Hangzhou NeoDen Technology Co.

Ltd

User Manual
Neoden4

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 Content
1.Structure of Neoden 4.................................................................................................................. 6
1.1.Brief Introduction..................................................................................................................6
1.2.Structure of NeoDen 4.......................................................................................................... 7
2.Operation Flow Chart....................................................................................................................8
3.Procedure for making a programming file..................................................................................9
4.Edit on the Operation Interface..................................................................................................10
4.1Edit on the Interface.............................................................................................................10
4.1.1.PCB Feeding Setting................................................................................................10
（1） Tray fixed...................................................................................................... 10
（2） Rail once....................................................................................................... 10
（3） Rail multi.......................................................................................................11
（4） Eject front......................................................................................................11
4.1.2.Setting Panelized PCB & first chip( manual is the same as automatic download)............. 11
（1） Single PCB....................................................................................................12
（2） Panelized PCB.............................................................................................. 12
（3） PCB angle correction.................................................................................... 13
（4） Bad PCB detection........................................................................................13
4.1.3.PCB mark point setting............................................................................................13
（1） Single PCB....................................................................................................13
（2） Panelized PCB.............................................................................................. 13
（3） Maunal.......................................................................................................... 14
（4） Add or delete mark point.............................................................................. 14
4.1.4.Chip list setting........................................................................................................ 15
（1） Manual program............................................................................................15
（2） Import PCB BOM File..................................................................................16
4.1.5.Feeder configuration................................................................................................ 17
（1） Feed setting................................................................................................... 17
（2） System setting............................................................................................... 17
4.2.File mounting...................................................................................................................... 21
4.3.Manual test.......................................................................................................................... 22
4.3.1.Placement head........................................................................................................ 22
4.3.2.Rails control............................................................................................................. 23
4.3.3.Host control..............................................................................................................23
4.3.4.Feeder test................................................................................................................ 24
4.4.Factory settings................................................................................................................... 24
4.4.1Feeder configuration................................................................................................. 26
4.4.2.Feed setting.......................................................................................................... …29
4.4.3.Peel Configuration ……………………………………………………………… 30
4.4.4.System setting.......................................................................................................... 31
4.5.First trial and testing........................................................................................................... 33
4.6Continuous SMT production................................................................................................34

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5.Structure and maintenance instruction..................................................................................... 35
5.1.Structure chart..................................................................................................................... 35
5.1.1Peel box.....................................................................................................................36
5.1.2.Tape&Reel holder.................................................................................................... 36
5.1.3.Fixation support....................................................................................................... 37
5.1.4.Feed-box...................................................................................................................37
5.1.5.Vibration feeder........................................................................................................38
5.1.6.Auto-rails................................................................................................................. 39
5.1.7.Nozzle...................................................................................................................... 40
5.2Maintenance......................................................................................................................... 42
5.2.1.Take effective measures to reduce/ avoid malfunction........................................... 42
5.2.2Maintenance of device.............................................................................................. 43
5.2.3Placement failure analysis and troubleshooting....................................................... 44
5.2.4Related issues during Solder paste printing process ...............................................45
1.Stencil Printing Technology...................................................................................45
2.Inspecting of solder paste printing.........................................................................45
3.The defects of solder paste printing, reasons and solutions.................................. 46

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 PLEASE READ THIS USER MANUAL
COMPLETELY BEFORE OPERATING
IMPORTANT THIS UNIT AND RETAIN THIS BOOKLET
FOR FUTURE REFERENCE

Notes
1.The contents include all features of NeoDen4, some of which may not be equipped on your
machine.
2.Basic training and basic SMT knowledge is required for an operator.
3.For routine inspection and repair ,please contact sales for operating instruction.

Safety Device,Warning Label

1.Before operation,please ensure the presence of adequate guarding and safety devices to avoid
accident..
2.When tear down the safety device,please keep it in the original position,and make sure it works
in good condition
3.When failures happen on safety device,can not run the machine after remove safety device.In
case any injuries or casualty accident.

Usage
1.You agree that you will solely be responsible for your use of any products and services provided
to you and that you will use our products and services legally and only for the purposes that they
are intended to be used for.
2.You agree that you will not misuse the products and/or services supplied and that you will abide
by any laws applicable to this agreement or the operation of it.

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 CAUTION
Power off: After cut off main power supply,pull the plug or disconnect the power cable from the
power supply.
1.When an exception or failure happens,or power failure,please terminate the operation of
Windows,and power it off.
2.Power off prior to cleaning and repairing in case of any accidents.
3.When pull the plug,please hold the head instead of wire.

Transport
1.Take necessary security measures,to prevent upside down or fall when lifting or moving.

Open
1.Please read all instruction in the wooden box
2.Do not cut the packing tape by knife,to avoid scratch the machine
3.Keep all packing material.

Installation
1.Please put the machine in a horizontal place.
2.Please keep the floor clean and dry,and the machine should be grounded, to prevent electric
shock or leakage.

Prepare work
1.Make sure the power cable no damage,no shedding and no loose.
2.Do not put hand in the working area.

