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SiC_Overview

The document provides an overview of Silicon Carbide (SiC) technology, including its applications in Schottky Barrier Diodes, MOSFETs, and power modules. It discusses current developments, such as 2nd and 3rd generation devices, and future directions like 4th generation SiC MOSFETs and packaging innovations. Additionally, it offers tips for successful implementation, including gate driver criteria and performance comparisons.

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Kent Weng
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© © All Rights Reserved
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0% found this document useful (0 votes)
8 views

SiC_Overview

The document provides an overview of Silicon Carbide (SiC) technology, including its applications in Schottky Barrier Diodes, MOSFETs, and power modules. It discusses current developments, such as 2nd and 3rd generation devices, and future directions like 4th generation SiC MOSFETs and packaging innovations. Additionally, it offers tips for successful implementation, including gate driver criteria and performance comparisons.

Uploaded by

Kent Weng
Copyright
© © All Rights Reserved
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 32

Silicon Carbide: A Brief Overview

March 14, 2019


ROHM Semiconductor, USA
Applications Engineering

© 2019 ROHM Co.,Ltd.


SiC: A Brief Overview (this is what we will cover)

• Where we are
• SiC Schottky Barrier Diodes

• SiC MOSFETs (Discrete)

• SiC Power Modules

• Where we are Headed


• Packages with Kelvin connection

• 4th Generation SiC MOSFETs

• Tips for Successful Use


• Gate Driver Criteria

• Consider the Isolated DC/DC Converter

• Check the Gate Drive signal

• Check the overshoot voltage on the Drain

• Look for current shoot-through

© 2019 ROHM Co., Ltd. P. 1


SiC: A Brief Overview

• SiC Diodes
• The #1 choice as the “catch” diode for PFC Boost applications

• Your choice of 80 diodes from 2A – 40A, from 650V – 1200V (20 are AECQ qualified)

• Choice of 2nd Gen or 3rd Gen devices (as of now only 2nd Gen are AECQ qualified)

• 3rd Gen offers the following improvements:


• Improved Surge current rating (IFSM)

• Lower Forward Voltage Drop (VF)

• Lower leakage current (IR)

Figure 1. 3.3 kW Battery Charger


© 2018 ROHM Co.,Ltd. P. 2
Reverse recovery characteristics

Si-FRD 3G SiC-SBD

VR=400V VR=400V

Minority carrier device Majority carrier device


→much depends on temperature →no reverse recovery current

※These data are provided to show a result of evaluation done by ROHM for your reference. ROHM does not
guarantee any of the characteristics shown here.

© 2018 ROHM Co.,Ltd. P. 3


2nd generation SiC-Schottky Barrier Diodes (SBD)

Package TO-220 TO-220FM TO-247 D2pack Bare dies


(LPTL)
K

K A K A
Rated N/C A
voltage A K A

650V 6A~20A 6A~20A 20A~40A 2A~20A 6A~20A(MP)


30A~100A(DS)
1200V 5A~20A 10A~40A 5A~20A
30A, 50A
1700V 10A~50A

Automotive grade AEC-Q101 qualified


650V 6A~20A 20A~40A 6A~20A

1200V 5A~20A 10A~40A

© 2018 ROHM Co.,Ltd. P. 4


3rd Gen SiC-SBD portfolio
 Line up

650V P/N 2A 4A 6A 8A 10A 12A 15A 20A

SCS3xxAH
TO-220ACP-2L
(halogen free)

TO-220FM-2L SCS3xxAM
New
TO-263AB-3L
SCS3xxAJ
(D2PAK/LPTL) New

Mass Production

Note: Automotive (AECQ) Grade is in process. New Device

© 2018 ROHM Co.,Ltd. As of Oct, 2018 P. 5


SiC Discrete MOSFETs

• 2nd Generation devices utilizing Planar technology


• Largest die size for a given ON resistance (RDS(on))
• Longest Short-Circuit Withstand time (SCWT is about 10 microseconds)

• 3rd Generation devices utilizing Trench technology


• About half the ON resistance (RDS(on)) for a given die size

• Short-Circuit Withstand time is lower (SCWT is about 5 microseconds)

• Reduced Input capacitance (Ciss) makes it easier to drive

• Less switching energy losses for both Turn-On and Turn-Off

© 2018 ROHM Co.,Ltd. P. 6


2nd Generation DMOS Portfolio

650V P/N 120mΩ

TO-220AB SCT2120AF

GDS

1200V P/N 80mΩ 160mΩ 280mΩ 450mΩ

SCT2xxxKE
TO-247
SCH2080KE
SBD co-pack
G D S

1700V P/N 750mΩ 1150mΩ

TO-3PFM SCT2H12NZ
D

TO-268-2L SCT2xxxNY G D S

Mass Production G S

© 2018 ROHM Co.,Ltd. P. 7


3G SiC MOSFET Discrete development plan

650V Part No. / Status 17mΩ 22mΩ 30mΩ 60mΩ 80mΩ 120mΩ
TO-247N SCT3xxxAL
on MP
TO-247-4L SCT3xxxAR
MP: Q2/19

