INTEGRATED CIRCUITS

DATA SHEET

PCF84C81A
Telecom microcontroller
Product specification 1998 Apr 20
Supersedes data of 1996 Nov 20
File under Integrated Circuits, IC14
Philips Semiconductors Product specification

Telecom microcontroller PCF84C81A

CONTENTS

1 FEATURES
2 GENERAL DESCRIPTION
3 ORDERING INFORMATION
4 BLOCK DIAGRAM
5 PINNING INFORMATION
5.1 Pinning
5.2 Pin description
6 INSTRUCTION SET
7 HIGH SINK OUTPUT CURRENTS
8 ROM MASK OPTIONS
9 HANDLING
10 LIMITING VALUES
11 DC CHARACTERISTICS
12 AC CHARACTERISTICS
13 PACKAGE OUTLINES
14 SOLDERING
14.1 Introduction
14.2 DIP
14.2.1 Soldering by dipping or by wave
14.2.2 Repairing soldered joints
14.3 SO
14.3.1 Reflow soldering
14.3.2 Wave soldering
14.3.3 Repairing soldered joints
15 DEFINITIONS
16 LIFE SUPPORT APPLICATIONS
17 PURCHASE OF PHILIPS I2C COMPONENTS

1998 Apr 20 2
Philips Semiconductors Product specification

Telecom microcontroller PCF84C81A

1 FEATURES
• Manufactured in silicon gate CMOS process
• 8-bit CPU, ROM, RAM, I/O in a 28-lead package
• 8 kbyte ROM, 256 byte RAM (PCF84C81A)
• I2C-bus interface with multi-master capability
• Over 100 instructions (based on MAB8048) all of 2 GENERAL DESCRIPTION
1 or 2 cycles This data sheet details the specific properties of the
• 20 quasi-bidirectional I/O Port lines PCF84C81A. The shared properties of the PCF84CxxxA
• High sink current capability on the 8 lines of Port 1 family of microcontrollers are described in the
“PCF84CxxxA family” data sheet which should be read in
• 8-bit programmable timer/event counter 1
conjunction with this publication.
• 3 single-level vectored interrupts:
The PCF84C81A is a general purpose CMOS
– external
microcontroller with 8 kbytes of program memory and
– 8-bit programmable timer/event counter 1 256 bytes of RAM. In addition to 20 I/O port lines, the
– I2C-bus microcontrollers provide an on-chip I2C-bus interface. This
two-line serial bus extends the microcontroller capabilities
• Two test inputs, one of which also serves as the external
when implemented with the powerful I2C-bus peripherals.
interrupt input
These include LCD drivers, I/O expanders, telecom
• Stop and Idle modes circuits, ADC and DAC converters, clock/calendar circuits,
• Supply voltage: 2.5 to 5.5 V EEPROM and RAM and are listed in “Data Handbook
• Clock frequency: 1 to 16 MHz IC12, I2C Peripherals”.

• Operating temperature: −40 to +85 °C. The instruction set is based on that of the MAB8048 and
is a sub-set of that listed in the “PCF84CxxxA family” data
sheet.

3 ORDERING INFORMATION (see note 1)

PACKAGE
TYPE NUMBER
NAME DESCRIPTION VERSION
PCF84C81AP DIP28 plastic dual in-line package; 28 leads (600 mil) SOT117-1
PCF84C81AT SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1

Note
1. Please refer to the Order Entry Form (OEF) for the full type number to use when ordering. This type number will also
specify the required program and the ROM mask options.

