MLX90393 Triaxis® Magnetic Node

Datasheet

1. Features and Benefits 3. Description

 Absolute Position Sensor IC featuring
The MLX90393 brings the highest flexibility in the
Triaxis® Hall Technology
Triaxis portfolio's smallest packaged assembly.
 Simple & Robust Magnetic Design Additionally, the MLX90393 is designed for
micropower applications, with programmable
 Miniature size for tiny assemblies
duty cycles in the range of 0.1% to 100% allowing
 Selectable SPI and I2C bus protocols for configurable power consumption based on
 Wide dynamic range (5-50mT) with on-the- system requirements.
fly programmable gain
The MLX90393 magnetic field sensor can be
 2.2V-3.6V supply for battery powered reprogrammed to different modes and with
applications, down to 1.8V IO voltage different settings at run-time to fine-tune the
 On board filter settings performance and power consumed. The sensor
offers a 16-bit output proportional to the
 On the fly programmable operating modes magnetic flux density sensed along the X, Y, and Z
and sleep times for micro-power use axes using the Melexis proprietary Triaxis
 External and internal acquisition triggering technology and offers a 16-bit temperature
modes output signal. These digital values are available via
I2C and SPI, where the MLX90393 is a slave on the
 External interrupt pin when the field bus. Multiple sensors can be connected to the
changes same bus, by A0 and A1 hardwired connection (4x)
 On board temperature sensor but also through ordering codes with different SW
address (4x).

By selecting which axes are to be measured, the

raw data can be used as input for further post-
processing, such as for joystick applications,
rotary knobs, and more complex 3D position
sensing applications. Unparalleled performance is
achieved with this sensor, which is primarily
targeting industrial and consumer applications.

2. Application Examples VDD VDD_IO A0 A1

 Non-contacting HMI applications with Bias

State Machine SDA/ MOSI

push-pull functionality
RAM EEPROM SCL/ SCLK
VX
Tria xis® VY
MISO
MUX

VZ Control
G ADC SPI/ I2C

 Rotary knobs & dials VT Interface MS/ CS

Temp Compensation Interrupt

 (Long stroke) Linear motion in one or Temp Sensor Trigger

two axes for levers & sliding switches Oscillator

Low Power
Oscillator
Wake-Up VSS

 Joystick (gimbal or ball & socket)

 Home Security 3D closure detection Figure 1: General Block Diagram
 Accurate liquid level sensing
 Factory automation position sensing
 Magnetic fingerprint detection

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Contents
1. Features and Benefits ............................................................................................................................... 1
2. Application Examples................................................................................................................................ 1
3. Description ............................................................................................................................................... 1
4. Ordering Information ............................................................................................................................... 5
5. Functional Diagram .................................................................................................................................. 6
5.1. QFN-16 Block Diagram ..................................................................................................................... 6
5.2. UTDFN-8 Block Diagram................................................................................................................... 6
6. Glossary of Terms ..................................................................................................................................... 7
7. QFN-16 Pinout .......................................................................................................................................... 8
8. UTDFN-8 Pinout ........................................................................................................................................ 9
9. Absolute Maximum Ratings .................................................................................................................... 10
10. General Electrical Specifications........................................................................................................... 11
11. Thermal Specification ........................................................................................................................... 12
12. Timing Specification ............................................................................................................................. 13
13. Magnetic Specification ......................................................................................................................... 14
13.1. Noise vs Conversion Time ............................................................................................................ 16
14. Mode Selection..................................................................................................................................... 17
14.1. Burst mode ................................................................................................................................... 18
14.2. Single Measurement mode ......................................................................................................... 18
14.3. Wake-Up on Change mode.......................................................................................................... 19
15. Digital Specification .............................................................................................................................. 19
15.1. Command List .............................................................................................................................. 20
15.2. Status Byte ................................................................................................................................... 21
15.3. SPI Communication ...................................................................................................................... 22
15.3.1. Command implementation.................................................................................................... 22
15.3.2. SPI Timing Specification ......................................................................................................... 24
15.4. I2C Communication ...................................................................................................................... 24
15.4.1. Command Implementation.................................................................................................... 25
15.4.2. I2C Timing Specification ......................................................................................................... 27
16. Memory Map ........................................................................................................................................ 28
16.1. General Description ..................................................................................................................... 28

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16.2. Parameter Description ................................................................................................................. 30

16.2.1. ANA_RESERVED_LOW............................................................................................................ 31
16.2.2. BIST ......................................................................................................................................... 31
16.2.3. Z_Series .................................................................................................................................. 31
16.2.4. GAIN_SEL[2:0] ........................................................................................................................ 32
16.2.5. HALLCONF[3:0]....................................................................................................................... 33
16.2.6. TRIG_INT_SEL ......................................................................................................................... 33
16.2.7. COMM_MODE[1:0] ................................................................................................................ 33
16.2.8. WOC_DIFF .............................................................................................................................. 33
16.2.9. EXT_TRIG ................................................................................................................................ 34
16.2.10. TCMP_EN ............................................................................................................................. 34
16.2.11. BURST_SEL[3:0] .................................................................................................................... 34
16.2.12. OSR2[1:0] ............................................................................................................................. 34
16.2.13. RES_XYZ[5:0] ........................................................................................................................ 34
16.2.14. DIG_FILT[1:0] ....................................................................................................................... 34
16.2.15. OSR[1:0] ............................................................................................................................... 34
16.2.16. SENS_TC_HT[7:0] ................................................................................................................. 34
16.2.17. SENS_TC_LT[7:0] .................................................................................................................. 35
16.2.18. OFFSET_i[15:0] ..................................................................................................................... 35
16.2.19. WOi_THRESHOLD[15:0] ....................................................................................................... 35
17. Recommended Application Diagram .................................................................................................... 36
1.1 I2C .................................................................................................................................................... 36
1.2 SPI .................................................................................................................................................... 36
18. Packaging Specification ........................................................................................................................ 37
18.1. QFN-16 ......................................................................................................................................... 37
18.1.1. Package dimensions and sensitive spot location .................................................................. 37
18.1.2. QFN-16 - Pinout and Marking ................................................................................................ 38
18.2. UDTFN-8 package......................................................................................................................... 39
18.2.1. Package dimensions and sensitive spot location .................................................................. 39
18.2.2. UTDFN-8 - Pinout and Marking.............................................................................................. 40
19. Standard Information ........................................................................................................................... 40
20. ESD Precautions.................................................................................................................................... 40
21. Revision History .................................................................................................................................... 41

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22. Contact ................................................................................................................................................. 42

23. Disclaimer ............................................................................................................................................. 43

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4. Ordering Information
Product Temperature Package Option Code Packing Form Definition

MLX90393 S (-20°C to 85°C) LW ABA-011 RE I2C address = 00011xx

MLX90393 S (-20°C to 85°C) LW ABA-012 RE I2C address = 00100xx

MLX90393 S (-20°C to 85°C) LW ABA-013 RE I2C address = 00101xx

MLX90393 S (-20°C to 85°C) LW ABA-014 RE I2C address = 00110xx

MLX90393 E (-40°C to 85°C) LW ABA-011 RE I2C address = 00011xx

MLX90393 E (-40°C to 85°C) LW ABA-012 RE I2C address = 00100xx

MLX90393 E (-40°C to 85°C) LW ABA-013 RE I2C address = 00101xx

MLX90393 E (-40°C to 85°C) LW ABA-014 RE I2C address = 00110xx

MLX90393 S (-20°C to 85°C) LQ ABA-011 RE I2C address = 0010000

Table 1: Product Ordering Codes

Legend:
Temperature Code:
S: from -20°C to 85°C
E: from -40°C to 85°C
Package Code: “LW” for QFN-16 3x3x1mm package with wettable flanks
“LQ” for UTDFN-8 2.5x2mm package

Option Code: ABA-011:

ABA-012:
ABA-013:
ABA-014:
Different I2C addresses – 5 most significant bits. The 2 least significant bits of the
address are defined by the external address pins A0 and A1.

