Hardware Engineer's Guide

FOR

Component Selection
Component Selection Guide Shimi Cohen - All Rights Reserved

INTRODUCTION
SELECTION FUNDAMENTALS
Modern Selection Challenges

Today's board designers face unprecedented component selection challenges:

Challenge Impact Mitigation Approach

Supply Chain Disruptions Extended lead times Strategic sourcing, alternate components

Accelerating Obsolescence Shorter lifecycle products Lifecycle planning, second-sourcing

Counterfeit Components Quality/reliability issues Trusted supply chain, verification

Miniaturization Pressure Footprint constraints Advanced packaging technologies

Performance Demands Power/thermal constraints Advanced simulation, margin analysis

Component selection parameters

These factors must be taken into consideration when selecting components:

Performance:
Parameters defining the components

Availability:
Component availability always been a problem

Product Lifespan:
Component lifecycles constrain

Cost:
Very Important Factor

Size:
Component Dimension

Age:
Manufacturing Date

Status:
Active / NRND / Obsolete

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Component Selection Guide Shimi Cohen - All Rights Reserved

OVERVIEW
COMPONENT VARIETY
When we talk about Board Design there are families of components used in most
applications and design, some of them are passive, some are active or even semi-
conductor (diode). These are the components we will focus on:
Popular Components

Component Family Application

Resistor Passive PU / PD

Capacitor Passive Filter, Decoupling

Inductor Passive Filter, Switching

Diode Semiconductor Protection, DC-DC

Transistors Active Current Amplifiers, Buffers

OPAMP Active Voltage Amplifiers, Filters

DC-DC (Reg.) Active Power Supplies

MCU/FPGA/CPLD Active Complex Logic Devices

FOOTPRINT AND PLACEMENT

Type of placement known and familiar with today:
• Through-Hole TH
• Surface-Mount Device SMD
• Ball Grid Array BGA
• Land Grid Array LGA
• Quad Flat Package QFP
• Quad Flat No-lead QFN
• Small Outline IC SOIC
• Small Outline Package T/M/V/TS/ SOP
• Dual Flat No-lead DFN
• Leadless Chip Carrier LCC

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Component Selection Guide Shimi Cohen - All Rights Reserved

COMPONENTS TYPES
PASSIVE COMPONENTS
Resistor Characteristics

Resistor Parameters:
• Resistance (Ω): The primary value – opposition to current flow.
• Tolerance (%): How accurate the resistor is from its nominal value (e.g., ±1%, ±0.1%).
• Power Rating (W): Maximum heat without damage (e.g., 1/4W, 1W, 5W).
• Voltage Rating (V): Max voltage it can withstand without breakdown.
• Stability: How well the value holds over time, temperature, humidity
• Size / Package: Affects power handling and layout. E.g., 0603, 0805, axial, radial

Resistor Types:
• General: No special parameters
• Precision: Resistance Tolerance < 0.1%
• Shunt: Very Small Values for current sensing
• Power: Rated for high power (physically larger)
• Variable: Resistance Range (potentiometer)
• Photoresistor: Reflected light Changes resistance
• Thermistor: RTD / NTD / PTC

Resistor Packages:
• 0201 (0603 metric): Ultra-compact (0.6×0.3mm) for wearables/medical devices
• 0402 (1005 metric): Tiny SMD (1.0×0.5mm) for smartphones/tablets
• 0603 (1608 metric): Standard SMD (1.6×0.8mm) for consumer electronics
• 0805 (2012 metric): Mid-size SMD (2.0×1.25mm) for general-purpose circuits
• 1206 (3216 metric): Larger SMD (3.2×1.6mm) for power supplies/industrial use
• 2512 (6432 metric): High-power SMD (6.4×3.2mm) for 1W+ applications

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Component Selection Guide Shimi Cohen - All Rights Reserved

PASSIVE COMPONENTS
Capacitor Characteristics

Capacitor Parameters:
• Capacitance (F): primary value – ability to store electric charge
• Tolerance (%): Allowed deviation from nominal value
• Voltage Rating (V): Max continuous voltage before breakdown.
• ESR (Ω): Equivalent Series Resistance – impacts Heat/Ripple/Stability
• Dielectric Type: Material defines behavior (X7R, C0G).
• Package/Size: SMD (0402–1210), radial, axial
• Polarity: Electrolytic and tantalum are polarized

