INTERNSHIP WORK REPORT

By

YASH ALIAS YASHODHAN NAGRAJ PRABHU BORKAR

201103079
FOR
Internship report Submitted in partial fulfilment of the requirements for the degree of
BACHELOR OF ENGINEERING
In
ELECTRICAL AND ELECTRONICS ENGINEERING
OF GOA UNIVERSITY
Under the guidance of
Prof. NILESH BORKAR

AUGUST-SEPTEMBER 2023

ELECTRICAL AND ELECTRONICS DEPARTMENT

GOA COLLEGE OF ENGINEERING
(Government of Goa)
Farmagudi, Ponda, Goa - 403401
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INDEX

SR.NO CONTENTS PAGE.NO

1 AKNOWLEDGEMENT
2 ABSTRACT
3 INTRODUCTION
4 INDUSTRY OVERVIEW
5 PRODUCTION LINE AND QUALITY CONTROL
INTRODUCTION
6 PCB MATERIAL STUDY AND REPORT

7 MANUFACTURER SURVEY

8 CONCLUSION

9 FURTHER SCOPE OF WORK DONE

10 DAILY DAIRY
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AKNOWLEDGEMENT

I would like to thank IFB Appliances for allowing us to do an industrial study. I would like to
extend my greatest acknowledgement to department of strategic sourcing, HOD (strategic
sourcing) Mr.Jitendra Mohil, Electronics team and its Manager Mrs.Nina Dobhal along with
my Mentor Mrs.Arushi Saxena, Global sourcing Team and Mr.Sayak Dey for assisting me in
project and our institute mentors Prof.Nilesh W.S Borkar and dr.G.R.Kuncolienkar for
guiding us during our internship .
I would also like to thank all the staff and GETs of our strategic sourcing for helping and
mentoring us in project related and no-project related works.
I am much obliged to everyone for providing us the opportunity for gaining useful experience,
supernumerary to our academic knowledge.
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ABSTRACT
Engineering graduates are highly competent with their skills technical skill, but they lack the
technical exposure, management skills, attitude and interpersonal skills when they first step into
the industry. The primary objective of industrial training program is to overcome such
problems faced by a technical student, and to build up a sound appreciation and understanding
of theoretical principles learnt, by exposing them to industrial environment. It is oriented
towards developing the skills, knowledge and attitudes needed to make an effective start as a
member of the engineering profession.
I am fortunate to have our industrial training experience at IFB Appliance from 31-07-2023 to
21-09-2023
Here in this report, I will present the experience, knowledge, skills I had gained during the
training period.
I had a very successful training period, the experience and knowledge I got is very valuable for
my future career.
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INTRODUCTION

IFB Industries Limited originally known as Indian Fine Blanks Limited started their operations in India
during 1974 in collaboration with Hienrich Schmid AG of Switzerland. The product range includes
Fine Blanked components, tools and related machine tools like Straighteners, Decoilers, Strip loaders
and others. set yourself free The Engineering divisions are located at Kolkata & Bangalore. The
Bangalore unit, apart from Fine Blanked components, manufactures motors for White goods as well as
Automotive applications.
IFB Home Appliances is a division of IFB Industries which makes home appliances across a range of
product categories. It has its manufacturing locations in Kolkata and Verna, Goa, India. The company
has a chain of ~530 retail outlets called IFB Point'.
In 1989, IFB began producing fully automatic washing machines and other state-of the-art appliances.
The Company is reputed for its forte in quality, durability and technology.

FINE BLANKING & MOTOR, IFB INDUSTRIES LIMITED

Originally known as Indian Fine Blanks Limited, IFB was established in 1974 in collaboration with
Hienrich Schmid AG of Switzerland. The name was later changed to IFB Industries Ltd. Operations
were extended to Bengaluru in 1989. We are the leaders in manufacturing fine blanked tools and
components for a variety of industries. The core of our expertise is a world class tool room with
advanced presses, supporting machinery and highly skilled personnel. The Stamping Division was
acquired by the Engineering Division in 2019.
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IFB AUTOMOTIVE PRIVATE LIMITED

Established in 1989, this company supplies fine blanked automotive components; radiator and
condenser motors; seating systems—sliders, recliners, latches and frames; door and hood
latches; door systems and window regulators; to all major auto OEMs in India. Headquartered
in Bangalore,the Company has manufacturing units in Rudrapur, Chennai, Binola and Pune.