Packing Form: “RE for Reel”

Ordering Example: “MLX90393-ELW-ABA-011-RE”

MLX90393 Micropower magnetometer with I2C address 00011xx where the last
two bits are defined by external address pins A0 and A1. In QFN package,
temperature range -40°C to 85°C.

Table 2: Product Ordering Code Example

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5. Functional Diagram
5.1. QFN-16 Block Diagram

5.2. UTDFN-8 Block Diagram

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6. Glossary of Terms
Term Definition

TC Temperature Coefficient (in ppm/°C)

Gauss (G), Tesla (T) Units for the magnetic flux density − 1 mT = 10 G

NC Not Connected

PWM Pulse Width Modulation

%DC Duty Cycle of the output signal i.e. TON /(TON + TOFF)

ADC Analog-to-Digital Converter

DAC Digital-to-Analog Converter

LSb Least Significant Bit

MSb Most Significant Bit

DNL Differential Non-Linearity

INL Integral Non-Linearity

EMC Electro-Magnetic Compatibility

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7. QFN-16 Pinout
Pin Name Type Supply Wiring Recommendation
# System

Primary Secondary Reference I2C 4-wire 3-wire

To SPI SPI

1 INT I/O out N/A VDD_IO Optional Optional Optional

2 SENB/CS I/O in MLX Test VDD_IO To Required Required

VDD_IO

3 SCL/SCLK I/O in MLX Test VDD_IO Required Required Required

4 N/C -- -- -- -- -- --

5 SDA/MOSI I/O bi MLX Test VDD_IO Required Required

Short
together
6 MISO I/O out MLX Test VDD_IO Floating Required

7 INT/TRIG I/O bi N/A VDD_IO Optional Optional Optional

8 VDD_IO Supply N/A Required Required Required

9 N/C -- -- -- -- -- --

10 N/C -- -- -- -- -- --

11 A1 I2C Address LSB MLX Test VDD To To GND To GND

VDD/GND

12 A0 I2C Address LSB MLX Test VDD To To GND To GND

VDD/GND

13 VSS Ground N/A Required Required Required

14 N/C -- -- -- -- -- --

15 VDD Supply N/A Required Required Required

16 N/C -- -- -- -- -- --

Table 3: Pinout Description

It is recommended to connect the N/C pins (Not Connected) to Ground.

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8. UTDFN-8 Pinout
Pin Name Type Supply Wiring Recommendation
# System

Primary Secondary Reference I2C 4-wire 3-wire

To SPI SPI
1 SCL/SCLK I/O in MLX Test VDD_IO Required Required Required
2 SDA/MOSI I/O bi MLX Test VDD_IO Required Required
Short
3 MISO I/O out MLX Test VDD_IO Floating Required together

4 VDD_IO Supply N/A Required Required Required

5 VSS Ground N/A Required Required Required
6 VDD Supply N/A Required Required Required
7 SENB/CS I/O in MLX Test VDD_IO To Required Required
VDD_IO
8 INT I/O out N/A VDD_IO Optional Optional Optional

Table 4: UTDFN-8 Pinout Description

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9. Absolute Maximum Ratings

Parameter Symbol Min. Typ. Max. Unit

VDD_MAX Analog Supply Voltage Limits -0.3 4 V

VDD_IO_MAX Digital IO Supply Limits -0.3 min(4, VDD+0.3) V

TSTORAGE Storage (idle) temperature range -50 125 °C

ESDHBM According to AEC-Q100-002 2.5 kV

ESDCDM According to AEC-Q100-011-B (QFN) 750 V

Table 5: Absolute Maximum Ratings

Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute maximum-rated
conditions for extended periods may affect device reliability.

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10. General Electrical Specifications

Parameter Remark Min Nom Max Unit

VDD Analog Supply Voltage 2.2 3 3.6 V

VDD_IO Digital IO Supply 1.65 1.8 VDD V

VPOR_LH Power-on Reset threshold 1.42 1.55 V

(rising edge)

VPOR_HL Power-on Reset threshold 1 1.31 V

(falling edge)

IDD,CONVXY Conversion Current XY-axis 2.29 3 mA

IDD,CONVZ Conversion Current Z-axis 2.96 4 mA

IDD,CONVT Conversion Current Temperature 1.60 2 mA

IDD, CONV_END
Current during TCONV_END 1.5 1.75 mA
Current during TACTIVE
IDD_ACTIVE 1.2 1.75 mA
IDD_IDLEtoSTBY Current during TSTBY
1.2 1.75 mA

IDD,STBY Standby Current(1) 43 60 µA

IDD,IDLE Idle Current(2) 1 2.4 5 µA

IDD,NOM Nominal Current (TXYZ, Datarate = 10Hz, 100 µA

OSR=OSR2=0, DIG_FILT=4)

Table 6: General Electrical Specifications

1
Standby current corresponds to the current consumed in the digital where only the low power oscillator is running.
This standby current is present in burst mode, or whenever the IC is counting down to start a new conversion.
2
Idle current corresponds to the current drawn by the IC in idle mode where all operating functions are disabled except
communications.

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11. Thermal Specification

The MLX90393 has an on-board temperature sensor which measures the temperature of the MLX90393
sensor. The temperature can be read out via the communication protocol in a digital format

Parameter Symbol Min. Typ. Max. Unit

TRES Temperature sensor resolution 45.2 LSB/°C

T25 Temperature sensor output at 25°C 46244 LSB16u

TLIN Temperature Linearity (3) +/-3 °C

TOPERATING Operating temperature range [S code] -20 25 85 °C

Operating temperature range [E code] -40 25 85 °C

Table 7: Thermal Specifications

3
The linearity is defined as the best fit curve through the digital temperature outputs over the entire temperature
range. It includes ADC non-linearity effects

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12. Timing Specification

The specifications are applicable at 25 Deg. C unless specified otherwise and for the complete supply range.

Parameter Remark Min Nom Max Unit

Main Oscillator & Derived Timings
TSTBY Time from IDLE to STBY 176 220 264 µs
TACTIVE Time from STBY to ACTIVE 288 360 432 µs
Single Magnetic axis conversion time(4) 259 66627
TCONVM µs
typical programming range 67 + 64 ∙ 2 𝑂𝑂𝑂𝑂𝑂𝑂
∙ (2 + 2𝐷𝐷𝐷𝐷𝐷𝐷_𝐹𝐹𝐹𝐹𝐹𝐹𝐹𝐹 )

Temperature conversion time 259 1603

TCONVT µs
typical programming range 67 + 192 ∙ 2 𝑂𝑂𝑂𝑂𝑂𝑂2

TCONV_END Time to end analog active mode 80 100 120 µs

Total conversion time in Single TSTBY + TACTIVE + m*TCONVM + TCONVT+
TCONV_SMM ms
Measurement Mode TCONV_END

