
This may be due to the different time spans of latent While, for q = 2.7 kW/m2, three-finned heat sink pro-
heating phase of PCM at different heat flux values. The vides higher thermal conductance compared to other
 1099114x, 2021, 4, Downloaded from https://onlinelibrary.wiley.com/doi/10.1002/er.6215 by Indian Institute of Technology Indore, Wiley Online Library on [19/01/2025]. See the Terms and Conditions (https://onlinelibrary.wiley.com/terms-and-conditions) on Wiley Online Library for rules of use; OA articles are governed by the applicable Creative Commons License
KOTHARI ET AL. 5959

F I G U R E 2 1 Enhancement
ratio at different heat flux of 1.3,
2.0, and 2.7 kW/m2 for different
ξ and SPT of A, 65 C and B,
70 C [Colour figure can be
viewed at
wileyonlinelibrary.com]

configurations of heat sinks. Also, it is noticed that finned is found to decrease with the rise in input heat flux for a
00
MF–PCM-based heat sink assembly exhibits improved given SPT. At q = 1.3 kW/m2 and TCE volume fraction
thermal performance in comparison to the heat sink with (ξ) of 13.825%, the time taken to attain SPT of 65 C is
fin–PCM combination. The overall highest thermal con- found to be 98.5 and 125.33 minutes for four-finned heat
ductance value is obtained for three-finned MF–PCM- sink with PCM and four-finned heat sink with MF–PCM,
00 00
based heat sink at q = 2.7 kW/m2. respectively. While, for q = 1.3 kW/m2 and ξ = 15.825%,
the time taken to attain SPT of 65 C is found to be 77.67
and 122.67 minutes for four-finned heat sink with PCM
5.10 | Effect of volume fraction of TCE and four-finned heat sink with MF–PCM, respectively.
00
on enhancement in operating time and The time to attain SPT of 70 C for q = 1.3 kW/m2 and
enhancement ratio ξ = 15.825% is found to be 119 and 138.67 minutes
for four-finned heat sink with PCM and four-finned
Figure 20A,B depict the operating time needed to attain heat sink with MF–PCM, respectively. While, at
00
different SPTs (65 C and 70 C) for the four-finned heat q = 1.3 kW/m2 and ξ = 15.825%, the time taken to attain
sink assembly with various TCE volume fractions as well SPT of 70 C is found to be 105.5 and 135.33 minutes for
00
as varied range of TCE and q values. The operating time four-finned heat sink with PCM and four-finned heat
 1099114x, 2021, 4, Downloaded from https://onlinelibrary.wiley.com/doi/10.1002/er.6215 by Indian Institute of Technology Indore, Wiley Online Library on [19/01/2025]. See the Terms and Conditions (https://onlinelibrary.wiley.com/terms-and-conditions) on Wiley Online Library for rules of use; OA articles are governed by the applicable Creative Commons License
5960 KOTHARI ET AL.

sink with MF–PCM, respectively. This may be due to the heat flux value. Highest operating time and
slight decrease in volume fraction of MF and PCM with enhancement ratio are obtained for four-finned MF–
the increase in the volume fraction of fins. PCM heat sink compared to other configurations of
00
The enhancement ratios of two different heat sink heat sink for q = 1.3 and 2.0 kW/m2. While, for
00
assemblies such as four-finned heat sink with PCM q = 2.7 kW/m2, three-finned heat MF–PCM-based
and four-finned MF–PCM-based heat sink for varied heat sink shows better performance.
00
range of q are shown in Figure 21A,B. The results are 5. Enhancement in operating time is found to vary with
shown for heat sink assemblies to achieve the SPT the value of SPT and heat flux values. At SPT of 65 C,
value of 65 C and 75 C. It may be noted that for SPT enhancement is more at lower heat flux of 1.3 kW/m2.
of 65 C, MF–PCM with ξ = 13.852% shows better However, at higher SPT of 70 C, greater enhancement
enhancement ratio compared to MF–PCM with is obtained at 2.7 kW/m2.
