0% found this document useful (0 votes)
11 views18 pages

L6386ED

The L6386E is a high-voltage driver capable of operating up to 600 V, featuring a 400 mA source and 650 mA sink current capability. It includes integrated features such as a bootstrap diode, under-voltage lockout, and CMOS/TTL compatible inputs, making it suitable for driving power MOSFETs or IGBTs. The device supports fast switching times and has a robust design for high-voltage applications.

Uploaded by

Tempestuoso
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
0% found this document useful (0 votes)
11 views18 pages

L6386ED

The L6386E is a high-voltage driver capable of operating up to 600 V, featuring a 400 mA source and 650 mA sink current capability. It includes integrated features such as a bootstrap diode, under-voltage lockout, and CMOS/TTL compatible inputs, making it suitable for driving power MOSFETs or IGBTs. The device supports fast switching times and has a robust design for high-voltage applications.

Uploaded by

Tempestuoso
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 18

L6386E

High-voltage high and low side driver

Features
■ High voltage rail up to 600 V
DIP-14 SO-14
■ dV/dt immunity ±50 V/nsec in full temperature
range

l
■ Driver current capability:

ba
– 400 mA source,
– 650 mA sink Description
■ Switching times 50/30 nsec rise/fall with 1 nF The L6386E is an high-voltage device,
load manufactured with the BCD “off-line” technology.
■ CMOS/TTL Schmitt trigger inputs with
hysteresis and pull down
glo It has a driver structure that enables to drive
independent referenced channel power MOS or
IGBT. The high-side (floating) section is enabled
■ Under-voltage lock out on lower and upper to work with voltage rail up to 600 V. The logic
driving section inputs are CMOS/TTL compatible for ease of
et.
■ Integrated bootstrap diode interfacing with controlling devices.
■ Outputs in phase with inputs
he

Figure 1. Block diagram


BOOTSTRAP DRIVER
tas

Vboot
14
CBOOT
VCC H.V.
UV UV
HVG
4 DETECTION DETECTION R DRIVER
HVG
R
13
3 LEVEL S
da

HIN OUT
SHIFTER
12 TO LOAD
VCC
LOGIC
2 LVG
SD
9
LVG
PGND
w.

DRIVER
1 8
LIN
- DIAG
VREF 5
+
SGND
ww

7 6 CIN

D97IN520D

July 2009 Doc ID 13989 Rev 2 1/18


www.st.com 18
Contents L6386E

Contents

1 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2 Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.1 AC operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.2 DC operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.3 Timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

4 Bootstrap driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.1 CBOOT selection and charging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

5 Typical characteristic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

6 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

7 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

2/18 Doc ID 13989 Rev 2


L6386E Electrical data

1 Electrical data

1.1 Absolute maximum ratings


Table 1. Absolute maximum ratings
Symbol Parameter Value Unit

Vout Output voltage -3 to Vboot - 18 V


Vcc Supply voltage - 0.3 to +18 V
Vboot Floating supply voltage -1 to 618 V
Vhvg High side gate output voltage - 1 to Vboot V
Vlvg Low side gate output voltage -0.3 to Vcc +0.3 V
Vi Logic input voltage -0.3 to Vcc +0.3 V
Vdiag Open drain forced voltage -0.3 to Vcc +0.3 V
Vcin Comparator input voltage -0.3 to Vcc +0.3 V
dVout/dt Allowed output slew rate 50 V/ns
Ptot Total power dissipation (TJ = 85 °C) 750 mW
Tj Junction temperature 150 °C
Tstg Storage temperature -50 to 150 °C

Note: ESD immunity for pins 12, 13 and 14 is guaranteed up to 900 V (human body model)

1.2 Thermal data


Table 2. Thermal data
Symbol Parameter SO-14 DIP-14 Unit

Rth(JA) Thermal resistance junction to ambient 165 100 °C/W

1.3 Recommended operating conditions


Table 3. Recommended operating conditions
Symbol Pin Parameter Test condition Min Typ Max Unit
(1)
Vout 12 Output voltage 580 V
VBS (2) (1)
14 Floating supply voltage 17 V
fsw Switching frequency HVG,LVG load CL = 1 nF 400 kHz
Vcc 4 Supply voltage 17 V
TJ Junction temperature -45 125 °C
1. If the condition Vboot - Vout < 18 V is guaranteed, Vout can range from -3 to 580 V
2. VBS = Vboot - Vout

