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Automatic Analog IC
Sizing and Optimization
Constrained with PVT
Corners and Layout
Effects
Automatic Analog IC Sizing and Optimization
Constrained with PVT Corners and Layout Effects
Nuno Lourenço Ricardo Martins
•
Nuno Horta
123
Nuno Lourenço Nuno Horta
Instituto de Telecomunicações, Instituto Instituto de Telecomunicações, Instituto
Superior Técnico Superior Técnico
Universidade de Lisboa Universidade de Lisboa
Lisbon Lisbon
Portugal Portugal
Ricardo Martins
Instituto de Telecomunicações, Instituto
Superior Técnico
Universidade de Lisboa
Lisbon
Portugal
Over the past few decades, very large scale integration technologies have been
widely improved, allowing the proliferation of consumer electronics and enabling
the steady growth of the integrated circuit (IC) market to an estimated value of over
$350 billion in 2016. The steady increase in performance of ICs in the recent past
has been mostly supported by an exponential growth in the density of transistors
while inversely reducing the transistors’ cost, as described by Moore’s law. Even
though it is still valid today, its end, as such an exponential law “can’t continue
forever” was already preconized by Moore itself, and is pushing for new techno-
logic advancements outside complementary metal-oxide-semiconductor (CMOS)
IC design. In the meanwhile, telecommunications, medical, and multimedia
applications extensively use of electronic devices where blocks of analog and
mixed-signal (AMS), digital processors and memory blocks are integrated together.
While AMS components in these system-on-a-chip (SoC) designs usually occupy
approximately 20 % of the die area, the design effort and respective design costs are
considerably higher in comparison to their digital counterpart. In this context, the
lack of mature automation tools for analog design has its share of blame in this SoC
design paradigm.
Generally the complexity in the design of analog circuits is not due to the
number of devices, but from their sensitivity to noise and the countless interactions
between them, e.g., parasitic disturbances, crosstalk, substrate noise, thermal noise,
etc. Plus, for smaller technology nodes with the increasing complexity of design
rules and physical effects, the impact of these interactions is even greater. Despite
the algorithms and techniques introduced in the last 25 years, analog IC design
automation tools still strive to keep up with the new challenges created by tech-
nological evolution. Therefore, designers’ exploration of the solution space keeps
on being mostly manual, and their knowledge and experience crucial in making
effective decisions at all stages of the analog design flow, creating additional risks
and elongating the time needed to complete the design. On the other hand, in the
digital IC design realm several mature electronic design automation (EDA) tools
and design methodologies are available, pushing the design productivity forward.
vii
viii Preface
Currently most of the low-level phases of the process are automated that help the
designers keeping up with the new capabilities offered by the technology and
making design reuse the commonplace. Since this difference in the level of
automation becomes critical when digital and analog circuits are integrated toge-
ther, the rising of efficient and state-of-the-art tools to boost analog designers’
productivity is an intensive research topic in both academia and industry.
The work presented in this book belongs to the scientific area of electronic
design automation and addresses automatic sizing of analog ICs. The developed
multi-objective design methodology for automatic analog IC sizing was imple-
mented in the tool AIDA-C. In AIDA-C, the usage of state-of-the-art multi-
objective multi-constraint optimization engines enables the exploration of circuit
design trade-offs. Process variation effects on circuit’s performance are accounted
with user-defined worst-case corners, and circuit’s performance evaluation is done
with industrial circuit simulators, e.g., Mentor Graphics’ ELDO®, Synopsys’
HSPICE®, or Cadence’s Spectre®, ensuring that the developed automatic circuit
sizing is compliant with the accuracy requirements of analog designers. In addition,
layout effects are included in the sizing-flow to decrease the number of independent
sizing and layout iterations required to obtain a post-layout correct design. To
further enhance AIDA-C, a model for first-order interactions between design
variables and circuit performance, the Gradient Model, derived using machine
learning techniques, is used to guide and accelerate the optimization process. The
proposed approach was validated with both classical and new analog circuit
structures for a several design processes, i.e., 130-nanometer, 180-nanometer, and
350-nanometer design kits, showing its validity and generality.
This work would not have been possible without the contribution, and the
support and valuable discussions on circuits, layout and optimization, of Ricardo
Póvoa, António Canelas, Frederico Rocha, and Ricardo Lourenço.
