Welding

Level-IV
Based on October, 2023, Curriculum Version 2

Module Title: High Reliability Soldering and De-Soldering

Module Code: IND WLD4 M05 1023
Nominal Duration: 80 Hours

Prepared by: Ministry of Labor and Skills

October, 2023
Addis Ababa, Ethiopia

i
 Acknowledgment
The Ministry of Labor and skills wishes to thank and appreciation to MoLS leaders and experts,
Regional Labor and skill/training Bureaus leader, experts, TVT College Deans, Instructors and
industry experts who contribute their time and professional experience to the development of this
Training Module.

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page ii of 70
Author/Copyright De-Soldering October 2023
 Table of Contents
Acknowledgment ............................................................................................................................ ii
Table of Contents ........................................................................................................................... iii
Acronym ......................................................................................................................................... 1
Introduction to Module ................................................................................................................... 2
Unit one: Work requirements......................................................................................................... 3
1.2. Soldering tools and equipment ......................................................................................... 7
1.3. Resource Allocations...................................................................................................... 11
1.4. Production Scheduling ................................................................................................... 13
Self-check 1.1 ............................................................................................................................... 16
Unit two: Prepare soldering ........................................................................................................ 17
2.1. Shape Material/Device in to standard sizes.................................................................... 18
2.2. Set-up and mounting techniques .................................................................................... 21
2.3. Methods of joint preparation .......................................................................................... 29
Self-check 2.1 ............................................................................................................................... 32
Unit three: Weld Solder components ......................................................................................... 34
3.1. Apply Soldering with use of Flux .................................................................................. 35
3.2. Protect materials/ devices from heat damage ................................................................. 37
3.3. Assembly Printed Circuit Boards and Components ....................................................... 43
3.4. Electrostatic Discharge and Mechanical Damage .......................................................... 50
Self-check 3.1 ............................................................................................................................... 53
Operation Sheet 3.1 ....................................................................................................................... 54
Unit four: soldering process to the standard ................................................................................ 58
4.1. Visual inspection. ........................................................................................................... 59
4.2. Test Joints....................................................................................................................... 59
4.3. Rework in the production process .................................................................................. 62
4.4. Staff and Contractors Training ....................................................................................... 66
Self-check 4. ................................................................................................................................. 68
Reference ...................................................................................................................................... 69
Developer‟s Profile ....................................................................................................................... 70

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page iii of 70
Author/Copyright De-Soldering October 2023
Acronym
PCB ...............................................................Printed Circuit Board
THT ................................................................ Through Whole Technology
SMD ..............................................................Surface Mount Device.
MSLs ..............................................................Moisture Sensitivity Levels
IPA ................................................................. Isopropyl Alcohol
DIP ................................................................Dual In-Line Package
SOP ................................................................ Small Outline Package
TSOP .............................................................Thin Small Outline Package
QFP ................................................................Quad Flat Package
QFP-EP .........................................................Quad Flat Package-Extended
QFN ...............................................................Quad Flat No-leads
CSP ...............................................................Chip Scale Package
DFN ...............................................................Dual Flat No-leads
PLCC .............................................................Plastic Leaded Chip Carrier
QFN-ML ........................................................ Quad Flat Package No-lead
UQFN ............................................................Ultra-Thin Quad Flat No-lead
ANSI .............................................................American National Standards Institute

1
 Introduction to Module
In Manufacturing Technology, we use different automation and digital machine technology. So
we need both electrical and mechanical connection between package elements that retains
integrity through subsequent manufacturing processes and service conditions. These
interconnections of machines may causes strains and thermal expansion mismatches under
service conditions over the lifetime of the assembly. Reliability joint that interconnect to retain
functionality under use environments. As the number of joints increase, and their size decreases,
the reliability of joints becomes an issue because they are more difficult to manufacture and
functionality requirements become stricter. After assembly, joints must retain integrity when
exposed to a variety of application conditions that include mechanical and environmental stress,
either individually or in combination.
This module is designed to meet those requirements under the Welding Technology occupational
standard, particularly for the unit of competency: high reliable soldering and de-soldering.
This module covers the units:
 Work requirements
 Soldering materials
 Solder components
 Soldering process to stander
Learning Objective of the Module
 determine job requirements
 prepare Soldering materials
 Weld Solder components
 Quality standard on soldering process to stander

Module Instruction
For effective use this modules trainees are expected to follow the following module instruction:
1. Read the information written in each unit
2. Accomplish the Self-checks at the end of each unit
3. Perform Operation Sheets which were provided at the end of units
4. Do the “LAP test” giver at the end of unit and
5. Read the identified reference book for Examples and exercise

2
 Unit one: Work requirements
This unit is developed to provide you the necessary information regarding the following content
coverage and topics:
 Data Sheets and Technical Drawings
 Soldering preparation
 Resource allocation
 Production component
This unit will also assist you to attain the learning outcomes stated in the cover page. Specifically,
upon completion of this learning guide, you will be able to:
 Identify Work requirement
 Select proper equipment and materials for solder and de-solder
 Identify Tools and equipment‟s
 Allocate resource
 scheduled Production component

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 3 of 70
Author/Copyright De-Soldering October 2023
 1.1.Data Sheets and Technical Drawings
Product Description
Solder-Wick Lead-Free is the state of the art in desoldering technology. It is specially designed
for removal of today‟s high temperature lead-free solders. The single layer weave used for
Solder-Wick Lead-free braid is lighter in mass than any other desoldering braid available and
allows for lead-free solder removal at lower temperatures. Solder-Wick Lead-Free responds
faster than any other conventional desoldering braid. This unique design minimizes overheating
and requires less “contact” time thus preventing heat damage to the PCB and sensitive
components. For Lead-Free rework, Solder-Wick has the answer.
 Fastest wicking and heat transfer
 High capacity for solder uptake
 Halide free, no corrosive residues
 Minimizes risk of heat damage to pads, components and PBCs
 Can be used with Tin/Lead solders
 RoHS compliant
Typical Applications
Solder-Wick Lead-Free desoldering braid safely removes solder from:
 Thru-hole Components
 SMT Pads and BGA Pads
 Micro Circuits
 Terminals, Lugs and Posts
 Identification Script

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 4 of 70
Author/Copyright De-Soldering October 2023
 Typical Product Data and Physical Properties

Fig.1.1. Typical Product Data and Physical Properties

Static Dissipative Packaging
Solder-Wick Lead-Free is packaged on Static Dissipative bobbins to minimize the risk of
damage associated with static electricity. The static dissipative bobbins qualify as electrostatic
discharge protective per MIL-STD-1686C and MIL-HDBK263B and meet the static delay rate
provision of MIL-B-81705C.
 Usage Instructions / Technical Drawings
For industrial use only, read MSDS carefully prior to use.
I. Choose a Solder-Wick Lead-Free braid width equal to or slightly larger than the pad or
connection.
II. Choose a solder iron tip equal to or slightly larger than the pad or connection.
III. Set temperature of iron between 650° and 750°F
IV. Place wick on solder joint or pad and place tip of hot iron on top of wick
V. As solder becomes molten, the color of the wick will change from copper to silver.
VI. Remove wick and iron simultaneously once color change has stopped.
VII. The component lead / pad is now clean and free from solder.

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 5 of 70
Author/Copyright De-Soldering October 2023
 VIII. Clip and discard the used portion of the wick.
IX. If needed, clean PCB with Circuit Works Lead-free Flux Remover Pen CW9400 and
remove soils with a Control Wipes absorbent wipe.
SODER-WICK IS DESIGNED TO MEET OR EXCEED THE FOLLOWING:
 MIL-F-14256F, Type R
 NASA-STD-8739.3
 DOD-STD-883E, Method 2022
 ANSI/IPC J STD-004, Type ROL0
BELLCORE TR-NWT-000078 ANSI/IPC J SF-818 SODER-WICK® SD BOBBINS ARE
DESIGNED TO MEET OR EXCEED:
 MIL-STD-2000A
 MIL-B-81705C
 MIL-STD-1686C
 MIL-HDBK-263B
Technical & Application Assistance
Chemtronics provides a technical hotline to answer your technical and application related
questions. The toll free number is: 1-800-TECH-401.
AVAILABILITY 40 Series Lead-Free No Clean Flux 25 bobbins / bag

NOTE: This information is believed to be accurate. It is intended for professional end users
having the skills to evaluate and use the data properly. ITW CHEMTRONICS® does not

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 6 of 70
Author/Copyright De-Soldering October 2023
 guarantee the accuracy of the data and assumes no liability in connection with damages incurred
while using it.
1.2.Soldering tools and equipment

Fig.1.2. Soldering tools

I. Vise
II. Safety glasses
III. Solder sucker
IV. Solder tool
V. Diagonal cutters
VI. Needle nose pliers
VII. Solder
VIII. Solder wick
IX. Damp sponge 10)Soldering iron

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 7 of 70
Author/Copyright De-Soldering October 2023
 Soldering Iron

Fig.1.3. Soldering Iron

Solder

 Solder is an alloy of tin and lead.

 The solder used for electronics is frequently called 60/40 solder because it is made of
63% tin and 37% lead.
 60/40 solder melts at 361 F.
 Lead-free solder: As of July 1st, 2006, European laws mandated that new electronics be
entirely lead-free. As of yet, no such laws exist in the United States.
Soldering Iron Care & Maintenance

 A soldering iron must be coated with a thin coat of solder. This will allow for the transfer
of heat to the work piece.
 This procedure is called tinning.
 The tip must be kept coated with a shiny layer of solder by occasional wiping and
applying solder directly to the tip.