Total conversion time in BURST with burst

TCONV_BURST_NDLY m*TCONVM + TCONVT+ TCONV_END ms
data rate =0
Total conversion time in BURST with burst
TCONV_BURST_DLY TACTIVE + m*TCONVM + TCONVT+ TCONV_END ms
data rate > 0
Total conversion time in WOC with burst
TCONV_WOC_NDLY m*TCONVM + TCONVT+ TCONV_END ms
data rate = 0
Total conversion time in WOC with burst TSTBY + TACTIVE + m*TCONVM + TCONVT+
TCONV_WOC_DLY ms
data rate > 0 TCONV_END
TOSC_TRIM Trimming accuracy -5 +5 %
TOSC_THD Thermal drift (full temperature range) -5 +5 %
Low-power Oscillator & Derived Timings
0 1260
Time in between 2 conversions (Burst
TINTERVAL ms
mode or Wake-Up on Change)(5) BURST_DATA_RATE * 20
TLPOSC_TRIM Trimming accuracy -4 +4 %

4
This conversion time is defined as the time to acquire a single axis of the magnetic flux density. When measuring
multiple axes they are obtained through time multiplexing. The conversion time is programmable through parameters
OSR and DIG_FILT for magnetic values and OSR2 for the temperature value. The conversion sequence is TXYZ, opposite
of the ZYXT argument of the command set.
5
The time TINTERVAL is defined as the time between the end of one set of measurements (any combination of TXYZ) and
the start of the following same set of measurements in BURST and WOC mode. As a result of this, the maximum output
data rate is not only a function of TINTERVAL but equals 1/(TCONV_BURSTWOC + TINTERVAL).

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Parameter Remark Min Nom Max Unit

TLPOSC_THD Thermal drift (full temperature range) -5 +5 %

Startup
TPOR Power-on-reset completion time 0.6 1.5 ms
External Trigger
TTRIG Trigger pulse width (active high) 0.01 250 us
Table 8: Timing Specifications

13. Magnetic Specification

The specifications are applicable at 25 Deg. C unless otherwise specified and for the complete supply voltage
range.

Parameter Remark Min Nom Max Unit

NADC ADC span 17.4 bits

NOUT Output span (taken from 19 by RESXYZ) 16 bits

BRANGE Output range (function of RESXYZ) RANGE from Table 17: mT

Sensitivity table for given gain
and resolution selection for
HALLCONF=0xC / SENSii

BSAT Magnetic saturation onset 50 mT

OFFS Deviation from expected 0mT output 0 LSB

OFFSTHD Offset thermal drift, Delta from 25°C (6) < ±1000 LSB

SENSXX, Programming range of magnetic resolution 3.220 0.161 µT/LSB

SENSYY (µT/LSB) or sensitivity (LSB/mT) (7)
[modifying GAIN_SEL and RESXYZ], cfr. Table 311 6211 LSB/mT
17: Sensitivity table for given gain and
SENSZZ 5.872 0.294 µT/LSB

6
The offset thermal drift is defined as the deviation at 0Gauss from the output with respect to the output at 25°C when
sweeping the temperature. The highest gradient (µT/°C) typically occurs at 85°C. The spec value is based on
characterization on limited sample size at GAIN_SEL=0x7 and RES_XYZ=0x00.
7
The total axis sensitivity is programmable to support different applications, but has no Automatic Gain control on-chip
as do the other angular position sensors from Melexis. The highest gain corresponds to at least the minimum +/-4.8mT
magnetic measurement range and the magnetic resolution defined by SENSii.

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Parameter Remark Min Nom Max Unit

resolution selection for HALLCONF=0xC 170 3406 LSB/mT

Parameter Remark Min Nom Max Unit

SENSXY, Cross-axis sensitivity (X/Y-axis sensitivity to < ±1 %

SENSYX Y/X magnetic fields)

SENSXZ, Cross-axis sensitivity (X/Y-axis sensitivity to Z < ±1 %

SENSYZ magnetic field)

SENSZX, Cross-axis sensitivity (Z-axis sensitivity to X < ±1 %

SENSZY and Y magnetic fields)

SENSTHD Sensitivity thermal drift -3 +3 %

Delta from 25°C(8)

Table 9: Magnetic Specifications

8
The sensitivity thermal drift is expressed as a band around the sensitivity at 25°C. It is applicable on wafer level
trimming, but can be influenced by packaging (overmolding).

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13.1. Noise vs Conversion Time

The MLX90393 provides configurable filters to adjust the tradeoff between current consumption, noise, and
conversion time. See section 15.1.5 for details on selecting the conversion time by adjusting OSR and
DIG_FILT.

XY-axis Noise over Conversion Time (bundled per OSR setting)

60

50

40
Noise Stdev [mGauss]

OSR = 0
30
OSR = 1
OSR = 2
20 OSR = 3

10

0
1 10 100

Conversion Time [ms]

Figure 2: XY axis RMS noise versus conversion time, expressed in mGauss for GAIN_SEL = 0x7

Z-axis Noise over Conversion Time (bundled per OSR setting)

90

80

70

60
Noise Stdev [mGauss]

50
OSR = 0

40 OSR = 1
OSR = 2
30 OSR = 3

20

10

0
1 10 100

Conversion Time [ms]

Figure 3: Z axis RMS noise versus conversion time, expressed in mGauss for GAIN_SEL = 0x7

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14. Mode Selection

The MLX90393 can operate in three modes. They are: Burst mode, Single Measurement mode, and Wake-
On-Change mode.

 Burst mode
The ASIC will have a programmable data rate at which it will operate. This data rate implies auto-
wakeup and sequencing of the ASIC, flagging that data is ready on a dedicated pin (INT/DRDY). The
maximum data rate corresponds to continuous burst mode, and is a function of the chosen
measurement axes. For non-continuous burst modes, the time during which the ASIC has a counter
running but is not doing an actual conversion is called the Standby mode (STBY).
 Single Measure mode
The master will ask for data via the corresponding protocol (I2C or SPI), waking up the ASIC to make a
single conversion, immediately followed by an automatic return to sleep mode (IDLE) until the next
polling of the master. This polling can also be done by strobing the TRG pin instead, which has the
same effect as sending a protocol command for a single measurement.
 Wake-Up on Change
This mode is similar to the burst mode in the sense that the device will be auto-sequencing, with the
difference that the measured component(s) is/are compared with a reference and in case the
difference is bigger than a user-defined threshold, the DRDY signal is set on the designated pin. The
user can select which axes and/or temperature fall under this cyclic check, and which thresholds are
allowed.

The user can change the operating mode at all time through a specific command on the bus. The device
waits in IDLE mode after power-up, but with a proper user command any mode can be set after power-up.
Changing to Burst or WOC mode, coming from Single Measure mode, is always accompanied by a
measurement first. The top-level state diagram indicating the different modes and some relevant timing is
shown below in Figure 4. In the Measure state, the MDATA flag will define which components will be
measured (ZYXT). The order of conversion is defined as TXYZ and cannot be modified by the user, only the
combination of axes is a degree of freedom.

Arrows indicated in grey are the direct result of an Exit command. The main difference between STANDBY
and WOC_IDLE is that in STANDBY mode, all analog circuitry is ready to make a conversion, but this is
accompanied by a larger current consumption than IDLE mode. For burst mode this extra current
consumption is justified because the emphasis is more on accurate timing intervals, avoiding the delay of
TSTBY before conversion and supporting an efficient continuous burst mode without standby overhead.

It is the user’s responsibility to read back the measured data as the MLX90393 is a slave device on the bus.
Even in burst mode and WOC mode when the MLX90393 is auto-sequencing, the master will be responsible
for collecting the acquired sensor data.