Maintenance
1.Repair and calibration should be operated by skilled mechanical technician.When replacing
parts,please use the part which are supplied by NeoDen.We are not responsible for any accident
result from using nonstandard part.
2.In order to prevent electric shock caused by unskilled operation,the electrical repairs,
maintenance(including wiring),should be operated by professional electrician or the technical staff
from NeoDen or our distributors.
3.Make sure Bolts - Nuts are tighten after repair,calibration or replacing any part.

Working Environment
1.Do not use machine in a noisy environment,such as high frequency welding machine.
2.Do not use machine if the power supply voltage exceed the rated voltage ± 10%.
3.Do not use machine and pull the plug when thunder to avoid any accident caused by damaged
electrical component.

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1. Brief Introduction

1.1. Product Introduction

NeoDen4,the 4th generation pick and place machine of NeoDen Tech., was
independently designed and developed with patents and CE certificate.
This machine equipped with dual cameras, four heads, auto rails,electronic
feeder,two conveyor ports, which achieves high accuracy,simple structure,stable
performance and easy operation.
It adopts our newly developed feeding system which can help to replace the tape
easily and install smoothly, together with its vision system and rails feeding system,
committed to create the great value for customers in actual PCB production.

1 Number of Heads with Vision 4

Placement Rate( under
2 WITH VISION:5000/WITHOUT VISION:10000
factory test condition)
TAPE REEL FEEDERS:48（all 8mm)
3 Feeder capacity
VIBRATING FEEDERS:5
4 IC tray capacity 5
Smallest Component size:0201
5 Component sizes with vision
Largest Component size:TQFP240
6 Component Max Height 5MM
7 Resolution X/Y axis:0.01MM Z axis:0.1MM
9 Rotation +/-180°(360°)
10 Positioning Accuracy +/-0.02MM
11 X-Y repeatability +/-0.02MM
With Auto Rails:310*1500MM(without waffle tray)
140*1500MM(with 1 waffle tray)
13 Placement Area
Without Auto Rails :310*400MM(without waffle tray)
140*400MM(with 1 waffle tray)
15 Main Control GUI
16 Power Supply 110V/220V
17 Power 180W
18 External Dimensions Machine :87*68*48CM/Packing size:94*74*60CM
19 Weight Net Weight:60KGS/Gross weight:80KGS

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 1.2. Structure of NeoDen 4

Each part mentioned above can be disassembled and tested. Please find more details on P20.

①：Placement head
②: Nozzle
③：Rails
④：Vibration feeder
⑤：On/Off button
⑥：Conveyor port
⑦：Multi-hole positioning board
⑧：Feed box
⑨：Peel box
⑩：Emergency button
⑪：Power switch
⑫：Rack shelf
⑬：Acrylic cover
⑭：Foot Mounts
⑮：Fixed support

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 2. Operation Flow Chart
NO. Flow chart Note
Check the working environment
1 Preparation whether it is safe or not

2 Turn on

The machine will start a 1-2 mins

Initialization self-inspection after boot-up. It enters
3
the operation page once finished.

4 Operation page

Please check detailed programming

5 Edit tutorial in P10.

After making a programming file, there

Modify
may exist several unpredictable
6 Test problems , such as rotation issues of
No
components, so a production testing is
necessary for solving issues.
Yes

Start to pick and place

7 Mounting

8
Exit

Power off software

9 System power off

Power off after the software being

10 Power off turned off, which decrease the damage
to the software
Keep the machine clean and nozzles
Cleaning and maintenance need to be washed regularly
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Keep daily maintenance of nozzle
assures high utility.

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 3. Procedure for making a programming
file

Edit the file 1. PCB feed setting See P10

See P11
2、Chip list Save Select
and file and
3.Feeder setting See P 17 start
return
Add a new file working
4.Panelized PCB first See P11
chip setting

See P13
Start 5.Mark point setting

Note: The basic procedure of making a programming file for manual programming or direct PCB
file is similar, but there are two different parts: chip list and mark point setting. Please find the
detailed operation steps of the differences on relative page.

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4. Edit on the Operation Interface

4.1. Edit on the Interface

See below Fig.: Edit Interface

4.1.1. PCB Feeding Setting

Function:Used to confirm the feeding place,first edit item in manual program

Introduction of function keys:
(1) Tray Fixed:Once select tray fixed,the setting items of board feeding will be closed.We only
need use the positioning column to fix the board.
(2) Rail Once:First need ensure there are rails for your machine,then select one-off rail feed,the
setting items will be open corresponding.
Operation Step:First should adjust the width of the rail to ensure the PCB can move smoothly
Adjust the position of the board in rail via clicking items”Rail forward” and “Rail
backward”.
Click “ Align” enter into below interface(See fig.2),then adjust the position of camera until
to the limited place (See fig.3).Click “Save” item to save the setting,return to the main page

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 to finish the setting.

Fig.2 Fig.3

(3) Multiple rail feed: This is only available for long board that can’t be handled once, such as
LED strip. After finished one part of PCB, the rails will advance the board and handle the left part
automatically.

(4) Eject PCB front-side:Once selected this item,the PCB will eject at front side when finish
mounting.If don’t select,the PCB will eject at back side.