1998 Apr 20 3
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1998 Apr 20

Philips Semiconductors
Telecom microcontroller
BLOCK DIAGRAM
P2.0 to P2.2 P1.0 to P1.7 P0.0 to P0.7
RESIDENT ROM
SCLK SDA/P2.3 2 kbytes
3 8 8
(PCF84C21A)
4 kbytes
CLOCK DATA PORT 2 PORT 1 (PCF84C41A) PORT 0
BUFFER BUFFER 8 kbytes BUFFER
(PCF84C81A)
PORT 2 PORT 1 PORT 0
DECODE
FLIP-FLOPS FLIP-FLOPS FLIP-FLOPS

INTERNAL
MEMORY
CLOCK
BANK
FREQ.
FLIP-FLOPS
30

32 TIMER/ HIGHER LOWER PROGRAM

I2C-BUS EVENT PROGRAM PROGRAM STATUS
INTERFACE COUNTER COUNTER COUNTER WORD
T1

8 4 8 8 5 8 8 8 8

8
8 8 8 8 8

MULTIPLEXER
4

INTERRUPT TEMPORARY TEMPORARY

ACCUMULATOR REGISTER 2 REGISTER 1
LOGIC REGISTER 0
RAM REGISTER 1
timer interrupt ADDRESS REGISTER 2
REGISTER REGISTER 3
SIO/
derivative ARITHMETIC INSTRUCTION REGISTER 4
interrupt LOGIC UNIT REGISTER REGISTER 5
&
D REGISTER 6
DECODER
E REGISTER 7
C
O 8 LEVEL STACK
D (VARIABLE LENGTH)
INT / T0
E
OPTIONAL SECOND
T1 REGISTER BANK
external interrupt TIMER
CONDITIONAL
DECIMAL FLAG
BRANCH
ADJUST DATA STORE
LOGIC CARRY

STOP ACC

PCF84C81A
CONTROL &

Product specification
TIMING ACC BIT RESIDENT RAM ARRAY
IDLE INT / T0 RESET XTAL 1 XTAL 2 TEST
handbook, full pagewidth

MBB561

INTERRUPT INITIALIZE
OSCILLATOR

Fig.1 Block diagram.

Fig.1 Block diagram of PCF84C21A; PCF84C41A and PCF84C81A.
Philips Semiconductors Product specification

Telecom microcontroller PCF84C81A

5 PINNING INFORMATION 5.2 Pin description

5.1 Pinning Table 1 DIP28 and SO28 packages
SYMBOL PIN FUNCTION
P2.2 1 1 bit of Port 2: 4-bit
handbook, halfpage
P2.2 1 28 VDD quasi-bidirectional I/O port
SDA/P2.3 2 27 P2.1
SDA/P2.3 2 bidirectional data line of the
I2C-bus interface, or 1 bit of
SCLK 3 26 P2.0 Port 2: 4-bit quasi-bidirectional
P0.0 4 25 P1.7 I/O port
P0.1 5 24 P1.6
SCLK 3 bidirectional clock line of the
I2C-bus interface
P0.2 6 23 P1.5
P0.0 to P0.7 4 to 11 8 bits of Port 0: 8-bit
P0.3 7 22 P1.4 quasi-bidirectional I/O port
PCF84C81A
P0.4 8 21 P1.3 INT/T0 12 Interrupt/Test 0
P0.5 9 20 P1.2
T1 13 Test 1/count input of 8-bit
timer/event counter 1
P0.6 10 19 P1.1
VSS 14 ground
P0.7 11 18 P1.0
XTAL1 15 crystal oscillator input or
INT/T0 12 17 RESET external clock input
T1 13 16 XTAL2
XTAL2 16 crystal oscillator output
VSS 14
RESET 17 Reset input
15 XTAL1
P1.0 to P1.7 18 to 25 8 bits of Port 1: 8-bit
MBB562
quasi-bidirectional I/O port
P2.0 to P2.1 26 to 27 2 bits of Port 2: 4-bit
Fig.2 Pin configuration. quasi-bidirectional I/O port
VDD 28 positive supply

6 INSTRUCTION SET 7 HIGH SINK OUTPUT CURRENTS

See the “PCF84CxxxA family ” data sheet for a complete The Port 1 outputs of these devices are designed for high
description of the instruction set. current drive in the logic 0 state. They are capable of
driving 10 mA loads and higher. Applications include drive
for small relays and light-emitting diodes (LEDs).
To avoid overload, care should be taken that the total
Port 1 current averages less than 80 mA, i.e. an average
of 10 mA per Port 1 line. Refer to Chapter “Limiting values”
which specifies an upper limit of 100 mA for ISS.

