HighTech at LowCost

PRINTED CIRCUIT BOARDS BASIC DESIGN RULES

1. Design Parameters
Outer & inner layers: Cu thickness / min. conductor
H copper Min. trace width | -space | annular ring
thickn.
Standard Special production
A G E 18µm 100µm | 100µm | 100µm 75µm | 75µm | 75µm

B 35µm
70µm
100µm | 100µm | 100µm
150µm | 150µm | 150µm
90µm | 90µm | 100µm
150µm | 150µm | 130µm

I 105µm 225µm | 225µm | 225µm 200µm | 200µm | 170µm

140µm 300µm | 300µm | 300µm 250µm | 250µm | 200µm
F 175µm 400µm | 400µm | 400µm 280µm | 280µm | 240µm

K 210µm
245µm
450µm | 450µm | 450µm
475µm | 475µm | 475µm
300µm | 300µm | 280µm
350µm | 350µm | 320µm

C 280µm 500µm | 500µm | 500µm 380µm | 380µm | 350µm

315µm 525µm | 525µm | 525µm 380µm | 380µm | 350µm
J 350µm 550µm | 550µm | 550µm 380µm | 380µm | 350µm
385µm 575µm | 575µm | 575µm 380µm | 380µm | 350µm
400µm 600µm | 600µm | 600µm 380µm | 380µm | 350µm

D 455µm
490µm
700µm | 700µm | 700µm
700µm | 700µm | 700µm
380µm | 380µm | 350µm
380µm | 380µm | 350µm
525µm
L
700µm | 700µm | 700µm 380µm | 380µm | 350µm
560µm 800µm | 800µm | 800µm 380µm | 380µm | 350µm

Name Standard (min.) Special production (min.)

(Parameters exemplary for 35µm copper)
aspekt Ø via-pad annular ring aspekt Ø via-Pad annular ring
ratio circular ratio circular

A, B, C via, buried Via 1:10 200µm 400µm 100µm 1:12 150µm 330µm 75µm
(component hole:
annular ring circular 25µm larger)

D blind via, mechanical 1:1 200µm 400µm 100µm 1:1.2 150µm 350µm 100µm

E blind via, laser - - - - 1:1 100µm 280µm 90µm*

F stacked vias Disproportional high effort. - - - - - - - -

G staggered vias (microvias) 1:1 - 1:10* 200µm 400µm 100µm 1:1 - 1:12* 100µm 300µm 90µm

H, I conductor trackwidth / -space width | space 100µm | 100µm width | space 75µm | 75µm

J conductor, pad <> milling edge space 200µm space 200µm

conductor, pad <> scoring edge space 500µm space 500µm

K conductor, pad <> via space 200µm space 200µm

L solder-stop, green clearance 50µm circular clearance 25µm circ. (BGA)

bridge 100µm bridge 80µm
solder-stop, other colours - - clearance 50µm
- - bridge 125µm
* see buried via, blind via | * For special production (min.) possible data check necessary.

NPT - Holes Coil

min. Ø: 200µm Coils on the inner layers:
aspekt ratio: 1:10 (o.r. 1:12) min. conductor width / space of 125µm.

Coils on the outer layers:

M conductor, pad <> NPTH: min. 200µm min. conductor width / space of 100µm.
M

Pilot or mounting holes (usually with Ø = 3,05mm) should be created in

the same drill program as NPT-holes. Please label mounting holes in the
dimension layer, as such.

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PRINTED CIRCUIT BOARDS BASIC DESIGN RULES

2. Solder-stop
Bridge Solder-stop = green
standard on request (data)
Clearance Cover
clearance 50µm 40µm | 25µm (BGA)
bridge width 100µm 80µm
cover 100µm 80µm

Solder-stop = black, blue, white, red, yellow

standard on request (data)
clearance 50µm 40µm
bridge width 125µm 100µm
cover 150µm 125µm

SMD-Pads (Solder-Mask-Defined Pads)

PadØ For solder pads, which are defined by the sol-
der-mask, please use the following parameters:
MC Ø (Mask Clearance) = Pad Ø - 80µm
MF
Process capable for drill Ø ≥ 0,3 mm

Solder-stop Parameters
d2 > 5µm thickness
d1: on the PCB > 10µm < 25µm
d2: on the conductor edge > 5µm < 25µm

d1 > 10µm
electric strength 500VDC min.

3. Marking print
Marking Print Parameters
font height ideal font width min. font width*
space 1,2mm 150µm 100µm
1,5mm 180µm 125mm
1,8mm 200µm 150µm
1
spacing to pad min. 150µm
spacing to solder-stop clearance 100µm
Never place marking print on pads > will be clipped by Multi-CB before production.
* Can lead to surcharge > special production
For EAGLE-Users
Before exporting your data, you should always activate the option
IC4 font height
- “Always vector font”

which is found under: Options/User interface. Otherwise your mark-

ing print will very probably be incorrectly applied (EAGLE V. 5+).