Capacitor Types:
• Ceramic – non-polarized, cheap, used for decoupling
• Electrolytic – Polarized, high cap, used for P.S smoothing
• Tantalum – Polarized, compact, stable, used in space-constrained circuits
• Film – non-polarized, stable, low loss, used in filters and timing
• Polypropylene – Film subtype, ultra-stable, great for precision and high-voltage
• Supercapacitor – Ultra-high capacitance, used for energy storage/backups
• SMD– Surface-mount version of any type above
• Radial/Axial Capacitor – Through-hole lead configurations

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Component Selection Guide Shimi Cohen - All Rights Reserved

PASSIVE COMPONENTS
Inductor Characteristics

Inductor Parameters:
• Inductance (H) – Ability to store magnetic energy; how it resists current change.
• Current Rating (A) – Max continuous current before overheating or degradation
• Saturation Current – Current where the core loses its magnetic ability
• DC Resistance (DCR) – Internal resistance of the wire; causes I²R losses and heat
• Core Material – Affects frequency response, saturation, and loss (Ferrite, Iron)
• Shielding – Reduces EMI to/from nearby components
• Tolerance (%) – How much inductance can vary from the nominal value.
• Mounting Type – SMD or through-hole; affects size, current handling, and assembly.
• Package Size / Footprint – Physical size; larger inductors handles more power.

Inductor Types:
• Toroidal – Donut-shaped core
• Common Mode Choke – Cancels noise
• Multilayer– SMD, compact
• Drum/Core - used in general power apps.
• Coupled– Two or more windings, SEPIC, Flyback
• Shielded– Magnetic shielding added; minimizes EMI,
• Unshielded– Cheaper, smaller, but higher EMI leakage.
• Surface Mount (SMD) – Small footprint for PCBs
• Power Inductor– Designed to handle high current and power, DC-DC converters.

Inductor Materials:
• Air – No core; zero core losses, ideal for high-frequency RF, but low inductance.
• Ferrite – Ceramic compound; high permeability, low loss at MHz range
• Iron Powder – Granular iron mix; decent inductance, tolerates DC bias well
• Laminated Steel/Iron – Stacked metal sheets; used in transformers
• Silicon Steel – Enhanced laminated iron; Low Freq applications.
• Ceramic – Used as non-magnetic core base in multilayer inductors, mainly for RF.

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Component Selection Guide Shimi Cohen - All Rights Reserved

SEMICONDUCTOR COMPONENT
Diode Characteristics

Diode Parameters:
• Forward Voltage (VF): Voltage drop when conducting forward.
• Reverse Leakage (IR): Small current under reverse bias.
• Max Forward Current (IF): Max continuous forward current.
• Reverse Voltage (VRM): Max reverse voltage without breakdown.
• Max Surge Current (IFSM): Max short-term forward current.
• Power Dissipation (P): Max heat power diode can handle.

Diode Types:
• Rectifier: Handles high current; used for AC to DC conversion.
• Schottky: Low forward voltage and fast switching
• Zener: Operates in reverse breakdown for voltage regulation.
• LED (Light Emitting Diode): Emits light when forward biased
• Power: Supports high current and voltage; used in power electronics.
• Small Signal: Low capacitance and fast recovery; used in RF
• TVS: Protect sensitive electronics from voltage spikes

Popular Packages:
• TO-220: Heatsink-compatible package for power rectifiers/Schottky diodes.
• SOD-123: SMD package for switching diodes (e.g., 1N4148W).
• SOD-323: Ultra-compact SMD for space-constrained designs (e.g., RF diodes).
• SOD-523: Miniature SMD for low-power circuits (e.g., signal clamping).
• SMA/SMB/SMC: SMD packages (DO-214AC/AA/AB)
• MELF (DO-213): Leadless cylindrical SMD for stable Schottky/Zener diodes.
• SOT-23: 3-pin SMD for diode arrays/small-signal applications.
• TO-247: Robust SMD/heatsink package for high-power rectifiers (e.g., automotive).

