LC29D (B,C,F)

Hardware Design

GNSS Module Series

Version: 1.1

Date: 2022-02-24

Status: Released
 GNSS Module Series

At Quectel, our aim is to provide timely and comprehensive services to our customers. If you
require any assistance, please contact our headquarters:

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Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai
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Or email us at: [email protected].

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 GNSS Module Series

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Copyright © Quectel Wireless Solutions Co., Ltd. 2022. All rights reserved.

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 GNSS Module Series

Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service,
or repair of any terminal or mobile incorporating the module. Manufacturers of the terminal should notify
users and operating personnel of the following safety precautions by incorporating them into all product
manuals. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

Ensure that the product may be used in the country and the required environment,
as well as that it conforms to the local safety and environmental regulations.

Keep away from explosive and flammable materials. The use of electronic
products in extreme power supply conditions and locations with potentially
explosive atmospheres may cause fire and explosion accidents.

The product must be powered by a stable voltage source, and the wiring shall
conform to security precautions and fire prevention regulations.

Proper ESD handling procedures must be followed throughout the mounting,

handling and operation of any devices and equipment that incorporate the module
to avoid ESD damages.

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 GNSS Module Series

About the Document

Document Information

Title LC29D (B,C,F) Hardware Design

Subtitle GNSS Module Series

Document Type Hardware Design

Document Status Released

Revision History

Version Date Description

- 2021-04-26 Creation of the document

1.0 2021-06-18 First official release

Numerous changes were made to this document; It should be read

in its entirety.
1. Deleted the applicable OC: LC29D (A) and added the
applicable OC: LC29D (F).
2. Reserved pin 15 (RTK_IND) and deleted the information
related to RTK (Chapter 1, 2 and 4.1.5).
3. Added the combination of constellation for testing the data of
power consumption and sensitivity, updated the power
1.1 2022-02-24 consumption data for LC29D (C) and the test conditions for
TTFF (with AGNSS) and Horizontal Position Accuracy
(Chapter 1.3).
4. Adjusted the order of sub-chapters within Chapter 1.5, 4
and 5.
5. Updated the content of QZSS, SBAS and DR (Chapter 1.5.6,
1.6.1 and 1.9).
6. Added the content of firmware update (Chapter 1.10).
7. Updated the figure of Pin Assignment and adjusted the

LC29D(B,C,F)_Hardware_Design 4 / 50
 GNSS Module Series

structure of Pinout (Chapter 2).

8. Updated the time for keeping the BOOT pin at high level
during startup to enable the module to enter the Boot
download mode (Chapter 2 and 4.2.2).
9. Specified the time limit for voltage rising during startup and
updated the recommended ripple (Chapter 3.3).
10. Updated the figure of Power-Down and Power-on Restart
Sequence (Chapter 3.4).
11. Deleted the chapter of LNA_EN.
12. Updated the figure of SPI Interface Reference Design
(Chapter 4.1.1).
13. Updated the content of IPPS (Chapter 4.1.5).
14. Updated the figure of Reset Sequence (Chapter 4.2.1).
15. Updated the figure of Recommended Footprint. (Chapter 5.3).
16. Added the content of supply current requirement
(Chapter 6.3).
17. Updated the figure of Top, Side and Bottom View Dimensions
(Chapter 7.1).
18. Updated the figure of Top and Bottom views of the Module
(Chapter 7.2).
19. Updated the packaging information about the module
(Chapter 8.1).
20. Updated the content of the storage, manufacturing and
soldering (Chapter 8.2 and 8.3).

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 GNSS Module Series

Contents

Safety Information ....................................................................................................................................... 3

About the Document ................................................................................................................................... 4
Contents ....................................................................................................................................................... 6
Table Index ................................................................................................................................................... 8
Figure Index ................................................................................................................................................. 9

1 Product Description........................................................................................................................... 10
1.1. Overview.................................................................................................................................. 10
1.1.1. Special Marks ................................................................................................................. 11
1.2. Features .................................................................................................................................. 11
1.3. Performance ............................................................................................................................ 13
1.4. Block Diagram ......................................................................................................................... 14
1.5. GNSS Constellations .............................................................................................................. 14
1.5.1. GPS ................................................................................................................................ 14
1.5.2. GLONASS ...................................................................................................................... 15
1.5.3. Galileo ............................................................................................................................ 15
1.5.4. BDS ................................................................................................................................ 15
1.5.5. QZSS .............................................................................................................................. 15
1.5.6. IRNSS ............................................................................................................................ 15
1.6. Augmentation System ............................................................................................................. 15
1.6.1. SBAS .............................................................................................................................. 15
1.7. AGNSS .................................................................................................................................... 16
1.8. Geofencing .............................................................................................................................. 16
1.9. Dead Reckoning Function ....................................................................................................... 16
1.10. Firmware Upgrade................................................................................................................... 16

2 Pin Assignment .................................................................................................................................. 17

3 Power Management ........................................................................................................................... 20

3.1. Power Supply .......................................................................................................................... 20
3.1.1. VCC ................................................................................................................................ 20
3.2. Power Mode ............................................................................................................................ 21
3.2.1. Continuous Mode ........................................................................................................... 21
3.3. Power-Up Sequence ............................................................................................................... 21
3.4. Power-Down Sequence .......................................................................................................... 21

4 Application Interfaces ....................................................................................................................... 22

4.1. IO Pins ..................................................................................................................................... 22
4.1.1. Communication Interfaces ............................................................................................. 22
4.1.1.1. Interface Selection (D_SEL) ........................................................................... 22
4.1.1.2. UART Interface ............................................................................................... 23
4.1.1.3. SPI Interface ................................................................................................... 23
4.1.2. GEOFENCE ................................................................................................................... 24
4.1.3. FWD ............................................................................................................................... 24

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 GNSS Module Series

4.1.4. WHEELTICK................................................................................................................... 25
4.1.5. 1PPS .............................................................................................................................. 25
4.2. System Pins ............................................................................................................................ 25
4.2.1. RESET_N ....................................................................................................................... 25
4.2.2. BOOT ............................................................................................................................. 26

5 Design ................................................................................................................................................. 28
5.1. Antenna Design ....................................................................................................................... 28
5.1.1. Antenna Specification..................................................................................................... 28
5.1.2. Antenna Selection Guide ............................................................................................... 28
5.1.3. Active Antenna Reference Design ................................................................................. 29
5.1.4. Passive Antenna Reference Design .............................................................................. 30
5.2. Coexistence with Cellular Systems ......................................................................................... 31
5.2.1. In-Band Interference ...................................................................................................... 31
5.2.2. Out-of-Band Interference ............................................................................................... 32
5.2.3. Ensuring Interference Immunity ..................................................................................... 32
5.3. Recommended Footprint ......................................................................................................... 34