History
Originally IFB Industries was known as Indian Fine Blanks Ltd and started operations in India
in 1974 in collaboration with Heinrich Schmid AG of Switzerland. In 1989, it entered an
agreement with Bosch Siemens Hausgerate to produce fully-automatic washing machines and
other domestic appliances.
The Home Appliances Division started in 1990-91. The factory is based at Verna Industrial
Estate, Verna, Goa, India and Visveswariah Industrial Estate, Bengaluru, India.

Products
The company currently offers products for laundry, kitchen, living and industrial purposes
along with additives and accessories. It offers appliances such as washing machines, washer-
dryers, laundry dryers, dishwashers, microwave ovens, air conditioners, hobs, chinmneys and
other cooking appliances.

IFB's Vision
To be the customer's first choice. IFB will be synonymous with Innovation & Technology in its
chosen fields of business activities. IFB will excel in Quality & Services to be in consonance
with Global Standards.

IFB's Mission
To be the best in the eyes of our customers, employees, business partners and shareholders.
Continuously maximizing company's wealth by manufacturing and marketing best quality
engineering products that go into daily life.
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For our customers: The best product to buy, an innovative product that consistently
outperforms peers and outstanding services that makes every customer smile.
For our people: An environment in which individuals can constantly learn, grow and prosper.
For our business: IFB should be the first choice for their products and services.
For our investors: The company should be acknowledged as one with the highest standards of
corporate transparency; that delivers on promises given to shareholders.

IFB Quality Policy

To supply products that will exceed customer's expectation due to excellence through
perfection in quality and service. "To nmaintain an environment for teamwork and continuous
improvement, leading to total quality in all activities of the organisation".
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INDUSTRY OVERVIEW
INTRODUCTION TO DEPARTMENTS

1.R&D

2.PRODUCTION

R&D
The Company's R&D centre is equipped with High-end software's like Solid modelling, CATIA, FEA and Mold
Flow for the design and analysis of various products. Highly skilled & experienced Tool designers design Fine
Blanking parts

Figure 1 Catia by Dassault Figure 2 FEA :finite element analysis

PRODUCTION
The production department produces washing machines which are of two types
1.Top loading
2.Front loading
3.Clothes dryer

Figure 4 front loading Figure 3 top loading Figure 5 clothes dryer

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Production process involves:

Injection moulding: is a manufacturing process for producing parts by injecting molten material
into a mould, or mold. Plastic parts are formed in an injection molding machine, a metal mold
with one or more cavities in the shape of the specified part After being heated to temperature
the plastic is forced into the mold under high pressure Water is passed through the mold to
cool down and solidify the part The mold is opened and the part pushed out by ejector pins

‘
Figure 7 part and injection moldable raw plastic beads Figure 6 2 IM parts

Cabinet press: the sheet metal is pressed and made into desired shapes

Fabrication: Machine presses a chunk of sheet metal between two halves of a mold called die.
The metal will take space between two halves of the die. Possible metal is fed directly from a
coil into a press. Not possible metal is cut out to length and manually placed into a die.

