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ZXWM-M920

The ZXWM M920 is a backbone DWDM equipment from ZTE Corporation, detailed in this product description document. It includes technical characteristics, upgrade and maintenance features, and various subsystem specifications. The manual is intended for planning, installation, commissioning, and maintenance engineers, providing comprehensive information about the product's functions and requirements.

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0% found this document useful (0 votes)
11 views

ZXWM-M920

The ZXWM M920 is a backbone DWDM equipment from ZTE Corporation, detailed in this product description document. It includes technical characteristics, upgrade and maintenance features, and various subsystem specifications. The manual is intended for planning, installation, commissioning, and maintenance engineers, providing comprehensive information about the product's functions and requirements.

Uploaded by

Hoàng Hiếu
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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ZXWM M920

Backbone DWDM Equipment


Product Descriptions

Version: V4.20

ZTE CORPORATION
NO. 55, Hi-tech Road South, ShenZhen, P.R.China
Postcode: 518057
Tel: +86-755-26771900
Fax: +86-755-26770801
URL: http://ensupport.zte.com.cn
E-mail: [email protected]
LEGAL INFORMATION
Copyright © 2011 ZTE CORPORATION.
The contents of this document are protected by copyright laws and international treaties. Any reproduction or
distribution of this document or any portion of this document, in any form by any means, without the prior written
consent of ZTE CORPORATION is prohibited. Additionally, the contents of this document are protected by
contractual confidentiality obligations.
All company, brand and product names are trade or service marks, or registered trade or service marks, of ZTE
CORPORATION or of their respective owners.
This document is provided “as is”, and all express, implied, or statutory warranties, representations or conditions
are disclaimed, including without limitation any implied warranty of merchantability, fitness for a particular purpose,
title or non-infringement. ZTE CORPORATION and its licensors shall not be liable for damages resulting from the
use of or reliance on the information contained herein.
ZTE CORPORATION or its licensors may have current or pending intellectual property rights or applications
covering the subject matter of this document. Except as expressly provided in any written license between ZTE
CORPORATION and its licensee, the user of this document shall not acquire any license to the subject matter
herein.
ZTE CORPORATION reserves the right to upgrade or make technical change to this product without further notice.
Users may visit ZTE technical support website http://ensupport.zte.com.cn to inquire related information.
The ultimate right to interpret this product resides in ZTE CORPORATION.

Revision History

Revision No. Revision Date Revision Reason

R1.7 2011–11–29 Version update

R1.6 2011–06–23 Version update

R1.5 2011–03–20 Version update

R1.4 2011–02–23 Version update

R1.3 2011–01–10 Version update

R1.2 2010–12–21 Version update

R1.1 2010–11–12 Version update

R1.0 2010–05–10 First release

Serial Number: SJ-20100512144809-004

Publishing Date: 2011–11-29(R1.7)


Tables of Contents
About This Manual ......................................................................................... I
Chapter 1 Product Characteristics ........................................................... 1-1
1.1 Product Technical Characteristics ........................................................................ 1-1
1.1.1 FEC/AFEC Function ................................................................................. 1-1
1.1.2 APSD/APR Function................................................................................. 1-2
1.1.3 Erbium-Doped Fiber Amplifier (EDFA) ...................................................... 1-2
1.1.4 RAMAN Amplifiers.................................................................................... 1-2
1.1.5 HUB-type ROADM ................................................................................... 1-2
1.1.6 L2 Switching Function............................................................................... 1-3
1.1.7 Electric Cross-Connect Function ............................................................... 1-3
1.1.8 RPOA Technology .................................................................................... 1-3
1.2 Upgrade and Maintenance Characteristics ........................................................... 1-5
1.2.1 Master/Slave Subrack............................................................................... 1-5
1.2.2 Compatibility ............................................................................................ 1-6
1.2.3 Smooth Expansion and Upgrade ............................................................... 1-6
1.2.4 Online Upgrade........................................................................................ 1-6
1.2.5 Pluggable Optical Module ......................................................................... 1-6

Chapter 2 Interfaces ................................................................................... 2-1


2.1 Transmission Subrack Backplane Description ...................................................... 2-1
2.2 Board Interface .................................................................................................. 2-2

Chapter 3 Technical Specifications .......................................................... 3-1


3.1 Physical Specifications ....................................................................................... 3-1
3.1.1 Dimension and Weight.............................................................................. 3-1
3.1.2 Bearing Requirements for Equipment Room .............................................. 3-4
3.2 Power Supply Specifications ............................................................................... 3-5
3.2.1 Power Supply Requirement....................................................................... 3-5
3.2.2 Power Consumption Specifications............................................................ 3-5
3.3 Grounding Requirement.................................................................................... 3-10
3.4 Environment Specifications ............................................................................... 3-10
3.4.1 Storage Environment.............................................................................. 3-10
3.4.2 Transportation Environment .................................................................... 3-12
3.4.3 Running Environment ............................................................................. 3-13
3.5 Lightning Protection Requirements .................................................................... 3-15

I
3.6 Electro Magnetic Compatibility Requirements..................................................... 3-16
3.6.1 Electro-Magnetic Susceptibility................................................................ 3-16
3.6.2 Electro-Magnetic Interference (EMI) ........................................................ 3-16
3.7 Requirements on Operating Wavelength............................................................ 3-17
3.7.1 Wavelength Allocation in 8/16/32/40-Channel Systems............................. 3-17
3.7.2 Wavelength Allocation in 48/96 Wavelength System ................................. 3-18
3.7.3 Wavelength Allocation in 80/160 Wavelength System ............................... 3-19
3.7.4 Wavelength Allocation in 176-Channel Systems ....................................... 3-23
3.7.5 Wavelength Allocation in 192-Channel Systems ....................................... 3-23
3.8 Service Access and Convergence Subsystem Specifications .............................. 3-26
3.8.1 Board Classification List.......................................................................... 3-26
3.8.2 Specifications of the 2.5G Board ............................................................ 3-27
3.8.3 Specifications of the 10G Board ............................................................. 3-29
3.8.4 Specifications of the 40G Board ............................................................. 3-32
3.9 Optical Mux/DeMux Subsystem Specifications .................................................. 3-33
3.9.1 Fixed Add/Drop Multiplexer Unit Specifications......................................... 3-33
3.9.2 Reconfigurable Add/Drop Multiplexer Unit Specifications .......................... 3-36
3.9.3 Multiplex/Demultiplex Unit Specifications ................................................. 3-40
3.9.4 Group Mux/DeMux Unit Specifications..................................................... 3-47
3.10 Optical Amplification Subsystem Specifications ............................................... 3-48
3.10.1 Specifications of the EOA Board............................................................ 3-48
3.10.2 Specifications of the SEOA Board ......................................................... 3-61
3.10.3 Specifications of the DRA Board............................................................ 3-65
3.10.4 Specifications of the LAC Board ............................................................ 3-67
3.11 Optical Layer Management Subsystem Specifications....................................... 3-67
3.11.1 Specifications of the OPM Board ........................................................... 3-67
3.11.2 Specifications of the OWM Board .......................................................... 3-69
3.11.3 Specifications of the DCU Board............................................................ 3-69
3.11.4 Specifications of the EOPM Board ......................................................... 3-69
3.11.5 Specifications of the EOWM Board ........................................................ 3-70
3.12 Protection Subsystem Specifications ............................................................... 3-71
3.12.1 Specifications of the SOP Board............................................................ 3-71
3.12.2 Specifications of the SOPCS Board ....................................................... 3-72
3.12.3 Specifications of the SOPMS Board....................................................... 3-72
3.13 Supervision Subsystem Specifications ............................................................. 3-73
3.13.1 Specifications of the SOSC Board ......................................................... 3-73
3.14 RPOA Subsystem Specifications ..................................................................... 3-74

II
3.14.1 Applicable Transmission Codes............................................................. 3-74
3.14.2 Specifications of the RPOA Subsystem ................................................. 3-75
3.15 Specifications of APO Function ....................................................................... 3-75
3.16 Specifications of the IWF Function .................................................................. 3-78

Figures............................................................................................................. I
Tables ............................................................................................................ III
Glossary .......................................................................................................VII

III
IV
About This Manual
Purpose
This manual is applicable to Unitrans ZXWM M920 (V4.20) backbone DWDM equipment
(ZXWM M920 in short hereinafter).

Intended Audience
This manual is intended for:
l Planning engineers
l Device installation engineers
l Commissioning engineers
l Network management monitoring personnel
l Maintenance engineers

What is in This Manual


This manual is Unitrans ZXWM M920 (V4.20) Backbone DWDM Equipment Product
Descriptions. The following table describes the chapters in this manual.

Chapter Description

Chapter 1 Product Introduces the product characteristics of ZXWM M920, including


Description technical characteristics and upgrade maintenance characteristics.

Chapter 2 Interface Introduces the interfaces of ZXWM M920 equipment, including


Description service interfaces and non-service interfaces.

Chapter 3 Technical Lists the parameters and technical specifications of the ZXWM
Specification M920 equipment, including physical parameters, power supply
requirements, environment requirements, lightning protection
requirements, electromagnetic compatibility requirements, operating
wavelengths and specifications of each sub-system.

Conventions
This document uses the following typographical conventions.

Typeface Meaning

Italics Variables in commands. It may also refers to other related manuals and documents.

Bold Menus, menu options, function names, input fields, option button names, check boxes,
drop-down lists, dialog box names, window names, parameters and commands.

CAPS Keys on the keyboard and buttons on screens and company name.

Constant Text that you type, program codes, filenames, directory names, function names.
width

I
Typeface Meaning

[] Optional parameters.

{} Mandatory parameters.

| Separates individual parameter in series of parameters.

Danger: Indicates an imminently hazardous situation, which if not avoided, will result in
death or serious injury.

Warning: Indicates a hazard that, if not avoided, could result in serious injuries,
equipment damages or interruptions of major services.

Caution: Indicates a potential hazard that, if not avoided, could result in moderate
injuries, equipment damages or partial service interruption.

Note: Provides additional information about a certain topic.

Tip: Indicates a suggestion or hint to make things easier or more productive for the
reader.

II
Chapter 1
Product Characteristics
Table of Contents
Product Technical Characteristics...............................................................................1-1
Upgrade and Maintenance Characteristics .................................................................1-5

1.1 Product Technical Characteristics


1.1.1 FEC/AFEC Function
ZXWM M920 provides forward error correction function. This function can improve the
error tolerance capability of transmission signals, reduce the system requirement for
OSNR, and enhance the transmission distance. There are two types of forward error
connection functions: ordinary FEC and AFEC.
l Ordinary FEC: The frame structure complies with ITU-T G.975/G.709
Recommendation.

à In the 40G system, the rate of coded STM-256 service signal is 43.018Gbit/s.
à In the 10G system, the rate of coded STM-64 service signal is 10.709 Gbit/s and
the rate of coded 10GE service signal is 11.1 Gbit/s.

à In the 2.5G system. the rate of coded service signal is 2.66 Gbit/s.
à Ordinary FEC can improve OSNR by 5 dB to 7 dB.
l AFEC: It uses improved FEC coding/decoding algorithm.
à In the 40G system, the rate of coded STM-256 service signal is 43.018Gbit/s.
à In the 10G system, the rate of coded STM-64 service signal is 10.709 Gbit/s and
the rate of coded 10GE service signal is 11.1 Gbit/s.

à AFEC can improve OSNR by 7 dB to 9 dB.

Note:

2.5G system does not support AFEC.

In ZXWM M920, boards of 2.5G system, including SOTU2.5G, GEMF, and DSAF, support
FEC function. Boards of 10G system, including EOTU10G, EOTU10GB, OTU10G,

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ZXWM M920 Product Descriptions

SOTU10G, SRM41, GEM8, and FCA, support either FEC or AFEC function. Boards of
40G system, including TST3, MQT3 and MQ1, support either FEC or AFEC function.

1.1.2 APSD/APR Function


With the cooperation of the NMS software, ZXWM M920 supports two modes of auto power
control functions: auto power shutdown (APSD) and auto power reduction (APR). When
no input optical is detected by the detection board which has optical performance detection
function (such as the OPM board), the detection board will send the message to the SNP
board. And then the SNP board will control the execution board (such as the EOA board)
to automatically reduce the power or shutdown the power, so as to prevent human eyes
from being burnt by the laser. The system can be automatically or manually recovered
after the fault recovery.

1.1.3 Erbium-Doped Fiber Amplifier (EDFA)


The ZXWM M920 adopts EDFA technology to improve the transmission distance of the
system without the electric regenerator.
EDFA technology replaces the traditional regeneration mode of optical-electrical-optical to
implement the simultaneous amplification for the multiple optical signals in the fiber. This
technology can greatly reduce the cost of optical regeneration, and realize the coupling
with transmission fiber. It also provides various benefits, such as high gain, low noise, large
bandwidth, high output power, high pump efficiency, low insertion loss, and insensitive for
polarization.

1.1.4 RAMAN Amplifiers


In the DWDM system with the long-haul transmission distance, only adopting EDFA
technology to implement the amplification will cumulate spontaneous radiation and restrict
the performance of the system. ZXWM M920 adopts the distributed RAMAN amplification
(DRA) board to effectively improve optical amplification performance of the long-haul
transmission system through the combination of EDFA and DRA (the combination of EOA
board and DRA board).

1.1.5 HUB-type ROADM


ZXWM M920 provides an intelligent HUB-type ROADM, supporting multi-direction and
service broadcast functions, which is implemented via the power distribution unit (PDU)
and the wavelength selection unit (WSU). HUB-type ROADM improves the flexibility of
the WDM network to ensure that the operator can dynamically control the wavelength
transmission path in a long distance, and effectively reduce the operation and the running
cost. The detailed functions provided by HUB-type ROADM are illustrated as follows:
l Realizes the wavelength scheduling for signals in different directions.
l Provides local adding/dropping functions.
l Supports the wavelength scheduling in ten optical directions.

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Chapter 1 Product Characteristics

l It can be configured to be wavelength-related or direction-related.

1.1.6 L2 Switching Function


ZXWM M920 can provide Ethernet L2 switching and client service performance detection
functions. This function is based on VLAN L2 switching function and implemented through
the ASMA board. The function can be used to identify the MAC address of the Ethernet
frame, to implement convergence/deconvergence function from multi-GE/10GE to 10GE
bandwidth, QoS management, VLAN and other functions.

1.1.7 Electric Cross-Connect Function


ZXWM M920 provides OTN-based cross and centralized cross-connect function to
schedule GE/2.5G/10G services flexibly.
l Centralized cross-connect includes aggregate units (such as SMUBL, LD2 and LQ2),
CX units (such as CSU and CSUB), tributary units (such as DSAC, SAUC, SMUBC,
CD2, CQ2, COM and COMB) with cross granularity to be ODU1/2 and cross capacity
of single-subrack to be 400G.
l CX units are not needed for distributed cross-connection. Service boards are
interconnected through the high-speed backplane bus. With the NMS, the blockless
cross-connection scheduling is implemented among four pieces of service boards
with cross granularity to be ODU0/1/2. Multi-sets of cross-connection are available
in the single subrack with cross capacity of each set to be 80G.

1.1.8 RPOA Technology


l Remotely Pumped Optical Amplifier (RPOA) is a ultra-long distance transmission
technology applied in the ZXWM M920 system.
l In the RPOA system, a segment of Erbium-Doped Fiber (EDF) is inserted in the
transmission optical cables, which provides pumped light at a far-end site to amplify
optical signals.
l The RPOA system is developed to implement ultra-long single-span transmission
when power supply is not available in the system.

It is usually applied in the following cases:


l Power supply is unavailable, or regenerator sites can not be established when optical
cables stride across channels, offing or pass through depopulated areas, such as
desert, morass and forest.
l The construction and maintenance of regenerator sits is difficult in remote areas due
to territory limits.

1.1.8.1 Unidirectional Pump Application through the Same Fiber


The unidirectional pump application through the same fiber illustrates that the signal light
and pumped light are transferred through the same fiber, as shown in Figure 1-1.

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ZXWM M920 Product Descriptions

Figure 1-1 RPOA Unidirectional Pump Application through the Same Fiber

The RPU board is located in the OTM site. It provides the pumping energy to the
corresponding RGU module on the line through the line fiber.
When the DRA board is adopted at transmitting site, the unidirectional pump application
through the same fiber is illustrated in Figure 1-2.

Figure 1-2 RPOA Unidirectional Pump Application through the Same Fiber (with DRA
board)

1.1.8.2 Unidirectional Pump Application through Different Fiber


The unidirectional pump application through different fiber illustrates that the signal light
and pumped light are transferred through different fibers, as shown in Figure 1-3.

Figure 1-3 RPOA Unidirectional Pump Application through Different Fiber

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Chapter 1 Product Characteristics

The RPU board is located in the OTM site. The pumped light from the RPU board is
transferred to the corresponding RGU module on the line through a special fiber. In this
transmission mode, the system gets better gain flatness. It is applicable to large-capacity
DWDM transmission without regenerator.

1.1.8.3 Bidirectional Pump Application through Two Fiber


The bidirectional signal light and pumped light are transferred through two fibers. Based
on the application of unidirectional light transmission in the same fiber, this application
mode uses different fibers to forward the pump signals of another RPU module to the end
of the RGU module. And then it proceeds the reverse pump for the RGU module in order
to forward the pump signal with higher power to the RGU module for higher gain. This
kind of application mode can meet the requirement of higher span. Figure 1-4 illustrates
the bidirectional transmission of signal light and pumped light through two fibers.

Figure 1-4 RPOA Bidirectional Pump Application through Two Fiber

1.2 Upgrade and Maintenance Characteristics


1.2.1 Master/Slave Subrack
ZXWM M920 supports the configuration of master/slave subrack. One side of the
equipment can configure a master subrack, in which a master subrack supports several
salve subracks. A master subrack can support 127 cascaded slave subracks.

Note:
The master subrack refers to subrack configured with the semi-height SNP board, while
the slave subrack refers to the subrack without the SNP board.

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1.2.2 Compatibility
The optical supervision channel of ZXWM M920 can be connected with the supervision
channel of ZXMP M820 and ZXMP M720 through 100M optical interface.

1.2.3 Smooth Expansion and Upgrade


ZXWM M920 supports the function of multi-subrack management, and provides the ability
of smooth expansion and upgrade described as follows:
l In the mixed transmission system with the rate at 40 Gbit/s, 10 Gbit/s and 2.5 Gbit/s,
ZXWM M920 supports the smooth upgrade to the system with the rate at 40 Gbit/s.
l When configuring 192-channel Mux/DeMux system, ZXWM M920 can implement the
smooth upgrade to the system with 192 wavelengths by adding optical transponder
unit and other boards.

1.2.4 Online Upgrade


ZXWM M920 supports online upgrade described as follows:
l ZXWM M920 can implement online upgrade for the NMS software and embedded
software in each board without interrupting services.
l The system can be upgraded to the system with 192 wavelengths.

