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Lecture Notes in Electrical Engineering 976
Abhijit Biswas
Aminul Islam
Rishu Chaujar
Olga Jaksic Editors
Microelectronics,
Circuits and
Systems
Select Proceedings of Micro2021
Lecture Notes in Electrical Engineering
Volume 976
Series Editors
Leopoldo Angrisani, Department of Electrical and Information Technologies Engineering, University of Napoli
Federico II, Naples, Italy
Marco Arteaga, Departament de Control y Robótica, Universidad Nacional Autónoma de México, Coyoacán,
Mexico
Bijaya Ketan Panigrahi, Electrical Engineering, Indian Institute of Technology Delhi, New Delhi, Delhi, India
Samarjit Chakraborty, Fakultät für Elektrotechnik und Informationstechnik, TU München, Munich, Germany
Jiming Chen, Zhejiang University, Hangzhou, Zhejiang, China
Shanben Chen, Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai, China
Tan Kay Chen, Department of Electrical and Computer Engineering, National University of Singapore, Singapore,
Singapore
Rüdiger Dillmann, Humanoids and Intelligent Systems Laboratory, Karlsruhe Institute for Technology, Karlsruhe,
Germany
Haibin Duan, Beijing University of Aeronautics and Astronautics, Beijing, China
Gianluigi Ferrari, Università di Parma, Parma, Italy
Manuel Ferre, Centre for Automation and Robotics CAR (UPM-CSIC), Universidad Politécnica de Madrid,
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Faryar Jabbari, Department of Mechanical and Aerospace Engineering, University of California, Irvine, CA, USA
Limin Jia, State Key Laboratory of Rail Traffic Control and Safety, Beijing Jiaotong University, Beijing, China
Janusz Kacprzyk, Systems Research Institute, Polish Academy of Sciences, Warsaw, Poland
Alaa Khamis, German University in Egypt El Tagamoa El Khames, New Cairo City, Egypt
Torsten Kroeger, Stanford University, Stanford, CA, USA
Yong Li, Hunan University, Changsha, Hunan, China
Qilian Liang, Department of Electrical Engineering, University of Texas at Arlington, Arlington, TX, USA
Ferran Martín, Departament d’Enginyeria Electrònica, Universitat Autònoma de Barcelona, Bellaterra, Barcelona,
Spain
Tan Cher Ming, College of Engineering, Nanyang Technological University, Singapore, Singapore
Wolfgang Minker, Institute of Information Technology, University of Ulm, Ulm, Germany
Pradeep Misra, Department of Electrical Engineering, Wright State University, Dayton, OH, USA
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Luca Oneto, Department of Informatics, Bioengineering, Robotics and Systems Engineering, University of Genova,
Genova, Genova, Italy
Federica Pascucci, Dipartimento di Ingegneria, Università degli Studi Roma Tre, Roma, Italy
Yong Qin, State Key Laboratory of Rail Traffic Control and Safety, Beijing Jiaotong University, Beijing, China
Gan Woon Seng, School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore,
Singapore
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Germano Veiga, Campus da FEUP, INESC Porto, Porto, Portugal
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Abhijit Biswas · Aminul Islam · Rishu Chaujar ·
Olga Jaksic
Editors
Microelectronics, Circuits
and Systems
Select Proceedings of Micro2021
Editors
Abhijit Biswas Aminul Islam
Department of Radio Physics Department of Electronics
and Electronics and Communication Engineering
University of Calcutta Birla Institute of Technology
Kolkata, West Bengal, India Ranchi, Jharkhand, India
© The Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature
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Contents
v
vi Contents
xi
xii About the Editors
1 Introduction
Due to technology scaling, there is a decrease in supply voltage and other node capac-
itances for controlling the power consumption in ICs, but it increases the chance of
being vulnerable to the SET (single event transient) which can eventually increase
the probability of single event upset (SEU), which are also known as ‘Soft Errors’
[1–4]. SETs are caused due to Cosmic rays (neutrons), alpha particles originating
from extra-terrestrial rays, and packaging materials, respectively [5]. These particles
can either directly or indirectly ionize (generate electron-hole pairs) the semicon-
ductor materials like silicon substrates used in the ICs. The generated electron/hole
drifts toward the reverse-biased drain diffusion regions of NMOS/PMOS transistors
causing an increase in charge. If this extra charge is gained by the sensitive nodes it
causes voltage transients and if the amplitude and time duration of these transients
© The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd. 2023 1
A. Biswas et al. (eds.), Microelectronics, Circuits and Systems, Lecture Notes in Electrical
Engineering 976, https://doi.org/10.1007/978-981-99-0412-9_1
2 R. T. Yekula et al.
are strong enough they lead to change in the state of the node. This phenomenon is
termed as single event upset or Soft Error [5, 6].
These do not cause permanent damage, hence, they are also regarded as temporary
errors but they can potentially cause a malfunction in the circuit and, hence, protec-
tion is needed against such SET [6]. Aggressive technology scaling has placed the
transistors close to each other and due to the less spacing between transistors, more
than one transistor can be affected in a single event because of charge sharing causing
Single Event Multi-Node Upset (SEMNU), which can easily cause a malfunction in
the circuit. These SEUs are possible in both logic and memory circuits but memory
circuits are more susceptible due to their compact design, dense packing, and lack of
recovery or error masking mechanisms [7]. Various alternate circuits were proposed
in place of the standard 6T SRAM cell to have protection from SEU.
However, a differential read Quarto 10T cell was introduced in [8] which is much
robust to radiation strike compared to 6T SRAM and 1/2 rate ECC protected 6T.
Taking the time penalty also into account Quarto 10T is preferred, but the high write
failure probability is a major concern for Quarto 10T SRAM cells [8]. Therefore,
a write enhanced Quarto 12T SRAM cell was introduced to boost the write ability
compared to the Quarto 10T SRAM but with a tradeoff of large area overhead.
Later, NMOS stacked 10T SRAM cell (NS10T) and PMOS stacked 10T SRAM cell
(PS10T) were introduced but they provide only partial protection against the SEU,
i.e., either a 0–1 or a 1–0 transient is only protected according to whether the NMOS
or PMOS is used in the stacking structure [9].
In view of the above issues, this paper proposes a 12T SRAM cell, which uses
a non-differential read technique to provide a shorter read access time and higher
RSNM (read static noise margin), which makes it read upset tolerant in addition to
single event upset tolerant at the cost of slightly increased write delay.
The rest of the paper is organized as follows. Section 2 briefly describes the
prior work. Section 3 presents the proposed SRAM cell. Section 4 consists of the
simulation of SRAM cells. Section 5 provides the conclusion.