ξ = 15.852%. While, PCM-based heat sink associated 6. The highest enhancement ratio of 2.97 is achieved
with ξ = 13.852% exhibits better enhancement ratio for four-finned MF–PCM heat sink and three-finned
00
compared to PCM-based heat sink with ξ = 15.852%. MF–PCM heat sink at q = 1.3 and 2.7 kW/m2, respec-
00
At q = 1.3 kW/m 2 and SPT of 70 C, MF–PCM with tively. Also, three-finned heat sink provides higher
ξ = 13.852% exhibits the best value of enhancement heat transfer rate and highest thermal conductance at
00
ratio compared to other fin configurations. While for q = 2.7 kW/m2.
00
q = 2.0 and 2.7 kW/m2 , MF–PCM with ξ = 13.852%
shows same enhancement ratio as MF–PCM with
ξ = 15.852%. PCM-based heat sink associated with NOMENCLATURE
ξ = 13.852% exhibits better enhancement ratio com-
pared to PCM-based heat sink with ξ = 15.852% at all DSC 
Differential scanning calorimeter 
the heat flux values. G Thermal Conductance (W/K) T max −P T amb
MF Metallic foam
P Power (W)
6 | C ON C L U S I ON S PCM Phase change material
00
q Heat flux (kW/m2)
In this study, an experimental investigation is performed SPT Set point temperature ( C)
for various input heat flux (1.3, 2.0, and 2.7 kW/m2) at TCE Thermal conductivity enhancer
different volume fractions of PCM (0, 0.50, 0.86, and 1) to tcr with TCE Time to attain critical SPT by PCM-based
study the thermal performance of heat sinks. Various heat sink with TCE (s)
configurations of heat sinks such as unfinned with pure tcr without TCE Time to attain critical SPT by PCM-based
PCM, finned with pure PCM, unfinned with MF–PCM heat sink without TCE (s)
composite, and finned with MF–PCM composite heat tcr with MF − PCM Time to attain critical SPT by PCM-based
sinks are considered to evaluate the operating time to heat sink with MF–PCM (s)
achieve a set point temperature. The conclusions tcr without MF − PCM Time to attain critical SPT by PCM-based
obtained from this experimental study are elaborated heat sink without MF–PCM (s)
below. Tmax Maximum heat sink base temperature ( C)
Tamb Ambient temperature ( C)
1. Inclusion of PCM inside heat sink increases the maxi- Tb Base temperature of heat sink ( C)
mum operating time required to reach critical SPT in VPCM Volume of PCM filled inside heat
comparison to heat sink without PCM. sink (mm3)
2. Lower base temperature and better thermal manage- Vs Volume of heat sink (mm3)
ment capability are obtained in case of MF–PCM com- Vf Volume of TCE (mm3)
posite than pure PCM.
3. MF–PCM heat sinks are more advantageous for
higher input heat flux (2.0 and 2.7 kW/m2) due to uti-
lization of entire latent heat of PCM. Also, at higher GREEK SY MBO LS
heat flux, MF–PCM takes longer time to reach SPT
 
compared to pure PCM–based heat sinks. ε Enhancement ratio
t cr with TCE
tcr without TCE
4. Heat sink configuration with highest operating time  
and enhancement ratio may vary with the variation in ψ Volume fraction of PCM V PCM
Vs −Vf
 1099114x, 2021, 4, Downloaded from https://onlinelibrary.wiley.com/doi/10.1002/er.6215 by Indian Institute of Technology Indore, Wiley Online Library on [19/01/2025]. See the Terms and Conditions (https://onlinelibrary.wiley.com/terms-and-conditions) on Wiley Online Library for rules of use; OA articles are governed by the applicable Creative Commons License
KOTHARI ET AL. 5961

ϕ MF–PCM composite enhancement ratio materials embedded with porous materials/foams. Int. J. Heat
  Mass Transfer. 2019;135:649-673.
tcrwith MF− PCM
t crwithout MF− PCM 13. Kothari R, Kundalwal SI, Sahu SK. Transversely isotropic ther-
mal properties of carbon nanotubes containing vacancies. Acta
ξ Volume fraction of TCE
Mech. 2018;229(7):2787-2800.
