TPS92664-Q1

SLUSF16 – JULY 2022

TPS92664-Q1 Automotive Low Noise 16-Channel LED Matrix Manager with Advance
Diagnostics, Integrated Oscillator, and EEPROM

1 Features 3 Description
• AEC-Q100 qualified for automotive applications The TPS92664 LED matrix manager device enables
– Grade 1: –40°C to 125°C ambient temperature fully dynamic adaptive lighting solutions by providing
– Device HBM classification level H1C individual pixel-level LED control. The device includes
– Device CDM classification level C5 four sub-strings of four series connected integrated
• Functional Safety-Compliant switches for bypassing individual LEDs. The individual
– Developed for functional safety applications sub-strings allow the device to accept either single or
– Documentation available to aid ISO 26262 multiple current sources.
system design up to ASIL B The TPS92664 features an internal oscillator.
• 16 integrated bypass switches The internal oscillator can be shared to other
– Programmable 10-bit PWM dimming system devices through the internal low noise
– Programmable slew rate control LVDS transmitter and receiver blocks. The multi-
– LED open detection and protection drop, universal, asynchronous, receiver transmitter
– Single LED short detection (UART) serial interface is compatible with TPS92665,
• UART serial communication TPS92667, TPS92662x and TPS92663x devices.
– Internal oscillator for system clock The internal EEPROM can store system defaults as
– LVDS clock driver for synchronizing devices well as calibration and lighting module data. An on-
– Previous LMM generation compatible board ADC with multiplexed inputs samples all LED
– CAN transceiver compatible channels as well as IC die temperature and an LED
• Integrated ADC current sense. The ADC also samples dedicated ADC
– LED voltage for each switch inputs for use with system temperature compensation,
– LED current monitor LED binning and coding.
– Die temperature The TPS92664 incorporates registers for
– 2x general ADC inputs (thermistor compatible) programming phase shift and pulse width of each
• Internal EEPROM (MTP) individual LED in the string and for reporting LED
– Failsafe default settings open, short faults and functional parameters.
– Customer calibration data
Package Information
2 Applications PART NUMBER PACKAGE(1) BODY SIZE (NOM)
• Automotive headlight systems TPS92664-Q1 PHP (HTQFP, 48) 7.00 mm × 7.00 mm
• ADB or glare-free high beam
(1) For all available packages, see the orderable addendum at
• Sequential turn, animated daytime running lights the end of the data sheet.

VBAT
BOOST BUCK

TPS92664
NTC ADCx
CP_TOP

SYNC
Other 66x
devices CLK_H
MCU CP_BOT
CLK_L
….. ….. …..
UART
RX
CAN CAN UART MTP
ECU TX 4x4
series
switches
5V VDD

GND CS

Simplified Application

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS92664-Q1
SLUSF16 – JULY 2022 www.ti.com

4 Device and Documentation Support

4.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
4.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
4.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
4.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.

4.5 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.

2 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated

Product Folder Links: TPS92664-Q1

 TPS92664-Q1
www.ti.com SLUSF16 – JULY 2022

5 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 3

Product Folder Links: TPS92664-Q1
 PACKAGE OPTION ADDENDUM

www.ti.com 22-Jul-2022

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

TPS92664QPHPRQ1 ACTIVE HTQFP PHP 48 1000 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 TPS92664Q Samples

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 9-Aug-2022

TAPE AND REEL INFORMATION

REEL DIMENSIONS TAPE DIMENSIONS

K0 P1

B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2 Q1 Q2

Q3 Q4 Q3 Q4 User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS92664QPHPRQ1 HTQFP PHP 48 1000 330.0 16.4 9.6 9.6 1.5 12.0 16.0 Q2

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 9-Aug-2022

TAPE AND REEL BOX DIMENSIONS

Width (mm)
H
W

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS92664QPHPRQ1 HTQFP PHP 48 1000 336.6 336.6 31.8

Pack Materials-Page 2
 GENERIC PACKAGE VIEW
PHP 48 TQFP - 1.2 mm max height
7 x 7, 0.5 mm pitch QUAD FLATPACK

This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.

4226443/A

www.ti.com
 PACKAGE OUTLINE
PHP0048L SCALE 1.900
PowerPAD
TM
HTQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK

7.2
B
6.8
NOTE 3
48 37
PIN 1 ID

1 36

7.2 9.2
TYP
6.8 8.8
NOTE 3

12
25

13 24
A
0.27
44X 0.5 48X
0.17
0.08 C A B
4X 5.5
1.2 MAX

SEATING PLANE

(0.13) SEE DETAIL A 0.08

TYP 13 24

12 25

0.25
GAGE PLANE (1)
5.00
49
4.23

0.75 0.15
0 -7 0.45 0.05
1 36 DETAIL A
A 16

TYPICAL

48 5.00 37
4X (0.25) NOTE 5
4.23 4226599/A 05/2021
PowerPAD is a trademark of Texas Instruments.
NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MS-026.
5. Feature may not be present.

www.ti.com
 EXAMPLE BOARD LAYOUT
PHP0048L PowerPAD
TM
HTQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK

( 6.5)
NOTE 10
(5)
SYMM
48 37 SOLDER MASK
DEFINED PAD

48X (1.6)

1
36

48X (0.3)

(5)

SYMM 49
(1.1 TYP)

44X (0.5) (8.5)

12 25

(R0.05) TYP

( 0.2) TYP
VIA
13 24 METAL COVERED
SEE DETAILS (1.1 TYP) BY SOLDER MASK

(8.5)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE:8X

0.05 MAX 0.05 MIN

ALL AROUND ALL AROUND
METAL SOLDER MASK
OPENING
EXPOSED METAL

EXPOSED METAL
METAL UNDER
SOLDER MASK SOLDER MASK
OPENING

NON SOLDER MASK SOLDER MASK

DEFINED DEFINED
SOLDER MASK DETAILS
4226599/A 05/2021
NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. See technical brief, Powerpad thermally enhanced package,
Texas Instruments Literature No. SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged
or tented.
10. Size of metal pad may vary due to creepage requirement.

www.ti.com
 EXAMPLE STENCIL DESIGN
PHP0048L PowerPAD
TM
HTQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK

(5)
BASED ON
0.125 THICK STENCIL

SYMM SEE TABLE FOR

DIFFERENT OPENINGS
48 37 FOR OTHER STENCIL
THICKNESSES

48X (1.6)

1
36

48X (0.3)

(8.5)
(5)
SYMM 49 BASED ON
0.125 THICK
STENCIL
44X (0.5)

12 25
(R0.05) TYP

METAL COVERED
BY SOLDER MASK
13 24
(8.5)

SOLDER PASTE EXAMPLE

EXPOSED PAD
100% PRINTED SOLDER COVERAGE BY AREA
SCALE:8X

STENCIL SOLDER STENCIL

THICKNESS OPENING
0.1 5.59 X 5.59
0.125 5.00 X 5.00 (SHOWN)
0.150 4.56 X 4.56
0.175 4.23 X 4.23

4226599/A 05/2021

NOTES: (continued)

11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
12. Board assembly site may have different recommendations for stencil design.

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