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IR Receiver Modules for Remote Control Systems
FEATURES
• Very low supply current
• Photo detector and preamplifier in one package
• Internal filter for 38 kHz IR signals
• Supply voltage: 2.5 V to 5.5 V
4 • Improved immunity against ambient light
3
2 • Capable of side or top view
1
• Insensitive to supply voltage ripple and noise
• Two lenses for high sensitivity and wide receiving angle
20953 • Narrow optical filter to reduce interference from plasma
TV emissions
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
MECHANICAL DATA
DESCRIPTION
Pinning:
The TSSP77038 is a compact two lens SMD IR receiver
1, 4 = GND, 2 = VS, 3 = OUT for sensor applications. It has a high gain for IR signals
at 38 kHz. The detection level does not change when
ambient light or strong IR signals are applied. It can receive
continuous 38 kHz signals or 38 kHz bursts.
This component has not been qualified according to
automotive specifications.

PARTS TABLE
CARRIER FREQUENCY SENSOR APPLICATIONS

38 kHz TSSP77038

BLOCK DIAGRAM APPLICATION CIRCUIT

17170-10
2 R1
Transmitter IR receiver
VS
33 kΩ with VS + VS
TSALxxxx
C1
Circuit

3
µC
Band Demo- OUT OUT
Input AMP
pass dulator VO
GND GND
1, 4

PIN GND The external components R1 and C1 are optional

to improve the robustness against electrical overstress
16833_17 (typical values are R1 = 100 Ω, C1 = 0.1 µF).

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ABSOLUTE MAXIMUM RATINGS

PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Supply voltage VS - 0.3 to + 6 V
Supply current IS 5 mA
Output voltage VO - 0.3 to (VS + 0.3) V
Output current IO 5 mA
Junction temperature Tj 100 °C
Storage temperature range Tstg - 25 to + 85 °C
Operating temperature range Tamb - 25 to + 85 °C
Power consumption Tamb ≤ 85 °C Ptot 10 mW
Note
• Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability.

ELECTRICAL AND OPTICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)

PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT
Supply voltage VS 2.5 5.5 V
VS = 5 V, Ev = 0 ISD 0.55 0.7 0.9 mA
Supply current
Ev = 40 klx, sunlight ISH 0.8 mA
Ev = 0,
IR diode TSAL6200,
Transmission distance d 40 m
IF = 250 mA,
test signal see fig. 1
IOSL = 0.5 mA, Ee = 0.7 mW/m2,
Output voltage low VOSL 100 mV
test signal see fig. 1
Pulse width tolerance:
Minimum irradiance tpi - 5/fo < tpo < tpi + 6/fo, Ee min. 0.2 0.4 mW/m2
test signal see fig. 1
tpi - 5/fo < tpo < tpi + 6/fo,
Maximum irradiance Ee max. 50 W/m2
test signal see fig. 1
Angle of half transmission
Directivity ϕ1/2 ± 50 deg
distance

TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)

Ee Optical Test Signal 1.5

(IR diode TSAL6200, IF = 0.4 A, 30 pulses, f = f0, t = 10 ms) 1.4
tpo - Output Pulse Width (ms)

1.3
1.2 Output pulse width
1.1
1.0 Input burst length
t 0.9
tpi * 0.8
0.7
T 0.6
* tpi 10/f0 is recommended for optimal function 0.5
0.4
VO Output Signal 16110
0.3
1) 7/f0 < td < 15/f0 0.2 λ = 950 nm,
VOH 2) 0.1 optical test signal, Fig. 1
tpi - 5/f0 < tpo < tpi + 6/f 0
0
VOL 0.1 10 1000 100 000
td 1) tpo 2) t
Ee - Irradiance (mW/m2)

Fig. 1 - Output Active Low Fig. 2 - Pulse Length and Sensitivity in Dark Ambient

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Optical Test Signal 5.0

Ee min. - Threshold Irradiance (mW/m2)

Ee Correlation with Ambient Light Sources:
4.5 10 W/m2 = 1.4 kLx (Std. illum. A, T = 2855 K)
4.0 10 W/m2 = 8.2 kLx (Daylight, T = 5900 K)

3.5
Wavelength of Ambient
t 3.0 Illumination: λ = 950 nm
600 µs 600 µs
2.5
t = 60 ms
2.0

94 8134 1.5
Output Signal, (see fig. 4)
VO 1.0
VOH 0.5
0
VOL 0.01 0.1 1 10 100
t on t off t Ee - Ambient DC Irradiance (W/m2)

