ME150 Lecture 4
ME150 Lecture 4
Imperfections in Solids
1
Imperfections in Solids
ISSUES TO ADDRESS...
2
Imperfections in Solids
3
Imperfections in Solids
4
Imperfections in Solids
5
Imperfections in Solids
2D representation of a perfect
single crystal atomic arrangement
6
Imperfections in Solids
• Solidification- result of casting of molten material
– 2 steps
• Nuclei form
• Nuclei grow to form crystals – grain structure
• Start with a molten material – all liquid
7
Types of Imperfections
8
Point Defects in Metals
• Vacancies:
-vacant atomic sites in a structure.
Vacancy
distortion
of planes
• Self-Interstitials:
-"extra" atoms positioned between atomic sites.
self-
interstitial
distortion
of planes
9
Equilibrium Concentration:
Point Defects
• Equilibrium concentration varies with temperature!
Nv Q v
No. of potential = exp
N kT
Temperature
-23
(1.38 x 10 J/atom-K)
-5
(8.62 x 10 eV/atom-K)
defect sites
Each lattice site
N
is a potential N= r x A
vacancy site ACu
10
Boltzmann's constant
Measuring Activation Energy
Nv Nv slope
ln
N N
-Qv /k
exponential
dependence!
T
1/T
defect concentration
11
Estimating Vacancy Concentration
Find the equil. # of vacancies in 1 m3 of Cu at room temp.
(27C) and at 1000C
r = 8.4 g/cm 3 A Cu = 63.5 g/mol
Qv = 0.9 eV/atom NA = 6.02 x 1023 atoms/mol
Boltzmann constant =8.62 x 10-5 eV/atom-K
Temperature in Kelvin = 27C + 273 = 300 K
12
Other Point Defects
1.Vacancy (from previous section)
2. Self interstitial:
Large distortion in the surrounding lattice
Needed energy is 3 times larger than vacancies,
eq. concentration is very low
3. Interstitial impurity
4.5.Substitutional impurity
13
Imperfections in Metals (i)
Two outcomes if impurity (B) added to host (A):
• Solid solution of B in A (i.e., random dist. of point defects)
OR
14
Imperfections in Metals (ii)
Conditions for substitutional solid solution (S.S.)
• W. Hume – Rothery rule
– 1. r (atomic radius) < 15%
– 2. Proximity in periodic table
• i.e., similar electronegativities
– 3. Same crystal structure for pure metals
– 4. Valence
• All else being equal, a metal will have a greater tendency
to dissolve a metal of higher valence than one of lower
valence
15
Imperfections in Metals (iii)
Application of Hume–Rothery rules – Solid
Solutions Element Atomic Crystal Electro- Valence
Radius Structure nega-
(nm) tivity
1. Which elements Cu 0.1278 FCC 1.9 +2
C 0.071
completely dissolve H 0.046
O 0.060
in Cu and Fe? Ag 0.1445 FCC 1.9 +1
Al 0.1431 FCC 1.5 +3
Co 0.1253 HCP 1.8 +2
Cr 0.1249 BCC 1.6 +3
2. More Zn or Al Fe 0.1241 BCC 1.8 +2
Ni 0.1246 FCC 1.8 +2
in Cu? Pd 0.1376 FCC 2.2 +2
Zn 0.1332 HCP 1.6 +2
16
Interstitial Impurities
Carbon interstitial atom in
BCC iron
17
Composition
Average
Density of Alloy
Average Atomic Weight
of Alloy
18
Line Defects
Dislocations:
• are line defects,
• slip between crystal planes result when dislocations move,
• produce permanent (plastic) deformation.
slip steps
19
Imperfections in Solids
20
Imperfections in Solids
Edge Dislocation
21
Motion of Edge Dislocation
• Dislocation motion requires the successive bumping
of a half plane of atoms (from left to right here).
• Bonds across the slipping planes are broken and
remade in succession.
b
Dislocation
line
Burgers vector b (b)
(a)
Adapted from Fig. 4.4, Callister & Rethwisch 8e.
23
Edge, Screw, and Mixed Dislocations
Mixed
Edge
24
Dislocations
Dislocations are visible in electron micrographs
26
Planar Defects in Solids
Twin boundary
One case is a twin boundary (plane)
– Essentially a reflection of atom positions across the twin
plane.
Stacking faults
– For FCC metals an error in ABCABC packing sequence
– Ex: ABCABABC 27
Microscopic Examination
28
Optical Microscopy
• Useful up to 2000X magnification.
• Polishing removes surface features (e.g., scratches)
• Etching changes reflectance, depending on crystal
orientation.
crystallographic planes
Adapted from Fig. 4.13(b) and (c), Callister
& Rethwisch 8e. (Fig. 4.13(c) is courtesy
of J.E. Burke, General Electric Co.)
Micrograph of
brass (a Cu-Zn alloy)
0.75mm
29
Optical Microscopy
Grain boundaries...
• are imperfections,
• are more susceptible
to etching,
• may be revealed as polished surface
dark lines,
• change in crystal surface groove
orientation across grain boundary
(a)
boundary. Adapted from Fig. 4.14(a)
and (b), Callister &
ASTM grain Rethwisch 8e.
(Fig. 4.14(b) is courtesy
size number of L.C. Smith and C. Brady,
the National Bureau of
• Polarized light
– metallographic scopes often use polarized
light to increase contrast
– Also used for transparent samples such as
polymers
31
Microscopy
Optical resolution ca. 10-7 m = 0.1 m = 100 nm
For higher resolution need higher frequency
– X-Rays? Difficult to focus.
– Electrons
• wavelengths ca. 3 pm (0.003 nm)
– (Magnification - 1,000,000X)
• Atomic resolution possible
• Electron beam focused by magnetic lenses.
32
Electron Microscopy
•Scanning Tunneling Microscopy (STM)
•Scanning Electron Microscopy (SEM)
•Transmission Electron Microscopy (TEM)
33
34
35
Summary
• Point, Line, and Area defects exist in solids.
36