SMT TROUBLE

SHOOTING GUIDE

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 SMT TROUBLE SHOOTING OUTLINE

▪ Solder balling/spattering ▪ Tombstoning

▪ Solder beading ▪ Cold solder joints
▪ Bridging ▪ Disturbed joints
▪ Non-wet opens (NWO)/Head in ▪ Excessive fillet/too much solder
pillow (HiP) ▪ Nonwetting/dewetting
▪ Insufficient fillet/solder ▪ Grainy joints/graping
▪ Voiding

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 SOLDER BALLING/SPATTERING
Definition: Solder balling or spattering refers to the formation of tiny solder balls
adjacent to solder joints or scattered across the PCB surface after the reflow
process. These unintended solder balls can potentially cause short circuits if they
bridge adjacent conductive areas.

How to Recognize: Solder balling can be visually identified by the presence

of small, round solder beads on or around the soldered areas of the PCB.
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 SOLDER BALLING/SPATTERING: CAUSES AND SOLUTIONS

Problem Cause Solution

Rapid flux volatilization If the flux within the solder paste Adjust the reflow profile, allowing for a
volatilizes too quickly, it can spatter more controlled flux volatilization during
solder particles. the soak stage.
Oxidized solder paste Oxidized solder particles may not Use fresh solder paste and ensure proper
coalesce well with the rest of the storage to minimize oxidation. Make sure
paste, leading to isolated solder balls. paste is not on PCB for too long before
reflow. Consider using a mild cleaning
agent if oxidation is suspected.
Aggressive reflow An overly aggressive or inappropriate Optimize the reflow profile to ensure a
profile reflow profile can cause solder smooth and controlled melting and
spattering. solidification of the solder.

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 SOLDER BEADING
Definition: Solder beading refers to the formation of small solder beads or balls
typically located adjacent to chip components, such as resistors or capacitors, after
the reflow process. Unlike random solder balling, solder beading is usually
positioned close to the terminations of passive components.
Solder Beads

How to Recognize: Solder beading can be visually identified by spotting

tiny solder balls positioned near the ends of chip components. These beads
are typically larger and more defined than the more randomly dispersed
solder balls caused by balling or spattering.
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 SOLDER BEADING: CAUSES AND SOLUTIONS

Problem Cause Solution

Excessive solder paste Depositing too much solder paste can Start by increasing squeegee pressure to
lead to the formation of solder beads, see if this resolves the issue. If not, adjust
especially near chip components. the stencil design to ensure appropriate
solder paste deposition and ensure
accurate printer calibration.
Reflow ramp-up too A slow reflow profile ramp up can Adjust the reflow profile, using a ramp up
slow cause capillary action to draw the rate of 1.5 to 2.5◦C per second.
unreflowed paste away from the pad,
leading to solder beading.
Oxidation or Contaminated or oxidized pads or Store solder paste under recommended
contamination solder paste can hinder coalescence, conditions and ensure PCBs are clean and
causing the solder to bead up. free from oxidation.

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 BRIDGING
Definition: A defect in which an unintended solder connection forms between
adjacent pads or component leads. This can potentially create short circuits,
affecting the functionality of the circuit.

How to Recognize: Bridging can be visually identified by observing solder

connections between two adjacent pads or leads where there shouldn't be
any. These connections can appear as thin solder filaments or broader solder
masses spanning between pads.

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 BRIDGING: CAUSES AND SOLUTIONS

Problem Cause Solution

Cold slump Paste slumps due to incorrect Check viscosity of the paste. If correct,
viscosity or as a result of shear forces lower the print speed to see if the
from the squeegee. problem persists. If slumping is humidity
related, try using fresh paste.
Excessive solder paste Too much solder paste is deposited Ensure proper squeegee pressure during
deposition on the pads, leading to an overflow the printing process. Adjust the stencil
that can connect adjacent pads design, reduce aperture size or thickness
during reflow. if needed.
Reflow profile issues An inappropriate reflow profile can Optimize the reflow profile to ensure
cause paste deposits to settle or complete and uniform melting of the
spread out during the ramp up cycle, solder paste. Consider shortening the
and spread out to the adjacent pad. ramp up time or changing the profile
type.