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Startup

Startup
Idle

Command received
to start
measurement

Enable analog
Idle
typ.220µs

NVRAM copy
typ.360µs

Active
Measuring

WOC STBY BM STBY

BM/WOC,
Ending active mode BM, BDR>0
BDR=0
typ.100µs SM, or EX received
WOC, BDR>0

Figure 4: Top-level state diagram with indication of timings

14.1. Burst mode

When the sensor is operating in burst mode, it will make conversions at specific time intervals. The
programmability of the user is the following:

 Burst speed (TINTERVAL) through parameter BURST_DATA_RATE

 Conversion time (TCONV) through parameters OSR, OSR2 and DIG_FILT
 Axes/Temperature (MDATA) through parameter BURST_SEL or via the command argument (ZYXT)

Whenever the MLX90393 has made the selected conversions (based on MDATA), the DRDY signal will be set
(active H) on the INT and/or INT/TRG pin to indicate that the data is ready for readback. It will remain high
until the master has sent the command to read out at least one of the converted quantities (ZYXT). Should
the master have failed to read out any of them by the time the sensor has made a new conversion, the
INT/DRDY pin will be strobed low for 10us, and the next rising edge will indicate a new set of data is ready.

14.2. Single Measurement mode

Whenever the sensor is set to this mode (or after startup) the MLX90393 goes to the IDLE state where it
awaits a command from the master to perform a certain acquisition. The duration of the acquisition will be

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the concatenation of the TSTBY, TACTIVE, m*TCONVM (with m # of axes) and TCONVT. The conversion time will
effectively be programmable by the user (see burst mode), but is equally a function of the required
axes/temperature to be measured.

Upon reception of such a polling command from the master, the sensor will make the necessary
acquisitions, and set the DRDY signal high to flag that the measurement has been performed and the master
can read out the data on the bus at his convenience. The INT/DRDY will be cleared either when:

 The master has issued a command to read out at least one of the measured components
 The master issues an Exit (EX) command to cancel the measurement
 The chip is reset, after POR (Power-on reset) or Reset command (RT)

14.3. Wake-Up on Change mode

The Wake-Up on Change (WOC) functionality can be set by the master with as main purpose to only receive
an interrupt when a certain threshold is crossed. The WOC mode will always compare a new burst value with
a reference value to assess if the difference between both exceeds a user-defined threshold. The reference
value is defined as one of the following:

 The first measurement of WOC mode is stored as reference value once. This measurement at “t=0” is
then the basis for comparison or,
 The reference for acquisition(t) is always acquisition(t-1), in such a way that the INT signal will only
be set if the derivative of any component exceeds a threshold.

The in-application programmability is the same as for burst mode, but now the thresholds for setting the
interrupt are also programmable by the user, as well as the reference, if the latter is data(t=0) or data(t-1).

15. Digital Specification

The supported protocols are I2C and SPI. The SENB/CS pin is used to define the protocol to be used:

 /CS = 0 for SPI, addressing the MLX90393 slave in SPI mode (3- and 4-wire), but releasing this line in
between commands (no permanent addressing allowed)
 /CS = 1 for I2C, addressing the MLX90393 slave when the correct address is transmitted over the bus
(permanently kept high)

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To ensure the activity on the SPI bus cannot be accidentally interpreted as I2C protocol, programming bits
are available in the memory of the MLX90393 to force the communication mode. It concerns the
COMM_MODE[1:0] bits with the following effect:

COMM_MODE[1] COMM_MODE[0] Description

0 X The mode in which the first valid command is transmitted to the

MLX90393 defines the operating mode (SPI or I2C) for all its future
commands, until a reset (hard or soft) is done.

1 0 SPI mode only

1 1 I2C mode only

Table 10: Communication mode definition

15.1. Command List

The MLX90393 only listens to a specific set of commands. Apart from the Reset command, all commands
generate a status byte that can be read out. The table below indicates the 10 different commands that are
(conditionally) accepted by the MLX90393. The MLX90393 will always acknowledge a command in I2C, even
if the command is not a valid command. Interpreting the associated status byte is the method for
verification of command acceptance.

Command Set

Command Name Symbol # CMD1 byte CMD2 byte CMD3 byte CMD4 byte

Start Burst Mode SB 1 0001 zyxt N/A N/A N/A

Start Wake-up on Change Mode SW 2 0010 zyxt N/A N/A N/A

Start Single Measurement Mode SM 3 0011 zyxt N/A N/A N/A

Read Measurement RM 4 0100 zyxt N/A N/A N/A

Read Register RR 5 0101 0abc {A5…A0,0,0} N/A N/A

Write Register WR 6 0110 0abc D15…D8 D7…D0 {A5…A0,0,0}

Exit Mode EX 8 1000 0000 N/A N/A N/A

Memory Recall HR D 1101 0000 N/A N/A N/A

Memory Store HS E 1110 0000 N/A N/A N/A

Reset RT F 1111 0000 N/A N/A N/A

Table 11: Command List

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The argument for the volatile memory access commands (RR/WR) «abc» should be set to 0x0, in order to get
normal read-out and write of the memory.

The argument in all mode-starting commands (SB/SW/SM) is a nibble specifying the conversions to be
performed by the sensor in the following order «zyxt». For example, if only Y axis and temperature are to be
measured in Single Measurement mode the correct command to be transmitted is 0x35. The sequence of
measurement execution on-chip is inverted to «TXYZ», so T will be measured before X, followed by Y and
finally Z. By issuing an all-zero «zyxt» nibble, the BURST_SEL value from RAM will be used instead of the
empty argument of the command.

15.2. Status Byte

The status byte is the first byte transmitted by the MLX90393 in response to a command issued by the
master. It is composed of a fixed combination of informative bits:

bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0

BURST_MODE WOC_MODE SM_MODE ERROR SED RS D1 D0

Table 12: Status Byte Definition

 MODE bits
These bits define in which mode the MLX90393 is currently set. Whenever a mode transition
command is rejected, the first status byte after this command will have the expected mode bit
cleared, which serves as an indication that the command has been rejected, next to the ERROR bit.
The SM_MODE flag can be the result of an SM command or from raising the TRG pin when TRG mode
is enabled in the volatile memory of the MLX90393.
 ERROR bit
This bit is set in case a command has been rejected or in case an uncorrectable error is detected in
the memory, a so called ECC_ERROR. A single error in the memory can be corrected (see SED bit),
two errors can be detected and will generate the ECC_ERROR. In such a case all commands but the
RT (Reset) command will be rejected. The error bit is equally set when the master is reading back
data while the DRDY flag is low.
 SED bit
The single error detection bit simply flags that a bit error in the non-volatile memory has been
corrected. It is purely informative and has no impact on the operation of the MLX90393.
 RS bit
Whenever the MLX90393 gets out of a reset situation – both hard and soft reset – the RS flag is set
to highlight this situation to the master in the first status byte that is read out. As soon as the first
status byte is read, the flag is cleared until the next reset occurs.
 D[1:0] bits
These bits only have a meaning after the RR and RM commands, when data is expected as a response
from the MLX90393. The number of response bytes correspond to 2*D[1:0] + 2, so the expected byte
counts are either 2, 4, 6 or 8. For commands where no response is expected, the content of D[1:0]
should be ignored.

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15.3. SPI Communication

The MLX90393 can handle SPI communication at a bitrate of 10Mhz. The SPI communication is implemented
in a half-duplex way, showing high similarities with I2C communication, but addressing through the \CS (Chip
Select) pin instead of through bus arbitration. The half-duplex nature is at the basis of the supported 3-wire
SPI operation. SPI mode 3 is implemented: CPHA=1 (data changed on leading edge and captured on trailing
edge, and CPOL=1 (high level is inactive state). The Chip Select line is active-low.