Painting: The cabinet formed after pressing and fabrication are then painted.
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Sub-assemblies: The transmission is assembled manually by workers who bolt, Snap or press
several shafts and add a metered gear together. workers then amount of oil and bolt the unit
together The pump is assembled automatically. Robots place the seals within the cover
impeller and made and body, and seal the pump. The tub parts are in presses and also the sub-
assembly is automatically. After being manufactured The rolled into a drum shape the side is
welded weld is smoothed out and also the drum is placed on which stretches the tub into
expander drum and is final shape.
A bottom is welded onto the smoothed. The balance ring could be a large weight that outside
stabilizes the washer. Its structure is plastic with a ring of metal melted into the plastic for
strength
Assembly: Mount the transmission on the balance ring. The wash transmission is ready on a
bearing that is bolted on the wash tub; the tub is sitting on a conveyor. The lower bearing, the
brake assembly, and therefore the drive pulley is put on the end of the transmission. Next, to
carry all the pieces legs are. together, the pivot dome and bolted on the assembly Workers lift
the module onto the washer base. Springs are added to carry module and base together. A seal
is added, the spin tub is bolted to the transmission inside the mash tub, and its plastic. Covers
are snapped into place. A plastic hub, which attaches the. Agitator to the transmission, is bolted
onto the output end of the shaft. Then the agitator is snapped onto the hub The pump and a
mounting bracket are now bolted onto the motor, which is fitted with a shield to guard against
potential leaks. This assembly is bolted to the bottom of the washer and connected to the
transmission module with a belt and hoses Next, the lid hinges are attached to the lid and also
the top. The top is bolted to the cabinet with a hinge for easy maintenance. A mixing valve to
manage the mixture of hot and cold is bolted to the rear of the cabinet.
The graphics panel is mounted on the control panel. The harness is clipped to the control
connectors at one end, and therefore the other end 1s passed through a hole within the top. To
be mounted to the motor. As to its large size and weight, the cabinet assembly is placed within
the washer by a robot The cabinet is bolted to the bottom and also the controls are snapped
along with the mating connectors on the module and motor. The drain hose is pulled through
the cabinet and the gooseneck is added. This part is what gives the hose its hook shape in order
that it 11 fasten into the drain. After being tested, the front panel is bolted on and a packet of
data and accessories is added The finished unit is crated automatically. A machine opens the
cardboard box and drops it over the washer. The top and bottom flaps. Are simultaneously
folded over and glued. The machine applies pressure to make sure the glue sets properly.
Next, the machine puts a banding strap round the top of the crate for lift truck transportation

Figure 8 Production Line

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DEPARTMENTS OF IFB
❖ Press-Shop
❖ Injection moulding
❖ Tool room
❖ Paint shop
❖ Assembly line Top loader
❖ Assembly line Front loader
❖ PED (Production Engineering Department)
❖ Maintenance
❖ R&D
❖ Bench-marking and Test Lab
❖ Quality
❖ Project
❖ IT
❖ Admin
❖ Supply chain management
i.Vendor
ii.Stratergic Sourcing
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PRODUCTION LINE AND QUALITY CONTROL INTRODUCTION

During my internship at the IFB Washing Machine company, I learned a lot about the manufacturing
line and quality control procedures. The production line is an essential component of every
manufacturing plant, converting raw resources into completed goods. Component assembly, wiring,
testing, packing, and final inspection are all processes at IFB. Quality control is critical for ensuring that
manufactured items satisfy the necessary requirements. The process begins with raw materials that are
extensively evaluated to confirm their suitability for manufacture.

Various quality checks are performed throughout the manufacturing process to guarantee that each
component fulfils the specified standards. IFB's quality control staff detects faults using manual
inspections and automated testing equipment and keeps extensive records to track product quality.

The various quality control include.

• IQC
• PQC
• OQC
• CA Lab testing

IQC -Incoming Quality Control

Incoming Quality Control (IQC) is a crucial aspect of IFB Industries’ quality assurance process. IQC refers to the inspection
of raw materials and components before the manufacturing process begins1. This process aims to limit and control incoming
material problems as much as possible before such materials are put into production.

By implementing stringent IQC procedures, IFB Industries ensures that defect-free rates improve when materials are put into
production on assembly lines. This not only ensures the quality of the final products but also reduces costs associated with
addressing post-production defects.

In conclusion, IQC at IFB Industries plays a vital role in maintaining the quality of their home appliances right from the start
of the production process. It helps the company to exceed customer expectations through excellence in quality and service.

PQC -Process Quality Control

Product Quality Control (PQC) is a critical aspect of IFB Industries’ commitment to delivering high-quality home
appliances. PQC involves rigorous testing and inspection of products during various stages of the manufacturing process to
ensure they meet the company’s high standards for performance, durability, and safety.

