32-Bit

Microcontroller

TC1793
32-Bit Single-Chip Microcontroller

Data Sheet
V 1.1.1 2012-12

Microcontrollers
Edition 2012-12
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2012 Infineon Technologies AG
All Rights Reserved.

Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.

Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).

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Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
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be endangered.
32-Bit
Microcontroller

TC1793
32-Bit Single-Chip Microcontroller

Data Sheet
V 1.1.1 2012-12

Microcontrollers
 TC1793

Table of Contents
1 Summary of Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
2 System Overview of the TC1793 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-8
2.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9
3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-11
3.1 TC1793 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-12
4 Identification Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-85
5 Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-87
5.1 General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-87
5.1.1 Parameter Interpretation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-87
5.1.2 Pad Driver and Pad Classes Summary . . . . . . . . . . . . . . . . . . . . . . . 5-88
5.1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-89
5.1.4 Pin Reliability in Overload . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-91
5.1.5 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-93
5.1.5.1 Extended Range Operating Conditions . . . . . . . . . . . . . . . . . . . . . 5-97
5.2 DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-100
5.2.1 Input/Output Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-100
5.2.2 Analog to Digital Converters (ADCx) . . . . . . . . . . . . . . . . . . . . . . . . 5-118
5.2.3 Fast Analog to Digital Converter (FADC) . . . . . . . . . . . . . . . . . . . . . 5-123
5.2.4 Oscillator Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-127
5.2.5 Temperature Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-128
5.2.6 Power Supply Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-129
5.2.6.1 Calculating the 1.3 V Current Consumption . . . . . . . . . . . . . . . . 5-132
5.3 AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-134
5.3.1 Testing Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-134
5.3.2 Power Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-135
5.3.3 Power, Pad and Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-137
5.3.4 Phase Locked Loop (PLL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-139
5.3.5 ERAY Phase Locked Loop (ERAY_PLL) . . . . . . . . . . . . . . . . . . . . . 5-142
5.3.6 JTAG Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-143
5.3.7 DAP Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-145
5.3.8 Micro Link Interface (MLI) Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 5-146
5.3.9 Micro Second Channel (MSC) Interface Timing . . . . . . . . . . . . . . . 5-149
5.3.10 SSC Master/Slave Mode Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-151
5.3.11 ERAY Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-153
5.3.12 EBU Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-155
5.3.12.1 BFCLKO Output Clock Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-155
5.3.12.2 EBU Asynchronous Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-155
5.3.12.3 EBU Burst Mode Access Timing . . . . . . . . . . . . . . . . . . . . . . . . . 5-163

Data Sheet I-1 V 1.1.1, 2012-12

 TC1793

5.3.12.4 EBU Arbitration Signal Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-166

5.4 Flash Memory Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-167
5.5 Package and Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-169
5.5.1 Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-169
5.5.2 Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-170
5.5.3 Quality Declarations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-170
6 History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1

Data Sheet I-2 V 1.1.1, 2012-12

 TC1793

Data Sheet 3 V 1.1.1, 2012-12

 TC1793

Data Sheet 4 V 1.1.1, 2012-12

 TC1793

Summary of Features

1 Summary of Features
The SAK-TC1793F-512F270EF / SAK-TC1793F-512F270EB has the following
features:
• High-performance 32-bit super-scalar TriCore V1.6 CPU with 6-stage pipeline
– Superior real-time performance
– Strong bit handling
– Fully integrated DSP capabilities
– Multiply-accumulate unit able to sustain 2 MAC operations per cycle
– Fully pipelined Floating point unit (FPU)
– 270 MHz operation at full temperature range
• 32-bit Peripheral Control Processor with single cycle instruction (PCP2)
– 16 Kbyte Parameter Memory (PRAM)
– 32 Kbyte Code Memory (CMEM)
– 200 MHz operation at full temperature range
• Multiple on-chip memories
– 4 Mbyte Program Flash Memory (PFLASH) with ECC
– 192 Kbyte Data Flash Memory (DFLASH) usable for EEPROM emulation
– 2 x 8 Kbyte Key Flash
– 128 Kbyte Data Scratch-Pad RAM (DSPR)
– 16 Kbyte Instruction Cache (ICACHE)
– 32 Kbyte Instruction Scratch-Pad RAM (PSPR)
– 16 Kbyte Data Cache (DACHE)
– 128 Kbyte Memory (SRAM)
– 16 Kbyte BootROM (BROM)
• 16-Channel DMA Controller
• 8-Channel Safe DMA (SDMA) Controller
• Sophisticated interrupt system with 2 × 255 hardware priority arbitration levels
serviced by CPU or PCP2
• High performing on-chip bus structure
– 64-bit Cross Bar Interconnect between CPU, Flash and Data Memory
– 32-bit System Peripheral Bus (SPB) for on-chip peripheral and functional units
– One bus bridge (SFI Bridge)
• Versatile On-chip Peripheral Units
– Two Asynchronous/Synchronous Serial Channels (ASC) with baud rate generator,
parity, framing and overrun error detection
– Four High-Speed Synchronous Serial Channels (SSC) with programmable data
length and shift direction
– Four SSC Guardian (SSCG) modules, one for each SSC
– Two serial Micro Second Bus interfaces (MSC) for serial port expansion to external
power devices
– Two High-Speed Micro Link interfaces (MLI) for serial inter-processor
communication