2 Prior Work
The QUCCE 10T SRAM cell proposed in [10] has two storage nodes named Q and
QN in addition to its internal node pair A and B. Each node is present between a
series of PMOS and NMOS transistors as shown in Fig. 1. Both the bit lines, namely
BL and BLB connect the two storage nodes Q and QN via NMOS access transistors
N5 and N6, respectively. These access transistors are controlled through word line
WL which is connected to the gate of these two access transistors. Considering ‘0’
is stored in the cell, the node values are as follows—A is ‘1’, Q is ‘0’, QN is ‘1’, and
B is ‘0’, respectively. With these the hold, read, and write operations are explained
as follows:
Highly Reliable PMOS Pass Transistor-Based Radiation Tolerant 12T … 3
Fig. 1 Quadruple
cross-coupled storage cells
(QUCCE) 10T SRAM cell
[10]
In this mode, the WL is grounded making sure the N5 and N6 access transistor are
switched off, the transistors P1, N2, P3, and N4 are in ‘ON’ state and N1, P2, N3,
and P4 are in ‘OFF’ state.
In this operation, initially both the bit lines BL and BLB are pre-charged to supply
voltage V DD and then WL is made high switching ON the access transistors N5 and
N6 but only N2 is in ON state and N3 is in OFF state, hence, there is a discharge
path only for BL through N5 and N2 leading to a voltage difference between BL
and BLB. With the help of a sense amplifier, read operation is carried out. During
read operation zero storing node, Q gets disturbed from its state due to the voltage
division between the resistance of N5/6 and N2/3. While the discharge of BL a
voltage bump is developed at Q, which should not be high enough to flip the state of
the cell. Hence, the N2/3 should be sized stronger than the N5/6, i.e., the cell ratio
(W N2 /L N2 )/(W N5 /L N5 ) or (W N3 /L N3 )/(W N6 /L N6 ) must be chosen properly to avoid
flipping of the cell and ensure proper read operation.
In this operation, for writing an opposite value to the already stored value, initially
the bit line associated with the node storing ‘1’ is driven to GND and the other bit
line is driven to V DD . That is, since QN was previously storing ‘1’, hence, the BLB
is grounded and BL is driven to V DD ; then WL is made high switching ON both
the access transistors. Therefore, the QN node storing ‘1’ is pulled down by BLB
4 R. T. Yekula et al.
through transistor N6 such that the potential at QN falls below the threshold voltage
(V th ) of N2 putting it in an OFF state; on the other side the BL tries to pull up the
potential of storage node Q and the cross-coupled structure of N2 and N3 transistors
amplify the difference between Q and QN aiding in flipping the stored voltages. For
this to happen, we should ensure N6 (N5) transistor is stronger compared to the
P3 (P2) so the pull-up ratio (W P2 /L P2 )/(W N5 /L N5 ) or (W P3 /L P3 )/(W N6 /L N6 ) should
be chosen properly. The cross-coupled structure of P1 (P3) and P2 (P4) helps in
amplifying the difference between Q (QN) and A (B) [10]. To pull up the potential
of node, B the P4 should be stronger than the N4 and, hence, the pull-up ratio, i.e.,
(W P4 /L P4 )/(W N4 /L N4 ) or (W P1 /L P1 )/(W N1 /L N1 ) should be chosen adequately. Since
the mobility of holes is lesser than that of free electrons a larger PMOS is required
here for proper write operation this causes more area overhead [10]. After the write
operation, the transistors P2, N3, P4, and N1 are ‘ON’ and the transistors N4, P1,
N2, and P3 are in ‘OFF’ state and, hence, the contents of the nodes are flipped to A
is ‘0’, Q is ‘1’, QN is ‘0’, and B is ‘1’, respectively.
The proposed circuit, as shown in Fig. 2, is similar to the QUCCE 10T with the
exception that PMOS transistors (P5 and P6) are used as access transistors instead
of NMOS access transistors (N5 and N6) and a separate NMOS stack containing
two NMOS transistors are used to carry out the read operation separately without
influencing the present state of the cell.
The Hold and Write operations are similar to that of QUCCE 10T SRAM cell as
explained in Sect. 2, only the read operation differs from that of the QUCCE 10T
SRAM and it is as follows:
Fig. 2 PMOS pass transistor-based radiation-tolerant 12T (PPTRT 12T) SRAM cell
Highly Reliable PMOS Pass Transistor-Based Radiation Tolerant 12T … 5
Read Operation is carried out with help of the NMOS stack connected to RBL,
which is pre-charged before the read operation is initiated. To perform read operation,
read line (RL) is activated. The lower NMOS in the stack is already in ON state due to
storage node QN, which has been assumed to hold a ‘1’ previously. Therefore, as soon
as the read line (RL) is raised high the read bit line (RBL) starts discharging through
the NMOS stack, and a sense amplifier (not shown) senses the decrease in RBL
with respect to a reference voltage. The non-differential read operation is completed
once a potential difference between the read bit line (RBL) and the reference voltage
becomes 50-mV because a sense amplifier can decipher the stored content only if
the potential difference is at least 50-mV [10]. The stacked NMOS sizing is done
conveniently as they do not influence the cell and there is no risk of flipping the
contents of the cell [10]. Hence, a higher value of RSNM is achievable, which makes
the cell robust and stable in the presence of noise thereby making the circuit highly
reliable and robust against read upset.
The transistors in a cell are to be sized in such a way that the cell content is not altered
during a read operation and the cell content is flipped during a write operation.
Phrased in a different way—read upset and write failure should not occur due to
sizing problems. Unlike QUCCE 10T, the proposed cell state is not influenced in a
read operation, hence, only write operation is considered for cell sizing. The pull-up
ratio (W P2 /L P2 )/(W P5 /L P5 ) or (W P3 /L P3 )/(W P6 /L P6 ) for a stable write operation is set
as 2 and the pull-up ratio (W P4 /L P4 )/(W N4 /L N4 ) or (W P1 /L P1 )/(W N1 /L N1 ) for ensuring
proper write operation is set to be 2.5. As the read operation does not disturb the
content of the cell, the cell ratio CR (W N2 /L N2 )/(W P5 /L P5 ) or (W P3 /L P3 )/(W P6 /L P6 )
can be taken conveniently.
This subsection describes the SEU recovery mechanism of the proposed cell referring
to Fig. 2 and with the nodes A, Q, QN, and B holding the values ‘1’, ‘0’, ‘1’, and ‘0’,
respectively. If node A is affected by a SET, the state of node A is changed from ‘1’ to
‘0’. This immediately switches N4 transistor OFF and P2 to turn ON [10]. Now both
the transistors P2 and N2 are in an ON state causing the node Q present in between
them to be in an unstable state, at the same time since N4 is OFF, node B enters into a
high impedance state so its state ‘0’ is retained. Since the P3 transistor is unaffected
and continues to be in an ON state the node QN retains its state ‘1’. Hence, the node
QN helps the node Q to regain its original state ‘0’ due to the persistent signal at the
gate terminal of transistor N2 and then node Q itself ensures that node A is brought
6 R. T. Yekula et al.
back to its original state ‘1’ as the node Q controls the transistor P1. The analysis is
similar in the case of node QN due to the symmetric cross-coupled structure of the
SRAM cell.
