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Tyan Thunder SX GT86CB5630 B5630G86CV12 Server Service Engineer's Manual

The GT86C-B5630 Service Engineer's Manual provides comprehensive instructions for experienced users on installing and maintaining the TYAN GT86C-B5630 system. It includes safety precautions, compliance information, and detailed chapters on setup and component replacement. The manual emphasizes the importance of adhering to safety guidelines and using specified parts to ensure proper operation.

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0% found this document useful (0 votes)

23 views165 pages

Tyan Thunder SX GT86CB5630 B5630G86CV12 Server Service Engineer's Manual

Uploaded by

simplex6

We take content rights seriously. If you suspect this is your content, claim it here.

Available Formats

Download as PDF, TXT or read online on Scribd

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GT86C-B5630

Service Engineer’s Manual

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PREFACE
Copyright
This publication, including all photographs, illustrations, and software, is
protected under international copyright laws, with all rights reserved.
Neither this manual, nor any material contained herein, may be reproduced without
written consent of manufacturer.
Copyright 2017 MITAC COMPUTING TECHNOLOGY CORPORATION. All rights
®
reserved. TYAN is a registered trademark of MITAC COMPUTING TECHNOLOGY
CORPORATION.
Version 1.0f

Disclaimer
Information contained in this document is furnished by MiTAC COMPUTING
TECHNOLOGY CORPORATION and has been reviewed for accuracy and
®
reliability prior to printing. TYAN assumes no liability whatsoever, and disclaims
®
any express or implied warranty, relating to sale and/or use of TYAN products
including liability or warranties relating to fitness for a particular purpose or
®
merchantability. TYAN retains the right to make changes to produce descriptions
®
and/or specifications at any time, without notice. In no event will TYAN be held
liable for any direct or indirect, incidental or consequential damage, loss of use, loss
of data or other malady resulting from errors or inaccuracies of information
contained in this document.

Trademark Recognition
All registered and unregistered trademarks and company names contained in this
manual are property of their respective owners including, but not limited to the
following.
®
TYAN is a trademark of MiTAC COMPUTING TECHNOLOGY CORPORATION.
®
Intel is a trademark of Intel Corporation.
® ®
AMI , AMIBIOS and combinations thereof are trademarks of AMI Technologies.
® ®
Microsoft , Windows are trademarks of Microsoft Corporation.
® ® ® ®
IBM , PC , AT and PS/2 are trademarks of IBM Corporation.
®
Winbond is a trademark of Winbond Electronics Corporation.

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 FCC Declaration

Notice for the USA

Compliance Information Statement (Declaration of Conformity Procedure) DoC

FCC Part 15: This device complies with part 15 of the FCC Rules

This device complies with Part 15 of the FCC Rules. Operation is subject
to the following conditions:

·This device may not cause harmful interference.

·This device must accept any interference received, including interference that may
cause undesirable operation.

This equipment has been tested and found to comply with the limits for a Class A
digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful
interference in which case the user will be required to correct the interference at his
own expense.

Notice for Canada

This Class A digital apparatus complies with Canadian ICES-003. Cet appareil
numérique de la Classe A est conforme à la norme NMB-003 du Canada.

 Notice for Europe (CE Mark)

This product is in conformity with the Council Directive 2014/30/EU.

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Warning

This equipment is compliant with Class A of CISPR 32. In a residential environment

this equipment may cause radio interference.

CAUTION

Lithium battery included with this board. Do not puncture, mutilate, or dispose of
battery in fire. There will be danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by manufacturer.
Dispose of used battery according to manufacturer instructions and in accordance
with your local regulations.

● VCCI-A
この装置は、クラスＡ情報技術装置です。この装置を家庭環境で使用すると電波
妨害を引き起こすことがあります。この場合は使用者が適切対策を講ずるよう
要求されることがあります。

● Safety: EN/IEC 60950-1

This equipment is compliant with CB/LVD of Safety: EN/IEC 60950-1.

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About this Manual
This Manual is intended for experienced users and integrators with hardware
knowledge of personal computers. It is aimed to provide you with instructions on
®
installing your TYAN GT86C-B5630.

How this guide is organized

This guide contains the following parts:

Chapter 1: Overview
This chapter give an introduction to the GT86C-B5630 barebones, standard
parts list, and accessories. describes the external components, gives a table of
key

Chapter2: Setting Up
This chapter Covers procedures on installing the CPU, memory modules, add
on card and hard drives. Give an overview about theGT86C-B5630 barebone
from an overall angle.

Chapter 3: Replacing the Pre-installed Components

This chapter covers the removal and replacement procedures for pre-installed
components.

Appendix:
This chapter provides the cable connection table, the FRU parts list for reference of
system setup, and technical support in case a problem arises with your system.

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Safety and Compliance Information
®
Before installing and using TYAN GT86C-B5630, take note of the following
precautions:

·Read all instructions carefully.

·Do not place the unit on an unstable surface, cart, or stand.
·Do not block the slots and opening on the unit, which are provided for
ventilation.
·Only use the power source indicated on the marking label. If you are not sure,
contact the power company.

·The unit uses a three-wire ground cable, which is equipped with a third pin to
ground the unit and prevent electric shock. Do not defeat the purpose of this
pin. If your outlet does not support this kind of plug, contact your electrician
to replace your obsolete outlet.

·Do not place anything on the power cord. Place the power cord where it will
not be in the way of foot traffic.
·Follow all warnings and cautions in this manual and on the unit case.

·Do not push objects in the ventilation slots as they may touch high voltage
components and result in shock and damage to the components.

·When replacing parts, ensure that you use parts specified by the
manufacturer.

·When service or repairs have been done, perform routine safety checks to
verify that the system is operating correctly.

·Avoid using the system near water, in direct sunlight, or near a heating
device.
·Cover the unit when not in use.

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Safety Information
Retain and follow all product safety and operating instructions provided with your
equipment. In the event of a conflict between the instructions in this guide and the
instructions in equipment documentation, follow the guidelines in the equipment
documentation.
Observe all warnings on the product and in the operating instructions. To
reduce the risk of bodily injury, electric shock, fire and damage to the equipment,
observe all precautions included in this guide.
You must become familiar with the safety information in this guide before you
install, operate, or service TYAN products.
Symbols on Equipment

Caution. This symbol indicates a potential hazard.

The potential for injury exists if cautions are not
observed. Consult equipment documentation for
specific details.
Caution. Slide-mounted equipment is not to be
used as a shelf or a work space.
Warning. This symbol indicates the presence of
hazardous energy circuits or electric shock
hazards. Refer all servicing to qualified personnel.
Warning. This symbol indicates the presence of a
hot surface or hot component. If this surface is
contacted, the potential for injury exists.
To reduce risk of injury from a hot component,
allow the surface to cool before touching.

Warning. Hazardous moving parts keep away

from moving fan blades.

General Precautions
· Follow all caution and warning instructions marked on the equipment and
explained in the accompanying equipment documentation.

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Machine Room Environment
· This device is for use only in a machine room or IT room.
 · Make sure that the area in which you install the system is properly
ventilated and climate-controlled.
· Ensure that the voltage and frequency of your power source match the
voltage and frequency inscribed on the electrical rating label of the
equipment.
· Do not install the system in or near a plenum, air duct, radiator, or heat
register.
· Never use the product in a wet location.

Equipment Chassis
· Do not block or cover the openings to the system.
· Never push objects of any kind through openings in the equipment.
Dangerous voltages might be present.
· Conductive foreign objects can produce a short circuit and cause fire,
electric shock, or damage to your equipment.
· Lift equipment using both hands and with your knees bent.