Data Sheet 1 V 1.1.1, 2012-12

 TC1793

Summary of Features

– One External Bus Interface (EBU) supporting different memories: asynchronous

memories e.g. SRAM, peripheral devices; synchronous devices e.g. burst NOR
flash, PSRAM; and DDR NOR flash e.g. LPDDR-NVM (Jedec 42.2), ONFI 2.0
(limited frequency at 1.8 V I/O supply)
– One MultiCAN Module with 4 CAN nodes and 128 free assignable message
objects for high efficiency data handling via FIFO buffering and gateway data
transfer (one CAN node supports TTCAN functionality)
– One FlexRayTM module with 2 channels (E-Ray).
– Two General Purpose Timer Array Modules (GPTA) with additional Local Timer
Cell Array (LTCA2) providing a powerful set of digital signal filtering and timer
functionality to realize autonomous and complex Input/Output management
– Two Capture / Compare 6 modules
– Two General Purpose 12 Timer Units (GPT120 and GPT121)
• 44 analog input lines for ADC
– 4 independent kernels (ADC0, ADC1, and ADC2)
– Analog supply voltage range from 3.3 V to 5 V (single supply)
• 4 different FADC input channels
– channels with impedance control and overlaid with ADC1 inputs
– Extreme fast conversion, 21 cycles of fFADC clock
– 10-bit A/D conversion (higher resolution can be achieved by averaging of
consecutive conversions in digital data reduction filter)
• 8 digital input lines for SENT
– communication according to the SENT specification J2716 FEB2008
• 221 digital general purpose I/O lines (GPIO)
• Digital I/O ports with 3.3 V capability
• On-chip debug support for OCDS Level 1 (CPU, PCP, DMA, On Chip Buses)
• Dedicated Emulation Device chip available (TC1793ED)
– multi-core debugging, real time tracing, and calibration
– four/five wire JTAG (IEEE 1149.1) or two wire DAP (Device Access Port) interface
• Power Management System
• Clock Generation Unit with PLL and PLL_ERAY
• Flexible CRC Engine (FCE)
– IEEE 802.3 CRC32 ethernet polynomial: 0x82608EDB (CRC kernel 0)
– CRC32C Castagnoli: 0xD419CC15 (CRC kernel 1)
The SAK-TC1793F-512F200EB / SAK-TC1793F-512F200EF has the following
features:
• High-performance 32-bit super-scalar TriCore V1.6 CPU with 6-stage pipeline
– Superior real-time performance
– Strong bit handling
– Fully integrated DSP capabilities
– Multiply-accumulate unit able to sustain 2 MAC operations per cycle
– Fully pipelined Floating point unit (FPU)

Data Sheet 2 V 1.1.1, 2012-12

 TC1793

Summary of Features

– 200 MHz operation at full temperature range

• 32-bit Peripheral Control Processor with single cycle instruction (PCP2)
– 16 Kbyte Parameter Memory (PRAM)
– 32 Kbyte Code Memory (CMEM)
– 200 MHz operation at full temperature range
• Multiple on-chip memories
– 4 Mbyte Program Flash Memory (PFLASH) with ECC
– 192 Kbyte Data Flash Memory (DFLASH) usable for EEPROM emulation
– 2 x 8 Kbyte Key Flash
– 128 Kbyte Data Scratch-Pad RAM (DSPR)
– 16 Kbyte Instruction Cache (ICACHE)
– 32 Kbyte Instruction Scratch-Pad RAM (PSPR)
– 16 Kbyte Data Cache (DACHE)
– 128 Kbyte Memory (SRAM)
– 16 Kbyte BootROM (BROM)
• 16-Channel DMA Controller
• 8-Channel Safe DMA (SDMA) Controller
• Sophisticated interrupt system with 2 × 255 hardware priority arbitration levels
serviced by CPU or PCP2
• High performing on-chip bus structure
– 64-bit Cross Bar Interconnect between CPU, Flash and Data Memory
– 32-bit System Peripheral Bus (SPB) for on-chip peripheral and functional units
– One bus bridge (SFI Bridge)
• Versatile On-chip Peripheral Units
– Two Asynchronous/Synchronous Serial Channels (ASC) with baud rate generator,
parity, framing and overrun error detection
– Four High-Speed Synchronous Serial Channels (SSC) with programmable data
length and shift direction
– Four SSC Guardian (SSCG) modules, one for each SSC
– Two serial Micro Second Bus interfaces (MSC) for serial port expansion to external
power devices
– Two High-Speed Micro Link interfaces (MLI) for serial inter-processor
communication
– One External Bus Interface (EBU) supporting different memories: asynchronous
memories e.g. SRAM, peripheral devices; synchronous devices e.g. burst NOR
flash, PSRAM; and DDR NOR flash e.g. LPDDR-NVM (Jedec 42.2), ONFI 2.0
(limited frequency at 1.8 V I/O supply)
– One MultiCAN Module with 4 CAN nodes and 128 free assignable message
objects for high efficiency data handling via FIFO buffering and gateway data
transfer (one CAN node supports TTCAN functionality)
– One FlexRayTM module with 2 channels (E-Ray).