IFB Industries has modern Quality Control facilities equipped with high-end design and analysis software such as Solid
Modelling, CATIA, FEA, and Mold Flow. These facilities enable the company to create products to internationally certified
standards1.

The PQC process at IFB Industries includes several steps:

Inspection of Raw Materials: This involves checking the quality of raw materials before they are used in production.

In-Process Quality Control: This includes monitoring and controlling the manufacturing process to prevent defects.

Final Product Inspection: This involves a thorough inspection of the finished product to ensure it meets the required
quality standards.

Through these measures, IFB Industries ensures that every product that leaves its manufacturing units is of the highest
quality, thereby maintaining customer satisfaction and trust.
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PCB MATERIAL STUDY AND REPORT

I had opportunity to study the PCB materials used for the making of display and control board of
washing machine. This was done to move forward with electronics part consolidation I matter of the
PCB material for both control and display board. Here is the classification I came up with.

CLASSIFICATION BASED ON STRUCTURE

SINGLE LAYER PCB: - type of circuit board that
consists of only one layer of conductive material,
usually copper. single-layer PCBs have limited
routing options and are not suitable for complex
circuits with dense component placement.

Figure 9:-Single Layer PCB

DOUBLE LAYER PCB: -type of circuit board

that has two layers of conductive material.
These layers are connected by vias, which are
small holes that allow electrical signals to pass
between the layers. This design allows for more
complex circuitry and can help reduce the size
and cost of electronic devices.
Figure 10 Double Layer PCB

MULTI LAYER PCB: -type of circuit board that consists of more than two layers of conductive
material. These layers are separated by insulating material called the substrate. The multiple layers allow
for increased circuit density and complexity, as well as improved signal integrity and reduced
electromagnetic interference.

Figure 11: - Multi Layer PCB

CLASSIFICATION BASED ON

“RIGID/FLEX/RIGID-FLEX”
RIGID PCB: -A rigid PCB (Printed Circuit
Board) is a traditional board made of rigid Figure 12: - Rigid PCB
materials like fiberglass and epoxy resin. It's
inflexible and primarily used in applications where the board doesn't need to bend or flex. Common in
electronics like computers and appliances.
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FLEX PCB: - A flex PCB is a flexible circuit board

that can be bent, twisted, or folded to fit into tight
spaces or accommodate complex geometries. It's often
used in applications with limited space or where
movement is required, such as wearable devices and
medical equipment.

Figure 13: - Flex PCB

RIGID-FLEX PCBA rigid-flex PCB combines both

rigid and flexible materials in a single board, offering
the advantages of both. It's suitable for devices that
need a mix of rigid and flexible areas, allowing for
compact designs and complex form factors. Often
used in aerospace, military, and advanced electronics
where reliability and space optimization are crucial.
Figure 14: - RIGID-Flex PCB

Table 1: - Rubrics of types of PCB

ASPECTS RIGID PCB FLEX PCB RIGID-FLEX PCB

Flexibility Not flexible Highly flexible Combination of rigidity and

flexibility

Space Requires more space Space-efficient Space-efficient, enables

compact designs

Applications Conventional electronics Wearables, medical devices Aerospace, military, complex

electronics

Form Factor Limited form factors Accommodates unique Supports intricate geometries
shapes

Reliability High reliability Reliable, but potential for High reliability due to reduced
wear interconnects

Complexity Limited complex Supports complex layouts Requires expertise

designs

Cost Generally lower cost Can be more expensive Moderate to higher cost

Weight Heavier Lighter Can be lighter compared to rigid

PCBs
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Materials used for PCB:-

CEM1
CEM-1 is a type of PCB material that is made from a paper
core that is impregnated with epoxy resin and has a single
layer of glass fabric on the surface. It is a low-cost material
that is flame retardant and has good electrical properties.
However, it is not as strong as FR-4, which is the most
common type of PCB material.

