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From Wikipedia, the free encyclopedia
For devices using semiconductors and their history, see Semiconductor device. For
other uses, see Semiconductor (disambiguation).
MOSFET scaling
(process nodes)
20 μm – 1968
10 μm – 1971
6 μm – 1974
3 μm – 1977
1.5 μm – 1981
1 μm – 1984
800 nm – 1987
600 nm – 1990
350 nm – 1993
250 nm – 1996
180 nm – 1999
130 nm – 2001
90 nm – 2003
65 nm – 2005
45 nm – 2007
32 nm – 2009
28 nm – 2010
22 nm – 2012
14 nm – 2014
10 nm – 2016
7 nm – 2018
5 nm – 2020
3 nm – 2022
Future
2 nm ~ 2025
1 nm ~ 2027
Half-nodes
Density
CMOS
Device (multi-gate)
Moore's law
Transistor count
Semiconductor
Industry
Nanoelectronics
vte
A semiconductor is a material with electrical conductivity between that of a
conductor and an insulator.[1] Its conductivity can be modified by adding
impurities (“doping”) to its crystal structure. When two regions with different
doping levels are present in the same crystal, they form a semiconductor junction.
The behavior of charge carriers, which include electrons, ions, and electron holes,
at these junctions is the basis of diodes, transistors, and most modern
electronics. Some examples of semiconductors are silicon, germanium, gallium
arsenide, and elements near the so-called "metalloid staircase" on the periodic
table. After silicon, gallium arsenide is the second-most common semiconductor and
is used in laser diodes, solar cells, microwave-frequency integrated circuits, and
others. Silicon is a critical element for fabricating most electronic circuits.
The conductivity of silicon is increased by adding a small amount (of the order of
1 in 108) of pentavalent (antimony, phosphorus, or arsenic) or trivalent (boron,
gallium, indium) atoms.[3] This process is known as doping, and the resulting
semiconductors are known as doped or extrinsic semiconductors. Apart from doping,
the conductivity of a semiconductor can be improved by increasing its temperature.
This is contrary to the behavior of a metal, in which conductivity decreases with
an increase in temperature.[4]
Properties
Variable electrical conductivity
Semiconductors in their natural state are poor conductors because a current
requires the flow of electrons, and semiconductors have their valence bands filled,
preventing the entire flow of new electrons. Several developed techniques allow
semiconducting materials to behave like conducting materials, such as doping or
gating. These modifications have two outcomes: n-type and p-type. These refer to
the excess or shortage of electrons, respectively. A balanced number of electrons
would cause a current to flow throughout the material.[8]
Homojunctions
Homojunctions occur when two differently doped semiconducting materials are joined.
For example, a configuration could consist of p-doped and n-doped germanium. This
results in an exchange of electrons and holes between the differently doped
semiconducting materials. The n-doped germanium would have an excess of electrons,
and the p-doped germanium would have an excess of holes. The transfer occurs until
an equilibrium is reached by a process called recombination, which causes the
migrating electrons from the n-type to come in contact with the migrating holes
from the p-type.[9] The result of this process is a narrow strip of immobile ions,
which causes an electric field across the junction.[5][8]
Excited electrons
A difference in electric potential on a semiconducting material would cause it to
leave thermal equilibrium and create a non-equilibrium situation. This introduces
electrons and holes to the system, which interact via a process called ambipolar
diffusion. Whenever thermal equilibrium is disturbed in a semiconducting material,
the number of holes and electrons changes. Such disruptions can occur as a result
of a temperature difference or photons, which can enter the system and create
electrons and holes. The processes that create or annihilate electrons and holes
are called generation and recombination, respectively.[8]
Light emission
In certain semiconductors, excited electrons can relax by emitting light instead of
producing heat.[10] Controlling the semiconductor composition and electrical
current allows for the manipulation of the emitted light's properties.[11] These
semiconductors are used in the construction of light-emitting diodes and
fluorescent quantum dots.
Materials
Main article: List of semiconductor materials
Certain pure elements are found in group 14 of the periodic table; the most
commercially important of these elements are silicon and germanium. Silicon and
germanium are used here effectively because they have 4 valence electrons in their
outermost shell, which gives them the ability to gain or lose electrons equally at
the same time.
Binary compounds, particularly between elements in groups 13 and 15, such as
gallium arsenide, groups 12 and 16, groups 14 and 16, and between different group-
14 elements, e.g. silicon carbide.
Certain ternary compounds, oxides, and alloys.
Organic semiconductors, made of organic compounds.
Semiconducting metal–organic frameworks.[17][18]
The most common semiconducting materials are crystalline solids, but amorphous and
liquid semiconductors are also known. These include hydrogenated amorphous silicon
and mixtures of arsenic, selenium, and tellurium in a variety of proportions. These
compounds share with better-known semiconductors the properties of intermediate
conductivity and a rapid variation of conductivity with temperature, as well as
occasional negative resistance. Such disordered materials lack the rigid
crystalline structure of conventional semiconductors such as silicon. They are
generally used in thin film structures, which do not require material of higher
electronic quality, being relatively insensitive to impurities and radiation
damage.