Equipment Racks
To avoid injury or damage to the equipment:
· Observe local occupational health and safety requirements and guidelines
for manual materials handling.
· Do not attempt to move a rack by yourself; a minimum of two people are
needed to move a rack.
· Do not attempt to move a fully loaded rack. Remove equipment from the
rack before moving it.
· Do not attempt to move a rack on an incline that is greater than 10 degrees
from the horizontal.
· Make sure the rack is properly secured to the floor or ceiling.
· Make sure the stabilizing feet are attached to the rack if it is a single-rack
installation.
· Make sure racks are coupled together if it is a multiple-rack installation.
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· Make sure the rack is level and stable before installing an appliance in the
rack.
· Make sure the leveling jacks are extended to the floor.
· Make sure the full weight of the rack rests on the leveling jacks.
· Always load the rack from the bottom up. Load the heaviest component in
the rack first.
· Make sure the rack is level and stable before pulling a component out of the
rack.
· Make sure only one component is extended at a time. A rack might become
unstable if more than one component is extended.
To avoid damage to the equipment:
· The rack width and depth must allow for proper serviceability and cable
management.
· Ensure that there is adequate airflow in the rack. Improper installation or
restricted airflow can damage the equipment.
· The rack cannot have solid or restricted airflow doors. You must use a mesh
door on the front and back of the rack or remove the doors to ensure adequate
air flow to the system.
· If you install the Model in a rack, do not place equipment on top of the unit. It
will cause restricted airflow and might cause damage to the equipment.
· Make sure the product is properly matted with the rails. Products that are
improperly matted with the rails might be unstable.
·Verify that the AC power supply branch circuit that provides power to the rack is
not overloaded. This will reduce the risk of personal injury, fire, or damage to the
equipment. The total rack load should not exceed 80 percent of the branch circuit
rating. Consult the electrical authority having jurisdiction over your facility wiring
and installation requirements.
·Verify that the AC power supply branch circuit that provides power to the rack is
not overloaded. This will reduce the risk of personal injury, fire, or damage to the
equipment. The total rack load should not exceed 80 percent of the branch circuit
rating. Consult the electrical authority having jurisdiction over your facility wiring
and installation requirements.
·Verify that the AC power supply branch circuit that provides power to the rack is
not overloaded. This will reduce the risk of personal injury, fire, or damage to the
equipment. The total rack load should not exceed 80 percent of the branch circuit
rating. Consult the electrical authority having jurisdiction over your facility wiring
and installation requirements.

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· When use 100V-127VAC input: The system does not support redundant PSU
operation if the total system load exceeds 20A.
Equipment Power Cords
· Use only the power cords and power supply units provided with your system.
The system might have one or more power cords.
· Plug the power cord into a grounded (earthed) electrical outlet that is easily
accessible at all times.
· In all European electrical environments, you must ground the Green/Yellow tab
on the power cord. If you do not ground the Green/Yellow tab, it can cause an
electrical shock due to high leakage currents.
· Do not place objects on AC power cords or cables. Arrange them so that no one
might accidentally step on or trip over them.
· Do not pull on a cord or cable. When unplugging from the electrical outlet, grasp
the cord by the plug.
· To reduce the risk of electrical shock, disconnect all power cords before
servicing the appliance.

Equipment Batteries
· The system battery contains lithium manganese dioxide. If the battery pack is
not handled properly, there is risk of fire and burns.
· Do not disassemble, crush, puncture, short external contacts, or dispose of the
battery in fire or water.
· Do not expose the battery to temperatures higher than 60°C (140°F).
· The system battery is not replaceable. If the battery is replaced by an incorrect
type, there is danger of explosion. Replace the battery only with a spare
designated for your product.
· Do not attempt to recharge the battery.
· Dispose of used batteries according to the instructions of the manufacturer. Do
not dispose of batteries with the general household waste. To forward them to
recycling or proper disposal, use the public collection system or return them to
TYAN, your authorized TYAN partner, or their agents.

Equipment Modifications
· Do not make mechanical modifications to the system. TYAN is not responsible
for the regulatory compliance of TYAN equipment that has been modified.
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Equipment Repairs and Servicing
· The installation of internal options and routine maintenance and service of this
product should be performed by trained service technician/personnel who are
knowledgeable about the procedures, precautions, and hazards associated with
equipment containing hazardous energy levels.
· Do not exceed the level of repair specified in the procedures in the product
documentation. Improper repairs can create a safety hazard.
· Allow the product to cool before removing covers and touching internal
components.
· Remove all watches, rings, or loose jewelry when working before removing
covers and touching internal components.
· Do not use conductive tools that could bridge live parts.
· Use gloves when you remove or replace system components; they can become
hot to the touch.
· If the product sustains damage requiring service, disconnect the product from
the AC electrical outlet and refer servicing to an authorized service provider.
Examples of damage requiring service include:
– The power cord, extension cord, or plug has been damaged.
– Liquid has been spilled on the product or an object has fallen into the product.
– The product has been exposed to rain or water.
– The product has been dropped or damaged.
– The product does not operate normally when you follow the operating
instructions.

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Table of Contents

Chapter 1: Overview .....................................................................14

1.1 About the TYAN GT86C-B5630 .......................................... 14
1.2 Standard Parts List .............................................................. 22
1.2.1 Box Contents ................................................................ 22
1.2.2 Accessories .................................................................. 22
1.3 About the Product ................................................................ 23
1.3.1 System Front View ....................................................... 23
1.3.2 System Rear View ........................................................ 23
1.3.3 LED Definitions ............................................................. 24
1.3.4 Internal View ................................................................. 25
1.3.5 Board Image ................................................................. 27
1.3.6 Block Diagram .............................................................. 28
Chapter 2: Setting Up ...................................................................29
2.0.1 Before you Begin .......................................................... 29
2.0.2 Work Area ..................................................................... 29
2.0.3 Tools ............................................................................. 29
2.0.4 Precautions ................................................................... 30
2.1 Installing Motherboard Components ................................... 31
2.1.1 Removing the Chassis Cover ....................................... 31
2.1.2 Installing the CPU and Heat sink .................................. 33
2.1.3 Installing the Memory ................................................... 35
2.1.4 Installing Hard Drives ................................................... 39
2.1.5 Installing the Add-On Card ........................................... 44
Chapter 3: Replacing Pre-Installed Components ...................... 50
3.1 Introduction .......................................................................... 50
3.2 Disassembly Flowchart ........................................................ 50
3.3 Removing the Cover ............................................................ 51
3.4 Replacing the Riser Card .................................................... 51
3.5 Replacing the System Fan .................................................. 52
3.6 Replacing the HDD Backplane ............................................ 53
3.6.1 HDD Backplane Features ............................................. 54
3.6.2 Connector Definition ..................................................... 54
3.7 Replacing the Power Supply ............................................... 55
3.8 Replacing the Motherboard ............................................. 59
Chapter 4: BIOS Setup ..................................................................60
4.1 About the BIOS ................................................................ 60
4.2 Main Menu ....................................................................... 62
4.3 Advanced Menu ............................................................... 64
4.4 Platform Configuration ..................................................... 93
4.5 Socket Configuration ..................................................... 105
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4.6 Server Management ...................................................... 132
4.7 Security .......................................................................... 137
4.8 Boot ............................................................................... 142
4.9 Save & Exit .................................................................... 145
Chapter 5: Diagnostics ...............................................................147
5.1 Flash Utility .................................................................... 147
5.2 AMIBIOS Post Code (Aptio) .......................................... 148
Appendix I: Installing IO Plate for OCP Card ...........................156
Appendix II: Cable Connection Tables .....................................160
Appendix III: FRU Parts Table ....................................................162
Appendix IV: Technical Support................................................164

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Chapter 1: Overview
1.1 About the TYAN GT86C-B5630
®
Congratulations on your purchase of the TYAN GT86C-B5630, a highly optimized
rack-mountable 1U barebone system.GT86C-B5630 is designed to support single
® ®
Intel Xeon Scalable Processor Families and Up to 384GB RDIMM/ 768GB
LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS DDR4 Memory, providing a rich
feature set and incredible performance. Leveraging advanced technology from
®
Intel ,GT86C-B5630 server system is capable of offering scalable 32 and 64-bit
computing, high-bandwidth memory design, and lightning-fast PCI-E bus
implementation.GT86C-B5630 not only empowers your company in today’s
demanding IT environment but also offers a smooth path for future application
usage.
®
TYAN also offers theGT86C-B5630 in a version that can support up to twelve
3.5”/2.5” Easy-Swap SSDs/HDDs and two 2.5” fixed SSDs/HDDs.GT86C-B5630
uses rack-mountable 1U chassis featuring a robust structure and a solid
mechanical enclosure. All of this provides GT86C-B5630 the power and flexibility
to meet the needs of nearly any server application.