1998 Apr 20 5
Philips Semiconductors Product specification

Telecom microcontroller PCF84C81A

8 ROM MASK OPTIONS

ROM CODE OPTION

Program/data Any mix of instructions and data up to ROM size of
8 kbytes.
Port Output
P0.0 to P0.7 standard open-drain push-pull
P1.0 to P1.7 standard open-drain push-pull
P2.0 to P2.2 standard open-drain push-pull
SDA/P2.3 − open-drain −
Port State after reset
P0.0 to P0.7 set reset −
P1.0 to P1.7 set reset −
P2.0 to P2.2 set reset −
SDA/P2.3 set − −
Oscillator
Transconductance LOW (gmL) MEDIUM (gmM) HIGH (gmH)

9 HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, it is good practice to take
normal precautions appropriate to handling MOS devices. See “Data Handbook IC14, Section: Handling MOS devices”.

10 LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER MIN. MAX. UNIT
VDD supply voltage −0.5 +7 V
VI all input voltages −0.5 VDD + 0.5 V
II DC input current −10 +10 mA
IO DC output current except Port 1 output LOW −10 +10 mA
IO DC output current, Port 1 output LOW −10 +20 mA
Ptot total power dissipation − 125 mW
PO power dissipation per output − 30 mW
IDD supply current −50 +50 mA
ISS ground supply current −100 +50 mA
Tstg storage temperature range −55 +150 °C
Tj operating junction temperature − 90 °C

1998 Apr 20 6
Philips Semiconductors Product specification

Telecom microcontroller PCF84C81A

11 DC CHARACTERISTICS
VDD = 2.5 to 5.5 V; VSS = 0 V; Tamb = −40 to +85 °C; all voltages with respect to VSS; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VDD operating supply voltage see Fig.3 2.5 − 5.5 V
IDD operating supply current note 1; see Figs 4 and 5
VDD = 3 V; fxtal = 3.58 MHz (gmL) − 0.3 0.6 mA
VDD = 5 V; fxtal = 10 MHz (gmL) − 1.1 3.0 mA
VDD = 5 V; fxtal = 16 MHz (gmM) − 1.7 5.0 mA
VDD = 5 V; fxtal = 16 MHz (gmH) − 2.5 6.0 mA
IDD(idle) supply current (Idle mode) note 1; see Figs 6 and 7
VDD = 3 V; fxtal = 3.58 MHz (gmL) − 0.2 0.4 mA
VDD = 5 V; fxtal = 10 MHz (gmL) − 0.8 1.6 mA
VDD = 5 V; fxtal = 16 MHz (gmM) − 1.2 4.0 mA
VDD = 5 V; fxtal = 16 MHz (gmH) − 1.7 5.0 mA
IDD(stp) supply current (Stop mode) VDD = 2.5 V; notes 1 and 2; see Fig.8 − 1.2 10 µA
Inputs
VIL LOW level input voltage 0 − 0.3VDD V
VIH HIGH level input voltage 0.7VDD − VDD V
ILI input leakage VSS ≤ VI ≤ VDD −1 − +1 µA
Outputs
IOL LOW level output sink current VDD = 5 V; VO = 0.4 V; see Fig.9 1.6 5 − mA
[except Port 1; SDA/P2.3 and
SCLK]
IOL1 LOW level output sink current; VDD = 5 V; VO = 1.2 V; see Fig.10 10 19 − mA
Port 1
IOL2 LOW level output sink current; VDD = 5 V; VO = 0.4 V; see Fig.11 3 6.5 − mA
SDA/P2.3 and SCLK
IOH HIGH level pull-up output VDD = 5 V; VO = 3.5 V; see Fig.12 40 100 − µA
source current VDD = 5 V; VO = 0 V; see Fig.12 − −140 −400 µA
IOH1 HIGH level push-pull output VDD = 5 V; VO = 4.6 V; see Fig.13 −1.6 −7 − mA
source current
Oscillator (see Fig.14)
gmL LOW transconductance VDD = 5 V 0.2 0.4 1.0 mS
gmM MEDIUM transconductance VDD = 5 V 0.9 1.6 3.2 mS
gmH HIGH transconductance VDD = 5 V 3.0 4.5 9.0 mS
RF feedback resistor 0.3 1.0 3.0 MΩ
Notes
1. VIL = VSS; VIH = VDD; open drain outputs connected to VSS; all other outputs, including XTAL2, open (typical values
at 25 °C with crystal connected between XTAL1 and XTAL2).
2. VIL = VSS; VIH = VDD; RESET and T1 at VSS; INT/T0 at VDD; crystal connected between XTAL1 and XTAL2; open
drain outputs connected to VSS; all other outputs open.