1.2.5 Pluggable Optical Module


For service signals with the rate at 40 Gbit/s (STM-256), the optical interfaces at both client
side and line side support MSA300PIN optical module.
For service signals with the rate at 10 Gbit/s (STM-64/OC-192/10GE), the optical interfaces
at client side support hot pluggable optical module (XFP) and those at line side and client
side support MSA300PIN optical module.
For service signals with the rate at 2.5 Gbit/s or below, the optical interfaces at client side
supports hot pluggable optical module (SFP).
Pluggable optical modules support the position detection function for optical modules. The
system configuration of ZXWM M920 is flexible with the use of pluggable optical modules.

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Chapter 2
Interfaces
Table of Contents
Transmission Subrack Backplane Description ............................................................2-1
Board Interface...........................................................................................................2-2

2.1 Transmission Subrack Backplane Description


As an internal communication platform for various boards, the subrack backplane provides
power socket and signal socket for boards. The structure of backplane in 21–inch subrack
is illustrated in Figure 2-1 as an example.

Note:
As the 19–inch transmission subrack has two slots less than the 21–inch transmission
subrack, their backplane dimensions are different, although of the same structure. And
they have the same backplane DIP switch setting.

Figure 2-1 Structure of 21–inch Subrack Backplane

1. DIP switch for subrack No.

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ZXWM M920 Product Descriptions

An 8-pin DIP switch on backplane (identified as S1) is used to configure the subrack
number. The description of subrack number is illustrated in Table 2-1.

Table 2-1 Description of Subrack No.

DIP
Subrack
2 3 4 5 6 7 8

Subrack 1 up up up up up up down

Subrack 2 up up up up up down up

Subrack 3 up up up up up down down

┇ ┇ ┇ ┇ ┇ ┇ ┇ ┇

Subrack
down down down down down down down
127

1. The pin 1 of the DIP switch is reserved.


2. “up” refers to turn on the DIP switch, which also means 0 in binary code.
3. “down” refers to turn down the DIP switch, which also means 1 in binary code.
4. ZXWM M920 supports at most 127 subracks (including the master subrack). A single-NE supports 16 subracks at
most, including the master subrack.

2.2 Board Interface


l Distributed Raman Amplifier (DRA)

The IN interface of the DRA_P board is E2000/APC connector, while the other optical
interfaces are LC/UPC connectors.
The IN interface and OUT interface of the DRA_B board is E2000/APC connector,
while the other optical interfaces are LC/UPC connectors.
l Enhanced Optical Amplifier (EOBA/EOLA/EOPA)
The OUT interface of the EOBAH/EONAH board is E2000/APC connector, while the
other optical interfaces are LC/UPC connectors. Other optical interfaces of other
EOBA/EOLA/EOPA boards are LC/UPC connectors.
l Semi-height Node Process Board (SNP)

The interface of the SNP board for outputting board debugging information is RS232.
l Semi-height Communication Control Board (SCC)

The interface of the SCC board for outputting board debugging information is RS232.
l Power Supply Supervision Board (SPWA)

The interface of the SPWA board for outputting board debugging information is RS232.
l Other Board

The optical interfaces of other boards are LC/UPC connectors.

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Chapter 3
Technical Specifications
Table of Contents
Physical Specifications ...............................................................................................3-1
Power Supply Specifications ......................................................................................3-5
Grounding Requirement ...........................................................................................3-10
Environment Specifications ......................................................................................3-10
Lightning Protection Requirements...........................................................................3-15
Electro Magnetic Compatibility Requirements...........................................................3-16
Requirements on Operating Wavelength ..................................................................3-17
Service Access and Convergence Subsystem Specifications ...................................3-26
Optical Mux/DeMux Subsystem Specifications ........................................................3-33
Optical Amplification Subsystem Specifications .......................................................3-48
Optical Layer Management Subsystem Specifications..............................................3-67
Protection Subsystem Specifications ........................................................................3-71
Supervision Subsystem Specifications .....................................................................3-73
RPOA Subsystem Specifications..............................................................................3-74
Specifications of APO Function ................................................................................3-75
Specifications of the IWF Function ..........................................................................3-78

3.1 Physical Specifications


3.1.1 Dimension and Weight
The dimension and weight of the structural parts of the ZXWM M920 are shown in Table
3-1 and Table 3-2.

Table 3-1 Dimensions and Weights of Structural Parts of ZXWM M920

Structural Part Dimensions (Unit: mm) Weight (kg)

2000 (height) × 600 (width) × 300 (depth) 58.50


ZTE transmission equipment
2200 (height) × 600 (width) × 300 (depth) 64.50
cabinet
2600 (height) × 600 (width) × 300 (depth) 76.00

21–inch Transmission Sub-


422 (height) × 533 (width) × 286 (depth) 12.50
rack

19–inch Transmission Sub-


422 (height) × 473 (width) × 286 (depth) 11.00
rack

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ZXWM M920 Product Descriptions

Structural Part Dimensions (Unit: mm) Weight (kg)

Centralized Cross-Connect
577 (height) × 482.6 (width) × 269.5 (depth) 12.00
Subrack

Power supply distribution box 43.6 (height) × 533 (width) × 233.1 (depth) 6.50

DCM plug-in box 47 (height) × 533 (width) × 286.5 (depth) 5.60

Conversion bracket 29.6 (height) × 345.6 (width) 0.30

30 (height) × 122.9 (width) × 276.8 (depth) 0.68


Fan unit
30 (height) × 107.9 (width) × 276.8 (depth) 0.52

SPWA board Front panel: 235 (height)× 43.3 (width) 1.80

SEIA board Front panel: 95.2 (height)× 87.1 (width) 0.45

PCB: 320 (width) × 210 (depth)


Full-height board -
Front panel: 345.6 (height) × 29.8 (width)

PCB: 152 (width) × 210 The weight of board is


Semi-height board
Front panel: 155.6 (height) × 25.1 (width) illustrated in Table 3-2

• The subrack dimensions include the dimension of flange and front door. The subrack weight listed in the table is
that of an empty subrack.

Table 3-2 ZXWM M920 Board Weight

Board Board ID Weight (kg)

Semi-height Node Process Board SNP 0.60

Semi-height Communication Control Board SCC 0.47

Semi-height Optical Supervision Channel


SOSC 0.60
Board

Semi-height OTU 10Gb/s Transceiver SOTU10G 0.70

Semi-height Optical Group Mux/DeMux


SOGMD 0.60
Board

Semi-height Optical Adding/Dropping


SOAD1 0.60
Board of 1 Wavelength

Semi-height Optical Adding/Dropping


SOAD2 0.60
Board of 2 Wavelength

Semi-height Optical Adding/Dropping


SOAD4 0.60
Board of 4 Wavelength

Semi-height Optical Protection Board SOP 0.60

Semi-height Optical Protection Board for


SOPCS 0.60
Channel Section

Semi-height Optical Protection Board for


SOPMS 0.60
Mux Section

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Chapter 3 Technical Specifications

Board Board ID Weight (kg)

Semi-height Supervisory Division Multi-


SSDM 0.60
plexing Board

Semi-height Power Supply Board (A-type) SPWA 1.80

Semi-height Extension Interface Board SEIA 0.45

Semi-height Fan Board SFANA 0.68

Optical Transparent Unit OTU 1.55

Semi-height Optical Transponder Unit for


SOTU2.5G 0.60
2.5 Gbit/s

Optical Transponder Unit for 10 Gb/s OTU10G 1.65

Enhanced Optical Transponder Unit for 10


EOTU10G 1.65
Gbit/s

Type B Enhanced Optical Transponder


EOTU10GB 1.65
Unit for 10 Gbit/s

TST3 (using DPSK module) 3.3


Optical Transponder Unit for 40 Gb/s
TST3 (using DQPSK module) 3.5

Gigabit Ethernet Mux Board with FEC GEMF 1.50

Two Gigabit Ethernet Mux Board GEM2 1.50

Eight Gigabit Ethernet Mux Board GEM8 2.05

Data Service Aggregation with FEC DSAF 1.40

Four 622 M/155 M SubRate Mux Board SRM42 1.25

Four 2.5 G SubRate Mux Board SRM41 1.25

Type A Convergence Switching Board ASMA 0.6

FC service Access unit FCA 1.50

MQT3 (using DPSK module) 3.05


Four 10 G SubRate Mux Board
MQT3 (using DQPSK module) 3.25

Enhanced Optical Booster Amplifier EOBA 1.80

Enhanced Optical Pre-Amplifier EOPA 1.80

Enhanced Optical Line Amplifier EOLA 1.80

Enhanced Optical Node Amplifier EONA 2.00

Enhanced Optical Booster Amplifier SEOBA 0.60

Enhanced Optical Pre-Amplifier SEOPA 0.60

Enhanced Optical Line Amplifier SEOLA 0.60

DRA_P 2.00
Distributed Raman Amplifier
DRA_B 2.00

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Board Board ID Weight (kg)

Line Attenuation Compensator LAC 1.10

Data Service Aggregation Board DSA 1.60

Data Service Aggregation Board DSAC 0.6

SDH Service Access Unit SAUC 0.6

SDH Service Aggregate Multiplexer Board SMUB 1.30

Optical Multiplexing Unit OMU 1.60

Optical De-Multiplexing Unit ODU 1.60

Optical De-Multiplexing Unit ODU 1.60

Optical De-Multiplexing Unit (B Type) ODUB 1.60

Optical Channel Interleaver OCI 1.95

Variable Insertion Loss Multiplexer VMUX 2.10

Variable Insertion Loss Multiplexer (B


VMUXB 2.10
Type)

Power Distribution Unit PDU 1.40

Wavelength Blocking Unit WBU 2.60

Wavelength Selective Unit WSU 2.60

Wavelength Blocking Multiplexer WBM 2.10

Optical Multi-Channel Protection OMCP 1.25

Optical Performance Monitor OPM 1.15

Optical Wavelength Monitor OWM 1.10

Remote Pump Unit RPU 2.50

Remote Gain Unit RGU 1.50

Dispersion Compensation Board DCU 0.55

Enhanced Optical Wavelength Monitor


EOWM 0.90
Board

Enhanced Optical Channel Performance


EOPM 0.96
Monitor

10G Optical Convergence Board MQ1 1.50

3.1.2 Bearing Requirements for Equipment Room


The bearing capacity of equipment room should be greater than 450 kg/m2 so as to hold
the ZXWM M920 equipment.

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3.2 Power Supply Specifications


3.2.1 Power Supply Requirement
The power supply requirements of ZXWM M920 are described as follows:
l Input voltage: -48 VDC
l Allowable fluctuation range: -60 VDC to -36 VDC

3.2.2 Power Consumption Specifications


The power consumption specifications of each board and unit of the ZXWM M920 are
shown in Table 3-3.

Table 3-3 Power Consumption of ZXWM M920

Maximum Maximum
Power Power
Board/Unit Abbreviation Remark
Consumption Consumption
℃) (W)
in (25℃ ℃) (W)
(55℃

Optical Transponder Unit OTU 14 21 -

Semi-height Optical
Transponder Unit for 2.5 SOTU2.5G 24 27 -
Gbit/s

Optical Transponder Unit for


OTU10G 29.2 41 -
10 Gb/s

Optical Transponder Unit for OTU10G (re-


22.2 31 -
10 Gb/s generator)

Enhanced OTU 10Gbit/s


EOTU10G 28 39 -
Transceiver

Type B Enhanced OTU


Board EOTU10GB 28 39
10Gbit/s Transceiver

Enhanced OTU 10Gbit/s EOTU10G (re-


21 29 -
Transceiver generator)

Semi-height OTU 10Gbit/s


SOTU10G 25 30 -
Transceiver

Optical Transponder Unit for


TST3 90 117 -
40 Gb/s

Optical Transponder Unit for TST3 (regen-


78 101.4 -
40 Gb/s erator)

Two Gigabit Ethernet Mux


GEM2 13 20 -
Board

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Maximum Maximum
Power Power
Board/Unit Abbreviation Remark
Consumption Consumption
℃) (W)
in (25℃ ℃) (W)
(55℃

Gigabit Ethernet Mux Board


GEMF 18 27 -
with FEC

Eight Gigabit Ethernet Mux


GEM8 35 53 -
Board

Data Service Aggregation


DSA 25 38 -
Board

Data Service Aggregation


DSAF 22 33 -
with FEC

Four 622 M/155 M SubRate


SRM42 20 30 -
Mux Board

Four 2.5 G SubRate Mux


SRM41 33 50 -
Board

Type A Convergence
ASMA 80 85 -
Switching Board

FC service Access unit FCA 40 50 -

Four 10 G SubRate Mux


MQT3 120 150 -
Board

The maximum
14.5 (EOBAS) 20 output power is
20 dBm

The maximum
20 (EOBA) 30 output power is 21
Enhanced Optical Booster dBm
EOBA
Amplifier The maximum
30 (EOBAH) 45 output power is 24
dBm

The maximum
40 (EOBAH) 60 output power is 26
dBm

The maximum
11 (EOPAS) 15 output power is
Enhanced Optical PreAmpli- 12dBm
EOPA
fier The maximum
11 (EOPAS) 15 output power is 17
dBm

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Maximum Maximum
Power Power
Board/Unit Abbreviation Remark
Consumption Consumption
℃) (W)
in (25℃ ℃) (W)
(55℃

The maximum
14.5 (EOPAS) 22 output power is 20
dBm

Enhanced Optical Line Am-


EOLA 14.5 20 -
plifier

The maximum
25 38 output power is 20
Enhanced Optical Node Am- dBm
EONA
plifier The maximum
26 39 output power is 21
dBm

Enhanced Optical Booster


SEOBA 14 20 -
Amplifier

Enhanced Optical PreAmpli-


SEOPA 11 15 -
fier

Enhanced Optical Line Am-


SEOLA 14 20 -
plifier

Distributed RAMAN Ampli- DRA_P 35 53 -


fier
DRA_B 35 53 -

Line Attenuation Board LACG/LACT 3 4 -

3 (TFF or 4 (TFF or
Optical Multiplexing Unit OMU coupler) coupler) -
13.2 (AWG) 16 (AWG)

3 (TFF) 4 (TFF)
Optical De-Multiplexing Unit ODU -
13.2 (AWG) 16 (AWG)

Optical De-Multiplexing Unit


ODUB 38 (AWG) 46 (AWG) -
(B Type)

Semi-height Optical Group


SOGMD 5 6 -
Mux/DeMux Board

Optical Channel Interleaver OCI 3 4 -

Variable Insertion Loss Mul-


VMUX 30 36 -
tiplexer

Variable Insertion Loss Mul-


VMUXB 30 36 -
tiplexer (B Type)

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ZXWM M920 Product Descriptions

Maximum Maximum
Power Power
Board/Unit Abbreviation Remark
Consumption Consumption
℃) (W)
in (25℃ ℃) (W)
(55℃

Optical Broadband Multi-


OBM 3 4 -
plexer

Semi-height Optical
Add/Drop Board of 1 SOAD1 4 5 -
Wavelength

Semi-height Optical
Add/Drop Board of 2 SOAD2 4 5 -
Wavelength

Semi-height Optical
Add/Drop Board of 4 SOAD4 5 6 -
Wavelength

Wavelength Blocking Unit WBU 15 18 -

Wavelength Selective Unit WSU 15 18 -

Wavelength Blocking Multi-


WBM 32 38 -
plexing

Power Distribution Unit PDU 3 4 -

Optical Protect Board SOP 5 6 -

Semi-height Optical Protec-


tion Board for Channel Sec- SOPCS 3 4 -
tion

Semi-height Optical Protec-


SOPMS 3 4 -
tion Board for Mux Section

Optical Protect for Mux Sec-


OMCP 5 6 -
tion

Optical Wavelength Monitor OWM 3 4 -

Optical Performance Moni-


OPM 5 6 -
tor

Semi-height Fan Board SFANA 10 20 -

Semi-height Power Box


SPWA 28 55 -
Board (A-type)

Semi-height Node Proces-


SNP 10 12 -
sor Board

Semi-height Optical Super-


SOSC 12 14 -
vision Channel Board

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Maximum Maximum
Power Power
Board/Unit Abbreviation Remark
Consumption Consumption
℃) (W)
in (25℃ ℃) (W)
(55℃

Semi-height Extension Inter-


SEIA 5 6 -
face Board

Communication Control
SCC 10 12 -
Board

Data Service Aggregation


DSAC 34 41 -
Board

SDH Service Access Unit SAUC 32 38 -

SDH Service Aggregate


SMUB 40 48 -
Multiplexer Board

Dispersion Compensation
DCU 17 19 -
Board

10G Optical Convergence


MQ1 41 45 -
Board

Enhanced Optical Wave-


EOWM 10 12 -
length Monitor Board

Enhanced Optical Channel


EOPM 10 12 -
Performance Monitor

Eight GE/STM-16 SubRate


COMB 35 38 -
Mux Unit(Type B)

Eight GE/STM-16 SubRate


COM 32 38 -
Mux Unit

Cross switch and Syn-


CSUB 12 14 -
chronous clock Unit

Line side board with double


LD2 28 39 -
ports: OTU2 level

Client side board with dou-


CD2 28 39 -
ble ports: OTU2 level

Client side board with 4 ports LQ2 28 39 -

Line side board with 4 ports CQ2 85 91 -

Master subrack - 733 954 -


Subrack
Slave subrack - 721 940 -

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ZXWM M920 Product Descriptions

3.3 Grounding Requirement


Grounding Requirements for Equipment Internal
l Each board in ZXWM M920 equipment should be grounded through the contact
between its panel and equipment cover. Make sure there is no electrical connection
inside each board.
l The outer cases of cabinet and subracks should be connected to the protection ground
in the equipment room.

Note:
One side of the protection ground should be connected to the grounding copper
busbar at the right side of rack, while the other side should be connected to the
protection ground of the cabinet.

Grounding Requirements for Equipment Room


l AC working ground resistance ≤ 4 Ω
l DC working ground resistance ≤ 4 Ω
l Security protection ground resistance ≤ 4 Ω
l Lightning protection ground resistance ≤ 4 Ω
l Joint grounding resistance ≤ 1 Ω
l If the equipment room provides working ground and protection ground separately,
the working ground and protection ground of ZXWM M920 equipment should be
connected to corresponding grounding copper busbar.
l If the equipment room provides only one grounding copper busbar, the working ground
and protection ground of ZXWM M920 equipment can be jointed for grounding. The
ground resistance should meet the above requirements.

3.4 Environment Specifications


The environment requirements for ZXWM M920 equipment can be classified into three
aspects: storage environment, transportation environment, and running environment.

3.4.1 Storage Environment


Climate Requirement
The climate requirements for the ZXWM M920 equipment are described in Table 3-4.

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Table 3-4 Requirements for Climate (Storage Environment)

Item Specifications

Altitude ≤4000 m

Air pressure 70 kPa to 106kPa

Temperature -40 ℃ to +70 ℃

Temperature variance ratio ≤1 ℃/min

Relative humidity 5% to 100%

Solar radiation ≤1120 W/s2

Hot radiation ≤600 W/s2

Wind speed ≤20 m/s

Water-proof Requirement
l Keep the equipment indoor.
l Ensure that there is no water on the storage room floor, so that the water will not leak
on the packing container of the equipment. Furthermore, the storage position should
be far away from the leaking places of the fire fighting equipment and heating system.
l If the equipment should be stored outside, the requirements are listed as follows:
à Ensure that the packing of the equipment is in good condition without any
damages.
à Rainwater-proof measures should be provided, so that the rainwater can not
damage the pack of the equipment.
à Ensure that no water on the floor, so that the packing container of the equipment
will not be leaked.
à Do not expose the packing to direct sunlight.