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1.2 Features

B5630G86CV12 Specifications
Form Factor 1U Rackmount
Chassis Model GT86C
33.86" x 17.32" x 1.72" (860 x 440 x
Dimension (D x W x H)
System 43.6mm)
Motherboard S5630GMR
Gross Weight 20 kg (44 lbs)
Net weight 10.5kg (23.5 lbs)

Front Panel Buttons (1) PWR, (1) RST

3.5"/2.5" Easy-Swap SSD/HDD,

Type / Q'ty
(12)
HDD backplane
Internal Drive Bay SATA 6.0Gb/s
support
Supported HDD
(12) SATA 6Gb/s
Interface

Type / Q'ty (2) 2.5" easy-swap HDD/SSD

Internal Drive Bay Supported HDD
(2) SATA 6Gb/s
Interface
System Cooling
FAN (5) 4cm fans
Configuration
Type PSU (single)
Input Range AC 100-127V/8A, AC 200-240V/4A
Frequency 50/60Hz
Power Supply
Output Watts 500 Watts
Efficiency PFC, 80 plus gold
Redundancy N/A

Socket Type / Q'ty LGA3647/ (1)

Supported CPU Series Intel Xeon Scalable Processor
Processor
Thermal Design
Max up to 165W
Power (TDP) wattage

Chipset PCH Intel C621

Supported DIMM
(12) DIMM slots
Qty
Memory
DDR4 RDIMM/RDIMM
DIMM Type / Speed
3DS/LRDIMM/LRDIMM 3DS

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2933/2666 / Intel Optane DC
Persistent Memory Module
(DCPMM)
Up to 384GB RDIMM/ 768GB
LRDIMM/ 1,536GB RDIMM
Capacity
3DS/LRDIMM 3DS *Follow latest
Intel DDR4 Memory POR
Memory channel 6 Channels
Memory voltage 1.2V
DDR4-2933 speed only supported
with 2nd Gen Intel Xeon Scalable
Processor (codename: Cascade
Lake) and in a 1 DIMM per channel
configuration. / Intel Optane DC
Notification Persistent Memory Module
(DCPMM) only supported with
specific 2nd Gen Intel Xeon Scalable
Processor (codename: Cascade
Lake). Please contact Tyan
Technical Support for more detail.

PCI-E (1) PCI-E Gen3 x16 slot

Expansion Slots (1) PCI-E Gen3 x16 OCP slots
Others:
(conn.A+conn.B)

Port Q'ty (1) PHY

LAN
PHY Realtek RTL8211E

Connector (2) Mini-SAS HD (8-ports)

Controller Intel C621
SATA
Speed 6.0 Gb/s
RAID RAID 0/1/10/5 (Intel RSTe)
Storage (2) SATA/SATA-DOM, (1)
Connector
Mini-SAS HD (4-ports)
sSATA Controller Intel C621
Speed 6.0 Gb/s
RAID RAID 0/1/10/5 (Intel RSTe)

Connector type D-Sub 15-pin

Graphic Resolution Up to 1920x1200
Chipset Aspeed AST2500

(2) USB3.0 ports (at rear), (1)

USB
USB3.0 TYPE-A
I/O Ports
COM (1) DB-9 COM port
VGA (1) D-Sub 15-pin port
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RJ-45 (1) GbE port dedicated for IPMI

TPM (Optional) Please refer to our TPM

TPM Support
supported list.

Chipset Aspeed AST2500

Monitors temperature for CPU &
Temperature
memory & system environment
Monitors voltage for CPU,
Voltage
System Monitoring memory, chipset & power supply
Over temperature warning
LED indicator, Fan & PSU fail LED
indicator
Others Watchdog timer support

Onboard Chipset Onboard Aspeed AST2500

IPMI 2.0 compliant baseboard
management controller (BMC),
AST2500 iKVM
Supports storage over IP and
Feature
Server Management remote platform-flash, USB 2.0
virtual hub
24-bit high quality video
AST2500 IPMI
compression, 10/100/1000 Mb/s
Feature
MAC interface

Brand / ROM size AMI, 32MB

Hardware Monitor, ACPI 5.0,
SMBIOS 3.0/PnP/Wake on LAN,
BIOS Boot from USB device/PXE via
Feature LAN/Storage, User Configurable
FAN PWM Duty Cycle, Console
Redirection, ACPI sleeping states
S4,S5

Please refer to our AVL support

lists., SuSE Linux/ SLES, VMware
Operating System OS supported list ESX, Windows Server 2008, 2008
R2, Red Hat Enterprise Linux
Server

CE (DoC) Class A
VCCI Class A
Regulation CB/LVD Yes
RCM Class A
FCC (DoC) Class A

Operating Temp. 10° C ~ 35° C (50° F~ 95° F)

Operating Environment
Non-operating Temp. - 40° C ~ 70° C (-40° F ~ 158° F)

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In/Non-operating 90%, non-condensing at 35° C,
Humidity 5%~95%, non-condensing

RoHS RoHS 6/6 Compliant Yes

Manual (1) Quick Installation Guide

Package Contains Installation CD (1) TYAN Device Driver CD
Barebone (1) GT86C-B5630 Barebone

B5630G86CV12R Specifications
Form Factor 1U Rackmount
Chassis Model GT86C
33.86" x 17.32" x 1.72" (860 x 440 x
Dimension (D x W x H)
System 43.6mm)
Motherboard S5630GMR
Gross Weight 20 kg (44 lbs)
Net weight 10.5kg (23.5 lbs)

Front Panel Buttons (1) PWR, (1) RST

3.5"/2.5" Easy-Swap SSD/HDD,

Type / Q'ty
(12)
HDD backplane
Internal Drive Bay SATA 6.0Gb/s
support
Supported HDD
(12) SATA 6Gb/s
Interface
System Cooling
FAN (5) 4cm fans
Configuration
Type RPSU
Input Range AC 110-240V/8-4A
Frequency 47-63 Hz
Power Supply
Output Watts 500 Watts
Efficiency PFC, 80 plus gold
Redundancy 1+1

Socket Type / Q'ty LGA3647/ (1)

Supported CPU Series Intel Xeon Scalable Processor
Processor
Thermal Design
Max up to 165W
Power (TDP) wattage

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Chipset PCH Intel C621

Supported DIMM
(12) DIMM slots
Qty
DDR4 RDIMM/RDIMM
3DS/LRDIMM/LRDIMM 3DS
DIMM Type / Speed 2933/2666 / Intel Optane DC
Persistent Memory Module
(DCPMM)
Up to 384GB RDIMM/ 768GB
LRDIMM/ 1,536GB RDIMM
Capacity
3DS/LRDIMM 3DS *Follow latest
Intel DDR4 Memory POR
Memory channel 6 Channels
Memory
Memory voltage 1.2V
DDR4-2933 speed only supported
with 2nd Gen Intel Xeon Scalable
Processor (codename: Cascade
Lake) and in a 1 DIMM per channel
configuration. / Intel Optane DC
Persistent Memory Module
Notification
(DCPMM) only supported with
specific 2nd Gen Intel Xeon
Scalable Processor (codename:
Cascade Lake). Please contact
Tyan Technical Support for more
detail.

PCI-E (1) PCI-E Gen3 x16 slot

Expansion Slots (1) PCI-E Gen3 x16 OCP slots
Others:
(conn.A+conn.B)

Port Q'ty (1) PHY

LAN
PHY Realtek RTL8211E

Connector (2) Mini-SAS HD (8-ports)

Graphic Connector type D-Sub 15-pin

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Resolution Up to 1920x1200
Chipset Aspeed AST2500

(2) USB3.0 ports (at rear), (1)

USB
USB3.0 TYPE-A
I/O Ports COM (1) DB-9 COM port
VGA (1) D-Sub 15-pin port
RJ-45 (1) GbE port dedicated for IPMI

TPM (Optional) Please refer to our TPM supported

TPM Support
list.

Chipset Aspeed AST2500

Monitors temperature for CPU &
Temperature
memory & system environment
Monitors voltage for CPU, memory,
Voltage
System Monitoring chipset & power supply
Over temperature warning
LED indicator, Fan & PSU fail LED
indicator
Others Watchdog timer support

Onboard Chipset Onboard Aspeed AST2500

Brand / ROM size AMI, 32MB

Hardware Monitor, ACPI 5.0,
SMBIOS 3.0/PnP/Wake on LAN,
BIOS Boot from USB device/PXE via
Feature LAN/Storage, User Configurable
FAN PWM Duty Cycle, Console
Redirection, ACPI sleeping states
S4,S5

Please refer to our AVL support

lists., SuSE Linux/ SLES, VMware
Operating System OS supported list ESX, Windows Server 2008, 2008
R2, Red Hat Enterprise Linux
Server

Regulation CE (DoC) Class A

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VCCI Class A
CB/LVD Yes
RCM Class A
FCC (DoC) Class A

Operating Temp. 10° C ~ 35° C (50° F~ 95° F)

Non-operating Temp. - 40° C ~ 70° C (-40° F ~ 158° F)
Operating Environment
In/Non-operating
90%, non-condensing at 35° C
Humidity

RoHS RoHS 6/6 Compliant Yes

Manual (1) Quick Installation Guide

Package Contains Installation CD (1) TYAN Device Driver CD
Barebone (1) GT86C-B5630 Barebone

NOTE:
1. The specifications are subject to change without prior notice.
2. Please visit our website for the latest specifications.