Data Sheet 3 V 1.1.1, 2012-12

 TC1793

Summary of Features

– Two General Purpose Timer Array Modules (GPTA) with additional Local Timer
Cell Array (LTCA2) providing a powerful set of digital signal filtering and timer
functionality to realize autonomous and complex Input/Output management
– Two Capture / Compare 6 modules
– Two General Purpose 12 Timer Units (GPT120 and GPT121)
• 44 analog input lines for ADC
– 4 independent kernels (ADC0, ADC1, and ADC2)
– Analog supply voltage range from 3.3 V to 5 V (single supply)
• 4 different FADC input channels
– channels with impedance control and overlaid with ADC1 inputs
– Extreme fast conversion, 21 cycles of fFADC clock
– 10-bit A/D conversion (higher resolution can be achieved by averaging of
consecutive conversions in digital data reduction filter)
• 8 digital input lines for SENT
– communication according to the SENT specification J2716 FEB2008
• 221 digital general purpose I/O lines (GPIO)
• Digital I/O ports with 3.3 V capability
• On-chip debug support for OCDS Level 1 (CPU, PCP, DMA, On Chip Buses)
• Dedicated Emulation Device chip available (TC1793ED)
– multi-core debugging, real time tracing, and calibration
– four/five wire JTAG (IEEE 1149.1) or two wire DAP (Device Access Port) interface
• Power Management System
• Clock Generation Unit with PLL and PLL_ERAY
• Flexible CRC Engine (FCE)
– IEEE 802.3 CRC32 ethernet polynomial: 0x82608EDB (CRC kernel 0)
– CRC32C Castagnoli: 0xD419CC15 (CRC kernel 1)
The SAK-TC1793N-512F270EF has the following features:
• High-performance 32-bit super-scalar TriCore V1.6 CPU with 6-stage pipeline
– Superior real-time performance
– Strong bit handling
– Fully integrated DSP capabilities
– Multiply-accumulate unit able to sustain 2 MAC operations per cycle
– Fully pipelined Floating point unit (FPU)
– 270 MHz operation at full temperature range
• 32-bit Peripheral Control Processor with single cycle instruction (PCP2)
– 16 Kbyte Parameter Memory (PRAM)
– 32 Kbyte Code Memory (CMEM)
– 200 MHz operation at full temperature range
• Multiple on-chip memories
– 4 Mbyte Program Flash Memory (PFLASH) with ECC
– 192 Kbyte Data Flash Memory (DFLASH) usable for EEPROM emulation
– 2 x 8 Kbyte Key Flash

Data Sheet 4 V 1.1.1, 2012-12

 TC1793

Summary of Features

– 128 Kbyte Data Scratch-Pad RAM (DSPR)

– 16 Kbyte Instruction Cache (ICACHE)
– 32 Kbyte Instruction Scratch-Pad RAM (PSPR)
– 16 Kbyte Data Cache (DACHE)
– 128 Kbyte Memory (SRAM)
– 16 Kbyte BootROM (BROM)
• 16-Channel DMA Controller
• 8-Channel Safe DMA (SDMA) Controller
• Sophisticated interrupt system with 2 × 255 hardware priority arbitration levels
serviced by CPU or PCP2
• High performing on-chip bus structure
– 64-bit Cross Bar Interconnect between CPU, Flash and Data Memory
– 32-bit System Peripheral Bus (SPB) for on-chip peripheral and functional units
– One bus bridge (SFI Bridge)
• Versatile On-chip Peripheral Units
– Two Asynchronous/Synchronous Serial Channels (ASC) with baud rate generator,
parity, framing and overrun error detection
– Four High-Speed Synchronous Serial Channels (SSC) with programmable data
length and shift direction
– Four SSC Guardian (SSCG) modules, one for each SSC
– Two serial Micro Second Bus interfaces (MSC) for serial port expansion to external
power devices
– Two High-Speed Micro Link interfaces (MLI) for serial inter-processor
communication
– One External Bus Interface (EBU) supporting different memories: asynchronous
memories e.g. SRAM, peripheral devices; synchronous devices e.g. burst NOR
flash, PSRAM; and DDR NOR flash e.g. LPDDR-NVM (Jedec 42.2), ONFI 2.0
(limited frequency at 1.8 V I/O supply)
– One MultiCAN Module with 4 CAN nodes and 128 free assignable message
objects for high efficiency data handling via FIFO buffering and gateway data
transfer (one CAN node supports TTCAN functionality)
– Two General Purpose Timer Array Modules (GPTA) with additional Local Timer
Cell Array (LTCA2) providing a powerful set of digital signal filtering and timer
functionality to realize autonomous and complex Input/Output management
– Two Capture / Compare 6 modules
– Two General Purpose 12 Timer Units (GPT120 and GPT121)
• 44 analog input lines for ADC
– 4 independent kernels (ADC0, ADC1, and ADC2)
– Analog supply voltage range from 3.3 V to 5 V (single supply)
• 4 different FADC input channels
– channels with impedance control and overlaid with ADC1 inputs
– Extreme fast conversion, 21 cycles of fFADC clock