If node Q is affected by a SET, the node Q state is changed from state ‘0’ to ‘1’
which causes transistor N3 to switch ON and transistor P1 to switch OFF immedi-
ately, this causes node QN to be in an unstable state, simultaneously we can notice
that node A is in high impedance state and, hence, it retains its value without any
fluctuation, and in turn, it makes sure that node B’s state is also unchanged.
The read access time (T RA ) or read delay is calculated during the read operation; it
is estimated as the time from which the WL goes high to the time when BL or BLB
discharges by 50-mV from its pre-charge (V DD ) value; this difference is sufficient for
the sense amplifier to detect a successful read [10]. The estimated (T RA ) is reported
in Table 1, from which we can observe the Read Access Time (T RA ) is less in the case
of the proposed SRAM cell than the QUCCE 10T. This is because the NMOS stack
has been sized conveniently for shorter T RA since the read operation does not affect
the contents of the cell. From Fig. 3, the variation of T RA with respect to variation of
V DD for both the cells has been reported. It can be observed that the proposed PPTRT
12T SRAM cell shows 1.24× shorter read delay compared to QUCCE 10T SRAM
cell at a nominal supply voltage of 0.7 V. The spread (standard deviation) of T RA of
QUCCE 10T SRAM cell is 1.25× wider than that of the proposed cell at nominal
supply voltage 0.7 V. This implies the robustness of the proposed cell against voltage
variation compared to QUCCE 10T SRAM cell.
440
QUCCE 10T
420 Proposed 12T
400
380
(ps)
360
RA
340
T
320
300
280
260
640 660 680 700 720 740 760
V DD (mV)
Fig. 3 Variation of read access time (T RA ) or read delay with V DD is plotted for both QUCCE 10T
and the proposed 12T SRAM cells
The write access time (T WA ) or write delay is measured during the write operation. It
can be estimated as the time from when the WL line is activated to the time when the
node Q is flipped from ‘0’ to ‘1’ state [11]. Table 2 shows the comparison between
QUCCE 10T SRAM cell and the proposed PPTRT 12T cell in terms of write access
time (T WA ) and its variation with V DD . From the table, we can observe that the T WA
of the proposed cell is longer compared to QUCCE 10T SRAM cell. This is due to
the use of PMOS access transistors, which have lower drive current due to lower
mobility of holes compared to electrons in NMOS transistors in QUCCE 10T. From
Fig. 4, the variation of T WA with respect to V DD for both QUCCE 10T SRAM cell
and the proposed 12T SRAM cell can be observed.
T WA (ps) 880
860
840
820
800
780
Fig. 4 Variation of write access time (T WA ) or write delay with V DD is plotted for both QUCCE
10T and the proposed 12T SRAM cells
Static noise margin can be defined as the minimum voltage caused by the noise which
is sufficient to flip the contents of the cell [10]. It is the most extensively used design
metric for estimating the stability of the cell. The length of the side of the largest
square that can be fitted into the smallest wing of a butterfly curve gives the RSNM of
the corresponding cell. From Fig. 5, we can observe that the RSNM of the proposed
SRAM cell is higher compared to the QUCCE 10T SRAM cell (RSNM of QUCCE
10T is 80 mV and that of the proposed PPTRT 12T cell is 175 mV). Whereas in
QUCCE 10T SRAM cell the read operation affects the contents of the cell and thus
can reduce the read stability of the cell. Hence, the RSNM of the proposed cell is
2.19× higher compared to that of the QUCCE 10T SRAM cell.
SEU robustness can be analyzed using a metric called critical charge (QC ), which is
defined as the minimum charge collected at a sensitive node that can cause an upset to
the state of the cell. By using an exponential current source on the LT spice simulation
environment we can create a SET (Single Event Transient) at the sensitive node, and
using (1), we can calculate the charge that is accumulated at the sensitive node due
to the exponential current source [10]. By increasing the current through the current
source, we are increasing the charge induced at the nodes to which this source is
connected; as we increase the current steadily we can find the critical charge (QC )
of the circuit, i.e., by measuring (Q0 ) corresponding to the current which causes the
SEU using (1), where τ α and τ β are rise and fall time delay constants, respectively.
Highly Reliable PMOS Pass Transistor-Based Radiation Tolerant 12T … 9
0.7
QUCCE 10T
0.6 PPTRT 12T
0.3
0.2
0.1
0
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
Storage Node Q (V)
Fig. 5 Butterfly curve for estimating RSNM of QUCCE 10T SRAM cell and the proposed 12T
SRAM cell
Q o −t −t
I (t) = e τα − e τβ (1)
τα − τβ
The proposed 12T SRAM cell and the QUCCE 10T SRAM cell are robust against
SET (Single Event Transient) until the charge induced by the SET is less than the
critical charge (QC ). From Figs. 6 and 7 we can observe that a 1 → 0 SET at node
QN of both QUCCE 10T SRAM cell and the proposed 12T SRAM cell flip its
stored content. Extensive simulations are done using PrimeSim HSPICE, where an
exponential current source is used for mimicking the SET at node QN. The minimum
charge to flip the contents of the cell, i.e., (critical charge, QC ) in the case of QUCCE
10T SRAM cell is 2.8 pC and the QC in the case of the proposed 12T SRAM cell
is 3.3 pC. These are calculated for the 1 → 0 SET in both circuits. The proposed
PPTRT 12T SRAM cell exhibits 17.88% increase in critical charge (QC ) compared to
QUCCE 10T SRAM cell. This is because the access transistors used in the proposed
cell are PMOS unlike the NMOS transistors used in QUCCE 10T cell. The drain
diffusion regions of PMOS access transistors in PPTRT 12T are not subjected to
reverse-biased conditions, there is only a slight rise in potential beyond ‘1’ at node
QN due to the strike of energetic particle. This positive spike of potential does
not flip the cell content. In the case of QUCCE 10T SRAM cell, strike-generated
electrons are collected by the node QN due to reverse-biased condition at the drain
diffusion regions of N3 and N6 and, hence, a negative spike is generated resulting
in a possibility of SEU.
10 R. T. Yekula et al.
5 Conclusion
The proposed 12T SRAM cell is more robust against SEU caused by the energetic
particle. It shows shorter read delay and higher read static noise margin (RSNM)
compared to QUCCE 10T SRAM cell. The proposed PPTRT 12T SRAM cell exhibits
a higher critical charge compared to the QUCCE 10T SRAM cell thereby proving
its radiation hardness against energetic particles. The proposed design is, therefore,
an attractive choice as cache memory in the processor for deep-space applications.