14. Chougule SS, Sahu SK. Thermal performance of nanofluid
A C K N O WL E D G E M E N T charged heat pipe with phase change material for electronics
Authors acknowledge DST, India, for financial support cooling. J Electron. Packag. 2015;137(2):021004–021011.
under DST/TMD/MES/2k17/65 and IF170534. 15. Feng S, Zhang Y, Shi M, Wen T, Lu TJ. Unidirectional freezing
of phase change materials saturated in open-cell metal foams.
DATA AVAILABILITY STATEMENT Appl. Therm. Eng. 2015;88:315-321.
16. Tariq SL, Ali HM, Akram MA, Janjua MM,
Author elects to not share data.
Ahmadlouydarab M. Nanoparticles enhanced phase change
materials (NePCMs)-A recent review. Appl. Therm. Eng. 2020;
ORCID 176:115305.
Rohit Kothari https://orcid.org/0000-0002-7678-6690 17. Hassan A, Wahab A, Qasim MA, et al. Thermal management
and uniform temperature regulation of photovoltaic modules
R EF E RE N C E S using hybrid phase change materials-nanofluids system.
1. Viswanath R, Wakharkar V, Watwe A, Lebonheur V. Thermal Renewable Energy. 2020;145:282-293.
performance challenges from silicon to systems. Intel Technol J. 18. Baby R, Balaji C. Experimental investigations on phase change
2000;Q3:1–16. material based finned heat sinks for electronic equipment
2. Kraus AD, Bar-Cohen A. Thermal Analysis and Control of Elec- cooling. Int. J. Heat Mass Transfer. 2012;55(5–6):1642-1649.
tronic Equipment. Washington, DC: Hemisphere Publishing 19. Baby R, Balaji C. Thermal management of electronics using
Corp; 1983. phase change material based pin fin heat sinks. J. Phys. 2012;
3. Grimes R, Walsh E, Walsh P. Active cooling of a mobile phone 395(012134):1–8.
handset. Appl Therm Eng. 2010;30(16):2363-2369. 20. Ali HM, Arshad A. Experimental investigation of n-eicosane
4. Peles Y, Ar AK, Mishra C, Kuo CJ, Schneider B. Forced convec- based circular pin-fin heat sinks for passive cooling of elec-
tive heat transfer across a pin fin micro heat sink. Int. J. Heat tronic devices. Int. J. Heat Mass Transfer. 2017;112:649-661.
Mass Transfer. 2005;48(17):3615-3627. 21. Arshad A, Ali HM, Ali M, Manzoor S. Thermal performance of
5. Ng KC, Yap CR, Chan MA. A universal performance chart phase change material (PCM) based pin-finned heat sinks for
for CPU cooling devices. Heat Transfer Eng. 2008;29(7): electronics devices: effect of pin thickness and PCM volume
651-656. fraction. Appl. Therm. Eng. 2017;112:143-155.
6. Walsh E, Walsh P, Grimes R, Egan V. Thermal management of 22. Leong KY, Chew SP, Gurunathan BA, Ahmad KZK, Ong HC.
low profile electronic equipment using radial fans and heat An experimental approach to investigate thermal performance
sinks. J Heat Transfer. 2008;130(12):125001. of paraffin wax and 1-hexadecanol based heat sinks for cooling
7. Kothari R, Sahu SK, Kundalwal SI. Comprehensive analysis of of electronic system. Int Commun Heat Mass Transfer. 2019;
melting and solidification of a phase change material in an 109:104365.