1998 Apr 20 7
Philips Semiconductors Product specification

Telecom microcontroller PCF84C81A

MBC953 - 1 MLA712
18 3
handbook, halfpage handbook, halfpage

f xtal I DD
(MHz) (mA)
16 MHz

12 2

10 MHz

guaranteed
6 operating range 1
3.58 MHz

0 0
1 3 5 7 1 3 5 7
V DD (V) V DD (V)

Supply current based on optimal oscillator selection.

Fig.3 Maximum clock frequency as a function of Fig.4 Typical operating supply current (IDD) as a
operating supply voltage (VDD). function of operating supply voltage (VDD).

MBB563
MLA713 - 1
3 1.5
handbook, halfpage handbook, halfpage

IDD(idle) 16 MHz
I DD
(mA) (mA)

2 1.0
10 MHz
5V

1 0.5
3.58 MHz

3V

0 0
100 1 3 5 7
0.1 1 10 V DD (V)
f xtal (MHz)

Supply current based on optimal oscillator selection.

Supply current based on optimal oscillator selection.
Fig.6 Typical supply current in Idle mode (IDD(idle))
Fig.5 Typical operating supply current (IDD) as a as a function of operating supply voltage
function of clock frequency (fxtal). (VDD).

1998 Apr 20 8
Philips Semiconductors Product specification

Telecom microcontroller PCF84C81A

MBB564 - 1 MBC954
1.5 3
handbook, halfpage handbook, halfpage

IDD(idle) 5V IDD(stp)
(mA) (µA)

1.0 2

o
85 C
o
25 C
0.5 1
3V

0 0
0.1 1 10 100 1 3 5 7
f xtal (MHz) V DD (V)

Supply current based on optimal oscillator selection.

Fig.8 Typical supply current in Stop mode

Fig.7 Typical supply current in Idle mode (IDD(idle)) (IDD(stp)) as a function of operating supply
as a function of clock frequency (fxtal). voltage (VDD).

MBB565 MBB566
16 60
handbook, halfpage

I OL IOL1
(mA) (mA)

12 40

8 20

4 0
1 3 5 7 1 3 5 7
V DD (V) VDD (V)

VO = 0.4 V. VO = 1.2 V.

Fig.9 Typical LOW level output sink current (IOL) Fig.10 Typical LOW level output sink current for
as a function of operating supply voltage Port 1 (IOL1) as a function of operating
(VDD). supply voltage (VDD).

1998 Apr 20 9
Philips Semiconductors Product specification

Telecom microcontroller PCF84C81A

MBB567 MBC960
16 300
handbook, halfpage

IOL2 I OH
(mA) (µA)

12 200
VO = VSS

VO = 0.7 V DD
8 100

4 0
1 3 5 7 1 3 5 7
VDD (V) V DD (V)

Fig.11 Typical LOW level output sink current for Fig.12 Typical HIGH level pull-up output source
SDA/P2.3 or SCLK (IOL2) as a function of current (IOH) as a function of operating
operating supply voltage (VDD). supply voltage (VDD).

MBC961 MBC962
12 6
handbook, halfpage handbook, halfpage

I OH1 gm g mH
(mA) (mS)

8 4

4 2
g mM

g mL

0 0
1 3 5 7 1 3 5 7
V DD (V) V DD (V)

VOL = VDD − 0.4 V.