Data Sheet 5 V 1.1.1, 2012-12

 TC1793

Summary of Features

– 10-bit A/D conversion (higher resolution can be achieved by averaging of

consecutive conversions in digital data reduction filter)
• 8 digital input lines for SENT
– communication according to the SENT specification J2716 FEB2008
• 221 digital general purpose I/O lines (GPIO)
• Digital I/O ports with 3.3 V capability
• On-chip debug support for OCDS Level 1 (CPU, PCP, DMA, On Chip Buses)
• Dedicated Emulation Device chip available (TC1793ED)
– multi-core debugging, real time tracing, and calibration
– four/five wire JTAG (IEEE 1149.1) or two wire DAP (Device Access Port) interface
• Power Management System
• Clock Generation Unit with PLL and PLL_ERAY
• Flexible CRC Engine (FCE)
– IEEE 802.3 CRC32 ethernet polynomial: 0x82608EDB (CRC kernel 0)
– CRC32C Castagnoli: 0xD419CC15 (CRC kernel 1)
The SAK-TC1793S-512F270EF has the following features:
• High-performance 32-bit super-scalar TriCore V1.6 CPU with 6-stage pipeline
– Superior real-time performance
– Strong bit handling
– Fully integrated DSP capabilities
– Multiply-accumulate unit able to sustain 2 MAC operations per cycle
– Fully pipelined Floating point unit (FPU)
– 270 MHz operation at full temperature range
• 32-bit Peripheral Control Processor with single cycle instruction (PCP2)
– 16 Kbyte Parameter Memory (PRAM)
– 32 Kbyte Code Memory (CMEM)
– 200 MHz operation at full temperature range
• Multiple on-chip memories
– 4 Mbyte Program Flash Memory (PFLASH) with ECC
– 192 Kbyte Data Flash Memory (DFLASH) usable for EEPROM emulation
– 2 x 8 Kbyte Key Flash
– 128 Kbyte Data Scratch-Pad RAM (DSPR)
– 16 Kbyte Instruction Cache (ICACHE)
– 32 Kbyte Instruction Scratch-Pad RAM (PSPR)
– 16 Kbyte Data Cache (DACHE)
– 128 Kbyte Memory (SRAM)
– 16 Kbyte BootROM (BROM)
• 16-Channel DMA Controller
• 8-Channel Safe DMA (SDMA) Controller
• Sophisticated interrupt system with 2 × 255 hardware priority arbitration levels
serviced by CPU or PCP2
• High performing on-chip bus structure

Data Sheet 6 V 1.1.1, 2012-12

 TC1793

Summary of Features

– 64-bit Cross Bar Interconnect between CPU, Flash and Data Memory
– 32-bit System Peripheral Bus (SPB) for on-chip peripheral and functional units
– One bus bridge (SFI Bridge)
• Versatile On-chip Peripheral Units
– Two Asynchronous/Synchronous Serial Channels (ASC) with baud rate generator,
parity, framing and overrun error detection
– Four High-Speed Synchronous Serial Channels (SSC) with programmable data
length and shift direction
– Four SSC Guardian (SSCG) modules, one for each SSC
– Two serial Micro Second Bus interfaces (MSC) for serial port expansion to external
power devices
– Two High-Speed Micro Link interfaces (MLI) for serial inter-processor
communication
– One External Bus Interface (EBU) supporting different memories: asynchronous
memories e.g. SRAM, peripheral devices; synchronous devices e.g. burst NOR
flash, PSRAM; and DDR NOR flash e.g. LPDDR-NVM (Jedec 42.2), ONFI 2.0
(limited frequency at 1.8 V I/O supply)
– One MultiCAN Module with 4 CAN nodes and 128 free assignable message
objects for high efficiency data handling via FIFO buffering and gateway data
transfer (one CAN node supports TTCAN functionality)
– One FlexRayTM module with 2 channels (E-Ray).
– Two General Purpose Timer Array Modules (GPTA) with additional Local Timer
Cell Array (LTCA2) providing a powerful set of digital signal filtering and timer
functionality to realize autonomous and complex Input/Output management
– Two Capture / Compare 6 modules
– Two General Purpose 12 Timer Units (GPT120 and GPT121)
• 44 analog input lines for ADC
– 4 independent kernels (ADC0, ADC1, and ADC2)
– Analog supply voltage range from 3.3 V to 5 V (single supply)
• 4 different FADC input channels
– channels with impedance control and overlaid with ADC1 inputs
– Extreme fast conversion, 21 cycles of fFADC clock
– 10-bit A/D conversion (higher resolution can be achieved by averaging of
consecutive conversions in digital data reduction filter)
• 8 digital input lines for SENT
– communication according to the SENT specification J2716 FEB2008
• 221 digital general purpose I/O lines (GPIO)
• Digital I/O ports with 3.3 V capability
• On-chip debug support for OCDS Level 1 (CPU, PCP, DMA, On Chip Buses)
• Dedicated Emulation Device chip available (TC1793ED)
– multi-core debugging, real time tracing, and calibration
– four/five wire JTAG (IEEE 1149.1) or two wire DAP (Device Access Port) interface
• Power Management System

