MIC2026/2076

Dual-Channel Power Distribution Switch

General Description Features

The MIC2026 and MIC2076 are high-side MOSFET • 140mΩ maximum on-resistance per channel
switches optimized for general-purpose power distribution • 2.7V to 5.5V operating range
requiring circuit protection.
• 500mA minimum continuous current per channel
The MIC2026/76 are internally current limited and have
• Shortcircuit protection with thermal shutdown
thermal shutdown that protects the device and load.
• Thermally isolated channels
The MIC2076 offers “smart” thermal shutdown that
reduces current consumption in fault modes. When a • Fault status flag with 3ms filter eliminates false
thermal shutdown fault occurs, the output is latched off assertions
until the faulty load is removed. Removing the load or • Undervoltage lockout
toggling the enable input will reset the device output. • Reverse current flow blocking (no “body diode”)
Both devices employ soft-start circuitry that minimizes • Circuit breaker mode (MIC2076)
inrush current in applications where highly capacitive loads • Logic-compatible inputs
are employed.
• Soft-start circuit
A fault status output flag is asserted during overcurrent
and thermal shutdown conditions. Transient faults are • Low quiescent current
internally filtered. • Pin compatible with MIC2526
The MIC2026/76 are available in 8-pin DIP or 8-pin SOIC. • UL File # E179633
All support documentation can be found on Micrel’s web Applications
site at www.micrel.com.
• USB peripherals
• General purpose power switching
• ACPI power distribution
• Notebook PCs
• PDAs
• PC card hot swap
___________________________________________________________________________________________________________

Typical Application
VCC
VCONT. 2.7V to 5.5V
10k
10k

Logic Controller MIC2026-2

VIN ON/OFF ENA OUTA Load
OVERCURRENT FLGAI N
0.1µF
OVERCURRENT FLGB GND
ON/OFF ENB OUTB Load

UL Recognized Component
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com

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Ordering Information
Part Number Temperature
Enable Package
Standard Pb-Free Range
MIC2026-1BM MIC2026-1YM(1) Active High 8-Pin SOIC
(1)
MIC2026-2BM MIC2026-2YM Active Low 8- Pin SOIC
MIC2026-1BN — Active High 8- Pin DIP
MIC2026-2BN — Active Low –40°C to +85°C 8- Pin DIP
MIC2076-1BM MIC2076-1YM(1) Active High 8- Pin SOIC
MIC2076-2BM MIC2076-2YM(1) Active Low 8- Pin SOIC
MIC2076-1BN — Active High 8-Pin DIP
MIC2076-2BN — Active Low 8-Pin DIP
Note:
1. RoHS compliant and Halogen free.

Pin Configuration

ENA 1 8 OUTA
FLGA 2 7 IN

FLGB 3 6 GND

ENB 4 5 OUTB

8-Pin SOIC (M)

8-Pin DIP (N)

Pin Description
Pin Number Pin Name Pin Function
1 ENA Switch A Enable (Input): Logic-compatible, enable input. Active high (-1) or
active low (-2).
2 FLGA Fault Flag A (Output): Active-low, open-drain output. Indicates overcurrent or
thermal shutdown conditions. Overcurrent conditions must last longer than tD inB B

order to assert FLGA.

3 FLGB Fault Flag B (Output): Active-low, open-drain output. Low indicates overcurrent
or thermal shutdown conditions. Overcurrent conditions must last longer than tD B B

in order to assert FLGB.

4 ENB Switch B Enable (Input): Logic-compatible enable input. Active-high (-1) or
active-low (-2).
5 OUTB Switch B (Output)
6 GND Ground
7 IN Input: Switch and logic supply input.
8 OUTA Switch A (Output)

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Absolute Maximum Ratings(1) P Operating Ratings(2) P

Supply Voltage (VIN) ........................................ –0.3V to +6V B B Supply Voltage (VIN) ..................................... +2.7V to +5.5V
B B

Fault Flag Voltage (VFLG) ................................................+6V B B Ambient Temperature (TA) .......................... –40°C to +85°C
B B

Fault Flag Current (IFLG) ..............................................25mA B B Junction Temperature Range (TJ) ............. Internally Limited
B B

Output Voltage (VOUT) ....................................................+6V B B Thermal Resistance

Output Current (IOUT) .................................Internally Limited B B
SOIC (θJA) ........................................................160°C/W
B B