The communication is also bundled in bytes, equally MSB first and MSByte first. A command can of course
consist of more than 1 byte (refer to Table 10: Communication mode definition) as can the response be from
the MLX90393 in the form of multiple bytes after the status byte (not shown in Figure 5: SPI communication
example)

/CS

SCL 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8

MOSI COMMAND[7:0] X (4-wire SPI) or Z (3-wire SPI)

MISO Z (3 & 4-wire SPI) STATUS_BYTE[7:0]

ADD NADD

Figure 5: SPI communication example

15.3.1. Command implementation

For the examples give, the below convention is used.

xxx MOSI data (1 byte)

xxx MISO data (1 byte)

Figure 6: SPI convention

15.3.1.1. SB, SWOC, SM, EX, HR, HS

All the commands follow the structure below. The reply from the MLX90393 is only the status byte. The
example below is for a start of a burst mode with X and Y being measured.

0x16 0x00
xx Status

Figure 7: SB command, XY

After the HS command, wait at least 15ms before sending the next command to allow the IC to update the
NVRAM correctly.

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15.3.1.2. RT

This command will (warm-)reset the IC. The status byte of the command following will indicate the reset
event. It is recommended to perform an ‘EX’ command before issuing a ‘RT’ command.

0xF0
xx

Figure 8: RT command

15.3.1.3. RM

This command differs depending on the value for zyxt. The data is returned in the order Status-TXYZ, where
the components which are set to zero are skipped.

0x4F 0x00 0x00 0x00 0x00 0x00 0x00

xx Status T [15:8] T [7:0] X [15:8] X [7:0] Y [15:8]
0x00 0x00 0x00
Y [7:0] Z [15:8] Z [7:0]

Figure 9: RM command, XYZT

0x45 0x00 0x00 0x00 0x00 0x00

xx Status T [15:8] T [7:0] Y [15:8] Y [7:0]

Figure 10: RM command, YT

15.3.1.4. RR

Important in this command is that the register address to be read needs to be shifter left by two bits. To
read register 0x12 for example, the MOSI byte becomes 0x48.

0x50 Register << 2 0x00 0x00 0x00

xx xx Status Data [15:8] Data [7:0]

Figure 11: RR command

15.3.1.5. WR

Important in this command is that the register address to be read needs to be shifter left by two bits. To
read register 0x12 for example, the MOSI byte becomes 0x48.

0x60 Data [15:8] Data [7:0] Register << 2 0x00

xx xx xx xx Status

Figure 12: WR command

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15.3.2. SPI Timing Specification

All timings are referred to the levels found in Table 6: General Electrical Specifications.

Electrical Parameter Symbol Min. Max. Unit

SPI Clock Cycle tc (SPC) 100 ns
SPI Clock Cycle tc (SPC) 10 MHz
CS Setup Time tsu (CS) 5 ns
CS Hold Time th (CS) 10 ns
SDI Input Setup Time tsu (SI) 5 ns
SDI Input Hold Time th (SI) 15 ns
SDO Valid Output Time tv (SO) 50 ns
SDO Output Hold Time th (SO) 5 ns
SDO Output Disable Time tdis (SO) 50 ns
Table 13: General SPI Timing Specification

CS

tsu (CS) tc (SPC) th (CS)

SPC

tsu (SI) th (SI)

SDI MSB IN LSB IN

tv (SO) th (SO) tdis (SO)

SDO MSB OUT LSB OUT

Figure 13: SPI Timing Diagram

15.4. I2C Communication

The I2C protocol is implemented such that the command is written to a specific register in the RAM, and the
status and measurement data are read back from this RAM. The commands themselves are the same as for
SPI (section 15.3) except for the read measurement commands and the memory read/write commands. For
memory read/write commands, written can be done directly to the required register. Note that memory
read/write commands are required to be word-wise, so always in multiples of 2 bytes. Read measurement is
the same as a memory read, except starting from the status register. MSbits are sent first.

The 7-bit I2C-address is determined by the connection to the A0 and A1 pins. The 5 MSBs are programmed
by Melexis in the MLX90393. Please contact Melexis in case other addressing is required.

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7-bit I2C address R/W bit

7 6 5 4 3 2 1 0
2
0 if A1 shorted to ground 0 if A0 shorted to ground 0 for I C write
0 0 0 1 1
1 if A1 shorted to supply 1 if A0 shorted to supply 1 for I2C read

Ordering Code EE_I2C_ADDR[4:0] 7-bit I2C addresses possible

MLX90393xLW-ABA-011-RE 0x03 0x0C, 0x0D, 0x0E, 0x0F

MLX90393xLW-ABA-012-RE 0x04 0x10, 0x11, 0x12, 0x13

MLX90393xLW-ABA-013-RE 0x05 0x14, 0x15, 0x16, 0x17

MLX90393xLW-ABA-014-RE 0x06 0x18, 0x19, 0x1A, 0x1B

MLX90393xLQ-ABA-011-RE 0x04 0x10

Table 14: I2C address ordering codes

15.4.1. Command Implementation

For the examples given, the below convention is used.

S I2C Start
SR I2C Repeated Start
P I2C Stop
A Acknowledge from IC (1 bit)
A NACK (Not) Acknowledge from Master (1 bit)
xxx I2C Addressing (1 byte)
xxx Data from Master to IC (1 byte)
xxx Data from IC to Master (1 byte)

Figure 14: I2C Convention

15.4.1.1. SB, SWOC, SM, EX, HR, HS

All the commands follow the structure below. The reply from the MLX90393 is only the status byte. The
example below is for a start of a burst mode with X and Y being measured.

S I2C addr [W] A 0x16 A SR I2C addr [R] A Status NACK P

Figure 15: SB command, XY

After the HS command, wait at least 15ms before sending the next command to allow the IC to update the
NVRAM correctly.

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15.4.1.2. RT

This command will (warm-)reset the IC. The status byte of the command following will indicate the reset
event. It is recommended to perform an ‘EX’ command before issuing a ‘RT’ command.

S I2C addr [W] A 0x80 A P

Figure 16: RT command

15.4.1.3. RM

This command differs depending on the value for zyxt. The data is returned in the order Status-TXYZ, where
the components which are set to zero are skipped.

S I2C addr [W] A 0x4F A SR I2C addr [R] A Status A T [15:8] A T [7:0] A
X [15:8] A X [7:0] A Y [15:8] A Y [7:0] A Z [15:8] A Z [7:0] NACK P

Figure 17: RM command-XYZT

S I2C addr [W] A 0x45 A SR I2C addr [R] A Status A T [15:8] A T [7:0] A
Y [15:8] A Y [7:0] NACK P

Figure 18: RM command-YT

15.4.1.4. RR

Important in this command is that the register address to be read needs to be shifted left by two bits. To
read register 0x12 for example, the SDA byte becomes 0x48.

S I2C addr [W] A 0x50 A Register << 2 A SR I2C addr [R] A Status A Data [15:8] A Data [7:0] NACK P

Figure 19: RR command

15.4.1.5. WR

Important in this command is that the register address to be read needs to be shifted left by two bits. To
read register 0x12 for example, the SDA byte becomes 0x48.

S I2C addr [W] A 0x60 A Data [15:8] A Data [7:0] A Register << 2 A SR I2C addr [R] A Status NACK P

Figure 20: WR command

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15.4.2. I2C Timing Specification

All timings are referred to the levels found in Table 6: General Electrical Specifications.