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1.2 Standard Parts List
This section describes GT86C-B5630 package contents and accessories. Open the
box carefully and ensure that all components are present and undamaged. The
product should arrive packaged as illustrated below.

1.2.1 Box Contents

GT86C-B5630 (B5630G86CV12R) Box Content

 (1) 1U barebone with (12) easy-swap HDD bays

 (1) 500W PSU (1+1 redundant)
 (1) S5630GMR system Board (pre-installed)
 (5) System Fans
 (3) M7051G86-BP6-4 HDD Backplane (pre-installed)
 (1) M2091/Riser Board(pre-installed)

GT86C-B5630 (B5630G86CV12) Box Content

 (1) 1U barebone with (12) easy-swap HDD bays

 (1) 2.5’ easy-swap HDD/SSD HDD bays
 (1) 500W PSU
 (1) S5630GMR system Board (pre-installed)
 (5) System Fans
 (3) M7051G86-BP6-4 HDD Backplane (pre-installed)
 (1) M2091/Riser Board(pre-installed)

1.2.2 Accessories

If any items are missing or appear damaged, contract your retailer or browse to
®
TYAN ’s website for service: http://www.tyan.com.

GT86C-B5630 Accessory Kit

 (1) CPU Clip Narrow Non-Fabric CPU Carrier+COVER

 (1) Rail kit
 (1) QIG
 (1) CPU heatsink
 (2) US power cord(B5630G86CV12R)/(1) US power cord (B5630G86CV12)
 (2) EU power cord(B5630G86CV12R)/(1) EU power cord (B5630G86CV12)
 (3) SCREW KIT

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1.3 About the Product
The following views show you the product.

1.3.1 System Front View

1.3.2 System Rear View

B5630G86CV12

B5630G86CV12R

No. Description
1. 500W Power Supply
2. ID LED Button
3 Serial Port
4. Type-A USB 3.0 Ports
5 Optional OCP LAN card location
6 D-sub VGA Port
7 1Gb RJ45 LAN from Realtek RLT8211
(dedicated for BMC/IPMI)
8 Expansion Slots for PCI-E add on card
9 500W PSU (1+1 redundant)

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1.3.3 LED Definitions

1Gbps LAN Port LAN Indication

10/100/1000 Mbps LAN Link/Activity LED Scheme

Left LED Right LED

(Link/Activity) (Speed)

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1.3.4 Internal View

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NO. Description NO. Description
(12) 3.5”/2.5” easy-swap
1. 7. (3) M7051G86-BP6-4 HDD Backplane
HDD/SSD Hard Disk tray
2. (5) System fans 8. PCIE 3.0 Slot x16
3. Riser Card bracket 9. OCP A Slot (J36)
4. 500W PSU 10. OCP B Slot (J37)
(1) Internal 2.5” HDD/SSD Hard Disk tray
5. CPU socket 11.
(can be install 2 facilities)
6. Memory Slots 12. 500W PSU (1+1) redundant
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1.3.5 Board Image

This picture is representative of the latest board revision available at the

time of publishing. The board you receive may not look exactly like the
above picture.

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1.3.6 Block Diagram

S5630 Block Diagram

NOTE: Please refer to Tyan S5630 User Guide for more MB details.

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Chapter 2: Setting Up

2.0.1 Before you Begin

This chapter explains how to install the CPUs, CPU heatsinks, memory
modules, and hard drives. Instructions on inserting add on cards are
also given.

2.0.2 Work Area

Make sure you have a stable, clean working environment. Dust and dirt
can get into components and cause malfunctions. Use containers to
keep small components separated. Putting all small components in
separate containers prevents them from becoming lost. Adequate
lighting and proper tools can prevent you from accidentally damaging
the internal components.

2.0.3 Tools

The following procedures require only a few tools, including the

following:
 A cross head (Phillips) screwdriver
 A grounding strap or an anti-static pad
Most of the electrical and mechanical connections can be disconnected
using your fingers. It is recommended that you do not use needle-nosed
pliers to remove connectors as these can damage the soft metal or
plastic parts of the connectors.

Caution!
1. To avoid damaging the motherboard and associated
components, do not use torque force greater than
7kgf/cm (6.09 lb/in) on each mounting screw for
motherboard installation.
2. Do not apply power to the board if it has been
damaged.

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2.0.4 Precautions

Components and electronic circuit boards can be damaged by

discharges of static electricity. Working on a system that is connected to
a power supply can be extremely dangerous. Follow the guidelines below
to avoid damage to GT86C-B5630 or injury to yourself.

 Ground yourself properly before removing the top cover of the

system. Unplug the power from the power supply and then touch a
safely grounded object to release static charge (i.e. power supply
case). If available, wear a grounded wrist strap. Alternatively,
discharge any static electricity by touching the bare metal chassis
of the unit case, or the bare metal body of any other grounded
appliance.

 Avoid touching motherboard components, IC chips, connectors,

memory modules, and leads.

 The motherboard is pre-installed in the system. When removing

the motherboard, always place it on a grounded anti-static surface
until you are ready to reinstall it.

 Hold electronic circuit boards by the edges only. Do not touch the
components on the board unless it is necessary to do so. Do not
flex or stress circuit boards.

 Leave all components inside the static-proof packaging that they

ship with until they are ready for installation.

 After replacing optional devices, make sure all screws, springs, or

other small parts are in place and are not left loose inside the case.
Metallic parts or metal flakes can cause electrical shorts.

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2.1 Installing Motherboard Components
This section describes how to install components on to the motherboard, including
CPUs, memory modules and Add-on cards.

2.1.1 Removing the Chassis Cover

Follow these instructions to remove GT86C-B5630 chassis cover.

1. Remove the side screw on the chassis cover as in the small diagram.
Loosen the Thumb screw on the back side of the chassis as in the small
diagram in a counterclockwise direction.

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2. Push the cover in the direction of the arrow, and take out the top cover from
chassis kit.

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2.1.2 Installing the CPU and Heat sink

Follow the steps below on installing CPUs and CPU heat sinks.

1. Locate the CPU socket. Remove the CPU protection cap.

2. Put the Narrow-Fabric processor on the Carrier hook clips.

3. Align and install the processor on the carrier.

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4. Carefully flip the heatsink. Then install the carrier assembly on the bottom of
the heatsink and make sure Carrier hook clips is stuck in the heatsink.

5. Align the heatsink on the CPU socket by the guide pins and make sure the
gold arrow is located in the correct direction. Then place the heatsink onto
the top of the CPU socket.

6. To secure the heatsink, use a T30 Security Torx to tighten the screws in a
sequential order (1->2 -> 3 -> 4). When disassembling the heatsink, loosen
the screws in reverse order (4 -> 3 ->2 ->1).

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2.1.3 Installing the Memory

Follow these instructions to install the memory modules onto the motherboard.

1. Press the memory slot locking levers in the direction of the arrows as
shown in the following illustration.

2. Align the memory module with the slot. When inserted properly, the memory
slot locking levers lock automatically onto the indentations at the ends of the
module.

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DIMM Location

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Recommended Memory Population Table

Quantity of
Single CPU memory installed
Installed
1 2 3 4 5 6 7 8 9 10 11 12
CPU0_DIMM_A0 √ √ √ √ √ √ √
CPU0_DIMM_A1 √ √
CPU0_DIMM_B0 √ √ √ √ √
CPU0_DIMM_B1 √ √
CPU0_DIMM_C0 √ √
CPU0_DIMM_C1 NOT NOT NOT
√
CPU0_DIMM_D0 Recommended Recommended Recommended
√ √ √ √ √ √
CPU0_DIMM_D1 √ √
CPU0_DIMM_E0 √ √ √ √
CPU0_DIMM_E1 √ √
CPU0_DIMM_F0 √ √
CPU0_DIMM_F1 √
NOTE:
1.√ indicates a populated DIMM slot.
2. Use paired memory installation for max performance.
3. Populate the same DIMM type in each channel, specifically
- Use the same DIMM size
- Use the same # of ranks per DIMM
4. Dual-rank DIMMs are recommended over single-rank DIMMs.
5. Always install with CPU0 Socket and DIMM_0 Slot first, following the alphabetical
order.