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 8 of 70
Author/Copyright De-Soldering October 2023
 Fig.1.4. coat and un thin of solder

Tinning Process

Fig.1.5. Apply Solder to Soldering Iron Tip fig.1.6. Roll Tip on Damp Sponge

Fig.1.7. Properly Tinned Soldering Iron Tip

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 9 of 70
Author/Copyright De-Soldering October 2023
 Desoldering
Solder Sucker
Apply heat to the connection to be de-soldered. When the solder melts, trigger the solder sucker.

Fig.1.8. Solder Sucker

Repeat de-soldering as needed until all solder is removed. Remove soldering iron & solder
sucker from area.

Fig. 1.9. Repeat de-soldering

Remove component lead.

Fig.1.10. Remove component lead

Solder Wick
Solder wick is finely braided copper that is used to wick away excess solder from a de-soldered
connection.

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 10 of 70
Author/Copyright De-Soldering October 2023
 Fig.1.11. Solder Wick
Apply the solder wick and soldering iron to the de-soldered connection. The solder wick will
draw the excess solder off of the PCB pad.

Fig. 1.12. Excess solder off of the PCB pad

De-soldered PCB pad

Fig.1.13. De-soldered PCB pad

1.3. Resource Allocations

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 11 of 70
Author/Copyright De-Soldering October 2023
 Table1.1. the requirements list for desoldering and soldering (reflow) system

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 12 of 70
Author/Copyright De-Soldering October 2023
 In this work, we propose a nozzle selection heuristic to
optimise the HP-110. Based on the information supplied by
DIMA, nozzle (tool) changes are very time consuming.
Hence, our approach aims to minimise the nozzle changes in
order to minimise the total assembly cycle time (CT). The CT
is the total time taken by the machine to assemble all the
components on a printed circuit board (PCB). Minimising the
CT will directly increase the machine‟s throughput. The CT
can be used to evaluate the quality of a schedule. The
following notations are used to describe the scheduling model
(most of them adopted from [6]):
1.4. Production Scheduling
In this work, we propose a nozzle selection heuristic to optimize the HP-110. Based on the
information supplied by DIMA, nozzle (tool) changes are very time consuming. Hence, our
approach aims to minimize the nozzle changes in order to minimize the total assembly cycle time
(CT). The CT is the total time taken by the machine to assemble all the components on a printed
circuit board (PCB). Minimizing the CT will directly increase the machine‟s throughput. The CT
can be used to evaluate the quality of a schedule. The following notations are used to describe
the scheduling model (most of them adopted from.
 CT:- the assembly cycle time to assemble all components;
 B :- the total number of sub tours;
 Λ:- the time for picking up a component;
 θ:- the time for placing a component;
 j:- the jth sub tour number where j є {1,2,…,B};
 I(j):- the time taken for the robot arm to travel from feeder to PCB point and place the
component(s) in the jth sub tour;
 P(j):- the time taken for the robot arm to travel from PCB point to feeder and pick the
component(s) in the jth sub tour;
 Φ0(j):- the time taken for the robot arm to move from PCB point to pick up the first
component in the jth sub tour from a feeder;

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 13 of 70
Author/Copyright De-Soldering October 2023
  Φ1(j):- the time taken for the robot arm to move from current feeder to the next feeder in
the jth sub tour;
 b0(j):- the time taken for the robot arm to travel from the camera (or pickup point for the
mechanical alignment case) to the first PCB point in the jth sub tour;
 b1(j) : the time taken for the robot arm to travel from the first PCB point to the second
PCB point in the jth sub tour;
 C0(j) : the time taken for the robot arm to travel from feeder to position the first pipette
above the camera in the jth sub tour;
 C1(j) : the time taken for the robot arm to position the next pipette above the camera in
the jth sub tour;
 ρ(j):- a decision variable to indicate either there is a second component for pickup and
placement (ρ(j)=1), or 0 otherwise;
 τ(j):- a decision variable for having one camera vision and one mechanical alignment
component in a sub tour where τ(j)=0 if true, or 1 otherwise;
 η(j):- the number of tool change required to pick up the component(s) in the jth sub tour
where η(j) є {0,1,2};
 γ(j):- a decision variable of simultaneous vision in the jth sub tour where γ(j)=0 if exist
simultaneous vision, or 1 otherwise;
 ω(j) :a decision variable of simultaneous pickup in the jth sub tour where ω(j)=0 if exist
simultaneous pickup, or 1 otherwise;
 σ(j) :a decision variable of having two mechanical alignment components in the jth sub
tour where σ(j)=0 if having two mechanical alignment components, or 1 otherwise; u
:the time for the robot arm to move up/down;
 Ω :the tool changing time;
 α :the image acquisition and recognition time;
 ψ :a decision variable either both components are picked up from the same component
feeder in a sub tour (ψ=1), or ψ=0 otherwise;
 ζ: the component feeder transportation time.

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 14 of 70
Author/Copyright De-Soldering October 2023
 The objective function is to:

Where
P (j) = (Φ0 (j) + λ+ (2*u)) + (ρ (j)*ω (j)*(max (Φ1 (j), ψ* ζ) + λ+ (2*u))) + (η (j)* Ω)
I(j) = ((2*u)+ b0(j)+ θ+ σ(j)* (C0(j)+α)) + ( ρ(j)* (γ (j)* σ(j)* τ(j)* ( C1(j)+α) + b1(j)+ θ+
(2*u)) )

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 15 of 70
Author/Copyright De-Soldering October 2023
 Self-check 1.1
Part I: say true or false
1. Soldering is defined the joining of metals by fusions of allows w/c have relatively low
melting points.
2. While soldering at least 2cm distance the eyes and the body and the solder iron movement
should be easy.
3. Never leave the soldering iron un attended while it is powered on
4. Do not solder live circuit.

Part-II: Choose the correct answer from the given alternatives

1. Solder is an allowance of ______and _____?
A. Zn and lead C. Zn and Mg
B. Cu and tin D. Tin and lead
2. Which one of the ff. is a soldering tool?
A. Solder sock C. Safety glass
B. Solder Wick D. all
3. Solder used for electronics is frequently called 60/40 solder b/c it is made of ___% and
____of lead respectively.
A. 50 and 40 C. 65 and 35
B. 65 and 37 D. 50 and 35

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 16 of 70
Author/Copyright De-Soldering October 2023
 Unit two: Soldering preparation
This unit is developed to provide you the necessary information regarding the following content
coverage and topics:
 Material/Device
 Set-Up /Mounting Techniques
 Joint Preparation
This unit will also assist you to attain the learning outcomes stated in the cover page. Specifically,
upon completion of this learning guide, you will be able to:
 Operate Cutting, shaping and drilling material/device
 Preform Cleaning materials/devices
 Use correct set-up and mounting techniques
 Identify Methods of joint preparation
 Follow Soldering joint test and inspection procedures

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 17 of 70
Author/Copyright De-Soldering October 2023
 2.1. Material/Device
Most soldering jobs can be done with flux cored solder (solder wire with the flux in a core) when
the surfaces to be joined are already clean or can be cleaned of rust, dirt and grease. Flux can
also be applied by other means. Flux only cleans oxides off the surfaces to be soldered. It does
not remove dirt, soot, oils, silicone, etc.
Base Material
The base material in a solder connection consists of the component lead and the plated circuit
traces on the printed circuit board. The mass, composition, and cleanliness of the base material
all determine the ability of the solder to flow and adhere properly (wet) and provide a reliable
connection. If the base material has surface contamination, this action prevents the solder from
wetting along the surface of the lead or board material. Component leads are usually protected by
a surface finish. The surface finishes can vary from plated tin to a solder - dipped coating.
Plating does not provide the same protection that solder coating does because of the porosity of
the plated finish.
The Correct Way to Solder

Fig.2.1. Way to Solder

Soldering Materials
 Solder:
 Used to form electrical connections.
 Available in various widths, materials (lead, lead-free, etc.), and core materials (rosin
core, solid core, etc.)
 Flux:

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 18 of 70
Author/Copyright De-Soldering October 2023
  Used to break surface tension and help solder flow
 Available in various types (rosin based, water-based, no clean)
 Many varieties are conductive or corrosive
 Distilled Water:
 Used for dampening solder sponge and removing water-soluble flux

Fig. 2.2. Distilled Water

Material Removal
 Desoldering Braid:
 Braided material (usually copper) that flux adheres to when heat is applied
 Used to remove excess solder from circuits, clear solder bridges, and correct mistakes
 Desoldering Pump:
 Alternative to desoldering wick
 Press button, apply to excess solder region, and depress button
 Flux Remover:
 Used for removing certain fluxes (particularly rosin-based fluxes)
 Cleans circuit, removes corrosive/conductive flux

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 19 of 70
Author/Copyright De-Soldering October 2023
 Fig. 2.3. Desoldering Braid:
Other Tools
 SMT Tweezers and Picks:
i. Fine point tools used for careful placement and manipulation of electronic
components
ii. Board Clamps:
 Used to hold board in fixed, stable position for soldering or inspection
iii. Magnification and Illumination:
 Various options (loupes, microscopes, cameras)
 Used to get a better view of circuit board being soldered as well as visual
inspection of board

Fig. 2.4. SMT Tweezers and Picks:

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 20 of 70
Author/Copyright De-Soldering October 2023
 2.2. Set-up and mounting techniques
Printed circuit boards (PCBs) are populated by electronic components and these may be “surface
mount” or “through-hole” types.
Through-Hole Components
As the description “through-hole” suggests, the leads of the component are passed through holes
in the PCB and then soldered to a “pad” on the reverse side of the PCB. Soldering is
accomplished by heating the component lead and PCB pad with a soldering iron and melting
solder wire into the joint. This type of construction was common from the 1960‟s until early
2000‟s and is still used by hobbyists and in small scale production where manual assembly is
preferred.
Surface Mount Components
Commercial circuits are mostly of the surface mount type as these are cheaper to make, more
compact and easier to automate assembly. For surface mount construction the component‟s pads
are on the same side of the PCB as the component and the component connections sit onto these
pads. Soldering is accomplished by applying solder paste onto component pads on the PCB,
placing the component onto the paste and then heating the entire assembly to melt the solder.
Commercial assembly uses ovens to heat the boards. Hobbyists can also use surface mount
components and soldering can be accomplished by applying solder paste and melting with a hot
plate, small oven or soldering iron. Some surface mount joints can be soldered using a soldering
iron and solder wire.