Finally, the authors would like to express their gratitude for the financial support
that made this work possible. The work developed in this book was supported in
part by the Fundação para a Ciência e a Tecnologia (Grant FCT-SFRH/BPD/
104648/2014, Grant FCT-SFRH/BD/86608/2012, Research project DISRUPTIVE
EXCL/EEI-ELC/0261/2012 and Research project UID/EEA/50008/2013) and by
the Instituto de Telecomunicações (Research project OPERA-PEst-OE/EEI/
LA0008/2013).
This book is organized in eight chapters.
Chapter 1 presents a brief introduction to analog IC design automation, with
special emphasis to automatic circuit sizing and optimization taking into account
layout effects and random variations. The motivation to address automatic analog
IC design is given, then, a well-accepted design flow for analog ICs that is the
starting point for the methodology proposed in this book is described.
Chapter 2 presents a study of the available tools for analog design automation,
overviewing state-of-the-art sizing optimization, robust design and layout-driven
approaches. Valuable information can be gathered from them, such as algorithms
and evaluation methods.
Preface ix
Chapter 3 introduces the developed automatic flow for analog IC design and
particularly the general description of the developed methodology providing more
detail about the inputs and interfaces of AIDA-C.
Chapter 4 describes the multi-objective optimization techniques used in
AIDA-C, addressing the non-dominated sorting genetic algorithm II (NSGA-II),
multi-objective simulated annealing (MOSA) and multi-objective particle swarm
optimization (MOPSO) algorithms. The enhancements made by using machine
leaning techniques, i.e., the Gradient model, are also explored.
Chapter 5 studies the results obtained with the proposed IC sizing approach with
different parameters for the optimization kernel, the impact of considering nominal
or worst-case conditions in the evaluation of the circuits, and also, the advantages of
enhancing the optimization kernels with the gradient model. Also, two amplifiers
and an oscillator are used to compare the performance of the three optimization
kernels (NSGA-II, MOSA MOPSO).
Chapter 6 presents two new methodologies to include layout effects in the sizing
optimization loop: the floorplan-aware approach, which is a method to include
layout’s geometric properties in the optimization with negligible impact in the
performance; and the layout-aware approach that accounts for the parasitic effects.
Chapter 7 presents the results obtained with the proposed analog layout-aware
sizing approach, by considering the circuit’s floorplan and layout induced para-
sitics. The efficiency of the methodology is proved in the successful design and area
improvement of four design cases: a single-stage folded cascode amplifier with bias,
a single-stage amplifier with gain enhancement using voltage combiners, a
two-stage Miller amplifier, and a two-stage folded cascode amplifier, for a
130-nanometer design process.
In Chap. 8, the closing remarks and future directions for the continuous
development of AIDA-C are outlined.
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Analog IC Design Automation . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1.1 Robustness in Analog IC Design. . . . . . . . . . . . . . . . . . . 3
1.1.2 Computer Assisted Analog IC Design . . . . . . . . . . . . . . . 5
1.2 Analog IC Design Flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.3 Automatic Analog Circuit-Level Sizing . . . . . . . . . . . . . . . . . . . 7
1.4 Contributions to the State-of-the-Art . . . . . . . . . . . . . . . . . . . . . 8
1.5 Conclusion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2 Previous Works on Automatic Analog IC Sizing . . . . . . . . . . ..... 13
2.1 Analog IC Sizing Automation: An Historical Perspective . . ..... 13
2.2 Optimization-Based Circuit Sizing . . . . . . . . . . . . . . . . . . ..... 14
2.2.1 Optimization Techniques Applied to Analog Circuit
Sizing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.2.2 Circuit’s Performance Evaluation . . . . . . . . . . . . . . . . . . 16
2.2.3 Commercial Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2.3 Robust Circuit Optimization . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2.3.1 Worst-Case Optimization . . . . . . . . . . . . . . . . . . . . . . . . 21
2.3.2 Commercial Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2.4 Layout-Aware Sizing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2.5 Summary of the Automatic Circuit Sizing Approaches . . . . . . . . . 26
2.5.1 Contributions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
2.6 Conclusions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
3 AIDA-C Architecture. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
3.1 AIDA Environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
3.2 AIDA-C Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
3.2.1 Setup and Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . 41
3.2.2 Circuit Optimizer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
xi
xii Contents
Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181
Abbreviations
xv
xvi Abbreviations
xvii
xviii List of Figures
Figure 3.13 Part of the XML description of the layout guides (floorplan.
