ECE 4254/5224: Electronics Packaging

Lecture 2

Package Types and Considerations

January 19, 2023

 Reminders & Announcements
• Office hours:
– Friday, Jan. 20th, 2:00pm – 3:00pm ET
– See syllabus for Zoom link
– See Canvas Calendar for next week’s office hours

ECE 4254/5224: Electronics Packaging 2 January 19, 2023

 Summary
Topic Summary
Interconnecting, powering, cooling, and
What is electronics packaging?
protecting all of the system components
Why is packaging needed? Signal, power, thermal, protection
Packaging considerations Performance, size, weight, reliability, cost…
Packaging hierarchy/levels 1st level in this course
Die, die attach, substrate,
Packaging components
interconnect, encapsulant, terminals
Ceramic, plastic,
Packaging schemes
through-hole, surface mount

ECE 4254/5224: Electronics Packaging 3 January 19, 2023

Viswanadham
Semiconductor Packaging Schemes

ECE 4254/5224: Electronics Packaging 4 January 19, 2023

Viswanadham
Semiconductor Packaging Schemes

Bonded to the Has pins that are

surface of a inserted through
substrate (e.g., holes in a printed
PCB, PWB). circuit board (PCB)
or printed wiring
board (PWB).

ECE 4254/5224: Electronics Packaging 5 January 19, 2023

Viswanadham
Semiconductor Packaging Schemes

Dual in Package (DIP)

Transistor Outline
(TO-247)

Pin Grid Array (PGA)

Mount to
heatsink

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 Inside the Package

Dual in Package (DIP) Pin Grid Array (PGA)

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Viswanadham
Semiconductor Packaging Schemes
Ball Grid Array (BGA)

J-Leaded

Chip-Scale Package (CSP)

Leadless Chip Carrier (LCC)

Gull Wing

Quad Flat No Lead (QFN)

ECE 4254/5224: Electronics Packaging 8 January 19, 2023

 Inside the Package

ECE 4254/5224: Electronics Packaging 9 January 19, 2023

Mahesh
There are Many Packages…
DIP JLCC QFP SO SO PGA BGA BGA

You do not need to memorize these!

You can find a list on Wikipedia.
ECE 4254/5224: Electronics Packaging 10 January 19, 2023
 Dual in-line Quad Flat Quad Flat Transistor
Material
Package (DIP) J-Lead (QFJ) No Lead (QFN) Outline (TO-3P)
C-DIP C-QFJ C-QFN

Ceramic

Plastic

Ceramic: Plastic:
• Hermetic • Low-cost
• High-temperature • High-volume manufacturing
• High-reliability • Lightweight

ECE 4254/5224: Electronics Packaging 11 January 19, 2023

 Multi-Chip Module (MCM)
• An MCM is a single package
containing more than one chip.
• What are the advantages of an
SCM
MCM over multiple SCMs?
– Smaller size and weight
– Higher performance (shorter MCM
interconnects)
– Lower cost

ECE 4254/5224: Electronics Packaging 12 January 19, 2023

 Multi-Chip Module (MCM)
• An MCM is a single package
containing more than one chip.
Assembly of SCMs
• What are the advantages of an
MCM over multiple SCMs?
– Smaller size and weight MCM
– Higher performance (shorter
interconnects)
– Lower cost

ECE 4254/5224: Electronics Packaging 13 January 19, 2023

 Power Multi-Chip Module

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 Power Multi-Chip Module

Chip/die
Wire bonds
Ceramic substrate EconoDUAL

ECE 4254/5224: Electronics Packaging 15 January 19, 2023

 Power Multi-Chip Module

Si IGBT
600 V, 6 A
SEMITOP
SKiiP

Control board
Spring terminals
Chip/die
SiC MOSFET
1200 V, 72 A
Wire bonds
MiniSKiiP Ceramic substrate
Heatsink