Figure 2.5. Different Types of PCB

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 21 of 70
Author/Copyright De-Soldering October 2023
 Soldering Techniques

 Select solder alloy/type:

i. Leaded solders – lower temperature requirements, improved reliability
ii. Lead-free/ROHS compliant solders- higher temperature requirements, more
environmentally friendly, necessary for products bound for Europe (ROHS regulations)
 Select flux type:
i. Water-soluble flux – Good in many situations, easy cleaning (corrosive and conductive,
so cleaning is mandatory)
ii. Rosin-based flux – High performance, though cleaning is much more challenging
iii. “No-clean” flux – Misnomer; leaves less residue than other fluxes
 Select tip for application:
i. Conical – Useful for applying point-heat to a region, good for soldering individual leads
and heat transfer
ii. Chisel – Spreads heat over a wider area than conical, good for wider pads and some IC
lead-work
iii. Hook – Similar properties to chisel, but contains bend. Useful for through-hole
components and some SMD soldering
iv. Blade – Spreads heat over thin, wide area. Useful for soldering leads of IC packages (esp.
SSOP, QFP, etc.)
v. Thickness – Thicker tips have better thermal mass/heat transfer while smaller leads allow
precision application of heat
vi. Changing Tips – Can be done during soldering, but be careful (solder probe, sleeve, iron
tips are HOT!!!)
 Select operating temperature:
i. Lead-based solders have lower melting points (400ºF/200ºC range)
ii. ROHS solders have higher melting points (700ºF/375ºC range)
iii. Excessively heating a part may cause traces/pads to “lift” (become unglued from board
substrate)
iv. Sometimes higher iron temperatures are used to reduce total heat applied to board

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 22 of 70
Author/Copyright De-Soldering October 2023
 “Tin the tip” – Apply solder to iron tip, then use solder sponge to remove excess solder. Cleans
tip, removes oxidation, and improves performance.

i. Tin iron tip at least every 5-10 solder joints and when finished soldering.
ii. Use rosin core solder when tinning the tip at the end of a soldering session

Hand Soldering Free Wire

 Choose wire type:

i. Solid – Easier to work with but easier to break
ii. Stranded – Harder to break, slightly harder to work with
 If heat shrink tubing is being used add this to wires prior to connecting
 Twist wires together to form mechanical connection, apply flux as appropriate (solder can be
twisted around the exposed mechanical connection for reinforcement)
 Form electrical connection using soldering iron
 Insulate connection with heat shrink tubing, electrical tape, etc.
NOTE: In most cases, physical connectors may provide a superior alternative to soldering wires

Fig.2.6. Solder wires

Hand Soldering Through Hole

i. Insert component into plated circuit board holes so that part is flush with the board, secure
in place (bend leads, clamp, etc.)
ii. Touch tip of soldering iron to the lead and annular ring of the opposite side of the board
(Important: the lead, annular ring, and solder must all be hot to form a reliable connection
Surface mount board layout is a critical portion of the total design. The footprint for the
semiconductor packages must be the correct size to ensure proper solder connection interface

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 23 of 70
Author/Copyright De-Soldering October 2023
 between the board and the package. With the correct pad geometry, the packages will self-align
when subjected to a solder reflow process.

Fig.2.7. Soldering Through Hole

Inspect solder joints to ensure that a good connection has been made (good through-hole solder
joints have a “volcano” shape). Apply additional heat and flux or remove excess solder as
necessary.
Clip off excess leads using a small pair of diagonal cutters or something similar

Fig.2.8. small pair of diagonal cutters

Hand Soldering Surface Mount
 Simple Passive Components:
i. Apply flux to passive component pads
ii. Apply solder to ONE component pad
iii. Add passive component, connect component at pad containing solder (often known as
“tacking” a component). Soldered component should be flush with board.
iv. Solder remaining pads/leads of component, remove excess solder as necessary

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 24 of 70
Author/Copyright De-Soldering October 2023
 Fig. 2.9. Simple Passive Components
Surface Mount ICs:
i. Apply flux to surface mount IC pads
ii. Add solder to tip of soldering iron
iii. Place IC on the board. Careful alignment is needed to ensure all PCB pads line up with
component leads
iv. While holding the component in place, apply soldering iron tip to one of the lead corners.
The solder should solder that connection
v. Tack all other corners of the IC (do this prior to soldering interior leads of the part). Make
sure alignment is correct before step 6
vi. Apply solder to the remaining pads/leads of the IC. Blade tips are very useful here.
Solder bridges may form in this stage, that is okay
vii. Once all leads are soldered, apply desoldering braid to remove any solder bridges that
may have formed in step 6
viii. Carefully visually inspect the board for solder bridges or pads where all solder was
removed in step 7; correct as necessary

Fig.2.10. Surface Mount ICs:

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 25 of 70
Author/Copyright De-Soldering October 2023
 Reflow Soldering
Reflow soldering is an alternative to hand soldering
Advantages:
i. Able to solder many components at once
ii. Ideal for production/manufacturing (able to solder multiple boards simultaneously)
iii. Able to solder advanced packages (QFN, BGA, LGA, etc.) which cannot be hand
soldered
Disadvantages:
i. Requires additional materials (board stencil, solder paste, hotplate/oven, placement tools)
ii. Can only reflow solder a board once
iii. Heats entire board at once – care must be made to avoid thermal damage to components
Reflow Soldering Process
i. Place board into secure mounting bracket and secure solder stencil
ii. Apply solder paste to board and spread using thin card or squeegee
iii. If necessary, parts can be further secured through the addition of tacky flux (flux w/ mild
adhesive additive)
iv. Carefully place components on pasted pads, using hand tools or automated SMD
placement tools
v. Using a hotplate or a reflow oven, bring the board to the necessary temperature for solder
reflow, then gradually cool board back to room temperature
vi. Inspect boards visually (possibly with x-rays for advanced parts), and perform necessary
corrections
Reflow Soldering and Moisture Sensitivity Levels (MSLs)
i. The casing on some electronic components may be semi porous, allowing moisture and
water vapor to impregnate components
ii. These pockets of trapped moisture can expand during reflow soldering, damaging
components
iii. To counter these issues, components may need to be baked prior to soldering
iv. MSLs are defined for components on Digi Key and other online sources

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 26 of 70
Author/Copyright De-Soldering October 2023
 Hot Air Rework
i. Sometimes components are soldered incorrectly or are damaged in the course of electrical
manufacture and test. It may be necessary to remove components from circuit boards (for
realignment, replacement, etc.)
ii. Hot air rework stations can provide heated air to regions to heat up many solder connections
simultaneously, causing them to “reflow” and allow parts to be easily removed
iii. Care is needed so that heat doesn‟t cause traces/pads to lift from board (alternative method:
sever leads from component body using exacto knife and remove each lead individually)

Fig.2.11. Hot Air Rework

Common Soldering Pitfalls
i. When in doubt, add more flux (it can always be cleaned off later)
ii. Solder parts in such an order that soldering future parts may be accessed unobstructed
iii. When applying solder to the iron tip, act quickly. Better joints can be made when some of
the flux from the solder core hasn‟t evaporated
iv. Make sure pin 1 of any IC is in the correct position (avoid soldering parts which are
rotated 90, 180, or 270 degrees from correct orientation)
v. When soldering, always use electrical solders (as opposed to other solders designed for
other applications, such as plumbing)

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 27 of 70
Author/Copyright De-Soldering October 2023
 Setting Up Work Area.

i. Ensure adequate ventilation. If multiple people are soldering in a concentrated area, set
up a fan to gently blow fumes and vapors away from you and your co-workers.
ii. Keep area clean around workplace at all times.
iii. When working with statically sensitive components (most active devices such as ICs,
FETs, transistors, etc.), be sure to use an anti-static mat to work on and wear an anti-static
wrist strap to minimize risk of electrostatic discharge (ESD) damage.
Preparing Work piece
i. Clamp work securely while performing soldering or de-soldering. Use a vise, a helping
hand or other approved clamping systems to keep your hands free to work.
ii. Use heat sinks to protect thermally-sensitive circuit components.
iii. When soldering wire connections, make sure the wires are tightly connected. Use
appropriate covering like heat shrink tubing or twist-on connectors to protect the splice.
Do not use wires with melted insulation or exposed conductors.
Setting Up the Soldering Station.

i. Select proper solder and flux. Most solder nowadays are integrated with flux.
ii. Select the proper sized solder tip for your work. As trace and pad size decrease, soldering
tip size must also decrease.
iii. Turn the soldering station ON and set the temperature 650~750 F. Note: higher
temperatures lead to more rapid formulation of oxidation on soldering tip and will
shorten tip life.
iv. Make sure the solder tip is cleaned and tinned.
Tinning Soldering Tip

i. Allow the soldering iron to reach temperature.

ii. Apply flux to the tip first and then liberally apply solder to tip. Note: flux-core solder
may not require application of flux.
iii. Wipe off excess solder on sponge.
iv. A properly tinned tip will be shiny and free of oxidation.
v. It is normal to have to re-tin a tip from time to time as oxidation builds up on the tip.