6 Electrical Specification...................................................................................................................... 35
6.1. Absolute Maximum Ratings .................................................................................................... 35
6.2. Recommended Operating Conditions ..................................................................................... 35
6.3. Supply Current Requirement................................................................................................... 36
6.4. ESD Protection ........................................................................................................................ 37

7 Mechanical Dimensions .................................................................................................................... 38

7.1. Top, Side and Bottom View Dimensions ................................................................................. 38
7.2. Top and Bottom Views............................................................................................................. 39

8 Product Handling ............................................................................................................................... 40

8.1. Packaging ................................................................................................................................ 40
8.1.1. Carrier Tape.................................................................................................................... 40
8.1.2. Plastic Reel .................................................................................................................... 41
8.1.3. Packaging Process ........................................................................................................ 42
8.2. Storage .................................................................................................................................... 43
8.3. Manufacturing and Soldering .................................................................................................. 44

9 Labelling Information ........................................................................................................................ 46

10 Appendix References ........................................................................................................................ 47

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 GNSS Module Series

Table Index

Table 1: Special Marks ................................................................................................................................11

Table 2: Product Features ...........................................................................................................................11
Table 3: Product Performance.................................................................................................................... 13
Table 4: I/O Parameter Definition ............................................................................................................... 17
Table 5: Pin Description ............................................................................................................................. 18
Table 6: Data Interface Selection by Using D_SEL ................................................................................... 22
Table 7: Operating Modes .......................................................................................................................... 26
Table 8: Recommended Antenna Specifications........................................................................................ 28
Table 9: Intermodulation Distortion (IMD) Products ................................................................................... 32
Table 10: Absolute Maximum Ratings........................................................................................................ 35
Table 11: Recommended Operating Conditions ........................................................................................ 36
Table 12: Supply Current ............................................................................................................................ 37
Table 13: Carrier Tape Dimension Table (Unit: mm) .................................................................................. 40
Table 14: Plastic Reel Dimension Table (Unit: mm) ................................................................................... 41
Table 15: Recommended Thermal Profile Parameters .............................................................................. 44
Table 16: Related Documents .................................................................................................................... 47
Table 17: Terms and Abbreviations ............................................................................................................ 47

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 GNSS Module Series

Figure Index

Figure 1: Block Diagram ............................................................................................................................. 14

Figure 2: Pin Assignment ........................................................................................................................... 17
Figure 3: VCC Input Reference Circuit ...................................................................................................... 20
Figure 4: Power-Down and Power-on Restart Sequence .......................................................................... 21
Figure 5: UART Interface Reference Design ............................................................................................. 23
Figure 6: SPI Interface Reference Design ................................................................................................. 24
Figure 7: Reference OC Circuit for Module Reset ..................................................................................... 25
Figure 8: Reset Sequence ......................................................................................................................... 26
Figure 9: BOOT Pin State (Normal Operating Mode) ................................................................................ 27
Figure 10: BOOT Pin Control Sequence (Boot Download Mode) ............................................................. 27
Figure 11: Active Antenna Reference Design ............................................................................................ 29
Figure 12: Passive Antenna Reference Design ......................................................................................... 30
Figure 13: In-Band Interference on GPS L1 .............................................................................................. 31
Figure 14: Out-of-Band Interference on GPS L1 ....................................................................................... 32
Figure 15: Interference Source and Its Path .............................................................................................. 33
Figure 16: Recommended Footprint .......................................................................................................... 34
Figure 17: Top, Side and Bottom View Dimensions ................................................................................... 38
Figure 18: Top and Bottom Views .............................................................................................................. 39
Figure 19: Carrier Tape Dimension Drawing .............................................................................................. 40
Figure 20: Plastic Reel Dimension Drawing............................................................................................... 41
Figure 21: Plastic Reel Dimension Drawing............................................................................................... 42
Figure 22: Recommended Reflow Soldering Thermal Profile ................................................................... 44
Figure 23: Labelling Information................................................................................................................. 46

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 GNSS Module Series

1 Product Description

1.1. Overview

The Quectel LC29D module includes three variants: LC29D (B)*, LC29D (C) and LC29D (F)*. Unless
otherwise indicated, any information described in this document about LC29D applies to LC29D (B)*,
LC29D (C) and LC29D (F)*.

The Quectel LC29D module supports multiple global positioning and navigation systems: GPS,
GLONASS, Galileo, BDS, QZSS and IRNSS. The module also supports SBAS (including WAAS, EGNOS,
MSAS and GAGAN) and AGNSS functions.

Key features:

⚫ The Quectel LC29D module is a dual-band, multi-constellation GNSS module and features a
high-performance, high reliability positioning engine. The module facilitates a fast and precise GNSS
positioning capability.
⚫ The module supports serial communication interfaces UART and SPI.
⚫ The module integrates a 6-axis IMU and supports sophisticated dead-reckoning algorithms to fuse
the sensor data, GNSS raw data and speed data, etc.
⚫ The embedded flash memory provides the capacity for storing user-specific configurations and future
firmware updates.

The Quectel LC29D module is an SMD type module with a compact form factor of 12.2 mm × 16.0 mm ×
2.4 mm. It can be embedded in your applications through the 24 LCC pins.

The module is fully compliant with the EU RoHS Directive.

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 GNSS Module Series

1.1.1.Special Marks

Table 1: Special Marks

Mark Definition

Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface,
pin name, or argument, it indicates that the function, feature, interface, pin, or argument is
*
under development and currently not supported; and the asterisk (*) after a model indicates
that the sample of such model is currently unavailable.

1.2. Features

Table 2: Product Features

Features LC29D (B)* LC29D (C) LC29D (F)*

Industrial   
Grade
Automotive - - -

Standard Precision GNSS   

High Precision GNSS - - -

Category DR   

RTK - - -

Timing - - -

Supply Voltage 2.7–3.6 V, Typical: 3.3 V   

IO Voltage Typical: VCC   

UART   
Communication
SPI   
Interfaces
I2C - - -

Additional LNA   
Integrated
Additional SAW   
Features
RTC Crystal   

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 GNSS Module Series

TCXO Oscillator   

6-axis IMU   

L1 C/A   
GPS
L5   

GLONASS L1   

E1   
Galileo
E5a   

Constellations B1I   
BDS
B2a  - 

L1 C/A   
QZSS
L5   

IRNSS L5   

SBAS L1   

Temperature Operating Temperature Range: -40 °C to +85 °C

Range Storage Temperature Range: -40 °C to +90 °C
Physical Size: (12.2 ±0.15) mm × (16.0 ±0.15) mm × (2.4 ±0.20) mm
Characteristics Weight: Approx. 0.9 g

NOTE

For more information about GNSS constellation configuration, see document [1].