I2C Standard Mode I2C Fast Mode

Electrical Parameter Symbol Unit
Min. Max. Min. Max.
SCL Clock Frequency f (SCL) 100 400 kHz
SCL Clock Low Time tw (SCLL) 4.7 1.3 µs
SCL Clock High Time tw (SCLH) 4 0.6 µs
SDA Setup Time tsu (SDA) 250 100 ns
SDA Data Hold Time th (SDA) 3.45 0 0.9 µs
tr (SDA)
SDA and SCL Rise Time 1000 20+0.1*Cb(9) 300 ns
tr (SCL)
tr (SDA)
SDA and SCL Fall Time 300 20+0.1*Cb(9) 300 ns
tr (SCL)
START Condition Hold Time th (ST) 4 0.6 µs
REPEATED START Condition Setup Time tsu (SR) 4.7 0.6 µs
STOP Condition Setup Time tsu (SP) 4 0.6 µs
Bus Free Time Between STOP and START
tw (SP:ST) 4.7 1.3 µs
Condition
Table 15: General I2C Timing Specification

REPEATED
tf (SDA) tr (SDA) START
START
tsu (SR)
SDA
STOP START

tsu (SDA) th (SDA)

tsu (SP) tw (SP:ST)

SCL

th (ST) tw (SCLL) tw (SCLH) tr (SCL) tf (SCL)

Figure 21: I2C Timing Diagram

9
Where Cb is the total bus capacitance (in pF)

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16. Memory Map

16.1. General Description
The MLX90393 has 1kbit of non-volatile memory, and the same amount of volatile memory. Each memory
consists out of 64 addresses containing 16 bit words. The non-volatile memory has automatic 2-bit error
detection and 1-bit error correction capabilities per address. The handling of such corrections & detections
is explained in Section 15.2.

The memory is split in 2 areas:

 Customer area [address 0x00 to 0x1F]

 Melexis area [address 0x20 to 0x3F]

The RR and WR commands impact the volatile memory only, there no direct access possible to the non-
volatile memory. The customer area of the volatile memory is bidirectionally accessible to the customer; the
Melexis area is write-protected. Only modifications in the blue area are allowed with the WR command. The
adjustments in the customer area can be stored in the permanent non-volatile memory with the STORE
command HS, which copies the entire volatile memory including the Melexis area to the non-volatile one.
With the HR command the non-volatile memory content can be recalled to the volatile memory, which can
restore any modifications due to prior WR commands. The HR step is performed automatically at start-up of
the ASIC, either through cold reset or warm reset with the RT command.

The above is graphically shown in Figure 22.

VOLATILE NON-VOLATILE
MEMORY MEMORY

CUSTOMER AREA CUSTOMER AREA

STORE (HS)

RECALL (HR)
MELEXIS AREA MELEXIS AREA

RR WR

Figure 22: The memories of the MLX90393, their areas and the impacting commands.

The customer area houses 3 types of data:

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 Analog configuration bits

 Digital configuration bits
 Informative (free) bits

The latter can be filled with customer content freely, and covers the address span from (and including) 0x0A
to 0x1F, a total of 352 bits. The memory mapping of volatile and non-volatile memory on address level is
identical. The volatile memory map is given in Figure 23.

The table below gives an overview of the customer area in the MLX90393’s NVRAM.

In the register map, the 16-bit words are split into 2 bytes for the sake of readability. The general format is
shown below in the yellow table.

Register Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 (LSB)
0x..
Bit 15 (MSB) Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8

Register Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

Z-SERIES GAIN_SEL HALLCONF
0x00h
ANA_RESERVED_LOW BIST
BURST_SEL (zyxt) BURST_DATA_RATE (BDR)
0x01h
TRIG_INT COMM_MODE WOC_DIFF EXT_TRG TCMP_EN BURST_SEL (zyxt)
RES_Y RES_X DIG_FILT OSR
0x02h
OSR2 RES_Z RES_Y
SENS_TC_LT
0x03h
SENS_TC_HT
OFFSET_X
0x04h
OFFSET_X
OFFSET_Y
0x05h
OFFSET_Y
OFFSET_Z
0x06h
OFFSET_Z
WOXY_THRESHOLD
0x07h
WOXY_THRESHOLD
WOZ_THRESHOLD
0x08h
WOZ_THRESHOLD
WOT_THRESHOLD
0x09h
WOT_THRESHOLD
0x0Ah
… FREE
0x1Fh

Figure 23: Customer area memory map.

The non-volatile memory can only be written (HS store command) if pin VDD is supplied with 3.3V minimum,
otherwise the write sequence cannot be performed in a reliable way. Additionally, this HS command was
designed to be used as one-time calibration, but not as multi write-cycle memory within the application. In

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case memory is written within the application, the number of write cycles should be kept to a minimum.
There is no limit to the write cycles in the volatile memory (WR write command).

16.2. Parameter Description

The meaning of each customer accessible parameter is explained in this section. The customer area of both
the volatile and the non-volatile memory can be written through standard SPI and I2C communication, within
the application. No external high-voltages are needed to perform such operations, nor access to dedicated
pins that need to be grounded in the application.

Parameter Description

ANA_RESERVED_LOW Reserved IO trimming bits

BIST Enabled the on-chip coil, applying a Z-field [Built-In Self Test]

Z_SERIES Enable all plates for Z-measurement

GAIN_SEL[2:0] Analog chain gain setting, factor 5 between min and max code

HALLCONF[3:0] Hall plate spinning rate adjustment

TRIG_INT_SEL Puts TRIG_INT pin in TRIG mode when cleared, INT mode otherwise

COMM_MODE[1:0] Allow only SPI [10b], only I2C [11b] or both [0Xb] according to CS pin

WOC_DIFF Sets the Wake-up On Change based on Δ{sample(t),sample(t-1)}

EXT_TRIG Allows external trigger inputs when set, if TRIG_INT_SEL = 0

TCMP_EN Enables on-chip sensitivity drift compensation

BURST_SEL[3:0] Defines the MDATA in burst mode if SB command argument = 0

BURST_DATARATE[6:0] Defines TINTERVAL as BURST_DATA_RATE * 20ms

OSR2[1:0] Temperature sensor ADC oversampling ratio

RES_XYZ[5:0] Selects the desired 16-bit output value from the 19-bit ADC

DIG_FILT[1:0] Digital filter applicable to ADC

OSR[1:0] Magnetic sensor ADC oversampling ratio

SENS_TC_HT[7:0] Sensitivity drift compensation factor for T < TREF

SENS_TC_LT[7:0] Sensitivity drift compensation factor for T > TREF

OFFSET_i[15:0] Constant offset correction, independent for i = X, Y, Z

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Parameter Description

WOi_THRESHOLD[15:0] Wake-up On Change threshold, independent for i = X, Y, Z and T

Table 16: NVRAM parameter description

16.2.1. ANA_RESERVED_LOW
Reserved bits for analog trimming at Melexis factory. Do not modify.

16.2.2. BIST
Enables (1) or disables (0) the built in self-test coil. In normal operation set to 0. A measurement with this
coil enabled shows a change in magnetic field sensed on the Z-axis.

16.2.3. Z_Series
Enables series connection of hall plates for Z axis measurement. In normal operation set to 0.

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16.2.4. GAIN_SEL[2:0]
Sets the analog gain to the desired value. The sensitivity is dependent on the axis (the X- and Y-axis have
higher sensitivity, compared with the Z-axis, expressed in LSB/µT) as well as the setting of the RES_XYZ[5:0]
parameter. The relationship is given in the below table.

