190415_Dynamic-Profiling_E
190415_Dynamic-Profiling_E
Profiling
Active Profiling
Control
asscon.de
Dynamic Profiling
Process Reliability and Quality Assurance
As the leading manufacturer of vapor phase reflow soldering systems, ASSCON develops
and produces advanced innovative solutions for modern soldering technology. The center
piece of the vapor phase soldering technique is the controlled transfer of energy developed
by ASSCON to set flexible temperature profiles, thus resulting in dynamic profiling.
One of the major challenges in the soldering process is to The measuring standard behavior is used as a variable for
set the optimum soldering profile for every product. This active profile control during the soldering process. Influences
applies both when developing prototypes and in series pro on the process, caused for instance by different loads or
duction, where a reliable constant temperature profile is workpiece carrier temperature, can thus be compensated.
required, not to mention guaranteed traceability and moni
toring of every profile. Guaranteed traceability, monitoring and checking of the
soldering profiles is thus ensured by the ASSCON-BDE
ASSCON dynamic profiling permits real time measuring of software tool using a database.
every soldering process on product level, and the automatic
creation and control of the soldering profile. A measuring
standard is used, which is heated in the system together
with the solder product. The temperature profiles of the Dynamic profiling permits production
measuring standard and product are virtually identical. The line optimization. ASSCON has already
temperature and heating behavior of the product can thus installed more than thousand vapor
be ascertained and recorded with no risk of destruction.
Prior to every soldering process the temperature of the
phase soldering systems worldwide.
measuring standard is matched to the temperature of the Prestigious companies are among its
product (ambient temperature) by active cooling. customers.
customer benefits
Dynamic profiling guarantees fast and easy temperature profile creation and full process reliability in series production.
T he operator enters the required temperature in the system T hree different measuring standards ensure that the entire
control. product spectrum is covered.
T he soldering system automatically sets the required control Cooling of the reference measuring points prior to every
parameters. soldering process ensures that the process temperatures
are always recorded in the same measuring conditions.
T he product is soldered automatically with the set para
meters on the basis of the measuring standard temperature T he recorded data is available for traceability and docu
profile. mentation purposes
T his procedure ensures that all other products in the series Dynamic profiling also offers the option of processing both
are soldered according to the set temperature profile. leaded and lead-free products with the same process media.
the four key inputs for creating temperature profiles
1 Power setting to determine pre-heat gradient (T2) 3 Power setting to determine solder gradient (T3)
2 Start temperature of the soak zone in °C and soaking time 4 Soaking time after reaching the end temperature
(in sec.)
T in °C
T3
T2
t6
T1
t1 t2 t3 t4 t5 t in sec.
TECHNICAL DATA
* option
format (mm) VP2000 - 410 dual-lane:
620 x 2 x 275
VP7000 - 200: 520 x 450
Ready for operation ca. 25 min. ca. 35 min. ca. 30 min. / ca. 45 min. (VP 7000)
Operating mode Batch Batch / Inline upgradeable Inline single lane / dual lane