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 GNSS Module Series

1.3. Performance

Table 3: Product Performance

Parameter Specification LC29D (B)* LC29D (C) LC29D (F)*

Power Consumption 1 Acquisition 51 mA 38 mA 38 mA

(GPS + GLONASS + Galileo +
BDS + QZSS) Tracking 37 mA 38 mA 39 mA

Acquisition -148 dBm -148 dBm -148 dBm

Sensitivity
(GPS + GLONASS + Galileo + Reacquisition -157 dBm -157 dBm -157 dBm
BDS + QZSS)
Tracking -162 dBm -163 dBm -162 dBm

Cold Start 34 s 34 s 34 s
1
TTFF
Warm Start 30 s 30 s 30 s
(without AGNSS)
Hot Start 2s 2s 2s

TTFF 2
Cold Start 5s 5s 5s
(with AGNSS)
3
Horizontal Position Accuracy 1.0 m 1.2 m 1.0 m

1 Hz 1 Hz
Update Rate 1 Hz
(Max. 10 Hz) (Max. 10 Hz)

Accuracy of 1PPS Signal Typical accuracy: 100 ns

Velocity Accuracy Without aid: 0.1 m/s

Acceleration Accuracy Without aid: 0.1 m/s²

Maximum Altitude: 18000 m

Dynamic Performance Maximum Velocity: 515 m/s
Acceleration: 4g

1
Room temperature, all satellites at -130 dBm, except Galileo at -122 dBm.
2
Open-sky, active high-precision GNSS antenna.
3
CEP, 50%, 24 hours static, -130 dBm, more than 6 SVs.

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 GNSS Module Series

1.4. Block Diagram

The following figure shows a block diagram of the module. The module includes a GNSS IC, a 6-axis IMU,
two additional LNAs, two additional SAWs, a diplexer, flash memory, a TCXO and an XTAL. The diplexer
integrates two band-pass filters, which can improve the out-of-band rejection. Consequently, the LNAs
will have less chance to produce in-band interference in challenging environments, which ensures
enhanced performance in a jamming environment.

RF_IN VDD_RF VCC RESET_N

XTAL
32.768 kHz

DIP
RTC
L5 L1 UART/SPI
BOOT
CPU 1PPS
LNA LNA PMU ARM Cortex-M0
(low power) FWD
Low Power RAM

General Purpose IO
32 KB WHEELTICK
LNA_EN
GEOFENCE
SAW
SAW

6-axis
IMU
RF Front CPU
GNSS High- ARM Cortex-M4F
End
Sensitivity
Measurement
Integrated
Engine

Flash
LNA

2 MB
TCXO SRAM ROM
26 MHz 1.125 MB 1 MB

Figure 1: Block Diagram

1.5. GNSS Constellations

The Quectel LC29D module is a dual-band GNSS receiver that can receive and track GNSS signals.

1.5.1.GPS

The module is designed to receive and track GPS L1 C/A and L5 signals centered at 1575.42 MHz and
1176.45 MHz.

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 GNSS Module Series

1.5.2.GLONASS

The module is designed to receive and track GLONASS L1 signal ranging from 1598.0625 to
1605.375 MHz.

1.5.3.Galileo

The module is designed to receive and track Galileo E1 and E5a signals centered at 1575.42 MHz and
1176.45 MHz.

1.5.4.BDS

The module is designed to receive and track BDS B1I and B2a signals provided by the BDS Navigation
Satellite System centered at 1561.098 MHz and 1176.45 MHz. The ability to receive and track BDS
signals in conjunction with GPS results in higher coverage, improved reliability, and better accuracy.

1.5.5.QZSS

The Quasi-Zenith Satellite System (QZSS) is a regional navigation satellite system that transmits
additional GPS L1 C/A, L1C, L2C, and L5 signals for the Pacific region covering Japan and Australia. The
Quectel LC29D module can detect and track QZSS L1 C/A and L5 signals concurrently with GPS signals,
resulting in better availability especially under challenging conditions, i.e., in urban canyons.

1.5.6.IRNSS

The Indian Regional Navigation Satellite System (IRNSS) or NavIC is a regional navigation satellite
system that transmits additional L5 signals for complying with the requirements of an independent
accurate positioning system for users in India. The Quectel LC29D module is designed to receive and
track IRNSS L5 signals from IRNSS satellites centered at 1176.45 MHz.

1.6. Augmentation System

1.6.1.SBAS

The Quectel LC29D module supports SBAS signals reception. By augmenting primary GNSS
constellations with additional satellite-broadcast messages, the system improves the accuracy and
reliability of GNSS information by correcting signal measurement errors and providing information about
signal accuracy, integrity, continuity and availability. SBAS signals can also be used as additional signals
for ranging or distance measurement, thus further improving availability. Supported SBAS systems:
WAAS, EGNOS, MSAS and GAGAN.

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 GNSS Module Series

1.7. AGNSS

The module supports AGNSS feature that significantly reduces the module’s TTFF, especially under
lower signal conditions. To implement AGNSS feature, the module should get the assistance data
including the current time, rough position, and LTO data. For more information, see document [2].

1.8. Geofencing

The Quectel LC29D module supports geofence areas, defined on the Earth's surface using a 2D model.
Geofencing is active when at least one geofence area is defined. The current status can be found by
polling the receiver. The receiver evaluates whether the current location of each region is within that
region or not and signals its status via GEOFENCE pin (pin 16). Geofencing feature can be configured
using Quectel geofence messages. The evaluation is activated whenever one or more geofences are
configured. For more information about geofencing configuration, see document [1].

1.9. Dead Reckoning Function

The Quectel LC29D module supports dead reckoning which is the process of estimating the module’s
current position based on the last position obtained from GNSS, speed, heading sensor data, etc. With
these combined sensor inputs, the system plots the navigation trace when the satellite signals are
partially or completely blocked while satellite signals provide updates and correction for sensor drift. With
this technology, the system achieves continuous and high-accuracy positioning in environments such as
tunnels and urban canyons. For more information, see document [3].

1.10. Firmware Upgrade

The Quectel GNSS module is delivered with preprogrammed firmware. Quectel may release firmware
versions that contain bug fixes or performance optimizations. It’s highly important that customers
implement a firmware upgrade mechanism in their system. A firmware upgrade is a process of
transferring a binary file image to the receiver and storing it in non-volatile flash. For more information,
see document [4].