Figure 15: -CEM1 PCB

FR-1
FR-1 is a type of PCB material that is made from
paper that is impregnated with epoxy resin. It is a
flame-retardant material that is commonly used
for low-cost, low-density applications where flame
retardancy is not a major concern.

Figure 16: - FR1 PCB

FR-4
FR-4 is the most common type of PCB material. It is
made from fiberglass that is impregnated with epoxy
resin. It is a flame-retardant material that is
commonly used for general-purpose applications that
require flame retardancy and mechanical strength.

Figure 17: - FR4 PCB

ALUMINUM CORE
Aluminium core PCBs are a type of PCB that
has an aluminum core instead of a fiberglass
core. This makes them much more heat-
resistant than traditional PCBs, which is why
they are often used in applications where heat
dissipation is critical, such as in power supplies,
LED lighting, and motor control systems.

Figure 18: - Aluminium Core PCB

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COPPER CORE
Copper core PCBs are a type of PCB that has a
copper core instead of a fiberglass core. This
makes them much more heat-resistant and
electrically conductive than traditional PCBs,
which is why they are often used in applications
where heat dissipation and electrical performance
are critical, such as in high-power electronics and
high-frequency applications.

Figure 19: - Copper Core PCB

ROGGER-MATERIAL
Rogers PCBs are a type of PCB material that is
made by Rogers Corporation. They are known for
their high performance, low loss, and excellent
thermal properties. Rogers PCBs are often used in
high-frequency and high-speed applications, such
as in radar, satellite communication, and
microwave devices.
Figure 20: - Rogger Material PCB

Table 2 :- Comparison between “FR1,FR4 and CEM-1”

property FR1 FR4 CEM-1

Composition Paper-based substrate with epoxy Fiberglass reinforced epoxy Cellulose-based material with epoxy
resin laminate resin

Flame Retardancy Limited flame resistance Superior flame resistance Moderate flame resistance

Mechanical Strength Lower mechanical strength Higher mechanical strength Moderate mechanical strength

Electrical Properties Basic insulation Excellent insulation Moderate insulation

Thermal Properties Limited thermal stability Good thermal stability Moderate thermal stability deforms at
60/90̊c
Deforms beyond 130̊c Deforms beyond 130̊c

Applications Simple consumer electronics Wide range of applications Basic electronics applications

Durability Less durable Highly durable Moderate durability

Toxic Emissions May release smoke and toxic Emits fewer toxic gases May release smoke and gases
gases

Price Generally lower cost Moderate cost Generally lower cost

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Table 3: - CTI of Different materials

CTI of PCB Material

Material groups Comparative Tracking Index
The comparative tracking index value depicts the
resistance of the printed circuit board materials against CTI
ecological influences like moisture and dirt. This is well
Material group I 600 ≤CTI
explained in terms of when the value is higher, then the
higher the material is, the more resistant. Material group II 400 ≤ CTI<600
Table 4:- Appliance CTI Ratings
Material group III a 175 ≤ CTI<400

appliance CTI rating Material group III b 100 ≤ CTI<175

Washing Machine 600 FR4 CTI has a default comparative tracking index of
Air Conditioner 600 175 and which may increase to about 600 unique
materials. There are high PCB CTI (increased CTI 600
Dishwasher 600
PCB material backed by aluminum, CTI 300, and CTI
Refrigerator 400 600v PCB) which works in such a difficult
environment of humidity, filth, and high voltage.
Microwave Oven 400

Table 5: - Application of types of PCB Material in different industries

Industry / PCB Material FR1 FR4 CEM-1

Home Appliances

Air Conditioners (AC) Limited use in Commonly used for control boards -

basic components

Refrigerators Limited use in Commonly used for control boards Limited use in non-critical
systems
basic components

Microwaves Limited use in Commonly used for control boards -

basic components

Dishwashers Limited use in Commonly used for control boards Limited use in non-critical
systems
basic components

Washing Machines Limited use in Commonly used for control boards Limited use in non-critical
systems
basic components

Automobile

Cars Limited use in non-critical Commonly used in control systems Limited use in non-critical
systems systems

Trucks Limited use in non-critical Commonly used in control -

systems systems(higher cti)

Buses Limited use in non-critical Commonly used in control -

systems systems(higher cti)

Trains Limited use in non-critical Commonly used in control -

systems systems(higher cti)
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Electronics Parts Consolidation

BILL OF MATERIAL (BOM)
A bill of materials (BOM) in PCB manufacturing is a list of all the components that are needed to assemble a
printed circuit board (PCB).