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ACTIVE COMPONENTS
Active components Types

Transistor
• BJT: Good for current amplifiers, analog buffers
• MOSFET: Good for everything else (Driver, Power Amplifiers)
• JFET: same as MOSFET but slower and less noisy

Operational Amplifier
• General-Purpose – Basic performance, cheap and widely used
• Precision – Low offset/drift, ideal for measurement circuits
• High-Speed – Fast response, high bandwidth for RF/video
• Low-Noise – Minimal input noise, great for audio and sensors
• Rail-to-Rail – Full swing input/output, perfect for low-voltage systems
• Low-Power – Microamp current draw, used in battery-powered devices
• Differential (Instrumentation) – Handles small differential signals
• Programmable Gain – Gain set digitally, great for analog front-end control.
• Comparator –Optimized for switching at thresholds

Voltage Regulators
• Linear Regulator – Either Fixed or Adjustable
• Low Dropout (LDO) – Efficiency depending on in/Out ration
• Buck – Higher Input Lower Output
• Boost – Lower Input Higher (or Equal) Output
• Buck-Boost – When Input range is wide and needs both Buck & Boost
• SEPIC– Buck-Boost with better ripple out
• Inverter – Input and Output are inverted
• PMIC – Programmable regulator via I2C/SPI

MCU / Others
• MCU – Microcontroller Unis (I/O, Memory, Logic)
• FPGA/CPLD – Reconfigurable Logic Blocks
• ICs – Logic Gates Timer and specific applications

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Component Selection Guide Shimi Cohen - All Rights Reserved

SELSCTION STRATERGIES
MULTI-SOURCING APPROACHES
When selectin components always lean towards those that can be replaced when a
problem occurs. For example, pick known footprint were you know that other
manufactures produce the same part with the same pinout.

Approach Implementation
Same Specification Identical part from multiple manufacturers
Form-Fit-Function (FFF) Different part numbers, same functionality
Functional Alternatives Different specifications but same core function
Technology Alternatives Different solution approach

FOOTPRINT STRATEGIES
Strategy Description
Thermal Relief Ensure support in thermal pads (EP)

Footprint Reuse Select Components that share footprints across the design

Hand vs. Machine Prototypes- Avoid smaller than 0603 or no exposed pins.

Avoid Custom Stick to industry standards unless you really need custom pads

Mech Consideration Pay attention to height and dimensions

THERMAL CONSIDERATIONS
• Calculate worst-case power dissipation
• Determine available cooling capability
• Select appropriate thermal resistance
• Verify junction temperature remains below derated maximum
• Consider component placement impact

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Component Selection Guide Shimi Cohen - All Rights Reserved

MANUFACTURING PROCESS COMPATIBILITY

SMT Process Considerations

• Minimum component size for reliable placement

• Maximum component height for reflow clearance
• Component spacing for pick-and-place access
• Solder paste requirements (stencil design)
• Thermal profile compatibility

Assembly limits

Process Capability Standard Advanced Cutting Edge

Minimum Passive Size 0402 0201 01005
Minimum Pitch (QFP) 0.5mm 0.4mm 0.3mm
Minimum BGA Pitch 0.8mm 0.5mm 0.3mm
Minimum Via Diameter 0.3mm 0.2mm 0.1mm

COMPONENT COST
• Unit component cost
• Testing and qualification costs
• Manufacturing yield impact
• Field failure and warranty costs
• Redesign and obsolescence costs

ENGINEERING METHODS
Method Application Savings
Function Analysis Map component cost to functional value 10-30%
Cost Teardown Compare to competitive implementations 5-20%
Technology Alternative Analysis Evaluate different technical approaches 15-50%
Design-to-Cost Set cost targets before selection 20-40%

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Component Selection Guide Shimi Cohen - All Rights Reserved

QUALITY AND RELIABILITY

Qualif ication Standards

Common Qualification Standards:

Standard Industry Focus Key Requirements

AEC-Q100/200 Automotive Environmental Temperature, humidity, vibration resistance
MIL-STD-883 Military Reliability Accelerated life testing, hermetic sealing
JEDEC JESD47 Semiconductor Stress testing Temperature cycling, bias conditions
IPC-9701 Electronics Solder reliability Thermal cycling endurance
ISO 13485 Medical Process quality Traceability, risk management