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 GNSS Module Series

2 Pin Assignment
The Quectel LC29D module is equipped with 24 LCC pins by which the module can be mounted on your
PCB.

1 BOOT GND 24

2 FWD VCC 23

3 1PPS RESERVED 22

4 WHEELTICK RXD/SPI_CS 21

5 D_SEL TXD/SPI_CLK 20

6 RESERVED LC29D RTS/SPI_MISO 19

7 RESERVED (Top View) CTS/SPI_MOSI 18

8 RESET_N SPI_REQ 17

9 VDD_RF GEOFENCE 16

10 GND RESERVED 15

11 RF_IN LNA_EN 14

12 GND GND 13

IO POWER GND SYSTEM ANT RESERVED

Figure 2: Pin Assignment

Table 4: I/O Parameter Definition

Type Description

AI Analog Input

DI Digital Input

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 GNSS Module Series

DO Digital Output

DIO Digital Input/Output

PI Power Input

PO Power Output

Table 5: Pin Description

Function Name No. I/O Description Remarks

Power VCC 23 PI Main power supply Provides clean and steady voltage.

TXD/ Transmits data/ When using UART Interface: D_SEL=1

20 DIO
SPI_CLK SPI clock (Pulled up internally by default)
RXD/ Receives data/ In Normal operating mode, the UART
21 DI
SPI_CS SPI chip-select interface can be used for standard NMEA

CTS/ Clear to send/ message output, PGLOR/PQTM

18 DI 4
SPI_MOSI SPI master out slave in command input and output, Bream
message input and output, and firmware
RTS/ Request to send/
19 DO upgrade. In this mode, the module
SPI_MISO SPI master in slave out
requires a two-wire UART (TXD and RXD)
SPI_REQ 17 DO Indicates SPI data validity only.
In Boot download mode, the UART
interface can be used for bootloader
upgrade. In this mode, the module
IO requires a four-wire UART (TXD, RXD,
CTS and RTS).
When using SPI Interface: D_SEL=0
(Pulled down externally with a 1 kΩ
Selects UART/SPI
D_SEL 5 DI resistor)
interface
The SPI interface can be used for standard
NMEA message output, PGLOR/PQTM
4
command input and output, Bream
message input and output, and firmware
upgrade. In this case, the module requires
a five-wire SPI (SPI_MOSI, SPI_MISO,
SPI_CLK, SPI_CS and SPI_REQ).
Forward/Backward
FWD 2 DI Pulled up internally by default.
direction

4
Bream is the chipset supplier dedicated protocol.

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 GNSS Module Series

WHEELTICK 4 DI Odometer wheel-tick input

Once the pin is activated, the receiver

continuously compares its current position
GEOFENCE 16 DIO Indicates geofence status to the preset geofence area.
If unused, leave the pin N/C (not
connected).
Synchronized on rising edge.
1PPS 3 DO One pulse per second If unused, leave the pin N/C (not
connected).
VDD_RF = VCC, the output current
capacity depends on VCC.
Power supply for external Typically used to supply power for an
VDD_RF 9 PO
RF components external active antenna or LNA.
If unused, leave the pin N/C (not
ANT
connected).

RF_IN 11 AI GNSS antenna interface 50 Ω characteristic impedance.

Power control for active If unused, leave the pin N/C (not
LNA_EN 14 DO
antenna connected).
Pulled down internally by default.
If the pin is kept floating during startup, the
Controls module startup module will enter Normal operating mode.
BOOT 1 DI
System mode If the pin is kept at high level for about
50 ms during startup, the module will enter
Boot download mode.
RESET_N 8 DI Resets the module Active low.
10,
Ensure a good GND connection to all GND
12,
GND GND - Ground pins of the module, preferably with a large
13,
ground plane.
24
6, 7,
These pins must be left floating and cannot
RESERVED RESERVED 15, - Reserved
be connected to power or GND.
22

NOTE

Leave RESERVED and unused pins N/C (not connected).

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 GNSS Module Series

3 Power Management
The Quectel LC29D module provides a power optimized architecture with built-in autonomous energy
saving capabilities to minimize power consumption at any given time. The receiver can be used in one
operating mode: Continuous mode for best performance.

3.1. Power Supply

3.1.1.VCC

The VCC is the supply voltage pin. The VCC pin supplies power for BB, RF and 6-axis IMU.

Module power consumption may vary by several orders of magnitude, especially when power saving
mode is enabled. Therefore, it is important that the power supply can sustain peak power for a short time,
ensuring that the load current does not exceed the rated value.

An LDO with a high PSRR should be chosen for good performance. In addition, a TVS, and a combination
of a 10 μF, a 100 nF and a 33 pF decoupling capacitor network should be added near the VCC pin. The
lowest value capacitor should be the closest to the module’s VCC pin.

An LDO voltage regulator with a fast discharge is recommended as the power supply. This can ensure a
quick voltage drop when the VCC power is cut.

It is not recommended to use a switching DC-DC power supply.

Module

VCC
PMU

TVS 10 µF 100 nF 33 pF

Figure 3: VCC Input Reference Circuit

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 GNSS Module Series

3.2. Power Mode

3.2.1.Continuous Mode

If VCC is powered on, the module automatically enters the Continuous mode that comprises acquisition
mode and tracking mode. In acquisition mode, the module starts to search satellites, and to determine
visible satellites, coarse frequency, as well as the code phase of satellite signals. When the acquisition is
completed, the module automatically switches to tracking mode. In tracking mode, the module tracks
satellites and demodulates the navigation data from specific satellites.

3.3. Power-Up Sequence

Once VCC is powered up, the module starts up automatically and the voltage should rise rapidly in less
than 50 ms.

Ensure that the VCC has no rush or drop during rising time, and then keep the voltage stable. The
recommended ripple is less than 50 mV.

3.4. Power-Down Sequence

Once the VCC is shut down, voltage should drop quickly in less than 50 ms. It is recommended to use a
voltage regulator that supports fast discharge.

To avoid abnormal voltage condition, if VCC falls below the minimum specified value, the system must
initiate a power-on restart by lowering VCC to less than 100 mV for at least 1 s.

< 50 ms < 50 ms

VCC
below 100 mV ≥ 1 s

UART Valid Invalid Valid

Figure 4: Power-Down and Power-on Restart Sequence

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 GNSS Module Series

4 Application Interfaces

4.1. IO Pins

4.1.1.Communication Interfaces

The following interfaces can be used for data reception and transmission.

4.1.1.1. Interface Selection (D_SEL)

The D_SEL pin is pulled up internally by default. At this time, the UART interface is selected. If the SPI
interface is needed, pull the D_SEL pin down externally with a 1 kΩ resistor.

Table 6: Data Interface Selection by Using D_SEL

D_SEL=1 D_SEL=0
PIN# (Pulled up internally by (Pulled down externally with
default) a 1 kΩ resistor)

20 TXD SPI_CLK

21 RXD SPI_CS

18 CTS SPI_MOSI

19 RTS SPI_MISO

SPI_REQ will not be changed

17 SPI_REQ SPI_REQ by D_SEL. The pin is needed
when using SPI interface.

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 GNSS Module Series

4.1.1.2. UART Interface

The module provides one UART interface that has the following features:

⚫ Supports standard NMEA message output, PGLOR/PQTM command input and output, Bream 5

message input and output, and firmware upgrade.