Biology Environment
l Avoid the propagation of microorganism, such as fungi or mould.
l Avoid rodent (such as mice) to damage the equipment.

Air Cleanness Requirement


l There should be no explosive, electrically conductive, magnetically conductive or
corrosive dust in the equipment room.
l The concentration of mechanical activity material is illustrated in Table 3-5.
l The concentration of chemical activity material is illustrated in Table 3-6.

Table 3-5 Concentration of Mechanical Activity Material (Storage Environment)

Mechanical Activity Material Content

Suspended dust ≤5.00 mg/m3

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Mechanical Activity Material Content

Degraded dust ≤20.0 mg/m2•h

Sand ≤300 mg/m3

Table 3-6 Concentration of Chemical Activity Material (Storage Environment)

Chemical Activity Material Content

SO2 ≤0.30 mg/m3

H2S ≤0.10 mg/m3

NO2 ≤0.50 mg/m3

NH3 ≤1.00 mg/m3

Cl2 ≤0.10 mg/m3

HCI ≤0.10 mg/m3

HF ≤0.01 mg/m3

O3 ≤0.05 mg/m3

3.4.2 Transportation Environment


Climate Requirement
The climate requirements for the ZXWM M920 equipment are described in Table 3-7.

Table 3-7 Requirements for Climate

Item Specifications

Altitude ≤4000 m

Air pressure 70 kPa to 106kPa

Temerature -40 ℃ to +70 ℃

Temperature variance ratio ≤1 ℃/min

Relative humidity 5% to 100%

Solar radiation ≤1120 W/s2

Hot radiation ≤600 W/s2

Wind speed ≤20 m/s

Water-proof Requirement
l Ensure that the packing of the equipment is in good condition without any damages.
l Rainwater-proof transportation tools should be provided, so that the rainwater can not
damage the pack of the equipment.

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l Ensure that no water in the transportation tools, so that the packing container of the
equipment will not be leaked.

Biology Environment
l Avoid the propagation of microorganism, such as fungi or mould.
l Avoid rodent (such as mice) to damage the equipment.

Air Cleanness Requirement


l There should be no explosive, electrically conductive, magnetically conductive or
corrosive dust in the equipment room.
l The concentration of mechanical activity material is illustrated in Table 3-8.
l The concentration of chemical activity material is illustrated in Table 3-9.

Table 3-8 Concentration of Mechanical Activity Material

Mechanical Activity Material Content

Suspended dust No special requirements

Degraded dust ≤3.0 mg/m2•h

Sand ≤100 mg/m3

Table 3-9 Concentration of Chemical Activity Material

Chemical Activity Material Content

SO2 ≤0.30 mg/m3

H2S ≤0.10 mg/m3

NO2 ≤0.50 mg/m3

NH3 ≤1.00 mg/m3

Cl2 ≤0.10 mg/m3

HCI ≤0.10 mg/m3

HF ≤0.01 mg/m3

O3 ≤0.05 mg/m3

3.4.3 Running Environment


Climate Requirements
The climate requirements for the ZXWM M920 equipment are described in Table 3-10 and
Table 3-11.

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Table 3-10 Climate Requirements

Item Specification

Long term running: 0 ºC to +45 ºC


Ambient temperature
Short term running: -5 ºC to +50 ºC

Long term running: 10% to 90%


Relative humidity (35 ºC)
Short term running: 5% to 95%

• Temperature and humidity are measured 1.5 m above the floor and 0.4 m in front of the equipment.
• Short term running means that the equipment works continuously for no more than 96 hours and
works for no more than 15 days in one year.

Table 3-11 Requirements for Climate

Item Specifications

Altitude ≤4000 m

Air pressure 70 kPa to 106kPa

Temperature variance ratio ≤30 ℃/min

Solar radiation ≤700 W/s2

Hot radiation ≤600 W/s2

Wind speed ≤5 m/s

Biology Environment
l Avoid the propagation of microorganism, such as fungi or mould.
l Avoid rodent (such as mice) to damage the equipment.

Air Cleanness Requirement


l There should be no explosive, electrically conductive, magnetically conductive or
corrosive dust in the equipment room.
l The concentration of mechanical activity material is illustrated in Table 3-12.
l The concentration of chemical activity material is illustrated in Table 3-13.

Table 3-12 Concentration of Mechanical Activity Material

Mechanical Activity Material Content

Suspended dust ≤0.2 mg/m3

Degraded dust ≤15 mg/m2•h

Sand ≤100 mg/m3

Dust particle ≤3×105 /m3

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Table 3-13 Concentration of Chemical Activity Material

Chemical Activity Material Content

SO2 ≤0.30 mg/m3

H2S ≤0.10 mg/m3

NO2 ≤0.50 mg/m3

NH3 ≤3.00 mg/m3

Cl2 ≤0.10 mg/m3

HCI ≤0.10 mg/m3

HF ≤0.01 mg/m3

O3 ≤0.05 mg/m3

NOx ≤0.5 mg/m3

3.5 Lightning Protection Requirements


Typical power supply lightning protection can be divided in to three classes as shown in
Table 3-14.

Table 3-14 Typical Power Supply Lighting Protection Classification

Location of Lightning
Class Parameter
Protection Circuit

AC power distribution
Class B 40 kA (8 μs /20 μs)
board/unit

Class C 20 kA (8 μs/20 μs) DC power cabinet

Class D 6000 V (combination wave) -48 V power rectifier

ZXWM M920 must meet the following lightning protection requirements:


l In central equipment room:
à AC power cables should be led into the cable vault or power room underground.

à Since the AC power distribution board/unit and the DC power cabinet are in
the same equipment room, the distance between Class B and Class C lightning
protection units should meet the following decoupling distance requirements:

When the protection grounding bar is laid independently, the distance between
Class B and Class C lightning protection units should be no less than 5 m.
When the protection grounding bar and the power cords are laid in parallel, the
distance between Class B and Class C lightning protection units should be no
less than 15 m.

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à If the required decoupling distance can not be satisfied due to some restrictions
in the equipment room, additional decoupling inductance(s) should be installed
before the Class C lightning protection unit by 1.5μH/m.
à Bunched copper wires with cross section area no less than 95 mm2 which are
joined by MET (Main Earthing Terminal) or FEB (Floor Equipotential Earthing
Terminal Board) should be used as the grounding cables of the Class B lightning
protection unit (AC power distribution board/unit), and the protection grounding
cables and working grounding cables of the Class C lightning protection unit
(DC power cabinet), which are connected to the protection grounding bar in the
equipment room. Keep the length of grounding cables as short as possible.
l The lightning requirements of ZXWM M920 power supply input/output ports are listed
in Table 3-15.

Table 3-15 ZXWM M920 Port Lighting Requirements

Ports Requirements

DC power input port 1 kV (1.2/50 µs)

Signal input/output port 1 kV (1.2/50 µs)

3.6 Electro Magnetic Compatibility Requirements


3.6.1 Electro-Magnetic Susceptibility
The Electro-magnetic susceptibility specifications of ZXWM M920 are illustrated in Table
3-16.

Table 3-16 Electro-Magnetic Susceptibility Specifications

Test Item Standard

Electronic Static Discharge Susceptibil-


GB/T 17626.2 or IEC 61000-4-2
ity

RF Electromagnetic Radiation Suscep-


GB/T 17626.3 or IEC 61000-4-3
tibility

Electrical Fast Transient Susceptibility GB/T 17626.4 or IEC 61000-4-4

Surge Susceptibility GB/T 17626.5 or IEC 61000-4-5

RF Filed Conduct Susceptibility GB/T 17626.6 or IEC 61000-4-6

3.6.2 Electro-Magnetic Interference (EMI)


Electro-Magnetic Interference (EMI) specifications of ZXWM M920 include conduction
disturbance and radiation disturbance, which are in compliance with GB 9254 or CISPR
22 (A-level ITE).

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3.7 Requirements on Operating Wavelength


3.7.1 Wavelength Allocation in 8/16/32/40-Channel Systems
Table 3-17 lists the wavelength allocation in a system consisting of ZXWM M920 with no
more than 40 wavelengths in C band. The spacing between wavelengths is 100 GHz (The
spacing for 8-channel system is 200 GHz).

Table 3-17 Wavelength Allocation (8/16/32/40-channel, C band)

Central Central Central Central


Sub-band Sub-band
S/N Frequency Wave- S/N Frequency Wave-
Name Name )
(THz) length (nm) (THz) length (nm)

1 C 192.10 1560.61 21 C 194.10 1544.53

2 C 192.20 1559.79 22 C 194.20 1543.73

3 C 192.30 1558.98 23 C 194.30 1542.94

4 C 192.40 1558.17 24 C 194.40 1542.14

5 C 192.50 1557.36 25 C 194.50 1541.35

6 C 192.60 1556.55 26 C 194.60 1540.56

7 C 192.70 1555.75 27 C 194.70 1539.77

8 C 192.80 1554.94 28 C 194.80 1538.98

9 C 192.90 1554.13 29 C 194.90 1538.19

10 C 193.00 1553.33 30 C 195.00 1537.4

11 C 193.10 1552.52 31 C 195.10 1536.61

12 C 193.20 1551.72 32 C 195.20 1535.82

13 C 193.30 1550.92 33 C 195.30 1535.04

14 C 193.40 1550.12 34 C 195.40 1534.25

15 C 193.50 1549.32 35 C 195.50 1533.47

16 C 193.60 1548.51 36 C 195.60 1532.68

17 C 193.70 1547.72 37 C 195.70 1531.9

18 C 193.80 1546.92 38 C 195.80 1531.12

19 C 193.90 1546.12 39 C 195.90 1530.33

20 C 194.00 1545.32 40 C 196.00 1529.55

• Sub-band C refers to the first sub-band in C band with the wavelength spacing at 100 GHz.

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3.7.2 Wavelength Allocation in 48/96 Wavelength System


Table 3-18 lists the wavelength allocation in a system consisting of ZXWM M920 with 48/96
wavelengths in C band. The spacing between wavelengths is 100 GHz/50 GHz.

Table 3-18 Wavelength Allocation (48/96-channel,C band)

Central Central Central Central


Sub-band Sub-band
S/N Frequency Wave- S/N Frequency Wave-
Name Name )
(THz) length (nm) (THz) length (nm)

1 C1002 196.05 1529.16 49 C1002 193.65 1548.11

2 C1001 196.00 1529.55 50 C1001 193.60 1548.51

3 C1002 195.95 1529.94 51 C1002 193.55 1548.91

4 C1001 195.90 1530.33 52 C1001 193.50 1549.32

5 C1002 195.85 1530.72 53 C1002 193.45 1549.72

6 C1001 195.80 1531.12 54 C1001 193.40 1550.12

7 C1002 195.75 1531.51 55 C1002 193.35 1550.52

8 C1001 195.70 1531.9 56 C1001 193.30 1550.92

9 C1002 195.65 1532.29 57 C1002 193.25 1551.32

10 C1001 195.60 1532.68 58 C1001 193.20 1551.72

11 C1002 195.55 1533.07 59 C1002 193.15 1552.12

12 C1001 195.50 1533.47 60 C1001 193.10 1552.52

13 C1002 195.45 1533.86 61 C1002 193.05 1552.93

14 C1001 195.40 1534.25 62 C1001 193.00 1553.33

15 C1002 195.35 1534.64 63 C1002 192.95 1553.73

16 C1001 195.30 1535.04 64 C1001 192.90 1554.13

17 C1002 195.25 1535.43 65 C1002 192.85 1554.54

18 C1001 195.20 1535.82 66 C1001 192.80 1554.94

19 C1002 195.15 1536.22 67 C1002 192.75 1555.34

20 C1001 195.10 1536.61 68 C1001 192.70 1555.75

21 C1002 195.05 1537 69 C1002 192.65 1556.15

22 C1001 195.00 1537.4 70 C1001 192.60 1556.55

23 C1002 194.95 1537.79 71 C1002 192.55 1556.96

24 C1001 194.90 1538.19 72 C1001 192.50 1557.36

25 C1002 194.85 1538.58 73 C1002 192.45 1557.77

26 C1001 194.80 1538.98 74 C1001 192.40 1558.17

27 C1002 194.75 1539.37 75 C1002 192.35 1558.58

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Central Central Central Central


Sub-band Sub-band
S/N Frequency Wave- S/N Frequency Wave-
Name Name )
(THz) length (nm) (THz) length (nm)

28 C1001 194.70 1539.77 76 C1001 192.30 1558.98

29 C1002 194.65 1540.16 77 C1002 192.25 1559.39

30 C1001 194.60 1540.56 78 C1001 192.20 1559.79

31 C1002 194.55 1540.95 79 C1002 192.15 1560.2

32 C1001 194.50 1541.35 80 C1001 192.10 1560.61

33 C1002 194.45 1541.75 81 C1002 192.05 1561.02

34 C1001 194.40 1542.14 82 C1001 192.00 1561.42

35 C1002 194.35 1542.54 83 C1002 191.95 1561.83

36 C1001 194.30 1542.94 84 C1001 191.90 1562.24

37 C1002 194.25 1543.33 85 C1002 191.85 1562.64

38 C1001 194.20 1543.73 86 C1001 191.80 1563.05

39 C1002 194.15 1544.13 87 C1002 191.75 1563.46

40 C1001 194.10 1544.53 88 C1001 191.70 1563.87

41 C1002 194.05 1544.92 89 C1002 191.65 1564.27

42 C1001 194.00 1545.32 90 C1001 191.60 1564.68

43 C1002 193.95 1545.72 91 C1002 191.55 1565.09

44 C1001 193.90 1546.12 92 C1001 191.50 1565.5

45 C1002 193.85 1546.52 93 C1002 191.45 1565.91

46 C1001 193.80 1546.92 94 C1001 191.40 1566.32

47 C1002 193.75 1547.32 95 C1002 191.35 1566.73

48 C1001 193.70 1547.72 96 C1001 191.30 1567.14

• Sub-band C1001 and C1002 respectively refer to the first and the second sub-bands in C band with the wavelength
spacing at 100 GHz. Each sub-band includes 48 wavelengths.

3.7.3 Wavelength Allocation in 80/160 Wavelength System


1. Table 3-19 lists the wavelength allocation in a system consisting of ZXWM M920 with
80 wavelengths in C band. The spacing between wavelengths is 50 GHz.

Table 3-19 Wavelength Allocation (80-channel, C band)

Central Central Central Central


Sub-band Sub-band
S/N Frequency Wave- S/N Frequency Wave-
Name Name )
(THz) length (nm) (THz) length (nm)

1 C+ 196.05 1529.16 41 C+ 194.05 1544.92

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Sub-band Sub-band
S/N Frequency Wave- S/N Frequency Wave-
Name Name )
(THz) length (nm) (THz) length (nm)

2 C 196.00 1529.55 42 C 194.00 1545.32

3 C+ 195.95 1529.94 43 C+ 193.95 1545.72

4 C 195.90 1530.33 44 C 193.90 1546.12

5 C+ 195.85 1530.72 45 C+ 193.85 1546.52

6 C 195.80 1531.12 46 C 193.80 1546.92

7 C+ 195.75 1531.51 47 C+ 193.75 1547.32

8 C 195.70 1531.90 48 C 193.70 1547.72

9 C+ 195.65 1532.29 49 C+ 193.65 1548.11

10 C 195.60 1532.68 50 C 193.60 1548.51

11 C+ 195.55 1533.07 51 C+ 193.55 1548.91

12 C 195.50 1533.47 52 C 193.50 1549.32

13 C+ 195.45 1533.86 53 C+ 193.45 1549.72

14 C 195.40 1534.25 54 C 193.40 1550.12

15 C+ 195.35 1534.64 55 C+ 193.35 1550.52

16 C 195.30 1535.04 56 C 193.30 1550.92

17 C+ 195.25 1535.43 57 C+ 193.25 1551.32

18 C 195.20 1535.82 58 C 193.20 1551.72

19 C+ 195.15 1536.22 59 C+ 193.15 1552.12

20 C 195.10 1536.61 60 C 193.10 1552.52

21 C+ 195.05 1537.00 61 C+ 193.05 1552.93

22 C 195.00 1537.40 62 C 193.00 1553.33

23 C+ 194.95 1537.79 63 C+ 192.95 1553.73

24 C 194.90 1538.19 64 C 192.90 1554.13

25 C+ 194.85 1538.58 65 C+ 192.85 1554.54

26 C 194.80 1538.98 66 C 192.80 1554.94

27 C+ 194.75 1539.37 67 C+ 192.75 1555.34

28 C 194.70 1539.77 68 C 192.70 1555.75

29 C+ 194.65 1540.16 69 C+ 192.65 1556.15

30 C 194.60 1540.56 70 C 192.60 1556.55

31 C+ 194.55 1540.95 71 C+ 192.55 1556.96

32 C 194.50 1541.35 72 C 192.50 1557.36

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Central Central Central Central


Sub-band Sub-band
S/N Frequency Wave- S/N Frequency Wave-
Name Name )
(THz) length (nm) (THz) length (nm)

33 C+ 194.45 1541.75 73 C+ 192.45 1557.77

34 C 194.40 1542.14 74 C 192.40 1558.17

35 C+ 194.35 1542.54 75 C+ 192.35 1558.58

36 C 194.30 1542.94 76 C 192.30 1558.98

37 C+ 194.25 1543.33 77 C+ 192.25 1559.39

38 C 194.20 1543.73 78 C 192.20 1559.79

39 C+ 194.15 1544.13 79 C+ 192.15 1560.2

40 C 194.10 1544.53 80 C 192.10 1560.61

• Sub-band C and C+ respectively refer to the first and the second sub-bands in C band with the wavelength spacing
at 100 GHz. Each sub-band includes 40 wavelengths.

2. Table 3-20 lists the wavelength allocation in a system consisting of ZXWM M920 with
80 wavelengths in L band. The spacing between wavelengths is 50 GHz.