TO-263-7L SCT3xxxAW
MP: Q2/19

1200V Part No. / Status 22mΩ 30mΩ 40mΩ 80mΩ 105mΩ 160mΩ
TO-247N SCT3xxxKL
on MP
TO-247-4L SCT3xxxKR
MP: Q2/19

TO-263-7L SCT3xxxKW
MP: Q2/19
* as of Oct 2018
MP: Mass production
Mass Production Under development

© 2018 ROHM Co.,Ltd. P. 8


3G SiC MOSFET Discrete development plan

Automotive grade (AEC-Q101 qualified)

650V Part No. / Status 17mΩ 22mΩ 30mΩ 60mΩ 80mΩ 120mΩ
TO-247N SCT3xxxALHR
New
TO-263-7L SCT3xxxAWHR
MP: Q2/19

1200V Part No. / Status 22mΩ 30mΩ 40mΩ 80mΩ 105mΩ 160mΩ
TO-247N SCT3xxxKLHR
New
TO-263-7L SCT3xxxKWHR
MP: Q2/19

* as of Dec 2018

MP: Mass production Mass Production Under development

© 2018 ROHM Co.,Ltd. P. 9


Full SiC module outline

C type E type G type

 1200V  1200, 1700V  1200V


 80, 120, 180A  180, 250, 300A  400, 600A
 Higher voltage  High current
 Low inductance

17mm
17mm
17mm

© 2019 ROHM Co.,Ltd. P. 10


Low Inductance

 Package evolution of full SiC power modules

LS=25nH LS=13nH LS=10nH


~120A ~300A ~600A > Low stray inductance
LS=10nH
> High current rating
~600A
C type E type G type > Compatible outline with
45.6mm x 122mm 58mm x 152mm 58mm x 152mm
x 17mm x 17mm x 17mm market available IGBT
Under development
modules
 Line up
Voltage Current
Case MOS device Ls
Rating Rating Circuit Thermistor
Type generation (nH)
(V) (A)
BSM400D12P2G003 1200 400 G 2G(planer) Half bridge 10 ○
BSM400D12P3G002 1200 400 G 3G(Trench) Half bridge 10 ○
BSM600D12P3G001 1200 600 G 3G(Trench) Half bridge 10 ○
BSM400C12P3G202 1200 400 G 3G(Trench) Chopper 10 ○
BSM600C12P3G201 1200 600 G 3G(Trench) Chopper 10 ○

© 2019 ROHM Co.,Ltd. P. 11


Low Inductance
Patented
 Feature 1件

> Lower stray inductance by original main terminal structure 特許


出願済

E type G type Effort


Main > Reduction of stray inductance
E type:13nH → G type:10nH
terminal > Reduction of surge voltage by 27%
on same switching loss condition

VDS=600V
ID=300A
Ta=25degC
E type
E type

Surge voltage G type


Voltage

Current

© 2019 ROHM Co.,Ltd. P. 12


Full SiC power modules lineup

Module type Vdss Io (Tc=60℃ ) Part No. MOS Topology Status


C type 80A BSM080D12P2C008 Half bridge on MP
BSM120D12P2C005 2G Planar Half bridge on MP
120A
1200V BSM120C12P2C201 Chopper (boost) on MP
BSM180D12P3C007 Half bridge on MP
122 x 45.6 mm 180A 3G Trench
BSM180C12P3C202 Chopper (boost) on MP
E type BSM180D12P2E002 Half bridge on MP
180A
BSM180C12P2E202 2G Planar Chopper (boost) on MP
BSM300D12P2E001 Half bridge on MP
1200V
BSM300D12P3E005 * Half bridge 2019
300A
BSM300C12P3E201 3G Trench Chopper (boost) on MP
152 x 62 mm BSM300C12P3E301 * Chopper (buck) 2019
1700V 250A BSM250D17P2E004 2G Planar Half bridge on MP NEW

G type BSM400D12P2G003 2G Planar Half bridge on MP


400A BSM400D12P3G002 Half bridge on MP
1200V BSM400C12P3G202 Chopper (boost) on MP
3G Trench
152 x 62 mm BSM600D12P3G001 Half bridge on MP
600A
Low Ls 10nH BSM600C12P3G201 Chopper (boost) on MP

* Under Development

© 2019 ROHM Co.,Ltd. P. 13


Where we are headed - Package roadmap

◆TO-220AC ◆TO-247 2L
THD Halogen free (650V) (1700V)

