401 0451 00 Rev D E300 Series Industrial eUSB Eng Spec
401 0451 00 Rev D E300 Series Industrial eUSB Eng Spec
E300 Series
Industrial eUSB Module
Engineering Specification
Document Number: 401-0451-00
Revision: D
Product Overview
⚫ Capacity ⚫ MTBF
■ 1GB – 32GB ■ More than 2,000,000 hours at 0°C
Notes:
1. Please see “5.2 Power Consumption” for details.
TABLE OF CONTENTS
1. INTRODUCTION....................................................................................................... 6
1.1. General Description ............................................................................................. 6
1.2. Flash Management .............................................................................................. 6
1.2.1. Error Correction Code (ECC) .......................................................................... 6
1.2.2. Wear Leveling ................................................................................................. 6
1.2.3. Bad Block Management.................................................................................. 7
1.2.4. SMART ........................................................................................................... 7
1.2.5. Read Disturb Management ............................................................................. 7
1.2.6. Firmware Redundancy.................................................................................... 7
1.2.7. Dynamic Data Refresh.................................................................................... 8
1.2.8. Power Fail Robustness ................................................................................... 8
1.2.9. Page-based Mapping ..................................................................................... 8
2. PRODUCT SPECIFICATIONS ................................................................................. 9
2.1. Overview ............................................................................................................. 9
2.2. Sequential and Random Performance .............................................................. 10
2.3. Part Numbers .................................................................................................... 10
2.4. Connector & Configuration Options ................................................................... 11
3. ENVIRONMENTAL SPECIFICATIONS .................................................................. 12
3.1. Environmental Conditions.................................................................................. 12
3.1.1. Temperature and Humidity ........................................................................... 12
3.1.2. Shock & Vibration ......................................................................................... 12
3.2. MTBF................................................................................................................. 12
3.3. Certification & Compliance ................................................................................ 12
4. ENDURANCE & DATA RETENTION ..................................................................... 13
5. ELECTRICAL SPECIFICATIONS .......................................................................... 13
5.1. Supply Voltage .................................................................................................. 13
5.2. Power Consumption .......................................................................................... 13
6. INTERFACE ........................................................................................................... 14
6.1. Pin Assignment and Descriptions ...................................................................... 14
7. PHYSICAL ATTRIBUTES ...................................................................................... 15
© 2019 | Delkin Devices Inc. 3
E300 Series Industrial eUSB Module 401-0451-00 Rev. D
LIST OF TABLES
Table 2-1 Performance by Capacity & Firmware Type ................................................ 10
Table 2-2 Part Numbers by Capacity & Firmware Type .............................................. 10
Table 2-3 Connector & Fixed/Removable Options ...................................................... 11
Table 5-1 Supply Voltage ............................................................................................ 13
Table 5-2 Power Consumption .................................................................................... 13
Table 6-1 Pin Assignment and Description for eUSB .................................................. 14
Table 7-1 eUSB Mechanical Form Factor Attributes ................................................... 15
1.Introduction
1.1. General Description
Delkin’s E300 Series Embedded USB (eUSB) is designed as a compact, non-removable
storage module to be used as a boot device or for storage of critical data. The industrial-
grade eUSB is fully compliant with USB 3.1 specifications, and is built with industrial temp
Flash memory cells will deteriorate with use, which might generate random bit errors in the
stored data. Thus, the controller in Delkin’s Industrial eUSB drive applies an advanced BCH
ECC algorithm, which can detect and correct errors occur during read processes, ensuring
data been read correctly, as well as protecting data from corruption. The Delkin Industrial
eUSB also employs “near-miss” ECC, such that all blocks which reach a certain error
threshold are automatically refreshed immediately upon detection. The threshold is
determined by the specific flash and ECC configuration in the card.
1.2.4. SMART
SMART, an acronym for Self-Monitoring, Analysis and Reporting Technology, is a special
function that allows a memory device to automatically monitor its health. While there is not an
industry standard for USB drive SMART functionality, as there is for SATA & PATA devices,
the Delkin eUSB supports ATA pass through commands to collect data from the card. Refer
to Section 7 for the command details and the information that can be extracted from the card.
2.Product Specifications
2.1. Overview
⚫ Capacity / Flash Type
■ 1GB to 32GB Industrial Temperature SLC
⚫ Electrical/Physical Interface
■ Compliant with USB 3.1 Gen 1 Specification, which includes backward compatibility to
USB 2.0 and 1.1
⚫ ECC Scheme
■ Capable of correcting up to 96 bits per 1K Byte – BCH engine
⚫ OS Compatibility
■ All USB 2.0 Compatible Operating Systems supported, including:
Sequential Random
Capacity
Read (MB/s) Write (MB/s) Read (MB/s) Write (MB/s)
1GB SLC TBD TBD 5.0 3.5
2GB SLC TBD TBD 5.0 3.5
4GB SLC 35 25 6.0 2.5
8GB SLC 75 35 7.0 3.5
16GB SLC 75 60 7.0 3.8
32GB SLC 75 60 7.0 3.7
Measured with CrystalDiskMark 3.0.3 64 bit in USB 3.0 mode, Random performance for 4K blocks.
2GB M402TQHFL-xx000-D
4GB M404TQJGR-xx000-D
8GB M408TQJGR-xx000-D
16GB M416TNKGR-xx000-D
32GB M432TNJGR-xx000-D
NOTES:
1. “xx” in part number is determined by connector selection and fixed vs. removable
configuration. See Section 2.4 for available options.