Enable Input (IEN) ..................................... –0.3V to VIN + 3V

B B
PDIP (θJA) ........................................................105°C/W
B B

Storage Temperature (TS) ........................–65°C to +150 °C B B

ESD Rating(3)
HBM ......................................................................... 1kV
MM .........................................................................200V

Electrical Characteristics(4) P

VIN = +5V; TA = 25°C, bold values indicate –40°C ≤ TA ≤ +85°C; unless noted
B B B B B B

Symbol Parameter Condition Min Typ Max Units

IDD B B Supply Current MIC20x6-1, VENA = VENB ≤ 0.8V B B B B 0.75 5 µA
(switch off), OUT = open
MIC20x6-2, VENA = VENB ≥ 2.4V B B B B 9.5 20 µA
(switch off), OUT = open
MIC20x6-1, VENA = VENB ≥ 2.4V B B B B 100 160 µA
(switch on), OUT = open
MIC20x6-2, VENA = VENB ≤ 0.8V B B B B 100 160 µA
(switch on), OUT = open
VEN B B Enable Input Threshold low-to-high transition 1.7 2.4 V
high-to-low transition 0.8 1.45 V
Enable Input Hysteresis 250 mV
IEN B B Enable Input Current VEN = 0V to 5.5V
B B -1 0.01 1 µA
Enable Input Capacitance 1 pF
RDS(ON) B B Switch Resistance VIN = 5V, IOUT = 500mA
B B B B 90 140 mΩ
VIN = 3.3V, IOUT = 500mA
B B B B 100 170 mΩ
Output Leakage Current MIC20x6-1, VENx ≤ 0.8V; 10 µA
MIC20x6-1, VENx ≥ 2.4V, (output off)
OFF Current in Latched MIC2076 50 µA
Thermal Shutdown (during thermal shutdown state)
tON B B Output Turn-On Delay RL = 10Ω, CL = 1µF, see “Timing Diagrams”
B B B B 1.3 5 ms
tR B B Output Turn-On Rise Time RL = 10Ω, CL = 1µF, see “Timing Diagrams”
B B B B 0.5 1.15 4.9 ms
RL = 10Ω, CL = 1µF, see “Timing Diagrams”
B B B B 1.75 ms
tOFFB B Output Turn-Off Delay RL = 10Ω, CL = 1µF, see “Timing Diagrams”
B B B B 35 100 µs
tF B B Output Turn-Off Fall Time RL = 10Ω, CL = 1µF, see “Timing Diagrams”
B B B B 32 100 µs
ILIMIT
B B Short-Circuit Output Current VOUT = 0V, enabled into short-circuit
B B 0.5 0.9 1.25 A
Current-Limit Threshold ramped load applied to output 0.65 1.0 1.25 A
Short-Circuit Response Time VOUT = 0V to IOUT = ILIMIT
B B B B B B 20 µs
(short applied to output)

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Symbol Parameter Condition Min Typ Max Units

tD Overcurrent Flag Response VIN = 5V, apply VOUT = 0V until FLG low
B B B B 1.5 3 7 ms
Delay
VIN = 3.3V, apply VOUT = 0V until FLG low
B B B B 3 ms
Undervoltage Lockout VIN rising B B 2.2 2.4 2.7 V
Threshold
VIN falling B B 2.0 2.15 2.5 V
Error Flag Output Resistance IL = 10mA, VIN = 5V
B B B B 10 25 Ω
IL = 10mA, VIN = 3.3V
B B B B 15 40 Ω
Error Flag Off Current VFLAG = 5V B B 10 µA
(5)
Overtemperature Threshold P P TJ increasing, each switch
B B 140 °C
TJ decreasing, each switch
B B 120 °C
TJ increasing, both switches
B B 160 °C
TJ decreasing, both switches
B B 150 °C
Notes:
1. Exceeding the absolute maximum rating may damage the device.
2. The device is not guaranteed to function outside its operating rating.
3. Devices are ESD sensitive. Handling precautions recommended.
4. Specification for packaged product only.
5. If there is a fault on one channel, that channel will shut down when the die reaches approximately 140°C. If the die reaches approximately 160°C,
both channels will shut down, even if neither channel is in current limit.