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 28 of 70
Author/Copyright De-Soldering October 2023
 2.3. Methods of joint preparation
Preparation for Soldering
i. Warm-up. Allow the soldering iron to reach adequate temperature. The recommended
temperature setting is between 600 and 750° F. Some tips may have recommended
operating temperatures that should be observed.
ii. Clean Tip. A clean tip promotes heat transfer and helps to prevent unwanted “solder
bridges” from forming. A heavily oxidized tip will make it impossible to solder properly.
The steps to maintain clean tips are as follows: 1. Moisten sponge. 2. Wipe tip on sponge.
iii. “Wet” tip with solder – just enough for a very thin coating.
iv. Repeat if necessary to obtain a clean, shiny tip surface. Also, repeat between each solder
operation to maintain a clean tip.

Fig.2.12. properly cleaned and “wetted” soldering iron tip.

Prepare surfaces to be soldered
i. If soldering to a bare copper (non-pretinned) printed circuit board (PCB), the copper
should be cleaned using fine steel wool or other fine abrasive. All oils and remaining
abrasives should be removed with light soap and water followed by an alcohol rinse. The
copper should have a bright, shiny appearance prior to soldering.
ii. If soldering to magnet wire or other wire with a varnish insulation or with oxidized
surfaces, fine grit sandpaper can be used to prepare the surfaces to be soldered.
Wire Types
 Stranded Wire
I. Stranded wire should be used for connections from PCB to panel-mounted components,
or where wires will be flexed.
II. Strip, twist, and lightly “tin” the wire prior to soldering it in place this prevents fraying
of the conductors. Apply solder sparingly since too much solder may increase the wire

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 29 of 70
Author/Copyright De-Soldering October 2023
 diameter so that it becomes too large or too stiff. A wire prepared in this way may now
be hooked around a terminal or soldered into place on a PCB without fraying.

Fig.2.13. Stranded wire preparation.

III. 22 – 26 ga. stranded copper wire is recommended and 22 or 24 ga. is most common.
IV. For power connections, refer to wire tables (e.g., CRC Handbook) to determine the
proper gauge to carry the required current.
 Solid Wire
i. Solid wire should be used for jumpers on pc boards or for any point-to-point wiring.
ii. Use pre-tinned wire for best results.
iii. 22 – 28 ga. solid copper wire is recommended and 22 or 24 ga. is most common
iv. For power connections, refer to wire tables (e.g., CRC Handbook) to determine the
proper gauge to carry the required current.
 Coaxial Cable
i. Coax should be used when shielding from noise sources is desired.
ii. Preparation Methods:
 Strip the outer insulating sleeve using a sharp knife (e.g., X-Ac to knife).
 Bend the wire over, split the shield braid and pull the center conductor through the
opening.
 Strip the center conductor using a knife or wire strippers.
 Twist and tin the center conductor (if stranded type). e. Twist and tin the braid.

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 30 of 70
Author/Copyright De-Soldering October 2023
 Fig.2.14. Coaxial cable preparation

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 31 of 70
Author/Copyright De-Soldering October 2023
Self-check 2.1
Part one: - say true or false
1. soldering is extremely difficult compare to Desoldering
2. There is not art to soldering; it takes patience and practice to get it right.
3. Reflow Soldering Process is Placing board into secure mounting bracket and secure solder
stencil
4. Advantages Of Reflow Soldering Is To Solder Many Components At Once
5. Most soldering jobs can be done with flux cored
6. Soldering is used to form electrical connection
7. Soldering is may be lead, lead free and core materials
8. Flux is used to break surface tension and help solder flow.
Part two: Multiple Choose
1. De soldering Braid is used:
A. To remove excess solder from circuit C. Flux removal
B. To desoldering pump D. all
2. To make perfect solder joints:
A. All parts must be clean and free from dirt and grease
B. Try to secure the work firmly
C. Remove and return the iron safely to its standard
D. All
3. Cleaning materials or devices of soldering is used to______
A. Reduce solvent volumes
B. Reduce mixtures of IPA with water
C. Reduce mixtures of IPA with solvent
D. All
4. w/c one easier to work with but easier to break
A. solid wire B. Standard wire
5. simple passive components are :-
A. apply flux to passive component pads
B. apply solder to one component
C. solder remaining pads

32
 D. all
6. advantages of reflow soldering is:
A. to solder many component at one
B. ideal for production/manufacturing
C. to solder advanced packages
D. all
7. surface mount ICs means
A. apply flux to surface
B. add solder to tip of solder
C. place IC on boards

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 33 of 70
Author/Copyright De-Soldering October 2023
 Unit three: Weld Solder components

This unit is developed to provide you the necessary information regarding the following content
coverage and topics:
 Material/Device
 Apply Soldering with use of Flux
 Different techniques of soldering
 Assembly Printed Circuit Boards and Components
This unit will also assist you to attain the learning outcomes stated in the cover page. Specifically,
upon completion of this learning guide, you will be able to:
 Mounting Material/Device
 Applies Soldering use Flux
 Undertake Protect Materials/ Devices From Heat Damage
 Prevent Electrostatic Discharge And Mechanical Damage
 Printed Circuit Boards, Assemblies And Components

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 34 of 70
Author/Copyright De-Soldering October 2023
 3.1. Soldering with use of Flux
Flux
For electrical soldering both solder wire and solder paste contain flux. This helps to clean the
surfaces being soldered and prevent oxidization of the hot solder. The composition of the flux
will vary depending on whether it is in a paste or wire, leaded or unleaded solder. Solder wire
usually contains a flux called “rosin”. Most fluxes will produce fumes when the solder is heated
and these fumes are likely harmful to your health. For occasional soldering it may be sufficient
to have a well-ventilated workspace but for longer or repeated exposure a fume extractor should
be used. Solder flux can also causes solder to spatter and eye protection should be worn when
soldering.

Figure 3.1.Fumes and Fume Extraction Systems

Hazards involved in soldering

Heat
Although solder has a relatively low melting point this temperature is more than high enough to
cause serious burns to people or objects. It is important to hold the soldering iron only by the
insulated handle, never touch the heating element or tip when the soldering iron is on. The
soldering iron will remain hot for some time after it is turned off so always check that it has
cooled down before touching it, e.g. if changing the tip. When you are not soldering always keep
the soldering iron in a proper holder so that you don‟t touch it accidently and it doesn‟t heat or

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 35 of 70
Author/Copyright De-Soldering October 2023
 burn other objects such as the benchtop. Don‟t hold parts being soldered with your hands as
these will also be heated when being soldered. Don‟t flick molten solder from the soldering iron
or wipe the tip on brass wool type tip cleaners. If using a hot plate for surface mount soldering do
not touch the hot plate. Use utensils such as pliers to place and remove PCB‟s from the hotplate.
If using hot air tools for soldering, de-soldering or rework, do not direct the hot air stream onto
yourself or other people. If using an oven allow the PCB to cool before handling or use utensils.
Don‟t place hot PCB‟s on temperature sensitive surfaces. If burns occur they should be treated
by holding under cold running water for several minutes and assistance sought if burns are
severe. Incidents should be reported.
Toxic materials
Leaded solder contains lead which is a harmful material. Use of this type of solder will probably
involve handling it and your skin may become contaminated by it. Although it is unlikely that
the lead can be absorbed directly through your skin it may be ingested indirectly if it is
transferred by handling food whilst your skin is contaminated. Always wash your hands
thoroughly before eating or handling food. Solder flux creates fumes when heated during
soldering which may be harmful if inhaled. Use a fume extractor to avoid inhaling fumes.
Spattering
Solder and flux can spit or spatter when heated. Always wear eye protection (safety glasses)
when soldering.
Electrical Safety
Electric soldering irons are plugin appliances and must have a current safety test tag. The test
will confirm that the soldering iron conforms to electrical safety standards and has not been
damaged at the time of the test. Before use you should visually check that the soldering iron does
not have damage such as melted insulation on the lead, broken or cracked handle or exposed
conductors. Don‟t use damaged equipment and report the damage. For electrical safety the
exposed metal parts such as the tip and heating element are earthed. Don‟t solder on any live
equipment as contact with the earthed tip may cause damage to the equipment or soldering iron.