Doc ID 13989 Rev 2 3/18


Pin connection L6386E

2 Pin connection

Figure 2. Pin connection (Top view)

LIN 1 14 Vboot
SD 2 13 HVG
HIN 3 12 OUT
VCC 4 11 N.C.
DIAG 5 10 N.C.
CIN 6 9 LVG
SGND 7 8 PGND
D97IN521A

Table 4. Pin description


N° Pin Type Function

1 LIN I Low side driver logic input


2 SD(1) I Shut down logic input
3 HIN I High side driver logic input
4 VCC Low voltage supply
5 DIAG O Open drain diagnostic output
6 CIN I Comparator input
7 SGND Ground
8 PGND Power ground
9 LVG (1) O Low side driver output
10, 11 N.C. Not connected
12 OUT O High side driver floating driver
(1)
13 HVG O High side driver output
14 Vboot Bootstrapped supply voltage
1. The circuit guarantees 0.3 V maximum on the pin (@ Isink = 10 mA), with VCC > 3 V. This allows to omit
the “bleeder” resistor connected between the gate and the source of the external MOSFET normally used
to hold the pin low; the gate driver assures low impedance also in SD condition.

4/18 Doc ID 13989 Rev 2


L6386E Electrical characteristics

3 Electrical characteristics

3.1 AC operation
VCC = 15 V; TJ = 25 °C
‘s

Table 5. AC operation electrical characteristics


Symbol Pin Parameter Test condition Min Typ Max Unit

High/low side driver turn-on


ton 110 150 ns
1,3 vs propagation delay
9,13 High/low side driver turn-off
toff Vout = 0 V 110 150 ns
propagation delay
2 vs Shut down to high/low side
tsd 105 150
9,13 propagation delay
tr Rise time CL = 1000 pF 50 ns
9, 13
tf Fall time CL = 1000 pF 30 ns

3.2 DC operation
VCC = 15 V; TJ = 25 °C

Table 6. DC operation electrical characteristics


Symbol Pin Parameter Test condition Min Typ Max Unit

Low supply voltage section

Vcc Supply voltage 17 V


Vccth1 Vcc UV turn on threshold 11.5 12 12.5 V
Vccth2 Vcc UV turn off threshold 9.5 10 10.5 V
Vcchys 4 Vcc UV hysteresis 2 V
Undervoltage quiescent
Iqccu Vcc ≤ 11 V 200 μA
supply current
Iqcc Quiescent current Vcc = 15 V 250 320 μA

Bootstrapped supply section

Vboot Bootstrap supply voltage 17 V


Vbth1 Vboot UV turn on threshold 10.7 11.9 12.9 V
Vbth2 Vboot UV turn off threshold 8.8 9.9 10.7 V
Vbhys 14 Vboot UV hysteresis 2 V
Iqboot Vboot quiescent current HVG ON 200 μA
Vhvg = Vout = Vboot
Ilk High voltage leakage current 10 μA
= 600 V
Bootstrap driver on
Rdson Vcc ≥12.5 V; Vin = 0 V 125 Ω
resistance (1)

Doc ID 13989 Rev 2 5/18


Electrical characteristics L6386E

Table 6. DC operation electrical characteristics (continued)


Symbol Pin Parameter Test condition Min Typ Max Unit

Driving buffers section

9, High/low side source short


Iso VIN = Vih (tp < 10 μs) 300 400 mA
13 circuit current
9, High/low side sink short
Isi VIN = Vil (tp < 10 μs) 500 650 mA
13 circuit current

Logic inputs

Low level logic threshold


Vil 1.5 V
voltage

Vih 1,2, High level logic threshold 3.6 V


3 voltage
Iih High level logic input current VIN = 15 V 50 70 μA
Iil Low level logic input current VIN = 0 V 1 μA

Sense comparator

Vio Input offset voltage -10 10 mV


Iio 6 Input bias current Vcin ≥ 0.5 0.2 μA
Open drain low level output
Vol 2 Iod = -2.5 mA 0.8 V
voltage
Comparator reference
Vref 0.46 0.5 0.54 V
voltage
1. RDS(on) is tested in the following way:
( V CC – V CBOOT1 ) – ( V CC – V CBOOT2 )
R DSON = ------------------------------------------------------------------------------------------------------
-
I 1 ( V CC ,V CBOOT1 ) – I 2 ( V CC ,V CBOOT2 )
where I1 is pin 14 current when VCBOOT = VCBOOT1, I2 when VCBOOT = VCBOOT2

6/18 Doc ID 13989 Rev 2


L6386E Electrical characteristics

3.3 Timing diagram


Figure 3. Input/output timing diagram

HIN
LIN

SD

HOUT
LOUT

VREF

VCIN

DIAG D97IN522A

Note: SD active condition is latched until next negative IN edge.