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Supports up to (6+6) DDR-4 up to 2666MHz memory
 All installed memory will automatically be detected and no jumpers or settings
need changing
 All memory must be of the same type and density

DDR4 Memory POR

 Physical Ranks are used to calculate DIMM Capacity.

 Supported DRAM Densities are 4Gb, 8Gb,16Gb, 32Gb, 64Gb.

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2.1.4 Installing Hard Drives
TheGT86C-B5630 supports (12) 2.5”/3.5” HDD/SSD. Follow these instructions to
install a hard drive.

3.5” Hard Disk Drive Installation

1. Press the lock lever to push the Hard Disk tray in the direction of the arrow to
release the HDD tray.

2. Take out the Hard Disk tray. Notice that move the rubber screw into the 3.5”
location.

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3. Place a hard drive into the drive tray. Use four screws to secure the HDD.

4. Reinsert the HDD tray into the chassis.

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2.5” Hard Disk Drive Installation

1. Press the lock lever to push the Hard Disk tray in the direction of the arrow to
release the HDD tray.

2. Take out the Hard Disk tray. Notice that move the rubber screw into the 2.5”
location.

3. Place a hard drive into the drive tray. Use four screws to secure the HDD.

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4. Reinsert the HDD tray into the chassis.

Installing Slim-type 2.5” HDD/SSD (Optional)

1 Lift up the locking lever to release the 2.5” HDD/SSD bracket.

2 Insert the 2.5” hard drives into the bracket and secure them with eight screws.

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3 Position the HDD bracket in its original place. Screw it firmly to the chassis.
Connect the SATA signal cables and the HDD power cables. And press down the
locking lever.

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2.1.5 Installing the Add-On Card

TheGT86C-B5630 has one preinstalled M2091 riser card.

You can install an Add-On card into the expansion slot which is available with riser
card. The following instructions are for Add-On card installation. You may refer to
the procedures below for the installation.
1. Remove the screw of PCI-E bracket and lift up the bracket.

2. Remove the screw to slide the PCIE bracket.

3. Insert the Add-On card to the M2091 riser card.

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4. Reinstall the riser bracket to the chassis.

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2.2 Rack Mounting

CAUTION: Please note that the following illustrations are based on a

GT86C-B5630 barebone which may not look exactly like the
rackmount server you purchased. Therefore, the illustrations should be
held for your reference only.

After installing the necessary components, the TYANGT86C-B5630 can be mounted

in a rack using the supplied rack mounting kit.
Rack mounting kit

1. Sliding Rails x 2
2. Screws Kit x 1

2.2.1 Installing the Server in a Rack

Follow these instructions to mount the TYANGT86C-B5630 into an industry standard
19" rack.
NOTE: Before mounting the TYANGT86C-B5630 in a rack, ensure that all internal
components have been installed and that the unit has been fully tested. However, to
make the installation easier, we suggest that you remove all HDD trays before you
insert the chassis into the rack.

Screws List

No. Screw Size Quantity

A M5+washer 8pcs
Rail Kit

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2.2.2 Installing the inner Rails to the Chassis
1. Draw out the inner rail from the rail assembly. When the rail comes to a
stop pull the tab to release the latch and completely draw the inner rail out.

2. Align the inner sliding rail on one side of the server. Pull the inner sliding
rail forward to secure it to the chassis.

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2.2.3 Installing the Outer Rails to the Rack
1. Secure the outer rail to the rack using (8) M5+washer (A) screws for
each side.

2.2.4 Rack mounting the Server

1. Lift the unit and then insert the inner slide rails into the middle rails.
Press the white button in the direction of the arrow to push the whole
system into the rack.

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2. Secure the chassis to the rack by rotate the thumb screws.

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Chapter 3: Replacing Pre-Installed Components
3.1 Introduction
This chapter explains how to replace the pre-installed components, including the
S5630GMR Motherboard, M7051G86-BP6-4 Backplane, M2091 Riser Card,
System Fan and Power Supply etc.

3.2 Disassembly Flowchart

The following flowchart outlines the disassembly procedure.

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3.3 Removing the Cover
Before replacing any parts you must remove the chassis cover. Follow Chapter
2.1.1 to remove the cover of GT86C-B5630.

3.4 Replacing the Riser Card

1. TheGT86C-B5630 has preinstalled (1) M2091 riser cards. Release the 2 screw to
lift the riser bracket from the chassis.

2. Remove the 2 screws to release the M2091 riser card.

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3.5 Replacing the System Fan
1. GT86C-B5630 has equipment with five system fans which you need to replace
up.

2. Disconnect all the fan cables and take out the fan.

3. Take out the rubbers to replace a new fan.

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3.6 Replacing the HDD Backplane

GT86C-B5630 is equipment with three HDD Backplanes. Follow these instructions

to replace the M7051G86-BP6-4 HDD Backplane.

1. First located at the three HDD Backplane.

2. Disconnect all the cables connected to the HDD Backplane.

3. Remove the five screws securing the bracket and lift the bracket.

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3.6.1 HDD Backplane Features

M7051G86-BP6-4

Front View

Rear View

(4) SAS/SATA+ PCIe HDD Connectors

 Integrated I/O (1) MINI SAS Connector connect to MB
(1) 4Pin power connector connect to MB

3.6.2 Connector Definition

Location Definition
J1 SAS/SATA HDD Connector
J2 SAS/SATA HDD Connector
J4 SAS/SATA HDD Connector
J5 SAS/SATA HDD Connector
J3 Mini SAS Connector
SGPIO1 SGPIO Connector
PW2 Power Connector

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3.7 Replacing the Power Supply
To replace the power supply follow these instructions.

B5630G86CV12

1. Disconnect the power cables from and the M7051.

2. Disconnect the power cables from and the Motherboard.

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3. Remove ten (5) screws that secure the power supply to the chassis.

4. Lift the whole power supply unit up from the chassis.

5. Take out the whole power supply.

6. Install a new power supply unit following the steps in reverse.

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B5630G86CV12R

1. Located at the power supply usage.

2. Press the lab to free the power from the power socket.

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3. Replace a new power supply and reinsert it into the power socket following
the above steps in reverse.

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3.8 Replacing the Motherboard
After removing all of the aforementioned cables, follow these instructions to remove
the motherboard from the chassis.

1. Disconnect SATA and USB cables.

2. Disconnect the power cable and PSMI Cable.

3. Disconnect the front panel cable and fan control cable.

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Chapter 4: BIOS Setup
4.1 About the BIOS

The BIOS is the basic input/output system, the firmware on the motherboard that
enables your hardware to interface with your software. The BIOS determines what a
computer can do without accessing programs from a disk. The BIOS contains all the
code required to control the keyboard, display screen, disk drives, serial
communications, and a number of miscellaneous functions. This chapter describes
the various BIOS settings that can be used to configure your system.

The BIOS section of this manual is subject to change without notice and is provided
for reference purposes only. The settings and configurations of the BIOS are current
at the time of print and are subject to change, and therefore may not match exactly
what is displayed on screen.

This section describes the BIOS setup program. The setup program lets you modify
basic configuration settings. The settings are then stored in a dedicated,
battery-backed memory (called NVRAM) that retains the information even when the
power is turned off.

To start the BIOS setup utility:

1. Turn on or reboot your system.
2. Press <F2> or <Del> during POST (<Tab> on remote console) to start the
BIOS setup utility.

4.1.1 Setup Basics

The table below shows how to navigate in the setup program using the keyboard.

Key Function
↑↓ Move cursor
<Enter> Execute command or select submenu
<->/<+> Select the previous or next value/setting of the field
<ESC> Exit current menu
<F1> General help
<F2> Previous values
<F3> Load the Optimal default configuration values of the menu
<F4> Save and exit
<K> Scroll help area upwards
<M> Scroll help area downwards
<PgUp> / <PgDn> Move cursor to next/previous page

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4.1.2 Getting Help

Pressing [F1] will display a small help window that describes the appropriate
keys to use and the possible selections for the highlighted item. To exit the Help
Window, press [ESC] or the [Enter] key again.