Table 3-20 Wavelength Allocation (80-channel, L band)

Central Central Central Central


Sub-band Sub-band
S/N Frequency Wave- S/N Frequency Wave-
Name Name )
(THz) length (nm) (THz) length (nm)

1 L 190.90 1570.42 41 L 188.90 1587.04

2 L+ 190.85 1570.83 42 L+ 188.85 1587.46

3 L 190.80 1571.24 43 L 188.80 1587.88

4 L+ 190.75 1571.65 44 L+ 188.75 1588.30

5 L 190.70 1572.06 45 L 188.70 1588.73

6 L+ 190.65 1572.48 46 L+ 188.65 1589.15

7 L 190.60 1572.89 47 L 188.60 1589.57

8 L+ 190.55 1573.30 48 L+ 188.55 1589.99

9 L 190.50 1573.71 49 L 188.50 1590.41

10 L+ 190.45 1574.13 50 L+ 188.45 1590.83

11 L 190.40 1574.54 51 L 188.40 1591.26

12 L+ 190.35 1574.95 52 L+ 188.35 1591.68

13 L 190.30 1575.37 53 L 188.30 1592.10

14 L+ 190.25 1575.78 54 L+ 188.25 1592.52

15 L 190.20 1576.20 55 L 188.20 1592.95

16 L+ 190.15 1576.61 56 L+ 188.15 1593.37

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Sub-band Sub-band
S/N Frequency Wave- S/N Frequency Wave-
Name Name )
(THz) length (nm) (THz) length (nm)

17 L 190.10 1577.03 57 L 188.10 1593.79

18 L+ 190.05 1577.44 58 L+ 188.05 1594.22

19 L 190.00 1577.86 59 L 188.00 1594.64

20 L+ 189.95 1578.27 60 L+ 187.95 1595.06

21 L 189.90 1578.69 61 L 187.90 1595.49

22 L+ 189.85 1579.10 62 L+ 187.85 1595.91

23 L 189.80 1579.52 63 L 187.80 1596.34

24 L+ 189.75 1579.93 64 L+ 187.75 1596.76

25 L 189.70 1580.35 65 L 187.70 1597.19

26 L+ 189.65 1580.77 66 L+ 187.65 1597.62

27 L 189.60 1581.18 67 L 187.60 1598.04

28 L+ 189.55 1581.60 68 L+ 187.55 1598.47

29 L 189.50 1582.02 69 L 187.50 1598.89

30 L+ 189.45 1582.44 70 L+ 187.45 1599.32

31 L 189.40 1582.85 71 L 187.40 1599.75

32 L+ 189.35 1583.27 72 L+ 187.35 1600.17

33 L 189.30 1583.69 73 L 187.30 1600.60

34 L+ 189.25 1584.11 74 L+ 187.25 1601.03

35 L 189.20 1584.53 75 L 187.20 1601.46

36 L+ 189.15 1584.95 76 L+ 187.15 1601.88

37 L 189.10 1585.36 77 L 187.10 1602.31

38 L+ 189.05 1585.78 78 L+ 187.05 1602.74

39 L 189.00 1586.20 79 L 187.00 1602.17

40 L+ 188.95 1586.62 80 L+ 186.95 1603.57

• Sub-band L and L+ respectively refer to the first and the second sub-bands in L band with the wavelength spacing
at 100 GHz. Each sub-band includes 40 wavelengths.

3. Table 3-19 and Table 3-20 lists the wavelength allocation in a system consisting of
ZXWM M920 with 160 wavelengths in C+L band. The spacing between wavelengths
is 50 GHz.

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3.7.4 Wavelength Allocation in 176-Channel Systems


When the system is extended to 176-channel system (C+L band) with the spacing at 50
GHz, wavelength allocations in 96-channel band (C band) and 80-channel system (L band)
are adopted.

3.7.5 Wavelength Allocation in 192-Channel Systems


Table 3-21 lists the wavelength allocation in a system consisting of ZXWM M920 with 192
wavelengths in C band. The spacing between wavelengths is 25 GHz.

Table 3-21 Wavelength Allocation (192-channel, C band)

Central Central Central Central


Sub-band Sub-band
S/N Frequency Wave- S/N Frequency Wave-
Name Name )
(THz) length (nm) (THz) length (nm)

1 C1004 196.075 1528.97 97 C1004 193.675 1547.92

2 C1002 196.05 1529.16 98 C1002 193.65 1548.11

3 C1003 196.025 1529.36 99 C1003 193.625 1548.31

4 C1001 196 1529.55 100 C1001 193.6 1548.51

5 C1004 195.975 1529.75 101 C1004 193.575 1548.71

6 C1002 195.95 1529.94 102 C1002 193.55 1548.91

7 C1003 195.925 1530.14 103 C1003 193.525 1549.11

8 C1001 195.9 1530.33 104 C1001 193.5 1549.32

9 C1004 195.875 1530.53 105 C1004 193.475 1549.52

10 C1002 195.85 1530.72 106 C1002 193.45 1549.72

11 C1003 195.825 1530.92 107 C1003 193.425 1549.92

12 C1001 195.8 1531.12 108 C1001 193.4 1550.12

13 C1004 195.775 1531.31 109 C1004 193.375 1550.32

14 C1002 195.75 1531.51 110 C1002 193.35 1550.52

15 C1003 195.725 1531.7 111 C1003 193.325 1550.72

16 C1001 195.7 1531.9 112 C1001 193.3 1550.92

17 C1004 195.675 1532.09 113 C1004 193.275 1551.12

18 C1002 195.65 1532.29 114 C1002 193.25 1551.32

19 C1003 195.625 1532.49 115 C1003 193.225 1551.52

20 C1001 195.6 1532.68 116 C1001 193.2 1551.72

21 C1004 195.575 1532.88 117 C1004 193.175 1551.92

22 C1002 195.55 1533.07 118 C1002 193.15 1552.12

23 C1003 195.525 1533.27 119 C1003 193.125 1552.32

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Sub-band Sub-band
S/N Frequency Wave- S/N Frequency Wave-
Name Name )
(THz) length (nm) (THz) length (nm)

24 C1001 195.5 1533.47 120 C1001 193.1 1552.52

25 C1004 195.475 1533.66 121 C1004 193.075 1552.73

26 C1002 195.45 1533.86 122 C1002 193.05 1552.93

27 C1003 195.425 1534.05 123 C1003 193.025 1553.13

28 C1001 195.4 1534.25 124 C1001 193 1553.33

29 C1004 195.375 1534.45 125 C1004 192.975 1553.53

30 C1002 195.35 1534.64 126 C1002 192.95 1553.73

31 C1003 195.325 1534.84 127 C1003 192.925 1553.93

32 C1001 195.3 1535.04 128 C1001 192.9 1554.13

33 C1004 195.275 1535.23 129 C1004 192.875 1554.34

34 C1002 195.25 1535.43 130 C1002 192.85 1554.54

35 C1003 195.225 1535.63 131 C1003 192.825 1554.74

36 C1001 195.2 1535.82 132 C1001 192.8 1554.94

37 C1004 195.175 1536.02 133 C1004 192.775 1555.14

38 C1002 195.15 1536.22 134 C1002 192.75 1555.34

39 C1003 195.125 1536.41 135 C1003 192.725 1555.55

40 C1001 195.1 1536.61 136 C1001 192.7 1555.75

41 C1004 195.075 1536.81 137 C1004 192.675 1555.95

42 C1002 195.05 1537 138 C1002 192.65 1556.15

43 C1003 195.025 1537.2 139 C1003 192.625 1556.35

44 C1001 195 1537.4 140 C1001 192.6 1556.55

45 C1004 194.975 1537.59 141 C1004 192.575 1556.76

46 C1002 194.95 1537.79 142 C1002 192.55 1556.96

47 C1003 194.925 1537.99 143 C1003 192.525 1557.16

48 C1001 194.9 1538.19 144 C1001 192.5 1557.36

49 C1004 194.875 1538.38 145 C1004 192.475 1557.57

50 C1002 194.85 1538.58 146 C1002 192.45 1557.77

51 C1003 194.825 1538.78 147 C1003 192.425 1557.97

52 C1001 194.8 1538.98 148 C1001 192.4 1558.17

53 C1004 194.775 1539.17 149 C1004 192.375 1558.38

54 C1002 194.75 1539.37 150 C1002 192.35 1558.58

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Sub-band Sub-band
S/N Frequency Wave- S/N Frequency Wave-
Name Name )
(THz) length (nm) (THz) length (nm)

55 C1003 194.725 1539.57 151 C1003 192.325 1558.78

56 C1001 194.7 1539.77 152 C1001 192.3 1558.98

57 C1004 194.675 1539.96 153 C1004 192.275 1559.19

58 C1002 194.65 1540.16 154 C1002 192.25 1559.39

59 C1003 194.625 1540.36 155 C1003 192.225 1559.59

60 C1001 194.6 1540.56 156 C1001 192.2 1559.79

61 C1004 194.575 1540.76 157 C1004 192.175 1560

62 C1002 194.55 1540.95 158 C1002 192.15 1560.2

63 C1003 194.525 1541.15 159 C1003 192.125 1560.4

64 C1001 194.5 1541.35 160 C1001 192.1 1560.61

65 C1004 194.475 1541.55 161 C1004 192.075 1560.81

66 C1002 194.45 1541.75 162 C1002 192.05 1561.01

67 C1003 194.425 1541.94 163 C1003 192.025 1561.22

68 C1001 194.4 1542.14 164 C1001 192 1561.42

69 C1004 194.375 1542.34 165 C1004 191.975 1561.62

70 C1002 194.35 1542.54 166 C1002 191.95 1561.83

71 C1003 194.325 1542.74 167 C1003 191.925 1562.03

72 C1001 194.3 1542.94 168 C1001 191.9 1562.23

73 C1004 194.275 1543.13 169 C1004 191.875 1562.44

74 C1002 194.25 1543.33 170 C1002 191.85 1562.64

75 C1003 194.225 1543.53 171 C1003 191.825 1562.84

76 C1001 194.2 1543.73 172 C1001 191.8 1563.05

77 C1004 194.175 1543.93 173 C1004 191.775 1563.25

78 C1002 194.15 1544.13 174 C1002 191.75 1563.45

79 C1003 194.125 1544.33 175 C1003 191.725 1563.66

80 C1001 194.1 1544.53 176 C1001 191.7 1563.86

81 C1004 194.075 1544.72 177 C1004 191.675 1564.07

82 C1002 194.05 1544.92 178 C1002 191.65 1564.27

83 C1003 194.025 1545.12 179 C1003 191.625 1564.47

84 C1001 194 1545.32 180 C1001 191.6 1564.68

85 C1004 193.975 1545.52 181 C1004 191.575 1564.88

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Sub-band Sub-band
S/N Frequency Wave- S/N Frequency Wave-
Name Name )
(THz) length (nm) (THz) length (nm)

86 C1002 193.95 1545.72 182 C1002 191.55 1565.09

87 C1003 193.925 1545.92 183 C1003 191.525 1565.29

88 C1001 193.9 1546.12 184 C1001 191.5 1565.5

89 C1004 193.875 1546.32 185 C1004 191.475 1565.7

90 C1002 193.85 1546.52 186 C1002 191.45 1565.9

91 C1003 193.825 1546.72 187 C1003 191.425 1566.11

92 C1001 193.8 1546.92 188 C1001 191.4 1566.31

93 C1004 193.775 1547.12 189 C1004 191.375 1566.52

94 C1002 193.75 1547.32 190 C1002 191.35 1566.72

95 C1003 193.725 1547.52 191 C1003 191.325 1566.93

96 C1001 193.7 1547.72 192 C1001 191.3 1567.13

• Sub-band C1001, C1002, C1003 and C1004 respectively refer to the first, second, third and fourth sub-bands in
C band with the wavelength spacing at 100 GHz. Each sub-band includes 48 wavelengths. Sub-band C501 with
wavelength spacing at 50 GHz is composed of sub-band C1001 and C1002, while sub-band C502 with wavelength
spacing at 50 GHz is composed of sub-band C1003 and C1004.

3.8 Service Access and Convergence Subsystem


Specifications
3.8.1 Board Classification List
Board classification list refer to Table 3-22

Table 3-22 Board classification list

Type Boards

2.5G DSA/DSAC/COM/COMB/DSAE/GEM2/GEMF/SAUC/OTU/SDSA/SRM42

ASMA/ASMB/CQ2/EOTU10G/OTU10G/SOTU10G/FCA/GEM2/GEM8/SRM41/SM-
10G
UB/LQ2

40G MQT3/TST3

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3.8.2 Specifications of the 2.5G Board


Technical Specifications of the 2.5G Board
Technical specifications of the 2.5G board interface at client side and wavelength division
side are listed in Table 3-23 and Table 3-24.

Table 3-23 Technical Specifications of the Client-Side 2.5G Board

Item Unit Specification

Parameters of client-side optical receive port (S point)

Receiver sensitivity (BER=10-12) dBm <-18

Receiver reflectance dB >27

Overload power dBm >0

Wavelength range of input signal nm 1280-1625

Parameters of client-side optical receive port (R point)

Mean launched power Maximum dBm 0


(near-end optical port
Minimum dBm -5
S-16.1)
Mean launched power Maximum dBm 3
(near-end optical port
Minimum dBm -2
L-16.2)
Minimum extinction ratio dB 8.2

Eye diagram - Complies with ITU-T G.957

1. Client side refers to the receive part at transmit end and the transmit part at receive end in a DWDM
system.
2. Line side refers to the receive part at receive end, the transmit part at transmit end, as well as the
transmit/receive part of regenerator in a DWDM system.

Table 3-24 Technical Specifications of the 2.5G Board at Wavelength Division Side

Item Unit Specification

Parameters of optical transmit port at wavelength division side (Sn point)

Nominal light source type - DFB-LD

Maximum -20 dB band- 0.2 (EA)


nm
width 0.4 (direct modulation)
Spectral characteristics
Minimum side mode
compression ratio dB 35
(SMCR)

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Item Unit Specification

Nominal central fre- 192.10-196.05 (C band)


THz
quency 191.30-196.075 (CE band)
Central frequency ≤±12.5 (wavelength spacing: 100
Central frequency off-
GHz GHz)
set
≤±5 (wavelength spacing: 50 GHz)

Maximum dBm 1
Mean launched power
Minimum dBm -3

10 (EA)
Minimum extinction ratio dB
8.2 (direct modulation)

12800 (EA)
Dispersion tolerance ps/nm
6400 (direct modulation)

Eye diagram - Complies with ITU-T G.957

Parameters of optical receive port at wavelength division side (Rn point)

Receiver sensitivity (BER=10-12) dBm <-25

Receiver reflection dB >27

Overload power dBm >-9

Wavelength range of input signal nm 1280-1625

Jitter Generation Specifications


When the 2.5G board uses the specified filter, the maximum jitter generation value got
during the test period of one minute does not exceed the reference value given in Table
3-25.

Table 3-25 Jitter Generation Specifications

Test Bandwidth
Optical Port High-pass Filter Low-pass Filter (MHz, Peak-peak Jitter (UIpp)
(kHz -60 dB/dec)

STM-1 optical 0.5 1.3 0.30


port 6.5 1.3 0.10

STM-4 optical 1 5 0.30


port 250 5 0.10

STM-16 optical 5 20 0.30


port 1000 20 0.10

• For transfer functions of high-pass and low-pass filters, refer to clause 35 of ITU-T G.825 Recomme
ndation.
• For STM-1, 1 UI = 6.43 ns. For STM-4, 1 UI = 1.61 ns . For STM-16, 1 UI = 0.40 ns .

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Jitter Transfer Characteristics


The jitter transfer characteristics of optical port at wavelength division side comply with
ITU-T G.783 Recommendation. Table 3-26 lists the jitter transfer characteristics of 3R
line-side optical port that carries SDH signal. Its jitter transfer function curve is below the
curve shown in Figure 3-1.

Table 3-26 Jitter Transfer Characteristics of 3R Line-Side Optical Port That Carries
SDH Signal

Optical Port fL (kHz) fC (kHz) fH (kHz) P (dB)

STM-1 1.3 130 1300 0.1

STM-4 5 500 5000 0.1

STM-16 20 2000 20000 0.1

Figure 3-1 Jitter Transfer Characteristics of Line-side Optical Port

3.8.3 Specifications of the 10G Board


Technical Specifications of the 10G Board
Technical specifications of the 10 Gboard interface at client side and wavelength division
side are listed in Table 3-27 and Table 3-28.

Table 3-27 Technical Specifications of the Client-Side 10G Board (with FEC)

Item Unit Specification

Parameters of client-side optical receive port (S point)

<-14 (I-64.1)

<-16 (S-64.2b)
Receiver sensitivity dBm <-14 (10GBASE-LR/LW) (only supported by
SOTU10G board)

<-16 (10GBASE-ER/EW)

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Item Unit Specification

<-14 (I-64.1)

>27 (S-64.2b)

Receiver reflectance dB <-14 (10GBASE-LR/LW) (only supported by


SOTU10G board)

>27(10GBASE-ER/EW)

>0 (PIN)
Overload power dBm
>-9 (APD)

Wavelength range of input signal nm 1280-1625

Parameters of client-side optical receive port (R point)

Maxi-
Mean launched power dBm -1
mum
(far-end optical port S-64.2a)
Minimum dBm -5

Maxi-
Mean launched power dBm 2
mum
(far-end optical port S-64.2b)
Minimum dBm -1

Maxi-
Mean launched power (near- dBm -1
mum
end optical port I-64.2r)
Minimum dBm -5
Maxi-
Mean launched power (near- dBm -1
mum
end optical port I-64.1) Minimum dBm -6

Minimum extinction ratio dB 10/8.2

Eye diagram - Complies with ITU-T G.691

1. Client side refers to the receive part at transmit end and the transmit part at receive end in a DWDM
system.
2. Line side refers to the receive part at receive end, the transmit part at transmit end, as well as the
transmit/receive part of regenerator in a DWDM system.

Table 3-28 Technical Specifications of the 10G Board at Wavelength Division Side
(with FEC)

Item Unit Specification

Parameters of optical transmit port at wavelength division side (Sn point)

Nominal light source type - MQW-DFB

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Item Unit Specification

Maximum -20 dB
nm 0.3
bandwidth
Spectral char-
Minimum side mode
acteristics
compression ratio dB 35
(SMCR)

Nominal central fre- 192.10-196.05 (C band)


THz
Central fre- quency 191.30-196.075 (CE band)
quency Central frequency off- ≤±12.5 (wavelength spacing: 100 GHz)
GHz
set ≤±5 (wavelength spacing: 50 GHz)

Mean Maximum dBm 1


launched
Minimum dBm -3
power

Minimum extinction ratio dB 10

Dispersion tolerance ps/nm 800

Eye diagram - Complies with ITU-T G.691

Parameters of optical receive port at wavelength division side (Rn point)

<-14 (STM-64)
PIN
<-12.6 (10GE)
Receiver sensitivity dBm
<-21 (STM-64)
APD
<-19.6 (10GE)

Receiver reflectance dB >27

>0 (PIN)
Overload power dBm
>-9 (APD)

Wavelength range of input signal nm 1280-1625

Jitter Generation Specifications


When the 10G board uses the specified filter, the maximum jitter generation value got
during the test period of one minute does not exceed the reference value given in Table
3-29.
Table 3-29 Jitter Generation Specifications

Test Bandwidth
Optical Port High-pass Filter Peak-peak Jitter (UIpp)
Low-pass Filter (MHz)
(kHz

STM-64 optical 20 80 0.30


port 4000 80 0.10

• For STM-64, 1 UI = 0.10 ns.

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3.8.4 Specifications of the 40G Board


Technical specifications of the 40G board interface at client side and wavelength division
side are listed in Table 3-30 and Table 3-31.

