02_Package Types and Considerations
02_Package Types and Considerations
Lecture 2
Transistor Outline
(TO-247)
Mount to
heatsink
J-Leaded
Ceramic
Plastic
Ceramic: Plastic:
• Hermetic • Low-cost
• High-temperature • High-volume manufacturing
• High-reliability • Lightweight
Chip/die
Wire bonds
Ceramic substrate EconoDUAL
Si IGBT
600 V, 6 A
SEMITOP
SKiiP
Control board
Spring terminals
Chip/die
SiC MOSFET
1200 V, 72 A
Wire bonds
MiniSKiiP Ceramic substrate
Heatsink
Multi-chip module
System-in-package
System-on-package
Trends:
1. Increasing packaging
density
2. Increasing number of pins
per cm2
Trends:
1. Increasing packaging
density
2. Increasing number of pins
per cm2
3. Increasing packaging
efficiency
Trends:
1. Increasing packaging
density
2. Increasing number of pins
per cm2
3. Increasing packaging
efficiency
4. Decreasing interconnect
& lead pitch
Trends:
1. Increasing packaging
density
2. Increasing number of pins
per cm2
3. Increasing packaging
efficiency
4. Decreasing interconnect
& lead pitch
5. Increasing current density
• Thermal • Size
• Mechanical • Weight
• Reliability • Environmental/safety
• Manufacturability
• Industry trends
– Increasing switching speeds
– Decreasing noise margins
– Decreasing size
– Increasing pins
• Industry trends
– Decreasing size
– Increasing power
• Critical components
– Die attach
– Substrate
– Molding
Chip Attach
Wire Bond
Chip
Lead
Molding
TO-220
• Industry trends
– Harsh environment
– Longer lifetime
– Increased integration
• Critical components
– All (chip attach, substrate,
interconnect, molding, terminals)
• Solutions
– Test sockets
Considerations
Package Levels
3. Thermal