Germanium
Germanium
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Anno 1886
• Discovery of a new element in the IVth column: Germanium by
Clemens Winkler: C. Winkler, “Mittheilungen über das Germanium,”
J. für Prakt. Chemie 34(1), 177-229 (1886)
• Patents are filed in the US and Great Britain for the mass production of
Aluminium
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D.I. Mendelejev and C.A. Winkler at the meeting of the 100th anniversary of
the Prussian Academy of Science, Berlin, March 19, 1900.
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Topics to be discussed
• Discovery of Germanium and Early History
• From the “Physics of Dirt” to a Respectable Science
• Point Contact Diodes and Transistors
• Applications of Germanium in Nuclear Physics: GeLi and
High-Purity Ge detectors
• New Physics with Ultra-Pure Germanium
• Infrared Photoconductors and Bolometers
• Isotopically Controlled Germanium
• Germanium Speeds Up Silicon Transistors
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From the “Physics of Dirt” to a
Respectable Science
Karl Lark-Horovitz joined the
Physics Dept., Purdue
University in 1929. In 1942 he
made the fateful decision to
work on Germanium,
Germanium not on
Galena (PbS) or Silicon. The
first transistor was built at Bell
labs with a slab of Purdue
Germanium! Based on the
Purdue work, Germanium
became the first controlled and
understood semiconductor.
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Purdue University Results
Karl Lark-Horovitz
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Purdue University Results
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Purdue University Researchers
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Point Contact Diodes and Transistors
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The MIT Radiation Laboratory
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Discovery of the Transistor
• Controlling big power with little effort: amplification
• The Bell labs vision: Mervin J. Kelly
• Minority carrier injection and lifetime
• December 24, 1947
• The point contact transistor: shows the principle of
amplification but is very fragile (J. Bardeen and W.
Brattain)
• The junction transistor (W. Shockley)
• Are single crystals required?
• The generations of Ge and Si transistors: point contact Ge
transistor Ge junction transistor alloyed Ge transistor
Ge mesa transistor (fmax = 500 MHz, Charles Lee, 1954)
Si planar transistor (Jean A. Hoerni, 1960)
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The first transistor fabricated by Bell Laboratories’ scientists
was this crude point-contact device, built with two cat’s
whiskers and a slab of polycrystalline germanium.
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Point contact
transistor
schematic
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William Shockley,
John Bardeen and
Walter Brattain (left
to right) are gathered
together around an
experiment in this
historic 1948 photo-
graph. The first
point contact tran-
sistor remains on
display at AT&T
Bell Labs in
Murray Hill, New
Jersey.
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Is Polycrystalline Material Reproducible?
Sketch of
a modern
CZ-puller
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Teal and Little’s Hard Fought Victory*
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The First Integrated Circuit
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Applications of Germanium in Nuclear
Physics: GeLi and hpGe Detectors
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Ultra-Pure Ge: NA-ND 2x1010cm-3
The Lawrence
Berkeley Laboratory
ultra-pure germanium
growth apparatus. A
water-cooled RF-
powered coil surrounds
the silica envelope of
the puller. About half
of the 25 cm long
crystal has been grown.
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The Berkeley High-Purity Ge Team
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Dopant Impurity Profiles
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Physics with Ultra-Pure Germanium:
Exciton Condensation
Photograph of a long-lived
electron-hole drop in a 4-
mm disk of ultra-pure
germanium. The sample is
mounted in a dielectric
sample holder and stressed
by a 1.8-mm-diam screw
discernible on the left.
See: J. P. Wolfe, W. L.
Hansen, E. E. Haller, R. S.
Markiewicz, C. Kittel, and C.
D. Jeffries, Phys. Rev. Lett.,
34 (1975) 1292.
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Hydrogen Permeation Studies
with Crystalline Germanium
Ref.: R.C. Frank and J.E. Thomas Jr., J. Phys. Chem. Solids 16, 144 (1960)
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Self-Counting Tritium Doped
Ultra-Pure Ge Detector
Tritium Labeling*:
3 3
1 T 2 He
Samples taken from tritium-
atmosphere-grown ultra-pure
Ge crystal at different
locations were fashioned into
radiation detectors, counting
the internal T decays. The H
concentration varies between
5x1014 and 2x1015 cm-3.
[*Ref.: W.L . Hansen, E.E.
Haller and P.N. Luke, IEEE
Trans. Nucl. Sci. NS-29, No.
3/18/2011 E. E. Haller 1, 738 (1982)] 33
Hydrogen and Dislocations in Ge
Ref.: E. E. Haller et al., Inst. Phys. Conf. Ser. 31, 309 (1977)
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Hydrogen and Dislocations in Ge
Ref.: E. E. Haller et al., Inst. Phys. Conf. Ser. 31, 309 (1977)
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The V2H Center in Dislocation Free,
H2 Atmosphere Grown Germanium
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Discovery of an Isotope Shift in the Ground State
of the Oxygen-Hydrogen Donor and the Silicon-
Hydrogen Acceptor in Germanium
pure H2
51 eV
isotope
shift!
pure D2
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Extrinsic Ge Photoconductors for Far
Infrared Astronomy
Far IR
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Extrinsic Ge Photoconductors
• Shallow dopants in Germanium have ionization energies near
10 meV (corresponding to 80 cm-1 or 125 m). The low
temperature photoconductive onset at max 125 m lies in
the far IR.