Data Sheet 7 V 1.1.1, 2012-12

 TC1793

Summary of Features

• Clock Generation Unit with PLL and PLL_ERAY

• Flexible CRC Engine (FCE)
– IEEE 802.3 CRC32 ethernet polynomial: 0x82608EDB (CRC kernel 0)
– CRC32C Castagnoli: 0xD419CC15 (CRC kernel 1)
• Secure Hardware Extension (SHE)
– For further information please contact your Infineon representative

Data Sheet 8 V 1.1.1, 2012-12

 TC1793

Summary of Features

Ordering Information
The ordering code for Infineon microcontrollers provides an exact reference to the
required product. This ordering code identifies:
• The derivative itself, i.e. its function set, the temperature range, and the supply
voltage
• The package and the type of delivery.
For the available ordering codes for the TC1793 please refer to the “Product Catalog
Microcontrollers”, which summarizes all available microcontroller variants.
This document describes the derivatives of the device.The Table 1 enumerates these
derivatives and summarizes the differences.

Table 1 TC1793 Derivative Synopsis

Derivative Ambient Temperature Range
SAK-TC1793F-512F270EF TA = -40oC to +125oC
SAK-TC1793F-512F270EB TA = -40oC to +125oC
SAK-TC1793F-512F200EF TA = -40oC to +125oC
SAK-TC1793F-512F200EB TA = -40oC to +125oC
SAK-TC1793N-512F270EF TA = -40oC to +125oC
SAK-TC1793S-512F270EF TA = -40oC to +125oC

Data Sheet 9 V 1.1.1, 2012-12

 TC1793

System Overview of the TC1793

2 System Overview of the TC1793

The TC1793 combines three powerful technologies within one silicon die, achieving new
levels of power, speed, and economy for embedded applications:
• Reduced Instruction Set Computing (RISC) processor architecture
• Digital Signal Processing (DSP) operations and addressing modes
• On-chip memories and peripherals
DSP operations and addressing modes provide the computational power necessary to
efficiently analyze complex real-world signals. The RISC load/store architecture
provides high computational bandwidth with low system cost. On-chip memory and
peripherals are designed to support even the most demanding high-bandwidth real-time
embedded control-systems tasks.
Additional high-level features of the TC1793 include:
• Efficient memory organization: instruction and data scratch memories, caches
• Serial communication interfaces – flexible synchronous and asynchronous modes
• Peripheral Control Processor – standalone data operations and interrupt servicing
• DMA Controller – DMA operations and interrupt servicing
• General-purpose timers
• High-performance on-chip buses
• On-chip debugging and emulation facilities
• Flexible interconnections to external components
• Flexible power-management
The TC1793 is a high-performance microcontroller with TriCore CPU, program and data
memories, buses, bus arbitration, an interrupt controller, a peripheral control processor
and a DMA controller and several on-chip peripherals. The TC1793 is designed to meet
the needs of the most demanding embedded control systems applications where the
competing issues of price/performance, real-time responsiveness, computational power,
data bandwidth, and power consumption are key design elements.
The TC1793 offers several versatile on-chip peripheral units such as serial controllers,
timer units, and Analog-to-Digital converters. Within the TC1793, all these peripheral
units are connected to the TriCore CPU/system via the Flexible Peripheral Interconnect
(FPI) Bus and the Cross Bar Interconnect (SRI). Several I/O lines on the TC1793 ports
are reserved for these peripheral units to communicate with the external world.

Data Sheet 8 V 1.1.1, 2012-12

 TC1793

System Overview of the TC1793Block Diagram

2.1 Block Diagram

Figure 1 shows the block diagram of the SAK-TC1793F-512F270EF / SAK-TC1793F-
512F270EB / SAK-TC1793F-512F200EF / SAK-TC1793F-512F200EB.

Abbreviations:
FPU ICACHE: Instruction Cache
PMI DMI DCACHE Data Cache
PSPR: Program Scratch-Pad RAM
LMU
32 KB PSPR
TriCore 128LDRAM
KB DSPR
DSPR: Data Scratch-Padl Data RAM
CPU BROM: Boot ROM
16 KB ICACHE 16 KB DCACHE
128 KB PFlash: Program Flash
DCACHE SRAM DFlash: Data Flash
PRAM: Parameter RAM in PCP
M/S M/S S CMEM: Code RAM in PCP
EBU XBAR: SRI Cross Bar (XBar_SRI)
Cross Bar Interconnect (SRI) S : On Chip Bus Slave Interface
XBAR M : On Chip Bus Master Interface
S

S S M
M/S OCDS L1 Debug
PMU0 PMU1
DMA Interface/JTAG
Bridge 16 channels
(SFI) 2
2 MB PFlash 2 MB PFlash (MemCheck)
192 KB DFlash M/S
MLI
16 KB BROM M/S
KeyFlash

16 KB PRAM Interrupt
2 SDMA
ASC System 8 channels
Interrupts

4 PCP2 STM
M /S

SSC Core

4
SSCG SBCU BMU
SSC Guardian

32 KB CMEM
E-Ray Ports
(2 Channels) 5V (3.3V supported as well)
Ext. ADC Supply
MultiCAN External
(4 Nodes, 128 MO) 2
CCU6 Request Unit ADC0
(2xCCU6)
(5V max)
SENT ADC1
FCE 44
(8 channels ) 2 ADC2
GPT120
SCU
GPTA 0 2
MSC FM-PLL
(LVDS) (3.3V max)
GPTA1 PLL E-RAY
FADC 8

LTCA2 System Peripheral Bus (SPB)

3.3V
Ext. FADC Supply

TC1793

Figure 1 Block Diagram

Data Sheet 9 V 1.1.1, 2012-12

 TC1793

System Overview of the TC1793Block Diagram

Figure 2 shows the block diagram of the SAK-TC1793N-512F270EF.