ECE 4254/5224: Electronics Packaging 16 January 19, 2023

S. K. Lim
Tummala, 1st Ed., Ch.1
Systems Packaging
System-on-chip

Multi-chip module

System-in-package

System-on-package

ECE 4254/5224: Electronics Packaging 17 January 19, 2023

Tummala, 1st Ed., Ch.1

Packaging Evolution: Package Types & I/O Density

DIP= dual in line
QFP= quad flat pack
BGA= ball grid array
CSP= chip scale package SOP
WLP= wafer level package
SIP= system in package

Trends:
1. Increasing packaging
density
2. Increasing number of pins
per cm2

ECE 4254/5224: Electronics Packaging 18 January 19, 2023

Tummala, 1st Ed., Ch.1

Packaging Evolution: Package Types & Package Eff.

PGA= pin grid array
QFP= quad flat pack
BGA= ball grid array
CSP= chip scale package
WLP= wafer level package
SIP= system in package

Trends:
1. Increasing packaging
density
2. Increasing number of pins
per cm2
3. Increasing packaging
efficiency

ECE 4254/5224: Electronics Packaging 19 January 19, 2023

Tummala, 1.6.
Packaging Evolution: Interconnects & I/O Density
DIP= dual in line
QFP= quad flat pack
BGA= ball grid array
CSP= chip scale package
WLP= wafer level package
SIP= system in package

Trends:
1. Increasing packaging
density
2. Increasing number of pins
per cm2
3. Increasing packaging
efficiency
4. Decreasing interconnect
& lead pitch

ECE 4254/5224: Electronics Packaging 20 January 19, 2023

Tummala, 1st Ed., Ch.1

Packaging Evolution: Package Types & Lead Density

DIP= dual in line
SOJ= small outline J-lead
QFP= quad flat pack
BGA= ball grid array
CSP= chip scale package
TCP= tape carrier package

Trends:
1. Increasing packaging
density
2. Increasing number of pins
per cm2
3. Increasing packaging
efficiency
4. Decreasing interconnect
& lead pitch
5. Increasing current density

ECE 4254/5224: Electronics Packaging 21 January 19, 2023

 Packaging Considerations

• Electrical • Testability / Characterization

• Thermal • Size

• Mechanical • Weight

• Reliability • Environmental/safety

• Manufacturability

ECE 4254/5224: Electronics Packaging 22 January 19, 2023

Tummala
Electrical
• Objectives • Critical components
– Signal distribution & integrity – Interconnects
– Power distribution & integrity – Terminals/leads

• Industry trends
– Increasing switching speeds
– Decreasing noise margins
– Decreasing size
– Increasing pins

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 Electrical
• Challenges • Solutions
– Parasitic capacitance, inductance, – Short signal lengths
and resistance – Separated signal and power
• Delays, slow speed, distortion, – High electrical conductivity
noise, voltage drop, reflection – Low dielectric constant
– Dielectric loss
• Consequences
– Electrical insulation
– Increased heat flux
– Increased thermal resistance
– Reduced reliability

ECE 4254/5224: Electronics Packaging 24 January 19, 2023

 Impact of Parasitic Inductance and Capacitance

ECE 4254/5224: Electronics Packaging 25 January 19, 2023

 Impact of Parasitic Resistance

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Tummala
Thermal
• Objective
– Heat dissipation

• Industry trends
– Decreasing size
– Increasing power

• Critical components
– Die attach
– Substrate
– Molding

ECE 4254/5224: Electronics Packaging 27 January 19, 2023

 Thermal
• Challenges • Solutions
– Thermal resistance – Low defects (e.g., voids)
– Heat flux – High thermal conductivity
– Heat spreading – Increase spacing between chips
– Thermal coupling • Consequences
– Higher cost
– Higher dielectric constant
– Increased size

ECE 4254/5224: Electronics Packaging 28 January 19, 2023

 θ = thermal resistance (Rth)
J = junction (chip temperature) Thermal Resistances
C = case of package
A = ambient