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 36 of 70
Author/Copyright De-Soldering October 2023
 3.2. Protect materials/ devices from heat damage
The Basic Soldering Guide
Soldering is a delicate manual skill which only comes with practice. Remember that your ability
to solder effectively will determine directly how well the prototype or product functions during
its lifespan. Poor soldering can be an expensive business - causing product failure and downtime,
engineer's maintenance time and customer dissatisfaction. At hobbyist level, bad soldering
technique can be a cause of major disappointment which damages your confidence. It needn't be
like that: soldering is really easy to learn, and like learning to ride a bike, once mastered is never
forgotten.
These photos illustrate the basic steps in making a perfect solder joint on a p.c.b. If you're a
beginner, our advice is that it's best to practice your soldering technique using some clean, new
parts with perhaps some new stripboard (protoboard). Be sure to avoid using old, dirty parts;
these can be difficult if not impossible to solder.

Fig.3.2. Soldering Guide step 1

(Left) Printed circuit board copper tracks must be clean to begin with, especially if they're not
previously "tinned" with solder. Clean any raw p.c.b. copper tracks gently with e.g. an abrasive
rubber block available from electronics suppliers. (Right) Clean the iron "bit" (soldering iron tip)
using a damp sponge. The soldering iron featured is an Ungar Concept 2100 Soldering Station.
Other popular brands of soldering equipment include Weller and Antex.

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 37 of 70
Author/Copyright De-Soldering October 2023
 Fig.3.3. Soldering Guide step 2

(Left) A useful product is Multicore's Tip Tinner Cleaner (TTC) a 15 gramme tin of special
paste which cleans and "tins" the soldering iron in one go. New tips must be tinned immediately
when used for the first time. (Right) Insert components and splay the leads so that the part is held
in place.

Fig.3.4. Soldering Guide step 3

(Left) It's usually best to snip the electronic component wires to length prior to soldering. This
helps prevent transmitting mechanical shocks to the copper foil.(Right) Apply a clean soldering
iron tip to the copper solder pad and the component lead, in order to heat both items at the same
time.

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 38 of 70
Author/Copyright De-Soldering October 2023
 Fig.3.4. Soldering Guide step 4

(Left) Continue heating and apply a few millimeters of solder. Remove the iron and allow the
solder joint to cool naturally. (Right) It only takes a second or two, to make the perfect joint,
which should be nice and shiny. Check the Guide for troubleshooting help. An example of a
"dry" or "gray" soller joint - the solder failed to flow, and instead beaded to form globules
around the wire.

Fig.3.5. Soldering Guide step 5

Here's a summary of how to make the perfect solder joint.

I. All parts must be clean and free from dirt and grease.
II. Try to secure the work firmly.
III. "Tin" the iron tip with a small amount of solder. Do this immediately, with new tips
being used for the first time.
IV. Clean the tip of the hot soldering iron on a damp sponge.
V. Many people then add a tiny amount of fresh solder to the cleansed tip.
VI. Heat all parts of the joint with the iron for under a second or so.
VII. Continue heating, then apply sufficient solder only, to form an adequate joint.

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 39 of 70
Author/Copyright De-Soldering October 2023
 VIII. Remove and return the iron safely to its stand.
IX. It only takes two or three seconds at most, to solder the average p.c.b. joint.
X. Do not move parts until the solder has cooled.
Some Reasons for Wettability

I. The selected temperature is too high. The tin coating is burnt off rapidly and oxidation
occurs.
II. Oxidation may occur because of wrong or imperfect cleaning of the tip. E.G.: when other
material is used for tip cleaning instead of the original damp Weller sponge.
III. Use of impure solder or solder with flux interruptions in the flux core.
IV. Insufficient tinning when working with high temperatures over 6650 F (3500 C) and after
work interruptions of more than one hour.
V. A dry tip, i.e. if the tip is allowed to sit without a thin coating of solder oxidation occurs
rapidly.
VI. Use of fluxed that are highly corrosive and cause rapid oxidation of the tip (e.g. water
soluble flux).
VII. Use of mild flux that does not remove normal oxides off the tip (e.g. no-clean flux).
Cleaning materials/devices

To reduce solvent volumes, mixtures of IPA with water and IPA with solvent are available in
pressurized containers. The propellants are HFC‟s. Theses containers may be fitted with a bristle
brush spray attachments for additional cleaning action.

i. Clean the board in an Aqueous or Semi-Aqueous cleaner, or pour approximately 10 ml

per 4 square inches of effected area.
ii. Scrub the board vigorously with a continually wet soft bristle brush for 10 seconds.
iii. Rinse the area with 10 ml per 4 square inches of clean Isopropyl Alcohol to effectively
remove all potentially harmful residues.
iv. Handle the board by the edges and blot the excess Isopropyl Alcohol with clean, lint free
cloth.
v. Examine board visually for cleanliness. The use of a black light will help detect
contaminants that will fluoresce.
vi. Dry boards in oven, if desired.

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 40 of 70
Author/Copyright De-Soldering October 2023
 vii. If the boards or assemblies are to be stored before use or coating, remove them from the
oven and allow cooling until they can be handled. Place the boards or assemblies into
self-sealing bags with packages of desiccant

Figure 3.6. Dirty tip and brass wool cleaner

Soldering is defined as "the joining of metals by a fusion of alloys which have relatively low
melting points". In other words, you use a metal that has a low melting point to adhere the
surfaces to be soldered together. Soldering is more like gluing with molten metal than anything
else. Soldering is also a must have skill for all sorts of electrical and electronics work. It is also a
skill that must be taught correctly and developed with practice.

Remember that when soldering, the rosin in the solder releases fumes. These fumes are harmful
to your eyes and lungs. Therefore, always work in a well-ventilated area. Hot solder is also
dangerous. Be sure not to let is splash around because it will burn you almost instantly. Eye
protection is also advised.

Fig.3.7. eye protection

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 41 of 70
Author/Copyright De-Soldering October 2023
 General Guidelines for Soldering

While soldering, there should be at least 20 cm distance between the eyes and the board and the
soldering iron movement should be easy. An incorrect position can lead to fume inhalation and
back pain.

Safety Precautions

Protecting oneself at all times is always utmost priority and electronics is no fun anymore if there
will be untoward accident when doing the soldering job. With soldering, the main safety hazard
is related to the high temperature of the soldering iron tip. Other safety precautions that you
should take into consideration are related to the fumes generated that are harmful to your eyes
and lungs, the hot solder splashes that might cause injury to yourself as well as to other people
around you and the toxic soldering materials being handled that you might ingest if not careful.
The product we sell is safe when used properly but you as the end-user has also a big part and
responsibility to ensure that no harm or damage (both ways) will result in using the product.
Make sure you follow these rules when using the soldering iron and during the soldering process.
I. Always protect yourself at all times by wearing safety eyeglasses.
II. Always solder in a well ventilated area or work with a fume extractor so that you do not
inhale the fumes released during the soldering process.
III. Never leave the soldering iron un-attended while it is powered on
IV. Unplug the soldering iron when you‟re not going to use it for the next 10 minutes or so.
V. Use the holder as stand for your soldering iron and do not place it elsewhere, it might
cause accidental fire.
VI. Do not solder live circuits.
VII. Do not touch flammable items (e.g. alcohol, solvents, paper, wood, etc) with the hot
soldering iron tip and keep them away from your work space
VIII. Make sure that the hot soldering iron tip does not touch the power supply cord.
IX. Keep your fingers and skin away from the hot soldering iron tip
X. Do not touch the parts immediately after soldering, they might still be hot

XI. Do not eat while soldering nor lick your fingers or put any soldering materials or tools in
the mouth.

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 42 of 70
Author/Copyright De-Soldering October 2023
 XII. Always wash your hands after soldering
XIII. If something unusual happens or if you suspect that something is wrong or has
malfunctioned, do not do anything with the product and immediately contact the seller for
assistance.

Fig.3.8 Safety Summary

3.3. Assembly Printed Circuit Boards and Components

Construction and Soldering Techniques
 Printed Circuit Board (PCB) Soldering and Construction.
 Component mounting. Components are pushed through from the top side of the board and
the leads are bent slightly to hold the component while soldering.

Fig. 3.9.Component mounting on PCBs

 Components are then soldered to the board
 The soldering iron tip should be placed in contact with both the trace (foil) and the lead. The
two should be heated only enough to melt solder in order to avoid damaging sensitive
components and to avoid delamination of the PCB traces.

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 43 of 70
Author/Copyright De-Soldering October 2023
  Solder is then touched to the area and allowed to flow freely around the lead and to cover the
solder pad. A minimal amount of solder should be applied. Only enough solder to cover the
joint and to form a smooth fillet should be used.
 The iron should be removed after the solder has flowed properly and wetted all surfaces. The
component and the board should not be moved until the solder has hardened (up to several
seconds, depending on the lead and trace size).

Fig.3.10. Steps for soldering components to a PCB.

Fig.3.11. Soldering a component to a PCB.

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 44 of 70
Author/Copyright De-Soldering October 2023
 Soldering a Wire to a Circuit Board

Fig. 3.12. Step of Soldering a Wire to a Circuit Board

Requirements of Solder
i. Should fuse safely below the sag or creep temperature of the parent alloy.
ii. Resist tarnish and corrosion
iii. Non-pitting
iv. Free flowing
v. Match color of parent metal 6. Strong
Good soldering and bad soldering Joints
Here are some example of good soldering and Bad soldering joint. For Japanese, we often say,
“Good soldering joint should look like Mt. Fuji.”

Fig. 3.13. Good soldering and bad soldering Joints

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 45 of 70
Author/Copyright De-Soldering October 2023
 Desoldering
Desoldering is extremely difficult compare to soldering. In the process of Rom Board
installation, the parts and circuit board must be in the good shape to re-use them. The tool we use
is Desoldering Gun. This device has vacuum pump built in with heater tip. Process of
desoldering itself is very simple, but there are some tricks to do clean and safe desoldering job.