◆TO-247 (650/1200V)
◆TO-220FM
SiC SBD

◆TO-220AC (650/1200V) 3G SBD (650V)


◆TO-220FM (650V)

SMD
◆TO-263-3L ◆TO-263-3L ◆TO-252 ◆TO-263-2L
(2G SBD) (3G SBD) (1200V)

THD Kelvin source


SiC MOSFET

◆TO-247 (650/1200V) ◆TO-247N ◆TO-247-4L (650/1200V) ◆TO-247-4L (1700V)


◆TO-3PFM (1700V) (Automotive)

SMD
Kelvin source
・ Leadless PKG ?
・ Embedded ?
◆TO-268-2L (1700V) ◆TO-263-7L ◆TO-263-7L (650/1200V)
(650/1200V) (Automotive) Low Ls technology

~2017 2018 2019 2020~


The trend is subject to change without notice.
© 2018 ROHM Co.,Ltd.
As of Feb. 2018 P. 14
PKG images are for illustrative purpose only.
Where we are headed – Gen 4 SiC MOSFET

1200V target spec (compared with Gen 3)


1) Ron*A : reduced by 50%
2) SCWT : > 5 µsec
3) Vgs rating : -10 to 20V (Vgs op is 15V)
4) Int R g : <50%
5) C gd : reduced Gen 2 Gen 3 Gen4
2012~ 2016~ 2019~
6) C gd /C gs : reduced
Structure Planar Trench Trench

Vdsmax 1200V
Target design sample : 2019 Q3 (Chip RonA 8.2mΩcm2 4.1mΩcm2 2.3mΩcm2

sample) SCWT 11usec 5usec >5usec


Vgs -6 to 22V -4 to 22V -6 to 20V
(surge
-10V to 26V)
Vgs op 18V 18V 15V
Internal Rg 6.3Ω 7Ω <3Ω
(same size)
Cgd 16nF 27nF <<16nF
(same size)

P. 19
SiC: A Brief Overview (Tips for Successful Use)

Consider the typical half-bridge topology:

© 2019 ROHM Co., Ltd. P. 16


Gate Driver Selection Criteria:

• Isolation Voltage Requirements (VIORM and VIOWM voltages)?

• Required Regulatory agency approvals in place?

• Automotive (AECQ) requirements?

• Creepage and clearance adequate?

• Appropriate temperature range?

• Input side supply current?

• Output drive current?

• Suitable CMR rating?

• Appropriate safety features?

• Cost and availability?

© 2019 ROHM Co., Ltd. P. 17


Propagation Delay Comparison example

Conditions: BM6105FW, ROHM Eval Board, VCC1=5.0V, VCC2=15V, VEE2=0V, INA=10kHz, OUT1_H/L=No
Load

Turn ON time (Ta = 25℃)


250
BM6105FW ACPL-336J
Opto coupler
(AVAGO)
40ns/div 40ns/div 200
Turn ON time(ACPL-336J)

Time (nsec)
150
Turn OFF time (ACPL-336J)
100 High
Turn OFF time (Ta = 25℃) Speed
Turn OFF time (BM6105FW)
BM6105FW ACPL-336J

40ns/div 40ns/div 50 Turn ON time(BM6105FW)

BM6105FW
0
-75 -50 -25 0 25 50 75 100 125 150 175
Ta (℃)

© 2019 ROHM Co., Ltd. P. 18


SiC: A Brief Overview (Tips for Successful Use)

• Use care when selecting your Isolated DC/DC Converter. Consider the following points:
• Breakdown Voltage Rating

• Capacitance from Primary to Secondary (<20pF)

• Common-Mode Rejection. Is it specified?


Suppliers of Converters include MuRata, Recom, CUI, and Mornsun

Estimated Power can be calculated from:


𝑷𝑷𝒈𝒈𝒂𝒂𝒕𝒕𝒆𝒆=𝑷𝑷𝒅𝒅𝒓𝒓𝒊𝒊𝒗𝒗𝒆𝒆𝒓𝒓+(𝑸𝑸𝒈𝒈𝒂𝒂𝒕𝒕𝒆𝒆𝒇𝒇𝒔𝒔𝒘𝒘Δ𝑽𝑽𝒈𝒈𝒂𝒂𝒕𝒕𝒆𝒆)+(𝑪𝑪gs𝒇𝒇𝒔𝒔𝒘𝒘Δ𝑽𝑽𝒈𝒈𝒂𝒂𝒕𝒕𝒆𝒆²)
or approximated by PDISS ≈ (CISS * 5) * (VCC2)2 * fs

© 2019 ROHM Co., Ltd. P. 19


SiC: A Brief Overview (Tips for Successful Use)

Check the Gate Drive signal:

© 2019 ROHM Co., Ltd. P. 20


SiC: A Brief Overview (Tips for Successful Use)