4.1.2. Setting Panelized PCB & first chip( manual is the same as
automatic import)

Function: This is mainly to determine the first component on single or panelized PCB of manual
programmed or imported file. The principle is to collect and calculate the data of each board’s

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relative spacing, in order to achieve the effect of the actual placing.

Operation introduction

(1) Single PCB: Only need to enter “1” in the row and column, some other useless function will
turn grey. The “left bottom” is functional, which means the first PCB.Then you can press “align”
to go to the screen of vision and get the coordinate of first component, see image 2-2.

Fig.2-2

After saving the coordinate, the screen will automatically turn back to “PCB information” . Click
“Create panelized list” to get the information of “Panel 1”. Now we’ve finished setting of first
component of PCB.

(2) Panelized PCB: the sequence is same to single PCB, but please pay some attention to several
points below.
The row and column is determined by the positioning of PCB on working area. The
direction along the rails is the column. Enter data in the row and column.
About the data collection of “left bottom” , “left top” and “right top”, we should take the
“left bottom” as the basic, and then go to set “left top” and “right top”. Once all the data is
collected, the machine can calculate and process the information of panelized PCB. Please
refer to the data collecting method of each position information as following:

The data of “left bottom” is collected according to first component in programming file.
Press “align” find the left bottom panel which is nearest to the feeding position, after saving
the data, it will return to the “PCB information” automatically.
The data of “left top” is collected according to component (its position is same to that on “left
bottom”). Press “align” find the left top panel which is furthest to the feeding position, after
saving the data, it will return to the “PCB information” automatically.
The data of “right top” is collected according to component (its position is same to that on
“left bottom”). Press “align” find the right top panel which is furthest to the feeding position,
after saving the data, it will return to the “PCB information” automatically.

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After setup, click “create panelized list”, the data will be generated accordingly in the blank.

(3)PCB angle correction: angle deviation of PCB board compare to rails

(4)Bad board detection：used for find the bad PCB board and skip

4.1.3.PCB mark point setting

Fig.3-1

Function: After completing setup of the mark points, with which the machine can locate the
position of PCB and identify the set up mark points, so that the next step can be followed
Operation method:

(1) Mark point on single PCB: this mainly applies on single PCB or a whole board that consists of
a few boards (take them as a single board ).General we need to set 2-3 mark points.

(2) Panelized PCB: this mainly applies on multiple PCB(we need to set mark points on each
PCB )

(3) Manual alignment

If there is no mark point on PCB, you can use some positioning holes or some other
referential points as subsidies to locate the PCB.

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 Fig.3-2
Import coordinate: according to the PCB schematic, we get the coordinate of mark and write
down manually.
Mark point information；
Min-Max: Based on different size of mark point to find the correct position in case of any
confusion.
Light source: inner ring and outer ring. Use inner ring if the board holes work as fiducials , use
outer ring if light-spots work as fiducials.
Brightness：Default value

Manual programming: when it’s in Manual Programming status, the function “Alignment” of
Mark will be effective. Click on it, the camera will go and collect the coordinate of mark (see
image 3-2), save it and go back. (Note: if the mark point is far away, please use Overall
movement to find it)

No mark exists: Generally we will choose a component that is far away from the first
component as a mark, which will make placement effect better.
(4) Add mark point: the function of adding mark point
Delete mark point: the function of deleting mark point can be used when there is needless mark
point or error point.

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4.1.4.Chip list settings

Function: to display the sequence, footprint and other information of components. There are two
ways to add these information: manual programming and import mounting file.

Operation：
（1） Manual programming: firstly, check the box of manual programming. There is a sample line
of the first component, please modify this line firstly.

Fig. 4-1,
one component has been found

Find and confirm one component’s coordinate by using the function of “Movement Mode”-Click

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to move (Visual field/Overall Workbench).Once clicked the “Save” item,the interface will
automatic back to main page,then input the corresponding values(Designator refer to the
location,Specification refer to the value of resistance,Footprint refer to the normal package
info,I.e.0603,0805,1206,Etc.Angle value should be set according to the required direction on the
PCB and polarity ,horizontal direction(0 or 180 degree),vertical direction(90 or -90 degree).The
first component have been completely created after set all above values.The next step is click
“New”item and will pop up one line(completely copy the previous line),then click “Align” to find
and confirm second component(same operation as before)

(2) Import PCB Coordinate File

First generate the coordinates from PCB diagram and put the PCB file on the USB Flash
Disk,then insert it to the machine(There are many kinds of PCB designer software,the only
request is can generate the coordinates from them,file format(.csv)-support use Excel to edit
Remove tick mark before the item”Manual ”and then click “File import”,will pop up one
small dialog,select the required PCB file and then click “Save”item,all data will be automatic
imported to Chip List .(Turn to the “Feeder configuration”interface to do next operation).See
fig.4-2

Fig.4-2

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4.1.5.Feeder configuration

(1) Feeders Arrangement:Left Feeders(Feeder20-48),Right Feeders(Feeder1-19),Special

Feeders(Feeder49-58).
There are two ways to setup feeders.
①Before installing tape&reels.
Press “Allocate Chip to Feeder”, it will calculate how many different components according to
Chip List, and automatically allocate them to each feeder in sequence.
②After installed tape&reel
Click on each feeder, it will pop out a drop-down list with all components’specification, select one
by one according to actual allocation.