Implementation Strategy:
• Define qualification requirements by component type
• Document required certifications and test reports
• Create supplier qualification checklist
• Develop incoming inspection protocols
• Establish waiver process for exceptions

Failure Rate Analysis

Component selection should incorporate failure rate expectations:

Reliability Metrics:
• Failures In Time (FIT): Failures per billion device-hours
• Mean Time Between Failures (MTBF): Average time between failures
• Failure Rate (λ): Failures per unit time
• Derating Factor (K): Modification based on operating conditions

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Component Selection Guide Shimi Cohen - All Rights Reserved

TRACEABILITY
COMPONENT DATA MANAGEMENT
Essential Component Documents

• Complete technical specifications

• Qualification test reports
• Compliance declarations
• PCN (Product Change Notice) history
• Application notes and design guidelines
• Sample availability information

Data Management Systems

System Type Features Best For

PLM Software Full lifecycle tracking Enterprise organizations

Component DBs Parametric search, lifecycle tracking Medium organizations

Document Management Version control, access control Smaller organizations

Spreadsheet System Low cost, flexible Start-ups, small teams

Implementation Approach

• Establish minimum required documentation by component type

• Create standardized documentation templates
• Develop naming conventions and storage structure
• Implement review and approval workflows
• Schedule regular documentation audits

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Component Selection Guide Shimi Cohen - All Rights Reserved

CHANGE CONTROL
CHANGE DEFINITION
Change Categories

• Form: Physical dimensions, markings, packaging

• Fit: Interface compatibility, mounting
• Function: Electrical/mechanical performance
• Manufacturing: Process, materials, location
• Quality: Testing, screening levels

Change Control Process

• Change identification/notification
• Impact assessment
• Verification testing requirements
• Implementation planning
• Documentation updates
• Validation and release

Supplier Change Management

• Establish PCN receipt and review process

• Define clear acceptance criteria for changes
• Require advance notification periods
• Implement verification testing for critical changes
• Document all change history

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Component Selection Guide Shimi Cohen - All Rights Reserved

COMPLIANCE DOCUMENTATION
Regulatory compliance requires thorough component documentation:

Key Compliance Areas

Regulation Focus Documentation Required

RoHS Hazardous substances Material composition declarations

REACH Chemical substances SVHC declarations, full material disclosure

Conflict Minerals Material sourcing Sourcing certifications, due diligence reports

WEEE Recycling Material codes, recyclability information

UL/CSA/TÜV Safety Certification records, test reports

Compliance Documentation Strategy

• Define compliance requirements by market and product

• Establish documentation standards for each regulation
• Implement documentation review in selection process
• Maintain compliance evidence throughout lifecycle
• Plan for regulatory changes and updates
Documentation Management Process:
• Request documentation during component selection
• Verify completeness against requirements
• Store in searchable, accessible system
• Review periodically for updates
• Link documentation to component records

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Component Selection Guide Shimi Cohen - All Rights Reserved

APPLICATION-SPECIFIC
INDUSTRIAL COMPONENT SELECTION
Industrial applications demand specialized component selection considerations:

Key Industrial Requirements

Extended temperature range (-40°C to +85°C typical)

Vibration and shock resistance
Long operational lifetime (10-20+ years)
Pollution resistance (dust, chemicals, moisture)
Electrical noise immunity

Industrial-Grade Selection Criteria

Component Type Key Parameters Recommended Specifications

Capacitors Temperature stability, life X7R/X8R ceramic, 105°C+ electrolytic

Connectors Contact reliability, sealing Gold-plated contacts, IP67+ sealing

ICs Temperature range, robustness Industrial temp, ESD protection

Power MTBF, transient handling 2× derating, surge protection

Sensors Drift, calibration stability Temperature compensated, sealed

Implementation Strategy

• Define environmental and operational profile

• Select components with appropriate ratings
• Apply additional derating for harsh environments
• Verify component availability for product lifetime
• Implement design validation testing

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Component Selection Guide Shimi Cohen - All Rights Reserved

CONSUMER ELECTRONICS CONSIDERATIONS

Consumer electronics prioritize different selection factors:

Key Consumer Requirements

• Cost sensitivity
• Small form factor
• Aesthetic considerations
• Energy efficiency
• Moderate lifetime (2-5 years)