xml), showing the constructs and illustrating the hierarchy,
with part of the sub-floorplan file for partition
P1A shown inline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 50
Figure 3.14 AIDA GUI—Main panel . . . . . . . . . . . . . . . . . . . . . . . . .. 51
Figure 3.15 AIDA Optimizer setup controls. a Sizing settings.
b Objectives and constraints. c Variable ranges.
d Measures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 52
Figure 3.16 AIDA-C—Manual edit tool. . . . . . . . . . . . . . . . . . . . . . . .. 55
Figure 3.17 AIDA typical plus corners monitoring plots.
a Convergence plot. b Historic front plot . . . . . . . . . . . . . .. 56
Figure 3.18 Reuse: changing the topology and reusing the previous
solutions as starting point. a Convergence plot. b Historic
front plot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 58
Figure 3.19 Reuse: changing the topology and (re)sizing from scratch.
a Convergence plot. b Historic front plot . . . . . . . . . . . . . .. 59
Figure 3.20 Reuse: moving to another technology. . . . . . . . . . . . . . . . .. 59
Figure 3.21 Reuse: (re)sizing in another technology. a Convergence plot.
b Historic Front plot . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 60
Figure 4.1 Schematic of the simple differential amplifier
and testbench . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 64
Figure 4.2 Algorithms implemented in AIDA-C’s
optimization kernel . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 67
Figure 4.3 Fronts for multiple ranks, and crowding distance
illustration for solution B . . . . . . . . . . . . . . . . . . . . . . . . .. 70
Figure 4.4 Particle update in PSO . . . . . . . . . . . . . . . . . . . . . . . . . . .. 74
Figure 4.5 Different methods to redistribute elements in the parallel
multi-kernel approach. a Shuffle. b Best. c Sorted . . . . . . . .. 76
Figure 4.6 Latin hypercube design with 2 variables and 5 levels.
a Design with poor space-filling. b Design with good
space-filling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 80
Figure 4.7 Perturbation p.d.f . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 84
Figure 4.8 Gradient rules in the mutation operator. . . . . . . . . . . . . . . .. 85
Figure 5.1 Single-ended folded cascade amplifier; a schematic;
b test-bench . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 88
Figure 5.2 POFs for various crossover rates (32 elem, 200 gen) . . . . . .. 90
Figure 5.3 POFs for various mutation % (32 elem, 200 gen) . . . . . . . .. 90
Figure 5.4 Single stage amplifier with gain enhancement using
voltage combiners . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 91
Figure 5.5 Dispersion of the POF limits: a Maximum FOM for various
P/G setups; b Maximum GDC for various P/G setups . . . . .. 93
Figure 5.6 10 POF obtained with P = 128 and G = 1000 . . . . . . . . . . .. 94
Figure 5.7 POF obtained using the 3 design strategies T, TC and C . . .. 95
List of Figures xix
Figure 5.26 Evolution of the best P, PN, and FOM with the number
of simulations in the LC-VCO runsets. a Runset I—best
power consumption. b Runset II—best power consumption.
c Runset I—best phase noise. d Runset II—best phase noise.
e Runset I—best figure of merit. f Runset II—best
figure of merit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
Figure 5.27 LC-VCO multi-objective optimization result for corner
conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
Figure 6.1 Traditional design flow: iterations between electrical
and physical design phases . . . . . . . . . . . . . . . . . . . . . . . . . 122
Figure 6.2 Optimization based layout-aware sizing flow . . . . . . . . . . . . . 123
Figure 6.3 Floorplan-aware evaluation flow . . . . . . . . . . . . . . . . . . . . . 124
Figure 6.4 A set of placement solutions for the same template
and same sizing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
Figure 6.5 Analog Module Generator architecture . . . . . . . . . . . . . . . . . 126
Figure 6.6 Example of transistors produced by the AMG: a Folded
transistor of 4 fingers with connections over the device;
b Folded transistor with 22 fingers, 2 rows and connections
outside the device; c Merge of 2 transistors, one with
2 fingers, the other with 10, with both gates and sources
connected; d Interdigitated of two transistors with 6 fingers;
e Common-centroid of 2 transistors with
16 fingers each . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
Figure 6.7 Example of passive devices produced by the AMG.
a MOM capacitor. b MIM capacitor.