⚫ Supports baud rates: 115200 bps, 230400 bps, 460800 bps and 921600 bps.

The reference design is shown the figure below.

MCU Module
0R
TXD RXD
0R
RXD TXD
RTS
CTS
GND GND

Figure 5: UART Interface Reference Design

NOTE

1. For data transmission and firmware upgrade in Normal operating mode, the module only requires a
two-wire UART (TXD and RXD). However, a four-wire UART (TXD, RXD, CTS and RTS) is needed
for firmware bootloader upgrade in Boot download mode. These additional pins should be made
accessible in your design.
2. “ ” represents UART interface test points. Place the test points close to the module.
3. UART interface default settings vary depending on software version. Please see specific software
versions for details.
4. If the IO voltage of MCU is not matched with the module, a level shifter must be selected.

4.1.1.3. SPI Interface

The module provides one SPI interface that supports the following features:

⚫ Supports standard NMEA message output, PGLOR/PQTM command input and output, Bream 5

message input and output, and firmware upgrade;

⚫ Operates as a slave;

5
Bream is the chipset supplier dedicated protocol.

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 GNSS Module Series

⚫ Fixes data frame size of 8 bits;

⚫ Supports baud rates: 1 Mbps to 3 Mbps.

MCU Module

GPIOX SPI_REQ
SPI_MISO SPI_MISO
SPI_MOSI SPI_MOSI
SPI_CLK SPI_CLK
SPI_CS SPI_CS

GND D_SEL
1K

Figure 6: SPI Interface Reference Design

NOTE

1. The recommended minimum speed for SPI is 1 MHz and the maximum speed depends on firmware.
2. For SPI selection, D_SEL pin must be pulled down externally with a 1 kΩ resistor.
3. “ ” represents SPI interface test points. Place the test points close to the module.
4. If the IO voltage of MCU is not matched with that of the module, a level shifter must be selected.

4.1.2.GEOFENCE

The GEOFENCE pin indicates the current geofence status. Pin active polarity and geofence locations are
preset using a command. Once the pin is configured, the receiver continuously compares its current
position to the preset geofence area. The pin state reflects the current geofence status, e.g., whether the
receiver is inside the active region or not.

4.1.3.FWD

The FWD pin is used to input the status signals indicating forward/backward vehicle movement. When it is
at low voltage level, the vehicle is moving forward, and when it is at high level, the vehicle is moving
backward.

NOTE

Only cars need to be connected to the FWD pin, not 2-wheelers.

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 GNSS Module Series

4.1.4.WHEELTICK

The WHEELTICK pin is used to input wheel tick pulse signals from a vehicle. It can be sampled from the
wheel revolution sensors or the transmission of the vehicle. For more information about the reference
circuit design, see document [5].

4.1.5.1PPS

The 1PPS output pin generates one pulse per second periodic signal synchronized with a GNSS time grid
with intervals. The accuracy is less than 100 ns. Thus, it may be used as a low frequency time
synchronization pulse or as a high frequency reference signal. To maintain the high accuracy of 1PPS, it
is required to have visible satellites in an open sky environment and the VCC should be kept powered.

4.2. System Pins

4.2.1.RESET_N

RESET_N is an input pin that is pulled up internally by default. The module can be reset by driving
RESET_N low for at least 100 ms and then releasing it.

RESET_N is pulled up to 1.8 V internally with a 2.4 kΩ pull-up resistor, thus external pull-up circuit is not
allowed for this pin.

An OC driver circuit as shown below is recommended to control the RESET_N pin.

RESET_N

4.7K

Input pulse
47K

Figure 7: Reference OC Circuit for Module Reset

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 GNSS Module Series

VCC
Pull down
≥ 100 ms

RESET_N

UART Invalid Valid Invalid Valid

Figure 8: Reset Sequence

NOTE

Ensure RESET_N is connected so that it can be used to reset the module if the module enters an
abnormal state.

4.2.2.BOOT

BOOT pin can be used to set the Quectel LC29D module into Boot download mode. It is pulled down
internally by default. If the pin is kept floating during startup, the module enters Normal operating mode. If
the pin is kept at high level for about 50 ms during startup, the module enters Boot download mode. For
more information about the reference circuit design, see document [5].

Check BOOT pin voltage level to identify its operating mode when the module is powered on.

Table 7: Operating Modes

Voltage Level Operating Mode Comment

If the pin is kept floating during startup, the module enters

Low Normal
Normal operating mode.
If the pin is kept at high level for about 50 ms during startup, the
High Boot download
module enters Boot download mode.

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 GNSS Module Series

11 s

VCC

BOOT

Figure 9: BOOT Pin State (Normal Operating Mode)

50 ms
0 ms

VCC

Keep Floating
BOOT

Figure 10: BOOT Pin Control Sequence (Boot Download Mode)

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 GNSS Module Series

5 Design

5.1. Antenna Design

5.1.1.Antenna Specification

The Quectel LC29D module can be connected to a dedicated passive or active dual-band (L1 + L5)
GNSS antenna to receive GNSS satellite signals. The recommended antenna specifications are given in
the table below.

Table 8: Recommended Antenna Specifications

Antenna Type Specifications

Frequency Range: 1164–1189 MHz & 1559–1606 MHz

Polarization: RHCP
Passive Antenna
VSWR: < 2 (Typ.)
Passive Antenna Gain: > 0 dBi
Frequency Range: 1164–1189 MHz & 1559–1606 MHz
Polarization: RHCP
VSWR: < 2 (Typ.)
Active Antenna Passive Antenna Gain: > 0 dBi
Active Antenna Noise Figure: < 1.5 dB
Active Antenna Total Gain: < 17 dB
Proposed by the Quectel Antenna Team: YB0017AA

NOTE

The total gain of the whole antenna is the internal LNA gain minus total insertion loss of cables and
components inside the antenna.

5.1.2.Antenna Selection Guide

Both active and passive dual-band (L1 + L5) GNSS antennas can be used for the Quectel LC29D module.
A passive antenna is recommended if the antenna can be placed close to the module, for instance, when
the distance between the module and the antenna is less than 1 m. Otherwise, use an active antenna,

LC29D(B,C,F)_Hardware_Design 28 / 50
 GNSS Module Series

since the insertion loss of RF cable can decrease the C/N0 of GNSS signal.