Highly Reliable PMOS Pass Transistor-Based Radiation Tolerant 12T … 11
References
Monika Rani, G. Sai Namith, Shashank Kumar Dubey, and Aminul Islam
1 Introduction
© The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd. 2023 13
A. Biswas et al. (eds.), Microelectronics, Circuits and Systems, Lecture Notes in Electrical
Engineering 976, https://doi.org/10.1007/978-981-99-0412-9_2
14 M. Rani et al.
Fig. 1 Schematic of
writability-enhanced Quatro
(We-Quatro) SRAM cell [3]
Figure 2 shows the outline of the MPRT SRAM cell. It also consists of 12 transistors
like We-Quatro. It contains four PMOS transistors specified as MP1, MP2, MP3,
and MP4 and four NMOS transistors named MN1, MN2, MN3, and MN4. There
are four PMOS access transistors specified as MP5, MP6, MP7, and MP8. Access
16 M. Rani et al.
transistors (MP5 and MP7) control the link between BLB and the node ‘A’ and ‘D.’
Access transistors (MP6 and MP8) control the link between BL and the node ‘B’ and
‘C.’ The nodes ‘D’ and ‘C’ are redundant nodes of storage nodes ‘A’ and ‘B.’ In the
case of hold, read, and write operations, there are two kinds of storage possibilities.
For ‘0’ stored bit, the node values are A = 0, B = 1, C = 1, and D = 0. The node
values are A = 1, B = 0, C = 0, and D = 1 for the stored bit of ‘1.’ The analyses of
the nodes (A, B, C, and D) are demonstrated as follows.
Case 1 (A = 0, B = 1, C = 1, and D = 0): Assuming when node A stores ‘0,’
then MN1 and MP1 are ON and OFF, respectively. The Gate of MN1 is attached to
node B. For allowing node A to have a path to discharge to logic ‘0.’ Since node B
is at logic ‘1,’ MN4 is ON pulling node D down to logic ‘0,’ which turns MP2 ON,
raising node C to logic ‘1.’ The Gate of MP1 is attached to node C. Hence, the logic
value at node C is maintained at ‘1’ to cutoff MP1. That is, the nodes A, B, C, and D
maintain their chronological order (0, 1, 1, 0), respectively.
Case 2 (A = 1, B = 0, C = 0, and D = 1): Assuming when node A stores ‘1,’
the path of charging to V DD by the MP1 is available and the path to discharge to
the ground is cutoff. That is, MP1 and MN1 are turned ON and OFF respectively.
The Gate of MP1 is connected to node C. Since the logic value at node C is ‘0,’ it
switches MP1 ON which allows node A to charge to logic ‘1.’ Since node C is logic
‘0,’ MP4 is ON pulling node D up to logic ‘1,’ which turns MP3 OFF and since the
gate of MN3 is connected to node A, it is ON, thereby pulling down node B to logic
‘0,’ The Gate of MN1 is connected to B; hence, it is OFF. So, the logic value of node
A is maintained at ‘1.’ For any ON PMOS, its gate should be ‘0.’ That is, the nodes
A, B, C, and D maintain their chronological order (1, 0, 0, 1), respectively.
The transistor sizing of the proposed MPRT 12T SRAM cell for carrying out
Monte Carlo simulations is as follows. For a fair comparison, the (W/L) of pull-down
devices (MN1, MN3) and (MN2, MN4) are 36 nm/16 nm and 24 nm/16 nm, respec-
tively. W/L of pull-up transistors (MP1, MP3) and (MP2, MP4) are 20 nm/16 nm and
16 nm/16 nm, respectively. For successful read and write operations, access devices
are made stronger than pull-up devices and weaker in strength than pull-down devices
and for that W/L of access devices (MP5, MP6, MP7, MP8) are 24 nm/16 nm.
For a write operation, we suppose that node A is ‘0’ and node B is ‘1.’ Both the
bit lines BLB and BL are set to ‘1’ and ‘0,’ respectively. Word line (WL) goes low.
Hence, all four access transistors are ON. In these circumstances, node B is pulled
down by MP6, and node C is pulled down by MP8. They are fighting against the
weaker pull-up devices MP3 and MP2, that is, BL forcibly flip node B and C to ‘0.’
At the same time, the access transistors MP5 and MP7 help to pull up the nodes ‘A’
and ‘D,’ respectively, and the write operation is successfully performed.
In a read operation, both bit lines (BL and BLB) are precharged to V DD . We assume
that A = ‘0,’ B = ‘1,’ C = 1, and D = 0 before read operation. For carrying out read
operation, WL is lowered. MN3 and MP1 are turned OFF, and MN1 and MP3 will
be turned ON. Hence, BLB starts discharging through MP5 and MN1 because it
provides a ground path. On the other hand, BL does not discharge because there is
no conducting path to the ground. Due to discharging, BLB voltage decreases, and
when the voltage difference of both bit lines BLB and BL come to be 50 mV, a sense
amplifier (not shown) which is connected in the middle of bit lines can sense and
decipher the stored content of the cell.
Assuming that B = ‘1,’ A = ‘0,’ C = ‘1,’ and D = ‘0’ in Fig. 2, in this subsection
we analyze the SEU recovery behavior at the circuit level.
Case 1. (+ve spike at Node A): If drain diffusion region/n-well of OFF transistor
MP1 is hit by an energetic particle, it collects all the strike generated holes or positive
charge, and a positive spike is generated at node A (that is, node A changes from ‘0’
to ‘1’). Consequently, transistors MN2 and MN3 are turned ON. Although, the state
of other transistors cannot affect by a positive transient pulse. As a result, nodes B
and C remain unaffected. We know, C is a redundant node of B so it stores ‘1.’ Node
C affects the MP1. As a result, for an instant of time node, A changes its value but
after sometimes the nodal logic level is recovered.
Case 2. (−ve spike at Node B): When the drain diffusion region of ON transistor
MP3 is hit by an energetic particle, it collects all the strike generated electrons or
negative charge, and a negative spike is generated at node B (that is, node B changes
from ‘1’ to ‘0’). Consequently, transistors MN4 and MN1 are turned OFF. Although,
the state of other transistors cannot affect by a negative transient pulse. As a result,
18 M. Rani et al.
The focus of this work is to achieve a higher critical charge, which signifies improved
radiation hardness of the circuit. We carry out SPICE simulation using a 16-nm PTM
at a nominal voltage of 0.7 V for comparison with We-Quatro.
In this paper, soft error robustness is studied by estimating QCrit (critical charge).
To perform the soft error tolerance analysis, the transient injection at the B node is
simulated, by the double-exponential current source. The double-exponential current
is modeled by Jung et al. [5]
Q −t −t/
I (t) = e τ f −e τr . (1)
τf − τr
transistors do not get affected by the radiation. This is because in the case of PMOS
transistor due to the use of holes as majority charge carriers are slower and carry less
current, whereas in the case of NMOS transistor electrons are used as majority charge
carriers. Since, mobility of electron is higher than holes so it has higher conductivity
hence leading to lower Rds (dynamic resistance). Due to this even small radiation can
energizes NMOS compare to PMOS hence making PMOS as an access transistor
makes our circuit more radiation hardened.