annulus. Heat Mass Transfer. 2019;55(3):769-790. 23. Hajmohammadi MR, Shariatzadeh OJ, Moulod M,
8. Sharma RK, Ganeshan P, Tyagi VV, Metsellar HSC, Nourazar SS. Phi and psi shaped conductive routes for
Sandaran SC. Developments in organic solid–liquid phase improved cooling in a heat generating piece. Int. J. Therm. Sci.
change materials and their applications in thermal energy stor- 2014;77:66-74.
age. Energy Convers Manage. 2015;95:193-228. 24. Najafi H, Najafi B, Hoseinpoori P. Energy and cost optimiza-
9. Hosseini MJ, Ranjbar AA, Rahimi M, Bahrampoury R. Experi- tion of a plate and fin heat exchanger using genetic algorithm.
mental and numerical evaluation of longitudinally finned Appl. Therm. Eng. 2011;31:1839-1847.
latent heat thermal storage systems. Energy Buildings. 2015;99: 25. Hajmohammadi MR, Moulod M, Shariatzadeh OJ, Campo A.
263-272. Effect of a thick plate on the excess temperature of iso-heat
10. Alshaer WG, Nada SA, Rady MA, Bot CL, Barrio EPD. Numeri- flux heat sources cooled by laminar forced convection flow:
cal investigations of using carbon foam/PCM/Nano carbon conjugate analysis. Numer Heat Transfer Part A. 2014;66:
tubes composites in thermal management of electronic equip- 205-216.
ment. Energy Convers Manage. 2015;89:873-884. 26. Hajmohammadi MR, Poozesh S, Hosseini R. Radiation effect
11. Kothari R, Mahalkar P, Sahu SK, Kundalwal SI. Experimental on constructal design analysis of a TeY-shaped assembly of
investigations on thermal performance of PCM based heat sink fins. J Therm Sci Technol. 2012;7:677-692.
for passive cooling of electronic components. Paper presented 27. Saha SK, Srinivasan K, Dutta P. Studies on optimum distribu-
at: ASME 16th International Conference on Nanochannels, tion of fins in heat sinks filled with phase change materials.
Microchannels, and Minichannels; June 10–13, 2018; Dubrov- J Heat Transfer. 2008;130(3):034505.
nik, Croatia. 28. Saha SK, Dutta P. Heat transfer correlations for PCM-based
12. Tauseef-ur Rehman AHM, Janjua MM, Sajjad U, Yan W. Criti- heat sinks with plate fins. Appl Therm Eng. 2010;30(16):2485-
cal review on heat transfer augmentation of phase change 2491.
 1099114x, 2021, 4, Downloaded from https://onlinelibrary.wiley.com/doi/10.1002/er.6215 by Indian Institute of Technology Indore, Wiley Online Library on [19/01/2025]. See the Terms and Conditions (https://onlinelibrary.wiley.com/terms-and-conditions) on Wiley Online Library for rules of use; OA articles are governed by the applicable Creative Commons License
5962 KOTHARI ET AL.

29. Pakrouh R, Hosseini MJ, Ranjbar AA, Bahrampoury R. A liquid metal as the phase change material. Appl. Therm. Eng.
numerical method for PCM-based pin fin heat sinks optimiza- 2016;109:746-750.
tion. Energy Convers Manage. 2015;103:542-552. 47. Yao Y, Wu H, Liu Z, Gao Z. Pore-scale visualization and mea-
30. Baby R, Balaji C. A neural network-based optimization of thermal surement of paraffin melting in high porosity open-cell copper
performance of phase change material-based finned heat sinks— foam. Int J Therm Sci. 2018;123:73-85.
An experimental study. Exp Heat Transfer. 2013;54(1):65-77. 48. Yao Y, Wu H. Thermal transport process of metal foam/paraffin
31. Baby R, Balaji C. Thermal optimization of PCM based pin fin composite (MFPC) with solid-liquid phase change: an experi-
heat sinks: an experimental study. Appl. Therm. Eng. 2013;54 mental study. Appl. Therm. Eng. 2020;179:115668.