C/N0 is an important factor for GNSS receivers, and it is defined as the ratio of the received modulated
carrier signal power to the received noise power in one Hz bandwidth. C/N0 formula is as below:

The “Power of GNSS signal” is GNSS signal level. In practical environment, the signal level at the earth
surface is about -130 dBm. “Thermal Noise” is -174 dBm/Hz at 290 K. To improve C/N0 of GNSS signal,
an LNA could be added to reduce “System NF”.

“System NF”, formula:

“F” is the noise factor of receiver system:

“F1” is the first stage noise factor, “G1” is the first stage gain, etc. This formula indicates that LNA with
enough gain can compensate for the noise factor behind the LNA. In this case, “System NF” depends
mainly on the noise figure of components and traces before first stage LNA plus noise figure of LNA itself.
This explains the need for using an active antenna, if the antenna connection cable is too long.

5.1.3.Active Antenna Reference Design

The following figure is a typical reference design of an active antenna. In this case, the antenna is
powered by the VDD_RF. When selecting the active antenna, it is necessary to pay attention to operating
voltage range.

Active Antenna
π Matching Circuit Module

R1
RF_IN
C1 NM

C2 NM

D1 0R
TVS
L1 68 nH

R2 10R
VDD_RF
C3 100 pF

C4 100 nF

Figure 11: Active Antenna Reference Design

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 GNSS Module Series

The components C1, R1 and C2 are reserved for matching antenna impedance. By default, R1 is 0 Ω, C1
and C2 are not mounted. D1 is an electrostatic discharge (ESD) protection device to protect the RF signal
input from the potential damage caused by ESD.

An active antenna can use the power supply from the VDD_RF pin. In that case, the inductor L1 is used to
prevent the RF signal from leaking into the VDD_RF and to prevent noise propagation from the VDD_RF
to the antenna. The L1 inductor routes the bias voltage to the active antenna without losses. The
recommended value of L1 should be at least 68 nH. The resistor R2 is used to protect the module in case
the active antenna is short-circuited to the ground plane.

The existing footprints in the matching circuit can be used to mount other type of components than the
ones presented in the figure above. In that case, you must pay attention to the DC power supply. For
example, if an inductor is mounted on the C1 footprint, then the circuit needs a DC-blocking capacitor
between L1 and C1 to prevent short-circuiting of the DC power supply through the inductor to the ground.
The same applies to the C2 footprint.

5.1.4.Passive Antenna Reference Design

The following figure is a typical reference design of a passive antenna.

Passive Antenna
Module

π Matching Circuit
R1
RF_IN
0R
C2 NM
TVS

C1 NM
D1

Figure 12: Passive Antenna Reference Design

The components C1, R1 and C2 are reserved for matching antenna impedance. By default, R1 is 0 Ω,
while C1 and C2 are not mounted. D1 is an electrostatic discharge (ESD) protection device to protect one
signal line from the damage caused by ESD. The impedance of RF trace should be controlled to 50 Ω and
the trace length should be kept as short as possible.

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 GNSS Module Series

5.2. Coexistence with Cellular Systems

Since GNSS signals are usually very weak, a GNSS receiver could be vulnerable to the environmental
interference. According to 3GPP specifications, a cellular terminal should transmit a signal of up to
33 dBm at GSM bands, or of about 24 dBm at WCDMA and LTE bands. Therefore, coexistence with
cellular systems must be optimized to avoid significant deterioration of the GNSS performance.

In a complex communication environment, interference signals can come from in-band and out-of-band
signals. Therefore, interference can be divided into two types: in-band interference and out-of-band
interference, which are both described in this chapter.

In this chapter, you can also find suggestions for decreasing the impact of interference signals that will
ensure the interference immunity of a GNSS receiver.

5.2.1.In-Band Interference

In-band interference refers to the signal whose frequency is within or near the operating frequency range
of a GNSS signal.

See the following figure for more details.

Power [dBm] GPS operation GPS carrier frequency Interference

bands 1575.42 MHz signal

-110

Frequency [MHz]
1525 1550 1575 1600 1625

Figure 13: In-Band Interference on GPS L1

The most common in-band interferences usually come from:

⚫ Harmonics, caused by crystals, high-speed signal lines, MCUs, switch-mode power supply etc., or
⚫ Intermodulation from different communication systems.

Common frequency combinations are presented in the table below. The table lists some probable in-band
interferences generated by two kinds of out-of-band signal intermodulation, or the second harmonic of
LTE Band 13.

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 GNSS Module Series

Table 9: Intermodulation Distortion (IMD) Products

Source F1 Source F2 IM Calculation IMD Products

GSM850/Band 5 Wi-Fi 2.4 GHz F2 (2412 MHz) - F1 (837 MHz) IMD2 = 1575 MHz

DCS1800/Band 3 PCS1900/Band 2 2 × F1 (1712.6 MHz) - F2 (1850.2 MHz) IMD3 = 1575 MHz

PCS1900/Band 2 Wi-Fi 5 GHz F2 (5280 MHz) - 2 × F1 (1852 MHz) IMD3 = 1576 MHz

LTE Band 13 N/A 2 × F1 (786.9 MHz) IMD2 = 1573.8 MHz

5.2.2.Out-of-Band Interference

Strong signals transmitted by other communication systems can cause a GNSS receiver to become
saturated, thus greatly deteriorating its performance, as illustrated in the following figure.

Power [dBm] GPS carrier frequency

1575.42 MHz
GSM850 GSM900 DCS1800 PCS1900 Wi-Fi 2.4 GHz
0

GPS 带宽

-110

Frequency [MHz]
0 500 1000 2000 2500

Figure 14: Out-of-Band Interference on GPS L1

5.2.3.Ensuring Interference Immunity

There are several things you can do to decrease the impact of interference signals and thus ensure the
interference immunity of a GNSS receiver:

⚫ Keep the GNSS antenna away from interference sources.

⚫ Add a band-pass filter in front of the GNSS module.
⚫ Use shielding and multi-layer PCB and ensure adequate grounding.
⚫ Optimize layout and component placement of the PCB and the whole device.

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 GNSS Module Series

The following figure illustrates the interference source and its possible interference path. In a complex
communication system, there are usually RF power amplifier, MCU, crystal, etc. These devices should be
far away from a GNSS receiver, or a GNSS module. In particular, shielding should be used to prevent
strong signal interference for power amplifiers. The cellular antenna should be placed away from a GNSS
receiving antenna to ensure enough isolation. Usually, a good design should provide at least a 20 dB
isolation between two antennas. Take DCS1800, for example, the maximum transmitted power of
DCS1800 is around 30 dBm. After a 20 dB attenuation, the signal received by the GNSS antenna will be
around 10 dBm, which is still too high for a GNSS module. With a GNSS band-pass filter with around
40 dB rejection in front of the GNSS module, the out-of-band signal will be attenuated to -30 dBm.