Abbreviations:
FPU ICACHE: Instruction Cache
PMI DMI DCACHE Data Cache
PSPR: Program Scratch-Pad RAM
LMU
32 KB PSPR
TriCore 128LDRAM
KB DSPR
DSPR: Data Scratch-Padl Data RAM
CPU BROM: Boot ROM
16 KB ICACHE 16 KB DCACHE
128 KB PFlash: Program Flash
DCACHE SRAM DFlash: Data Flash
PRAM: Parameter RAM in PCP
M/S M/S S CMEM: Code RAM in PCP
EBU XBAR: SRI Cross Bar (XBar_SRI)
Cross Bar Interconnect (SRI) S : On Chip Bus Slave Interface
XBAR M : On Chip Bus Master Interface
S

S S M
M/S OCDS L1 Debug
PMU0 PMU1 DMA Interface/JTAG
Bridge 16 channels
(SFI) 2
2 MB PFlash 2 MB PFlash (MemCheck)
192 KB DFlash M/S
MLI
16 KB BROM M/S
KeyFlash

16 KB PRAM
2 Interrupt SDMA
ASC System 8 channels
Interrupts

4 PCP2 STM
M /S

SSC Core

4
SSCG SBCU BMU
SSC Guardian

32 KB CMEM
Ports 5V (3.3V supported as well)
Ext. ADC Supply
MultiCAN External
(4 Nodes, 128 MO) 2
CCU6 Request Unit ADC0
(2xCCU6) (5V max)
SENT ADC1 44
(8 channels ) 2
FCE
GPT120 ADC2
SCU
GPTA0 2
MSC FM-PLL
(LVDS) (3.3V max)
GPTA1 PLL E-RAY
FADC 8

LTCA2 System Peripheral Bus (SPB)

3.3V
Ext. FADC Supply

TC1793

Figure 2 Block Diagram

Data Sheet 10 V 1.1.1, 2012-12

 TC1793

System Overview of the TC1793Block Diagram

Figure 3 shows the block diagram of the SAK-TC1793S-512F270EF.

Abbreviations:
FPU ICACHE: Instruction Cache
PMI DMI DCACHE Data Cache
LMU PSPR: Program Scratch-Pad RAM
32 KB PSPR
TriCore 128LDRAM
KB DSPR
DSPR: Data Scratch-Padl Data RAM
CPU BROM: Boot ROM
16 KB ICACHE 16 KB DCACHE
128 KB PFlash: Program Flash
DCACHE SRAM DFlash: Data Flash
PRAM: Parameter RAM in PCP
M/S M/S S CMEM: Code RAM in PCP
EBU XBAR: SRI Cross Bar (XBar_SRI)
Cross Bar Interconnect (SRI) S : On Chip Bus Slave Interface
XBAR M : On Chip Bus Master Interface
S

S S M
M/S OCDS L 1 Debug
PMU0 PMU1 DMA Interface/JTAG
Bridge 16 channels
(SFI) 2
2 MB PFlash 2 MB PFlash (MemCheck)
192 KB DFlash M/S
MLI
16 KB BROM M/S
KeyFlash

16 KB PRAM Interrupt
2 SDMA
ASC System 8 channels
Interrupts

4 PCP2
SSC STM SHE
M /S

Core

4
SSCG SBCU BMU
SSC Guardian

32 KB CMEM
E-Ray Ports
(2 Channels) 5V (3.3V supported as well)
Ext. ADC Supply
MultiCAN External
(4 Nodes, 128 MO) 2 Request Unit ADC0
CCU6
(2xCCU6)
(5V max)
SENT ADC1 44
(8 channels ) 2
FCE
GPT120 ADC2
SCU
GPTA0 2
MSC FM-PLL
(LVDS) (3.3V max)
GPTA1 PLL E-RAY
FADC 8

LTCA2 System Peripheral Bus (SPB)