The etching is the next process that is required. The part of the silicon that was
not covered by the photoresist layer from the previous step can now be etched. The
main process typically used today is called plasma etching. Plasma etching usually
involves an etch gas pumped in a low-pressure chamber to create plasma. A common
etch gas is chlorofluorocarbon, or more commonly known Freon. A high radio-
frequency voltage between the cathode and anode is what creates the plasma in the
chamber. The silicon wafer is located on the cathode, which causes it to be hit by
the positively charged ions that are released from the plasma. The result is
silicon that is etched anisotropically.[5][8]
The last process is called diffusion. This is the process that gives the
semiconducting material its desired semiconducting properties. It is also known as
doping. The process introduces an impure atom to the system, which creates the p–n
junction. To get the impure atoms embedded in the silicon wafer, the wafer is first
put in a 1,100 degree Celsius chamber. The atoms are injected in and eventually
diffuse with the silicon. After the process is completed and the silicon has
reached room temperature, the doping process is done and the semiconducting wafer
is almost prepared.[5][8]
Physics of semiconductors
Energy bands and electrical conduction
Main articles: Electronic band structure and Electrical resistivity and
conductivity
High conductivity in material comes from it having many partially filled states and
much state delocalization. Metals are good electrical conductors and have many
partially filled states with energies near their Fermi level. Insulators, by
contrast, have few partially filled states, their Fermi levels sit within band gaps
with few energy states to occupy. Importantly, an insulator can be made to conduct
by increasing its temperature: heating provides energy to promote some electrons
across the band gap, inducing partially filled states in both the band of states
beneath the band gap (valence band) and the band of states above the band gap
(conduction band). An (intrinsic) semiconductor has a band gap that is smaller than
that of an insulator and at room temperature, significant numbers of electrons can
be excited to cross the band gap.[23]
For partial filling at the top of the valence band, it is helpful to introduce the
concept of an electron hole. Although the electrons in the valence band are always
moving around, a completely full valence band is inert, not conducting any current.
If an electron is taken out of the valence band, then the trajectory that the
electron would normally have taken is now missing its charge. For the purposes of
electric current, this combination of the full valence band, minus the electron,
can be converted into a picture of a completely empty band containing a positively
charged particle that moves in the same way as the electron. Combined with the
negative effective mass of the electrons at the top of the valence band, we arrive
at a picture of a positively charged particle that responds to electric and
magnetic fields just as a normal positively charged particle would do in a vacuum,
again with some positive effective mass.[23] This particle is called a hole, and
the collection of holes in the valence band can again be understood in simple
classical terms (as with the electrons in the conduction band).
Electron-hole pairs are also apt to recombine. Conservation of energy demands that
these recombination events, in which an electron loses an amount of energy larger
than the band gap, be accompanied by the emission of thermal energy (in the form of
phonons) or radiation (in the form of photons).
As the probability that electrons and holes meet together is proportional to the
product of their numbers, the product is in the steady-state nearly constant at a
given temperature, providing that there is no significant electric field (which
might "flush" carriers of both types, or move them from neighbor regions containing
more of them to meet together) or externally driven pair generation. The product is
a function of the temperature, as the probability of getting enough thermal energy
to produce a pair increases with temperature, being approximately exp(−EG/kT),
where k is the Boltzmann constant, T is the absolute temperature and EG is bandgap.
Doping
Main article: Doping (semiconductor)
Doping of a pure silicon array. Silicon based intrinsic semiconductor becomes
extrinsic when impurities such as Boron and Antimony are introduced.
The conductivity of semiconductors may easily be modified by introducing impurities
into their crystal lattice. The process of adding controlled impurities to a
semiconductor is known as doping. The amount of impurity, or dopant, added to an
intrinsic (pure) semiconductor varies its level of conductivity.[26] Doped
semiconductors are referred to as extrinsic.[27] By adding impurity to the pure
semiconductors, the electrical conductivity may be varied by factors of thousands
or millions.[28]
The materials chosen as suitable dopants depend on the atomic properties of both
the dopant and the material to be doped. In general, dopants that produce the
desired controlled changes are classified as either electron acceptors or donors.
Semiconductors doped with donor impurities are called n-type, while those doped
with acceptor impurities are known as p-type. The n and p type designations
indicate which charge carrier acts as the material's majority carrier. The opposite
carrier is called the minority carrier, which exists due to thermal excitation at a
much lower concentration compared to the majority carrier.[33]
For example, the pure semiconductor silicon has four valence electrons that bond
each silicon atom to its neighbors.[34] In silicon, the most common dopants are
group III and group V elements. Group III elements all contain three valence
electrons, causing them to function as acceptors when used to dope silicon. When an
acceptor atom replaces a silicon atom in the crystal, a vacant state (an electron
"hole") is created, which can move around the lattice and function as a charge
carrier. Group V elements have five valence electrons, which allows them to act as
a donor; substitution of these atoms for silicon creates an extra free electron.
Therefore, a silicon crystal doped with boron creates a p-type semiconductor
whereas one doped with phosphorus results in an n-type material.[35]
During manufacture, dopants can be diffused into the semiconductor body by contact
with gaseous compounds of the desired element, or ion implantation can be used to
accurately position the doped regions.