• Three generations of photoconductors:
Far IR
photons
Blocking Layer
Far IR Far IR
photons photons Absorbing
Layer
- Launched in August
2003 on a two stage
Delta rocket with 9 solid
fuel boosters
- Lifetime : up to 5 years
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Observations with Ge Photoconductors
From visible
light to the
far infrared.
Galaxy
Messier 81
at a distance
of 12 Million
light years!
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Neutron Transmutation
Doped (NTD) Germanium
• Irradiation of Ge with thermal neutrons
• Neutron captures and decays: 70 EC
Ge(n, ) 3271Ge 71
31 Ga (acceptor)
32
11.2d
74 75 75
32 Ge(n, ) 32 Ge 33 As (donor)
82.2m
76 77
32 Ge(n, ) 32 Ge 3477 Se (double donor)
11.3h
• Homogeneous impurity distribution reflects uniform neutron flux and uniform
isotopic distribution
• Reproducibility: NGa = 70 N70
Ge Ge
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R versus T-1/2 for several NTD Ge
Thermistors
= o exp (To/T)1/2
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Silicon Nitride Micromesh
‘Spider-web’ NTD Ge Bolometers
= o exp (To/T)1/2
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STABLE ISOTOPES
75As
70Ge, 72Ge, 73Ge, 74Ge, 76Ge
69Ga, 71Ga
Z
N
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95% ENRICHED, ULTRA-PURE Ge SINGLE CRYSTALS
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Excitons in 70Ge, nat.Ge and 74Ge
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Change of the direct Ge Bandgap with Isotope Mass
natG
G. Abstreiter, Munich
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Raman Lines of the Ge Isotope Superlattice
Experiment Theory
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Summary
• The 120 year history of the element Ge is rich in
science and technology
• Today Ge has returned to mainstream electronics
because of its excellent transport properties and
engineering of bandstructures using strain
• More interesting findings will be made…Long live
Germanium!
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EXTRAS
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Pure H2 atmosphere
Mixed atmosphere:
H/D = 1/1
Pure D2 atmosphere
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The Acceptor A(H,Si) in Ultra-Pure
Germanium
• The groundstate of A(H,Si) is split
by 1.07 meV, leading to two series
of ground-to-bound excited state line
series (blue and red). The intensity
ratio of corresponding lines is pro-
portional to a Boltzmann factor
exp [1.1 meV/kBT ].
• Only crystals grown in a H2
atmosphere from a SiO2 crucible
contain this acceptor.
• Upon substitution of H with D the
ground state shifts by 21 eV to lower
energies.
• Kahn et al., Phys. Rev. B 36, 8001
Ref.: E. E. Haller, B.Joos and L. M. Falicov, (1987) modeled this and other centers
Phys. Rev. B 21, 4729 (1980)
[A(H,C), A(Be,H), A(Zn,H)] with
trigonal complexes.
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The Cu triple
acceptor in Ge binds
up to three
interstitial H or Li
atoms. Each bound
H or Li reduces the
number of
electronic states by
one (i.e., CuH3 is
neutral)
Position of the acceptor levels of copper and its complexes with hydrogen and lithium in
germanium. [Ref.: E.E. Haller, G.S. Hubbard and W.L. Hansen, IEEE Trans. Nucl. Sci.
NS-24, No. 1, 48 (1977)]
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Hillocks or dimples?
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Neutron Transmutation Doped Ge
Thermistors for Bolometers
Bolometers have two components: an absorber (TeO2) and
a thermometer (NTD Ge)
•Thermometer and absorber (heat
capacity C) are connected by a weak
thermal link (G) to a heat sink (To)
•Incoming energy is converted to heat
in the absorber:
T=To +(Psignal + Pbias)/C
•Temperature rise is proportional to the
incoming energy
•Temperature rise decays as energy
flows from the absorber to heat sink:
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= C/G 72
E. E. Haller
CUORE/CUORICINO Double Beta
Decay:An Italian-US Experiment
~ 1000 kg
• Temperature: 5 mK
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X-Ray Performance: Single
X-Ray Counting
natGe
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A High-Mobility Germanium QWFET
December 6, 2010 - At IEDM 2009, Intel announced a record breaking quantum well field effect transistor (QWFET); a 35nm
gate length device capable of 0.28mA/μm drive current and peak transconductance of 1350μS/μm. These QWFETs used
InGaAs as the quantum well channel material. At this week’s IEDM 2010 in San Francisco, Intel (Hillsboro, OR) will again
demonstrate a first: a high-mobility germanium QWFET that achieves the highest mobility (770 cm2/Vsec) with ultrathin oxide
Thickness (14.5Å) for low-power CMOS applications. This hole mobility is 4 higher than that achieved in state-of-the-art p-
channel strained silicon devices. These results involve the first demonstration of significantly superior mobility to strained
silicon in a p-channel device for low-power CMOS. The biaxially strained germanium QW structure (Figure) 1 incorporates a
phosphorus doped layer to suppress parallel conduction in the SiGe buffers.
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