4.1.3 In Case of Problems

If you have trouble booting your computer after making and saving the changes with
the BIOS setup program, you can restart the computer by holding the power button
down until the computer shuts off (usually within 4 seconds); resetting by pressing
CTRL-ALT-DEL; or clearing the CMOS.
The best advice is to only alter settings that you thoroughly understand. In particular,
do not change settings in the Chipset section unless you are absolutely sure of what
you are doing. The Chipset defaults have been carefully chosen either by MiTAC or
your system manufacturer for best performance and reliability. Even a seemingly
small change to the Chipset setup options may cause the system to become
unstable or unusable.

4.1.4 Setup Variations

Not all systems have the same BIOS setup layout or options. While the basic look
and function of the BIOS setup remains more or less the same for most systems, the
appearance of your Setup screen may differ from the charts shown in this section.
Each system design and chipset combination requires a custom configuration. In
addition, the final appearance of the Setup program depends on the system
designer. Your system designer may decide that certain items should not be
available for user configuration, and remove them from the BIOS setup program.

NOTE: The following pages provide the details of BIOS menu. Please be aware that
the BIOS menus are continually changing due to continual BIOS updates over the
product lifespan of the motherboard. The BIOS menus provided are current as of the
date when this manual was written. Please visit TYAN’s website at
http://www.tyan.com for information on BIOS updates available for this specific
motherboard.

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4.2 Main Menu

In this section, you can alter general features such as the date and time.
Note that the options listed below are for options that can directly be changed within
the Main Setup screen.

BIOS Information
It displays BIOS related information.

Product Name
It displays Product information.

BIOS Version
It displays BIOS version information

Build Date and Time

It displays the time when built

Access Level
Adminstrator

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Platform Information
It displays the processor and PCH information

Memory Information
It displays the total memory size.

Memory Frequency
It displays Memory frequency

System Date
Set the Date. Use Tab to switch between Date elements. Default Ranges:
Year: 2010-2079
Months: 1-12
Days: dependent on month

System Time
Adjust the system clock.
HH (24 hours format): MM (Minutes): SS (Seconds)

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4.3 Advanced Menu

This section facilitates configuring advanced BIOS options for your system.

iSCSI Configuration
Configure the iSCSI parameters

Intel (R) Virtual RAID on CPU

This formset allows the user to manage Intel(R) Virtual RAID on CPU

Trusted Computing
Trusted Computing settings.

ACPI Settings
System ACPI Parameters

Hardware Health Configuration

Onboard Device Configuration

Onboard Device and Function Configuration.

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AST2500 Super IO Configuration
System Super IO Chip Parameters

S5 RTC Wake Settings

Serial Port Console Redirection

Option ROM Dispatch Policy

PCI Subsystem Settings

PCI, PCI-X and PCI Express Settings

Network Stack Configuration

Network Stack Settings

CSM Configuration
CSM Configuration, Enable/Disable Option ROM execution setting, etc

USB Configuration
USB Configuration Parameters.

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4.3.1 iSCSI Configuration

iSCSI Initiator Name

The worldwide unique name of iSCSI Initiator. Only IQM format is accepted. Range
is from 4 to 223

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4.3.2 Intel(R) Virtual RAID on CPU

Please follow the instructions to initiate the Intel Virtual RAID on CPU function.
Step 1.
Select Socket Configuration  IIO Configuration  Intel® VMD technology 
Intel® VMD for Volume Management Device on Socket 0 (for CPU0) / Socket 1
(for CPU1)  Intel® VMD for Volume Management Device for PStack0 (Slot 1~4)
/ PStack1 (Slot 5~8) / PStack2 (Slot 9~12)
Step 2.
Suppose the card is installed in CPU0 Slot 3, then Intel® VMD for Volume
Management Device for PStack0 will be set to [Enabled].
Step 3.
Save changes and reboot.

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4.3.3 Trusted Computing

Security Device Support

Enable or Disable BIOS support for security device. O.S. will not show Security
device. O.S. will not show Security Device. TCG EFI protocol and INT1A interface
will not be available.
Enabled / Disabled

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4.3.4 ACPI Configuration

Enable ACPI Auto Configuration

Enable or Disables BIOS ACPI Auto Configuration
Disabled / Enabled

Enable Hibernation
Enables or Disables System ability to Hibernate (OS/S4 Sleep state). This option
may not be effective with some operating systems.
Disabled / Enabled

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4.3.5 Hardware Health Configuration

Auto Fan Control

Auto Fan Control help.
Disabled / Enabled

BMC Alert Beep

Enable/Disable BMC Alert Beep.
On / Off

PMBus support
PMBus Support
Disabled / Enabled

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4.3.5.1 Sensor Data Register Monitoring
When you enter the Sensor Data Register Monitoring submenu, you will see the
following dialog window pop out. Please wait 8~10 seconds.

NOTE 1: SDR can not be modified. Read only.

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4.3.6 Onboard Device Configuration

Chassis Intrusion Detection

Enabled: When a chassis open event is detected, the BIOS will display the event.
Disabled / Enabled

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4.3.7 AST2500 Super IO Configuration

Serial Port 1 Configuration

Set Parameters of Serial Port 1 (COMA)

Serial Port 2 Configuration

Set Parameters of Serial Port 2 (COMB)

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4.3.7.1 Serial Port 1 Configuration

Serial Port
Enable or disable Serial Port (COM).
Enabled / Disabled

Device Settings
Read only.

Change Settings
Select an optimal setting for Super IO Device.
Auto / IO=3F8h; IRQ=4;
/ IO=3F8h, IRQ=3, 4, 5, 6, 7, 9, 10, 11, 12;
/ IO=2F8h; IRQ=3, 4, 5, 6, 7, 9, 10, 11, 12;
/ IO=3E8h, IRQ=3, 4, 5, 6, 7, 9, 10, 11, 12;
/ IO=2E8h, IRQ=3, 4, 5, 6, 7, 9, 10, 11, 12;

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4.3.7.2 Serial Port 2 Configuration

Serial Port
Enable or disable Serial Port (COM).
Enabled / Disabled

Device Settings
Read only.

Change Settings
Select an optimal setting for Super IO Device.
Auto / IO=2F8h; IRQ=3;
/ IO=3F8h, IRQ=3, 4, 5, 6, 7, 9, 10, 11, 12;
/ IO=2F8h; IRQ=3, 4, 5, 6, 7, 9, 10, 11, 12;
/ IO=3E8h, IRQ=3, 4, 5, 6, 7, 9, 10, 11, 12;
/ IO=2E8h, IRQ=3, 4, 5, 6, 7, 9, 10, 11, 12;

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4.3.8 S5 RTC Wake Settings

Wake system from S5

Enable or disable system wake on alarm event. Select Fixed time, system will wake
on the hr::min::sec specified. Select dynamic time, system will wake on the current
time+ increase minute(s)
Disabled / Fixed time / Dynamic time

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4.3.9 Serial Port Console Redirection

COM1/COM2
Console Redirection
Console redirection enable or disable.
Disabled / Enabled

Legacy Console Redirection

Legacy Console Redirection Settings

Serial Port for Out-Of-Band Management/Windows Emergency Services (EMS)

Console Redirection
Console redirection enable or disable.
Disabled / Enabled

Console Redirection Settings

The settings specify how the host computer (which the user is using) will exchange
data. Both computers should have the same or compatible settings.
NOTE: Console Redirection Settings menu only available when Console
Redirection was set to [Enabled].