Chip Attach

Wire Bond

Chip
Lead
Molding

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 Thermal Management

ECE 4254/5224: Electronics Packaging 30 January 19, 2023

Tummala, 1.6.
Thermal Management

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 Mechanical
• Objectives • Challenges
– Protection – Vibration
– Support – Bending
– Durability – Fracture
• Industry trends • Solutions
– Harsh environment – Materials
– Increased density – Geometry
• Critical components • Consequences
– Substrate – Cost
– Molding – Performance
– Terminals – Thermal

ECE 4254/5224: Electronics Packaging 32 January 19, 2023

Liu
Mechanical Stress due to Lead Bending
Stress Distribution

TO-220

ECE 4254/5224: Electronics Packaging 33 January 19, 2023

Tummala
Reliability
• Objective
– Sufficient product lifetime

• Industry trends
– Harsh environment
– Longer lifetime
– Increased integration

• Critical components
– All (chip attach, substrate,
interconnect, molding, terminals)

“Moore’s Law Meets It’s Match” – Tummala

ECE 4254/5224: Electronics Packaging 34 January 19, 2023

 Reliability
• Challenges • Solutions
– Integration of different materials – Design for reliability
• Coefficient of thermal expansion – CTE matching
(CTE) – Increase cooling
• Elastic modulus – Accelerated life testing
– High temperature • Consequences
– Temperature cycles – Lower performance
– Humidity – Increased cost
– Longer design cycle

ECE 4254/5224: Electronics Packaging 35 January 19, 2023

 Interconnect Failures

Wire Bond Wire Bond Solder Ball

à Lift-Off à Heel Crack à Crack

Thermomechanical stress à degradation à increased electrical resistance

à thermal stress à open circuit

ECE 4254/5224: Electronics Packaging 36 January 19, 2023

Tummala
Manufacturability
• Objectives • Challenges
– Low cost – Process control
• High yield and throughput – Automation
– High volume – Yield
• Industry trends – Cycle time
– Cheaper – Rework
– Faster design cycle times • Solutions
– Short life spans – Design for manufacturability
– Statistical process control
• Critical components
– All

ECE 4254/5224: Electronics Packaging 37 January 19, 2023

 Wire Bonding

• One wire bond at a time

• Spacing between bonds limited by size of tool
• Cheap
ECE 4254/5224: Electronics Packaging 38 January 19, 2023
Tummala
Testability
• Objectives
– Eliminate defective parts
– Verify manufacturing
– Verify new design
– Predict product performance
• Industry trends
– Increased density
– Shorter leads
• Critical components
– Terminals/leads

ECE 4254/5224: Electronics Packaging 39 January 19, 2023

 Testability
• Challenges
– Lead length
– Lead pitch
– Visibility

• Solutions
– Test sockets

ECE 4254/5224: Electronics Packaging 40 January 19, 2023

 Test Socket Types

ECE 4254/5224: Electronics Packaging 41 January 19, 2023

Sandborn
Complex, Interdependent Nature of Packaging

ECE 4254/5224: Electronics Packaging 42 https://www.computer.org/csdl/magazine/dt/1998/03/d3010/13rRUIJuxzc January 19, 2023

Y. Liu
Design Ecosystem

ECE 4254/5224: Electronics Packaging 43 January 19, 2023

Y. Lee
Interaction Between Packaging Levels

Level 0 Level 1 Level 2 …

ECE 4254/5224: Electronics Packaging 44 January 19, 2023

X. Lecoq
IC-Package-PCB Co-design

Considerations

Package Levels

ECE 4254/5224: Electronics Packaging 45 https://ieeexplore.ieee.org/document/6698675 January 19, 2023

 Course Topics
1. Introduction

2. Electrical à Next class (Chapter 2 of textbook)

3. Thermal

4. Materials and Processes

5. Characterization and Testing

6. Reliability and Ruggedness

7. Emerging Technologies and Research Topics

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