(2) Feeder Configuration:Select one feeder,tick the item”Apply”,all configurations will be

unlocked for this feeder,then can do amendment.There are five items:Nozzle information,
Feed-box information,Feeder basic information,Tray feeder information,Feeder exchange.One
item will be always locked for Feed-box information and Tray feeder information according to the
differences of components.Operation sequence: Feed-box information(Tray feeder information)
—Feeder basic information—Nozzle information—Feeder exchange(used if placed wrong tape).

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 Feed-box information setting

Function:Adjust the value for feeder and peel box

Peel Strength:Support do adjustment according to different components’ required strength,default
value 100
Feeding rate: It's the distance between two components.
Feed strength:Adjust the feed strength by changing the value,default value 60
Feed test:After finishing above steps,can click this item to test the feed status

Tray feeder information

Function:Use to set the components’ information from tray and tube packages,complete picking
up operation for special feeders by changing the values
1 Column: Quantity of components on each column
2 Row: Quantity of components on each row
3 Right top X/Y: Find the position of right top component, this component is usually the
last component in IC tray, and left bottom side is the first component in IC tray.
4 Start X/Y: This setting is used to define the position of 1st component, its default setting
is X1,Y1( in 1st column, 1st row). If the 1st component is on 2nd column, 1st row, you can enter
X2,Y1.

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 Feeder basic information

Fig.5-1 Fig.5-2

1 Pick position X/Y:First have to lock the position of component on the feeder(See
fig.5-2),once saved the modification, the XY data will automatically change to the ones after
alignment.
2 Pickup Angle:The initial default angle is 90 degrees, support to do modifying the value
in order to change the mounting angels for wholly feeder if needed.
3 Footprint:Select corresponding footprint,when use the function”Vision Alignment”, will
refer to the values in date base.
4 Placement speed:Control the placement speed for the feeder by adjust the speed values.
5 Vision Alignment:Choose corresponding alignment method under this item.
6 Pick height:Control the pick height by dragging the sideward slider.
Placement height:Set the value according to the component’s actual thickness.
7 Placement/Pick delay:set a little value or 0 both ok.
8 There are two detection methods,Vacuum Detection and Vision Detection.
Vacuum Detection:Once the “Vacuum dete.” is ticked, the sensor of air pressure will be turned on.
If the actual vacuum hasn’t reached the default value during pick and place, the machine will
throw it and re-pick a component.
9 Skip:Once select this item,will skip all placement for this feeder.

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 Nozzle Information

Function:Function:Select corresponding nozzles according to actual demand. It will automatically

assign to each feeder in order to meet the requirements of single head or multi heads working.

Align:The nozzle will align to the component’s upside on corresponding feeders when click this
item

Height Test:After clicking this item,the nozzle will go down and check whether the pick height is
ok. Support do adjustment of pick height on feeder information item if needed.

Pick test:After clicking this item,the corresponding nozzle will pick one component and check
whether pick position is ok. Support do adjustment of pick position on feeder information item if
needed.

After finish setting of all above feeders information,then click “assign feeder and nozzle to Chip
list”,then chip list will automatic to be changed correspondingly.

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4.2. File Mounting

1.Method to mount one file:

First select one file, click”mount”, then you will enter into one mounting page, above picture is an
example of one file in mounting.
(1) On the top-left corner shows mounting process, chip list---by the variation of blue line, you
can track process of mounting constantly.
(2) On the bottom-left corner shows some feedback during mounting process.
(3) One the top-right corner shows the status of picking and picking alignment
(4) On the bottom-right corner shows some control information
Air pressure of 4 nozzles
Placement speed, can be changed by manual during mounting
Non-stop mount,this is used in one-stop smt production line, add conveyors in front and
behind,
Auto-eject PCB once finished, when select this option, after finished mounting task, PCB
will eject its working area automatically
Another control information,Continuous/Step/Pause/Eject PCB front-side manually/Stop
Continuous, The machine will obey its order and work constantly
Step, The machine will work one single step
Pause, The machine will stop its work instantly
Eject PCB front-side manually, In order to catch the PCB, after PCB assembly, click this
option, PCB will eject from its feeding position. Kindly notice: After pause the machine then you
can carry out this order.
Stop, before click this option, you need to click “pause” first

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4.3. Manual Test

Function: Used for testing the basic functions, connection between software and hardware is the
mainly function, details about testing as below:

4.3.1.Placement head

Choose nozzle 1, nozzle 2, nozzle 3, nozzle 4 to test separately

Blow, after click this option, air will blow-off from selected nozzle
Suck, after click this option, suction action will appear from selected nozzle
Turn left& Turn right, selected nozzles will turn
Down, after click this option, selected nozzle will descend slowly
Down Looking Camera light, after click this option, Led light besides the camera will turn on
Down Looking Camera Photograph, after click this option will take a picture
Air pressure 1, 2, 3, 4,Based on the testing of nozzles, you can see pressure value of each

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 nozzle.
Head move, after click this option, you will enter into”head move”page, click to move
(Overall Workbench) you can test to move in a wide range.