Table 3-30 Technical Specifications of the Client-Side 40G Board

Item Unit Specification

Bit rate (optical modulation mode) Gbps 39.813 (NRZ), 43.018

Optical interface category - VSR2000-3R2

Goal distance km 2

Parameters of client-side optical receive port (S point)

Frequency range nm 1280-1625

Sensitivity (BER=1×10-12) dBm <-6

Overload power (BER=1×10-12) dBm >+3

Receiver reflectance dB -27

Dispersion tolerance ps/nm 40

Parameters of client-side optical receive port (R point)

Frequency range - 1280-1625

Maximum 1
Mean launched power dBm
Minimum –3

Minimum side mode compression ratio


dB 35
(SMCR)

Minimum extinction ratio dB 8.2

Jitter transfer characteristics - Complies with GR-253, Issue 4

Eye diagram - Complies with G.959.1 NRZ 40G

1. Client side refers to the receive part at transmit end and the transmit part at receive end in a DWDM
system.
2. Line side refers to the receive part at receive end, the transmit part at transmit end, as well as the
transmit/receive part of regenerator in a DWDM system.

Table 3-31 Technical Specifications of the 40G Board at Line-Side

Item Unit Specification

Optical signal modulation mode - P-DPSK ,RZ-DQPSK

Bit rate Gbps 43.018, 44.571

Parameters of optical transmit port at wavelength division side (Rn point)

192.10-196.05 (C band)
Frequency range THz
191.30-196.075 (CE band)

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Item Unit Specification

Back to back OSNR(BER=1×10–3): dBm

Minimum overload power (BER=1×10-12) dBm 0

Receiver reflectance dB -27

Dispersion tolerance (including TDC) ps/nm -700-+700

Jitter transfer characteristics - Complies with G.8251

FEC gain dB >8 (AFEC)

Parameters of optical receive port at wavelength division side (Sn point)

192.10-196.05 (C band)
Nominal central frequency THz
191.30-196.075 (CE band)

Channel spacing GHz 50

Maximum central frequency offset GHz ±1.5

Maximum 1
Mean launched power dBm
Minimum -5

Launched power offset dB ±1

Maximum -20 dB
GHz 90
Spectral characteris- bandwidth
tics Minimum -3 dB
GHz 45
bandwidth

Minimum side mode compression ratio


dB 35
(SMCR)

Wavelength tuning time S <30

l Client side refers to the receive part at transmit end and the transmit part at receive
end in a DWDM system.
l Line side refers to the receive part at receive end, the transmit part at transmit end,
as well as the transmit/receive part of regenerator in a DWDM system.

3.9 Optical Mux/DeMux Subsystem Specifications


3.9.1 Fixed Add/Drop Multiplexer Unit Specifications
3.9.1.1 Specifications of the SOAD Board
Technical specifications of the SOAD1 board, the SOAD2 board and the SOAD4 board
are illustrated in Table 3-32, Table 3-33 and Table 3-34.

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Table 3-32 Technical Specifications of the SOAD1 Board

Item Unit Specification

192.10-196.05 (C band)
Central frequency range THz
191.30-196.075 (CE band)

Add/Drop channel - 1

-1 dB bandwidth (Drop) nm >0.2

-20 dB bandwidth (Drop) nm <1.20

Channel spacing GHz 100

IN-D1@ other channels dB >25

IN-MID1@ drop chan-


Isolation dB >14
nel

IN-OUT@ drop channel dB >28

Optical return loss dB >40

Drop wavelength (IN-


dB <3
D1)

Add wavelength (A1-


Insertion loss dB <3
OUT)

Pass-through wave-
dB <3
length (IN-OUT)

Polarization dependent loss (PDL) dB <0.2

Polarization mode dispersion (PMD) ps <0.1

Maximum allowed optical power mW <500

Table 3-33 Technical Specifications of the SOAD2 Board

Item Unit Specification

192.10-196.05 (C band)
Central frequency range THz
191.30-196.075 (CE band)

Add/Drop channel - 2

-1 dB bandwidth (Drop) nm >0.2

-20 dB bandwidth (Drop) nm <1.20

Channel spacing GHz 100

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Item Unit Specification

IN-D1/D2@ adjacent chan-


dB >25
nels

IN-D1/D2@ nonadjacent
Isolation dB >35
channel

IN-MID1@ drop channel dB >14

IN-OUT@ drop channel dB >28

Optical return loss dB >40

Drop wavelength (IN-D1/D2) dB <3

Add wavelength (A1/A2-OUT) dB <3


Insertion loss
Pass-through wavelength (IN-
dB <4
OUT)

Polarization dependent loss (PDL) dB <0.2

Polarization mode dispersion (PMD) ps <0.1

Maximum allowed optical power mW <500

Table 3-34 Technical Specifications of the SOAD4 Board

Item Unit Specification

192.10-196.05 (C band)
Central frequency range THz
191.30-196.075 (CE band)

Add/Drop channel - 4

-1 dB bandwidth (Drop) nm >0.2

-20 dB bandwidth (Drop) nm <1.20

Channel spacing GHz 100

IN-D1/D2/D3/D4@adjacent chan-
dB >25
nels

IN-D1/D2/D3/D4@nonadjacent
Isolation dB >35
channel

IN-MID1@drop channel dB >14

IN-OUT@drop channel dB >28

Optical return loss dB >40

Drop wavelength (IN-D1/D2/D3/D4) dB <4.0

Insertion Add wavelength (A1/A2/A3/A4-


dB <4.0
loss OUT)

Pass-through wavelength (IN-OUT) dB <5.0

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Item Unit Specification

Directional dB >60

Polarization dependent loss (PDL) dB <0.2

Polarization mode dispersion (PMD) ps <0.1

Maximum allowed optical power mW <500

3.9.2 Reconfigurable Add/Drop Multiplexer Unit Specifications


3.9.2.1 Specifications of the WBU Board
Technical specifications of the WBU board are illustrated in Table 3-35.

Table 3-35 Technical Specifications of the WBU Board

Item Unit Specification

1529-1561 (C band)
Operating wavelength range nm
1529-1568 (CE band)

100
Channel spacing GHz
50

40/48 (channel spacing: 100 GHz)


Channel quantity -
80/96 (channel spacing: 50 GHz)

A1-OUT <2

Insertion loss of IN-D1 <4


dB
WBU/AD1 EXIN-OUT <14

IN-EXOUT <4

A1-OUT <12

A2-OUT <2

Insertion loss of IN-D1 <12


dB
WBU/AD2 IN-D2 <2

EXIN-OUT <18

IN-EXOUT 12

Attenuation adjustment range dB 0-15

< (0.5 or ±10% of the configured value,


Attenuation adjustment precision dB
select the larger one)

Blocking extinction ratio dB >35

Optical return loss dB >40

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Item Unit Specification

Maximum total optical input power dBm ≤25

Maximum single-channel optical input


dBm ≤16
power

3.9.2.2 Specifications of the WSU Board


Technical specifications of the WSUD are illustrated in Table 3-36.

Table 3-36 Technical Specifications of the WSUD Board

Item Unit Specification

Operating wavelength range nm 1529-1561 (C band)

100
Channel spacing GHz
50

40 (channel spacing: 100 GHz)


Channel quantity -
80 (channel spacing: 50 GHz)

A1-OUT dB <2

IN-D1~D8 dB <6
WSUD /MA1
EXIN-OUT dB <9

IN-EXOUT dB <6
Inser-
tion A1-OUT dB <10

loss
A2-OUT dB <2

WSUD /MA2 IN-D1~D8 dB <6

EXIN-OUT dB <16

IN-EXOUT dB <6

WSUD/E dB 6

Attenuation adjustment range dB 0-15

< (0.5 or ±10% of the configured value,


Attenuation adjustment precision dB
select the larger one)

Blocking extinction ratio dB >35

Optical return loss dB >40

Maximum total optical input power dBm ≤25

Maximum single-channel optical input power dBm ≤16

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Technical specifications of WSUA are illustrated in Table 3-37.

Table 3-37 Technical Specifications of WSUA

Item Unit Specification

Operating wavelength range nm 1529-1561 (C band)

100
Channel spacing GHz
50

40 (channel spacing: 100 GHz)


Channel quantity -
80 (channel spacing: 50 GHz)

IN-D1 dB <2

A1~A8-OUT dB <6
WSUA /MD1
EXIN-OUT dB <6

IN-EXOUT dB <9
Inser-
IN-D1 dB <2
tion
loss IN-D2 dB <10

WSUA /MD2 A1~A8-OUT dB <6

EXIN-OUT dB <6

IN-EXOUT dB <16

WSUA/E dB 6

Attenuation adjustment range dB 0-15

< (0.5 or ±10% of the configured value,


Attenuation adjustment precision dB
select the larger one)

Blocking extinction ratio dB >35

Optical return loss dB >40

Maximum total optical input power dBm ≤25

Maximum single-channel optical input power dBm ≤16

3.9.2.3 Specifications of the WBM Board


Technical specifications of the WBM board are illustrated in Table 3-38.

Table 3-38 Technical Specifications of the WBM Board

Item Unit Specification

Operating wavelength range nm 1529-1561 (C band)

Channel spacing GHz 100

Channel quantity - 40 (channel spacing: 100 GHz)

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Item Unit Specification

An-OUT (n=1-40) dB <8

Insertion loss IN-DROP dB <7

EXIN-OUT <13
dB
IN-EXOUT <3

Attenuation adjustment range dB 0-15

< (0.5 or ±10% of the configured value,


Attenuation adjustment precision dB
select the larger one)

Optical return loss dB >40

3.9.2.4 Specifications of the PDU Board


Technical specifications of the PDU-4-x are listed in Table 3-39. Technical specifications
of the PDU-5-x are listed in Table 3-40. Technical specifications of the PDU-8-x are listed
in Table 3-41. Technical specifications of the PDU-9-x are listed in Table 3-42. Technical
specifications of the PDU-16-1 are listed in Table 3-43.

Table 3-39 Technical Specifications of the PDU-4-x Board

Item Unit Specification

1529-1561 (C band)
Operating wavelength range nm 1529-1568 (CE band)
1570-1605 (L band)

Insertion
INx→Ox-1/2/3/4 dB <8.0
loss

Polarization dependent loss (PDL) dB <0.4

Optical return loss dB >40

Table 3-40 Technical Specifications of PDU-5-x Board

Item Unit Specification

1529-1561 (C band)
Operating wavelength range nm 1529-1568 (CE band)
1570-1605 (L band)

Insertion INx→Ox-1/2/3/4 dB <12.0


loss INx→Dx dB <4.0

Polarization dependent loss (PDL) dB <0.5

Optical return loss dB >40

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Table 3-41 Technical Specifications of the PDU-8-x Board

Item Unit Specification

1529-1561 (C band)
Operating wavelength range nm 1529-1568 (CE band)
1570-1605 (L band)

Insertion
INx→Ox-1/2/3/4/5/6/7/8 dB <11.0
loss

Polarization dependent loss (PDL) dB <0.5

Optical return loss dB >40

Table 3-42 Technical Specifications of the PDU-9-x Board

Item Unit Specification

1529-1561 (C band)
Operating wavelength range nm 1529-1568 (CE band)
1570-1605 (L band)

Insertion INx→Ox-1/2/3/4/5/6/7/8 dB <15.0


loss INx→Dx dB <4.0

Polarization dependent loss (PDL) dB <0.5

Optical return loss dB >40

Table 3-43 Technical Specifications of the PDU-16-x Board

Item Unit Specification

1529-1561 (C band)
Operating wavelength range nm 1529-1568 (CE band)
1570-1605 (L band)

Insertion IN→O-1/2/3/4/5/6/7
dB <14.0
loss /8/9/10/11/12 /13/14/15/16

Polarization dependent loss (PDL) dB <0.5

Optical return loss dB >40

3.9.3 Multiplex/Demultiplex Unit Specifications


3.9.3.1 Specifications of the OMU Board
Technical specifications of the OMU board are listed in Table 3-44.

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Table 3-44 Technical Specifications of the OMU Board

Sp-
Spec- Spec-
eci-
ifica- ifica-
fica-
tions Specifications Specifications tions Specifications
tions
(8 - (32-Channel) (40-Channel) (48- (80-Channel)
Item Unit (16 -
Cha- Chan-
Cha-
nnel) nel)
nnel)

Cou- Cou- Cou- Cou- Cou-


AWG TFF AWG TFF AWG AWG
pler pler pler pler pler

Inser-
tion dB <11 <14 <17 <10 <10 <19 <10 <10 <10 <23 <10
loss

Maxi-
mum in-
sertion
loss dif-
ference dB <3 <3 <3 <3 <3 <3 <3 <3 <3 <3.5 <3
be-
tween
chan-
nels

Chan-
nel GHz - - - 100 100 - 100 100 100 - 50
spacing

Optical
return dB >40 >40 >40 >40 >40 >40 >40 >40 >40 >40 >40
loss

Oper- 1529 - 1529 1529 - 1529 - 1529 -


ating 1529 152 1561 -1561 1561 1561 1561
1529 - 1529 - 1529 - 1529 -
wave- nm - 156 9 -
1561 1570 - 1570 - 1561 1570 - 1570 - 1568 1561 1570 -
length 1 1561
1605 1605 1605 1605 1605
range

Polar-
ization
depen-
dB <0.5 <0.5 <0.5 <0.5 <0.5 <0.6 <0.5 <0.5 <0.5 <0.7 <0.5
dent
loss
(PDL)

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Sp-
Spec- Spec-
eci-
ifica- ifica-
fica-
tions Specifications Specifications tions Specifications
tions
(8 - (32-Channel) (40-Channel) (48- (80-Channel)
Item Unit (16 -
Cha- Chan-
Cha-
nnel) nel)
nnel)

Cou- Cou- Cou- Cou- Cou-


AWG TFF AWG TFF AWG AWG
pler pler pler pler pler

Polar-
ization
mode
ps <0.5 <0.5 <0.5 <0.5 <0.5 <0.5 <0.5 <0.5 <0.5 <0.5 <0.5
disper-
sion
(PMD)

Tem-
per-
nm < <
ature - - - - - - - - -
/℃ 0.005 0.005
charac-
teristics

3.9.3.2 Specifications of the ODU Board


Technical specifications of the ODU board are listed in Table 3-45.

Table 3-45 Technical Specifications of the ODU Board

Specifi- Specifi-
Specifications Specifications cations cations
Item Unit (32-Channel) (40-Channel) (48-Chan- (80-Chan-
nel) nel)

AWG TFF AWG TFF AWG AWG

Insertion loss dB <10 <10 <10 <10 <10 <10

Maximum inser-
tion loss difference dB <2 <2 <2 <2 <2 <2
between channels

Channel spacing GHz 100 100 100 100 100 50

Optical return loss dB >40 >40 >40 >40 >40 >40

Operating wave- 1529 - 1561 1529 - 1561 1529 - 1561 1529 - 1561 1529 - 1561
nm 1529 - 1568
length range
1570 - 1605 1570 - 1605 1570 - 1605 1570 - 1605 1570 - 1605

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Specifi- Specifi-
Specifications Specifications cations cations
Item Unit (32-Channel) (40-Channel) (48-Chan- (80-Chan-
nel) nel)

AWG TFF AWG TFF AWG AWG

Isolation of adja-
dB >25 >25 >25 >25 >25 >25
cent channel

Isolation of non-
dB >30 >30 >30 >30 >30 >30
adjacent channel

Polarization de-
pendent loss dB <0.5 <0.5 <0.5 <0.5 <0.5 <0.5
(PDL)

Polarization mode
ps <0.5 <0.5 <0.5 <0.5 <0.5 <0.5
dispersion (PMD)

Temperature char-
nm/℃ - <0.005 - <0.005 - -
acteristics

-1 dB bandwidth nm >0.2 >0.2 >0.2 >0.2 >0.2 >0.2

3.9.3.3 Specifications of the ODUB Board


Technical specifications of the ODUB board are listed in Table 3-46.

Table 3-46 Technical Specifications of the ODUB Board

Item Unit Specifications (40-Channel)

Insertion loss dB <10

Maximum insertion loss difference between channels dB <2

Channel spacing GHz 100

Optical return loss dB >40

1529 - 1561
Operating wavelength range nm
1570 - 1605

Isolation of adjacent channel dB >25

Isolation of non-adjacent channel dB >30

Polarization dependent loss (PDL) dB <0.5

Polarization mode dispersion (PMD) ps <0.5

Temperature characteristics nm/℃ -

-1 dB bandwidth nm >0.2

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3.9.3.4 Specifications of the OCI Board


Technical specifications of the OCI board are illustrated in Table 3-47 and Table 3-48.

Table 3-47 Technical Specifications of the OCI Board (100GHz-50GHz)

Item Unit Specification Remarks

Operating wavelength
nm 1529-1561 -
range (C band)

Operating wavelength
nm 1529-1568 -
range (CE band)

Operating wavelength
nm 1570-1605 -
range (L band)

Input channel spacing GHz 100 Multiplexing procedure

Output channel spacing GHz 50 Multiplexing procedure

<2.5 input signal 10 Gbit/s


Insertion loss dB
<3 input signal 40 Gbit/s

Maximum insertion loss


dB <1 -
offset

Demultiplexing proce-
Isolation dB >25
dure

Optical return loss dB >40 -

Polarization dependent
dB <0.5 -
loss (PDL)

Polarization mode disper-


ps <0.5 -
sion (PMD)

Table 3-48 Technical Specifications of the OCI Board (50GHz-25GHz)

Item Unit Specification Remarks

Operating wavelength
nm 1529-1568 -
range (CE band)

Input channel spacing GHz 50 Multiplexing procedure

Output channel spacing GHz 25 Multiplexing procedure

Insertion loss dB <3.2 -

Maximum insertion loss


dB <0.6 -
difference

Demultiplexing proce-
>21
Isolation dB dure

>16 Multiplexing procedure

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Item Unit Specification Remarks

Optical return loss dB >40 -

Polarization dependent
dB <0.5 -
loss (PDL)

Polarization mode disper-


ps <0.2 -
sion (PMD)

3.9.3.5 Specifications of the OBM Board


Technical specifications of the OBM board are illustrated in Table 3-49.

Table 3-49 Technical Specifications of the OBM Board

Item Unit Specification

Operating wavelength range (C


nm 1529-1561
band)

Operating wavelength range (CE


nm 1529-1568
band)

Operating wavelength range (L


nm 1570-1605
band)

Insertion loss (C band) dB <1.5

Insertion loss (CE band) dB <1.5

Insertion loss (L band) dB <1.5

Isolation dB 15

Optical return loss dB >40

Polarization dependent loss (PDL) dB <0.5

Polarization mode dispersion


ps <0.5
(PMD)

3.9.3.6 Specifications of the VMUX Board


Technical specifications of the VMUX board are illustrated in Table 3-50.