c Polysilicon resistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
Figure 6.8 B*-Tree and Slicing-Tree showing the flexibility
of the non-slicing structure for different sizes . . . . . . . . . . . . 129
Figure 6.9 Multiple B*-Trees extracted from the floorplans . . . . . . . . . . 130
Figure 6.10 Devices generated using the AMG and corresponding
bounding box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
Figure 6.11 Multiple floorplan packing for a sizing solution: a, b,
c B*-Trees; d placement for the B*-Tree (a) with an area
of 361.7 µm2; e placement for the B*-Tree (b) with an area
of 634.7 µm2; f placement for the B*-Tree (c) with an area
of 448.6 µm2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
Figure 6.12 Best placement showing the devices’ layout. Reprinted from
Integration, the VLSI Journal, 48, Nuno Lourenço, António
Canelas, Ricardo Póvoa, Ricardo Martins, Nuno Horta,
Floorplanaware analog IC sizing and optimization based on
topological constraints, 183–197, Copyright (2015), with
permission from Elsevier . . . . . . . . . . . . . . . . . . . . . . . . . . 133
Figure 6.13 Layout-aware evaluation flow . . . . . . . . . . . . . . . . . . . . . . . 134
List of Figures xxi
Figure 7.8 Floorplan T3c for the two-stage Miller amplifier obtained
from the combination of T3 with P1c. Reprinted
from Lourenço [3], Copyright (2015), with permission
from Elsevier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152
Figure 7.9 Fronts obtained with 5 runs for the four scenarios high-
lighting the WCPF. Reprinted from Lourenço [3], Copyright
(2015), with permission from Elsevier . . . . . . . . . . . . . . . . . 153
Figure 7.10 WCPF fronts for the 4 scenarios, identifying the most
frequent floorplans in the scenario with the 12 floorplans.
Reprinted from Lourenço [3], Copyright (2015), with
permission from Elsevier . . . . . . . . . . . . . . . . . . . . . . . . . . 154
Figure 7.11 Pareto fronts for the new specifications of the two-stage
Miller amplifier, obtained with 3 runs for the four scenarios,
highlighting the WCPF. Reprinted from Lourenço [3],
Copyright (2015), with permission from Elsevier . . . . . . . . . . 155
Figure 7.12 WCPF fronts for the 4 scenarios, identifying the floorplans
most used in the scenario with the 12 floorplans for the new
specifications. Reprinted from Lourenço [3], Copyright
(2015), with permission from Elsevier . . . . . . . . . . . . . . . . . 156
Figure 7.13 Placement for the designs showing a gain of 55 dB in all
scenarios: a Sum of devices’ area; b T1a; c T3c;
d All (all layouts are shown in the same scale).
Reprinted from Lourenço [3], Copyright (2015),
with permission from Elsevier . . . . . . . . . . . . . . . . . . . . . . . 157
Figure 7.14 Floorplan and layout-aware optimization POFs . . . . . . . . . . . 160
Figure 7.15 Layout for the 51 dB designs: a Layout for the 53 dB
solution of the traditional simulation-based sizing, obtained
using AIDA-L; b Layout obtained using the layout-aware
flow, with only global routing for the 51 dB solution.
c Layout after the detailed routing . . . . . . . . . . . . . . . . . . . . 161
Figure 7.16 Layout for the 75 dB (d–f) designs: a Layout for the 75 dB
solution of the traditional simulation-based sizing, obtained
using AIDA-L; b Layout obtained using the layout-aware
flow, with only global routing for the 75 dB solution;
c Layout after the detailed routing . . . . . . . . . . . . . . . . . . . . 162
Figure 7.17 Floorplan, layout-aware and layout-aware after floorplan
corner optimization POFs . . . . . . . . . . . . . . . . . . . . . . . . . . 164
Figure 7.18 Schematic of the two-stage folded cascode amplifier.
Reprinted from Lourenço [2], Copyright (2016), with
permission from Elsevier . . . . . . . . . . . . . . . . . . . . . . . . . . 165
Figure 7.19 Floorplan templates for the two-stage folded cascode
amplifier. Reprinted from Lourenço [2], Copyright (2016),
with permission from Elsevier . . . . . . . . . . . . . . . . . . . . . . . 166
List of Figures xxiii
xxv
xxvi List of Tables
In the last decades very large scale integration technologies have been widely
improved, allowing the proliferation of consumer electronics and enabling the steady
growth of the IC market from $10 billion in 1980 to an estimated value of over than
$350 billion in 2016 [1]. The steady increase in performance of ICs in the recent past
has been mostly supported by an exponential growth in the density of transistors
while inversely reducing the transistors’ cost, as described by Moore’s law [2].
