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DigitalCMOS Summary

The document provides an overview of silicon lattice structures and the principles of CMOS VLSI design, including the roles of dopants in creating n-type and p-type semiconductors. It explains the operation of nMOS and pMOS transistors, their function as switches, and the design of CMOS logic gates such as inverters and NAND gates. Additionally, it discusses the layout and design rules for creating transistors on silicon chips.

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Ramy Rady
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© © All Rights Reserved
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Download as KEY, PDF, TXT or read online on Scribd
0% found this document useful (0 votes)
5 views

DigitalCMOS Summary

The document provides an overview of silicon lattice structures and the principles of CMOS VLSI design, including the roles of dopants in creating n-type and p-type semiconductors. It explains the operation of nMOS and pMOS transistors, their function as switches, and the design of CMOS logic gates such as inverters and NAND gates. Additionally, it discusses the layout and design rules for creating transistors on silicon chips.

Uploaded by

Ramy Rady
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as KEY, PDF, TXT or read online on Scribd
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Silicon Lattice

Transistors are built on a silicon substrate


Silicon is a Group IV material
Forms crystal lattice with bonds to four
neighbors

Si Si Si

Si Si Si

Si Si Si

0: Introduction CMOS VLSI Design


4th Ed.
Dopants
Silicon is a semiconductor
Pure silicon has no free carriers and conducts
poorly
Adding dopants increases the conductivity
Group V: extra electron (n-type)
Group III: missing electron, called hole (p-type)
Si Si Si Si Si Si
- +

+ -
Si As Si Si B Si

Si Si Si Si Si Si

0: Introduction CMOS VLSI Design


4th Ed.
p-n Junctions
A junction between p-type and n-type
semiconductor forms a diode.
Current flows only in one direction

p-type n-type

anode cathode

0: Introduction CMOS VLSI Design


4th Ed.
nMOS Transistor
Four terminals: gate, source, drain, body
Gate – oxide – body stack looks like a capacitor
Gate and body are conductors
SiO2 (oxide) is a very good insulator
Called metal – oxide – semiconductor (MOS) capacitor
Even though gate is
no longer made of metal*
Source Gate Drain
Polysilicon
* Metal gates are returning today! SiO 2

n+ n+
Body
p bulk Si

0: Introduction CMOS VLSI Design


4th Ed.
nMOS Operation
Body is usually tied to ground (0 V)
When the gate is at a low voltage:
P-type body is at low voltage
Source-body and drain-body diodes are OFF
No current flows, transistor is OFF

Source Gate Drain


Polysilicon
SiO2

0
n+ n+
S D
p bulk Si

0: Introduction CMOS VLSI Design


4th Ed.
nMOS Operation Cont.
When the gate is at a high voltage:
Positive charge on gate of MOS capacitor
Negative charge attracted to body
Inverts a channel under gate to n-type
Now current can flow through n-type silicon from source
through channel to drain, transistor is ON

Source Gate Drain


Polysilicon
SiO2

1
n+ n+
S D
p bulk Si

0: Introduction CMOS VLSI Design


4th Ed.
pMOS Transistor
Similar, but doping and voltages reversed
Body tied to high voltage (VDD)
Gate low: transistor ON
Gate high: transistor OFF
Bubble indicates inverted behavior

Source Gate Drain


Polysilicon
SiO 2

p+ p+

n bulk Si

0: Introduction CMOS VLSI Design


4th Ed.
Transistors as Switches
We can view MOS transistors as electrically
controlled switches
Voltage at gate controls path from source to
drain g=0 g=1

d d d
nMOS g OFF
ON
s s s

d d d

pMOS g OFF
ON
s s s

0: Introduction CMOS VLSI Design


4th Ed.
CMOS Inverter

VDD
OFF
ON
0
1
A Y
ON
OFF

A Y
GND
0: Introduction CMOS VLSI Design
4th Ed.
CMOS NAND Gate

ON
OFF
OFF
ON OFF
ON

1
0
Y
ON
A OFF

0
1
1
0
OFF
ON
B ON
OFF

0: Introduction CMOS VLSI Design


4th Ed.
CMOS NOR Gate

A
B
Y

0: Introduction CMOS VLSI Design


4th Ed.
Inverter Cross-section
Typically use p-type substrate for nMOS
transistors
Requires n-well for body of pMOS transistors
A
GND VDD
Y SiO 2

n+ diffusion

p+ diffusion
n+ n+ p+ p+
polysilicon
n well
p substrate
metal1

nMOS transistor pMOS transistor

0: Introduction CMOS VLSI Design


4th Ed.
Well and Substrate Taps
Substrate must be tied to GND and n-well to
VDD
Metal to lightly-doped semiconductor forms
poor connection called Shottky Diode
Use heavily dopedAwell and substrate
contacts
GND / taps V DD
Y

p+ n+ n+ p+ p+ n+

n well
p substrate

well
substrate tap
tap

0: Introduction CMOS VLSI Design


4th Ed.
Inverter Mask Set
Transistors and wires are defined by masks
Cross-section taken along dashed line

GND V DD

nMOS transistor pMOS transistor


substrate tap well tap

0: Introduction CMOS VLSI Design


4th Ed.
Detailed Mask Views
Six masks
n-well
n well

Polysilicon
n+ diffusion
p+ diffusion Polysilicon

Contact
Metal
n+ Diffusion

p+ Diffusion

Contact

Metal

0: Introduction CMOS VLSI Design


4th Ed.
Layout
Chips are specified with set of masks
Minimum dimensions of masks determine
transistor size (and hence speed, cost, and
power)
Feature size f = distance between source and
drain
Set by minimum width of polysilicon
Feature size improves 30% every 3 years or so
Normalize for feature size when describing
design rules
Express rules in terms of λ = f/2
E.g. λ = 0.3 μm in 0.6 μm process

0: Introduction CMOS VLSI Design


4th Ed.
Simplified Design Rules
Conservative rules to get you started

0: Introduction CMOS VLSI Design


4th Ed.
Inverter Layout
Transistor dimensions specified as Width /
Length
Minimum size is 4λ / 2λ, sometimes called 1 unit
In f = 0.6 μm process, this is 1.2 μm wide, 0.6 μm long

0: Introduction CMOS VLSI Design


4th Ed.

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