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Module4_IntegratedCircuits-2

This module covers Integrated Circuits (IC), their design, construction, and various levels of integration, highlighting the evolution from large, bulky circuits to compact, efficient ICs. It outlines the different types of IC design methods: analog, mixed, and digital, along with the classification of digital logic families such as RTL, DTL, TTL, ECL, and CMOS. Additionally, it discusses the characteristics of digital logic families, including propagation delay, fan-in, fan-out, and the importance of simulation software for circuit design.

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0% found this document useful (0 votes)
4 views

Module4_IntegratedCircuits-2

This module covers Integrated Circuits (IC), their design, construction, and various levels of integration, highlighting the evolution from large, bulky circuits to compact, efficient ICs. It outlines the different types of IC design methods: analog, mixed, and digital, along with the classification of digital logic families such as RTL, DTL, TTL, ECL, and CMOS. Additionally, it discusses the characteristics of digital logic families, including propagation delay, fan-in, fan-out, and the importance of simulation software for circuit design.

Uploaded by

Shaiwin Jiro
Copyright
© © All Rights Reserved
Available Formats
Download as PDF, TXT or read online on Scribd
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LOGIC CIRCUITS AND DESIGN

Module 4- Integrated Circuits

By: Engr. Irene F. Salvador, MSME


Logic Circuits and Devices
Module 4: Integrated Circuits (IC)
circuits. Moreover, they were not entirely shockproof
TOPIC and reliable.
OUTLINE As it is said, necessity is the mother of all inventions.
So there was a need to develop smaller size circuits
with more power and safety to incorporate them into
Simplification using Boolean Algebra devices. Three American scientists invented transistors
that simplified things to quite an extent, but the
development of integrated circuits changed electronics
A. Integrated Circuits (IC) technology’s face. [2]
B. IC Design

C. Levels of integration

D. Digital Logic Families INTEGRATED CIRCUITS (IC)


E. Pin configurations

F. Installation of MultiSim software for circuit An integrated circuit or an IC is a small chip of a


simulation semiconductor material that mounts an entire circuit on
itself as seen in figure 1. It is very small when compared
to the standard circuits, which are made of independent
circuit components. The most commonly used IC is the
LEARNING monolithic integrated circuit.
OBJECTIVES
At the end of this module, you should be able to:

1. Familiarize the levels of integration of the Integrated


Circuits (ICs)

2. Determine the digital logic family that is appropriate


for a design.

3. Construct a circuit using the IC and its pin configu-


rations.

4. Simulate a circuit using MultiSim. Figure 1: IC Photo by www.seekweb.com

The integrated circuit is a fundamental concept of


electronics that builds on other basic concepts
OVERVIEW previously discussed in our syllabus. Therefore, for a
quick reference, go through the articles listed below:

Over the years, we have observed how technology has 1. Electric Circuits
managed to squeeze itself into a more compact and
concise structure. For instance, the first computers that 2. Resistors
were made were the size of 1000 laptops which we use
today. How has this been made possible? The 3. Transistors
integrated circuit is the answer to it. 4. Diodes
The circuits that were made previously were large and 5. Capacitors
bulky, consisting of circuit components like resistor,
capacitor, inductor, transistor, diodes, etc., which were
connected with copper wires. This factor limited the
use of the circuits to big machines. It was not possible
to create small and compact appliances with these big

Module 4: Integrated Circuits | Page 1 of 7


Logic Circuits and Devices
Module 4: Integrated Circuits (IC)

Integrated Circuit Construction An integrated circuit


IC DESIGN is a complex layering of semiconductors, coppers, and
AND CONSTRUCTION other interconnected materials to form resistors,
transistors and other components. The cut and formed
combinations of these wafers are known as a die.
Certain logic techniques and circuit designs are used to
design an integrated circuit. Following are the three The semiconductor wafers that make up the ICs are
categories of IC design: fragile, and the connections between the layers very
intricate. As an IC die is too small to solder and connect
1. ANALOG DESIGN When ICs are used as oscillators, to, the ICs are packaged. The IC package turns the
filters and regulators, analog design method is delicate and tiny die into a black chip we are familiar
employed to design the integrated chip. This with.
design method is used when the power dissipation,
gain and resistance are required to be perfect. The IC package encapsulates the integrated circuit and
transforms it into a device that we can easily connect.
2. MIXED DESIGN The mixed design integrates the There are many different types of packages, each
analog and digital design principles. The mixed ICs having unique dimensions and mounting types as
function as Digital to Analog converters, Analog to shown in the figure.
Digital converters (D/A and A/D converters) and
clock/timing ICs. All ICs are polarized, and every pin in an IC is unique
both in location and function. Integrated chips use a
3. DIGITAL DESIGN ICs, when used as computer notch or a dot to indicate the first pin as shown in the
memories (such as RAM and ROM), figure below.
microprocessors are designed by the digital design
method. This design method ensures that the Once the first pin is identified, the remaining PINs
circuit density is maximum and the overall increase sequentially counterclockwise direction
efficiency is maximum. The ICs designed using around the chip.
this method work with binary input data such as 0
and 1. The figure below shows the steps involved in
designing digital integrated circuits.