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4.3.9.1 COM1 Console Redirection Settings

Terminal Type
Emulation: ANSI: Extended ASCII char set.
VT100: ASCII char set.
VT100+: Extends VT100 to support color function keys, etc.
VT-UTF8: Uses UTF8 encoding to map Unicode chars onto 1 or more bytes.
VT-UTF8 / VT100 / VT100+ / ANSI

Bits per Second

Select serial port transmission speed. The speed must be matched on the other side.
Long or noisy lines may require lower speeds.
38400 / 9600 / 19200 / 115200 / 57600

Data Bits
8/7
Parity
A parity bit can be sent with the data bits to detect some transmission errors. Even:
parity bit is 0 if the num of 1’s in the data bits is even. Odd: parity bit is 0 if the num of
1’s in the data bits is odd. Mark: parity bit is always 1. Space: parity bit is always 0.
Mark and Space parity do not allow for error detection.
None / Even / Odd / Mark / Space

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Stop Bits
Stop bits indicate the end of a serial data packet. (A start bit indicates the beginning).
The standard setting is 1 stop bit. Communication with slow devices may require
more than 1 stop bit.
1/2

Flow Control
Flow Control can prevent data loss from buffer overflow. When sending data, if the
receiving buffers are full, a ‘stop’ signal can be sent to stop the data flow. Once the
buffers are empty, a ‘start’ signal can be sent to re-start the flow. Hardware flow
control uses two wires to send start/stop signal.
None / Hardware RTS/CTS

VT-UTF8 Combo Key Support

Enable VT-UTF8 Combination Key Support for ANSI/VT100 terminals.
Enabled / Disabled

Recorder Mode
With this mode enabled only text will be sent. This is to capture Terminal data.
Disabled / Enabled

Resolution 100x31
Enable or disable extended terminal resolution.
Disabled / Enabled

Legacy OS Redirection Resolution

On Legacy OS, the Number of Rows of and Columns supported redirection
80x24 / 80x25

Putty KeyPad
Select FunctionKey and KeyPad on Putty.
VT100 / LINUX / XTERMR6 / SCO / ESCN / VT400

Redirection after BIOS POST

When Bootloader is selected, then Legacy console Redirection is disabled before
booting to legacy OS. When Always Enable is selected, then Legacy Console
Redirection is enabled for legacy OS. Default setting for this option is set to always,
Enable.
Always Enable / BootLoader

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4.3.9.2 COM2 Console Redirection Settings

Bits per Second

Select serial port transmission speed. The speed must be matched on the other side.
Long or noisy lines may require lower speeds.
38400 / 9600 / 19200 / 115200 / 57600

Data Bits
8/7

Parity
A parity bit can be sent with the data bits to detect some transmission errors. Even:
parity bit is 0 if the num of 1’s in the data bits is even. Odd: parity bit is 0 if the num of
1’s in the data bits is odd. Mark: parity bit is always 1. Space: parity bit is always 0.
Mark and Space parity do not allow for error detection.
None / Even / Odd / Mark / Space

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Stop Bits
Stop bits indicate the end of a serial data packet. (A start bit indicates the beginning).
The standard setting is 1 stop bit. Communication with slow devices may require
more than 1 stop bit.
1/2

VT-UTF8 Combo Key Support

Enable VT-UTF8 Combination Key Support for ANSI/VT100 terminals.
Enabled / Disabled

Recorder Mode
With this mode enabled only text will be sent. This is to capture Terminal data.
Disabled / Enabled

Resolution 100x31
Enable or disable extended terminal resolution.
Disabled / Enabled

Putty KeyPad
Select FunctionKey and KeyPad on Putty.
VT100 / LINUX / XTERMR6 / SCO / ESCN / VT400

Redirection after BIOS POST

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4.3.9.3 Legacy Console Redirection Settings

Legacy Serial Redirection Port

Select a COM port to display redirection of Legacy OS and Legacy OPROM
Messages
COM1 / COM2

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4.3.9.4 Serial Port for Out-Of-Band Management/Windows Emergency
Services (EMS) Console Redirection Settings

Out-of Band Mgmt Port

Microsoft Windows Emergency Management Services (EMS) allows for remote
management of a Windows Server OS through a serial port.
COM1 / COM2

Terminal Type
VT-UTF8 is the preferred terminal type for out-of-band management. The next best
choice is VT100+ and then VT100. See above, in Console Redirection Settings page,
for more Help with Terminal Type/Emulation.
VT-UTF8 / VT100 / VT100+ / ANSI

Bits per Second

Select serial port transmission speed. The speed must be matched on the other side.
Long or noisy lines may require lower speeds.
115200 / 9600 / 19200 / 38400 / 57600

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Flow Control
Flow Control can prevent data loss from buffer overflow. When sending data, if the
receiving buffers are full, a ‘stop’ signal can be sent to stop the data flow. Once the
buffers are empty, a ‘start’ signal can be sent to restart the flow. Hardware flow
control uses two wires to send start/stop signal.
None / Hardware RTS/CTS

Data Bits / Parity / Stop Bits

Read only.

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4.3.10 Option ROM Dispatch Policy Configuration

Restore if Failure
If system fails to boot and this option is set to ‘Enabled’, software will reset settings
of this page as well as CSM page to its default values automatically.
Disabled / Enabled

PCIE_1 Empty
Enable or Disable Option ROM execution for selected Slot.
Disabled / Enabled

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4.3.11 PCI Subsystem

Above 4G Decoding
Globally Enables or Disables 64bit capable Devices to be decoded in Above 4G
Address Space(Only if System supports 64 bit PCI Decoding).
Enabled / Disabled

SR-IOV Support
If system has SR-IOV capable PCIe devices, this option Enable or Disable Single
root IO virtualization Support
Enabled / Disabled

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4.3.12 Network Stack Configuration

Network Stack
Enable/Disable UEFI Network Stack
Enabled / Disabled

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4.3.13 CSM Configuration

CSM support
Enable/Disable CSM Support
Enabled / Disabled

Option ROM Messages

Set display mode for Option ROM
Force BIOS / Keep Current

Boot option filter

This option controls Legacy/UEFI ROMs priority
UEFI and Legacy / Legacy only / UEFI only

Network
Controls the execution of UEFI and legacy PXE OpROM
Do not launch / UEFI / legacy
Storage
Controls the execution of UEFI and legacy PXE OpROM
Do not launch / UEFI / legacy /
Video
Controls the execution of UEFI and legacy PXE OpROM
Do not launch / UEFI / legacy
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Other PCI devices
Determines OpRom execution policy for devices other than network, storage, or
video
Do not launch / UEFI / legacy

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4.3.14 USB Configuration

Legacy USB Support

Enables USB legacy support. AUTO option disables legacy support if no USB
devices are connected. DISABLE option will keep USB devices available only for
EFI applications.
Enabled / Disabled / Auto

XHCI Hand-off
This is a workaround for OSes without XHCI hand-off support. The XHCI ownership
change should be claimed by XHCI driver.
Enabled / Disabled

USB Mass Storage Driver Support

Enable/Disable USB Mass Storage Driver Support.
Disabled / Enabled

Port 60/64 Emulation

Enable I/O port 60h/64h emulation support. This should be enabled for the complete
USB keyboard legacy support for non-USB aware OSes.
Disabled / Enabled

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USB transfer time-out
The time-out value for Control, Bulk and Interrupt transfers.
20 sec / 10 sec / 5 sec / 1 sec

Device reset time-out

USB mass storage device Start Unit command time-out.
20 sec / 10 sec / 30 sec / 40 sec

Device power-up delay

Maximum time the device will take before it properly reports itself to the Host
Controller. AUTO uses default value: for a Root port it is 100 ms, for a Hub port the
delay is taken from Hub descriptor.
Auto / Manual

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4.4 Platform Configuration

PCH Configuration
Displays and provides option to change the PCH Settings.

Server ME Configuration
Configure Server ME Technology Parameters.

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4.4.1 PCH Configuration

PCI Express Configuration

PCI Express Configuration settings.

PCH SATA Configuration

SATA devices and settings.

PCH sSATA Configuration

sSATA devices and settings.

USB Configuration
USB Configuration Settings.

PCH DFX Configuration

PCH DFX Configuration Options.