The BOM includes information such as the part number, quantity, and description of each component. It is also
important to include the manufacturer and distributor of each component in the BOM.
Table 6: - Sample BOM

Part Description Quantit Manufactur Manufactur Referenc Footpri Tolerance

number y er er part e nt s
number designato
r
RES- Resistor, 100 2 Digi-Key RES-0712P- R1, R2 1206 ±5%
0712P- ohms, 1/4 watt, 101K
101K through-hole

CAP- Capacitor, 10 1 Digi-Key CAP- C1 805 ±10%

0805C100 µF, 25V, 0805C100K
K ceramic,
through-hole

MCP2515- Integrated 1 Microchip MCP2515- U1 TQFP-

I/SN circuit, I/SN 48
microcontrolle
r, 8-bit, 16
MHz

ATTINY8 Microcontrolle 1 Microchip ATTINY85 U2 DIP-8

5-20PU r, 8-bit, 8 MHz -20PU

LED-RED- LED, red, 603 2 Digi-Key LED-RED- D1, D2 603

0603 package 0603

SW-SPST- Switch, SPST, 1 Digi-Key SW-SPST- S1 12mm

12MM 12mm 12MM

My work at IFB included studying a BOM and marking out the alternatives of the manufacturer of the component
and even figure out the alternative of the part itself.

This was needed for the part of internship job that was to figure out the way of consolidating the aspects of
electronics parts such as cost, footprint and value.

Pick N Place Machine

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A pick and place machine (PnP machine) is a robotic device used in PCB manufacturing to automatically place
electronic components onto a printed circuit board (PCB). The PnP machine has a vacuum pick head that is used
to pick up components from a feeder and place them on the PCB in the correct location.

The PnP machine is a critical part of the PCB manufacturing process. It is responsible for placing the vast
majority of components on the PCB. The PnP machine is also used to place components that are too small or
difficult to place manually.

Figure 21: - Pick and Place Machine

For through-hole components, the reels typically

contain the components in their individual packages.
The packages are then placed on the reel in a specific
order, so that the PnP machine can pick them up and
place them on the PCB in the correct location.

Figure 22: - Tape and Reel package.

Components are packed in reels to be fed into a pick
and place machine (PnP machine) in a variety of
ways, depending on the type of component and the
requirements of the PnP machine.
Knowledge of above machine was important knowing
why the consolidation is needed as to gear up the
efficiency of the manufacturing process and make the
final product more inclined towards to designed for
manufacturability.
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CONSOLIDATION
Footprint consolidation and value consolidation are two techniques that can be used to improve the
efficiency and cost-effectiveness of electronics manufacturing. Value consolidation is the process of
replacing multiple parts with a single part that offers the same or better. Footprint consolidation is the
process of combining multiple footprints into a single, more efficient footprint. This can be done for a
number of reasons, such as to reduce costs, improve efficiency, or simplify the PCB design process.
When we are to automate and employ pick and place machine, consolidation practices in bill of
material can reduce both lead time and number of different reels require per pcb design.
EXAMPLE
a PCB design may originally use two different
footprints for resistors: one for 0.125W resistors
and one for 0.25W resistors. The designer may
decide to consolidate these two footprints into a
single footprint that can accommodate both 0.125W
and 0.25W resistors. This reduces the number of
footprints on the PCB by one, which saves space
and makes the PCB design process easier. Figure 23: - Footprint of different types for same
component.