Table 3-50 Technical Specifications of the VMUX Board

Item Unit Specification

Channel quantity - 40/48

Channel spacing GHz 100

40-channel: 1529-1561/1570-1605
Operating wavelength range nm
48-channel: 1529-1568

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Item Unit Specification

-1 dB bandwidth nm >0.2

Insertion loss dB <8 (before adjustment)

Polarization mode dispersion


ps 0.5
(PMD)

Polarization dependent loss (PDL) dB 0.8

Optical return loss dB >40

Channel adjustment range dB 0-10

VOA adjustment precision dB 0.5

3.9.3.7 Specifications of the VMUXB Board


Technical specifications of the VMUXB board are illustrated in Table 3-51.

Table 3-51 Technical Specifications of the VMUXB Board

Item Unit Specification

Channel quantity - 40

Channel spacing GHz 100

Operating wavelength range nm 40-channel: 1529-1561/1570-1605

-1 dB bandwidth nm >0.2

Insertion loss dB <8 (before adjustment)

Polarization mode dispersion


ps 0.5
(PMD)

Polarization dependent loss (PDL) dB 0.8

Optical return loss dB >40

Channel adjustment range dB 0-10

VOA adjustment precision dB 0.5

3.9.3.8 Specifications of the SSDM Board


Technical specifications of the SSDMT board are illustrated in Table 3-52. And technical
specifications of the SSDMR board are illustrated in Table 3-53.

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Table 3-52 Technical Specifications of the SSDMT Board

Item Unit Specification

C band 1529-1561
Operating nm
CE band 1529-1568
wavelength range
nm C/CE band supervision channel 1500-1520

dB IN→OUT <1.5
Insertion loss
dB SIN→OUT <1.5

dB IN→OUT (@λSIN) >12


Isolation
dB SIN→OUT (@λIN) >20

Optical return loss dB >40

Polarization
dependent loss dB <0.2
(PDL)

Input optical power mW <500

Table 3-53 Technical Specifications of the SSDMR Board

Item Unit Specification

C band 1529-1561
Operating nm
CE band 1529-1568
wavelength range
nm C/CE band supervision channel 1500-1520

dB IN→OUT <1.5
Insertion loss
dB IN→SOUT <1.5

dB IN→OUT (@λSOUT) >12


Isolation
dB IN→SOUT (@λOUT) >40

Optical return loss dB >40

Polarization
dependent loss dB <0.2
(PDL)

Input optical power mW <500

3.9.4 Group Mux/DeMux Unit Specifications


3.9.4.1 Specifications of the SOGMD Board
Technical specifications of the SOGMD board are illustrated in Table 3-54.

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Table 3-54 Technical Specifications of the SOGMD Board

Item Unit Specification

Operating wavelength range nm 1529-1561 (C band)

IN→RRO dB <2.5

IN→RBO dB <2.5

IN→BRO dB <2.5

IN→BBO dB <2.5
Insertion loss
RRI→OUT dB <2.5

RBI→OUT dB <2.5

BRI→OUT dB <2.5

BBI→OUT dB <2.5

Isolation dB >12

Reflectance dB <-40

Polarization dependent loss (PDL) dB <0.4

Polarization mode dispersion (PMD) ps <0.15

Maximum optical power mW <500

3.10 Optical Amplification Subsystem Specifications


3.10.1 Specifications of the EOA Board
Short Description
To achieve smooth expansion of DWDM systems from 2.5 Gbit/s and 10 Gbit/s to 40 Gbit/s,
the EOA board in the ZXWM M920 are compatible with 2.5 Gbit/s, 10 Gbit/s and 40 Gbit/s
systems.

Enhanced Optical Booster Amplifier (EOBA)


l 40-channel EOBA board at C/L band
The specifications of 40-channel EOBA board at C/L band are listed in Table 3-55. The
specifications of 32-channel EOBA are same as those of 40-channel EOBA except the
single-channel optical power, which is 1 dB more than that of 40-channel EOBA.

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Table 3-55 Technical Specifications of 40-channel EOBA Board (C/L-band)

Specification (40-Channel System)


Item Unit
EOBA17/17 EOBA27/26 EOBA22/20 EOBA20/20 EOBA24/24

1529 to 1561 1529 to 1561 1529 to 1561 1529 to 1561 1529 to 1561
Operating wave- (C band) (C band) (C band) (C band) (C band)
nm
length range 1570 to 1605 1570 to 1605 1570 to 1605 1570 to 1605 1570 to 1605
(L band) (L band) (L band) (L band) (L band)

Total input power


dBm -32 to 3 -32 to 2 -32 to 1 -32 to 3 -32 to 3
range

Channel input power


dBm -32 to -13 -32 to -14 -32 to -15 -32 to -13 -32 to -13
range

Channel output
dBm -2 to 4 7 to 13 1 to 7 1 to 7 5 to 11
power range

Total output power


dBm -2 to 17 7 to 26 1 to 20 1 to 20 5 to 24
range

Maximum total out-


dBm 17 26 20 20 24
put power

Noise figure dB <6 <6 <6 <6 <6

Polarization depen-
dB <0.5 <0.5 <0.5 <0.5 <0.5
dent loss

Pump leakage at in-


dBm <-30 <-30 <-30 <-30 <-30
put

Pump leakage at
dBm <-30 <-30 <-30 <-30 <-30
output

Input return loss dB >40 >40 >40 >40 >40

Output return loss dB >40 >40 >40 >40 >40

Channel gain dB 17 27 22 20 24

Allowed maximum
dB <-30 <-30 <-30 <-30 <-30
input reflectance

Allowed maximum
dB <-30 <-30 <-30 <-30 <-30
output reflectance

Gain flatness dB ±1 ±1 ±1 ±1 ±1

Gain response time


while adding/reduc-
ms <10 <10 <10 <10 <10
ing channels (stable
status)

Polarization mode
ps <0.5 <0.5 <0.5 <0.5 <0.5
dispersion

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l 80-channel EOBA board at C/L band


The specifications of 80-channel EOBA board at C band are listed in Table 3-56.

Table 3-56 Technical Specifications of 80-channel EOBA Board (C-band)

Specification (80-Channel System)


Item Unit
EOBA17/17 EOBA27/26 EOBA22/20 EOBA20/20 EOBA24/24

1529 to 1561 1529 to 1561 1529 to 1561 1529 to 1561 1529 to 1561
Operating wave- (C band) (C band) (C band) (C band) (C band)
nm
length range 1570 to 1605 1570 to 1605 1570 to 1605 1570 to 1605 1570 to 1605
(L band) (L band) (L band) (L band) (L band)

Total input power


dBm -32 to 3 -32 to 2 -32 to 1 -32 to 3 -32 to 3
range

Channel input power


dBm -32 to -16 -32 to -17 -32 to -18 -32 to -16 -32 to -16
range

Channel output
dBm -5 to 1 4 to 10 -2 to 4 -2 to 4 2 to 8
power range

Total output power


dBm -5 to 17 4 to 26 -2 to 20 -2 to 20 2 to 24
range

Maximum total out-


dBm 17 26 20 20 24
put power

Noise figure dB <6 <6 <6 <6 <6

Polarization depen-
dB <0.5 <0.5 <0.5 <0.5 <0.5
dent loss

Pump leakage at in-


dBm <-30 <-30 <-30 <-30 <-30
put

Pump leakage at
dBm <-30 <-30 <-30 <-30 <-30
output

Input return loss dB >40 >40 >40 >40 >40

Output return loss dB >40 >40 >40 >40 >40

Channel gain dB 17 27 22 20 24

Allowed maximum
dB <-30 <-30 <-30 <-30 <-30
input reflectance

Allowed maximum
dB <-30 <-30 <-30 <-30 <-30
output reflectance

Gain flatness dB ±1 ±1 ±1 ±1 ±1

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Specification (80-Channel System)


Item Unit
EOBA17/17 EOBA27/26 EOBA22/20 EOBA20/20 EOBA24/24

Gain response time


while adding/reduc-
ms <10 <10 <10 <10 <10
ing channels (stable
status)

Polarization mode
ps <0.5 <0.5 <0.5 <0.5 <0.5
dispersion

l 48-channel EOBA board at CE band


The specifications of 48-channel EOBA board at CE band are listed in Table 3-57.

Table 3-57 Technical Specifications of 48-channel EOBA Board (CE-band)

Specification (48-Channel System)


Item Unit
EOBA17/17 EOBA23/21 EOBA26/24 EOBA28/26

Operating wavelength 1529 to 1568 1529 to 1568 1529 to 1568 (CE 1529 to 1568 (CE
nm
range (CE band) (CE band) band) band)

Total input power range dBm -32 to 3 -32 to 1 -32 to 1 -32 to 1

Channel input power


dBm -32 to -13 -32 to -16 -32 to -16 -32 to -16
range

Channel output power


dBm -2 to 4 1 to 7 4 to 10 6 to 12
range

Total output power range dBm -2 to 17 1 to 21 4 to 24 6 to 26

Maximum total output


dBm 17 21 24 26
power

Noise figure dB <6 <6 <6 <6

Polarization dependent
dB <0.5 <0.5 <0.5 <0.5
loss

Pump leakage at input dBm <-30 <-30 <-30 <-30

Pump leakage at output dBm <-30 <-30 <-30 <-30

Input return loss dB >40 >40 >40 >40

Output return loss dB >40 >40 >40 >40

Channel gain dB 17 23 26 28

Allowed maximum input


dB <-30 <-30 <-30 <-30
reflectance

Allowed maximum output


dB <-30 <-30 <-30 <-30
reflectance

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Specification (48-Channel System)


Item Unit
EOBA17/17 EOBA23/21 EOBA26/24 EOBA28/26

Gain flatness dB ±1 ±1 ±1 ±1

Gain response time while


adding/reducing chan- ms <10 <10 <10 <10
nels (stable status)

Polarization mode dis-


ps <0.5 <0.5 <0.5 <0.5
persion

l 96-channel EOBA board at CE band


The specifications of 96-channel EOBA board at CE band are listed in Table 3-58.

Table 3-58 Technical Specifications of 96-channel EOBA Board (CE-band)

Specification (96-Channel System)


Item Unit
EOBA17/17 EOBA23/21 EOBA26/24 EOBA28/26

Operating wavelength 1529 to 1568 (CE 1529 to 1568 (CE 1529 to 1568 (CE 1529 to 1568 (CE
nm
range band) band) band) band)

Total input power range dBm -32 to 3 -32 to 1 -32 to 1 -32 to 1

Channel input power


dBm -32 to -16 -32 to -19 -32 to -19 -32 to -19
range

Channel output power


dBm -5 to 1 -2 to 1 1 to 7 3 to 9
range

Total output power


dBm -5 to 17 -2 to 21 1 to 24 3 to 26
range

Maximum total output


dBm 17 21 24 26
power

Noise figure dB <6 <6 <6 <6

Polarization dependent
dB <0.5 <0.5 <0.5 <0.5
loss

Pump leakage at input dBm <-30 <-30 <-30 <-30

Pump leakage at output dBm <-30 <-30 <-30 <-30

Input return loss dB >40 >40 >40 >40

Output return loss dB >40 >40 >40 >40

Channel gain dB 17 23 26 28

Allowed maximum input


dB <-30 <-30 <-30 <-30
reflectance

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Specification (96-Channel System)


Item Unit
EOBA17/17 EOBA23/21 EOBA26/24 EOBA28/26

Allowed maximum out-


dB <-30 <-30 <-30 <-30
put reflectance

Gain flatness dB ±1 ±1 ±1 ±1

Gain response time


while adding/reducing ms <10 <10 <10 <10
channels (stable status)

Polarization mode dis-


ps <0.5 <0.5 <0.5 <0.5
persion

Enhanced Optical Line Amplifier (EOLA)


The specifications of 40/80-channel EOLA board at C/L band are listed in Table 3-59. The
specifications of 32-channel EOLA are the same as those of 40-channel EOLA except
the single-channel optical power, which is 1 dB more than that of 40-channel EOLA. In
48/96-channel system, EOLA board is replaced by EONA board.

Table 3-59 Technical Specifications of 40/80-channel EOLA (C/L-band)

Specification (40-Channel System) Specification (80-Channel System)


Item Unit EOLA22 EOLA27 EOLA32 EOLA22 EOLA27 EOLA32
/20 /20 /20 /20 /20 /20

1529 to 1529 to 1529 to 1529 to 1529 to 1529 to


1561 (C 1561 (C 1561 (C 1561 (C 1561 (C 1561 (C
Operating band) band) band) band) band) band)
nm
wavelength range 1570 to 1570 to 1570 to 1570 to 1570 to 1570 to
1605 (L 1605 (L 1605 (L 1605 (L 1605 (L 1605 (L
band) band) band) band) band) band)

Total input power


dBm -35 to 1 -35 to -4 -35 to -9 -35 to 1 -35 to -4 -35 to -9
range

Channel input power


dBm -35 to -15 -35 to -20 -35 to -25 -35 to -18 -35 to -4 -35 to -28
range

Channel output
dBm 1 to 7 1 to 7 1 to 7 -2 to 4 -2 to 4 -2 to 4
power range

Total output power


dBm 1 to 20 1 to 20 1 to 20 -2 to 20 -2 to 20 -2 to 20
range

Maximum total
dBm 20 20 20 20 20 20
output power

Noise figure dB <6 <6 <6 <6 <6 <6

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Item Unit EOLA22 EOLA27 EOLA32 EOLA22 EOLA27 EOLA32
/20 /20 /20 /20 /20 /20

Polarization
dB <0.5 <0.5 <0.5 <0.5 <0.5 <0.5
dependent loss

Pump leakage at
dBm <-30 <-30 <-30 <-30 <-30 <-30
input

Pump leakage at
dBm <-30 <-30 <-30 <-30 <-30 <-30
output

Input return loss dB >40 >40 >40 >40 >40 >40

Output return loss dB >40 >40 >40 >40 >40 >40

Channel gain dB 22 27 32 22 27 32

Allowed maximum
dB <-30 <-30 <-30 <-30 <-30 <-30
input reflectance

Allowed maximum
dB <-30 <-30 <-30 <-30 <-30 <-30
output reflectance

Gain flatness dB ±1 ±1 ±1 ±1 ±1 ±1

Gain response
time while
adding/reducing ms <10 <10 <10 <10 <10 <10
channels (stable
status)

Polarization mode
ps <0.5 <0.5 <0.5 <0.5 <0.5 <0.5
dispersion

Enhanced Optical Pre-Amplifier (EOPA)


l 40-channel EOPA board at C/L band
The specifications of 40-channel EOPA board at C/L band are listed in Table 3-60.
The specifications of 32-channel EOPA are the same as those of 40-channel EOPA
except the single-channel optical power, which is 1 dB more than that of 40-channel
EOPA.

Table 3-60 Technical Specifications of 40-channel EOPA (C/L-band)

Specification (40-Channel System)


Item Unit
EOPA17/17 EOPA22/17 EOPA27/17

1529 to 1561 (C 1529 to 1561 (C 1529 to 1561 (C


Operating wavelength band) band) band)
nm
range 1570 to 1605 (L 1570 to 1605 (L 1570 to 1605 (L
band) band) band)

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Item Unit
EOPA17/17 EOPA22/17 EOPA27/17

Total input power range dBm -35 to 3 -35 to -2 -35 to -7

Channel input power range dBm -35 to -13 -35 to -18 -35 to -23

Channel output power


dBm -2 to 4 -2 to 4 -2 to 4
range

Total output power range dBm -2 to 17 -2 to 17 -2 to 17

Maximum total output


dBm 17 17 17
power

Noise figure dB <5.5 <5.5 <5.5

Polarization dependent
dB <0.5 <0.5 <0.5
loss

Pump leakage at input dBm <-30 <-30 <-30

Pump leakage at output dBm <-30 <-30 <-30

Input return loss dB >40 >40 >40

Output return loss dB >40 >40 >40

Channel gain dB 17 22 27

Allowed maximum input


dB <-30 <-30 <-30
reflectance

Allowed maximum output


dB <-30 <-30 <-30
reflectance

Gain flatness dB ±1 ±1 ±1

Gain response time while


adding/reducing channels ms <10 <10 <10
(stable status)

Polarization mode
ps <0.5 <0.5 <0.5
dispersion

l 80-channel EOPA board at C/L band


The specifications of 80-channel EOPA board at C/L band are listed in Table 3-61.

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Table 3-61 Technical Specifications of 80-channel EOPA (C/L-band)

Specification (80-Channel System)


Item Unit
EOPA17/17 EOPA22/17 EOPA27/17

1529 to 1561 (C 1529 to 1561 (C 1529 to 1561 (C


Operating wavelength band) band) band)
nm
range 1570 to 1605 (L 1570 to 1605 (L 1570 to 1605 (L
band) band) band)

Total input power range dBm -35 to 3 -35 to -2 -35 to -7

Channel input power


dBm -35 to -16 -35 to -21 -35 to -26
range

Channel output power


dBm -2 to 1 -5 to 1 -5 to 1
range

Total output power range dBm -2 to 17 -5 to 17 -5 to 17

Maximum total output


dBm 17 17 17
power

Noise figure dB <5.5 <5.5 <5.5

Polarization dependent
dB <0.5 <0.5 <0.5
loss

Pump leakage at input dBm <-30 <-30 <-30

Pump leakage at output dBm <-30 <-30 <-30

Input return loss dB >40 >40 >40

Output return loss dB >40 >40 >40

Channel gain dB 17 22 27

Allowed maximum input


dB <-30 <-30 <-30
reflectance

Allowed maximum output


dB <-30 <-30 <-30
reflectance

Gain flatness dB ±1 ±1 ±1

Gain response time while


adding/reducing channels ms <10 <10 <10
(stable status)

Polarization mode
ps <0.5 <0.5 <0.5
dispersion

l 48-channel EOPA board at CE band


The specifications of 48-channel EOPA board at CE band are listed in Table 3-62.

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Table 3-62 Technical Specifications of 48-channel EOPA (CE-band)

Specification (48-Channel System)


Item Unit
EOPA17/17 EOPA22/17 EOPA27/17

Operating wavelength 1529 to 1568 1529 to 1568 1529 to 1568


nm
range (CE band) (CE band) (CE band)

Total input power range dBm -35 to 3 -35 to -2 -35 to -7

Channel input power range dBm -35 to -13 -35 to -18 -35 to -23

Channel output power


dBm -2 to 4 -2 to 4 -2 to 4
range

Total output power range dBm -2 to 17 -2 to 17 -2 to 17

Maximum total output


dBm 17 17 17
power

Noise figure dB <5.5 <5.5 <5.5

Polarization dependent
dB <0.5 <0.5 <0.5
loss

Pump leakage at input dBm <-30 <-30 <-30

Pump leakage at output dBm <-30 <-30 <-30

Input return loss dB >40 >40 >40

Output return loss dB >40 >40 >40

Channel gain dB 17 22 27

Allowed maximum input


dB <-30 <-30 <-30
reflectance

Allowed maximum output


dB <-30 <-30 <-30
reflectance

Gain flatness dB ±1 ±1 ±1

Gain response time while


adding/reducing channels ms <10 <10 <10
(stable status)

Polarization mode
ps <0.5 <0.5 <0.5
dispersion

l 96-channel EOPA board at CE band

The specifications of 96-channel EOPA board at CE band are listed in Table 3-63.