Amorphous semiconductors
Some materials, when rapidly cooled to a glassy amorphous state, have
semiconducting properties. These include B, Si, Ge, Se, and Te, and there are
multiple theories to explain them.[36][37]
Karl Ferdinand Braun developed the crystal detector, the first semiconductor
device, in 1874.
Thomas Johann Seebeck was the first to notice that semiconductors exhibit special
feature such that experiment concerning an Seebeck effect emerged with much
stronger result when applying semiconductors, in 1821.[38] In 1833, Michael Faraday
reported that the resistance of specimens of silver sulfide decreases when they are
heated. This is contrary to the behavior of metallic substances such as copper. In
1839, Alexandre Edmond Becquerel reported observation of a voltage between a solid
and a liquid electrolyte, when struck by light, the photovoltaic effect. In 1873,
Willoughby Smith observed that selenium resistors exhibit decreasing resistance
when light falls on them. In 1874, Karl Ferdinand Braun observed conduction and
rectification in metallic sulfides, although this effect had been discovered
earlier by Peter Munck af Rosenschöld (sv) writing for the Annalen der Physik und
Chemie in 1835; Rosenschöld's findings were ignored.[39] Simon Sze stated that
Braun's research was the earliest systematic study of semiconductor devices.[40]
Also in 1874, Arthur Schuster found that a copper oxide layer on wires had
rectification properties that ceased when the wires are cleaned. William Grylls
Adams and Richard Evans Day observed the photovoltaic effect in selenium in 1876.
[41]
The first semiconductor devices used galena, including German physicist Ferdinand
Braun's crystal detector in 1874 and Indian physicist Jagadish Chandra Bose's radio
crystal detector in 1901.[44][45]
In the years preceding World War II, infrared detection and communications devices
prompted research into lead-sulfide and lead-selenide materials. These devices were
used for detecting ships and aircraft, for infrared rangefinders, and for voice
communication systems. The point-contact crystal detector became vital for
microwave radio systems since available vacuum tube devices could not serve as
detectors above about 4000 MHz; advanced radar systems relied on the fast response
of crystal detectors. Considerable research and development of silicon materials
occurred during the war to develop detectors of consistent quality.[39]
Early transistors
Main article: History of the transistor
John Bardeen, William Shockley and Walter Brattain developed the bipolar point-
contact transistor in 1947.
Detector and power rectifiers could not amplify a signal. Many efforts were made to
develop a solid-state amplifier and were successful in developing a device called
the point contact transistor which could amplify 20 dB or more.[46] In 1922, Oleg
Losev developed two-terminal, negative resistance amplifiers for radio, but he died
in the Siege of Leningrad after successful completion. In 1926, Julius Edgar
Lilienfeld patented a device resembling a field-effect transistor, but it was not
practical. R. Hilsch [de] and R. W. Pohl [de] in 1938 demonstrated a solid-state
amplifier using a structure resembling the control grid of a vacuum tube; although
the device displayed power gain, it had a cut-off frequency of one cycle per
second, too low for any practical applications, but an effective application of the
available theory.[39] At Bell Labs, William Shockley and A. Holden started
investigating solid-state amplifiers in 1938. The first p–n junction in silicon was
observed by Russell Ohl about 1941 when a specimen was found to be light-sensitive,
with a sharp boundary between p-type impurity at one end and n-type at the other. A
slice cut from the specimen at the p–n boundary developed a voltage when exposed to
light.
In 1954, physical chemist Morris Tanenbaum fabricated the first silicon junction
transistor at Bell Labs.[48] However, early junction transistors were relatively
bulky devices that were difficult to manufacture on a mass-production basis, which
limited them to a number of specialised applications.[49]
See also
icon Electronics portal
Deathnium
Semiconductor device fabrication
Semiconductor industry
Semiconductor characterization techniques
Transistor count
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Further reading
A. A. Balandin & K. L. Wang (2006). Handbook of Semiconductor Nanostructures and
Nanodevices (5-Volume Set). American Scientific Publishers. ISBN 978-1-58883-073-9.
Sze, Simon M. (1981). Physics of Semiconductor Devices (2nd ed.). John Wiley and
Sons (WIE). ISBN 978-0-471-05661-4.
Turley, Jim (2002). The Essential Guide to Semiconductors. Prentice Hall PTR. ISBN
978-0-13-046404-0.
Yu, Peter Y.; Cardona, Manuel (2004). Fundamentals of Semiconductors: Physics and
Materials Properties. Springer. ISBN 978-3-540-41323-3.
Sadao Adachi (2012). The Handbook on Optical Constants of Semiconductors: In Tables
and Figures. World Scientific Publishing. ISBN 978-981-4405-97-3.
G. B. Abdullayev, T. D. Dzhafarov, S. Torstveit (Translator), Atomic Diffusion in
Semiconductor Structures, Gordon & Breach Science Pub., 1987 ISBN 978-2-88124-152-9
Feynman's lecture on Semiconductors
External links
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