Fig.3.14. Desoldering steps

 Solder joints should be inspected when completed to determine if they have been
properly made:
1. Qualities of good solder joints
 Shiny surface.
 Good, smooth fillet.

Fig.3.15. A good solder joint.

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 46 of 70
Author/Copyright De-Soldering October 2023
  Qualities of poor solder joints
i. Dull or crystallized surfaces. This is an indicator of a cold solder joint. Cold solder joints
result from moving the components after the soldering iron has been removed but before
the solder has hardened. Cold solder joints may work at first but will eventually fail.
ii. Air pockets. Air pockets (voids) result from incomplete wetting of surfaces, allowing air
to be in contact with the connecting metals. This will cause oxidation of the joint and
eventual failure. Blowholes can occur due to vaporization of moisture on the surface of
the board and exiting through the molten solder. Boards should be clean and dry prior to
soldering. Ethanol (100%) can be used as a moisture chaser if boards are wet prior to
soldering.
iii. Dimples. Dimples in the surface do not always indicate a serious problem, but they
should be avoided since they are precursors to voids.
iv. Floaters. Black spots “floating” in the solder fillet should be avoided because they
indicate contamination and a potential for failure as in the case of voids. These black
spots usually result from overheated (burnt) rosin or other contaminants such as burnt
wire insulation. Maintaining a clean tip will help to avoid these problems.
v. Balls. A solder ball, instead of a fillet, can occur if the trace was heated but the lead was
not (or vice-versa). This prevents proper wetting of both surfaces and results in solder
being attached to only one surface (component or trace).
vi. Excess Solder. Excess solder usage can cover up other potential problems and should be
avoided. It can also lead to solder bridges. In addition, spherical solder joints can result
from the application of too much solder.

Fig.3.16. Examples of poor solder joints.

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 47 of 70
Author/Copyright De-Soldering October 2023
 Fig.3.17. Example of a solder bridge.
Point-to-Point Prototyping Techniques
 Point-to-point techniques are used when the expense of designing a PCB is prohibitive or as
the prelude to the design of a PCB.
 Point-to-point wiring typically uses either plain perforated board (“perf-board”) or “pad per
hole” perf -board. Pad per hole boards have a plated-through eyelet, or pad, at each hole. Pad
per hole boards are more expensive, but are highly recommended because the eyelets ensure
that components are physically held to the board. In either case, wires must be wrapped
around each other or around the pins of components to make connections. Soldering methods
are approximately the same as for PCBs.

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 48 of 70
Author/Copyright De-Soldering October 2023
 Fig. 3.18.Point-to-point wiring using perf-board.

Fig.3.19. Point-to-point wiring using a pad per hole board.

 Miscellaneous construction techniques
Commercially available prototyping boards, several types of prototyping PCBs are available for
special applications.

Figure.3.20. Single DIP prototyping board Figure.3.21.Prototyping board for surface mount
components

Flea Clips. “Flea clips” can be used for mounting components that may be changed frequently
during the prototyping stage. They can also be used for terminals for connecting stranded wires
between the board and panel-mounted components. Flea clips can be seen in each of the point-to-
point examples above.

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 49 of 70
Author/Copyright De-Soldering October 2023
 Fig.3.22. Flea clip terminals and insertion tool
Spacers and Chassis: Spacers are usually used to mount circuit boards to a chassis. Spacers are
available in many lengths and materials, and may have internal or external threads. Used for
mounting a PCB into a chassis.

Fig.3.23. Use of spacers in construction.

3.4. Electrostatic Discharge and Mechanical Damage
Electrostatic discharge (ESD) is the release of static electricity when two objects come into
contact. Familiar examples of ESD include the shock we receive when we walk across a carpet
and touch a metal doorknob and the static electricity we feel from clothes coming out of the
dryer. Lightning is also electrostatic discharge.
While most of ESD events are harmless to the human body, they can cause challenging and
expensive problems in certain industrial environments. Static electricity is a problem for
electronic and medical device manufacturing, vehicle fabrication, industries that use plastics and
paper, and ones that need clean room environments. ESD issues can slow production, negatively
affect product quality issues, attract contaminants and create safety issues.
What causes an electrostatic discharge?

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 50 of 70
Author/Copyright De-Soldering October 2023
 An ESD event reflects a buildup of an electrostatic charge. This occurs when two different
conductive materials, or conductors, rub together. One of the materials becomes positively
charged; the other takes on a negative charge. The positively charged material now has an
electrostatic charge. When the electrically charged object comes into contact with another
conductive material, such as a Styrofoam cup or plastic bag, a static charge is transferred and an
ESD event occurs.
How does electrostatic discharge affect electronic components?

High voltage isn't necessarily the issue with ESD. Many electronic devices are susceptible to low
voltage ESD damage. For example, hard drive components are sensitive to 10 volts of
electrostatic discharge.
The heat from an ESD event can be extremely hot, although we might not feel the heat when we
are shocked. However, when the static discharge is released onto an electronic device, such as
a semiconductor or an expansion slot or card, the heat from the charge can melt or vaporize the
tiny parts, causing the part to fail.
Sometimes an ESD event can damage sensitive devices, but they continue to function. This is
called a latent defect, which is hard to detect but ultimately shortens the life of the device.

Fig.3.24. Heat in a data center can contribute to electrostatic discharge issues

How to manage and prevent ESD

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 51 of 70
Author/Copyright De-Soldering October 2023
 Electrostatic discharges can occur without warning. Prevention requires understanding the
environment in which an electronic device is manufactured, handled and used, and taking
measures to reduce the likelihood of an event.
Electronics manufacturers incorporate various ESD protection measures to prevent issues in
the manufacturing process, which includes fabricating, testing, shipping and handling. ESD
preventive measures include the following:
 Use devices, chairs and other furnishing that are classified as ESD-safe.
 Ensure all devices and machines are grounded according to American National Standards
Institute (ANSI) standards.
 Use personal grounding equipment and methods, such as antistatic wrist straps and footwear.
 Cover floors with antistatic mats that send charges into the ground and away from devices.
 Store devices in static-reducing containers.
 Package electronics using materials that shield them from ESD.
 Make antistatic spray available where appropriate.
 Only use static-attracting components in an area that is static-minimized.
 Avoid coming into contact with metallic parts or components, such as wires and connectors.
 Remove unnecessary components from static-protected work areas.
ESD standards
 Various standards help address ESD control issues and create protected areas. They define
the sensitivity of the products to ESD and the requirements for specific measures in
environments where electrostatic fields are a problem.
 ESD standards are voluntary in the United States but can be included in sales agreements
and other contracts. The EOS/ESD Association is accredited by ANSI to develop ESD
standards and testing methods. The following are some of the ESD standards available:
 ANSI/ESD S20.20-2021: Protection of electrical and electronic parts.
 International Electro technical Commission IEC 61340-5-1: Protection of electronic devices
from electrostatic phenomena -- general requirements.
 ANSI/ESD S8.1-2021: Standard for the protection of electrostatic discharge susceptible
Items -- symbols.
 ANSI/ESD S6.1-2019: Electrostatic discharge grounding.
 ANSI/ESD S541-2019: Standard for packaging ESD susceptible materials.

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 52 of 70
Author/Copyright De-Soldering October 2023
 Self-check 3.1
Part I: say true or false;
1. The types of mount material is surface mount and through hole type mount
2. Some surface mount is joints can be soldered using a soldering iron and solder wire
3. Both solder wire and solder paste contain flux
4. The solder wire usually contain a flux called „‟rosin‟
5. Leaded solder contain lead w/c is a harmful material
6. Solder and flux can spit or splatter when heated
Part I: Choose the appropriate answer from the given alternatives.
1. Soldering Iron Types are
A. Temperature C. Modified, non-temperature-controlled iron
B. Non-temperature D. all
2. Which one the types of Solder
A. Rosin core B. Lead-free C. Silver D. Acid-core E. all
3. Preparation for Soldering contains
A. Warm-up C. Clean Tip
B. “Wet” tip with solder D. all
4. Preparation Methods of Coaxial Cable are
A. Strip the outer insulating sleeve using a sharp knife
B. Bend the wire over, split the shield braid and pull the center conductor through the
opening.
C. Strip the center conductor using a knife or wire strippers D. All
5. Requirements of Solder are
A. Resist tarnish and corrosion
B. Non-pitting
C. Free flowing
D. All
6. What causes an electrostatic discharge?
A. occurs when two different conductive materials, or conductors, rub together
B. occurs when two different non -conductive materials, or conductors, rub together
C. when soldering
D. none

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 53 of 70
Author/Copyright De-Soldering October 2023
 Operation Sheet 3.1
Operation Title: Soldering
Purpose: to solder the specified modules on the PCB.
Object: To know what is soldering in PCB:
Conditions or situations for the operations:
 Safe working area
 Properly operated tools and equipment
 Appropriate working cloths fit with the body
Equipment Tools and Materials:
A copy of the board you will be working with is shown below
Quality Criteria: Assured performing of all the activities according to the procedures
Precautions:
 Wearing proper clothes, eye glass, glove
 Make working area hazard free
 Read and interpret manual which guide you how to use tools and equipment.

