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ADHESIVES IN
MANUFACTURING
MANUFACTURING ENGINEERING
AND MATERIALS PROCESSING
S E R I E S ED I TO R S
Adhesives in manufacturing.
MARCEL DEKKER
270 Madison A ven u e, New York, New York 10016
John R . Adams, B . S . , M .E .
Director of Education, Training D ivi
sion , Binks Manufacturing* Company, Franklin P a rk , Illinois
*Retired
v
vi C o n trib u tors
Jan V . L in d y b e rg , B .S ., M .S .
Technical Marketing Specialist, RTV
Products Department, General Electric Company, Silicone Products
Division, W aterford, New York
J . Dean M in fo rd , B . S ., M. L i t t ., Ph. D.
Scientific Associate, Product
and Process Engineering Division, Alcoa Laboratories, Alcoa Center,
Pennsylvania
^Retired
C o n trib u tors vii
Edmund J. Y aro c h , B .C h E .
Laboratory Manager, Automotive, Con
struction and Convenience Packaging Products Laboratory, A dhesives,
Coatings and Sealers Division, 3M Company, St. Paul, Minnesota
Present affiliations
♦Senior Research Chemist, Specialties Technology D ivision, Exxon
Chemical Company, Baton R ouge, Louisiana
fMarketing D irector, Barnes Drill Company, R ockford, Illinois
$ Section Leader, Research and Development, Weyerhaeuser Company,
Tacoma, Washington
Contents
Preface
C o n trib u to rs
F UN DA M E N TA LS
2. Surfaces
Donald H. Buckley
TYPES OF A DH ESIVES
BONDING P R A C T IC E
PERFORMANCE, D U R A B I L I T Y , A ND T E S T IN G
26. Adhesives and the S ta n d a rd iza tio n Program Within the 649
D epartm ent o f Defense (D O D )
Richard Chait and Edward T. Clegg
In d ex 671
FUNDAMENTALS
1
Adhesive Concepts and Terminology
I. Introduction 4
II. Surfaces 4
III. Adhesion 5
IV. Wetting* 5
V. Bond Strength 5
V I. Fatigue Life 6
V II. Heat Limitations 6
V III. Debonding 6
IX. Unstressed A gin g Data 6
X. Nondestructive Testing 7
X I. Expansion Coefficients 7
X II. Creep 7
X III. Thermoplastic 8
XIV. Thermosetting 8
XV. Surface Conversion 8
XVI. Scanning Electron Microscopy
X V II. Pot Life 8
X V III. Viscosity 9
XIX. Thixotropy 9
XX. Glass Transition Temperature
XXI. Shelf Life 9
X X II. Curing 9
X X III. Sag Resistance 10
XXIV. Resin 10
XXV. Polymer 10
XXVI. Mold Release Agent 10
XXVII. Outgassing 10
X X V III. Curing Agent 11
XXIX. Hardener 11
XXX. Filler 11
XXXI. Adhesive Failure 11
XXXII. Cohesive Failure 11
3
4 Schneberger
I. IN T R O D U C T IO N
II. SURFACES
Surfaces are complex and dynamic. They are never flat despite the
best attempts at polishing. Industrially bonded surfaces often have a
surface roughness of 50—100 microinches (12,700—25,400 ym) or more.
Rough surfaces are neither automatically good nor bad for bond
ing. The smoother the su rface, the fewer crevices and microvoids are
present to retain trapped air and prevent good contact of the adhe
sive with the su rface. On the other hand, a rough surface provides
more actual surface area for contact with the adhesive and may even
allow some mechanical interlocking as the adhesive solidifies in cracks
and crevices.
The most important property o f a su rface, as far as bonding is
concerned, is cleanliness. Unless surfaces are clean , that i s , free of
loosely held foreign material, the bond may fail unexpectedly and/or
at low loads for no apparent reason. Typical surface contaminants
include d ir t , o il, grease, mold release, oxid es, moisture, gases , and
lubricants.
Surfaces are dynamic in the sense that their chemical composition
is frequently subject to change with time. Some metals may oxidize
(corrode) by reacting with atmospheric moisture and oxygen which
permeate the bondline. Occasionally, plastic surfaces may become
coated with chemicals that migrate from the interior of the part or
which reach the surface from the external atmosphere by diffusion
through the bondline. In either case, a competition for attachment to
the surface develops between the adhesive and the newly arrived
chemical. Strong, long-lasting adhesives are generally those whose
chemical structure is such that they can compete favorably for surface
attachment sites with other chemicals which may find their way to the
surface.