Table for HALLCONF(10) = 0xC, sensitivity in µT/LSB, TC off, T=25°C:

RES = 0 RES = 1 RES = 2 RES = 3

GAIN_SEL
SENSXY SENSZ SENSXY SENSZ SENSXY SENSZ SENSXY SENSZ
0 0.751 1.210 1.502 2.420 3.004 4.840 6.009 9.680
1 0.601 0.968 1.202 1.936 2.403 3.872 4.840 7.744
2 0.451 0.726 0.901 1.452 1.803 2.904 3.605 5.808
3 0.376 0.605 0.751 1.210 1.502 2.420 3.004 4.840
4 0.300 0.484 0.601 0.968 1.202 1.936 2.403 3.872
5 0.250 0.403 0.501 0.807 1.001 1.613 2.003 3.227
6 0.200 0.323 0.401 0.645 0.801 1.291 1.602 2.581
7 0.150 0.242 0.300 0.484 0.601 0.968 1.202 1.936
Table 17: Sensitivity table for given gain and resolution selection for HALLCONF=0xC

Table for HALLCONF(10) = 0xC, sensitivity in µT/LSB, TC off, T=35°C:

RES = 0 RES = 1 RES = 2 RES = 3

GAIN_SEL
SENSXY SENSZ SENSXY SENSZ SENSXY SENSZ SENSXY SENSZ
0 0.787 1.267 1.573 2.534 3.146 5.068 6.292 10.137
1 0.629 1.014 1.258 2.027 2.517 4.055 5.034 8.109
2 0.472 0.760 0.944 1.521 1.888 3.041 3.775 6.082
3 0.393 0.634 0.787 1.267 1.573 2.534 3.146 5.068
4 0.315 0.507 0.629 1.014 1.258 2.027 2.517 4.055
5 0.262 0.422 0.524 0.845 1.049 1.689 2.097 3.379
6 0.210 0.338 0.419 0.676 0.839 1.352 1.678 2.703
7 0.157 0.253 0.315 0.507 0.629 1.014 1.258 2.027
Table 18: Sensitivity table for given gain and resolution selection for HALLCONF=0xC

10
For HALLCONF = 0x0, the sensitivity scales with a factor 98/75. For example (0.150µT/LSB with HALLCONF 0xC
becomes 0.196µT/LSB with HALLCONF 0x0)

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16.2.5. HALLCONF[3:0]
Modifies the hall plate spinning (2-phase vs 4-phase) which has an effect on the minimum sampling rate
achievable. Some configurations of OSR and DIG_FILT are not permitted. The cells shown in red are not
permitted with HALL_CONF=0xC (default) but are allowed when HALL_CONF=0x0.

Typical TCONV(TXYZ) OSR

for OSR2=0x0 [ms] 0 1 2 3
0 1.27 1.84 3.00 5.30
1 1.46 2.23 3.76 6.84
2 1.84 3.00 5.30 9.91
DIG_FILT

3 2.61 4.53 8.37 16.05

4 4.15 7.60 14.52 28.34
5 7.22 13.75 26.80 52.92
6 13.36 26.04 51.38 102.07
7 25.65 50.61 100.53 200.37
Table 19: TCONV as a function of OSR & DIG_FILT

Maximum ODR OSR

for OSR2=0x0 [Hz] 0 1 2 3
0 716.9 493.0 303.4 171.5
1 622.7 408.0 241.5 133.0
2 493.0 303.4 171.5 91.8
DIG_FILT

3 348.0 200.6 108.6 56.6

4 219.2 119.6 62.6 32.1
5 125.9 66.1 33.9 17.2
6 68.0 34.9 17.7 8.9
7 35.4 18.0 9.0 4.5
Table 20: Maximum Output Data Rate (ODR) as a function of OSR & DIG_FILT

16.2.6. TRIG_INT_SEL
When set to 0 the TRIG_INT pin is in trigger mode. When set to 1 the TRIG_INT pin acts as an interrupt pin.

16.2.7. COMM_MODE[1:0]
When set to 0x2 only SPI communication is allowed. When set to 0x3 only I2C communication is allowed.
When set to 0x0 or 0x1 both communication modes can be used but the selection is made by the CS pin.

16.2.8. WOC_DIFF
When wake-on-change mode is enabled this parameter defines the mode to use. When enabled, a
comparison on the current measurement is made with the previous measurement. When disabled, the first
initial measurement is used as a reference.

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16.2.9. EXT_TRIG
Allows for external trigger events when set to 1 and TRIG_INT_SEL = 0. When enabled an acquisition will
start with the external trigger pin detects a high value. Acquisitions will continue to be triggered until the
EXT_TRIG pin is brought low.

16.2.10. TCMP_EN
Enables (1) or disables (0) the on-chip sensitivity drift compensation. Enabling the temperature
compensation will influence the way the magnetic values are encoded and transmitted to the system
microcontroller as shown in the table below.

TCMP_EN = 0x0 TCMP_EN = 0x1

ABA
RANGE TYPE RANGE TYPE
2’s complement unsigned
0 ±215 ±215
0µT = 0LSB 0µT = 215LSB
2’s complement unsigned
1 ±215 ±215
0µT = 0LSB 0µT = 215LSB
RESi

unsigned
2 ±22000
0µT = 215LSB
N/A
unsigned
3 ±11000
0µT = 214LSB
Table 21: Output Range and Type as a function of TCMP_EN and RES_XYZ={RESX,RESY,RESZ}

16.2.11. BURST_SEL[3:0]
Defines the axes that will be converted in burst mode if the SB command argument is 0.

16.2.12. OSR2[1:0]
Selects the temperature sensor ADC oversampling ratio

16.2.13. RES_XYZ[5:0]
See 16.2.4 for the relationship between the gain and resolution. Additionally, section 16.2.10 for the
relationship between RES_XYZ and the output data format.

16.2.14. DIG_FILT[1:0]
See 16.2.5 for the selection of DIG_FILT and the impact on conversion time.

16.2.15. OSR[1:0]
Oversampling ratio for the magnetic measurements. See 16.2.5 for the selection of OSR

16.2.16. SENS_TC_HT[7:0]
Sensitivity drift compensation factor for T > TREF

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16.2.17. SENS_TC_LT[7:0]
Sensitivity drift compensation factor for T < TREF

16.2.18. OFFSET_i[15:0]
Constant offset correction, independent of temperature, and programmable for each individual axis where
i=X, Y, or Z.

16.2.19. WOi_THRESHOLD[15:0]
Wake-on-change threshold. Independently programmable for each magnetic axis (i=X, Y, Z) and temperature
(i=T)

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17. Recommended Application Diagram

1.1 I2C

A1 A0 I2C Address
-------------------------------------
Vss Vss 0001100R/W
Vss Vdd 0001101R/W
Vdd Vss 0001110R/W
A0

A1

Vdd Vdd 0001111R/W R1=R2=10K

VDDIO C1=C2=0.1uF
(1.71V - VDD)
VDDIO
R1
C2
SDA/MOSI
R2 I2C
SCL/SCLK

MLX90393 SENB/CS
VDD MCU
(2.2V - 3.6V)
VDD
C1

VSS

INT/TRG Trigger
INT Interrupt/DRDY

Figure 24: I2C recommended schematic

1.2 SPI

Short on PCB
for 3-wire SPI
A0

A1

VDDIO C1=C2=0.1uF
(1.71V - VDD)
VDDIO

C2
MISO
SDA/MOSI
SPI
SCL/SCLK
SENB/CS

MLX90393 VDD MCU

(2.2V - 3.6V)
VDD
C1

VSS

INT/TRG Trigger
INT Interrupt/DRDY

Figure 25: 3/4wire SPI recommended schematic

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18. Packaging Specification

18.1. QFN-16
The MLX90393 shall be delivered in a QFN-16 package as shown below in Figure 26.

18.1.1. Package dimensions and sensitive spot location

0.42 ± 0.10

Die rotation tolerances ±2°

0.80 Dimensions in “mm”
1.00

0.20 REF 0.50 0.00-0.05

0.18
0.30

1.50±0.20
1 2 3

1.50
±0.20 16

2.90 1.55
3.10 1.80

Y Z 0.20

0.30-0.50
1.55
2.90 1.80
3.10

Figure 26: QFN-16 - Package Outline Drawing

The sensing elements – Hall plates with the patented IMC technology – are located in the center of the die, which on its turn
is located in the center of the package.