Fig.13 Typical HIGH level push-pull output source Fig.14 Typical transconductance values (gm) as a
current (IOH1) as a function of operating function of operating supply voltage (VDD)
supply voltage (VDD). for the options gmL, gmM and gmH.

1998 Apr 20 10
Philips Semiconductors Product specification

Telecom microcontroller PCF84C81A

12 AC CHARACTERISTICS
VDD = 2.5 to 5.5 V; VSS = 0 V; Tamb = −40 to +85 °C; all voltages with respect to VSS; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

tr rise time all outputs VDD = 5 V; Tamb = 25 °C; CL = 50 pF − 30 − ns
tf fall time all outputs VDD = 5 V; Tamb = 25 °C; CL = 50 pF − 30 − ns
fxtal clock frequency see Fig.3 1 − 16 MHz

Table 2 I2C-bus timing (see Figs 15 and 16)

INPUT OUTPUT
SYMBOL PARAMETER
(see Fig.14) (see Fig.15; note 1)
SCLK
tHD;STA START condition hold time 14 DF + 9
≥ -------- ------------------
f xtal 2 × f xtal

tLOW SCLK LOW time 17 DF – 3

≥ -------- ------------------ ; note 2
f xtal 2 × f xtal

tHIGH SCLK HIGH time 17 DF + 3

≥ -------- ------------------ ; note 2
f xtal 2 × f xtal

tRC SCLK rise time ≤1 µs ≤1 µs; note 3

tFC SCLK fall time ≤0.3 µs ≤0.1 µs; note 4
SDA
tBUF bus free time 14 ≥ 4.7 µs; note 5
≥ --------
f xtal

tSU;DAT data set-up time ≥ 250 ns 15

≥ -------- ; note 6
f xtal

tHD;DAT data hold time ≥0 9

≥ --------
f xtal

tRD SDA/P2.3 rise time ≤1 µs ≤1 µs; note 3

tFD SDA/P2.3 fall time ≤0.3 µs ≤0.1 µs; note 4
tSU;STO STOP condition set-up time 14 DF – 3
≥ -------- ------------------
f xtal 2 × f xtal

Notes
1. DF stands for Division Factor: the divisor of fxtal (see the “PCF84CxxxA family” data sheet).
3 ( DF + 1 ) DF – 3
2. Values given for ASC = 0; for ASC = 1: tHIGH = ---------------------------- ; tLOW = ------------------
4 × f xtal 4 × f xtal

3. Determined by I2C-bus capacitance (Cb) and external pull-up resistor.

4. At maximum allowed I2C-bus capacitance Cb = 400 pF.
5. Determined by program.

24 t LOW – 9
6. If tLOW < -------- , tSU:DAT ≥ --------------------- , independent of ASC.
f xtal f xtal

1998 Apr 20 11
Philips Semiconductors Product specification

Telecom microcontroller PCF84C81A

0.7 V DD
SCLK
0.3 VDD

t HIGH t LOW

0.7 V DD
SDA/P2.3
0.3 VDD

t BUF
t RC t HD;DAT t SU;DAT t FC
t SU;STO
MBB568
t HD;STA t RD t FD

Fig.15 Slave SCLK receiver SDA/P2.3 timing (SCLK and SDA/P2.3 are inputs).

t LOW

0.9 VDD
SCLK
VOLmax

t HIGH t FC t FD

0.9 V DD
SDA/P2.3
acknowledge bit V OLmax

t HD;STA
t HD;DAT t HD;DAT t HD;DAT t SU;STO
t SU;DAT MBB569
t SU;DAT

Fig.16 Master SCLK and transmitter SDA/P2,3 timing (SCLK and SDA/P2.3 are outputs).