Doc ID 13989 Rev 2 7/18


Bootstrap driver L6386E

4 Bootstrap driver

A bootstrap circuitry is needed to supply the high voltage section. This function is normally
accomplished by a high voltage fast recovery diode (Figure 4 a). In the L6386E a patented
integrated structure replaces the external diode. It is realized by a high voltage DMOS,
driven synchronously with the low side driver (LVG), with in series a diode, as shown in
Figure 4 b. An internal charge pump (Figure 4 b) provides the DMOS driving voltage. The
diode connected in series to the DMOS has been added to avoid undesirable turn on of it.

4.1 CBOOT selection and charging


To choose the proper CBOOT value the external MOS can be seen as an equivalent
capacitor. This capacitor CEXT is related to the MOS total gate charge:

Q gate
C EXT = --------------
-
V gate

The ratio between the capacitors CEXT and CBOOT is proportional to the cyclical voltage loss.
It has to be:
CBOOT>>>CEXT

e.g.: if Qgate is 30 nC and Vgate is 10 V, CEXT is 3 nF. With CBOOT = 100 nF the drop would be
300 mV.
If HVG has to be supplied for a long time, the CBOOT selection has to take into account also
the leakage losses.
e.g.: HVG steady state consumption is lower than 200 μA, so if HVG TON is 5 ms, CBOOT has
to supply 1 μC to CEXT. This charge on a 1 μF capacitor means a voltage drop of 1 V.
The internal bootstrap driver gives great advantages: the external fast recovery diode can
be avoided (it usually has great leakage current).
This structure can work only if VOUT is close to GND (or lower) and in the meanwhile the
LVG is on. The charging time (Tcharge) of the CBOOT is the time in which both conditions are
fulfilled and it has to be long enough to charge the capacitor.
The bootstrap driver introduces a voltage drop due to the DMOS RDSon (typical value: 125
Ω). At low frequency this drop can be neglected. Anyway increasing the frequency it must be
taken in to account.
The following equation is useful to compute the drop on the bootstrap DMOS:

Q gate
V drop = I ch arg e R dson → V drop = ------------------- R dson
T ch arg e

where Qgate is the gate charge of the external power MOS, RDSon is the on resistance of the
bootstrap DMOS, and Tcharge is the charging time of the bootstrap capacitor.

8/18 Doc ID 13989 Rev 2


L6386E Bootstrap driver

For example: using a power MOS with a total gate charge of 30 nC the drop on the
bootstrap DMOS is about 1 V, if the Tcharge is 5 μs. In fact:

30nC
V drop = --------------- ⋅ 125Ω ∼ 0.8V
5μs

Vdrop has to be taken into account when the voltage drop on CBOOT is calculated: if this drop
is too high, or the circuit topology doesn’t allow a sufficient charging time, an external diode
can be used.

Figure 4. Bootstrap driver

DBOOT

VS VBOOT VBOOT
VS
H.V. H.V.

HVG HVG
CBOOT CBOOT

VOUT VOUT
TO LOAD TO LOAD

LVG LVG

D99IN1056
a b

Doc ID 13989 Rev 2 9/18


Typical characteristic L6386E

5 Typical characteristic

Figure 5. Typical rise and fall times vs Figure 6. Quiescent current vs supply
load capacitance voltage
time D99IN1054 Iq D99IN1057
(nsec) (μA)
250 104

200
Tr 103
150
Tf
100
102
50

0 10
0 1 2 3 4 5 C (nF)
For both high and low side buffers @25˚C Tamb 0 2 4 6 8 10 12 14 16 VS(V)

Figure 7. Turn on time vs temperature Figure 8. VBOOT UV turn on threshold


vs temperature

250 15

@ Vcc = 15V 14 @ Vcc = 15V


200 13
Vbth1 (V)

Typ.
150 12
Ton (ns)

Typ. 11
100 10
9
50
8
0 7
-45 -25 0 25 50 75 100 125 -45 -25 0 25 50 75 100 125
Tj (°C) Tj (°C)

Figure 9. Turn Off time vs temperature Figure 10. VBOOT UV turn off threshold
vs temperature