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 BRIDGING: CAUSES AND SOLUTIONS

Problem Cause Solution

Inconsistent or uneven Excessive part placement pressure, Check and adjust placement settings as
forces insufficient board support, or needed.
incorrect alignment may push paste
into places it doesn’t belong.
Squeegee issues during Incorrect squeegee angle, speed, or Adjust squeegee settings for optimal
printing pressure during solder paste printing solder paste deposition.
can lead to uneven paste deposition.
PCB design issues Pads that are too close together or Review and adjust PCB pad layouts,
improper pad design can make considering component specifications
bridging more likely. and soldering requirements.

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 NON WET OPENS (NWO)/HEAD IN PILLOW (HIP)
Definition: NWO occur when solder does not wet to one or both connection pads,
resulting in an open circuit. HiP are a type of NWO that arise when the solder ball on a BGA
or CSP component appears to rest on the solder paste without merging with after reflow.
Other names for NWO defects include "foot in mud" and "ball in socket".

How to Recognize: In general, NWO can be identified visually by observing a

clear gap or separation between the solder and one (or both) of the connection
pads. It's best recognized using X-ray inspection, where the solder ball and solder
paste appear distinct, lacking the expected coalescence. The defect often
manifests as an intermittent electrical connection.

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 NWO/HIP: CAUSES AND SOLUTIONS
Problem Cause Solution
Reflow profile issues An inappropriate reflow profile can Review/optimize the profile to match the
cause the solder paste to reflow solder paste and component
before the solder ball has a chance to specifications. Consider reducing reflow
merge with it, or result in inadequate peak temperature or increasing bottom-
heat, preventing proper wetting. side heat.
Oxidation of solder Oxidation prevents solder from Ensure components and PCBs are
ball, paste, pads, or wetting properly, leading to NWO/HiP clean and free from oxidation. Consider
leads defects. using a mild cleaning agent .
Insufficient solder If there isn't enough solder paste Adjust the stencil design, print speed,
paste volume deposited, the solder ball might not and squeegee pressure settings to ensure
make proper contact, leading to HiP. adequate solder paste deposition.
Insufficient flux activity Flux promotes solder wetting by Use solder paste with appropriate flux
removing oxides from surfaces. If activity. Consider the application of
there's insufficient flux activity, additional flux if solder paste flux is not
wetting can be impeded. sufficient.

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 INSUFFICIENT FILLS, FILLETS, OR SOLDER
Definition: This defect is characterized by a lack of sufficient solder in the joint,
leading to incomplete or weak connections. Insufficient fillet means that the solder
does not fully form the expected shape, resulting in a potentially weaker joint.

Good Fillet

How to Recognize: Insufficient solder can be visually identified by

observing that the solder joint appears incomplete or not fully formed. The
solder might not have completely covered the pad, or the fillet might appear
shallow or non-existent. The joint may also lack the typical concave shape at
the component lead-to-pad interface.

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 INSUFFICIENT FILLET/SOLDER: CAUSES AND SOLUTIONS

Problem Cause Solution

Scooping Excessive squeegee pressure forces Decrease squeegee pressure.
the edge of the squeegee to dip into
the aperture, scooping out paste
intended to be deposited.
Inadequate solder If not enough solder paste is Adjust the stencil design and aperture
paste deposition deposited on the pad, it can lead to size and ensure proper squeegee
insufficient solder after reflow. This pressure and speed during the printing
may be caused by poor stencil design, process, as well as separation distance
or improper squeegee pressure or and speed.
speed. It can also result if the
separation speed is too fast, not
allowing paste to release from the
stencil.