Consumer Electronics Selection Criteria

Component Type Key Parameters Selection Strategy

Passives Size, cost Commercial grade, minimal margins

ICs Power consumption, package size Latest process nodes, smallest packages

Interconnect Durability, appearance Cycle-rated connectors, aesthetic finish

Power Efficiency, thermal High efficiency prioritized, minimal heatsinking

Display Quality perception, power Optimize for visual impact vs. power

Implementation Strategy

• Establish clear cost targets by subsystem

• Prioritize form factor and aesthetics requirements
• Optimize for "good enough" reliability
• Consider consumer perception factors
• Balance cost against feature differentiation

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Component Selection Guide Shimi Cohen - All Rights Reserved

AUTOMOTIVE-GRADE COMPONENTS
Automotive applications require specialized component selection:

Key Automotive Requirements:

• Extreme temperature operation (-40°C to +125°C)

• Vibration and mechanical stress tolerance
• Long operational lifetime (15+ years)
• Functional safety considerations
• Zero-defect quality expectations

Automotive-Grade Selection Criteria:

Component Type Key Parameters Required Specifications

Passives Temperature stability, reliability AEC-Q200 qualified, automotive grades

ICs Qualification level, diagnostics AEC-Q100, functional safety features

Connectors Vibration resistance, sealing Automotive-specific designs, IP rating

Power Transient protection, efficiency Load dump tolerance, thermal performance

Sensors Accuracy over temperature, diagnostics AEC qualified, self-test capabilities

Implementation Strategy:

• Select components from automotive-approved vendor lists

• Verify AEC qualification documentation
• Review PPAP (Production Part Approval Process) documentation
• Assess functional safety capabilities
• Evaluate long-term availability commitments

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DECISION-MAKING
COMPONENT SELECTION MATRIX
A component selection matrix

Matrix Structure:
• Components as rows
• Selection criteria as columns
• Weighting factors for each criterion
• Scoring scale (typically 1-5 or 1-10)
• Weighted sum for final comparison

Common Selection Criteria:

• Technical performance
• Cost impact
• Supply chain risk
• Quality/reliability
• Manufacturing compatibility
• Environmental compliance
• Lifecycle availability

Matrix Implementation Steps:

• Define selection criteria relevant to project
• Assign weighting factors based on priorities
• Evaluate each option against criteria
• Calculate weighted score for each option
• Document decision rationale

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Component Selection Guide Shimi Cohen - All Rights Reserved

RISK ASSESSMENT METHODS

Risk assessment Stratergy:

Component Risk Factors:

• Single-source status
• Manufacturing capacity constraints
• Geographic concentration risk
• Technology maturity/volatility
• Supplier financial stability
• Quality history and incidents
• Compliance/regulatory risk

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Component Selection Guide Shimi Cohen - All Rights Reserved

CASE-BY-CASE
RESISTOR SELECTION
Step-By-Step (Shunt Resistor)

When you need to select resistor for your design Do the following Steps:
Step [1] : Define Your Application
What is the role of the resistor, for this matter let's assume it is a shunt.
Step [2] : Find Value
Design Requirements:
Measuring 4A of 24V
Gain = 500.
Max Input = 3V

VR = Vmax / 500 = 3 / 500 =60mV → R = VR / Imax = 60mV / 4A = 15mΩ

Step [3] : Check Performance

Let's Calculate the power over the resistor:
Power = I x VR = 4 x 60mV = 240mW
Step [4] : Select Size

According to the table we should select : 2512 / 15mΩ (minimum resistance)

Step [5] : Check Status

Check component status, Company Database, Availability, Lead Time, Cost.

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Component Selection Guide Shimi Cohen - All Rights Reserved

INDUCTOR SELECTION
Step-By-Step (Buck Converter)

When you need to select inductor for your Power Supply (Voltage Regulator)
Step [1] : Define Your Application
In this case, the application is Switching Inductor.
Step [2] : Find Value
Design Requirements:
12V Input / 3.3V Output
Current Load : 1A Max
PWM Frequency = 1.2MHz
Required Ripple = 50mV out (on 3.3V)
Duty Cycle (D): D = Vout/Vin = 3.3V/12V = 0.275
Required Inductance: L = [(Vin - Vout) × D] / [f × ΔIL]
Estimated Current: Peak current = I Max + (ΔIL/2)
Solving the equations: For 50mV ripple, L ≈ 4.7μH
Step [3] : Select Size & Type

Step [4] : Check Status

Check component status, Company Database, Availability, Lead Time, Cost.