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 HighTech at LowCost

PRINTED CIRCUIT BOARDS BASIC DESIGN RULES

4. Tolerances and Design Limits
The production of printed circuit boards is carried out according to the valid IPC guidelines and standards and on the basis of following technical
specifications. HDI or MFT boards can be produced with smaller tolerances. Differing requirements of the customer must be explicitly agreed!

Pattern tolerances Flexible PCB thickness

Tolerance Type Tolerance
Drilling (PTH) to conductive pattern outer layers ±0,10mm Flexible part thickness ±50µm
Drilling (PTH) to conductive pattern inner layers ±0,15mm Stiffener thickness ±50µm
Drilling (PTH) to milling pattern / contour ±0,10mm
Drilling (NPTH) to milling pattern / contour ±0,10mm Vias & Drills
Drilling (PTH) to marking print ±0,15mm Final-Ø
Plated-through-holes (PTH) and ±0,10mm
Conductive pattern to solder resist ±0,10mm component holes
Conductive pattern to marking print ±0,20mm Non-plated-through-holes (NPTH) ±0,08mm
Press-fit technology (drilled) ±0,05mm
Hole to hole, one pass* ±0,05mm > on request +0,10mm/-0
PTH-PTH or NPTH-NPTH
Press-fit technology (milled*) ±0,075mm
Hole to hole, two passes PTH-NPTH ±0,10mm
* Also applies for PTH-NPTH if they are drilled in one run (e.g. loca- * From a final diameter of approx. 6.0mm (depending on the surface)
tion holes for SMD stencils) the holes are milled, not drilled.

Conductor (acc. to IPC-6012) Cu min. thickness of throughplating

Conductor width min. 80% in comparsion to the data Class 2* Class 3
Conductor space max. 30% reduction in comparsion to data Via (> 150µm) 20µm - 25µm 20µm - 25µm
Microvia (≤ 150µm) 18µm - 20µm 20µm - 25µm
Impedance control Blind Via 10µm - 12µm 10µm - 12µm

Tolerance (normal) 10% Buried Via 10µm - 12µm 10µm - 12µm

* Standard
Tolerance (extended) 5%

Scoring
Milling
Tolerance
Tolerance
Offset (to PCB center) ±0,10mm
Milling offset ±0,10mm Drilling (PTH) to scoring pattern ±0,15mm
Z-Axis milling depth ±0,20mm Drilling (NPTH) to scoring pattern ±0,20mm
PCB dimension x/y ±0,15mm
Base material Scoring depth ±0,20mm
Tolerance
FR4 thickness ±10% Bow & Twist
The information about the base material thickness exclusively defines Tolerance
the thickness of the dielectric including base copper. The other layer
structures such as electroplated Cu layers or solder resist layers For PCBs ≥ 0,8mm thickness 0,75% with SMD
result in increased final thickness. 1,50% without SMD
Please note that the twist & bow value is increased above average, if
the copper balance of the PCB is locally very unequal or if the circuit
Rigid PCB thickness board is very thin.
Type Tolerance
Producibility level B (standard) ±10% or ±178µm Delivery quantity
Thickness tolerances for pressed multilayers according to IPC-2222A. Pieces Tolerance
The higher value is valid. When measured over metallizations or
coatings, those thicknesses and tolerances must be considered. 1 - 20 pcs. Excess or short delivery 0%
from 21 pcs. Excess or short delivery of up to10%
On request: quantities of more than 20 pieces in exact quantity.
The (single) piece rule also applies when ordering as panel.

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 HighTech at LowCost

PRINTED CIRCUIT BOARDS BASIC DESIGN RULES

5. Defined layer buildup
For certain applications it is necessary that the layer isolation thicknesses are defined, e.g. for impedances. For this purpose, Multi-CB offers the
following defined layer buildups at no extra charge. You can achieve your desired values with our layout examples for impedances (approx.).

4 layers: 4L-01 (1.6mm) 8 layers: 8L-01 (1.7mm)

4 layers: 4L-02 (1.0mm)

6 layers: 6L-01 (1.6mm)

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 HighTech at LowCost

PRINTED CIRCUIT BOARDS BASIC DESIGN RULES

6. Hybrid layer buildup Rogers 4350B/FR4
A hybrid layer buildup of Rogers 4350B and FR4 material combines several advantages. The critical layers are built up with a high-tech Rogers core
and then pressed with common FR4 prepreg. Your advantages: Optimised low loss material properties in the high-frequency layers, lower price due
to material mix, greatly improved mechanical stability, defined layer buildup with hybrid buildup - layout examples for impedances (approx.).

4 layers: 4L-H01 (1.55mm) Hybrid Rogers 4350B 168µm core

4 layers: 4L-H02 (1.55mm) Hybrid Rogers 4350B 254µm core

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