For example, a PCB design may originally use two

different types of capacitors: ceramic capacitors and
electrolytic capacitors. The designer may decide to
consolidate these two types of capacitors into a
single type: ceramic capacitors. This reduces the
number of parts on the PCB by one, which saves
cost and simplifies the PCB design process.
Figure 24: - Value Consolidation

The table 7 of BOM contains a total of 9 different components. Some of these components are similar
to each other, such as the resistors and the capacitors. These components could be consolidated into a
single component, which would reduce the number of components in the BOM and simplify the
manufacturing process.
For example, the two 100-ohm resistors could be consolidated into a single 200-ohm resistor. The two
10 µF capacitors could be consolidated into a single 20 µF capacitor. This would reduce the number of
components in the BOM from 9 to 7, which would simplify the manufacturing process and save costs.
Consolidation practices can be used to simplify bill of materials and reduce costs. By carefully evaluating
the components in the BOM, manufacturers can identify opportunities to consolidate components and
improve the efficiency of the manufacturing process.
Component consolidation is the process of identifying and replacing multiple components in a bill of
materials (BOM) with a single, more versatile component. This can be done to reduce the cost of the
BOM, simplify the manufacturing process, and improve the efficiency of the supply chain.
Pick-and-place machines are automated machines that are used to place components on PCBs. The
machines use a vacuum pick-up head to pick up components from a feeder and place them on the PCB
in the correct location.
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Component consolidation can have a number of benefits for pick-and-place machines. For example, it
can reduce the number of different components that the machine needs to handle, which can improve
the machine's speed and efficiency. It can also reduce the number of feeder trays that the machine
needs to use, which can save space and reduce costs.
Table 7: -Consolidation Example.

Part number Description Quantity Manufacturer Manufacturer Reference Footprint Tolerances

part number designator

RES-0712P- Resistor, 100 2 Digi-Key RES-0712P- R1, R2 1206 ±5%

101K ohms, 1/4 watt, 101K
through-hole

CAP- Capacitor, 10 1 Digi-Key CAP- C1 805 ±10%

0805C100K µF, 25V, 0805C100K
ceramic,
through-hole

MCP2515- Integrated 1 Microchip MCP2515- U1 TQFP-

I/SN circuit, I/SN 48
microcontroller,
8-bit, 16 MHz

ATTINY85- Microcontroller, 1 Microchip ATTINY85- U2 DIP-8

20PU 8-bit, 8 MHz 20PU

LED-RED- LED, red, 603 2 Digi-Key LED-RED- D1, D2 603

0603 package 0603

SW-SPST- Switch, SPST, 1 Digi-Key SW-SPST- S1 12mm

12MM 12mm 12MM
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MANUFACTURER SURVEY

As part of my 2 months internship at IFB Washer plant, Verna,Goa ,I was assigned under team of electronics of
strategic sourcing department for which I was a project where I had to prepare a survey of manufacturer. The
Manufactures in India(priority) and around the world who were willing to manufacturer or provide
manufacturing services to the design of product we provide. The service for which department would initiate
further biding process to find the lowest bidder and the manufacturer who would provide(if overseas) services of
transport and shipment of the finished good.

Early scouting for manufacturer in India through these sites

Results of the early scouting in India

Noida-1 Manufacturer, Ch. Sambhaji-Nagar- 1 Manufacturer, Selem- 1 Manufacturer, Gandhinagar- 1

Manufacturer, Total of 4 manufacturer.

Global survey.

Global supply chain sourcing team of IFB helped me in contacting the networks
of IFB in China and South Korea. Team in China and in South Korea were in
constant touch with me to provide the results of the survey they were requested.

IFB Global
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Table 8: - Manufacturer count Table 9:- global Manufacturer map

Country Manufacturers

AUSTRIA 1

CHINA 29

SOUTH KOREA 4

China-operation 1

UK 1

USA 2

others 10

Once survey was done the main task of sending RFQ (Request For Quotation) to be sent so that the quotation
which would be sent by the vendor must contain the data we request in RFQ.

Model Model Model Turnover Major Company Annual Quote

Number Name Customers Profile Volume

Once quotations are received, they are shortlisted according to following criteria.