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18.1.2. QFN-16 - Pinout and Marking

Marking :

A0
A1
12 11 Part Number MLX90393 (3 digits)
Die Version (1 digit)
VSS 13 VDD_IO 393 A

393A 7 INT/TRG 1234 Lot number: First 4 digits

1234 5 YWW
VDD 15 6 MISO
5YWW Assembly Year (Y) and week (WW)
5 SDA/MOSI 5th number of lot number (1 digit)

1 2 3
INT
MS/CS
SCL/SCLK

Figure 27: QFN-16 Pinout and Marking – Top view

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18.2. UDTFN-8 package

The MLX90393 shall be delivered in a UTDFN-8 package as shown below in Figure 28:

18.2.1. Package dimensions and sensitive spot location

Y Z

Figure 28: UTDFN-8 - Package Outline Drawing

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18.2.2. UTDFN-8 - Pinout and Marking

MS/CS
Marking :

VDD
VSS
INT
8 7
Part Number MLX90393 (2 digits)
Last two digits of lot number (2 digits)
93XX 93 A
YWW YWW
Assembly Year (Y) and week (WW)

1 4
SDA/MOSI
SCL/SCLK

VDD_IO
MISO

Figure 29: UTDFN-8 – Pinout and Marking

19. Standard Information

Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level
according to standards in place in Semiconductor industry.

For further details about test method references and for compliance verification of selected soldering method for
product integration, Melexis recommends reviewing on our web site the General Guidelines soldering
recommendation. For all soldering technologies deviating from the one mentioned in above document (regarding peak
temperature, temperature gradient, temperature profile, etc.), additional classification and qualification tests have to
be agreed upon with Melexis.

For package technology embedding trim and form post-delivery capability, Melexis recommends to consult the
dedicated trim & form recommendation application note: lead trimming and forming recommendations

Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information
on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain
Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/en/quality-environment

20. ESD Precautions

Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.

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21. Revision History

Date Revision Remark

11-Nov-2014 001  First Document Release

16-Feb-2015 002  Changed Ordering Code to indicate QFN wettable flanks

 Update Document number
 Added description of yellow cells in Table 1 and Table 2.

13-Jul-2017 003  Added additional ordering codes for up to 16 sensors on the same
bus and their description in Table 2
 Added E temperature code for -40°C capable products and the
associated update of the operating range in chapter 3
 Updated template to new Melexis format

28-May-2019 004  UTDFN-8 Package / Pinout/ Marking

 Updated sensitivity tables
 Additional Communication commands details
 Functional flowchart updated
 Timings and current consumption updated

08-Jan-2020 006  Additional specifications of Idd, IdletoStby, Idd, Active and

Idd,Conv_end

14-Jan-2021 007  RR + WR in I2C: typo (one bit->two bits)

 Sensitivity chapter: footer, and footnote corrected; uT to µT. Added
note that sensitivity increase is in LSB/µT.
 RM commands: wrong explanation
 RES_XYZ[5:0] and DIG_FILT[1:0]: corrected cross references
 OSR[1:0]: link to HALLCONF added
 I2C timing diagram
 I2C address of UTDFN (was 0001100, now 0010000), in both option
codes and table (I2C chapter)
 BIST: some more explanation

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22. Contact
For the latest version of this document, go to our website at www.melexis.com.

For additional information, please contact our Direct Sales team and get help for your specific needs:

Europe, Africa Telephone: +32 13 67 04 95

Email : [email protected]

Americas Telephone: +1 603 223 2362

Email : [email protected]

Asia Email : [email protected]

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23. Disclaimer
The content of this document is believed to be correct and accurate. However, the content of this document is furnished "as is" for
informational use only and no representation, nor warranty is provided by Melexis about its accuracy, nor about the results of its
implementation. Melexis assumes no responsibility or liability for any errors or inaccuracies that may appear in this document. Customer
will follow the practices contained in this document under its sole responsibility. This documentation is in fact provided without warranty,
term, or condition of any kind, either implied or expressed, including but not limited to warranties of merchantability, satisfactory quality,
non-infringement, and fitness for purpose. Melexis, its employees and agents and its affiliates' and their employees and agents will not be
responsible for any loss, however arising, from the use of, or reliance on this document. Notwithstanding the foregoing, contractual
obligations expressly undertaken in writing by Melexis prevail over this disclaimer.

This document is subject to change without notice, and should not be construed as a commitment by Melexis. Therefore, before placing
orders or prior to designing the product into a system, users or any third party should obtain the latest version of the relevant information.
Users or any third party must determine the suitability of the product described in this document for its application, including the level of
reliability required and determine whether it is fit for a particular purpose.

This document as well as the product here described may be subject to export control regulations. Be aware that export might require a
prior authorization from competent authorities. The product is not designed, authorized or warranted to be suitable in applications
requiring extended temperature range and/or unusual environmental requirements. High reliability applications, such as medical life-
support or life-sustaining equipment or avionics application are specifically excluded by Melexis. The product may not be used for the
following applications subject to export control regulations: the development, production, processing, operation, maintenance, storage,
recognition or proliferation of:
1. chemical, biological or nuclear weapons, or for the development, production, maintenance or storage of missiles for such weapons;
2. civil firearms, including spare parts or ammunition for such arms;
3. defense related products, or other material for military use or for law enforcement;
4. any applications that, alone or in combination with other goods, substances or organisms could cause serious harm to persons or goods
and that can be used as a means of violence in an armed conflict or any similar violent situation.

No license nor any other right or interest is granted to any of Melexis' or third party's intellectual property rights.

If this document is marked “restricted” or with similar words, or if in any case the content of this document is to be reasonably understood
as being confidential, the recipient of this document shall not communicate, nor disclose to any third party, any part of the document
without Melexis’ express written consent. The recipient shall take all necessary measures to apply and preserve the confidential character
of the document. In particular, the recipient shall (i) hold document in confidence with at least the same degree of care by which it
maintains the confidentiality of its own proprietary and confidential information, but no less than reasonable care; (ii) restrict the
disclosure of the document solely to its employees for the purpose for which this document was received, on a strictly need to know basis
and providing that such persons to whom the document is disclosed are bound by confidentiality terms substantially similar to those in this
disclaimer; (iii) use the document only in connection with the purpose for which this document was received, and reproduce document only
to the extent necessary for such purposes; (iv) not use the document for commercial purposes or to the detriment of Melexis or its
customers. The confidentiality obligations set forth in this disclaimer will have indefinite duration and in any case they will be effective for
no less than 10 years from the receipt of this document.

This disclaimer will be governed by and construed in accordance with Belgian law and any disputes relating to this disclaimer will be subject
to the exclusive jurisdiction of the courts of Brussels, Belgium.

The invalidity or ineffectiveness of any of the provisions of this disclaimer does not affect the validity or effectiveness of the other
provisions.
The previous versions of this document are repealed.

Melexis © - No part of this document may be reproduced without the prior written consent of Melexis. (2021)

IATF 16949 and ISO 14001 Certified

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