LEVELS OF INTEGRATION

Sum-of-Products (SOP)

The integration scale has always been the inspiration


and aspiration of the semiconductor industry. The
integration scale denotes the number of transistors or
gates integrated on a single chip. On this basis,
integrated circuits are of the following type:

1. Small scale integration (SSI) – In the beginning of


IC technology from 1961-1965, ICs had only a few
components integrated on a chip, typically 2 to 10
transistors. At present, integrated circuits having
10 to 100 transistors on a single chip making
around 3 to 30 gates on the chip are classified as
small scale integration ICs. These ICs are used to
make flip-flops and logic gate ICs.

2. Medium scale integration (MSI)– The next higher


level of IC integration is medium scale, in wh) ich,
typically 100 to 1000 transistors making 30 to 300
logic gates per chip are fabricated on a single chip.
Medium-scale integration technology was

Module 4: Integrated Circuits | Page 2 of 7


Logic Circuits and Devices
Module 4: Integrated Circuits (IC)

prominent between years 1966 and 1971. This


technology is used to make multiplexers, decoders,
counters, and registers. DIGITAL LOGIC FAMILIES
3. Large scale integration (LSI) – From 1971 to 1979,
large scale integration (LSI) technology took over According to the components used, there are different
MSI technology. In large scale integration, types of logic families. Some of the logic families
thousands of transistors – typically 1000 to 20,000 include Resistor-Transistor logic(RTL), Diode-Transistor
transistors resulting in 300 to 3000 gates per chip logic(DTL), Transistor-transistor logic(TTL), Emitter
– are fabricated on a single chip. This technology coupled logic(ECL), PMOS, NMOS, and CMOS circuits.
is used to make RAM, ROM, and microprocessors.
They are classified into several types as shown below.
4. Very large scale integration (VLSI) – From 1980 to
1984, very large scale integration (VLSI) was
achieved. In VLSI technology, tens of thousands of 1. Resistor Transistor Logic (RTL)
transistors – typically 20,000 to 50,000 transistors The resistor-transistor Logic(RTL) circuit is one of
making up 3000 gates per chip – are fabricated on the basic logic circuits in digital logic families. It is
a single die. This technology is used to design a bipolar saturated device. The RTL logic is popular
digital signal processors (DSP), RISC processors, because of its simplicity.
16-bit and 32-bit microprocessors and
The RTL circuit consists of resistors at inputs and
microcontrollers.
transistors at the output side. Transistors are used
5. Ultra large scale integration (ULSI) – Post-1984 as the switching device. The emitter of the
and till now, ultra large scale integration (ULSI) has transistor is connected to the ground. The collector
been achieved. In ULSI technology, from 50,000 to terminals are tied together and given to the supply
billions of transistors are fabricated on a single through the resistor RC. The collector resistor is
chip. The ULSI technology is mainly used for known as a passive pull-up resistor.
designing 64-bit and higher microprocessors and
2. Diode Transistor Logic (DTL)
controllers.
Diode transistor logic(DTL) belongs to the digital
logic family. This logic circuit has diodes at the
The future of the integration scale of ICs lies in input side and transistor at the output side and so
nanotechnology. Moore’s Law is still valid despite rising the name diode transistor logic. It has more
costs of research and development. The advantages than resistor transistor logic(RTL).
semiconductor manufacturers are still, and may
probably always look forward to achieving an even 3. Transistor-Transistor Logic (TTL)
higher level of integration. The modern applications of Transistor-Transistor Logic belongs to the digital
electronics (artificial intelligence, machine learning, logic family. It consists of transistors at both input
deep learning, cloud computing, IoT, AIoT, augmented and output side, diodes and few resistors. Unlike
reality, mixed reality, holographic reality, Resistor-transistor logic and Diode transistor logic,
supercomputing, scientific computing, etc) are ever both the logic function and amplifying function are
demanding in terms of memory as well as computing performed by the transistors.
power. The semiconductor industry may never settle to
a saturation point, and the level of integration, perhaps, The TTL integrated circuits are very popular in
never sees an end.[4] different applications including computer controls,
consumer electronics, industrial control systems,
etc. There are various subfamilies in
transistor-transistor logic, which includes standard
TTL, Low power TTL, Schottky TTL, Advanced
Schottky TTL, High power TTL, fast TTL, etc. In this
section, you will learn about the circuit and
operation of standard TTL and different output
configurations of TTL.