Surfaces also have a different composition than might ordinarily
be expected. Most commonly, bonded metal surfaces e x is t, not as free
metals, but as hydrated metal oxid es. Freshly milled aluminum su r
faces , for example, begin forming a transparent oxide layer immedi
ately when exposed to the atmosphere. Iron and ferrous alloys do
likewise. Applying adhesives to a metal-oxide surface is not neces
sarily bad. I f the metal oxide is tigh tly bound to the metal and is co
Adhesive Concepts and Terminology 5
III. ADHESION
IV . W ETTING
VI. F A T IG U E LIFE
V II. HEAT L I M IT A T I O N S
V III. DEBONDIN G
Debonding is the process by which an adhesive looses its attachment
to a su rface. Debonding usually occurs when water or some other
chemical displaces the adhesive from surface attachment sites. The
process is usually a gradual one although it may not be noticed until
the adhesive and the adherend separate completely, and a catastroph
ic failure resu lts.
IX . UNSTRESSED AG ING D A T A
X. N O N D E S T R U C T IV E T E S T IN G
XL EXPANSION C O E F F IC IE N T S
XII. CREEP
The tendency of any material to undergo a permanent change in di
mension when subjected to mechanical stress is known as cre ep .
Creep is particularly a problem with thermoplastic polymers. The ten
dency of a material to creep results primarily from the flexibility of its
molecular segments. Creep may often be retarded or reduced to an
acceptable level with fillers or small amounts o f crosslinking.
8 Schneberger
X III. T H E R M O P LA S T IC
X IV . T H E R M O S E TT IN G
Plastics which do not deform readily under load and which resist solu
tion in nearly all solvents are called thermosetting. The molecular
chain segments of thermosetting materials are chemically bound to one
another (crosslinked) in such a fashion that it is difficult for segments
to move independently. In e ffe c t, the chain segments lock each other
in place, and permanent deformation is difficult or impossible at ord i
nary temperatures. Solvents are also unable to dissolve thermosetting
resins.
X V I. S C A N N IN G ELECTRON MICROSCOPY
X V I I . POT LIFE
pot life has been exceeded, the viscosity of the formulation becomes
so great that spreading and wetting is d ifficu lt.
XVIII. V IS C O S IT Y
Viscosity is the ability of a liquid to resist flow . In practical term s,
solutions o f high viscosity are difficult to stir, pump, and spray.
Low-viscosity formulations, on the other hand, may be excessively
runny and difficult to apply uniformly to vertical surfaces. This
problem is often solved through the addition o f thixotropic materials.
X IX . T H IX O T R O P Y
A temporary decrease in viscosity upon stirrin g is called th ixotropy.
In more technical term s, it is accurate to say that the viscosity of
thixotropic materials is shear-rate dependent. Thixotropic additives
are often used to give an adhesive enough body to resist sagging on
vertical surfaces and yet become runny enough to flow easily under
the stress of brushing, rolling, or spraying during application.
X X II. CURING
Curing is the process during which an adhesive changes from a liquid
to a solid. Classically, curing means the formation of a crosslinked
polymer film. More loosely, the term is sometimes used to describe
10 S c h n e b e rg e r
any method of forming a solid adhesive film , including solvent loss and
linear polymerization.
XXI Ve RESIN
XXV. POLYMER
The plastic-like material which forms the bulk o f most adhesive films is
a polymer. Polymers are made by the repetitive joining o f many small
chemical units (m olecules). The resulting high molecular weight ma
terial is known as a polym er. Most o f the bulk properties of an adhe
sive material, such as heat resistance and tensile strength, are p r i
marily due to the nature o f the polymer used in the adhesive.
XXVII. OUTGASSI NG
Outgassing is the formation of gas bubbles in an adhesive film while it
is curing. This generally undesirable situation may arise because
gaseous products are formed while the adhesive cures or because cur
ing conditions, such as temperature, may cause bubbles o f dissolved
air to be released. In general, severe outgassing should be avoided.
Adhesive Concepts and Terminology 11
XXVIII. C UR IN G A G E NT
Curing agents are chemicals which react with an adhesive to form a
solid adhesive film . Curing agents are generally used in much larger
amounts than catalysts. They may be considered coreactants with the
adhesive resin since they are consumed during the curing reaction.