Steps in doing the task

1. The modules that you will solder in this lab are indicated below in the bill of materials.
2. Match up the component label or designation with the part listed in the table below.
2. If you end up with cold joints, you may want to reapply heat to re-melt the solder.
3. If this doesn‟t solve the problem, it is best that you unsolder the component and try again.
4. You will notice that each component has an outline on the board indicating where the
component goes.

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 54 of 70
Author/Copyright De-Soldering October 2023
 5. The components can be identified by matching the component label on the board (e.g. R2,
C7, U3, etc.) with the component on the bill of materials list below.
6. Your kit should come with the specified number of each component.
7. If your kit is missing something, let your GSI know immediately and we will get them for
you.
8. Make sure that you use the correct components and put them in the correct holes.
9. Your GSI will show you how to read resistor and capacitor values, and use the multimeter to
verify them.
10. Furthermore, make sure that you insert components with correct polarity.
11. If you are unsure of which way to insert a component, ask your GSI or consult the example
board.
12. All holes on the board, except for the test pads should have components associated with
them.
13. The LEDs have two pins, an anode and a cathode.
14. Follow the PCB outline to match the flat part of the LED with the board.
15. You may have to bend and clip some of the leads for the potentiometer to make it fit.
16. For the larger leads of the potentiometer, you do not have to worry too much since they are
mounts and are not connected to the rest of the circuit.
17. Also we recommend you tin the leads for the battery clip before soldering and tape it down
after soldering since the wires break easily.

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 55 of 70
Author/Copyright De-Soldering October 2023
 18. Make sure you have READ the procedures before you begin soldering your components.
19. You will NOT be provided with an extra board so please try to understand the procedure
BEFORE you start soldering.
Lab Tips:
Solder passive components first (resistors, capacitors, potentiometer). Check for resistor value
using chart above.
Solder LEDs using correct polarity
 Solder switch using correct polarity (one side says NC, another says C)
 Solder IC socket holders in place of the op-amps. DO NOT solder op-amps directly to the
board
 Once all parts are soldered, put op-amps into IC holders with the correct polarity (check the
dot for pin 1 matches dot on PCB) once you finish soldering the components, verify that your
circuit is working and demonstrate it to your lab TA. To test if your PCB works or not, first
make sure that you circuit is turned on.
You should observe a flashing LED on your board. If you do, than congratulations, your circuit
works and you have completed your first lab! If your board doesn‟t work, take a quick look at
your soldering and make sure that it‟s clean. If your board still isn‟t working, ask your GSI to

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 56 of 70
Author/Copyright De-Soldering October 2023
 provide assistance. We‟ll get it to work eventually… Finally, you will have one lab section to
complete this assignment so please be prepared to come to lab and solder away. Once you finish,
you can leave early or familiarize yourself with the other lab equipment. Oh, and one more thing,
have fun and enjoy!  Regards, your teaching staff.

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 57 of 70
Author/Copyright De-Soldering October 2023
 Unit four: Soldering process to the standard
This learning guide is developed to provide you the necessary information regarding the
following content coverage and topics:

 Visual inspection.
 Test Joints
 Rework/Repair
 Staff And Contractors Training
This guide will also assist you to attain the learning outcomes stated in the cover page.
Specifically, upon completion of this learning guide, you will be able to:
 Carry out Visual inspection.
 Undertake test and inspection
 Carry out repair
 Train staff and contractors induction.

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 58 of 70
Author/Copyright De-Soldering October 2023
 4.1. Visual inspection
Inspection
After this process, comes the very important process of inspection. It is important to check to see
that the connection isn‟t poor and that there are no shorts as a result of misplaced components.
There are a number of inspection methods that are in use. These include:
 Manual Inspection- This works well for small batches. However, when the number of
boards increase, visual inspection becomes impractical
 AOI or Automatic Optical Inspection- This is suited for large a batch where an AOI
machine is used that has cameras at different angles. With different quality solders reflecting
light in different ways, it is easy to identify the low-quality solder.
 X-Ray inspection- For layered PCBs, this method works well

Fig. 4.1. Inspection

4.2. Test Joints

Range of Diameters:
There can be significant differences in the equipment and technique used to solder larger
diameters and smaller diameters. Consequently, test solder joints will qualify a solderer as
follows:
i. 1” nominal test joints will qualify a solderer for diameters up to 1-1/2” nominal.
ii. 2" nominal test joints will qualify a solderer for diameters from 2" through 3" nominal.
iii. 4" nominal test joints will qualify a solderer for diameters from 2" through 5" nominal.

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 59 of 70
Author/Copyright De-Soldering October 2023
 iv. 6" nominal test joints will qualify a solderer for diameters from 2" through 6" nominal.
v. 8" nominal test joints will qualify a solderer for diameters from 2" through 8" nominal.
Number of Test Joints: Four test joints will be required for each diameter range to be qualified.
Test joints of all assemblies are to be soldered in the horizontal position (see Figure 1).

Fig. 4.2. Joint Sketch

Functional Test

Post this comes the final inspection to test for functionality. With simulated signals running
through the PCB at this stage, its electrical characteristics are tested. This completes the PCB
Assembly process. However, soldering can make the process messy. What is therefore extremely
important, is to wash the product after the soldering process. For this, a high-pressure washing
apparatus is used, where the PCB is washed in deionized water. Washing is then followed by a
drying process which is then followed by packaging and shipment. It is also important to note
that there are some differences between THT Assembly, SMT Assembly and Mixed Technology
Printed Circuit Board Assembly.

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 60 of 70
Author/Copyright De-Soldering October 2023
 Fig.4.3. Functional Test

Through-Hole Components
The board also may contain a number of through-hole components, in which case these
components require a special kind of soldering method. This could be manual soldering where
components will be inserted one at a time. The process can be lengthy depending on how many
components there are. There is also wave soldering which is an automated version. However,
this isn‟t possible for double-sided PCBs.

Fig. 4.4. Through-Hole Components

Through Hole Technology PCB Assembly Process
In this Through Hole assembly process the first step is that of component placement where
components are placed manually conforming to a number of regulations regarding polarity and
orientation of components. This is, then followed by a process of inspection. The last step is to
do with wave soldering which involves the THT components to be accurately soldered onto the
circuit board.

Fig. 4.5. Through Hole Technology PCB Assembly Process

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 61 of 70
Author/Copyright De-Soldering October 2023
 SMT PCB Assembly Process
SMT Assembly process involves the steps of Solder Paste Printing where the solder paste is
applied through a solder paste printer. This is then followed by mounting of components through
an auto pick-and-place machine that sticks parts to the board. The final step is to do with reflow
soldering which binds the components firmly to the board.

Fig. 4.6. SMT PCB Assembly Process

Mixed Technology Printed Circuit Board Assembly with electronic products becoming
increasingly complex and miniaturization becoming the order of the day, most boards have both
Through-hole and SMD components. In such cases it is important to have a proper sequence in
order. Hand soldering works well where there are many components on both sides and where
SMD components are more. Where there are a small number of THT components, wave
soldering is recommended.

Fig. 4.7. Mixed Technology Printed Circuit Board Assembly

4.3. Rework in the production process
In our imperfect world, zero-fault soldering does not exist. Soldering faults will occur, and
because even one single fault makes a board unusable, each must be corrected by rework or
corrective soldering. It would be a mistake to regard rework as an unavoidable, tedious adjunct
to electronic production. On the contrary, it is an essential link in the production chain. Unless it
is taken seriously, properly organized, managed, monitored and integrated into production,
reworking the soldered boards may well cost more than soldering them in the first place. On the
other hand, if rework is monitored systematically, so as to lead to a learning curve and a fault
catalogue for each type of board, its cost can be reduced to its unavoidable minimum. At the
same time, the fault catalogue will form a valuable tool, for use by management, designers,
buying departments and quality managers. This applies equally to a large organization or

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 62 of 70
Author/Copyright De-Soldering October 2023
 manufacturing unit with many soldering lines as to a small manufacturer with a handful of
employees. Every rework operation must involve three steps:
I. Diagnosis having located a fault which must be put right, try to find out first why it has
occurred. Don‟t start working on it, until you have satisfied yourself that you have found
the answer, and have made a record of it. Otherwise, you may destroy vital evidence,
which could have helped to prevent the fault recurring again.
II. Remedy put the fault right.
III. Prevention Make sure that whoever in the organization could or should have prevented
the fault from occurring, knows what you have found and done about it, and if possible
that this information is recorded. Procedures and information technologies to take care
of that are commercially available. The rework rate can be regarded as the fever
thermometer of a manufacturing line. If nobody cares to read it, the patient may well be
moribund before anybody has noticed that he is sick.

Desoldering and Resoldering

Rework itself often involves two closely linked operations: if the correction of a fault requires
the removal of a faulty, misplaced or dislodged component and its replacement, the desoldering
and resoldering operations which this implies should follow closely upon one another. Removing
bridges and, if necessary, solder balls, are simple desoldering operations. Desoldering leaded
components from through plated holes requires soldering irons which can suck the solder out of
the hole. With SMDs, the removal of a defective component and its replacement with a new one
can often be carried out with one and the same tool. With the desoldering of wave soldered
SMDs, separating the glued joint underneath the component is an additional operation. Open
joints are normally filled with a small temperature-controlled hand soldering iron.