10 dBm Rejection = 40 dB
Isolation = 20 dB

-30 dBm

DCS1800 GNSS
30 dBm Receiver

Shielding

RF Power
Cellular MCU Crystal
Amplifier

Figure 15: Interference Source and Its Path

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 GNSS Module Series

5.3. Recommended Footprint

The figure below describes module footprint. These are recommendations, not specifications.

Figure 16: Recommended Footprint

NOTE

For easy maintenance, keep a distance of at least 3 mm between the module and other components on
the motherboard.

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 GNSS Module Series

6 Electrical Specification

6.1. Absolute Maximum Ratings

Absolute maximum ratings for power supply and voltage on digital pins of the Quectel LC29D module are
listed in table below.

Table 10: Absolute Maximum Ratings

Parameter Description Min. Max. Unit

VCC Main Power Supply Voltage -0.3 3.6 V

VIN_IO Input Voltage at IO Pins -0.3 3.6 V

PRF_IN Input Power at RF_IN - 15 dBm

T_storage Storage Temperature -40 +90 °C

NOTE

Stressing the device beyond the “Absolute Maximum Ratings” may cause permanent damage. The
product is not protected against over-voltage or reversed voltage. Therefore, it is necessary to use
appropriate protection diodes to keep voltage spikes within the parameters given in the table above.

6.2. Recommended Operating Conditions

All specifications are at an ambient temperature of +25°C. Extreme operating temperatures can
significantly impact the specified values. Applications operating near the temperature limits should be
tested to ensure the validity of the specification.

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 GNSS Module Series

Table 11: Recommended Operating Conditions

Parameter Description Min. Typ. Max. Unit

VCC Power Supply Voltage 2.7 3.3 3.6 V

IO_Domain Digital IO Pin Domain Voltage - VCC - V

VIL Digital IO Pin Low-Level Input Voltage 0 - 0.35 × VCC V

VIH Digital IO Pin High-Level Input Voltage 0.65 × VCC VCC + 0.3 V

VOL Digital IO Pin Low-Level Output Voltage - - 0.4 V

VOH Digital IO Pin High-Level Output Voltage VCC - 0.4 - - V

Low-Level Input voltage -0.3 - 0.35 V

RESET_N
High-Level Input voltage 0.65 × VCC - VCC + 0.3 V

VDD_RF VDD_RF Voltage - VCC - V

Low-Level Output Voltage - - 0.4 V

LNA_EN
High-Level Output Voltage 1.7 1.8 1.9 V

T_operating Operating Temperature -40 25 +85 °C

NOTE

Operation beyond the "Operating Conditions" is not recommended and extended exposure beyond the
"Operating Conditions" may affect device reliability.

6.3. Supply Current Requirement

The following table lists the supply current values of the total system that may be applied. Actual power
requirements may vary depending on processor load, external circuits, firmware version, the number of
tracked satellites, signal strength, startup type, test time and conditions.

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 GNSS Module Series

Table 12: Supply Current

LC29D (B)* LC29D (C) LC29D (F)*

Parameter Description Condition
ITyp. 6 IPEAK 6 ITyp. 6
IPEAK 6 ITyp. 6 IPEAK 6

Acquisition 51 mA 79 mA 38 mA 79 mA 38 mA 78 mA
7
IVCC Current at VCC
Tracking 37 mA 79 mA 38 mA 79 mA 39 mA 78 mA

6.4. ESD Protection

If the static electricity generated in various ways discharges to the module, the module maybe damaged
to a certain extent. Thus, please take proper ESD countermeasures and handling methods. For example,
wearing anti-static gloves during the development, production, assembly and testing of the module;
adding ESD protective components to the ESD sensitive interfaces and points in the product design.

The following measures ensure ESD protection when the module is handled:

⚫ When mounting the module onto a motherboard, make sure to connect the GND first, and then the
RF_IN pin.
⚫ When handling the RF_IN pin, do not come into contact with any charged capacitors or materials that
may easily generate or store charges (such as patch antenna, coaxial cable, soldering iron, etc.).
⚫ When soldering the RF_IN pin, make sure to use an ESD safe soldering iron (tip).

6
Room temperature, measurements are taken with typical voltage.
7
Used to determine maximum current capability of power supply.

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 GNSS Module Series

7 Mechanical Dimensions
This chapter describes the mechanical dimensions of the module. All dimensions are in millimeters (mm).
The dimensional tolerances are ±0.20 mm, unless otherwise specified.

7.1. Top, Side and Bottom View Dimensions

1 24 24 1

12 13 13 12

Figure 17: Top, Side and Bottom View Dimensions

NOTE

The package warpage level of the module conforms to the JEITA ED-7306 standard.

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 GNSS Module Series

7.2. Top and Bottom Views

1 24 24 1

12 13 13 12

Figure 18: Top and Bottom Views

NOTE

Images above are for illustrative purpose only and may differ from the actual module. For authentic
appearance and label, see the module received from Quectel.

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 GNSS Module Series

8 Product Handling

8.1. Packaging

The Quectel LC29D module is delivered in a tape carrier package, which enables efficient production,
set-up and dismantling of production batches. It is shipped in a vacuum-sealed packaging to prevent
moisture intake and electrostatic discharge.

8.1.1.Carrier Tape

Figure 19: Carrier Tape Dimension Drawing

Table 13: Carrier Tape Dimension Table (Unit: mm)

W P T A0 B0 K0 K1 F E

32 24 0.4 12.7 16.4 2.9 7.4 14.2 1.75

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 GNSS Module Series

8.1.2.Plastic Reel

Figure 20: Plastic Reel Dimension Drawing

Table 14: Plastic Reel Dimension Table (Unit: mm)

øD1 øD2 W

330 100 32.5

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 GNSS Module Series

8.1.3.Packaging Process

Place the modules into the carrier tape and

use the cover tape to cover them; then wind
the heat-sealed carrier tape to the plastic reel
and use the protective tape for protection.
One plastic reel can load 250 modules.

Place the packaged plastic reel, humidity

indicator card and desiccant bag into a
vacuum bag, then vacuumize it.

Place the vacuum-packed plastic reel inside a

pizza box.

Put 4 pizza boxes into 1 carton and seal it. One

carton can pack 1000 modules.

Figure 21: Plastic Reel Dimension Drawing

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 GNSS Module Series

8.2. Storage

The module is provided in the vacuum-sealed packaging. MSL of the module is rated as 3. The storage
requirements are listed below.

1. Recommended storage conditions: The temperature should be 23 ±5 °C and the relative humidity
should be 35–60 %.

2. The storage life (in a vacuum-sealed packaging) is 12 months in recommended storage conditions.

3. The shelf life of the module is 168 hours 8 in a plant where the temperature is 23 ±5 °C and relative
humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be
processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the
module should be stored in an environment where the relative humidity is less than 10 % (e.g., a
drying cabinet).