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Test Circuit
VOUT
Device
Under OUT
Test
RL CL

Timing Diagrams

tR tF

90% 90%
VOUT
10% 10%

Output Rise and Fall Times

50%
VEN
tOFF

tON

90%
VOUT
10%

Active-Low Switch Delay Times (MIC20x6-2)

VEN 50%

tOFF
tON
90%
VOUT
10%

Active-High Switch Delay Time (MIC20x6-1)

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Typical Characteristics

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Typical Characteristics (continue)

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Functional Characteristics

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Functional Characteristics (continue)

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Functional Characteristics (continue)

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Block Diagram
FLGA

FLAG
RESPONSE
DELAY OUTA
ENA

CHARGE GATE
PUMP CONTROL
CURRENT
LIMIT

OSC. THERMAL UVLO 1.2V IN

SHUTDOWN REFERENCE

CHARGE CURRENT
PUMP LIMIT
GATE
CONTROL
ENB

FLAG OUTB
RESPONSE
DELAY
FLGB

MIC2026/2076
GND
MIC2026/2076 Block Diagram

Functional Description activated. This allows the output latch to automatically

reset when the load (such as a USB device) is removed.
Input and Output The output can also be reset by toggling EN. Refer to
IN is the power supply connection to the logic circuitry Figure 1 for timing details.
and the drain of the output MOSFET. OUT is the source The MIC2026 will automatically reset its output when the
of the output MOSFET. In a typical circuit, current flows die temperature cools down to 120°C. The MIC2026
from IN to OUT toward the load. If VOUT is greater than output and FLG signal will continue to cycle on and off
VIN, current will flow from OUT to IN, since the switch is until the device is disabled or the fault is removed.
bidirectional when enabled. The output MOSFET and Figure 2 depicts typical timing.
driver circuitry are also designed to allow the MOSFET Depending on PCB layout, package, ambient
source to be externally forced to a higher voltage than temperature, etc., it may take several hundred
the drain (VOUT > VIN) when the switch is disabled. In this milliseconds from the incidence of the fault to the output
situation, the MIC2026/76 prevents undesirable current MOSFET being shut off. This time will be shortest in the
flow from OUT to IN. case of a dead short on the output.
Thermal Shutdown Power Dissipation
Thermal shutdown is employed to protect the device The device’s junction temperature depends on several
from damage should the die temperature exceed safe factors such as the load, PCB layout, ambient
margins due mainly to short circuit faults. Each channel temperature, and package type. Equations that can be
employs its own thermal sensor. Thermal shutdown used to calculate power dissipation of each channel and
shuts off the output MOSFET and asserts the FLG junction temperature are found below:
output if the die temperature reaches 140°C and the
PD = RDS(on) × IOUT2
overheated channel is in current limit. The other channel
is not affected. If however, the die temperature exceeds Total power dissipation of the device will be the
160°C, both channels will be shut off. Upon determining summation of PD for both channels. To relate this to
a thermal shutdown condition, the MIC2076 will latch the junction temperature, the following equation can be
output off. In this case, a pull-up current source is used:

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 Micrel, Inc. MIC2026/2076

TJ = PD × θJA + TA Current-Limit Response—Ramped Load

where: The MIC2026/76 current-limit profile exhibits a small
foldback effect of about 200mA. Once this current-limit
TJ = junction temperature
threshold is exceeded the device switches into a
TA = ambient temperature constant current mode. It is important to note that the
θJA = is the thermal resistance of the package device will supply current up to the current-limit
threshold.
Current Sensing and Limiting
The current-limit threshold is preset internally. The Fault Flag
preset level prevents damage to the device and external The FLG signal is an N-channel open-drain MOSFET
load but still allows a minimum current of 500mA to be output. FLG is asserted (active-low) when either an
delivered to the load. overcurrent or thermal shutdown condition occurs. In the
The current-limit circuit senses a portion of the output case of an overcurrent condition, FLG will be asserted
MOSFET switch current. The current-sense resistor only after the flag response delay time, tD, has elapsed.
shown in the block diagram is virtual and has no voltage This ensures that FLG is asserted only upon valid
drop. The reaction to an overcurrent condition varies overcurrent conditions and that erroneous error reporting
with three scenarios: is eliminated. For example, false overcurrent conditions
can occur during hot plug events when a highly
Switch Enabled into Short-Circuit capacitive load is connected and causes a high transient
If a switch is enabled into a heavy load or short-circuit, inrush current that exceeds the current-limit threshold for
the switch immediately enters into a constant-current up to 1ms. The FLG response delay time tD is typically
mode, reducing the output voltage. The FLG signal is 3ms.
asserted indicating an overcurrent condition.
Undervoltage Lockout
Short-Circuit Applied to Enabled Output Undervoltage lockout (UVLO) prevents the output
When a heavy load or short-circuit is applied to an MOSFET from turning on until VIN exceeds
enabled switch, a large transient current may flow until approximately 2.5V. Undervoltage detection functions
the current-limit circuitry responds. Once this occurs, the only when the switch is enabled.
device limits current to less than the short-circuit current
limit specification.