4.3.2.Rail control

Function, test rail PCB feeding,forward PCB feeding, backward PCB feeding and feeding speed

4.3.3.Hose control

Function, test each function key

Start button status, on the left side of machine, it has one start button, press this button the
status will change
Vibration feeder, after select this option, vibration tray will vibrate
Up looking camera light, after click the light will turn on

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 Up Looking Camera Photograph, after click this option will take a picture
Send PCB feeding command, after click this option, PCB will feed forward
Buzzer，after click this option some sound will appear
X Y step out recover&X Y Initialize, after click this, machine will recover to its original
position and coordinates in system will initialize.

4.3.4.Feeder test

Function, test each feeder’s matching and feed box & peel box’s function. First, select” Feed-box
and peel-box linkage”, then test function of feed box and peel box.
(1) click any feeder randomly, feed box and peel box will appear corresponding actions

4.4. Factory settings

Function, this part arm at machine’ global parameter settings, any modified parameter will
influence all mounting files, when modify this part please consider seriously. Especially the last
page system settings, we suggest after using a period of time or under the guidance of our
engineers then change its parameter.(Notice, before our machines leave factory, all parameter
already be set and no need to change). This user manual just introduce all setting functions briefly,
more details about parameter modification please refer to comments from our engineers.

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As pic show, function description of button on right side
Save configuration: click it for saving after modify the parameters
Modify password: click it, put into the password, then finish change the fourth page which is
also the System interface.

Set up feeder ID: click and show as pic above. This is for modifying of feed-box ID.
Feed-box is different from peel-box, feed-box ID is saved in feed-box itself . E.g.: Feeder of
feed-box 1, it will be identified feed-box 1 no matter which port matched. So we will mark it.
New feed-box default ID are all No.50, it need you to change them here by yourselves.

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 Version upgrade: After receiving our new version file, you can upload it with clicking
“version upgrade” to finish.
ENGLISH：Change to the English version.

4.4.1.Feeder configuration

As figure show: parameters setting for all feeders.

First list on left side is feeder No.
X,Y parameters is setting the feeder’s pick position.
Click button of “click of align” in the list of “position”, then go into interface as below,

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Save after setting well the pick position of the feeder. Same way as in the file.

“Feed-box” setting
It is used to set the feed-box ID. E.g., if you insert the feed-box 2 in the port 1, then it need to set
the feed-box ID to be 2

“Peel Box”setting

“Peel box” is different from “Feed box”,the ID for peel box is corresponding to the port.For
example,no matter which “Peel box” you connect,the ID always be No.1.

Above setting can help set the serial number of the stack in power supply port on the machine,
See below fig.

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For example,the default port ID for Stack 33 is 33,if the port 33 is broken and want to change to
port 34,can set in this item
“Feed test”
Once clicked this item,then the machine will start Feed test,feed one component and help check
whether the feed is normal

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4.4.2. Feed setting

Function:Used to setting values for all stacks

Feed rate:The distance between two components,default value 4mm,for 0402,should set 2mm.
Strength Setting：Motor torque of feed for the stack(Normally no need to change).
Test:The machine will do feed test separate after clicking this item,peel box won’t work during
above test
Alignment:Click peel box,the motor idling several rings to do the initial position of the calibration.

Used if there are problems during peel operation,then can click this item to repair. Normally no

need to click.

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4.4.3.Peel Configuration

Function:Peel configuration as above figure show,used to set the values for all peel boxes
Feed rate:Similar meaning in Feed box part,mean length of rotation each time
Strength:Torque setting of Peel motor(Plastic tape will be difficult strip away in the case of being
affected with damp, can adjust bigger values of motor torque here)
Test:The machine will do peel test separate after clicking this item,feed box won’t work during
above test

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4.4.4. System setting

Function: it is mainly for correction the position of suction nozzle.(Notice: In case change by
mistake,we ‘ve locked it by password. It can be changed by clicking the button of Password
change and then insert password. Strongly recommend operating it under our engineer’s
guidance).
(1) Default parameters 1 setting:
Default speed: placement head movement speed under overall situation, priority is not as fast
as speed set in stacks.
Vibration feeder frequency: setting the frequency of vibration feeder. Discharge state will be
more stable if frequency high.
Vibration feeder strength: it depends on the component, if component too small and strength
set high it will shake out the component easily, of course if strength small, the discharging
speed will be slower.
(2) Nozzle Jointly Alignment setting:
Click test button and go into interface below:

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 Click the central point among four nozzles under the shot can set the central point.
Another way is press CTRL button then click the mouse to make each nozzle to identify their
own central point in the four quadrants.
(Notice: Please click the LENS ROTATION before setting the suction nozzle, then PnP machine
will collect nozzle’s 360 degree rotation photos to synthesize. After that, press CTRL button to set
each nozzle’s identification of central point.
Save it after finishing the setting.

