Chapter 2 - summary
Chapter 2 - summary
Other Connectors:
o Molex: 4-pin connector for legacy devices (5V, 12V).
Cooling Systems
1. Fan Cooling:
o Heat Sink: Passive metal block (usually aluminum or copper) that
draws heat away from components.
o Thermal Paste: Ensures efficient heat transfer between CPU and
heat sink.
o Case Fans: Circulate air within the case—cool air drawn from the
front and hot air expelled from the rear.
o Smart Fans: Controlled by temperature sensors to adjust speed as
needed.
2. Liquid Cooling:
o Used for high-performance systems (e.g., gaming PCs).
o Components:
2. Storage Devices
Mass Storage Technologies
Non-Volatile Storage: Retains data when the system is off.
Types:
o Magnetic (HDD): Spinning platters with magnetic coating.
Removable Storage
1. USB Flash Drives: Portable flash memory.
2. Memory Cards: Expandable storage for cameras and mobile devices
(e.g., SD cards).
3. Optical Drives: CD/DVD/Blu-ray for data storage and media playback.
RAM Types
DDR SDRAM (Double Data Rate Synchronous Dynamic RAM):
o DDR3: Older but still common.
Memory Channels
Single Channel: 64-bit pathway (slower).
Dual Channel: 128-bit pathway (faster).
Multi-Channel: Further improves data transfer speed.
Multicore Processors:
o CPUs with 2+ cores for improved multitasking (e.g., 8C/16T = 8
cores, 16 threads).
Virtualization (VT/AMD-V): Enables running multiple OS via virtual
machines (VMs).
CPU Compatibility
CPUs are vendor-specific (Intel vs. AMD).
Each motherboard supports a specific socket and CPU generation.
Categories:
o Desktop: General-use PCs (budget to high-end gaming).