4. Emitter Coupled Logic (ECL)


Emitter-coupled logic is the fastest of all digital
logic families. It was invented by Hannon S. Yourke
in the year 1956 at IBM. It is also called as current

Module 4: Integrated Circuits | Page 3 of 7


Logic Circuits and Devices
Module 4: Integrated Circuits (IC)

mode logic. The design of ECL circuit consists of logic gates. For example, the following circuit has an
transistors and resistors. EX-OR gate, which drives 4 NOT gates. So fan-out of
By preventing the transistor from entering into EX-OR gate is 4.
saturation, the high-speed operation is achieved in
Fan-out of digital logic family Both fan-in and fan-out
ECL logic family. Very small voltage swing is
values are given by the manufacturer at the time of
necessary to switch between the two different
designing and the data is specified in the datasheet.
voltage levels. This cannot be achieved in
When the number of inputs or outputs are changed, it
transistor-transistor logic, as the transistors enter
may cause some malfunction to the device.
into saturation mode, while in operation.
Emitter-coupled logic family offers an incredible Power dissipation It is the amount of power that the
propagation delay of 1ns. The delay is more digital circuit dissipates. The power dissipated is
reduced in the latest ECL families. determined by the average current, that is drawn from
the supply voltage.
5. CMOS logic family | NMOS and PMOS
CMOS logic family is a group of logic circuits, built The average current is the average value of the current
with complementary MOS devices. All the logic at LOW gate output(logic ‘o’) and the current at HIGH
gates that are built with MOSFET devices will come gate output(logic ‘1’).
under MOS logic family. MOS Logic family can be
classified into three categories. They are: Noise Immunity and Noise margin What is Noise?

(a) NMOS logic family – built with N-channel It is an unwanted signal that is superimposed on the
Metal oxide semiconductor FET (MOSFET) normal operating signal. Noise may be due to various
factors like operating environment, radiations, stray
(b) PMOS logic family – built with P-channel
electrical and magnetic fields.
Metal oxide semiconductor FET (MOSFET)
(c) CMOS logic family – built with both N-channel In digital logic circuits, the binary values 0 and 1
and P-channel Metal oxide semiconductor represent the LOW and HIGH voltage levels. Due to the
FET (MOSFET) Off all the MOS families, interference of the noises, the voltage levels may
NMOS and CMOS are used in making an increase or decrease. This may lead to the wrong
integrated circuit. It is because of its operation of the device.
advantages.
The noise immunity is the ability of the logic device to
tolerate the noise without causing spurious change to
CHARACTERISTICS OF DIGITAL LOGIC FAMILIES the output voltage. Noise margin allows the logic
Propagation delay device to function properly within the specified limits.

It is the time interval between the application of the Figure of merit For an efficient operation of any device,
input pulse and the occurrence of the output. It is an whether it may be digital or analog, the power
important characteristic of the digital logic family. If the dissipation and the speed are notable characteristics.
propagation delay is less, then the speed at which the Achieving a higher speed with less power dissipation is
IC operates will be faster. a highly challenging task.

Let THL is the propagation delay when the output In the digital logic circuit, a trade-off exists between
changes from logic 0 to 1 and TLH is the delay when the these two characteristics. That is, for higher speed, the
output changes from logic 1 to 0. The maximum value power dissipation will be more.
of THL and TLH is considered as the propagation delay
for that logic gate. The figure of merit or Speed Power Product is a
common means of measuring the performance of
Fan in and Fan out circuits in the digital logic family.[5]

Fan-in refers to the number of inputs in a digital logic


gate family. For the example given in the figure below,
the EX-OR gate has three inputs. So fan-in for the given
EX-OR gate is 3.

Fan in of digital logic family Fan-out refers to the


number of inputs that is driven by the output of another

Module 4: Integrated Circuits | Page 4 of 7


Logic Circuits and Devices
Module 4: Integrated Circuits (IC)

5. 7402 Quad 2-input NOR Gate


IC PIN CONFIGURATIONS

1. 7408 Quad 2-input AND Gate

6. 7486 Quad 2-input XOR Gate

2. 7432 Quad 2-input OR Gate

7. 74266 Quad 2-input XNOR Gate

3. 7404 Hex NOT Gate

INSTALLATION OF
SIMULATION SOFTWARE
4. 7400 Quad 2-input NAND Gate To further understand the function of the logic gates in
a circuit, we should simulate and perform the input
combinations in a thuth table. To do this, we should
have a simulation tool or software. Follow the
installation procedure below.