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Component Selection Guide Shimi Cohen - All Rights Reserved

DC-DC SELECTION
Step-By-Step (Buck- Boost Converter)

When you need to select inductor for your Power Supply (Voltage Regulator)
Step [1] : Define Your Application
In this case, Buck Boost Voltage Regulator
Step [2] : Find Options
Design Requirements:
8V – 14V Input / 12V Output
Current Load : 1A Max
Efficiency > 85%
Preferred Manufacturers : TI / Analog
LTC3111 (Analog Devices )
• Input Voltage Range: 2.5V to 15V (covers 8–14V input)
• Output Voltage Range: 2.5V to 15V (supports 12V output)
• Continuous Output Current: 1.5A
• Efficiency: Up to 95%
2. LM5118 (Texas Instruments)
• Input Voltage Range: 4V–75V (handles 8V–14V input).
• Output Current: Configurable via external MOSFETs (supports 1A+).
• Efficiency: Up to 90% in buck mode.

Step [3] : Compare & Check Datasheet

This Part is very crucial, the more you check the datasheet the better.
Parameter LTC3127 LM5118
Input Voltage 3.5V–15V 4V–75V

Output Current 1A (integrated) Configurable (external FETs)

Efficiency Up to 95% Up to 90%

Package 10DFN/12MSOP 20HTSSOP

Complexity Low (integrated switches) Moderate (external FETs)

Cost Higher integration cost Lower BOM cost

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ONLINE TOOLS
COMPONENT SERACH ENGINES
Tool Name Link
Octopart https://octopart.com/
SnapEDA https://www.snapeda.com/
Ultra Librarian https://www.ultralibrarian.com/
FindChips https://www.findchips.com/
Component Search https://componentsearchengine.com/
Digi-Key Selector https://www.digikey.com/products/en
Mouser Selector https://www.mouser.com/
PartSim BOM Tool https://www.partsim.com/tools/bom
PCB Footprint Wizard https://www.pcblibraries.com/pcb-footprint-wizard.aspx
SamacSys Search https://componentsearchengine.com/
Altium Part Search https://www.altium.com/part-search
DesignSpark https://www.rs-online.com/designspark/home

SIMULATION TOOLS
Tool Name Link

Power Simulation https://webench.ti.com/

component simulation https://ds.murata.co.jp/simsurfing/index.html?lcid=en-us

Capacitor simulation https://ksim.kemet.com/

Inductor simulation https://redexpert.we-online.com/redexpert/

DC/DC converters https://www.analog.com/en/design-center/interactive-design-tools.html

Simulate NTC https://www.vishay.com/resistors/thermistors/ntc-rt-calculator/

Generate footprints https://www.pcblibraries.com/pcb-footprint-wizard.aspx

MTBF Simulation https://www.reliabilityeducation.com/mtbf-calculator.html

Inductors for DC-DC https://www.coilcraft.com/apps/tools/

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AI ASSITANCE
AI CAN SAVE YOU TIME
AI Search For Components

You need to find a component:

1. Define your requirements
2. Add constrains (cost, size)
3. Build a Prompt
4. Let GPT search the parts for you

AI Datasheet analysis

You found a candidate component, but you are not sure it meets all spec.
1. Download the datasheet of the desired component
2. Feed the AI with the PDF
3. Craft a Prompt with all requirement and constrains
4. Let AI analyze the datasheet file against the spec.
AI BOM Optimiztion

You have a BOM list of component but not sure regarding status or availability.
1. Prepare CSV or Excel with BOM
2. Feed the AI
3. Craft a prompt to check for Obsolete, NRND, Long Lead Time
4. AI will optimize the list and find alternatives based on your guidance
Extract BOM f rom Schematics

You need to get a BOM out of schematics and you have a PDF.
1. Save the schematics as PDF (you may need to divide it for resolution)
2. Feed the AI with all parts
3. Craft a Prompt to Arrange BOM list with values
4. Optimize the list and let it Look for real components

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