1998 Apr 20 12
Philips Semiconductors Product specification

Telecom microcontroller PCF84C81A

13 PACKAGE OUTLINES

DIP28: plastic
handbook, full pagewidthdual in-line package; 28 leads (600 mil) SOT117-1
seating plane

D ME

A2 A

L A1

c
Z e w M
b1
(e 1)
b
28 15 MH

pin 1 index

1 14

0 5 10 mm
scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A A1 A2 Z (1)
UNIT max. min. max. b b1 c D (1) E (1) e e1 L ME MH w max.
1.7 0.53 0.32 36.0 14.1 3.9 15.80 17.15
mm 5.1 0.51 4.0 2.54 15.24 0.25 1.7
1.3 0.38 0.23 35.0 13.7 3.4 15.24 15.90
0.066 0.020 0.013 1.41 0.56 0.15 0.62 0.68
inches 0.20 0.020 0.16 0.10 0.60 0.01 0.067
0.051 0.014 0.009 1.34 0.54 0.13 0.60 0.63

Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC EIAJ PROJECTION

92-11-17
SOT117-1 051G05 MO-015AH
95-01-14

1998 Apr 20 13
Philips Semiconductors Product specification

Telecom microcontroller PCF84C81A

SO28: plastic small outline package; 28 leads; body width 7.5 mm SOT136-1

D E A

y HE v M A

28 15

Q
A2 A
A1 (A 3)

pin 1 index
θ
Lp
L

1 14 detail X
e w M
bp

0 5 10 mm
scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A
UNIT max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z
(1)
θ

0.30 2.45 0.49 0.32 18.1 7.6 10.65 1.1 1.1 0.9
mm 2.65 0.25 1.27 1.4 0.25 0.25 0.1 o
0.10 2.25 0.36 0.23 17.7 7.4 10.00 0.4 1.0 0.4 8
0.012 0.096 0.019 0.013 0.71 0.30 0.419 0.043 0.043 0.035 0o
inches 0.10 0.01 0.050 0.055 0.01 0.01 0.004
0.004 0.089 0.014 0.009 0.69 0.29 0.394 0.016 0.039 0.016

Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC EIAJ PROJECTION

95-01-24
SOT136-1 075E06 MS-013AE
97-05-22

1998 Apr 20 14
Philips Semiconductors Product specification

Telecom microcontroller PCF84C81A

14 SOLDERING Several techniques exist for reflowing; for example,

thermal conduction by heated belt. Dwell times vary
14.1 Introduction
between 50 and 300 seconds depending on heating
There is no soldering method that is ideal for all IC method. Typical reflow temperatures range from
packages. Wave soldering is often preferred when 215 to 250 °C.
through-hole and surface mounted components are mixed
Preheating is necessary to dry the paste and evaporate
on one printed-circuit board. However, wave soldering is
the binding agent. Preheating duration: 45 minutes at
not always suitable for surface mounted ICs, or for
45 °C.
printed-circuits with high population densities. In these
situations reflow soldering is often used.
14.3.2 WAVE SOLDERING
This text gives a very brief insight to a complex technology.
Wave soldering techniques can be used for all SO
A more in-depth account of soldering ICs can be found in
packages if the following conditions are observed:
our “Data Handbook IC26; Integrated Circuit Packages”
(order code 9398 652 90011). • A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
14.2 DIP technique should be used.
• The longitudinal axis of the package footprint must be
14.2.1 SOLDERING BY DIPPING OR BY WAVE
parallel to the solder flow.
The maximum permissible temperature of the solder is • The package footprint must incorporate solder thieves at
260 °C; solder at this temperature must not be in contact the downstream end.
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed During placement and before soldering, the package must
5 seconds. be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
The device may be mounted up to the seating plane, but dispensing. The package can be soldered after the
the temperature of the plastic body must not exceed the adhesive is cured.
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling Maximum permissible solder temperature is 260 °C, and
may be necessary immediately after soldering to keep the maximum duration of package immersion in solder is
temperature within the permissible limit. 10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
14.2.2 REPAIRING SOLDERED JOINTS A mildly-activated flux will eliminate the need for removal
Apply a low voltage soldering iron (less than 24 V) to the of corrosive residues in most applications.
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the 14.3.3 REPAIRING SOLDERED JOINTS
soldering iron bit is less than 300 °C it may remain in Fix the component by first soldering two diagonally-
contact for up to 10 seconds. If the bit temperature is opposite end leads. Use only a low voltage soldering iron
between 300 and 400 °C, contact may be up to 5 seconds. (less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
14.3 SO using a dedicated tool, all other leads can be soldered in
14.3.1 REFLOW SOLDERING one operation within 2 to 5 seconds between
270 and 320 °C.
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