Moore’s law is a law of economics not physics, and Moore itself already preconized
its end, as such an exponential law “can’t continue forever” and is pushing for new
technologic advancements outside complementary metal-oxide-semiconductor
(CMOS) IC design, but it is still valid today.
In this context, the increasing need of faster, optimized and reliable electronic
devices urges their cost-effective development to efficiently meet customers’
demand under highly competitive time-to-market pressure [3]. Moreover, the
design of such complex multimillion transistor ICs is only possible because
designers are assisted by computer aided design (CAD) and design automation tools
that support the design process.
As analog ICs are difficult to design and reuse, designers have been replacing analog
circuits by digital computing whenever possible. Hence, most of the high-level
functions are implemented using digital or digital signal processing, however analog
and radio frequency (RF) circuitry is needed to interface with the real world, and
some functionalities that are intrinsically analog [3, 4] are listed below:
• Sensing the system inputs: The signals of a sensor, microphone or antenna has
to be detected or received, amplified and filtered, to enable digitalization with
good signal-to-noise and distortion ratio. Typical applications of these circuits
are in sensor interfaces, telecommunication receivers or sound recording;
design task. Generally the complexity of designing analog circuits’ is not due to the
number of devices, but from the countless interactions between them. Plus, for
smaller technology nodes with the increasing complexity of design rules and
physical effects, the impact of these interactions is even greater.
Due to the nature of the signals handled, analog circuits are more sensitive to
parasitic disturbances, crosstalk, substrate noise, supply noise, thermal noise, etc.,
and the variety of schematics and diversity of devices’ sizes and shapes are much
larger [4, 8]. The result of this automation deficit is that, while analog parts in a SoC
occupy only approximately 20 % of the global circuit area, as shown in Fig. 1.1,
the design effort is considerably higher in comparison to the design effort of the
digital section.
This difference in the level of automation between analog and digital design is
because analog is, in general, less systematic, more heuristic and knowledge
intensive than the digital counterpart, and becomes critic when digital and analog
circuits are integrated together. As the analog automation tools do not progress at
the same pace of technology, knowledge and experience of the designer is always
crucial for making decisions at all stages of the analog design flow.
In short, the development time of analog blocks is considerably higher when
compared to the development time of the digital one. The three main reasons for the
larger development time are: there is a lack of effective EDA tools; analog circuits
are being integrated using technologies optimized for digital circuits; and, analog
blocks are difficult to reuse because they are more sensitive to surrounding circuitry,
environmental and process variations than their digital counterpart [3, 4].
benefits. This is especially true for analog circuits. The reduced size and high
density of devices in modern ICs add new challenges to analog designers, as the
effects of non-idealities and variability of the fabrication process parameters in both
space and time became more significant. This phenomenon affects devices in dif-
ferent chips but also devices within the same chip, and is solved by robust circuit
design with several compensatory techniques [11] to ensure that the vast majority of
the fabricated circuits will work according to specifications.
The most common techniques for analog design centering are Monte Carlo
Simulation, process, voltage and temperature (PVT) Corners and Worst Case
Corners. Monte Carlo simulation executes many simulations by applying random
variations to circuit’s and process’ parameters, making a stochastic sampling of the
behaviors of the circuit in real world conditions. PVT Corner is a worst-case
approach where the circuit is simulated over multiple combinations of extreme
process parameters, voltage supply and temperature variations. Another kind of
worst case approach is the worst case corners, which are the set of environment and
process parameters that lead to the worst case value for performance figures.
Figure 1.2 illustrates 8 corners cases obtained by considering 3 values for power
supply, operating temperature and process parameters, together with a set of Monte
Carlo samples around the nominal performance for performance figures P1 and P2,
and the worst case corners for each performance (higher is better) [12].
Layout-induced parasitic effects are also more and more significant, having the
potential to affect noticeably the performance of the sized circuit. To overcome the
increasing impact of layout parasitic effects in circuit’s performance, sizing and
layout design phases tend to overlap. The integration of layout generation or
layout-related data in the sizing optimization process helps to account for the effects
of such non-idealities and parasitic disturbances earlier in the design flow, reducing
the number of iterations required to achieve designs that meet post-layout specifi-
cations. It is also important to note that careful layout considerations, like sym-
metry, matching, isolation, proximity, thermal balancing, etc., really help to
mitigate some of the problems introduced by the spatial variability [13–15].