Fig. 3 - Output Function Fig. 6 - Sensitivity vs. Supply Voltage Disturbances

0.8 0.40
ton, toff - Output Pulse Width (ms)

0.7 ton
0.35

Ee min. - Sensitivity (mW/m2)

0.6 0.30

0.5 toff 0.25

0.4 0.20

0.3 0.15

0.2 0.10

0.1 λ = 950 nm, 0.05

optical test signal, Fig. 3
0 0
0.1 1 10 100 1000 10 000 - 30 - 10 10 30 50 70 90

Ee - Irradiance (mW/m2) Tamb - Ambient Temperature (°C)

Fig. 4 - Output Pulse Diagram Fig. 7 - Sensitivity vs. Ambient Temperature

1.2 1
S (λ) rel - Relative Spectral Sensitivity

0.9
1.0
E e min./Ee - Rel. Responsivity

0.8
0.7
0.8
0.6
0.6 0.5
0.4
0.4
0.3
f = f0 ± 5 % 0.2
0.2
Δ f(3 dB) = f0/10
0.1
0.0 0
0.7 0.9 1.1 1.3 750 800 850 900 950 1000 1050 1100 1150

16925 f/f0 - Relative Frequency 21425 λ- Wavelength (nm)

Fig. 5 - Frequency Dependence of Responsivity Fig. 8 - Relative Spectral Sensitivity vs. Wavelength

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0° 10° 20° 30°

0.8

0.7

Ee min. - Sensitivity (mW/m2)

40° 0.6

1.0 0.5

0.9 50° 0.4

60° 0.3
0.8
70° 0.2

80° 0.1

0.6 0.4 0.2 0 0

1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
21427 drel - Relative Transmission Distance VS - Supply Voltage (V)

Fig. 9 - Horizontal Directivity Fig. 11 - Sensitivity vs. Supply Voltage

0° 10° 20° 30°

40°

1.0

0.9 50°

0.8 60°

70°
80°

0.6 0.4 0.2 0

21428 drel - Relative Transmission Distance

Fig. 10 - Vertical Directivity

Rev. 1.0, 09-Mar-12 4 Document Number: 82470

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PACKAGE DIMENSIONS in millimeters
6.8
6.6 ± 0.1
3.2
(3.4)
Mold residue
Mold residue 2.2 2.5

0.8
3

1.2 ± 0.2
(1.8)

(0.635) (1)
1.27
(3 x)
0.5 ± 0.1
(4 x)
technical drawings
3 x 1.27 = 3.81
according to DIN
specifications
Marking area
(2.2)
Tool separation line Not indicated tolerances ± 0.15

Proposed pad layout

from component side
2.2

(for reference only)

(1.65)

3 x 1.27 = 3.81

1.27
(R1.3)

Pick and place area

1.8

Drawing-No.: 6.550-5297.01-4
Issue: 4; 13.09.11

22608 0.8

ASSEMBLY INSTRUCTIONS
Reflow Soldering Manual Soldering
• Reflow soldering must be done within 72 h while stored • Use a soldering iron of 25 W or less. Adjust the
under a max. temperature of 30 °C, 60 % RH after temperature of the soldering iron below 300 °C
opening the dry pack envelope • Finish soldering within 3 s
• Set the furnace temperatures for pre-heating and heating • Handle products only after the temperature has cooled off
in accordance with the reflow temperature profile as
shown in the diagram. Excercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
• Handling after reflow should be done only after the work
surface has been cooled off

Rev. 1.0, 09-Mar-12 5 Document Number: 82470

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VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE
300
max. 260 °C
250 255 °C
240 °C 245 °C
217 °C
200
max. 20 s

T (°C)
150
max. 120 s max. 100 s
100
max. Ramp Up 3 °C/s max. Ramp Down 6 °C/s
50

0
0 50 100 150 200 250 300
t (s)
19800 max. 2 cycles allowed

TAPING VERSION TSSP..TR DIMENSIONS in millimeters

4°
0.3

3.3
7.1

16

7.5

1.75

1.34 ref.
4°
2.8

Ø 1.5

Ø 1.5 min
2
8

Direction of feed

technical drawings
4

according to DIN
specifications

Drawing-No.: 9.700-5337.01-4
Issue: 1; 16.10.08
21577

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TAPING VERSION TSSP..TT DIMENSIONS in millimeters
4°