• Cost
• Tooling deposit
• Reputation
• F O B (Freight on board)
• Miscellaneous criteria

For cost, the party with lowest cost and other 2 are categorized as L1 ,L2,L3 where L1 is lowest and has higher
preference . For Tooling deposit, the manufacturer sometimes demands upfront deposit of cost of tools they
employ in machining, molding. which can be reverted back once the no. units manufactured break even.
manufacturer with least tooling deposit is given preference. Freight on Board (FOB) is an international
commercial law term published by the International Chamber of Commerce (ICC). It indicates the point at
which the costs and risks of shipped goods shift from the seller to the buyer. Generally, manufacturer who takes
care of this cost is given more preference.
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CONCLUSION AND FURTHER SCOPE OF WORK DONE

During my internship at IFB Industries, a renowned entity in the home appliance manufacturing sector, I was
exposed to the intricate world of Printed Circuit Board (PCB) design. PCBs, the backbone of any electronic
device, come in various types, each with its unique properties and applications. My role involved an in-depth
study of these PCB types, evaluating their electrical characteristics, thermal performance, cost-effectiveness,
and suitability for different home appliances. This analysis was crucial in understanding the trade-offs involved
in selecting the right PCB for a specific application.

In addition to PCB analysis, my responsibilities extended to electronics part consolidation. This task required a
comprehensive understanding of electronic components, their specifications, and their interplay in a circuit. I
had to ensure that the consolidated parts were not only compatible but also optimized for performance, cost, and
reliability. This process involved meticulous planning and coordination, requiring me to liaise with various
teams, including design, procurement, and manufacturing. The experience honed my technical skills and gave
me a first-hand understanding of electronics manufacturing processes.

One of the significant projects I undertook was conducting a survey to identify potential manufacturers for a
new product. This task was not just about finding a manufacturer; it was about finding the right manufacturer
who could deliver the desired quality, at the right price, and within the stipulated timeline. It required a thorough
understanding of supply chain dynamics, cost structures, manufacturing capabilities, and market trends. I had to
evaluate manufacturers on various parameters, including technical capabilities, financial stability, quality
control processes, and adherence to delivery timelines. The insights gained from this exercise provided me with
a practical perspective on product development and supply chain management.

In conclusion, my internship at IFB Industries was a journey of learning and growth. It provided me with a 360-
degree view of the home appliance industry, right from PCB design to product manufacturing. The skills and
knowledge acquired during this period have been instrumental in shaping my technical acumen and industry
understanding. As I step into the professional world, I carry with me these invaluable experiences that will
undoubtedly guide me in my future endeavours within the home appliance industry, If I wish to.
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The future of PCB manufacturing is being shaped by several key trends:

Artificial Intelligence (AI) and Machine Learning (ML): AI and ML are making significant inroads into PCB
assembly and manufacturing. They are helping to address quality concerns in a way that wasn’t previously
feasible1.

5G Networks: The advent of 5G has necessitated the design of complex mixed-signal PCBs. The high-
frequency transmissions used by 5G require high-precision etching techniques, such as the Modified Semi-
Additive Process (MSAP), to achieve high circuit density with low signal loss1.

Internet of Things (IoT): The IoT revolution is driving the need for high-speed connectivity layers in PCBs.
This has led to faster PCB fabrication technologies1.

Flexible and Stretchable Circuits: Novel conductive materials and fabrication methods are enabling the
development of flexible and wearable devices2.

As for the materials used in PCB manufacturing, several innovative substances are being explored:

Biocomposites: These materials, created using various substances like wheat gluten and banana stem cellulose
fibers, are being used to develop biodegradable PCBs3.

Advanced Substrate Materials: The availability of advanced PCB substrate materials like epoxy and
polyamides supports the global PCB market requirements4.

Low-Temperature Co-fired Ceramic (LTCC): These highly heat-resistant ceramic PCBs can withstand
aggressive environments, making them suitable for defense, aerospace, and automotive systems2.

These trends indicate a future where PCBs are more efficient, versatile, and environmentally friendly. However,
these advancements also bring new challenges that the industry must overcome to fully realize their
potential1234.
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