© 2019 ROHM Co., Ltd. P. 21


SiC: A Brief Overview (Tips for Successful Use)

Tektronix IsoVu Probe is the best ($ 15k - $20k)

Di ffer en t i a l P r o b e

Op t ica lly- is o la t e d P r o b e

© 2019 ROHM Co., Ltd. P. 22


SiC: A Brief Overview (Tips for Successful Use)

Vg s c o m p a r i s o n w i t h o p t i c a l l y i s o l a t e d p r o b e

D iffe re n t ia l P r o b e

O p t i c a l l y-i s o l a t e d
Probe
SiC: A Brief Overview (Tips for Successful Use)

Check to see that V(BR)DSS is not exceeded:


• What is the peak voltage from Source to Drain? Remember the
allowable voltage goes DOWN as the temperature goes DOWN:

© 2019 ROHM Co., Ltd. P. 24


BSM300D12P2E001 Voltage Surge Measurement Conditions

1200 24
Vsurge
Measurement Circuit Inductive Load Chopper 1000 VG 20
S
VD
Current 600A 800 S 16

VDS (V), ID

VGS(V
Drain Voltage 800V 600 12
Gate Voltage On 18V / Off 0V IDS
400 8


Gate Resistance 0.2ohm

(A)
200 4
Inductive Load 250uH 0 0
Junction Temperature 25ª, 125ª -200 -4
C-Snubber (1.2uF) 0.0 0.5 1.0 1.5 2.0
Snubber Circuit Nippon Chemi-con Time(us)
400
HACD1C2V125JTLJ Voltage rate
Z0
Gate Drive IC ROHM BM6103 300
Oscilloscope YOKOGAWA DL7480 25℃

Vsurge
200
YOKOGAWA 700924,

(V)
Differential Voltage Prove 125℃
701921
100
VDC + Voltage surge is under 1150V in this condition.
0
0 2 4 6 8 10
External Gate Resistance (ohm)

※ These data are provided to show a result of evaluation done by ROHM for your reference.
ROHM does not guarantee any of the characteristics shown here.

© 2019 ROHM Co., Ltd. P. 25


SiC: A Brief Overview (Tips for Successful Use)

Another example of cold vs. warm rating:

© 2019 ROHM Co., Ltd. P. 26


SiC: A Brief Overview (Tips for Successful Use)

Remember to use enough dead-time! We


recommend starting with 200 nanoseconds.

If you are using an optically isolated driver,


check the datasheet for propagation delay vs.
temperature.

Remember, MOSFETs take longer to turn-off at


minimum load current, not maximum load!

Use a Rogowski Current Probe to check for


shoot-through.

SiC MOSFETS tolerate only about 5 – 10 usec of


overcurrent before shorting.

Use a snubber if needed

© 2019 ROHM Co., Ltd. P. 27


Snubber module
Confidential

EVSM1D72J2-145MH26 EVSM1D72J2-145MH16
28 22
C type E type & G type

5
5

6.5
6.5

11
11
1200V 1200V

45
45

38 38

8.4
8.4

Capacitor (Murata)
KR355WD72J564MH01 (630VDC )

Note:
The capacitor has been mass produced.
The snubber module is only for evaluation use.

280nF 560nF
© 2019 ROHM Co., Ltd. (2 parallel) P. 28
Bibliography

Figure 1: D. Gautam, F. Musavi, M. Edington, W. Eberle "An Automotive On-Board 3.3 kW


Battery Charger for PHEV Application", Delta-Q Technologies Corp.

Figure 5: “Future Prospects of Widebandgap (WBG) Semiconductor Power Switching Devices”


Krishna Shenai, 2015 IEEE Transactions on Electron Devices

Figure 7: IXYS SiC Power MOSFET Data Sheet IXFN50N120SiC 2018 P.6

Page 22 Pictures: “Driving and Layout Requirements for Fast Switching MOSFETs” Won-suk
Choi, Dong-kook Son, Markus Hallenberger and Sungmo Young, Fairchild Semiconductor
Power Seminar 2010-2011

© 2019 ROHM Co., Ltd. P. 29


Parts may be found at Mouser using these links:

https://www.mouser.com/new/rohmsemiconductor/rohm-sic-power-devices/

https://www.mouser.com/new/rohmsemiconductor/rohm-sic-power-modules/

https://www.mouser.com/new/rohmsemiconductor/rohm-sic-power-mosfet/

https://www.mouser.com/new/rohmsemiconductor/rohm-sic-schottky-barrier-diodes/

https://www.mouser.com/new/rohmsemiconductor/rohm-aec-q101-sic-power-mosfets/

© 2018 ROHM Co.,Ltd. P. 30


© 2019 ROHM Co., Ltd.

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