1998 Apr 20 15
Philips Semiconductors Product specification

Telecom microcontroller PCF84C81A

15 DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.

16 LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

17 PURCHASE OF PHILIPS I2C COMPONENTS

Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.

1998 Apr 20 16
Philips Semiconductors Product specification

Telecom microcontroller PCF84C81A

NOTES

1998 Apr 20 17
Philips Semiconductors Product specification

Telecom microcontroller PCF84C81A

NOTES

1998 Apr 20 18
Philips Semiconductors Product specification

Telecom microcontroller PCF84C81A

NOTES

1998 Apr 20 19
Philips Semiconductors – a worldwide company
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Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +31 40 27 82785, Fax. +31 40 27 88399
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +64 9 849 4160, Fax. +64 9 849 7811
Tel. +43 1 60 101, Fax. +43 1 60 101 1210 Norway: Box 1, Manglerud 0612, OSLO,
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, Tel. +47 22 74 8000, Fax. +47 22 74 8341
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Philippines: Philips Semiconductors Philippines Inc.,
Belgium: see The Netherlands 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Brazil: see South America
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, Tel. +48 22 612 2831, Fax. +48 22 612 2327
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 689 211, Fax. +359 2 689 102 Portugal: see Spain
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Romania: see Italy
Tel. +1 800 234 7381 Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
China/Hong Kong: 501 Hong Kong Industrial Technology Centre, Tel. +7 095 247 9145, Fax. +7 095 247 9144
72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. +852 2319 7888, Fax. +852 2319 7700 Tel. +65 350 2538, Fax. +65 251 6500
Colombia: see South America Slovakia: see Austria
Czech Republic: see Austria Slovenia: see Italy
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
Tel. +45 32 88 2636, Fax. +45 31 57 1949 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +27 11 470 5911, Fax. +27 11 470 5494
Tel. +358 9 615800, Fax. +358 9 61580/xxx South America: Rua do Rocio 220, 5th floor, Suite 51,
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, 04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Tel. +55 11 821 2333, Fax. +55 11 829 1849
Germany: Hammerbrookstraße 69, D-20097 HAMBURG, Spain: Balmes 22, 08007 BARCELONA,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Tel. +34 3 301 6312, Fax. +34 3 301 4107
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Tel. +46 8 632 2000, Fax. +46 8 632 2745
Hungary: see Austria Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2686, Fax. +41 1 481 7730
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.
Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722 Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66,
Chung Hsiao West Road, Sec. 1, P.O. Box 22978,
Indonesia: see Singapore TAIPEI 100, Tel. +886 2 382 4443, Fax. +886 2 382 4444
Ireland: Newstead, Clonskeagh, DUBLIN 14, Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
Tel. +353 1 7640 000, Fax. +353 1 7640 200 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180, Tel. +66 2 745 4090, Fax. +66 2 398 0793
Tel. +972 3 645 0444, Fax. +972 3 649 1007 Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, Tel. +90 212 279 2770, Fax. +90 212 282 6707
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
Tel. +82 2 709 1412, Fax. +82 2 709 1415 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +1 800 234 7381
Tel. +60 3 750 5214, Fax. +60 3 757 4880 Uruguay: see South America
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Vietnam: see Singapore
Tel. +9-5 800 234 7381
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Middle East: see Italy Tel. +381 11 625 344, Fax.+381 11 635 777

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Internet: http://www.semiconductors.philips.com
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825

© Philips Electronics N.V. 1996 SCA52

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Printed in The Netherlands 455102/00/04/pp20 Date of release: 1998 Apr 20 Document order number: 9397 750 03728