0.3

3.35
7.1

16

1.75 7.5
4°
3.3

Ø 1.5

Ø 1.5 min.
2

Direction of feed
8

technical drawings
Drawing-No.: 9.700-5338.01-4 according to DIN
Issue: 3; 09.06.09 specifications

21578

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REEL DIMENSIONS in millimeters

16734

LEADER AND TRAILER DIMENSIONS in millimeters

Trailer Leader

no devices devices no devices

End Start

min. 200 min. 400

96 11818

COVER TAPE REEL STRENGTH LABEL

According to DIN EN 60286-3 Standard bar code labels for finished goods
0.1 N to 1.3 N The standard bar code labels are product labels and used
300 ± 10 mm/min. for identification of goods. The finished goods are packed in
final packing area. The standard packing units are labeled
165° to 180° peel angle
with standard bar code labels before transported as finished
goods to warehouses. The labels are on each packing unit
and contain Vishay Semiconductor GmbH specific data.

Rev. 1.0, 09-Mar-12 8 Document Number: 82470

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VISHAY SEMICONDUCTORS GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods)
PLAIN WRITING ABBREVIATION LENGTH
Item-description - 18
Item-number INO 8
Selection-code SEL 3
LOT-/serial-number BATCH 10
Data-code COD 3 (YWW)
Plant-code PTC 2
Quantity QTY 8
Accepted by ACC -
Packed by PCK -
Mixed code indicator MIXED CODE -
Origin xxxxxxx+ Company logo
LONG BAR CODE TOP TYPE LENGTH
Item-number N 8
Plant-code N 2
Sequence-number X 3
Quantity N 8
Total length - 21
SHORT BAR CODE BOTTOM TYPE LENGTH
Selection-code X 3
Data-code N 3
Batch-number X 10
Filter - 1
Total length - 17

DRY PACKING After more than 72 h under these conditions moisture

The reel is packed in an anti-humidity bag to protect the content will be too high for reflow soldering.
devices from absorbing moisture during transportation and In case of moisture absorption, the devices will recover to
storage. the former condition by drying under the following condition:
Aluminum bag 192 h at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen)
or
Label
96 h at 60 °C + 5 °C and < 5 % RH for all device containers
or
24 h at 125 °C + 5 °C not suitable for reel or tubes.
An EIA JEDEC standard JSTD-020 level 4 label is included
Reel on all dry bags.

15973 LEVEL
CAUTION
This bag contains
MOISTURE-SENSITIVE DEVICES 4
FINAL PACKING 1. Shelf life in sealed bag: 12 months at < 40 °C and < 90 % relative
humidity (RH)
The sealed reel is packed into a cardboard box. A secondary 2. After this bag is opened, devices that will be subjected to soldering
reflow or equivalent processing (peak package body temp. 260 °C)
cardboard box is used for shipping purposes. must be
2a. Mounted within 72 hours at factory condition of < 30 °C/60 % RH or
2b. Stored at < 5 % RH
3. Devices require baking befor mounting if:
RECOMMENDED METHOD OF STORAGE Humidity Indicator Card is > 10 % when read at 23 °C ± 5 °C or
2a. or 2b. are not met.
4. If baking is required, devices may be baked for:
Dry box storage is recommended as soon as the aluminum 192 hours at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen) or
96 hours at 60 °C ± 5 °C and < 5 % RH for all device containers or
bag has been opened to prevent moisture absorption. The 24 hours at 125 °C ± 5 °C not suitable for reels or tubes
Bag Seal Date:
following conditions should be observed, if dry boxes are (If blank, see barcode label)

not available: Note: Level and body temperature defined by EIA JEDEC Standard JSTD-020

• Storage temperature 10 °C to 30 °C 22522

• Storage humidity ≤ 60 % RH max. EIA JEDEC standard JSTD-020 level 4 label is included
on all dry bags

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ESD PRECAUTION VISHAY SEMICONDUCTORS STANDARD BAR
Proper storage and handling procedures should be followed CODE LABELS (example)
to prevent ESD damage to the devices especially when they The Vishay Semiconductors standard bar code labels are
are removed from the antistatic shielding bag. Electro-static printed at final packing areas. The labels are on each
sensitive devices warning labels are on the packaging. packing unit and contain Vishay Semiconductors specific
data.

22178

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Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
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Revision: 12-Mar-12 1 Document Number: 91000