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 INSUFFICIENT FILLET/SOLDER: CAUSES AND SOLUTIONS

Problem Cause Solution

Stencil misalignment If the stencil is misaligned relative to Ensure machine calibration for accurate
the PCB, it can lead to uneven or stencil alignment and regularly inspect
insufficient solder paste deposition. and clean the stencil.
Component placement Misplaced components can drag Ensure accurate and precise component
issues solder away from the intended placement using calibrated machinery.
location, leading to insufficient solder
in the joint.
Improper viscosity of If solder paste viscosity is too high, it Check viscosity and metal content to see
paste won’t properly roll on the stencil if these meets the manufacturer’s
and/or fill the apertures specifications.

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 VOIDING
Definition: Voiding refers to the formation of air pockets or voids within a solder
joint, especially common in Ball Grid Array (BGA) and Leadless Components. These
voids can impact the mechanical strength, thermal performance, and electrical
integrity of the solder joint.

How to Recognize: Voids are typically not visible on the surface of the
solder joint. They are most commonly detected using X -ray inspection, where
they appear as dark spots or areas within the X-ray image of a solder joint.

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 VOIDING: CAUSES AND SOLUTIONS
Problem Cause Solution
Trapped volatiles in Volatile components in the solder Adjust the reflow profile to allow volatiles
solder paste paste, such as solvents, can outgas to escape more effectively or select
during reflow and become trapped, solder pastes formulated to reduce
forming voids. voiding. Consider modifying stencil
design to aid flux volatilization (ex. I/O
overprint). Choose a solder paste
designed to minimize voiding.
Reflow profile issues An inappropriate reflow profile can Optimize the reflow profile, ensuring a
lead to incomplete outgassing or proper soak period and peak
improper solder coalescence, leading temperature to allow for complete
to voids. Voids may form if peak outgassing.
temperature or time above liquidus
are too low, if the soak is too long or
too hot, or if the ramp rate is
excessive.

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 VOIDING: CAUSES AND SOLUTIONS
Problem Cause Solution
BTC voiding The BTC design may have internal Choose BTC components with minimal
voids or gaps that release gas during internal voids or gas-trapping features.
reflow. Flux with high viscosity or Select flux with low viscosity and strong
poor wetting properties can also trap wetting properties. Adjust stencil design
gas. Incorrect stencil design or for proper paste release, thickness, and
applying too much solder paste can consistent aperture sizes. Apply the
further exacerbate void entrapment. correct amount of solder paste to
prevent excess.
BGA voiding Uneven placement of solder balls or Ensure even placement and uniform
solder paste underneath the BGA solder paste under the BGA. Minimize
package. BGA component warping component warpage through proper
during reflow can create voids, as can handling and reflow profile. Use precise
uneven placement of solder palls or solder ball size and distribution.
paste, or inconsistent/oversized
solder balls.

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 VOIDING: CAUSES AND SOLUTIONS
Problem Cause Solution
QFN voiding Inadequate solder mask openings or Ensure proper solder mask design with
coverage can trap gas. Inconsistent or adequate openings. Precisely control the
excessive solder paste application or amount of solder paste applied. Adjust
QFN component warping during reflow profile to prevent warpage, or
reflow can also lead to voids. increase solder paste volume as needed.
Chip component Inconsistent or excessive solder paste Precisely control solder paste volume for
voiding application, incorrect placement or chip components, ensure accurate
alignment of chip components, or placement and alignment, and adjust
chip component warping during reflow profile to minimize warpage.
reflow can lead to voiding.

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 TOMBSTONING
Definition: A defect in which a two-terminal component (like a resistor or
capacitor) stands vertically on one end after reflow soldering. This results in one
end of the component being soldered correctly while the other end lifts off the pad,
resembling a tombstone.

How to Recognize: Tombstoning can be visually identified by observing

components such as resistors or capacitors standing vertically instead of lying
flat against the PCB. The defect is more prominent with 0402, 0201, or smaller
component sizes.

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 TOMBSTONING: CAUSES AND SOLUTIONS

Problem Cause Solution

Uneven solder paste If one side of the component wets Ensure consistent solder paste deposition
wetting or volume (melts and bonds) faster than the across pads and optimize the reflow
other, it can result in unequal forces, profile for uniform heating. Consider
causing the component to lift. testing components for solderability.
Component If a component is placed off-center, it Ensure accurate and precise component
misplacement increases the chance of tombstoning. placement using calibrated machinery.