4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under
the following circumstances:
⚫ The module is not stored under recommended storage conditions;
⚫ Violation of the third requirement above occurs;
⚫ Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;
⚫ Before module repairing.

5. If needed, the pre-baking should comply with the requirements below:

⚫ The module should be baked for 8 hours at 120 ±5 °C;

⚫ The module must be soldered to the PCB within 24 hours of baking, otherwise it should be put in
a dry environment such as a drying oven.

NOTE

1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module
to the air is forbidden.
2. Take the module out of the packaging and put it on high-temperature-resistant fixtures before
baking. The module must be soldered to PCB within 24 hours of the baking, otherwise put it in the
drying oven. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure.
3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the module.

8
This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the
solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or
are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are not
ready for soldering.

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 GNSS Module Series

8.3. Manufacturing and Soldering

Push the squeegee to apply solder paste on the stencil surface, thus making the paste fill the stencil
openings and then penetrate the PCB. Apply proper force on the squeegee to produce a clean stencil
surface on a single pass. For more information about stencil thickness for the module, see document [6].

The peak reflow temperature should be 235–246 ºC, with 246 ºC as the absolute maximum reflow
temperature. To avoid module damage caused by repeated heating, it is strongly recommended to mount
the module to the PCB only after reflow soldering the other side of the PCB. The recommended reflow
soldering thermal profile (lead-free reflow soldering) and related parameters are shown in the figure and
table below.

Temp. (°C)
Reflow Zone
Max slope: Cooling down slope:
1~3 °C/s C -1.5 ~ -3 °C/s
246
235
217
B D
200
Soak Zone

150 A

100
Max slope: 1~3 °C/s

Figure 22: Recommended Reflow Soldering Thermal Profile

Table 15: Recommended Thermal Profile Parameters

Factor Recommendation

Soak Zone

Max. Slope 1–3 °C/s

Soak Time (between A and B: 150 °C and 200 °C) 70–120 s

Reflow Zone

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 GNSS Module Series

Max. Slope 1–3 °C/s

Reflow Time (D: over 217 °C) 40–70 s

Max. Temperature 235 °C to 246 °C

Cooling Down Slope -1.5 to -3 °C/s

Reflow Cycle

Max. Reflow Cycles 1

NOTE

1. During manufacturing and soldering, or any other processes that may require direct contact with the
module, NEVER wipe the module shielding can with organic solvents, such as acetone, ethyl
alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusty.
2. The module shielding can be made of cupronickel base material. The Neutral Salt Spray Test has
shown that after 12 hours the laser-engraved label information on the shielding can is still clearly
identifiable and the QR code is still readable, although white rust may be found.
3. If the module requires conformal coating, DO NOT use any coating material that may chemically
react with the PCB or shielding cover, and prevent the coating material from entering the module
shield.
4. Avoid cleaning the module with ultrasonic technology since it can damage crystals inside the
module.
5. Due to SMT process complexity, please contact Quectel Technical Support before taking any
action or implementing any process that you are not sure about (e.g. selective soldering, ultrasonic
soldering) that is not mentioned in document [6].

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 GNSS Module Series

9 Labelling Information
The label of the Quectel GNSS modules contains important product information. The location of the
product type number is shown in figure below.

Quectel Logo

Product Name

Ordering Code

Pin1 indication

Figure 23: Labelling Information

The image above is for illustrative purpose only and may differ from the actual module. For authentic
appearance and label, see the module received from Quectel.

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 GNSS Module Series

10 Appendix References
Table 16: Related Documents

Document Name

[1] Quectel_LC29D(B,C,F)&LC79D(D)_GNSS_Protocol_Specification

[2] Quectel_LC29D(B,C,F)&LC79D(D)_AGNSS_Application_Note

[3] Quectel_LC29D(B,C,F)_DR_Application_Note

[4] Quectel_LC29D(B,C,F)&LC79D(D)_Firmware_Upgrade_Guide

[5] Quectel_LC29D(B,C,F)_Reference_Design

[6] Quectel_Module_Secondary_SMT_Application_Note

Table 17: Terms and Abbreviations

Abbreviation Description

AGNSS Assisted Global Positioning System

ARM Advanced RISC Machine

CEP Circular Error Probable

C/N0 Carrier-to-Noise Ratio

CTS Clear to Send

DCS1800 Digital Cellular System at 1800MHz

DR Dead Reckoning

EGNOS European Geostationary Navigation Overlay Service

ESD Electrostatic Discharge

GAGAN GPS Aided Geo Augmented Navigation

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 GNSS Module Series

Galileo Galileo Satellite Navigation System (EU)

GLONASS Global Navigation Satellite System (the Russian GNSS)

GNSS Global Navigation Satellite System

GPS Global Positioning System

GSM Global System for Mobile Communications

IC Integrated Circuit

IMD Intermodulation Distortion

I/O Input /Output

ITyp. Typical Current

IPEAK Peak Current

IRNSS/NavIC Indian Regional Navigation Satellite System

LCC Leadless Chip Carrier (package)

LDO Low-dropout Regulator

LED Light Emitting Diode

LNA Low Noise Amplifier

LTE Long Term Evolution

LTO Long-term Orbit

Mbps Megabits per second

MCU Microcontroller Unit/Microprogrammed Control Unit

MISO Master In Slave Out

MOSI Master Out Slave In

MSL Moisture Sensitivity Levels

NMEA National Marine Electronics Association

OC Open Connector

PCB Printed Circuit Board

PMU Power Management Unit

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 GNSS Module Series

1PPS One Pulse Per Second

PSRR Power Supply Rejection Ratio

QR (Code) Quick Response (Code)

QZSS Quasi-Zenith Satellite System

RAM Random Access Memory

RF Radio Frequency

RMC Recommended Minimum Specific GNSS Data

RHCP Right Hand Circular Polarization

ROM Read Only Memory

RoHS Restriction of Hazardous Substances

RTC Real Time Clock

RTK Real-Time Kinematic

3GPP 3rd Generation Partnership Project

SAW Surface Acoustic Wave

SBAS Satellite-based Augmentation System

SMD Surface Mount Device

SMT Surface Mount Technology

SPI Serial Peripheral Interface

SRAM Static Random Access Memory

TCXO Temperature Compensated Crystal Oscillator

TTFF Time to First Fix

TVS Transient Voltage Suppressor

UART Universal Asynchronous Receiver/Transmitter

UTC Coordinated Universal Time

VSWR Voltage Standing Wave Ratio

WAAS Wide Area Augmentation System

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WCDMA Wideband Code Division Multiple Access

XTAL External Crystal Oscillator

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