1. Get the installer from the website. Go to


ni.com/multisim and click on the Download NI
Multisim tab under the Learn menu on the left.
Alternatively, you can go to ni.com/multisim/try.

2. Begin the download process. For academic users,


fill out the profile form and select Continue at the
bottom.

Module 4: Integrated Circuits | Page 5 of 7


Logic Circuits and Devices
Module 4: Integrated Circuits (IC)

3. Select Start Download and save the 14. Select Next » to begin the installation process.
NI-Circuit-xx-x-x-Education-downloader.exe file. After the installation is complete select Next » to
This is an application that manages the download close the dialog.
process.
15. You can now launch Multisim from the start menu
4. Once the download finishes, open it through your under All Programs » National Instruments » Circuit
browser or from where you saved the file (Windows Design Suite xx.x » Multisim xx.x.
default is your Download directory).

5. Download the program installer. For all users, the


National Instruments Downloader will ask for a
directory to save the installer file. Choose ACTIVITY
whichever directory you want to download the
Multisim Installer to. The Downloads folder is
recommended for this. Answer the following questions.
6. After the download finishes, select Open Folder.
This will take you to where the .EXE file was saved 1. What are the group of ICs that are most likely used
(or go to the folder where you saved the download). on devices requiring low power consumption.

7. Double click to run the installation. When the


splash screen for the self extractor appears, click 2. It is the power available from power supplies that
OK. The next screen will show you where the is consumed by the logic gate.
extraction will be saved. Leave this on the default
settings (it will extract the files to a folder in your C
drive called National Instruments Downloads. 3. A single package chip that contains million of
gates used by devices such as micro-computers.
8. Select Unzip. Once the extraction is complete, the
Multisim splash screen will appear. Select Install
NI Circuit Design Suite xx.x. 4. Identify the input pins of quad 2-input XOR gate IC.

9. Installing Multisim. Click on the Next » button after


5. What are the common pins of all the logic gates
the splash screen for the Multisim installation
ICs in their pin configurations.
appears.

10. Fill out the blanks and choose the Install this
6. The type of IC that has fewer than 10 gates and
product for evaluation option. You can leave this
limited by the number of pins available in it.
option as default to install Multisim in your
Program Files directory. Select Next ».
7. The average transition delay time for a signal to
11. The Installation Features page will ask you what
propagate from input to output is what we call
you want to install. If the installer detects LabVIEW
.
in your system and you are planning on trying the
co-simulation capabilities on Multisim at some 8. The type of ICs that perform specific elementary
point, then let the installer install the plug-ins (for digital operations with hundreds or more gates in a
the current and an earlier version of LabVIEW). single package.
12. For the academic users, you will get the extra NI 9. Logic gates technology that are suitable in
ELVIS plug-in. It is recommended that you click on systems that needs high-speed operations.
the left of the feature and select Do not install NI
ELVISmx 4.x. This will only work if you have an NI
ELVIS unit with you, and can be installed separately 10. Fabricated on a die of a silicon semiconductor
with the NI ELVIS installation. Select Next » to crystal containing the electronic component for
proceed. constructing digital gates is called
.
13. Select I accept the License Agreement, and click
Next ». The installer will now list and outline the
changes or upgrades (in case you already have
Multisim software installed).

Module 4: Integrated Circuits | Page 6 of 7


Logic Circuits and Devices
Module 4: Integrated Circuits (IC)

SUMMARY

Integrated circuits are the core of electronics. In this


article, we have only covered simple classifications of
modern ICs. This covers just a small titbit of all-about
IC technologies. IC design and manufacturing
processes, both are endless topics. There is a lot more
to know about ICs. The future of integrated circuits lies
in nano-electronics. It is yet another vast and
fascinating topic.

REFERENCES

[1] Roth, Charles. H., et.al. Digital Systems Design Using


Verilog, First Edition. Cengage Learning, Boston, M.A.
USA(2016)
[2] https://byjus.com/physics/integrated-circuit/ ac-
cessed 11/8/21
[3] Mano, Morris and Michael D. Ciletti Digital De-
sign, 5th edition. Pearson Education, Inc. New Jersey,
USA.(2013)
[4] https://www.engineersgarage.com/what-are-the-
different-types-of-integrated-circuits/ accessed
11/8/21
[5] https://www.electrically4u.com/classification-and-
characteristics-of-digital-logic-family/

Prepared by:
ENGR. IRENE F. SALVADOR, CPE, MSME
Faculty, Computer Engineering Department
College of Engineering and Architecture

Module 4: Integrated Circuits | Page 7 of 7

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