Load and Fault Removed

(Output Reset)
Short-Circuit Fault
VEN

VOUT
ILIMIT
ILOAD Thermal
IOUT Shutdown
Reached
VFLG 3ms typ.
delay

Figure 1. MIC2076-2 Fault Timing: Output Reset by Removing Load

Short-Circuit Fault
VEN
Load/Fault
VOUT Removed
ILIMIT
ILOAD Thermal
IOUT Shutdown
Reached

VFLG 3ms typ.

delay

Figure 2. MIC2026-2 Fault Timing

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Application Information Universal Serial Bus (USB) Power Distribution

The MIC2026/76 are ideally suited for USB (Universal
Supply Filtering Serial Bus) power distribution applications. The USB
A 0.1µF to 1µF bypass capacitor positioned close to VIN specification defines power distribution for USB host
and GND of the device is strongly recommended to systems such as PCs and USB hubs. Hubs can either
control supply transients. Without a bypass capacitor, an be self-powered or bus-powered (that is, powered from
output short may cause sufficient ringing on the input the bus). Figure 5 shows a typical USB Host application
(from supply lead inductance) to damage internal control that may be suited for mobile PC applications employing
circuitry. USB. The requirement for USB host systems is that the
port must supply a minimum of 500mA at an output
Printed Circuit Board Hot-Plug voltage of 5V ±5%. In addition, the output power
The MIC2026/76 are ideal inrush current-limiters for hot delivered must be limited to below 25VA. Upon an
plug applications. Due to their integrated charge pumps, overcurrent condition, the host must also be notified. To
the MIC2026/76 present a high impedance when off and support hot-plug events, the hub must have a minimum
slowly become a low impedance as their integrated of 120µF of bulk capacitance, preferably low ESR
charge pumps turn on. This “soft-start” feature effectively electrolytic or tantulum. Please refer to Application Note
isolates power supplies from highly capacitive loads by 17 for more details on designing compliant USB hub and
reducing inrush current. Figure 3 shows how the host systems.
MIC2076 may be used in a card hot-plug application. For bus-powered hubs, USB requires that each
In cases of extremely large capacitive loads (>400µF), downstream port be switched on or off under control by
the length of the transient due to inrush current may the host. Up to four downstream ports each capable of
exceed the delay provided by the integrated filter. Since supplying 100mA at 4.4V minimum are allowed. In
this inrush current exceeds the current-limit delay addition, to reduce voltage droop on the upstream VBUS,
specification, FLG will be asserted during this time. To soft-start is necessary. Although the hub can consume
prevent the logic controller from responding to FLG up to 500mA from the upstream bus, the hub must
being asserted, an external RC filter, as shown in Figure consume only 100mA max at start-up, until it
4, can be used to filter out transient FLG assertion. The enumerates with the host prior to requesting more
value of the RC time constant should be selected to power. The same requirements apply for bus-powered
match the length of the transient, less tD(min) of the peripherals that have no downstream ports. Figure 6
MIC2026/76. shows a bus-powered hub.

USB
Controller

SPN010012
1
ENA OUTA 8 USB
VBUS Function
2 7
4.7 FLGA IN
µF CBULK
3 6
to "Hot" FLGB GND
Receptacle
4
ENB OUTB 5 USB
Function

GND CBULK

Cable USB Peripheral

Figure 3. Hot-Plug Application

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Figure 4. Transient Filter

Figure 5. USB Two-Port Host Application

Figure 6. USB Two-Port Bus-Powered Hub

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Package Information

8-Pin SOIC (M)

8-Pin DIP (N)

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MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA

TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http://www.micrel.com

The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its
use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.

Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product
can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant
into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A
Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and Purchaser agrees to fully
indemnify Micrel for any damages resulting from such use or sale.

© 2006 Micrel, Incorporated.

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