Basic considerations

 Metallurgical and mechanical consequences of rework

A reworked joint is never as good as the first joint would have been had it not needed to be
replaced or corrected. The reasons are found principally in the metallurgy of joint formation.
Furthermore, the additional thermal, and sometimes mechanical, stresses of resoldering may
easily weaken the bond between footprint and board. A lifted footprint is one of the most serious

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 63 of 70
Author/Copyright De-Soldering October 2023
 types of damage, caused by getting a joint too hot or heating it for too long during desoldering.
Repairing a lifted footprint is possible, but it is expensive, takes time, and the board will never be
as good again as it was in the first place. Industrial experience confirms the damaging effect of
corrective soldering. So did a cooperative research project carried out by a number of industrial
companies in the UK under the auspices of the National Physical Laboratory. The latter counted
the number of through-hole joints on standardized sample boards with 2000 points each which
showed visible cracks after they had been reworked with a soldering iron under controlled
conditions and then exposed to up to 1000 temperature cycles between −20 °C/−4 °F and 100
°C/212 °F. For comparison, boards which had not been reworked were given the same thermal
treatment.
Two conclusions are clear:
i. The longer the rework contact time of the soldering-iron bit, the more soldered joints are
visibly cracked after a given number of thermal fatigue cycles.
ii. The higher the rework temperature, the more heat is supplied to the solder joint and the
greater is the degradation of its performance under thermal fatigue, i.e. the loss of
reliability. The metallurgical reason for this degradation is the growth of the brittle
intermetallic layer between solder and substrate. Its thickness is a function of the
confrontation time between the molten solder and the substrate, and of its temperature.
Table 4.1 The degradation of soldered joints caused by rework

A further factor is the depletion of tin in the immediate neighborhood of the solder/copper
interface because it migrates to augment the intermetallic layer. This leaves a predominance of

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 64 of 70
Author/Copyright De-Soldering October 2023
 lead in the area next to that layer. Lead being weaker than solder, this circumstance further
promotes cracking under thermal fatigue loads.
The cost of rework
Rework is a joint-by-joint procedure, and necessarily time-consuming and expensive. Reworking
single joint costs on average as much as did the first-time soldering of the complete circuit board
on which it sits, and often considerably more. Depending on the type of product and its sale
value, it may sometimes be cheaper to scrap a faulty circuit than to rework it. Some low-cost
products like pocket calculators, cheap electronic watches and toys fall in that class. In small-
scale production in particular, where visual inspection and rework are carried out by the same
operator or operators, it is important to keep this cost aspect in mind. It is tempting to say „I
might as well touch up this joint while I am looking at it.‟ Not only do joint quality and
reliability suffer through this practice, but costs are liable to rise in an uncontrollable manner.
Lessons to be learned
The lessons to be drawn from these considerations are plain:
a. Whatever the method used for rework, choose only the best equipment available, and
maintain it in top condition.
b. Complete every joint quickly. The solder should be molten for not longer than a few
seconds.
c. Keep the working temperature as low as is compatible with this requirement.
d. Preheating the board, either locally or overall, before carrying out any rework on it
brings two benefits. First, the specific heat of the FR4 substrate is almost four times
that of copper or solder. This means that four times as much heat energy is needed to
bring the board up to soldering temperature than to heat the joint itself. Preheating
considerably shortens the heating time necessary to complete a joint, particularly with
heavy multilayer boards. Secondly, with wave soldered boards where the SMDs are
glued to the board surface, preheating softens the adhesive joint and makes it easier to
break when desoldering becomes necessary (Section 4.9.5). A preheating temperature
of about 60 °C/140 °F to 100 °C/210 °F is usually enough for this purpose. A stream
of warm air directed against the underside of the board is the usual method of
preheating. This avoids the danger of a sharply localized hot spot, which could distort
the board.

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 65 of 70
Author/Copyright De-Soldering October 2023
 e. Rework for cosmetic reasons alone is an expensive and damaging luxury, and it
should only be carried out if the customer or the market demands it and pays for it.
Rework equipment
 Heat sources
 Soldering irons
 Heated tweezers and thermodes
 Miniature solder waves
 Hot air or gas
 Infrared radiation
Rework tasks and procedures
 Removing bridges and solder balls
 Desoldering SMDs
 Filling empty joints
 Resoldering SMDs
 Cleaning after rework
 Semi-mechanized work stations

4.4. Staff and Contractors Training

Comprehensive Training
Repair personnel can't be part-timers and repair only one day a week or on a rotational basis with
other duties. They should be dedicated exclusively to the repair operation. The reason for this is
to develop a high level of skill and maintain it through repetition. For many challenging aspects
of repair to be done reliably, they must be done repeatedly, such as the replacement of fine-pitch
surface mount pads. Furthermore, some repair skills are so specific that they should be limited to
certain individuals who demonstrate an affinity for the job, rather than attempting to train a
general number of persons to do the same difficult task.
Considerable supervision is required during the basic phase of the training operation, with lots of
individual help and attention. The key is not to attempt to move people too fast on the road to
proficiency. It's a step-by-step approach. Other companies may do it differently, but this is our
method. Regardless of who provides the training, you will find that the greatest cost and

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 66 of 70
Author/Copyright De-Soldering October 2023
 investment is in personnel. Personnel are key to the success of the whole operation. Equipment
costs are actually quite low in comparison. Why?
Modern, Up-To-Date Equipment
Repair is and may always be a highly labor intensive operation relying more on individual
operator skills than automation. Despite the availability of very good tools for repair, many in-
house repair operations are poorly equipped.
Highly Skilled Technicians
In the PC board manufacturing and assembly environment, most processes are tightly controlled
and one-directional. The technicians who run these processes have certain defined characteristics
and training. As you look deeper into the repair operation, the first thing that becomes apparent is
that an entirely different set of skills are needed by repair personnel compared to assembly
personnel. Repair skills are more specific. They require a higher degree of manual dexterity,
patience, and a thorough understanding of the repair process. There are more steps involved in
any single repair operation than the typical assembly technician would be confronted with. It
becomes a personnel issue as well as a training one. You must not only have the proper training
program, but the right people.

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 67 of 70
Author/Copyright De-Soldering October 2023
 Self-check 4.
Part I: say true or false
1. Costs of Reworking on average is equal to cost of first-time soldering.
2. Automatic Optical Inspection is suited for large batches
3. 2” nominal test joints will qualify a solderer for diameters up to 1-1/2” nominal.
Part two: choose the best answer
1. Rework tasks and procedures are:-
a. Removing bridges and solder balls
b. Desoldering SMDs
c. Filling empty joints
d. All
2. Inspection includes
a. Manual Inspection
b. AOI or Automatic Optical Inspection
c. X-Ray inspection
d. All
3. ________ is an inspection used for small batches
a. Manual Inspection
b. X-Ray inspection
c. Automatic Optical Inspection
d. all
4. Which one of the following is the correct of diameters test?
a. 3” nominal test joints will qualify a solderer for diameters up to 1-1/2” nominal.
b. 2" nominal test joints will qualify a solderer for diameters from 2" through 3" nominal.
c. 1" nominal test joints will qualify a solderer for diameters from 2" through 5" nominal.
d. 4" nominal test joints will qualify a solderer for diameters from 2" through 6" nominal.

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 68 of 70
Author/Copyright De-Soldering October 2023
 Reference
MISHIRO, K. Issues related to the implementation of Pb-free electronic solders. In
Microelectronics Reliability, 2002, 42 , p. 77.
Clyde F. Coombs, ed. Printed Circuits Handbook, Second Edition, 1979, McGraw-Hill, New
York, NY. ISBN 0-07-012608-9
Strauss, R. (1990) The Metallurgical Aspects of Corrective Soldering of Printed Circuit
Boards. Proc. 5th Intern. Conference Interconnection Technology in Electronics, DVS Report
129,
Duesseldorf, Germany, pp. 155–157 (in German). 2. Keller, J. (1989) Solder Joint Failure
Detection: Does Inspection ensure Reliability? Soldering and SMT, No. 3, October 1989, pp.
56–57. 3. Lea, C. (1990) The Harmfulness of Touching up of Cosmetically Defective
Solderjoints. Soldering and SMT, No. 5, June 1990, pp. 4–9. 4. London, J. and Ashall, D. W.
(1986) Compound
Growth and Fracture at Copper/Tin–Silver Solder Interfaces. Brazing and Soldering (UK),
No. 11, pp. 49–55. 5. Verguld, M. M. F. and Leenaerts, M. H. W. (1988) Repair of Printed
Circuit Boards carrying SMDs. Circ. World (UK), No. 2, January 1988, pp. 11–15. 6. Klein
Wassink, R. J. (1989) Soldering in Electronics, 2nd ed., Electrochem. Publ., Ayr, Scotland,
pp. 631–641.

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 69 of 70
Author/Copyright De-Soldering October 2023
 Developer’s Profile
No Name Qualification Field of Study Organization/ Mobile E-mail
(Level) Institution number
1 ZELEKE A MSc. In Manufacturing Dilla Poly College 0910411586 [email protected]
AMDINE Technology
2 Tadele Worku A MSc. In Manufacturing Asosa Poly College 0913970611 [email protected]
Technology
3 Waliyi Bena A MSc. In Manufacturing AKPTC. 0912305425 [email protected]
Technology
4 Kibire Bekele A MSc. In Manufacturing Ambo Poly College 0922221563 [email protected]
Technology
5 Mulugeta Asers B BSc. In Mechanical Nefessilk Poly College 0912355149 [email protected]
Engineering

Ministry of Labor and Skills High Reliability Soldering and Version -I

Page 70 of 70
Author/Copyright De-Soldering October 2023