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Table 3-63 Technical Specifications of 96-channel EOPA (CE-band)

Specification (96-Channel System)


Item Unit
EOPA17/17 EOPA22/17 EOPA27/17

Operating wavelength 1529 to 1568 1529 to 1568 (CE 1529 to 1568


nm
range (CE band) band) (CE band)

Total input power range dBm -35 to 3 -35 to -2 -35 to -7

Channel input power


dBm -35 to -16 -35 to -21 -35 to -26
range

Channel output power


dBm -5 to 1 -5 to 1 -5 to 1
range

Total output power range dBm -5 to 17 -5 to 17 -5 to 17

Maximum total output


dBm 17 17 17
power

Noise figure dB <5.5 <5.5 <5.5

Polarization dependent
dB <0.5 <0.5 <0.5
loss

Pump leakage at input dBm <-30 <-30 <-30

Pump leakage at output dBm <-30 <-30 <-30

Input return loss dB >40 >40 >40

Output return loss dB >40 >40 >40

Channel gain dB 17 22 27

Allowed maximum input


dB <-30 <-30 <-30
reflectance

Allowed maximum output


dB <-30 <-30 <-30
reflectance

Gain flatness dB ±1 ±1 ±1

Gain response time while


adding/reducing channels ms <10 <10 <10
(stable status)

Polarization mode
ps <0.5 <0.5 <0.5
dispersion

Enhance Optical Node Amplifier (EONA)


l 40/80-channel EONA board at C/L band
The specifications of 40/80-channel EONA board at C/L band are listed in Table 3-64.
The specifications of 32-channel EONA are the same as those of 40-channel EONA
except the single-channel optical power, which is 1 dB more than that of 40-channel
EONA.

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Table 3-64 Technical Specifications of 40/80-channel EONA (C/L-band)

Specification (40-Channel System) Specification (80-Channel System)


Item Unit EONA25 EONA33
EONA25/20 EONA33/20 EONA27/24 EONA27/24
/20 /20

1529 to 1529 to 1529 to 1529 to 1529 to


1529 to 1561
1561 (C 1561 (C 1561 (C 1561 (C 1561 (C
(C band)
Operating band) band) band) band) band)
nm
wavelength range 1570 to 1570 to 1570 to 1570 to 1570 to
1570 to 1605
1605 (L 1605 (L 1605 (L 1605 (L 1605 (L
(L band)
band) band) band) band) band)

Total input power


dBm -35 to -2 -35 to -10 -35 to 0 -35 to -2 -35 to -10 -35 to 0
range

Channel input
dBm -35 to -18 -35 to -26 -35 to -16 -35 to -21 -35 to -29 -35 to -19
power range

Channel output
dBm 1 to 7 1 to 7 5 to 11 -2 to 4 -2 to 4 2 to 8
power range

Total output
dBm 1 to 20 1 to 20 5 to 24 -2 to 20 -2 to 20 2 to 24
power range

Maximum total
dBm 20 20 24 20 20 24
output power

20 to 22:
8.0 28 to 30:
20 to 22: 8.0 22 to 24: 8.5 22 to 24: 8.5
28 to 30: 6.5 22 to 25: 6.5
Noise figure dB 22 to 25: 7.0 24 to 27: 7.5 24 to 27: 7.5
30 to 38: 6.0 7.0 30 to 38:
25 to 30: 6.5 27 to 32: 6.5 27 to 32: 6.5
25 to 30: 6.0
6.5

Polarization
dB <0.5 <0.5 <0.5 <0.5 <0.5 <0.5
dependent loss

Pump leakage at
dBm <-30 <-30 <-30 <-30 <-30 <-30
input

Pump leakage at
dBm <-30 <-30 <-30 <-30 <-30 <-30
output

Input return loss dB >40 >40 >40 >40 >40 >40

Output return loss dB >40 >40 >40 >40 >40 >40

Channel gain dB 25 33 27 25 33 27

Allowed
maximum input dB <-30 <-30 <-30 <-30 <-30 <-30
reflectance

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Specification (40-Channel System) Specification (80-Channel System)


Item Unit EONA25 EONA33
EONA25/20 EONA33/20 EONA27/24 EONA27/24
/20 /20

Allowed
maximum output dB <-30 <-30 <-30 <-30 <-30 <-30
reflectance

Gain flatness dB ±1 ±1 ±1 ±1 ±1 ±1

Gain response
time while
adding/reducing ms <10 <10 <10 <10 <10 <10
channels (stable
status)

Polarization
ps <0.5 <0.5 <0.5 <0.5 <0.5 <0.5
mode dispersion

l 48/96-channel EONA board at CE band


The specifications of 48/96-channel EONA board at CE band are listed in Table 3-65.

Table 3-65 Technical Specifications of 48/96-channel EONA (CE-band)

Specification (48-Channel System) Specification (96-Channel System)


Item Unit EONA25 EONA33 EONA33 EONA27
EONA27/24 EONA25/21
/21 /21 /21 /24

1529 to 1529 to 1529 to 1529 to 1529 to 1529 to


Operating
nm 1568 (CE 1568 (CE 1568 (CE 1568 (CE 1568 (CE 1568 (CE
wavelength range
band) band) band) band) band) band)

Total input power


dBm -35 to -4 -35 to -12 -35 to 3 -35 to -4 -35 to -12 -35 to -3
range

Channel input
dBm -35 to -21 -35 to -29 -35 to -19 -35 to -24 -35 to -32 -35 to -22
power range

Channel output
dBm 1 to 7 1 to 7 5 to 11 -2 to 4 -2 to 4 2 to 8
power range

Total output power


dBm 1 to 21 1 to 21 5 to 24 -2 to 21 -2 to 21 2 to 24
range

Maximum total
dBm 21 21 24 21 21 24
output power

Noise figure dB <6 <6 <6 <6 <6 <6

Polarization
dB <0.5 <0.5 <0.5 <0.5 <0.5 <0.5
dependent loss

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Specification (48-Channel System) Specification (96-Channel System)


Item Unit EONA25 EONA33 EONA33 EONA27
EONA27/24 EONA25/21
/21 /21 /21 /24

Pump leakage at
dBm <-30 <-30 <-30 <-30 <-30 <-30
input

Pump leakage at
dBm <-30 <-30 <-30 <-30 <-30 <-30
output

Input return loss dB >40 >40 >40 >40 >40 >40

Output return loss dB >40 >40 >40 >40 >40 >40

Channel gain dB 25 33 27 25 33 27

Allowed maximum
dB <-30 <-30 <-30 <-30 <-30 <-30
input reflectance

Allowed maximum
dB <-30 <-30 <-30 <-30 <-30 <-30
output reflectance

Gain flatness dB ±1 ±1 ±1 ±1 ±1 ±1

Gain response
time while
adding/reducing ms <10 <10 <10 <10 <10 <10
channels (stable
status)

Polarization mode
ps <0.5 <0.5 <0.5 <0.5 <0.5 <0.5
dispersion

3.10.2 Specifications of the SEOA Board


SEOBA Board Specifications
The technical specifications of 40/80-channel C-band SEOBA board are listed in Table
3-66. The single-channel power of 32-channel SEOBA board is 1 dB more than that of
corresponding 40-channel SEOBA board.

Table 3-66 Technical Specifications of 40/80-Channel C-Band SEOBA Board

Specification (40/80-Channel)

Item Unit SEOBA17/17 SEOBA22/20

40-Channel 80-Channel 40-Channel 80-Channel

Operating wavelength
nm 1529 to 1561 1529 to 1561
range

Total input power


dBm -32 to 3 -32 to 1
range

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Specification (40/80-Channel)

Item Unit SEOBA17/17 SEOBA22/20

40-Channel 80-Channel 40-Channel 80-Channel

Channel input power


dBm -32 to -13 -32 to -16 -32 to -15 -32 to -18
range

Channel output power


dBm -2 to 4 -5 to 1 1 to 7 -2 to 4
range

Total output power


dBm -2 to -17 -5 to 17 1 to 20 -2 to 20
range

Maximum total output


dBm 17 20
power

Noise figure dB <6 <6

Polarization depen-
dB <0.5 <0.5
dent loss (PDL)

Pump leakage at input dBm <-30 <-30

Pump leakage at
dBm <-30 <-30
output

Input return loss dB >40 >40

Output return loss dB >40 >40

Channel gain dB 17 22

Maximum allowed
dB >30 >30
input reflectance

Maximum allowed
dB >30 >30
output reflectance

Gain flatness dB ±1 ±1

Gain response time


while adding/reducing
ms <10 <10
channels (stable sta-
tus)

Polarization mode dis-


ps <0.5 <0.5
persion (PMD)

SEOPA Board Specifications


The technical specifications of 40/80-channel C-band SEOPA board are listed in Table
3-67. The single-channel power of 32-channel SEOPA board is 1 dB more than that of
corresponding 40-channel SEOPA board.

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Table 3-67 Technical Specifications of 40/80-Channel C-Band SEOPA Board

Specification (40/80-Channel)

SEOPA17/17 SEOPA22/17 SEOPA27/17


Item Unit
40-Cha- 80-Cha- 40-Cha- 80-Cha- 40-Cha- 80-Cha-
nnel nnel nnel nnel nnel nnel

Operating
nm 1529 to 1561 1529 to 1561 1529 to 1561
wavelength range

Total input power


dBm -35 to 3 -35 to -2 -35 to -7
range

Channel input
dBm -35 to -13 -35 to -16 -35 to -18 -35 to -21 -35 to -23 -35 to -26
power range

Channel output
dBm -2 to 4 -5 to 1 -2 to 4 -5 to 1 -2 to 4 -5 to 1
power range

Total output power


dBm -2 to 17 -5 to 17 -2 to 17 -5 to 17 -2 to 17 -5 to 17
range

Maximum total
dBm 17 17 17
output power

Noise figure dB <5.5 <5.5 <5.5

Polarization
dependent loss dB <0.5 <0.5 <0.5
(PDL)

Pump leakage at
dBm <-30 <-30 <-30
input

Pump leakage at
dBm <-30 <-30 <-30
output

Input return loss dB >40 >40 >40

Output return loss dB >40 >40 >40

Channel gain dB 17 22 27

Maximum allowed
dB >30 >30 >30
input reflectance

Maximum allowed
dB >30 >30 >30
output reflectance

Gain flatness dB ±1 ±1 ±1

Gain response
time while
adding/reducing ms <10 <10 <10
channels (stable
status)

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Specification (40/80-Channel)

SEOPA17/17 SEOPA22/17 SEOPA27/17


Item Unit
40-Cha- 80-Cha- 40-Cha- 80-Cha- 40-Cha- 80-Cha-
nnel nnel nnel nnel nnel nnel

Polarization mode
ps <0.5 <0.5 <0.5
dispersion (PMD)

SEOLA Board Specifications


The technical specifications of 40/80-channel C-band SEOLA board are listed in Table
3-68. The single-channel power of 32-channel SEOLA board is 1 dB more than that of
corresponding 40-channel SEOLA board.

Table 3-68 Technical Specifications of 40/80-Channel C-Band SEOLA Board

Specification (40/80-Channel)

Item Unit SEOLA22/20

40-Channel 80-Channel

Operating wavelength range nm 1529 to 1561

Total input power range dBm -35 to 1

Channel input power range dBm -35 to -15 -35 to -18

Channel output power range dBm 1 to 7 -2 to 4

Total output power range dBm 1 to 20 -2 to 20

Maximum total output power dBm 20

Noise figure dB <6

Polarization dependent loss


dB <0.5
(PDL)

Pump leakage at input dBm <-30

Pump leakage at output dBm <-30

Input return loss dB >40

Output return loss dB >40

Channel gain dB 22

Maximum allowed input


dB >30
reflectance

Maximum allowed output


dB >30
reflectance

Gain flatness dB ±1

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Specification (40/80-Channel)

Item Unit SEOLA22/20

40-Channel 80-Channel

Gain response time while


adding/reducing channels ms <10
(stable status)

Polarization mode dispersion


ps <0.5
(PMD)

3.10.3 Specifications of the DRA Board


The DRA_P board applies RAMAN amplifier to amplify the optical signals, and its
specifications are listed in Table 3-69.

Table 3-69 Technical Specification of the DRA_P Board

Item Unit Specification

C band: 2-3

Pump wavelength and quantity nm/piece CE band: 2-3

L band: 2-3

Pump power mW 750

Total output power dBm ≥12

C/CE/L/C+L band gain (G.652) dB 10/10/10/10

C/CE/L/C+L band (LEAF) dB 12/12/12/12

C/CE/L/C+L band (TW RS) dB 13/13/13/13

C/CE/L/C+L band equated noise figure


dB 0/0/0/0
(G.652)

C/CE/L/C+L band equated noise figure


dB -1/-1/-1/-1
(LEAF)

C/CE/L/C+L band equated noise figure


dB -1.5/-1.5/-1.5/-1.5
(TW RS)

Polarization dependent gain dB <0.5

Temperature characteristics pm/°C <500

Practically, we adopt EDFA+RAMAN technologies, which is the combination of the EOA


board and the DRA_P board, to amply the optical signals. The specifications are listed in
Table 3-70.

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Table 3-70 Technical Specifications of the Combination of the EOA Board and the
DRA_P Board

Item Unit Specification

1529-1561 (C band)

Operating wavelength range nm 1529-1568 (CE band)

1570-1605 (L band)

Total output power range dBm >20

Noise figure dB <3

Polarization dependent loss dB <0.5

Pump leakage at output dBm <-30

Input return loss dB >40

Output return loss dB >40

Allowed maximum input reflectance dB <-30

Allowed maximum output reflectance dB <-30

Gain flatness dB ±1

Gain response time while adding/re-


ms <10
ducing channels (stable status)

Polarization mode dispersion ps <0.5

The DRA_B board applies RAMAN amplifier to amplify the optical signals, and its
specifications are listed in Table 3-71.

Table 3-71 Technical Specification of the DRA_B Board

Item Unit Specification

1529-1561 (C band)

Pump wavelength and quantity nm/piece 1529-1568 (CE band)

1570-1605 (L band)

Pump power mW 850

Total output power dBm ≥12

Band gain (G.652) dB 1-6

Noise figure dB <1

Polarization dependent loss dB <0.2

Input return loss dB >45

Output return loss dB >45

Gain flatness dB <4

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Item Unit Specification

Polarization mode dispersion ps <0.5

Insertion loss dB <1.5

3.10.4 Specifications of the LAC Board


Technical specifications of the LAC board are listed in Table 3-72.

Table 3-72 Technical Specifications of the LAC Board

Item Unit Specification

1529-1561 (C band)

Application wavelength range nm 1529-1568 (CE band)

1570-1605 (L band)

Input power detection range dBm -39 to +20

Output power detection range dBm -40 to +18

Optical power detection precision dB ≤±0.5

Attenuation adjustment precision dB ≤±0.5

Attenuation adjustment step length dB ≤±0.2

Attenuation adjustment range dB ≥20

Attenuation adjustment rate dB/s ≤10

3.11 Optical Layer Management Subsystem


Specifications
3.11.1 Specifications of the OPM Board
Technical specifications of the OPM board at 25GHz, 50GHz and 100GHz are listed in
Table 3-73, Table 3-74 and Table 3-75.

Table 3-73 Technical Specifications of the OPM Board (25 GHz)

Item Unit Specification

Application wavelength
nm 1528-1568 (CE band)
range

Wavelength resolution nm 0.02

Wavelength detection
nm ±0.1
precision

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Item Unit Specification

Input power range dBm -40 to -10

Power resolution dBm 0.05

Power detection preci-


dBm ±1.5
sion

OSNR range dB ≤25

OSNR detection preci-


dB ±1.5
sion

Input optical return loss dB 30

Detection signal time s ≤1

Table 3-74 Technical Specifications of the OPM Board (50 GHz)

Item Unit Specification

Application wavelength 1529-1561 (C band)


nm
range 1570-1605 (L band)

Wavelength detection
nm ±0.05
precision

Input power range dBm -45 to -15

Power detection preci-


dBm ±1.5
sion

OSNR range dB ≤25

OSNR detection preci-


dB ±1.5
sion

Input optical return loss dB 30

Detection signal time s ≤1

Table 3-75 Technical Specifications of the OPM Board (100 GHz)

Item Unit Specification

Application wavelength 1529-1561 (C band)


nm
range 1570-1605 (L band)

Wavelength detection
nm ±0.1
precision

Input power range dBm -45 to -15

Power detection preci-


dBm ±1.5
sion

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Item Unit Specification

OSNR range dB ≤25

OSNR detection preci-


dB ±1.5
sion

Input optical return loss dB 30

Detection signal time s ≤1

3.11.2 Specifications of the OWM Board


The technical specifications of the OWM board are listed in Table 3-76.

Table 3-76 Technical Specifications of the OWM Board

Item Unit Specification

1529-1561 (C band)

Wavelength detection range nm 1529-1568 (CE band)

1570-1605 (L band)

Input optical power dBm -45 to -15

Capture range of wavelength


GHz -5 to +5
offset

Alarm range of wavelength off-


GHz >±5
set

3.11.3 Specifications of the DCU Board


The technical specifications of the DCU board are listed in Table 3-77.

Table 3-77 Technical Specifications of the DCU Board

Item Unit Parameter

Dispersion adjustment range ps/nm


+/-700

Optical input power dBm 1~-12

3.11.4 Specifications of the EOPM Board


The technical specifications of the EOPM board at 50 GHz and 100 GHz are respectively
listed in Table 3-78 and Table 3-79.

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Table 3-78 Technical Specifications of the EOPM Board (50 GHz)

Project Unit Parameter

1529 to 1561 (C band)


Wavelength range
nm 1570 to 1605 (L band)
(band)
1529 to 1568 (CE band)

Wavelength detection
nm
range ±0.05

Input power range dBm -45 to -15

Power detection preci-


sion dBm ±1.5

OSNR range dB ≤25

OSNR detection preci-


sion dB ±1.5

Input return loss dB 30

Signal detection time s ≤1

Table 3-79 Technical Specifications of the EOPM Board (100 GHz)

Project Unit Parameter

1529 to 1561 (C band)


Wavelength range
nm 1570 to 1605 (L band)
(band)
1529 to 1568 (CE band)

Wavelength detection
nm
range ±0.1

Input power range dBm -45 to -15

Power detection preci-


sion dBm ±1.5

OSNR range dB ≤25

OSNR detection preci-


sion dB ±1.5

Input return loss dB 30

Signal detection time s ≤1

3.11.5 Specifications of the EOWM Board


The technical specifications of the EOWM board are listed in Table 3-80.