The T RA is evaluated from the moment when the word line (WL) is activated. It
is evaluated up to when BL/BLB is dropped by 50-mV from V DD . This difference
in potential between BL and BLB can be easily detected with the help of a sense
amplifier, thereby avoiding misread. T RA shows more dependency on the I READ (read
current) flowing via access devices. The bit line capacitance and cell ratio determine
I READ [7].
In the We-Quatro bit cell, NMOS devices are used as access transistors, whereas
in MPRT cell, PMOS devices are used as access transistors. Electrons are more
mobile as compared to holes, that is why the T RA of MPRT cell is longer than the
We-Quatro. Figure 5 depicts the graph of T RA comparison between We-Quatro and
MPRT at different voltage levels. Monte Carlo simulations are run with a sample
size of 3000 for estimation of various design metrics in this work.
The required time for storing ‘0’ or ‘1’ to from the time when WL is activated
to the time when the storage node rises to 90% of its full swing from its initial low
level or when the storage node falls to 10% of its initial high level (that is, its 90%
swing) is known as T WA (write delay or write access time). Figure 6 shows the graph
of T WA comparison between We-Quatro and MPRT at different voltage levels using
3000 sample size during Monte Carlo analysis.
SRAM bit cells remain mainly in hold mode. For long data retention during hold
mode, the word line (WL) is disabled. BL and BLB are precharged, and the partial
cross-coupled inverters are tightly connected [6]. Hold power has been estimated for
both the cells varying the V DD from 630 to 770 mV. Figure 7 shows the hold power
of MPRT and We-Quatro cell. PMOSFETs exhibit an order of magnitude smaller I G
(gate leakage current) compared to NMOSFETs [8]. Therefore, the proposed design
consumes ≈ 6% lower hold power compared with that of the We-Quatro SRAM bit
cell. Total standby power or hold power is given by
PHold = VDD × Isub + Ig + IJN (3)
where leakage current includes subthreshold leakage current (I sub ), the gate leakage
current (I g ), and junction leakage current (I JN ) through device.
Static noise margin (SNM) is the minimum DC noise voltage that is required to
change the cell content [5]. It measures the stability of the cell. Figure 8 shows the
butterfly curve of RSNM. The stability of the SRAM bit cell during read mode is
determined by RSNM. The side length of the biggest square that can be inscribed
in the smaller wing of the butterfly curve is used to estimate the noise margin [9].
To estimate the noise margin initially bit lines are precharged in both bit cells. WL
is biased at supply voltage in the We-Quatro cell and in the case of MPRT, WL is
biased to the ground. Two voltage sources N1 and N2 are connected to the gate of
MN3 and MN1 to introduce the DC noise at both storage nodes A and B. N1 and
N2 voltages are swept from 0 V to V DD to calculate the voltages of storage nodes.
Estimated voltage values are used to plot the butterfly curve.
The critical strategy of our design to improve read stability (RSNM) is to decide
the cell ratio (CR) by properly sizing the access devices and the pull-down devices.
The proper dimensioning has resulted in 1.5× higher read SNM of our design in
comparison with that the existing We-Quatro bit cell.
5 Conclusion
This paper presented a new SRAM cell that is more radiation-hardened than the
We-Quatro SRAM cell. Although the We-Quatro SRAM bit cell is one of the good
radiation-hardened SRAM bit cells, by proper design and sizing of the FETs, we
could achieve improved results compared with the We-Quatro SRAM bit cell. In
addition, we compare Read Time and Write Time of MPRT and We-Quatro through
Majority PFET-Based Radiation Tolerant Static Random Access … 23
References
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CMOS circuits for soft-error tolerance. IEEE Trans. Very Large Scale Integr. (VLSI) Syst.
14(5), 514–524 (2006)
2. R. Baumann, Soft errors in advanced computer systems. IEEE Des. Test Comput. 22(3), 258–
326 (2005)
3. L.D. Trang Dang, J.S. Kim, I.J. Chang, We-Quatro: Radiation-hardened SRAM cell with
parametric process variation tolerance. IEEE Trans. Nucl. Sci. 64(9), 2489–2496 (2017)
4. S.M. Jahinuzzaman, D.J. Rennie, M. Sachdev, A soft error tolerant 10T SRAM bit-cell with
differential read capability. IEEE Trans. Nucl. Sci. 56(6), 3768–3773 (2009)
5. I.-S. Jung, Y.-B. Kim, F. Lombardi, A novel sort error hardened 10T SRAM cells for low voltage
operation, in 2012 IEEE 55th International Midwest Symposium on Circuits and Systems
(MWSCAS) (2012)
6. S. Ahmad, N. Alam, M. Hasan, Pseudo differential multi-cell upset immune robust SRAM cell
for ultra-low power applications. AEU-Int. J. Electron. Commun. 83, 366–375 (2018)
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SRAM bit-cell designs for highly reliable terrestrial applications. IEEE Trans. Circuits Syst. I
Regul. Pap. 1–11 (2018)
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in deep submicron ICs, in 52nd Midwest Symposium on Circuits and Systems—MWSCAS 2009
(2009), pp. 551–554
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soft-error issue. IEEE Trans. Device Mater. Reliab. 16(2), 172–182 (2016)
10. L.D. Trang Dang, M. Kang, J. Kim, I.-J. Chang, Studying the variation effects of radiation
hardened Quatro SRAM bit-cell. IEEE Trans. Nucl. Sci. 63(4), 2399–2401 (2016)
11. L.D. Trang Dang, D. Seo, J. Han, J. Kim, I.-J. Chang, A 28mn FDSOI 4KB radiation-hardened
12T SRAM macro with 0.6 ~ 1V wide dynamic voltage scaling for space applications, in
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12. R.C. Baumann, Radiation-induced soft errors in advanced semiconductor technologies. IEEE
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13. A. Islam, M. Hasan, Variability aware low leakage reliable SRAM cell design technique.
Microelectron. Reliab. 52(6), 1247–1252 (2012)
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Devices 59(3), 631–638 (2012)
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IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 35(4), 549–558 (2016)
16. A. Islam, M. Hasan, T. Arslan, Variation resilient subthreshold SRAM cell design technique.
Int. J. Electron. 99(9), 1223–1237 (2012)
17. A. Islam, M. Hasan, A technique to mitigate impact of process, voltage and temperature
variations on design metrics of SRAM Cell. Microelectron. Reliab. 52(2), 405–411 (2012)
Comparison of Snapback Phenomenon
and Physics in Bottom and Top Body
Contact NMOS
Abstract This paper compares the features and physics of snapback involved in
2D NMOS structures having body/substrate contact at bottom and adjacent to source
under the application of high current ramp at drain and zero gate voltage. We analyzes
the S-shaped current–voltage characteristics of two structures for understanding the
snapback phenomenon and operational window of compact memory devices. This
work also evaluates the carrier electrostatics involving the electron–hole carrier build
up and ambipolar current flow in the body of the structures. We also investigate the
formation of memory cell in the body of NMOS under zero gate bias and ramp of
high current stress at drain terminal due to bipolar turn.