Worst P1
P1
1.1 Analog IC Design Automation 5
The systems’ complexity and the extremely competitive markets obligate the use of
CAD tools to enhance the design process. Today’s analog design environment is
made of CAD tools for analog IC design editing, evaluation and verification that are
mature and fully deployed in the industrial environment, the following list some
examples:
• Simulation tools: ADiT, Questa and Eldo [16]; HSPICE, nanosim and HSim
[17]; Spectre [18]; SMASH [19].
• Layout edition: Virtuoso Layout Editor [18]; IC Station Layout [16]; Galaxy
Custom Designer LE [17].
• Design rule verification and layout extraction: DIVA and Assura [18]; Hercules
[17]; CALIBRE [16].
• Integrated platforms like Mentor Graphics IC design Manager [16] or Cadence
Virtuoso Analog Design Environment [18].
The time required to manually implement an analog project is usually of weeks
or months, which is in opposition to the market pressure to accelerate the release of
new and high performance ICs. To address all these difficulties and solve the
problems, EDA tools are a solution increasingly strong and solid. Some commercial
automation solutions began to emerge as the result of the research efforts in this
field, such as ADA’s Genius product line and Magma Titan that were integrated in
Synopsys (2004 and 2012 respectively) [17], the circuit optimizer feature of
Cadence’s Virtuoso Custom Design Platform GXL [18], Solido’s Fast PVT, Fast
Monte Carlo and High-Sigma Monte Carlo [20] or MunEDA’s WiCkeD™ [21].
Even if applicable only at cell level, analog components with 10–100 devices [8],
they increase the automation level of the analog design environment.
Despite its fundamental aid to designers, the automation options are limited and
the ones available are not usually used by the majority of the designers. These tools
should play a key role in analog IC design productivity, as they speed up the design
process and increase tractability. However, the lack of mature and robust
automation tools still leads to handcrafted design, and analog design automation is
still a topic of intensive research effort.
Before proceeding into analog IC circuit design automation details, a brief overview
on the analog design flow is first provided. Due to the nature of analog design, it is
difficult to identify one unique design flow. Nevertheless, a typical and well
accepted design flow for AMS ICs was proposed by Gielen and Rutenbar in [4]. It
consists of a series of top-down topology selection and circuit sizing steps and
bottom-up layout generation and extraction steps. Before passing between any of
6 1 Introduction
System Circuit-Level
Level
Backtracking Topology
Redesign
Redesign Tradicional
Circuit Sizing Extraction
Circuit
Level
Layout
Verification
Backtracking Generation
Validation
Device
Level
Specification Layout
More Top-Down Electrical Bottom-Up Physical
Concrete Synthesis Synthesis
Fig. 1.3 Hierarchical level and design tasks of design flow architectures
the hierarchy levels, in both top-down and bottom-up path, verification is performed
to ensure the specifications are met. The design flow is illustrated in Fig. 1.3,
considering only system-level and cell-level without the loss of generality.
On the top-down path, the Topology Selection is the process where a set of
blocks and the connections between them in defined in order to implement the input
specifications of the current hierarchy level. In the Circuit Sizing task, the
higher-level specifications are translated in the specifications for each of the blocks.
Block specifications may be the definition of the DC Gain and Bandwidth for an
amplifier, or the sizes of the transistors, depending on the models used in that
abstraction level. The sizing is then verified to ensure the fulfillment of the input
specifications. Then, the specifications for each block are passed to the next level of
the hierarchy, and the process is repeated until the layout of the innermost block is
done. At this point, the bottom-up flow is executed. First, the layout of the current
level is generated from the layouts of the deeper hierarchy, then, the layout is
extracted to a model suitable for verification. When the top-most level verification
is complete, the system is designed. It is important to note that any of the many
verification stages throughout the design cycle may detect potential problems, with
the design failing to meet the target specifications. In that case, backtracking and
redesign will be needed.
The number of hierarchy levels depends on the complexity of the system being
handled and there are no generally accepted representations. The same authors in
[22] defined the cell-level and system-level, where the cell-level was defined as
analog components with 10–100 devices, examples of such circuits are OTAs,
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Language: English
WHIST
OR
BUMBLEPUPPY
THIRTEEN LECTURES ADDRESSED
TO CHILDREN.