(3) Correct nozzle 1~nozzle 4 separately.

Click test and go into interface below:

Operation steps: 1.click the button of LENS ROTATION to let machine take photos of nozzle’s
360 degree rotation . 2.click the central point of nozzle 3. Click the save button.
Relative position of nozzle 1 and camera: it is for the synchronism of nozzle and camera,
setting it when placement position do not matched with the camera position.
Click setting then go into interface below:

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 Move the nozzle to any place of PCB board, put one piece of carbon paper, then click
REMAINS(MARK), placement head will rotate and leave a dot, after that click the button of
Focus that dot and save,it will be done (show as photo above ).
Trash box position: setting the position of dropping component, it depends.

4.5. First trial and testing

（1）First dry run

Usually we would suggest you to have a dry run (no components are loaded) before
production test. After it goes smoothly, you can start to produce few boards.

（2）Production test
1 Make a programming file
2 Test the file to pick and place components.
（3）Inspection
1 Inspection Items
Check if the specification,direction,polarity of components are aligned with what they should be.
— Whether the components are damaged or the pins are distorted.
— Whether the component is off beyond allowance.
2 Inspection Methods
The inspection methods vary from the equipment that you have.
Except visual inspection, all of amplifier, microscope, online or offline AOI equipment can be
applied if the pitch of IC is quite small to check.
3 Inspection Standard
Please follow SOP to do inspection or any other general standards (IPC Standard and SJ /
T10670-1995 SMT General Technical Requirements)
Adjust the programming file according to the placement effect after the first production test
If there is any issue of specification, direction and polarity, please follow process file to amend.
If the components are off, please adjust the file by following two methods
a. If the placement effects of all components are off in the same direction, it would be the
fiducial issues. Please resolve this issue by adjusting the coordinate of fiducials according to
its value of deviation.
b. If there are several components off beyond allowance, you’d better adjust their coordinates
on working file with down-looking camera.
If there are couple of issues occur during test, some other points need to be considered.
a. Frequent pickup failure. Some suggestions are listed below,
— The pick height is inappropriate, please revise the value after an inspection or a pick-test;
— The pick offset needs an adjustment, it should be aligned with the center of component reel
slot rather than that of component.
— Due to peel strength or installation issue of wasted film, the film on tape won’t be peeled

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 completely
— The nozzle was blocked
— The nozzle is damaged or has a crack
— The size issue of nozzle would cause air leakage or insufficient suction.
— The air hose is blocked or has a leakage problem, and even the pump has an issue.
b. Frequently throwing components. Some suggestions are listed below,
— Up-looking camera can’t take a clear picture of component due to brightness issue for
example.
— The size or shape isn’t aligned with that in “Footprint library”
— The size of nozzle is inappropriate or insufficient suction.
— The nozzle is damaged or blocked, and even has a crack

4.6. Continuous SMT production

Follow the SOP to start production

Notes
1.Do not touch the surface to board to avoid damaging the printed solder paste.
2.When the error message occurs, please checkout and solve it a.s.a.p.
3.Once reloading the component during production, pay attention to the model,specification,
polarity and direction of components.

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 5. Structure and maintenance instruction

5.1. Structure chart

⑴ ⑻
⑺
⑵ ⑼
⑹
⑶ ⑽
⑸
⑷
⑾

1-1 Side view 1-2 Front view

⑴ Peel-box ⑵ Tape&Reel holder ⑶ fixed support
⑷ Power switch ⑸ Emergency stop ⑹ Feed-box
⑺ Cover ⑻ Placement head ⑼ Vibration feeder
⑽ Pause button ⑾ Conveyor port

⑻ ⑿ Up-looking camera
⒀ Auto-rails
⒀ ⑿
⒁ PCB support board
⑹
⒂ Nozzles
⒁ ⑼

1-3 Inner image

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5.1.1.Peel-box

Fix the peel-box

Installation of peel-box

36
5.1.2.Tape&Reel holder

5.1.3.Fixation support

37
5.1.4.Feed-box

5.1.5.Vibration feeder

38
5.1.6.Auto-rails

Adjustment of auto-rails
A

Fig.2 Fig.3

Fig.1

See（Fig.1）：Loosen screws on A and B，then the left rail can be moved arbitrarily.

See（Fig.2）：Put PCB on the groove of rails and tighten and screws A and B once confirmed
the width.

See（Fig.3）:Once finished width adjustment, put the board into rails. Check the effect picture
as below

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5.1.7.Nozzle

The size of nozzle

Please choose nozzles according to the shape and size of components.

Table 1-1 Nozzle

Model XN03 XN07 XN14 XN22 XN40 XN75

Illustration

Inner
0.3mm 0.7mm 1.4mm 2.2mm 4mm 7.5mm
diameter

Reference of nozzle selection

In order to assure placement accuracy, please select nozzles according to the

shape and size of components.