1 Introduction
As we are entering into modern era of nanoscale semiconductor industry, the memory
has become one of the crucial elements for high performance integrated circuits.
Scaling of MOSFET has reached to saturation having gigantic advancements, while
semiconductor-based memories are still facing severe challenges in scaling. In stan-
dard DRAM cell, bulky capacitor accounts for considerable area which is very tough
for designer to shrink the size. The newly introduced zero capacitor RAM (ZRAM)
has only a transistor, and it does not have any capacitor that’s why it shows 1T/0C
unlike the standard DRAM cell which is having one transistor and one capacitor
shown by 1T/1C DRAM cell. Silicon on insulator (SOI)-based multi-gate device is
used for designing of snapback-based memories having bipolar transistor formed in
© The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd. 2023 25
A. Biswas et al. (eds.), Microelectronics, Circuits and Systems, Lecture Notes in Electrical
Engineering 976, https://doi.org/10.1007/978-981-99-0412-9_3
26 P. Singh et al.
body of the FET [1]. Impact ionization takes place as the drain voltage increases,
which results in generation of the majority carriers. In p-type substrate, holes moves
toward the body, and minority electrons get collected by the drain as the drain voltage
increases to cause the breakdown near the drain–body depletion region. The modi-
fied threshold voltage due to the storage of the charges provides bistability to bipolar
transistor having two states (high and low current). The ZRAM scalability has been
shown in multi-gate with 10 nm thin body [2], and it also expresses the two states of
the memory cell for bipolar transistor formed in the body of the device.
The advancement in vertical gate all around, double gate junction-less, thyristor
RAM (TRAM), silicon on insulator field effect diode RAM (SOIFED-RAM) and
zero-ionization, zero-swing FET (Z2FET) RAM has led the future generation of
the ZRAM [3–6]. Memories based on charge storage have reached to a limit of
scalability. Therefore, the concept of new memory technologies has been introduced.
These new memory technologies must have the smaller size, longer retention time,
higher performance, lower operating voltage and of course the simple structure. So far
TRAM, SOIFED-RAM and Z2FET-RAM have been analyzed to form the compact
capacitor-less snapback-based memory having better retention time and lower power
dissipation [4–7]. TRAM exhibits two stable states due to fast gate switching, and it
relies on the majority carrier concentration in the gated structure. The majority carrier
concentration due to high and low switching of the gate decides the high and low
current states in the thyristor-based RAM. Accumulation of holes (majority carriers)
in p-base thyristor shows high current level, whereas depletion of holes shows low
current level [7]. As per the newer studies, TRAM- and SOI-based FED-RAM’s high
and low current levels defined by the depletion and accumulation of majority carries
[5], which is the opposite of the previously believed studies.
The Z 2 FET-RAM is also a snapback-based memory shown by the S-shaped
hysteresis characteristics, and its high and low states are governed by the high and
low drain voltage [8]. Double gate junction-less device has also been analyzed for
bipolar snapback-based memories [9]. Previously, studied capacitor-less memories
were designed by thyristor or SOI. Insights of TRAM, SOIFED-RAM, Z2FET-RAM
and all other snapback-based memories show that the clearer conception can be
developed for the apprehension of the low and high states of the memory depending
on the carrier electrostatics. Structure of the device and switching conditions also
play an important role to decide the memory states of capacitor-less RAM cells
depending on carrier concentrations. However, bulk MOS has not been introduced in
the designing of capacitor-less memories prominently. Therefore, a better insight is
needed in designing of capacitor-less memory cell using different structures of bulk
MOS.
This research is applicable for non-planar devices like FinFets, multi-gate struc-
tures and gate all around structures (GAA). Double gate junction-less transistor and
vertical transistors are also applicable for the snapback. However, we are looking in
to the bulk NMOS as there is no comparison has been done for bottom body contact
NMOS and side body contact NMOS. Most importantly, we found many untouched
facts in this research which have never been explored in any of the research so far.
However, we are intended to do more research using the non-planar device in the field
Comparison of Snapback Phenomenon and Physics in Bottom and Top … 27
of snapback to design capacitor-less memory cells. We are more concern about bulk
oriented ZRAM as bulk technology is still formidable in the field of semiconductor
memory. These devices present new concept of capacitor-less memory as compared
to the existing 1T-DRAM.
Drain current increases rapidly due to increase in drain to source voltage. Increase
in the drain current causes onset of avalanche multiplication, wherein newly gener-
ated carriers can participate in generating more carriers causing breakdown. Hole
current is significantly increasing in substrate causing voltage drop across the resis-
tance of the substrate to forward bias the source–substrate pn junction. Due to
forward biasing of source–substrate pn junction, electrons are injected from source
to substrate giving rise to parasitic bipolar turn on. The effect of the bipolar action
shown in I D –V D characteristic (Fig. 1) is termed as snapback. In general, MOSFETs
are not operated in the snapback region, whereas it can be used at input/output of
the chips to provide ESD (electro-static discharge) protection [10]. MOS transistors
under zero gate bias are prominently used as ESD protection devices. Behavior of
snapback phenomenon is explained under zero gate bias, but carrier electrostatics
are missing [11, 12]. Gate Grounded NMOS (GGNMOS) under high current applied
at the drain terminal shows the I–V characteristic of the device in Fig. 1. Snapback
phenomenon in these devices are dependent on bipolar turn on in the body of the
device [13, 14]. Explanation of the carrier electrostatics is not clearly understood
in the previous studies. Formation of the memory cell in the body of the device
relies on snapback characteristics, and its retention time is dependent on parameters
(Fig. 1) like (V t1 , I t1 ), V h and (V t2 , I t2 ) [15–19]. These parameters are the prominent
candidates for transforming in to the circuit models. In this paper, snapback-based
capacitor-less memory using two structures of bulk MOS has been presented. We
further emphasized on analysis of snapback in top and bottom body contact bulk
MOS. The formation of the memory cells using the parameters like (V t1 , I t1 ), V h
and (V t2 , I t2 ) in bulk MOS has also been focused.
Fig. 1 Bipolar formation inside the body of NMOS under zero gate bias and stress of high current
ramp at drain showing the snapback in I–V characteristics
28 P. Singh et al.
Figure 1 shows bipolar formation in the body of NMOS at zero gate bias and high
current ramp at the drain terminal. The device simulation setup uses well calibrated
mobility model and hydrodynamic transport model. In order to capture the accu-
rate results, Fermi–Dirac model, high field saturation, avalanche generation models
and Shockley–Read–Hall recombination/generation are included for MOS operating
biases. In this paper, two structures have been simulated. Structure one has the body
contact at the bottom (Fig. 2), and the structure two has the body contact at the top
adjacent to the source contact (Fig. 3). In the both of the structures, gate terminal
is grounded, and a high current ramp has been applied at the drain terminal. In the
top body contact structure, depth of the substrate is 10 times of the gap between
midpoint of source and body contact to have better analysis of flow lines and carrier
electrostatics. The device characteristics are simulated using Sentaurus two dimen-
sional (2D) Technology Computer Aided Design (TCAD) using its default parame-
ters available in the simulator. Here, we performed 2D transient device simulations
on device structures and examined the mechanism of snapback by applying the zero
gate voltage and high current at the drain terminal.