(1):65-77. 49. Zheng H, Wang C, Liu Q, Tian Z, Fan X. Thermal performance
32. Yusup N, Zain AM, Hashim SZM. Evolutionary techniques in of copper foam/paraffin composite phase change material.
optimizing machining parameters: review and recent applica- Energy Convers Manage. 2018;157:372-381.
tions (2007–2011). Expert Syst Appl. 2013;39(10):9909-9927. 50. Mustaffar A, Reay D, Harvey A. The melting of salt hydrate
33. Fukai J, Kanou M, Kodama Y, Miyatake O. Thermal conductiv- phase change material in an irregular metal foam for the appli-
ity enhancement of energy storage media using carbon fibers. cation of traction transient cooling. Therm Sci Eng Prog. 2018;
Energy Convers. Manage. 2000;41:1543-1556. 5:454-465.
34. Prieto R, Molina J, Narciso J, Louis E. Fabrication and proper- 51. Joshi V, Rathod MK. Experimental and numerical assessments
ties of graphite flakes/metal composites for thermal manage- of thermal transport in fins and metal foam infused latent heat
ment applications. Scr Mater. 2008;59:11-14. thermal energy storage systems: a comparative evaluation.
35. Zhou D, Zhao CY. Experimental investigations on heat transfer Appl Therm Eng. 2020;178:115518.
in phase change materials (PCMs) embedded in porous mate- 52. Chamkha A, Veismoradi A, Ghalambaz M,
rials. Appl Therm Eng. 2011;31:970-977. Talebizadehsardari P. Phase change heat transfer in an L-shape
36. Gharbi S, Harmand S, Jabrallah SB. Experimental comparison heat sink occupied with paraffin copper metal foam. Appl.
between different configurations of PCM based heat sinks for Therm. Eng. 2020;177:115493.
cooling electronic components. Appl. Therm. Eng. 2015;87:454-462. 53. Veismoradi A, Modir A, Ghalambaz M, Chamkha A. A phase
37. Mahmoud S, Tang A, Toh C, AL-Dadah R, Soo SL. Experimen- change/metal foam heat sink for thermal management of bat-
tal investigation of inserts configurations and PCM type on the tery packs. Int. J. Therm. Sci. 2020;157:106514.
thermal performance of PCM based heat sinks. Appl Energy. 54. Li X, Niu C, Li X, Ma T, Lu L, Wang Q. Pore-scale investigation
2013;112:1349-1356. on effects of void cavity distribution on melting of composite
38. Baby R, Balaji C. Experimental investigations on thermal per- phase change materials. Appl Energy. 2020;275:115302.
formance enhancement and effect of orientation on porous 55. Tauseef-ur-Rehman AHM. Thermal performance analysis of
matrix filled PCM based heat sink. Int Commun Heat Mass metallic foam-based heat sinks embedded with RT-54HC paraf-
Transfer. 2013;46:27-30. fin: an experimental investigation for electronic cooling.
39. Fan LW, Jin HQ. Local thermal nonequilibrium during melting J. Therm. Anal. Calorim. 2020;140:979-990.
of a paraffin filled in an open-cell copper foam: a visualized 56. Bhattacharya A, Mahajan RL. Finned metal foam heat sinks
study at pore-scale. J Heat Transfer. 2017;139:034505. for electronics cooling in forced convection. J Electron Pack.
40. Jackson GR, Fisher TS. Response of porous foams filled with 2002;124:155-163.
phase change material under transient heating conditions. 57. Tan WC, Saw LH, Yusof F, Thiam HS, Xuan J. Investigation of
Paper presented at: 45th AIAA Thermophysics Conference; functionally graded metal foam thermal management system
June 22-26, 2015; Dallas, TX. for solar cell. Int J Energy Res. 2019;44:9333-9349. https://doi.