Table 1-2 Size comparison of nozzles

Size Minimum Recommendation
diameter
XN03 0.2mm 0201,0402
XN07 0.5mm 0402,0603,0805,diode
XN14 1.2mm 1206,1210,1812,2010,SOT23,5050
XN22 2.0mm SOP series ICs,SOT89,SOT223,SOT252
XN40 4.0mm ICs from 5 to 12mm
XN75 7.5mm ICs bigger than 12mm

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 size size

0201 0.6*0.3 0402 1.0*0.5

0603 1.6*0.8 0805 2.0*1.2

1206 3.2*1.6 1210 3.2*2.5

1812 4.5*3.2 2010 5.0*2.5

SMA 4.0*2.5 SMB 4.0*3.3

SMC 6.6*5.6 SOT23 3*1.4

SOT89 4.5*2.5 SOT223 6.4*3.7

TO252 6.5*6.3

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5.2. Maintenance

5.2.1.Take effective measures to reduce/ avoid malfunction

1. reinforce daily maintenance

P&P machine is that high-accuracy device which requires a clean working environment with
constant temperature and humidity, so it’s necessary to have a routine maintenance.
2. Requirements for operator
(1)Operator should get a basic operator training,which should cover fully all the skills and
knowledge needed to safely operate the type of pick and place machine.
(2)Operating strictly against equipment’s instruction. DON’T use machine with problems. Stop
the machine once malfunction appears and contact with the after-sales service staff, restart to work
after problem solved.
(3)Operator should be concentrated.
Observation-- to see whether there is abnormal situation, such as peel-box doesn’t work, plastic
tape is broken etc.
Listening-- whether have strange sound, such as noise from placement head, sound of loss
component, strange noise of conveyor etc.
Handwork--solve some small problems in time, such as install feeder, correction placement
position etc. If the main machine body or circuit problem, please consult after-sales staff.
3.Formulate measures to reduce/ avoid big problem.
The most easily appeared problem during work are placement wrong components and placement
misaligned. Supply below measures for ref.
(1)It need to check whether the components’ package is matched with related feeder.If not, please
correct them.
(2)As to tape reel feeder, when ran out of one reel, operator must check whether newly changed
tape reel is correct or not.
(3) After import the SMD file or edit chip list manually, please recheck each component’s No.,
nozzle rotation angle and placement position to make sure correct.
(4) Operator must check the first finished PCB of each file. If any problem, please find solutions
such as revise program to solve it.
(5)To check the placement position misaligned or not, component loss problem in regular work.
Find reason in time and solve it.
(6)In sum,P&P machine’s running speed and placement accuracy still has limit. People’s work is
important to run machine on its proper role. So it’s necessary to comply with effective measures to
keep machine normal work, its placement quality and efficiency.

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5.2.2.Maintenance of device

Check below points daily

(1)Please check below before turn on the machine

①Temperature and humidity:temperature range 20℃～26℃, humidity range 45～70％.
②Working environment:please keep air fresh to avoid corrosive air in.
③Make sure there’s no obstacle on dual rails or the whole working area.
④Make sure camera lens is clean, no dirty things.
⑤Make sure no obstacles around the head nozzles.
⑥Please check whether nozzle is dirty or out of shape and adopt relevant cleaning measure or
change new nozzle.
⑦Please check whether feeders are well installed, and keep feeders clean.
⑧Please check whether the air hose is well connected with machine.
(2)Please check listed below after turn on the machine.
Error tips will show on the monitor if the machine work abnormality.
①Check the monitor screen whether display normally after system starting working.
Check emergency switch whether could work normal.
②Check the placement head whether could return to the original place.
③Whether have abnormal noise when placement head move.
④Check negative pressure whether in normal range or not.
⑤By the way checking PCB’s transmission on dual rails to know whether sensor is still work fine.

Check below points monthly

(1)X,Y axis--please make sure no abnormal noise when placement head move.
(2)X,Y motor--please make sure motors working well, no abnormal heating appearance.
(3)Nozzle--please check nozzle whether up down flexibly, not bent, check the suck surface
whether level.
(4)Air hose--check the air hose and connector, make sure hose is fine without broken, abrasion or
air-leak etc.
(7)Negative pressure--check all nozzles’ negative pressure.If abnormal,please clean nozzles.
(8)Positive pressure--check whether they’re normal.
(10)Optical axis--please check whether it is covered dusk. Please keep it clean and lubricated.
(11)Operation button--check each button to make sure they are well-worked
(12)Connector--check if well-connected of the air connector and air hose.

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5.2.3.Placement failure analysis and troubleshooting

Placement failure analysis

Whether Pick and Place machine can run normally or not, which will directly impact on
production quality and volume. To make the machine run properly, we must fully understand the
structure and characteristics of the machine, master every kinds of failure
patterns of manifestation,reason and troubleshooting methods. Finding problems and reasons in
time and timely troubleshooting can help ensure efficiency of the machine during working.