Thermal imbalance Different thermal characteristics such Optimize the reflow oven profile and
during reflow as unequal heat sink, or uneven ensure uniform heating across the PCB.
heating during reflow can cause one Increase duration of soak cycle to ensure
end of the component to reflow all parts of the PCB are at uniform
before the other. temperature.

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 COLD SOLDER JOINTS
Definition: A situation where portions of the solder paste do not properly reflow,
leaving residues of unreflowed solder particles and flux. This results in a joint that
may be porous, weak, and lacking the typical smooth appearance of a properly
reflowed joint.

How to Recognize: The defect can be visually identified by observing a

solder joint that appears rough, granular, or matte instead of the typical
smooth and shiny appearance. Under magnification or X -ray, unreflowed
solder particles might be visible within the joint.

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 COLD SOLDER JOINTS: CAUSES AND SOLUTIONS
Problem Cause Solution
Inadequate reflow If the reflow oven does not achieve Review and adjust the reflow profile,
profile the required peak temperature or ensuring it matches the solder paste's
doesn't maintain it long enough, the specifications.
solder paste might not fully reflow.
Expired or degraded Solder paste that's past its shelf life or Always use fresh solder paste and adhere
solder paste has been improperly stored may not to recommended storage conditions to
reflow consistently. Oxidized solder maintain its efficacy. Consider using a
particles within the paste may not mild cleaning agent if oxidation is
melt and coalesce properly during suspected.
reflow.
Reflow in inappropriate Some solder pastes – including ultra Ensure the reflow atmosphere is
atmosphere fine pastes – may require specific compatible with the solder paste being
atmospheres, like nitrogen, for used. Consider reflowing in a nitrogen-
optimal reflow. rich environment if recommended.

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 DISTURBED JOINTS
Definition: A disturbed solder joint is one where the solder has been disrupted or
moved during its solidification process. The joint may not have the desired
mechanical and electrical properties.

How to Recognize: Disturbed joints can be visually identified by their

irregular or deformed appearance. Instead of the typical smooth and shiny
surface, a disturbed joint might appear grainy, matte, or even contain visible
solder waves or ripples. The joint might lack the desired concave fillet shape,
appearing flattened or stretched.

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 DISTURBED JOINTS: CAUSES AND SOLUTIONS

Problem Cause Solution

Movement during If the PCB or components are moved Ensure there's no movement or vibration
solidification or disturbed while the solder is still in of the assembly until the solder has fully
its molten state, it can result in a solidified post-reflow.
disturbed joint.
Rapid cooling rate An overly aggressive cooling rate Adjust the reflow profile, particularly the
post-reflow can cause the solder to cooling rate, to ensure a controlled and
solidify irregularly. gradual solidification of the solder.
Inadequate reflow An inappropriate reflow profile can Review and adjust the reflow profile to
profile cause uneven heating and cooling, ensure uniform heating and controlled
leading to disturbed joints. cooling.

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 EXCESSIVE FILLET/TOO MUCH SOLDER
Definition: A situation where more solder than necessary is present in a solder
joint. The solder joint might appear bulky, and in extreme cases, it could bridge with
adjacent joints or components. Excessive solder can result in mechanical stress on
components, leading to potential reliability issues.

How to Recognize: The defect can be visually identified by observing a

solder joint that appears larger and bulkier than typical. The fillet might
extend significantly up the component lead or even touch the component
body. In severe cases, the excessive solder might form bridges or shorts with
neighboring components or traces.
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 EXCESSIVE FILLET/SOLDER: CAUSES AND SOLUTIONS
Problem Cause Solution
Excessive solder paste Depositing too much solder paste can Adjust the stencil design, thickness, and
deposition lead to excessive solder after reflow. aperture size. Also, ensure proper
squeegee pressure and speed during the
printing process.
Stencil misalignment or A worn-out stencil or one that's Regularly inspect the stencil for wear and
wear misaligned can deposit more solder ensure machine calibration for accurate
paste than intended. alignment. Replace worn stencils as
necessary.
Bleed out Poor stencil design, excess squeegee Inspect stencil and adjust squeegee
pressure, improper gasketing, or pressure to see if this resolves the issue.
viscosity that is too high can result in Check the viscosity of the paste to make
paste bleeding beyond the intended sure it is within specification. Reduce
print area before reflow. squeegee speed in case excessive shear
forces are causing the bleed out.