3.3V
Ext. FADC Supply

TC1793

Figure 3 Block Diagram

Data Sheet 11 V 1.1.1, 2012-12

 TC1793

Pinning

3 Pinning
Figure 3 is showing the TC1793 Logic Symbol.

Alternate Functions :
PORST
TESTMODE
16
Port 0 GPTA / HWCFG / E-RAY1)/
General Control GPT12
ESR0 16 GPTA / MLI 0 / ERU / SSC1 /
Port 1 SSC3 / CCU6 / GPT12
ESR1 14
Port 2 GPTA / SSC0 / SSC1
TRST
16
TCK / DAP0 Port 3 GPTA / CCU6 / GPT12
16
OCDS / TDI / BRKIN/ Port 4 GPTA / SSC2 / CCU6 / GPT12
JTAG Control BRKOUT 16 ASC0 / ASC1 / MSC0 / MSC1 /
TDO /BRKOUT/ Port 5 LVDS / MLI0 / CCU6 / GPT12
DAP2 / BRKIN 12 ASC0 / ASC1 / SSC1 / CAN /
Port 6
E-RAY1)/ CCU6 / GPT12
TMS / DAP1 8
Port 7 ERU / ADC-Mux / SSC3
XTAL1 8
Port 8 MLI 1 / GPTA / SENT /
XTAL2 CCU6 / GPT12
VD D OSC 15 MSC0 / MSC1 / GPTA /
Port 9 SENT / CCU6 / GPT12
VD D OSC3 6
Oscillator Port 10 SSC0
VSSOSC / TC1793
VSS 16
Port 11 EBU
VD D PF 8
VD D PF3 C3 Port 12 EBU
9 16
VD D EBU Port 13 GPTA / EBU
11 16
VD D P
13 Port 14 GPTA / EBU / CCU6 / GPT12
Digital Circuitry VD D 16
Power Supply 3 Port 15
VD D FL3 EBU
79
VSS 4
VD D SB Port 16 EBU
(ED only, N.C. in PD)
16 SENT
Port 17
VSSAF (Overlay with Analog Inputs )
VSSMF ADC / FADC
AN[43:0]
VFAGN D Analog Inputs
FADC Analog 3
Power Supply VFAR EF VAR EFx
2
VD D MF VAGN D x ADC0 / ADC1 / ADC2
VD D AF VD D M Analog Power Supply
9 VSSM
N.C.
1) Only available for SAK-TC 1793F-512F270EF, SAK-
TC1793F- 512F270EB, SAK-TC1793F- 512F200EF,
and SAK-TC 1793F- 512F200EB

TC1793_LogSym_416

Figure 3 TC1793 Logic Symbol

Data Sheet 11 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

3.1 TC1793 Pin Configuration

This chapter shows the pin configuration of the TC1793 package PG-BGA- 416.

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26

A N.C. P2.9 P2.13 P2.15 P0.14 P0.5 P0.2 P0.1 P0.0 P3.14 P3.5 P3.1 P5.1 P5.2 P5.7 P5.12 P5.15 VDDFL3 P9.0 P9.3 P9.9 ESR1 ESR0 N.C. VDDP VSS A

PO TEST V
B P2.6 P2.7 P2.10 P2.14 P0.9 P0.6 P0.4 P0.3 P3.15 P3.6 P3.3 P3.0 P5.0 P5.3 P5.6 P5.13 P5.14 VDDFL3 P9.1 P9.2 P9.10 DDP VSS VDD B
RST MODE

C P2.5 P2.8 P2.11 P2.12 P0.12 P0.10 P0.8 P0.7 P3.7 P3.10 P3.9 P3.4 P3.2 P5.5 P5.4 P5.9 P5.10 P5.11 P9.6 P9.8 P9.11 N.C. VDDP VSS VDD P9.13 C

D P2.4 P2.3 P2.2 P0.15 P0.13 P0.11 VDDP VSS VDD P3.8 P3.12 P3.13 P3.11 VDDP VSS VDD P5.8 P9.4 P9.5 P9.7 P9.12 VDDP VSS VDD TDO P9.14 D