（1）Common failures
boot failure
head doesn’t move
fail to feed forward a board
Pick failure
Place failure
（2） Main reasons of failure
transmission systems-driven PCB and head movement transmission system and the
corresponding sensors.
Air Route-Air pipe,nozzle
Nozzle size not suit to the component
No info in Footprint library
Irregular component
Incorrect values setting of component’s height or pick height
（3）placement troubleshooting
failure patterns of manifestation,Reasons,troubleshooting methods
head doesn’t move
Solutions:
1. Sensor is poor connected or short-circuited. Please wipe off the dust or lubrication on
sensor or even exchange a sensor
2. Longitudinal sensor or sensor poor connect or short circuit, check and repair the transmitter
or add too much lubricating oil on sensor-clean the sensor
Rails fail to advance the board feed forward after uploading the PCB
Solutions:
3. The rails belt get loose or broken, need to be adjusted or exchanged.
4. The rails drive motor doesn’t work.
Nozzle can’t pick up component
Pick up position offset
Components fall down during moving
Solutions:
1. Nozzle had been wearing or become aging,the crack causes leakage,replace with a new
nozzle
2. The nozzle’s bottom surface is uneven or get suck by solder paste or other dirt.Please wipe it

44
 off and use cleaning needle to clean the nozzle
3. Current nozzle size is not suit to component , change another one
4. Surface uneven on the component, replace with a qualified one
5. Component is sticking to the bottom tape;
6. Burrs on tape hole stuck component;
7. Component’s pin get stuck in the corner of the den;
8. Gap between components and tape package hole is not big enough , uncover the plastic tape
and upside down to check if the components can fall down or not.
9. Plastic adhesive tape is too sticky or flimsy and then can not be unfolded. Or plastic adhesive
tape has been tore down from edge side.
10. Pick up position offset. Actual Feed box is offset from Feeding center,check X, Y, Z data and
do reprogram.

Placement offset
Solutions:
1. Programming issue(some components’ positions are inaccurate),amend the coordinates;
2. If all components are offset, please modify fiducials.
3. The components’ thickness setting errors,modify components information on Footprint
Library
4. Pick height is too high that causes components being dropped. Please reset the Pick Height
value
5. Pick height is too low that causes slide problem during placement
6. High speed issue. Lower the speed to achieve a more accurate rotation and placement effect.

5.2.4.Related issues during Solder paste printing process

1. Stencil Printing Technology

Screen printing technology refer to using ready-made stencil, directly contact to the printer in a
certain way, make the solder paste evenly flow on the stencil and then leak into the mesh through
the holes. When getting the stencil away, solder paste had been covered to the printed circuit board
solder graphics
corresponding, thus complete the solder paste printing on the PCB.

2.Inspecting of solder paste printing

Printing process is one of the key working procedure to ensure the quality of surface mounting.
According to the statistics,under the premise of guaranteed quality about components and
PCB,correctly PCB design, 70% of the surface quality problem caused during printing process. In
order to ensure the quality of SMT assembly, it is necessary to strictly control the quality of the
solder paste printing.
The amount of solder paste printing requirements are as follows:

45
1.The using amount of solder paste should be uniform, good consistency. Solder paste graphics
should be clear, try to avoid adhesion between adjacent graphics. Solder paste graphics and solder
graphics should be consistent.
2.In general,keep unit area amount of solder paste about 0.8 mg/mm². For fine pitch components,
should be 0.5 mg/mm² (using stencil thickness and hole size to control in the actual operation).
3.Printed on the substrate of solder paste compared with required value, a certain deviation is
permissible, the covering area of the solder paste on each solder pad should be more than 75%.
4.Should be no seriously collapsing problem and edges neatly after solder paste had been printed,
the dislocation shouldn’t be larger than 0.2 mm, for solder pad of fine pitch
components,dislocation shouldn’t be larger than 0.1MM,pollution by solder paste is not permitted
to the PCB.

3.The defects of solder paste printing, reasons and solutions

Excellent printing graphics should be uniform in both vertical and horizontal direction,full,clean
all round, solder paste fill solder pad. Using above such printing graphics device, after reflow
soldering,will get good welding effect then.
Solder Paste graphics dislocation
Reasons: Holes on the stencil not good match with solder pad; No enough precision of the Printing
machine
Issues: easily cause bridge connection
Solutions:Adjust the stencil position; Adjust the printing machine.
Solder paste graphics have icicles and dents
Reasons:Scraper’s pressure is too large; Rubber scraper’s hardness is not enough; Holes are too
big in the stencil
Issues: Solder paste’s required volume is not enough, easy to appear faulty soldering;solder joint
strength is not enough.
Solutions:Adjust the printing pressure; Use metal scraper; Improved holes designing in the stencil.
Too much solder paste
Reasons:Holes are too big in the stencil; The gap is too big between stencil and PCB.
Issues: easily cause bridge connection
Solutions:Check the holes size in stencil; Adjust the parameters of printing, especially the gap
between PCB and stencil
Graphic uneven(have breakpoints)
Reasons:Holes’ wall are not smoothness enough; not wipe residual solder paste in using for many
times; Solder paste’s thixotropy is bad.
Issues: Easy cause no enough solder paste, lead to the problem such as faulty soldering.
Solutions:Wipe the stencil
Contamination of the graphics
Reasons:Not wipe residual solder paste in stencil after using for many times;Poor quality of solder
paste; Shake problem when getting the stencil way
Issues: easily cause bridge connection
Solutions:Wipe and clean stencil; replace solder paste;adjust the machine.

46