41. Xiao X, Zhang P, Li M. Preparation and thermal characteriza- org/10.1002/er.4896.
tion of paraffin/metal foam composite phase change material. 58. Tauseef-ur-RehmanAli HM, Saieed A, Pao W, Ali M. Copper
Appl Energy. 2013;112:1357-1366. foam/PCMs based heat sinks: an experimental study for electronic
42. Zhang P, Meng ZN, Zhu H, Wang YL, Peng SP. Melting heat cooling systems. Int. J. Heat Mass Transfer. 2018;127:381-393.
transfer characteristics of a composite phase change material 59. Tauseef-ur-Rehman AHM. Experimental study on the thermal
fabricated by paraffin and metal foam. Appl. Energy. 2017;185: behavior of RT- 35HC paraffin within copper and Iron-Nickel
1971-1983. open cell foams: energy storage for thermal management of
43. Mustaffar A, Harvey A, Reay D. Melting of phase change mate- electronics. Int. J. Heat Mass Transfer. 2020;146:118852.
rial assisted by expanded metal mesh. Appl. Therm. Eng. 2015; 60. Tauseef-ur-Rehman AHM. Experimental investigation on par-
90:1052-1060. affin wax integrated with copper foam based heat sinks for
44. Zhu F, Zhang C, Gong X. Numerical analysis and comparison electronic components thermal cooling. Int Commun Heat
of the thermal performance enhancement methods for metal Mass Transfer. 2018;98:155-162.
foam/phase change material composite. Appl. Therm. Eng. 61. Zhao L, Xing Y, Liu X. Experimental investigation on the ther-
2016;109:373-383. mal management performance of heat sink using low melting
45. Wang H, Wang F, Li Z, Tang Y, Yu B, Yuan W. Experimental point alloy as phase change material. Renewable Energy. 2020;
investigation on the thermal performance of a heat sink filled 146:1578-1587.
with porous metal fiber sintered felt/paraffin composite phase 62. Huang Y, Sun Q, Yao F, Zhang C. Experimental study on the
change material. Appl Energy. 2016;176:221-232. thermal performance of a finned metal foam heat sink with
46. Fan L, Wu Y, Xiao Y, Zeng Y, Zhang Y, Yu Z. Transient perfor- phase change material. Heat Transfer Eng. 2020. https://doi.
mance of a thermal energy storage-based heat sink using a org/10.1080/01457632.2020.1716482.
 1099114x, 2021, 4, Downloaded from https://onlinelibrary.wiley.com/doi/10.1002/er.6215 by Indian Institute of Technology Indore, Wiley Online Library on [19/01/2025]. See the Terms and Conditions (https://onlinelibrary.wiley.com/terms-and-conditions) on Wiley Online Library for rules of use; OA articles are governed by the applicable Creative Commons License
KOTHARI ET AL. 5963

63. Ganatra Y, Ruiz J, Howarter JA, Marconnet A. Experimental melting of phase change material in a rectangular enclosure.
investigation of Phase Change Materials for thermal man- Int J Heat Mass Transfer. 2014;72:186-200.
agement of handheld devices. Int J Therm Sci. 2018;129:
358-364.
64. Burns GW, Scroger MG, Strouse GF, Croarkin MC,
Guthrie WF. Temperature electromotive force reference func- How to cite this article: Kothari R, Sahu SK,
tions and tables for the letter-designated thermocouple types Kundalwal SI, Mahalkar P. Thermal performance
based on the ITS-90. NASA STI/Recon Technical Report N; of phase change material–based heat sink for
1993. passive cooling of electronic components: An
65. Holman JP. Experimental Methods for Engineers. 8th ed.
experimental study. Int J Energy Res. 2021;45:
New York, NY: McGraw Hill; 2012.
66. Kamkari B, Shokouhmand H, Bruno F. Experimental investi-
5939–5963. https://doi.org/10.1002/er.6215
gation of the effect of inclination angle on convection-driven