BY
PEMBRIDGE.
“Ingenuas didicisse fideliter artes
Emollunt mores, nec sinuisse feros.”—The Newcomes.
London:
FREDERICK WARNE & CO.,
Bedford Street, Strand.
·
LONDON:
PRINTED BY GEO. W. JONES,
35 ST. BRIDE ST., E.C.
·
WHIST; OR BUMBLEPUPPY?
———
“We have been rather lengthy in our remarks on this
book, as it is the best attempt we have ever seen to
shame very bad players into trying to improve, and also
because it abounds with most sensible maxims, dressed
up in a very amusing and palatable form.”—The Field.
“‘Whist; or Bumblepuppy?’ is one of the most
entertaining and at the same time one of the soundest
books on Whist ever written. Its drollery may blind some
readers to the value of its advice; no man who knows
anything about Whist, however, will fail to read it with
interest, and few will fail to read it with advantage. Upon
the ordinary rules of Whist ‘Pembridge’ supplies much
sensible and thoroughly amusing comment. The best
player in the world may gain from his observations, and a
mediocre player can scarcely find a better counsellor.
There is scarcely an opinion expressed with which we do
not coincide.”—Sunday Times.
“Lectures on the points most essential to the
acquisition of a complete knowledge of the game. The
lessons here given will well repay perusal.”—Bell’s Life.
“All true lovers of Whist will give a hearty welcome to
this work. It is a small book, but full of weighty matter.
We have not space to analyse the positive rules laid down
by ‘Pembridge’ for the guidance of those who wish to
qualify as Whist players. Suffice it to say that they are all
sound, and most of them worth committing to
memory.”—Sportsman.
“It would be very easy to write at greater length than
we have done in praise of ‘Pembridge’s’ little book. But
we have said enough to indicate its nature and scope;
and we feel sure that any of our readers who may meet
with it will endorse our verdict that it is a real addition to
the literature of Whist.”—Australasian.
CONTENTS.
page
LECTURE I.—Introductory 1
LECTURE II.—The Lead 11
LECTURE III.—The Play of the Second, Third, and Fourth Hand 26
LECTURE IV.—Discarding, and its Difficulties 32
LECTURE V.—The Discard from the Strongest Suit (Part I.; Part II.) 46
LECTURE VI.—The Eleven Rule 55
LECTURE VII.—The Peter and its Peculiarities 59
LECTURE VIII.—False Cards, Logic, Luck 69
LECTURE IX.—Whist as an Investment 74
LECTURE X.—On Things in General 81
LECTURE XI.—Thinking 93
LECTURE XII.—Temper 99
LECTURE XIII.—Deterioration of Whist, its Causes and Cure 105
BUMBLEPUPPY IN EXCELSIS 111
THE DOMESTIC RUBBER, Double Dummy 113
EPILOGUE I. 115
EPILOGUE II. 117
PREFACE.
——
These remarks are addressed to the young, in the hope that when
they arrive at man’s estate they will use their best endeavours to do
away with Law 91.
To the present generation, already acquainted with “the Game,” I
should no more presume to offer advice than I should presume to
teach my lamented Grandmother to suck eggs, if she were still alive.
“To instruct them, no art could ever reach,
No care improve them and no wisdom teach.”
Proverbs, chap. 27, v. 22.
LECTURE I.
——
INTRODUCTORY.
——
“Vacuis committere venis
Nil nisi lene decet.”—Eton Grammar.
“Those that do teach young babes
Do it with gentle means and easy tasks.”—Shakespeare.
T he play of the entire hand often depends upon the very first card
led, and the confidence your partner has that your lead is
correct; whatever then your original lead may be, let it be a true and
—as far as you can make it so—a simple lead: never lead an
equivocal card—that is one which may denote either strength or
weakness—if you can, lead a card about which no mistake is
possible.[6] With the original lead, follow the books and lead your
strongest suit; if you have nothing at all, do as little mischief as you
can; in this pitiable condition the head of a short suit—as a knave or
a ten—is better than the lowest or lowest but one of five to the nine;
your partner, when he sees the high card led, knows at once
(assuming he knows anything) that he will have to save the game
himself if it can be saved, and will take the necessary steps to that
end. Though there is ancient and modern authority for this,[7] I am
perfectly aware that (according to the latest theory) it is heresy; I
am also aware, and the reflection gives me quite as much pain as
the heresy does, that leading a long weak suit with a bad hand and
no cards of re-entry is a losing game:
“Such courses are in vain
Unless we can get in again.”
to lead your longest suit when you are neither likely to get the lead
again, nor to make a trick in it if you do, is a “short and easily
remembered rule,” but is apt to bring its followers to grief; if I do so,
I know perfectly well that after the game is over I shall probably be
left with the two long cards of that suit, or I may have an
opportunity of discarding one or both of them before that crisis
arrives, but this is not the slightest consolation to me.