The schematic of GGNMOS under applied high current bias at the drain is shown
in Fig. 1. This structure is the basic building block of the capacitor-less snapback-
based memories having formed BJT in the body of the structure. The drain voltage–
current characteristics have also been shown, which form the memory cell.
Substrate, source and drain terminals represent base, emitter and collector of BJT
formed in the body of GGNMOS under stress of high current at drain terminal
(Fig. 1). High voltage appears at drain terminal due to applied current ramp causes
impact ionization, which results in generation of the carriers. I–V characteristics
show (V t1 , I t1 ) as first snapback point. The generated carriers act as initiating current
as they flow in to the substrate (base), which results in bipolar transistor turn on [20].
Subsequently, collector to base voltage deceases to V h (holding voltage) due to flow
of initiating current in the base (shown in Fig. 1). The bipolar action ceases to exist
due to decrease in collector voltage caused by collector–emitter current.
The bottom body contact structures shown in Fig. 2 provide the storage of the
node, whereas top body structures shown in Fig. 3 govern the sensing of the current
presenting the two states of the memory cell formed in body of the structures. The
majority carrier holes are generated due to band to band tunneling or impact ionization
in MOS transistor [21, 22]. The generated holes stay in top body structure under zero
gate bias. Under these conditions, the vertical field under grounded gate is screened
due to majority carriers, and it has less effect on minority carriers. Current I t1 (shown
in Fig. 1) flowing through the p-substrate of the bottom body structure reads state
“1” and reads state “0” under depleted hole condition (Figs. 2 and 4), whereas in the
top body contact structure, the picture is exactly opposite [23]. In top body structure,
30 P. Singh et al.
buildup of electrons (absence of holes) represents state “1” and depletion of electron
(presence of holes) represents state “0” (Figs. 4 and 5).
The important differences between bulk and SOI-based capacitor-less memory
also between the top and bottom body bulk MOS structures are as follows:
1. Drain current flows due to majority carrier (holes) in bottom body contact,
whereas current flow is determined by electrons in top body contact GGNMOS
structure.
2. Flow of holes and electron determines the state of the memory cells.
3. Buildup of holes takes place in p-substrate bottom body contact, whereas
electrons buildup in p-substrate top body contact structure.
4. Bulk MOS can be utilized for the formation of the memory cells. Buried oxide
is not necessary.
5. Coupling of carriers plays an important role as both electron and hole presence
are crucial in determining the memory states due to bipolar turn on in the body.
Equation (1) shows the relation between the carrier generation/recombination due
to impact ionization and current gain of the device, which is manifested in Figs. 2,
3, 4 and 5.
α·M =1 (1)
Current gain α and impact ionization multiplication factor “M” maintain the
balance between formation of BJT in the body of the MOS and carrier generation–
recombination.
4 Conclusion
In this paper, the memory cell formation inside the body of the bulk MOS structure
has been explained. We found that high and low level of memory states are dependent
on BJT formed inside the MOS. We examined majority carrier (holes) accumulates in
NMOS (bottom body) structure which decides the high level of the memory cell and
absence of the holes relates to the low state of memory cell. We also demonstrated the
memory states relating to the minority carrier (electron) in the top body bulk MOS
structure. The memory state dependency related to carrier electrostatics is exactly
opposite in bottom and top body contact MOS.
Acknowledgements Authors would like to thank Special Manpower Development Program for
chip to system design (SMDP-C2SD) sponsored by Ministry of Electronics and Information Tech-
nology (MeiTy) Govt. of India and National Institute of Technology Mizoram, India, for providing
the machine and tools required to simulate the devices and carry out the research work.
References
20. P. Singh, R. S. Dhar and S. Baishya, Features of snapback in compact memory devices for
high performance integrated circuits. In 2021 Devices for Integrated Circuit (DevIC), Kalyani,
India, (2021) pp. 397–400. https://doi.org/10.1109/DevIC50843.2021.9455880
21. R. Ranica et al., A capacitor-less DRAM cell on 75nm gate length, 16nm thin fully depleted SOI
device for high density embedded memories. IEDM Technical Digest. IEEE. Inter. Electron.
Devices. Meet. San Francisco, CA, USA, (2004) pp. 277–280. https://doi.org/10.1109/IEDM.
2004.1419131
22. E. Yoshida and T. Tanaka, A capacitorless 1T-DRAM technology using gate-induced drain-
leakage (GIDL) current for low-power and high-speed embedded memory. In IEEE Trans-
actions on Electron Devices, 53(4), 692–697 (2006). https://doi.org/10.1109/TED.2006.
870283
23. R. Ranica et al., A capacitor-less DRAM cell on 75nm gate length, 16nm thin fully depleted SOI
device for high density embedded memories. IEDM Technical Digest. IEEE. Inter. Electron.
Devices. Meet. 2004., San Francisco, CA, USA, (2004) pp. 277–280. https://doi.org/10.1007/
s12633-021-01086-4. https://link.springer.com/article/10.1007/s12633-021-01086-4
A Review on Optimal Power Flow
Problem
1 Introduction
Optimal power flow (OPF) starts from generating plants, transmission lines, and
distribution lines up to the customer’s end in the power system. That is why a power
system network is a very complicated and complex network. For its complex nature,
© The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd. 2023 35
A. Biswas et al. (eds.), Microelectronics, Circuits and Systems, Lecture Notes in Electrical
Engineering 976, https://doi.org/10.1007/978-981-99-0412-9_4
36 N. Kumar et al.
planning, operation, and management of power systems are a great challenge for oper-
ators. Availability of electrical energy with quality, reliability, security, and economic
to the customers is the prime duty of the operators. The increasing load on generating
plants, establishment of new station and substation, and seasonal and climatic condi-
tion causes variation in load demand. Hence, operator must have to avoid voltage
deviation with proper maintaining voltage throughout the network as well as mini-
mized active power loss in generation, transmission, and distribution network [1, 2].
These objectives can be achieved from OPF by using reactive power compensation
devices as generator voltage setting, shunt capacitor bank, synchronous condenser,
tap changing transformer, and VAR devices while fulfilling a set of physical as well as
operating regularity and irregularity constraints. Optimal power flow (OPF) was for
the first time introduced by Carpentier in 1962 [3]. Later on, OPF was further devel-
oped by Dommel and Tinney [1]. A first survey related to optimal power flow was
presented by Happ [4] and after that IEEE working group [5] given a bibliography
survey of economic security functions in 1981. Carpentier [6] presented a survey
and classified the OPF algorithm according to their solution methodology in 1985.