X X IX . HARDENER
XXX. F IL L E R
X X X I. A D H E SIVE F A IL U R E
I . Introduction 13
I I . Surface Profile 14
I I I . Crystalline Structure 19
IV. Chemistry of Surfaces 21
A . Chemisorption 26
B . Compound formation 27
C . Metallurgical effects 28
V. Surface Film Effects 29
V I . Characterization o f Surfaces 31
A . Microscopy 31
B . Etching 32
C . Analytical surface tools 33
D. Adhesion 44
References 49
h IN T R O D U C T IO N
13
14 Buckley
The surfaces of the asperities are not atomically clean but contain
surface films (F ig . l b ) . For metals and alloys these films generally
consist of oxides and adsorbed gases— usually water va p o r, carbon
monoxide, and carbon dioxide. With many nonmetals the surface films
may simply consist o f other adsorbates. All o f the reacted and ad
sorbed film materials can exert a strong effect on the mechanical and
metallurgical behavior of the solids to which they adhere, as indicated
by the collection of papers appearing in Westwood and Stoloff [2] .
In addition to the films present on the surface of a solid, the
surficial (near surface) layers of the solid itself may vary consider
ably in structure from the bulk of the solid. With crystalline solids
these layers may consist of recrystallized material, strain hardened
region s, and/or textured region s. These surficial layers develop
when any type of finishing or polishing of the surface is done, par
ticularly when that surface is a metal. These layers can also be a re
gion rich in bulk impurities [ 3] . In amorphous solids these layers may
contain voids and microcracks.
(b) Ground
(c) Lapped
(a)
(b)
(c)
<d)
{100} *1 no I {III}
Fig. 5. Ion beam etched silver crystal surfaces with normally incident
A r + at 8 k e V ; dose 7 x 1018 ions.
Surfaces 19
III. C R Y S T A L L IN E S T R U C T U R E
The crystal structure of ideal surfaces for most practically used ma
terials is generally one of three major ty p e s : body-centered cubic,
face-centered cu bic, or close-packed hexagonal. All engineering
surfaces vary from these ideal structu res. Most real surfaces have
grain boundaries which develop during the solidification of crystal
line solids. These grain boundaries are, in a strict sense, defects
which exist in the bulk solid and extend to the surface. They are
atomic bridges linking the crystal structure of the two adjacent grains.
Because of their role they do not possess a regular stru ctu re; they
are highly active and are ve ry en ergetic. Grain boundaries are large
d efects, readily observable on real surfaces. In addition to these
there a re , however, many lesser defects that may ex ist. These in
clude subboundaries , twins , dislocations, interstitials , and vacancies.
Subboundaries are low-angle grain boundaries where only a
slight mismatch in the orientation of adjacent grains occurs. When the
crystal lattices of the adjacent grains are not parallel but are slightly
tilted one toward the o th er, the defect is referred to as a tilt bound
ary . When the lattices are parallel, but one is rotated about a simple
erystallographie axis relative to the other with the boundary being
normal to this a xis, the defect is a twist boundary.
The twin boundary occurs where there is only a degree or two o f
mismatch between the twins with the twins being mirror images of each
other. They are frequently seen on the basal planes o f hexagonal
metals with deformation.
Dislocations are atomic line defects existing in crystalline solids.
They may actually be in the subsurface and terminate with one end at
the surface or they may be in the surface. There are those disloca
tions that are entirely along a line where an extra half plane o f atoms
exists; these are called edge dislocations. In addition, there are
screw dislocations that form along a spiral dislocation line. A screw
dislocation can be seen on the surface as a wedge of atoms which is
the terminus of the spiral. The small-angle boundaries or subbounda
ries referred to earlier are generally composed of edge dislocations.
It is the presence of these defects which cause crystalline solids to
deviate so markedly from theoretical strength.
Some of the crystalline defects that may be found on a solid su r
face are presented schematically in Fig. 6 . The vacant lattice site
(F ig . 6 a) is simply the absence of one atom from a crystal lattice site.
The interstitial (also shown in Fig. 6 a) is an extra atom crowded into
the crystal lattice. Edge and screw dislocations are shown in Fig. 6 b,
and the small-angle boundary in Fig. 6 c.