2. For optional Acrylic conformal coating (contact Delkin for additional cost and MOQ) to
protect the devices from moisture and contaminants, replace the 000 in the part number
with 050.
3. Customized parts will have a special code in place of the 000 to indicate the customer-
specific features or attributes of the part.
4. Contact Delkin for information on a Security version of this product, with zone locking &
encryption capabilities via an API or direct commands. NDA required.
Code Pitch Total Height* Orientation Fixed / Removable Connector Mfr / Part #
RA 0.100” 9.77mm Right Angle Removable Sullins NPPC052KFMS-RC
3. Environmental Specifications
3.1. Environmental Conditions
⚫ Humidity:
▪ RH 10 - 95% under 55°C
⚫ Vibration Specification
▪ Sine Vibration: 10Hz ~2000Hz, 16.3 G peak to peak, 3 axes
▪ Random Vibration: 10Hz ~2000Hz, 1.49 GRMS, 3 axes
3.2. MTBF
MTBF, an acronym for Mean Time Between Failures, is a measure of a device’s reliability. Its value
represents the average time between a repair and the next failure. The measure is typically in units of
hours. The higher the MTBF value, the higher the reliability of the device. The predicted result of
Delkin’s eUSB SSD is more than 2,000,000 hours for 0°C to 25°C operation.
⚫ RoHS
⚫ USB 3.1
Attribute Value
5. Electrical Specifications
5.1. Supply Voltage
Table 5-1 Supply Voltage
Parameter Rating
Operating Voltage 5V ± 10%
6.Interface
6.1. Pin Assignment and Descriptions
7. Physical Attributes
7.1. Mechanical Form Factor
Dimension Value
Length 36.9mm ± 0.5mm
Words 60, 61, 85, 88 first byte, 130 – 135, 154, 155 and 255 are determined by the running firmware, all other
words are configured in the preformat by the preformat host tool (hsfmt.)
The ATA Pass Through module of the Delkin eUSB firmware supports the following ATA
SMART commands, determined by the Feature Register value.
Value Command
D0h Read Data
D1h Read Attribute Thresholds
D8h Enable SMART Operations
D9h Disable SMART Operations
DAh Return Status
SMART commands with Feature Register values not mentioned in the above table are not supported and will be aborted.
PROTOCOL: Non-data
INPUTS:
Register 7 6 5 4 3 2 1 0
Features D8h
Sector Count
Sector Number
Cylinder Low 4Fh
Cylinder High C2h
Device/Head 1 1 1 0
Command B0h
PROTOCOL: 5Ah
INPUTS:
Register 7 6 5 4 3 2 1 0
Features D9h
Sector Count
Sector Number
Cylinder Low 4Fh
Cylinder High C2h
Device/Head 1 1 1 0
Command B0h
ERROR OUTPUTS: Aborted if either the signature in the Cylinder registers is invalid or if
SMART is not enabled.
INPUTS:
Register 7 6 5 4 3 2 1 0
Features D0h
Sector Count
Sector Number
Cylinder Low 4Fh
Cylinder High C2h
Device/Head 1 1 1 0
Command B0h
ERROR OUTPUTS: Aborted if the signature in the Cylinder registers is invalid or if SMART
is not enabled.
DESCRIPTION: This command returns one sector of SMART data. The data structure
returned is shown in Section 3.4.
The following 512 bytes make up the device SMART data structure. Users can obtain the data
using the “SMART Read Data” command (D0h.)
The attributes that are defined for the eUSB firmware return their data in the attribute section of
the SMART data, using a 12 byte data field.
The field at offset 386 gives a version number for the contents of the SMART data structure.
For the controller in the Delkin eUSB, only version 4 is defined.
The byte at offset 396 is fixed to 1 for page-based firmware. All chips within an interleaved
channel are used for wear leveling.
The byte at offset 397 is fixed to 1 for page-based firmware. Bad block management is always
done within all chips of an interleaved channel.
This attribute is used for the SMART Return Status command. If the attribute value field
is less than the spare block threshold (currently fixed at 10), the SMART Return Status
command will indicate a threshold exceeded condition.
This attribute is used for the SMART Return Status command. If the attribute value field
is less than the erase count threshold (currently fixed at 10), the SMART Return Status
command will indicate a threshold exceeded condition.
The target number of erase cycles per flash block is taken from the
MaxBlockEraseCount column in the Device Description file.
INPUTS:
Register 7 6 5 4 3 2 1 0
Features D1h
Sector Count
Sector Number
Cylinder Low 4Fh
Cylinder High C2h
Device/Head 1 1 1 0
Command B0h
ERROR OUTPUTS: Aborted if the signature in the Cylinder registers is invalid or if SMART
is not enabled.
PROTOCOL: Non-data
INPUTS:
Register 7 6 5 4 3 2 1 0
Features DAh
Sector Count
Sector Number
Cylinder Low 4Fh
Cylinder High C2h
Device/Head 1 1 1 0
Command B0h
ERROR OUTPUTS: Aborted if the signature in the Cylinder registers is invalid or if SMART
is not enabled.
WARNING: This product may contain chemicals known to the State of California to cause cancer, birth
defects, or other reproductive harm. For more information go to www.p65warnings.ca.gov.