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 NONWETTING/DEWETTING
Definition: Nonwetting refers to the failure of molten solder to form a cohesive
and continuous bond with the metal surface it's intended to wet. Dewetting occurs
when the solder initially wets the surface but then recedes, leaving areas of the
base material exposed and often resulting in an irregular or rough solder surface.

How to Recognize: Both nonwetting and dewetting can be visually

identified. Nonwetting will show areas where the solder has not bonded to
the surface at all. Dewetting will show areas where solder initially bonded but
then pulled back, leading to exposed base material and a rough, irregular
solder finish.
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 NONWETTING/DEWETTING: CAUSES AND SOLUTIONS
Problem Cause Solution
Misregistered solder If the solder mask is not printed The customer should resolve this issue
mask correctly, this can create areas that with the PCB manufacturer.
do not wet.
Copper migration or If components or boards are old, they Ensure components and boards are
exposed copper may have suffered copper migration. unexpired or newer. Check boards for
Scratches on pads can also result in scratches or defects and make sure there
exposed copper. are no abrasive contaminants.
Oxidation of surfaces Oxidation of the PCB pads, Ensure that components and PCBs are
component leads, or solder itself can clean and free from oxidation. Store
prevent proper wetting. solder paste and other materials under
recommended conditions. Consider using
a mild cleaning agent if oxidation is
suspected.

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 NONWETTING/DEWETTING: CAUSES AND SOLUTIONS
Problem Cause Solution
Inadequate flux activity Flux facilitates solder wetting by Use solder paste with appropriate flux
removing oxides. Insufficient or activity. If solder paste flux is insufficient,
inactive flux can lead to nonwetting. consider applying additional flux.
Contaminated surfaces Residues, contaminants, or handling Ensure all surfaces are clean before
can lead to surface contamination, soldering. Implement cleaning processes
preventing proper wetting. if contamination is suspected.
Inappropriate reflow An unsuitable reflow profile can lead Review and optimize the reflow profile to
profile to inadequate heat, preventing ensure it matches the solder paste and
proper solder wetting. component specifications.
Rapid cooling For dewetting specifically, rapid Adjust the reflow profile, especially the
cooling can cause the solder to pull cooling rate, to ensure a controlled
back after initial wetting. solidification of the solder.

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 GRAINY JOINTS/GRAPING
Definition: Grainy joints, also known as graping, refer to a solder joint defect
where the solder appears rough and grainy, or like a bunch of grapes after reflow.

How to Recognize: Grainy joints can be visually identified by the distinct

granular texture on the solder joint surface.

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 GRAINY JOINTS/GRAPING: CAUSES AND SOLUTIONS
Problem Cause Solution
Oxidized solder If solder particles within the paste are Use fresh solder paste and ensure proper
particles oxidized, they may not coalesce storage conditions to prevent oxidation.
smoothly, leading to a grainy Consider a mild cleaning agent if
appearance. oxidation is suspected.
Aggressive reflow An overly aggressive reflow profile, Optimize the reflow profile to ensure a
profile especially during the ramp-up stage, gradual and uniform melting of solder
can cause solder particles to reflow particles. In particular, adjust the soak
prematurely and individually. If the and ramp-up stages, to allow for a more
flux within the solder paste volatilizes gradual flux volatilization.
too quickly, it can lead to graping.
Reflow in air vs Reflowing in air, especially for some Consider reflowing in a nitrogen
nitrogen solder paste formulations, can lead to atmosphere, especially for lead-free
increased oxidation and grainy joints. solder pastes that may be more
susceptible to oxidation.

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 THANK YOU

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