Mechanically finished surfaces generally have undergone a high
degree o f strain and thus may contain a large amount o f lattice dis
tortion which generates high concentrations of dislocations. While the
initial presence of dislocations causes a reduction in strength, their
Buckley
o o o o
o o o o
(a)
(b)
(c)
Surface
F ig . 8. Surface atoms (schem atic). Since these atoms are not entirely
surrounded by others, they possess more energy than internal atoms.
• SOLUTE
O SOLVENT
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RECONSTRUCTION SEGREGATION
(a) (b)
0 0 0 0 © ® ®
□ EJ 0 □ □
□ 0 □
0
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(b)
1s
(b)
(a)
Binding energy, eV
A. Chem isorption
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o% o% o% o l o U
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CHEMISORPTION COMPOUND
FO RM A TIO N
B. Compound Formation
stance with its own prop erties. Unlike chemisorption, which is simply
a monolayer process, constituents from the environment can react with
the solid surface by diffusion of the solid surface material into the
compound and diffusion of the environmental species into the film .
The compound can continue to thicken on the surface i f the film is po
rous and allows for the two-way diffusion to occur (Fig1. 1 2 ).
An example of the formation of a porous compound on a surface is
the ru s t, or iron o xid e, produced in the oxidation of iron in a moist
air environment. The oxidation process will continue to consume the
iro n . In contrast, the oxidation of aluminum to form aluminum oxide
results in the formation of a th in , dense oxide which, because of the
film?s d en sity, retards diffusion and further growth.
Co M etallurgical Effects
V I. C H A R A C T E R IZ A T IO N OF SURFACES
A. Microscopy
ring represents the layer of atoms next nearest to the surface. The
field ion microscope is so sensitive that it can be used to detect the
absence of a single atom from the surface or, con versely, the presence
of an extra or a foreign atom.
In recent years the atom probe has been developed for the deter
mination of single-atom chemistry. When used in conjunction with the
field ion microscope, the atom probe can not only characterize the
structural arrangement of individual atoms in a solid su rface, but also
determine the chemistry of an individual atom present in the surface.
B. Etching
The energy of these surfaces will v a r y , and they w ill, therefore, react
at differin g rates with a particular chemical agen t. T h u s, in a crude
way, one can distinguish the more atomically dense surface planes
from the less dense. The more dense planes have lower surface en er
gies and, th erefore, will not be as readily attacked as the less dense
planes.
Etching can b e , and has b een , v e ry effectively used as a techni
que for revealing grain boundaries in metals. Grain boundaries are
sites o f higher energy than the surfaces of the individual grains and,
th erefore, they will be preferentially attacked. Furthermore, d iffe r
ent phases in alloys will etch differently at the surface. The chemical
reagents for such etching are available in standard metallurgical hand
books .
In addition to identifying orientation, grain boundaries, and
phases, etchants can be used to identify atomistic defects such as d is
locations , the atomic line defects in crystalline materials referred to
earlier. The proper etchant can not only indicate the concentration of
dislocations at the su rface, but also reveal their locations. Further
more , etchants reveal the atomic plane upon which a dislocation lie s .
A wealth of useful information can be acquired about a surface
by the use of the optical microscope and etching techniques. The use
o f simple, chemical spot tests in conjunction with the foregoing can
provide insight into the chemistry of the solid surface. These tests
require the use o f readily available chemical reagents which, when ap
plied to the su rface, will reveal the metallic element present in the
su rface. Many standard college chemistry textbooks on inorganic
qualitative analysis list the required materials.
The chemical spot test can be used to detect adhesive transfer to
surfaces where dissimilar materials are in contact. A permanent pat
tern of an element’s distribution on a surface can be obtained i f a
porous p a p er, such as filter pap er, is impregnated with the chemical
rea gen ts. The paper is pressed against the surface to be analyzed;
then the paper is moistened. A map of the location of the elements
thus appears on the paper.
The field ion microscope and the atom probe have already been dis
cussed . These tools have been used in adhesive studies to character
ize surfaces before and after adhesive contacts.
A host o f analytical tools has been developed in recent years to
characterize the real nature o f solid surfaces. Some operate on the
principle of atomic arrangement in the surface layers of crystalline
solids. One such device is LEED. This surface tool can be very use
ful to those interested in surfaces. It analyzes, by an electron dif-
34 Buckley
(c)
Language: Finnish
KAFFE JA TUPAKKI
Kirj.
Imprimatur: C. A. Sanmark.
Kaffepuu.
Tupakki.
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