Chowdhury and Rahman [7] presented a survey on economic dispatch problems in
1990. Momoh et al. [8] presented a review on some selected OPF techniques in 1999.
Pandya and Joshi [9] given a survey on traditional and artificial intelligence optimiza-
tion methods in 2008. This OPF problem is classified into two subcategories. The
first is recognized as economic load dispatch (ELD), and the second is recognized as
optimum reactive power dispatch (ORPD). The subcategories of the OPF problem
are given in Fig. 1.
Improvement of Voltage
Optimal Reactive Profile
Power Dispatch
(ORPD)
Enhancement of Voltage
Stability
The main task of the OPF problem is the solving of complicated and non-continuous
functions by nourishing both equality and inequality constraints. Control variables
for OPF problems are alternator voltage, transformer tapping, and reactive power
delivered by reactors and capacitors.
∑
N
| |
F1 = MinFuelcost = α j + β j PG j + γ j PG2 j + |e j sin f j (PGMin
j − PG j )
| (1)
j=1
where ak, bk, εk, and δk are the emission coefficients of k th generating unit.
Minimization of Active Power Losses
∑
N
[ ]
F3 = MinPowerLoss = G B (VK )2 + VL2 − 2VK VL cos θKL (3)
B=1
sp
b = Bus number, VMb = Actual bus voltage, VMb = Specific bus voltage, N = Number
of load bus
38 N. Kumar et al.
A quadratic function
where Pgk is the active power output of gk and a, b, and c are cost coefficients.
2.2 Constraints
The OPF needs to satisfy with power balance and with system operational limits.
These constraints are divided into two categories, i.e., equality constraints and
inequality constraints.
Equality Constraints
Equality constraints are generally shown by power balance equations which ensure
that total power generation must satisfied total load demands and power loss in
transmission lines.
Active Power Flow Balance Equation
∑
Pgs − PLs − Vs Vk (gsk cos θsk + Bsk sin θsk ) = 0 (7)
k∈Ns
A Review on Optimal Power Flow Problem 39
gs ≤ Q gs ≤ Q gs , s ∈ Ng
Q Min Max
(10)
cj ≤ Q cj ≤ Q cj ,
Q Min j ∈ Nc
Max
(11)
S J ≤ S Max
j (13)
where S Max
j = Maximum value of apparent power of jth line.
40 N. Kumar et al.
The OPF problem aims to set up a network with proper planning at minimum cost
for satisfying desired objectives. First of all, it is required to define system data, allo-
cation of generators, and reactive power sources [10]. After that control variables are
optimized to find out certain objective functions considering equality and inequality
constraints. Control variables include terminal voltages of generator bus, reactive
power generation of VAR sources, and transformer tapping [11]. The dependent vari-
ables include voltage magnitude of load bus, active power generation at stack bus,
power flows through transmission lines, and reactive power output of the generators
(Fig. 2).
4 Challenges in OPF
SVEITSILÄISLAMPI
"Mikä?"
"Sen saatte kuulla. Hän on juuri saanut tietää, että mainio voittaja,
herra de Suffren, saapuu tänä iltana, ja kun se on tärkeä uutinen, ei
hän suo teidän siitä saavan tietoa."
"Mikä?"
"Kuninkaalle on jo ilmoitettu."
"Tekö ilmoititte?"
"Mitä varten?"
"Välittämään lainaa."
"Miksi niin?"
"Olkoon niin; minun on siis myös pidettävä huolta siitä, että keksin
jonkin valtiosalaisuuden."
"En."
"Hyvästi siis!"
"Milloin?"
"Tänä iltana."
"Minkä vuoksi?"
Filip poistui siis, ja parooni näki hyvillä mielin, että Artoisin kreivi
sanoi jäähyväiset kuningattarelle.
Tämä istuutui rekeen ja otti Andréen viereensä, ja kun kaksi
kookasta palvelijaa kiirehti työntämään rekeä, sanoi kuningatar:
"En tiedä, mistä olen saanut päähäni, että te luistelette yhtä hyvin
kuin Saint-Georges."
KIUSAAJA
Ja hän astui taas rekeen. Filip odotti turhaan käskyä. Silloin tarjosi
parikymmentä aatelismiestä palvelustaan.
"Hiljaa, hiljaa."
"Tuonneko?"
"Niin, kuningattaren luo."
"Miksi ei? Miksi kiitos vaan? Oletko hullu? Etkö tahdo takaisin
kuningattaren luo?"
"Vai ei käy päinsä! Etkö voi palata kuningattaren luo, joka odottaa
sinua?"
"Ikävöi minua!"
"Mikä varmuus?"
"Taikka…"
"Anteeksi, isäni, taikka olette tulemassa hulluksi."
Ukko tarttui nyt poikaansa käsivarteen niin rajusti, että nuori mies
rypisti kipeäntunteesta kulmakarvojaan.
"Eikä alamaisia."
"Minulla näet on se pelko, että sinä olet hölmö, poikani, eikä se ole
luvallista tuonnäköiselle kookkaalle veitikalle. Katso nyt tuonne!"
"Katson kyllä."
"Entä sitten, isäni, vaikka olisikin totta, mikä ei ole luultavaa, että
kuningatar etsii juuri minua?"
"Mitä?"
"Asia on se, että sinä tulet Amerikasta, jonne olit lähtenyt siihen
aikaan, kun oli vain kuningas, mutta ei kuningatarta, ellei oteta
lukuun rouva Dubarryta, jollainen majesteetti ei juuri herätä
kunnioitusta. Sitten palaat, näet kuningattaren ja tuumit:
kunnioittakaamme häntä."
"Epäilemättä."
"Totta vie! Mitä kuninkuus on? Kruunu, eikä siihen kajota, hornan
nimessä! Mitä on kuningatar? Nainen, niin juuri, nainen, ja siihen
kajotaan."
"Sinä et sitä usko, tietysti et. No hyvä, —" sanoi ukko matalalla,
ilkeällä äänellä, hymähtäen riettaasti, "kysy herra de Coignylta, kysy
herra de Lauzunilta, kysy herra de Vaudreuililta."
"Mokomakin uutinen!"
"Puhun sittenkin."
SUFFREN
"Kas niin, rakas käly", vastasi prinssi yhä nauraen, "te vähäksytte
meidän valtioviisauttamme. Hän on kyllä mennyt Fontainebleaun
tulliportille tapaamaan sankariamme, se on totta, mutta meidän
puolestamme on joku odottamassa samaa sankaria Villejuifin
kievarissa."
"Todellako?"
"Mainiosti keksitty!"
"Ei ainakaan huonosti, ja siitä olenkin itseeni tyytyväinen.
Ruvetkaa nyt pelaamaan, kälyni!"
Filip, joka sai ottaa osaa tähän peliin ja istui vastapäätä sisartaan,
nautti yhtaikaa kaikilla aisteillaan tästä tavattomasta, huumaavasta
suosiosta, jolla häntä odottamatta hyväiltiin.
"Kuuntelen."
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