250 15
@ Vcc = 15V 14 @ Vcc = 15V
200
13
Vbth2 (V)

150 12
Toff (ns)

11
Typ.
100 Typ.
10
9
50
8
0 7
-45 -25 0 25 50 75 100 125 -45 -25 0 25 50 75 100 125
Tj (°C) Tj (°C)

10/18 Doc ID 13989 Rev 2


L6386E Typical characteristic

Figure 11. Shutdown time vs Figure 12. VBOOT UV hysteresis


temperature

250 3
@ Vcc = 15V @ Vcc = 15V
200
2.5

Vbhys (V)
tsd (ns0

150
Typ.
2
Typ.
100

1.5
50

0 1
-45 -25 0 25 50 75 100 125 -45 -25 0 25 50 75 100 125
Tj (°C) Tj (°C)

Figure 13. VCC UV turn on threshold vs Figure 14. Output source current vs
temperature temperature
15 1000
@ Vcc = 15V
14 800
current (mA)
13
Vccth1(V)

600
Typ.
12 Typ.
400
11

10 200

9 0
-45 -25 0 25 50 75 100 125 -45 -25 0 25 50 75 100 125
Tj (°C) Tj (°C)

Figure 15. VCC UV turn off threshold vs Figure 16. Output sink current vs
temperature temperature
12 1000
@ Vcc = 15V
11 800
Typ.
current (mA)
Vccth2(V)

10 600
Typ.
9 400

8 200

7 0
-45 -25 0 25 50 75 100 125 -45 -25 0 25 50 75 100 125
Tj (°C) Tj (°C)

Doc ID 13989 Rev 2 11/18


Typical characteristic L6386E

Figure 17. VCC UV hysteresis vs


temperature
3

2.5
Vcchys (V)

Typ.
2

1.5

1
-45 -25 0 25 50 75 100 125
Tj (°C)

12/18 Doc ID 13989 Rev 2


L6386E Package mechanical data

6 Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of


ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.

Doc ID 13989 Rev 2 13/18


Package mechanical data L6386E

Figure 18. DIP14 mechanical data and package dimensions

mm inch
DIM. OUTLINE AND
MIN. TYP. MAX. MIN. TYP. MAX. MECHANICAL DATA

a1 0.51 0.020

B 1.39 1.65 0.055 0.065

b 0.5 0.020

b1 0.25 0.010

D 20 0.787

E 8.5 0.335

e 2.54 0.100

e3 15.24 0.600

F 7.1 0.280

I 5.1 0.201

L 3.3 0.130
DIP14
Z 1.27 2.54 0.050 0.100

14/18 Doc ID 13989 Rev 2


L6386E Package mechanical data

Figure 19. SO14 mechanical data and package dimensions

mm inch
DIM. OUTLINE AND
MIN. TYP. MAX. MIN. TYP. MAX.
MECHANICAL DATA
A 1.35 1.75 0.053 0.069

A1 0.10 0.30 0.004 0.012

A2 1.10 1.65 0.043 0.065

B 0.33 0.51 0.013 0.020

C 0.19 0.25 0.007 0.01

D (1) 8.55 8.75 0.337 0.344

E 3.80 4.0 0.150 0.157

e 1.27 0.050

H 5.8 6.20 0.228 0.244

h 0.25 0.50 0.01 0.02

L 0.40 1.27 0.016 0.050

k 0˚ (min.), 8˚ (max.)

ddd 0.10 0.004

(1) “D” dimension does not include mold flash, protusions or gate SO14
burrs. Mold flash, protusions or gate burrs shall not exceed
0.15mm per side.

0016019 D

Doc ID 13989 Rev 2 15/18


Ordering information L6386E

7 Ordering information

Table 7. Ordering information


Part number Package Packaging

L6386E DIP14 Tube


L6386ED Tube
SO14
L6386ED013TR Tape and reel

16/18 Doc ID 13989 Rev 2


L6386E Revision history

8 Revision history

Table 8. Document revision history


Date Revision Changes

11-Oct-2007 1 First release


22-Jul-2009 2 Modified Vbth2 on Table 6

Doc ID 13989 Rev 2 17/18


L6386E

Please Read Carefully:

Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.

UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.

Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.

ST and the ST logo are trademarks or registered trademarks of ST in various countries.

Information in this document supersedes and replaces all information previously supplied.

The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.

© 2009 STMicroelectronics - All rights reserved

STMicroelectronics group of companies


Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com

18/18 Doc ID 13989 Rev 2

You might also like