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Table 3-80 Technical Specifications of the EOWM Board

Project Unit Parameter

1529 to 1561 (C band)

Wavelength detection range nm 1529 to 1568 (CE band)

1570 to 1605 (L band)

Optical input power dBm -45 to -15

Wavelength offset capture


GHz -5 to +5
range

Wavelength offset alarm range GHz >±5

3.12 Protection Subsystem Specifications


3.12.1 Specifications of the SOP Board
The specifications of the SOP board are listed in Table 3-81.

Table 3-81 Technical Specifications of the SOP Board

Item Unit Specification

1280-1625
Operating Wavelength Range nm
1510-1625 1280-1510

T1_I->T1_O1 dB <4.4 <5.0

T2_I->T2_O1 dB <4.4 <5.0

T1_I->T1_O2 dB <4.4 <5.0

T2_I->T2_O2 dB <4.4 <5.0


Insertion Loss
R1_I1-> R1_O dB <2.1 <2.7

R2_I1-> R2_O dB <2.1 <2.7

R1_I2-> R1_O dB <2.1 <2.7

R2_I2-> R2_O dB <2.1 <2.7

Optical Return Loss dB >40

Polarization Dependent Loss dB <0.2

Optical Input Power mW <200

Switching Time ms 50

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3.12.2 Specifications of the SOPCS Board


The technical specifications of the SOPCS board are listed in Table 3-82.

Table 3-82 Technical Specifications of the SOPCS Board

Item Unit Specification

Operating
nm 1280-1625 - -
Wavelength Range

nm - 1510-1625 1280-1510

dB API → BPO <2.1 <2.7

dB API→BOUT <2.7 <3.3

dB AWI→AOUT <2.1 <2.7

dB AIN → AWO <4.4 <5.0

Insertion Loss dB AIN→BPO <5.1 <5.7

dB BIN→ BWO <4.4 <5.0

dB BIN→APO <5.1 <5.7

dB BWI→BOUT <2.1 <2.7

dB BPI→AOUT <2.7 <3.3

dB BPI→APO <2.1 <2.7

Optical Return Loss dB >40 - -

Polarization
dB <0.3 - -
Dependent Loss

Optical Input Power mW <200 - -

Switching Time ms <50 - -

3.12.3 Specifications of the SOPMS Board


The technical specifications of the SOPMS board are listed in Table 3-83.

Table 3-83 Technical Specifications of the SOPMS Board

Item Unit Specification

Operating
Wavelength nm 1510-1610 -
Range

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Item Unit Specification

dB API→BPO <3.2

dB AWI→AOUT <1.7

dB BWI→BOUT <1.7

dB BPI→APO <3.2

dB AIN→AWO <1.7

dB BIN→BWO <1.7

dB API→AWO <3.2
Insertion Loss
dB AWI→APO <3.2

dB AIN→BPO <1.7

dB BPI→AOUT <1.7

dB BWI→BPO <3.2

dB BPI→BWO <3.2

dB BIN→APO <1.7

dB API→BOUT <1.7

Optical return
dB >40 -
Loss

Polarization
dB <0.3 -
Dependent Loss

Optical Input
mW <200 -
Power

Switching Time ms <50 -

3.13 Supervision Subsystem Specifications


3.13.1 Specifications of the SOSC Board
The SOSC board supports 100 M optical supervision channel. The technical specifications
of the SOSC board are listed in Table 3-84.

Table 3-84 Technical Specifications of the SOSC Board

Item Unit Specification

Optical signal type - 100BASE-FX

Operating wavelength nm 1510±10

Signal code - 4B/5B

Supervision rate Mbit/s 100

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ZXWM M920 Product Descriptions

Item Unit Specification

Signal transmission
dBm -5 to 0 -1 to 6 ≥+4
power

Minimum receiving
dBm -34 -35 -43
sensitivity

3.14 RPOA Subsystem Specifications


3.14.1 Applicable Transmission Codes
RPOA subsystem is designed for ultra-long transmission. It only supports the transmission
over a single span because the Signal-to-Noise Ratio (SNR) of the system decreases
greatly if the fiber is too long.
Since the amplification range of EDF does not include 1510 nm wavelength, the
supervisory information can not be transmitted over a long distance. Therefore, the
RPOA subsystem needs a wavelength originally used for service transmission to transfer
the supervision signal.
Table 3-85 describes the transmission codes supported by RPOA subsystem over single
span. Notice that the system capacity listed in the table already includes a supervisory
channel.

Table 3-85 Transmission Codes Supported by RPOA Subsystem (over single span)

Single-Span Line Attenuation Maximum System Capacity


Fiber Type
dB Gbit/s

≤73 4×2.5

≤72 8×2.5

≤69 16×2.5

≤63 40×2.5
G.652 fiber
≤67 4×10

≤67 8×10

≤67 16×10

≤63 40×10

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Single-Span Line Attenuation Maximum System Capacity


Fiber Type
dB Gbit/s

≤68.5 4×2.5

≤67 8×2.5

≤64 16×2.5

≤63 40×2.5
G.655 fiber
≤66 4×10

≤66 8×10

≤66 16×10

≤63 40×10

3.14.2 Specifications of the RPOA Subsystem


The optical specifications of the RPOA subsystem are listed in Table 3-86.

Table 3-86 Optical Specifications of the RPOA Subsystem

Item Unit RPOA Subsystem with GFF RPOA Subsystem without GFF

Amplification range nm 1529-1561 1546-1561

Noise figure dB <7 (within amplification range) <7 (within amplification range)

Gain dB >17 >17

Gain flatness dB <2 <2

Optical received
dBm -44 to -18 -44 to -18
power

Optical launched
dBm -30 to +2 -34 to 8
power

Working tempera-
°C -40 to 65 (RGU), -10 to 60 (RPU) -40 to 65 (RGU), -10 to 60 (RPU)
ture range

Storage tempera-
°C -40 to 85 -40 to 85
ture range

• The RPOA subsystems without Gain Flatness Filter (GFF) meet the requirements of systems with capacity below
16 wavelengths, while the RPOA subsystems with GFF meet the requirements of systems with capacity of 40 wa
velengths.

3.15 Specifications of APO Function


Technical specifications of Automatic Power Optimization (APO) function at OMS illustrate
in Table 3-87. Technical specifications of Automatic Power Optimization (APO) function at

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OCH (power mode) illustrate in Table 3-88. Technical specifications of Automatic Power
Optimization (APO) function at OCH (OSNR mode) illustrate in Table 3-89.

Table 3-87 Technical Specifications of APO Function at OMS

Item Unit Specification Remark

It is the default value in


the automatic mode without
Sub-OTS section gain manual intervention. In the
dB 2–3
attenuation semi-automatic mode with
manual intervention, there is no
specification restriction.

It is the default value in


the automatic mode without
System allowed OMS section gain manual intervention. In the
dB 3–4
optimization range attenuation semi-automatic mode with
manual intervention, there is no
specification restriction.

It is the default value in


Difference between the the automatic mode without
optical power of initial manual intervention. In the
dB 2–3
OA and terminal OA in semi-automatic mode with
OMS section (ΔP) manual intervention, there is no
specification restriction.

dB LAC attenuation 2–20 -


Allowed
dB OA gain adjustment -2 – +2 -
optimization
dB EONA gain adjustment -5 – +5 -
adjustment range
dB DRA gain 6–12 -

Depends on the adjustment


of system performer
(LAC/OA/EONA/DRA). If
Sub-OTS section gain
dB -1 – +1 the performer adjustment
attenuation
compensates the system
degrade, it meets the
Optimization specifications.
accuracy Depends on the adjustment
of system performer
(LAC/OA/EONA/DRA). If
OMS section gain
dB -1 – +1 the performer adjustment
attenuation
compensates the system
degrade, it meets the
specifications.

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Item Unit Specification Remark

Depends on the adjustment


of system performer
Difference between the
(LAC/OA/EONA/DRA). If
optical power of initial
dB -1 – +1 the performer adjustment
OA and terminal OA in
compensates the system
OMS section (ΔP)
degrade, it meets the
specifications.

• OA board mentioned in the above table includes EOPA, EOBA. EOLA, OPA, OBA and OLA.

Table 3-88 Technical Specifications of APO Function at OCH (optical power mode)

Item Unit Specification Remark

System allowed
Optical power deviation >+1.5 or
optimization dB Default
of wavelength channel <-1.5
range

Allowed dB VMUX attenuation 0–10 -


optimization WSU/WBM/WBU
dB 0–15 -
adjustment range attenuation

Default. Depends on the


adjustment of system performer
(VMUX/WSU/WBM /WBU).
Optimization Optical power deviation
dB -1 – +1 If the performer adjustment
accuracy of wavelength channel
compensates the system
degrade, it meets the
specifications.

Table 3-89 Technical Specifications of APO Function at OCH (OSNR mode)

Item Unit Specification Remark

System allowed
OSNR of wavelength 14–18 or
optimization dB Default
channel 21–25
range

VMUX/VMUXB
Allowed dB 0–10 -
attenuation
optimization
WSU/WBM/WBU
adjustment range dB 0–15
attenuation -

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Item Unit Specification Remark

Default. Depends on the


adjustment of system performer
(VMUX/VMUXB/WSU/WBM
Optimization OSNR of wavelength
dB 19–20 /WBU). If the performer
accuracy channel
adjustment compensates the
system degrade, it meets the
specifications.

3.16 Specifications of the IWF Function


Technical specifications of the IWF function are illustrated in Table 3-90.

Table 3-90 Technical Specifications of the IWF Function

Item Unit Specification

1529-1561 (C band)
Operating
nm 1529-1568 (CE band)
wavelength rage
1570-1605 (L band)

Channel spacing GHz 50

Input optical
power range of dBm -45 to -15
single-wavelength

Detection range of
GHz -10 to +10
wavelength offset

Control accuracy of
GHz ±5
wavelength offset

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Figures
Figure 1-1 RPOA Unidirectional Pump Application through the Same Fiber .............. 1-4
Figure 1-2 RPOA Unidirectional Pump Application through the Same Fiber (with
DRA board)............................................................................................. 1-4
Figure 1-3 RPOA Unidirectional Pump Application through Different Fiber................ 1-4
Figure 1-4 RPOA Bidirectional Pump Application through Two Fiber......................... 1-5
Figure 2-1 Structure of 21–inch Subrack Backplane.................................................. 2-1
Figure 3-1 Jitter Transfer Characteristics of Line-side Optical Port .......................... 3-29

I
Figures

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Tables
Table 2-1 Description of Subrack No. ........................................................................ 2-2
Table 3-1 Dimensions and Weights of Structural Parts of ZXWM M920..................... 3-1
Table 3-2 ZXWM M920 Board Weight ....................................................................... 3-2
Table 3-3 Power Consumption of ZXWM M920......................................................... 3-5
Table 3-4 Requirements for Climate (Storage Environment).................................... 3-11
Table 3-5 Concentration of Mechanical Activity Material (Storage
Environment) ......................................................................................... 3-11
Table 3-6 Concentration of Chemical Activity Material (Storage Environment) ........... 3-12
Table 3-7 Requirements for Climate ........................................................................ 3-12
Table 3-8 Concentration of Mechanical Activity Material.......................................... 3-13
Table 3-9 Concentration of Chemical Activity Material ............................................. 3-13
Table 3-10 Climate Requirements ........................................................................... 3-14
Table 3-11 Requirements for Climate ...................................................................... 3-14
Table 3-12 Concentration of Mechanical Activity Material........................................ 3-14
Table 3-13 Concentration of Chemical Activity Material ........................................... 3-15
Table 3-14 Typical Power Supply Lighting Protection Classification......................... 3-15
Table 3-15 ZXWM M920 Port Lighting Requirements .............................................. 3-16
Table 3-16 Electro-Magnetic Susceptibility Specifications ....................................... 3-16
Table 3-17 Wavelength Allocation (8/16/32/40-channel, C band)............................. 3-17
Table 3-18 Wavelength Allocation (48/96-channel,C band) ..................................... 3-18
Table 3-19 Wavelength Allocation (80-channel, C band) ......................................... 3-19
Table 3-20 Wavelength Allocation (80-channel, L band) .......................................... 3-21
Table 3-21 Wavelength Allocation (192-channel, C band) ....................................... 3-23
Table 3-22 Board classification list .......................................................................... 3-26
Table 3-23 Technical Specifications of the Client-Side 2.5G Board.......................... 3-27
Table 3-24 Technical Specifications of the 2.5G Board at Wavelength Division
Side ....................................................................................................... 3-27
Table 3-25 Jitter Generation Specifications ............................................................. 3-28
Table 3-26 Jitter Transfer Characteristics of 3R Line-Side Optical Port That Carries
SDH Signal ............................................................................................ 3-29
Table 3-27 Technical Specifications of the Client-Side 10G Board (with FEC) ........... 3-29
Table 3-28 Technical Specifications of the 10G Board at Wavelength Division Side
(with FEC).............................................................................................. 3-30

III
ZXWM M920 Product Descriptions

Table 3-29 Jitter Generation Specifications ............................................................. 3-31


Table 3-30 Technical Specifications of the Client-Side 40G Board .......................... 3-32
Table 3-31 Technical Specifications of the 40G Board at Line-Side ......................... 3-32
Table 3-32 Technical Specifications of the SOAD1 Board........................................ 3-34
Table 3-33 Technical Specifications of the SOAD2 Board........................................ 3-34
Table 3-34 Technical Specifications of the SOAD4 Board........................................ 3-35
Table 3-35 Technical Specifications of the WBU Board ........................................... 3-36
Table 3-36 Technical Specifications of the WSUD Board......................................... 3-37
Table 3-37 Technical Specifications of WSUA ........................................................ 3-38
Table 3-38 Technical Specifications of the WBM Board ........................................... 3-38
Table 3-39 Technical Specifications of the PDU-4-x Board ...................................... 3-39
Table 3-40 Technical Specifications of PDU-5-x Board ............................................ 3-39
Table 3-41 Technical Specifications of the PDU-8-x Board ...................................... 3-40
Table 3-42 Technical Specifications of the PDU-9-x Board ...................................... 3-40
Table 3-43 Technical Specifications of the PDU-16-x Board .................................... 3-40
Table 3-44 Technical Specifications of the OMU Board ........................................... 3-41
Table 3-45 Technical Specifications of the ODU Board ........................................... 3-42
Table 3-46 Technical Specifications of the ODUB Board ........................................ 3-43
Table 3-47 Technical Specifications of the OCI Board (100GHz-50GHz) ................. 3-44
Table 3-48 Technical Specifications of the OCI Board (50GHz-25GHz) .................. 3-44
Table 3-49 Technical Specifications of the OBM Board............................................ 3-45
Table 3-50 Technical Specifications of the VMUX Board ......................................... 3-45
Table 3-51 Technical Specifications of the VMUXB Board ....................................... 3-46
Table 3-52 Technical Specifications of the SSDMT Board ...................................... 3-47
Table 3-53 Technical Specifications of the SSDMR Board....................................... 3-47
Table 3-54 Technical Specifications of the SOGMD Board ...................................... 3-48
Table 3-55 Technical Specifications of 40-channel EOBA Board (C/L-band)............ 3-49
Table 3-56 Technical Specifications of 80-channel EOBA Board (C-band)............... 3-50
Table 3-57 Technical Specifications of 48-channel EOBA Board (CE-band) ............ 3-51
Table 3-58 Technical Specifications of 96-channel EOBA Board (CE-band) ............ 3-52
Table 3-59 Technical Specifications of 40/80-channel EOLA (C/L-band) ................. 3-53
Table 3-60 Technical Specifications of 40-channel EOPA (C/L-band) ...................... 3-54
Table 3-61 Technical Specifications of 80-channel EOPA (C/L-band) ...................... 3-56
Table 3-62 Technical Specifications of 48-channel EOPA (CE-band)....................... 3-57
Table 3-63 Technical Specifications of 96-channel EOPA (CE-band)....................... 3-58

IV
Tables

Table 3-64 Technical Specifications of 40/80-channel EONA (C/L-band) ................ 3-59


Table 3-65 Technical Specifications of 48/96-channel EONA (CE-band) ................. 3-60
Table 3-66 Technical Specifications of 40/80-Channel C-Band SEOBA
Board ..................................................................................................... 3-61
Table 3-67 Technical Specifications of 40/80-Channel C-Band SEOPA
Board ..................................................................................................... 3-63
Table 3-68 Technical Specifications of 40/80-Channel C-Band SEOLA
Board ..................................................................................................... 3-64
Table 3-69 Technical Specification of the DRA_P Board.......................................... 3-65
Table 3-70 Technical Specifications of the Combination of the EOA Board and the
DRA_P Board ........................................................................................ 3-66
Table 3-71 Technical Specification of the DRA_B Board.......................................... 3-66
Table 3-72 Technical Specifications of the LAC Board............................................. 3-67
Table 3-73 Technical Specifications of the OPM Board (25 GHz) ............................ 3-67
Table 3-74 Technical Specifications of the OPM Board (50 GHz) ........................... 3-68
Table 3-75 Technical Specifications of the OPM Board (100 GHz) ......................... 3-68
Table 3-76 Technical Specifications of the OWM Board........................................... 3-69
Table 3-77 Technical Specifications of the DCU Board ............................................ 3-69
Table 3-78 Technical Specifications of the EOPM Board (50 GHz) ......................... 3-70
Table 3-79 Technical Specifications of the EOPM Board (100 GHz) ....................... 3-70
Table 3-80 Technical Specifications of the EOWM Board ........................................ 3-71
Table 3-81 Technical Specifications of the SOP Board ............................................ 3-71
Table 3-82 Technical Specifications of the SOPCS Board ....................................... 3-72
Table 3-83 Technical Specifications of the SOPMS Board....................................... 3-72
Table 3-84 Technical Specifications of the SOSC Board.......................................... 3-73
Table 3-85 Transmission Codes Supported by RPOA Subsystem (over single
span) ..................................................................................................... 3-74
Table 3-86 Optical Specifications of the RPOA Subsystem ..................................... 3-75
Table 3-87 Technical Specifications of APO Function at OMS ................................ 3-76
Table 3-88 Technical Specifications of APO Function at OCH (optical power
mode) .................................................................................................... 3-77
Table 3-89 Technical Specifications of APO Function at OCH (OSNR mode) ........... 3-77
Table 3-90 Technical Specifications of the IWF Function ......................................... 3-78

V
Tables

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Glossary
AFEC
- Advanced Forward Error Correction
APR
- Automatic Power Reduction
APSD
- Automatic Power Shutdown
AWG
- Array Waveguide Grating
DCM
- Dispersion Compensation Module
DFB-LD
- Distributed Feedback Laser Diode
DWDM
- Dense Wavelength Division Multiplexing
EA
- Electrical Absorption

EDFA
- Erbium Doped Fiber Amplifier

EMI
- Electromagnetic Interference
FC
- Fiber Channel
FEC
- Forward Error Correction
GE
- Gigabit Ethernet
NRZ
- Non-Return to Zero
OMS
- Optical Multiplex Section

OSNR
- Optical Signal-Noise Ratio
OTM
- Optical Terminal Multiplexer

VII
ZXWM M920 Product Descriptions

OTN
- Optical Transport Network
PDL
- Polarization Dependent Loss
PMD
- Polarization Mode Dispersion
QoS
- Quality of Service
ROADM
- Reconfigurable Optical Add/Drop Multiplexer
SDH
- Synchronous Digital Hierarchy
TFF
- Thin Film Filter
VLAN
- Virtual Local Area Network

VOA
- Variable Optical Attenuator
XFP
- 10-Gigabit Samll Form-Factor Pluggable

VIII

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