PCH state after G3

Select S0/S5 for ACPI state after a G3.
S0 / S5 / Last State

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4.4.1.1 PCI Express Configuration

PCI Express Root Port (To AST2500)

Control the PCI Express Root Port.
Enabled / Disabled

PCIE ASPM
PCI Express Root port ASPM Setting
Disable ASPM / ASPM L1 / ASPM Auto

L1 Substates
PCI Express L1 Substates settings.
Disabled / L1.1 / L1.2 / L1.1 & L1.2

PCIe Speed
Configure PCIe Speed.
Auto / Gen1 / Gen2 / Gen3

Max Payload Size

PCIE Max Payload Size Selection.
MPL128B / MPL256B

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4.4.1.2 PCH SATA Configuration

SATA Controller
Enable or Disable SATA Controller.
Enabled / Disabled

Configure SATA as
Determines how SATA controller(s) operate.
AHCI / RAID

SATA Port 0/1/2/3/4/5/6/7

Port 0/1/2/3/4/5/6/7
Enable or Disable SATA Port.
Disabled / Enabled

Hot Plug
Designates this port as Hot Pluggable.
Disabled / Enabled

Configure as eSATA
Configures port as External SATA (eSATA).
Disabled / Enabled

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Spin Up Device
If enabled for any of ports Staggered Spin Up will be performed and only the drives
witch have this option enabled will spin up at boot. Otherwise all drives spin up at
boot.
Disabled / Enabled

SATA Device Type

Identify the SATA port is connected to Solid State Drive or Hard disk Drive.
Hard Disk Drive / Solid State Drive

SATA Topology
Identify the SATA Topology if it is Default or ISATA or Flex or DirectConnect or M2.
Unknown / ISATA / Direct Connect / Flex / M2

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4.4.1.3 PCH sSATA Configuration

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sSATA Controller
Enable or Disable SATA Controller.
Enabled / Disabled

Configure sSATA as
Determines how SATA controller(s) operate.
AHCI / RAID

Port 0/1/2/3/4/5
Enable or Disable SATA Port.
Disabled / Enabled

Hot Plug
Designates this port as Hot Pluggable.
Disabled / Enabled

Configure as eSATA
Configures port as External SATA (eSATA).
Disabled / Enabled

Spin Up Device
If enabled for any of ports Staggered Spin Up will be performed and only the drives
witch have this option enabled will spin up at boot. Otherwise all drives spin up at
boot.
Disabled / Enabled

sSATA Device Type

Identify the SATA port is connected to Solid State Drive or Hard disk Drive.
Hard Disk Drive / Solid State Drive

SATA Topology
Identify the SATA Topology if it is Default or ISATA or Flex or DirectConnect or M2.
Unknown / ISATA / Direct Connect / Flex / M2

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4.4.1.4 USB Configuration

XHCI Idle L1
Enabled XHCI Idle L1. Disabled to workaround USB3 hot plug will fail after 1 hot plug
removal. Please put the system to G3 for the new settings to take effect.
Enabled / Disabled

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4.4.1.5 PCH DFX Configuration

Enable/Disable ADR
Enable or disable Automatic DIMM Refresh (ADR).
Enabled / Disabled

ADR GPIO
Select between GPIO_B or GPIO_C.
GPIO_B / GPIO_C

Host Partition Reset ADR Enable

Enables/Disables ADR on Host Partition Reset.
Enabled / Disabled

Enable/Disable ADR Timer

Held-off for DEBUG PURPOSES ONLY!.
Enabled / Held-off

ADR timer expire time

Select proper ADR timer value: 25uS, 50uS, 100uS or 0.
25 uS / 50 uS / 100 uS / 0 us

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ADR timer multiplier
Select proper ADR timer multiplier: x1, 8, 24, 40, 56, 64, 72, 80, 88, 96.
x1 / x8 / x24 / x40 / x56 / x64 / x72 / x80 / x88 / x96

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4.4.2 Miscellaneous Configuration

Active Video
Select active video type.
Auto / Onboard Device / PCIE Device

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4.4.3 Server ME Configuration

Read only.

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4.5 Socket Configuration

Processor Configuration
Displays and provides option to change the Processor Settings.

Common RefCode Configuration

Displays the provides option to change the Common RefCode Settings.

Memory Configuration
Displays and provides option to change the Memory Settings.

IIO Configuration
Displays and provides option to change the IIO Settings.

Advanced Power Management Configuration

Displays and provides option to change the Power Management Settings.

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4.5.1 Processor Configuration

Hyper-Threading [ALL]
Enables Hyper Threading (Software Method) to Enable/Disable Logical Processor
threads.
Disabled / Enabled

Max CPUID Value Limit

This should be enabled in order to boot legacy OSes that cannot support CPUs with
extended CPUID functions.
Disabled / Enabled

Execute Disable Bit

When disabled, forces the XD feature flag to always return 0.
Disabled / Enabled

Enable Intel® TXT

Enables Intel® TXT.
Disabled / Enabled

VMX
Enables the Vanderpool Technology, takes effect after reboot.
Disabled / Enabled
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Enable SMX
Enables Safer Mode Extensions.
Disabled / Enabled

Lock Chipset
Lock or Unlock chipset.
Disabled / Enabled

Hardware Prefetcher
MLC Streamer Prefetcher (MSR 1A4h Bit[0]).
Enabled / Disabled

Adjacent Cache Prefetch

MLC Spatial Prefetcher (MSR 1A4h Bit[1]).
Enabled / Disabled

Extended APCI
Enable/Disable extended APIC support.
Disabled / Enabled

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4.5.2 Common RefCode Configuration

MMCFG
Select MMCFG Base.
1G / 1.5G / 1.75G / 2G / 2.25G / 3G

MMCFG Size
Select MMCFG Size.
64M / 128M / 256M / 512M / 1G / 2G

MMIO High Base

Select MMIO High Base.
56T / 40T / 24T / 16T / 4T / 3T / 2T / 1T

MMIO High Granularity Size

Selects the allocation size used to assign mmioh resources. Total mmioh space can
be up to 32xgranularity.
Per stack mmioh resource assignments are multiples of the granularity where 1 unit
per stack is the default allocation.
1G / 4G / 16G / 64G / 256G / 1024G
Numa
Enable or Disable Non uniform Memory Access (NUMA).
Disabled / Enabled

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4.5.3 Memory Configuration

Enforce POR
Enable --- Enforces Plan Of Record restrictions for DDR4 frequency and voltage
programming. Disable --- disables this feature. Auto --- Sets it to the MRC default
setting; current default is Enable.
Auto / POR / Disable

Memory Frequency
Maximum Memory Frequency selections in Mhz. Do not select Reserved
Auto / 1866 / 2133 / 2400 / 2666

Memory Topology
Display memory topology with Dimm population information

Memory RAS Configuration

Display and provides option to change the Memory Ras Settings

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4.5.3.1 Memory Topology

Read only.

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4.5.3.2 Memory RAS Configuration

Mirror Mode
Mirror Mode will set entire 1LM/2LM memory in system to be mirrored, consequently
reducing the memory capacity by half. Mirror Enable will disable XPT Prefetch.
Disabled / Mirror Mode 1LM / Mirror Mode 2LM

Mirror TAD0
Enable Mirror on entire memory for TAD0.
Enabled / Disabled

Enable Partial Mirror

Partial mirror mode will enable the required size of memory to be mirrored. If rank
sparing is enabled partial mirroring will not take effect. Mirror Enable will disable XPT
Prefetch.
Disabled / Partial Mirror mode 1LM / Partial Mirror mode 2LM

Memory Rack Sparing

Enable/Disable Memory Rank Sparing.
Disabled / Enabled

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Correctable Error Threshold
Correctable Error Threshold (1 – 32767) used for sparing, tagging, and leaky bucket.
10

SDDC Plus One

Enable/Disable SDDC Plus One.
Disabled / Enabled

ADDDC Sparing
Enable/Disable ADDDC Sparing.
Disabled / Enabled

Patrol Scrub
Enable/Disable Patrol Scrub.
Disabled / Enabled

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4.5.4 IIO Configuration

Socket0 Configuration
Socket0 Configuration

Intel® VT for Directed I/O (VT-d)

Press <Enter> to bring up the Intel® VT for Directed I/O (VT-d) Configuration menu.

Intel® VMD Technology

Press <Enter> to bring up the Intel® VMD for Volume Management Device
Configuration menu.

PCIe Hot Plug

Enable/Disable PCIe Hot Plug globally.
Disabled / Enabled / Auto / Manual

PCIe ACPI Hot Plug

Enable/Disable PCIe ACPI Hot Plug globally, or allow per-port control. When
Disabled, MSI is generated on HP event. When Enabled, _HPGPE message is
generated.
Disabled / Enable / Per-Port

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PCIe Access Control Services
Enable or disable Access Control Services (ACS) in PCIe Downstream Switch Port.
Disabled / Enable

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4.5.4.1 Socket 0 Configuration

IDU0 (IIO PCIe Br1)

Selects PCIe port Bifurcation for selected slot(s).
x4x4x4x4 / x4x4x8 / x8x4x4 / x8x8 / x16 / Auto

IDU1 (IIO PCIe Br2)

Selects PCIe port Bifurcation for selected slot(s).
x4x4x4x4 / x4x4x8 / x8x4x4 / x8x8 / x16 / Auto