While on the subject of heresy, I may as well refer to another
lead which has a special orthodoxy of its own. In all suits of four or
more, containing no sequence, unless headed by the ace, you either
lead the lowest, or, if you wish particularly to exhibit your knowledge
of the game, the lowest but one; but from king, knave, ten, &c., you
lead the ten, and if your object is a quiet life, you will continue to do
so; if you want to make tricks the advantage of the lead is not so
clear: if the second player holds ace, queen, &c., or queen and
another, you drive him into playing the queen, and so lose a trick,
which if you had led your lowest in the usual way, you might not
have done.[8]
Against this you have the set off that by leading the ten you
insure having the king-card of the suit in the third round, but it is
scarcely worth your while to go through so much to get so little; for
such a lead pre-supposes your partner to have neither ace, queen,
nor nine, and it is two to one that he holds one of them; if your
partner’s best card is below the nine, the tricks you will make will be
like angels’ visits, few and far between, whatever you lead; and why
you should take such a desponding view of an unplayed suit I am
not aware. The advantage of opening a suit in which you hold
tenace is not so great as to oblige you to handicap it by sending the
town-crier round with a bell to proclaim what that tenace is; late in
the hand it is often advisable to lead the knave.
With ace and four small cards and a bad hand, when weak in
trumps, I have found, from long experience, the ace to be a losing
lead, and being distinctly of the impression that for the ordinary
purposes of life, 13/4 = 2, as I am not always anxious to proclaim
the exact number of my suit, I generally lead a small one.
I am aware that the suit does not always go twice, or even once;
but that is the fault of the cards, not of the equation.
Of course, if, for any wise purpose, you feel you must have one
trick, take it at the first opportunity, irrespective of Cocker or any
other authority.
N.B.—When you, second, third, or fourth player have won the first
trick, whatever you may think, you are not the original leader, and
your lead then should be guided by your own hand; if it is a bad one
you are under no compulsion to open a suit at all, one suit is already
open, go on with that; if it also is a bad one, one bad suit is a less
evil than two bad suits, or opening a doubtful one in the dark; return
through strength up to declared weakness, or if it was your partner
who led, why should you show a suit unless you hold a good
sequence or strong trumps? Return his suit, yours will be led
sometime; whatever you won the trick with, he is in a better position
to defend himself as third player than if he had to lead it again
himself.
In returning your partner’s lead, if you had originally three, you
return the higher of the two remaining cards; in returning through
your adversary’s lead, if you hold the third best and another, play the
small one, for your partner may hold the second best single and they
would fall together.
Whenever you hold a suit with one honour in it, to lead that suit,
if you can avoid it, is about the worst use you can make of it. Should
you fail to see this, devote ten minutes—not when you are playing
whist, but on some wet half-holiday or quiet Sunday afternoon—to
thinking the matter over; even if you have a suit of king, queen to
three, why not be quiet? If anybody else opens the suit you will
probably make two tricks, if you open it yourself, probably one;
there is no hurry about it, you can always do that, but why you
should go out of your way to lead a suit in which you hold four to
the knave or five to the ten is incomprehensible.
It is not generally known (or if it is, it is never acted on, which
comes to the same thing) that neither in the ninety-one laws of
whist, nor in any of its numerous maxims, are you forbidden to play
the third round of a suit, even though the best card is notoriously
held by your opponent. It is a common delusion to fancy that when
a suit is declared against you, you can prevent it making by leading
something else, whereas you merely postpone the evil day, and do
mischief in the interval. Many feeble whist-players are unwilling ever
to let their opponents make a single trick; now this is unnecessarily
greedy; under no circumstances, at short whist, is it imperative to
make more than eleven. Allow your adversary to have two, it
amuses him and does not hurt you.
“It is less mischievous, generally, to lead a certain
losing card, than to open a fresh suit in which you are
very weak.”—What to Lead, by Cam.
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