VDD
E P6.12 P6.11 P6.6 P6.9 VDD TCK TDI E
OSC3

VSS VDD
F P6.14 P6.10 P6.4 P6.8 TRST TMS F
OSC OSC

G P6.15 P6.13 P6.7 P6.5 VDDPF VDDPF3 XTAL XTAL G

2 1

H P8.1 P8.0 VDDFL3 VDD VDDEBU VDDEBU VDDEBU VDDEBU H

J P8.4 P8.3 P8.2 VSS P11.3 P12.6 P12.7 P11.0 J

K P8.7 P8.5 P8.6 VDDP VSS VSS VSS VSS VSS VSS VSS VSS P11.7 P11.4 P11.1 P11.2 K

L VSS VSS VSS VSS VSS VSS P11. L

P1.15 P1.14 P1.13 P1.11 VSS VSS VSS P11.5 P11.6
11

M P1.10 P1.9 P1.8 P1.5 VSS VSS VSS VSS VSS VSS VSS VSS VDDEBU P11. P11.9 P11.8 M
10

N VSS VSS VSS VSS VSS VSS VSS VSS P11. P11. P11. P11. N
P1.3 P1.7 P1.6 P1.4
13 14 15 12

P P1.2 P1.1 P1.0 P1.12 VSS VSS VSS VSS VSS VSS VSS VSS VDD P12.1 P12.2 P12.0 P

VDD
R P7.1 P7.0 VDD VSS VSS VSS VSS VSS VSS VSS VSS VSS P12.3 P12.5 P12.4 R
SBRAM

T P7.6 P7.5 P7.4 VSS VSS VSS VSS VSS VSS VSS VSS VSS VDDEBU P13.1 P13.3 P13.0 T

U AN23 P7.7 P7.3 P7.2 VSS VSS VSS VSS VSS VSS VSS VSS P13.6 P13.9 P13.5 P13.2 U

V VDD P13. V
AN22 AN21 AN19 AN16 P13.8 P13.4
13

W P13. W
AN20 AN17 AN13 VDDM VSS P14.0 P13.7
12

Y AN18 AN14 AN10 VSSM VDDEBU P14.2 P13. P13. Y

14 10

AA P13. AA
AN15 AN11 AN5 AN2 P14.3 P14.6 P14.1
11

AB VDD P13. AB
AN12 AN9 AN3 AN7 P14.5 P14.4
15

AC VSS VSS VDDEBU VSS P14.

AN8 AN4 AN32 AN38 AN42 VAGND1 AN26 AN24 VDDAF VDD P4.4 P4.8 P4.12 P10.5 VDDP VDD N.C. VDDEBU VSS P14.9 P14.7 AC
12

AD P14. P14.
AN6 AN1 AN34 AN40 AN35 VAREF1 AN27 AN25 VAREF2 P4.0 P4.2 P4.5 P4.11 P4.15 P10.2 VDDP P15.5 P16.1 P15.3 P15.2 P15.1 P16.2 N.C. P14.8 AD
15 11

P15. P14. P14. P14.

AE AN0 AN33 AN36 AN41 VAREF0 AN28 AN30 VFAGND VDDMF P4.1 P4.3 P4.7 P4.13 P10.4 P10.0 VDDP P15.4 P15.7 P16.3 P15.0 N.C. N.C. AE
11 14 13 10

P15. P15. P15. P15. P15.

AF N.C. AN37 AN39 AN43 VAGND0 AN29 AN31 VFAREF VSSMF P4.6 P4.9 P4.10 P4.14 P10.3 P10.1 VDDP P16.0 P15.6 12
P15.8 P15.9
10 13 14 15 N.C. AF

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26

mca05584_97.vsd

Figure 4 TC1793 Pinning for PG-BGA- 416 Package

Data Sheet 12 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions

Pin Symbol Ctrl. Type Function
Port 0
A9 P0.0 I/O A1+/ Port 0 General Purpose I/O Line 0
PU
HWCFG0 I Hardware Configuration Input 0
OUT56 O1 OUT56 Line of GPTA0
OUT56 O2 OUT56 Line of GPTA1
OUT80 O3 OUT80 Line of LTCA2
A8 P0.1 I/O A1/ Port 0 General Purpose I/O Line 1
PU
HWCFG1 I Hardware Configuration Input 1
OUT57 O1 OUT57 Line of GPTA0
OUT57 O2 OUT57 Line of GPTA1
OUT81 O3 OUT81 Line of LTCA2
A7 P0.2 I/O A2/ Port 0 General Purpose I/O Line 2
PU
HWCFG2 I Hardware Configuration Input 2
OUT58 O1 OUT58 Line of GPTA0
OUT58 O2 OUT58 Line of GPTA1
OUT82 O3 OUT82 Line of LTCA2
B8 P0.3 I/O A1/ Port 0 General Purpose I/O Line 3
PU
HWCFG3 I Hardware Configuration Input 3
OUT59 O1 OUT59 Line of GPTA0
OUT59 O2 OUT59 Line of GPTA1
OUT83 O3 OUT83 Line of LTCA2

Data Sheet 13 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
B7 P0.4 I/O A1/ Port 0 General Purpose I/O Line 4
PU
HWCFG4 I Hardware Configuration Input 4
OUT60 O1 OUT60 Line of GPTA0
OUT60 O2 OUT60 Line of GPTA1
EVTO0 O3 MCDS Output Event 01)
A6 P0.5 I/O A1/ Port 0 General Purpose I/O Line 5
PU
HWCFG5 I Hardware Configuration Input 5
OUT61 O1 OUT61 Line of GPTA0
OUT61 O2 OUT61 Line of GPTA1
EVTO1 O3 MCDS Output Event 11)
B6 P0.6 I/O A2/ Port 0 General Purpose I/O Line 6
PU
HWCFG6 I Hardware Configuration Input 6
OUT62 O1 OUT62 Line of GPTA0
OUT62 O2 OUT62 Line of GPTA1
EVTO2 O3 MCDS Output Event 21)
C8 P0.7 I/O A1/ Port 0 General Purpose I/O Line 7
PU
HWCFG7 I Hardware Configuration Input 7
OUT63 O1 OUT63 Line of GPTA0
OUT63 O2 OUT63 Line of GPTA1
EVTO3 O3 MCDS Output Event 31)
C7 P0.8 I/O A1/ Port 0 General Purpose I/O Line 8
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -

Data Sheet 14 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
B5 P0.9 I/O A1/ Port 0 General Purpose I/O Line 9
PU
RXDA0 I E-Ray Channel A Receive Data Input 0 2)
Reserved O1 -
Reserved O2 -
Reserved O3 -
C6 P0.10 I/O A2/ Port 0 General Purpose I/O Line 10
PU
TXENA O1 E-Ray Channel A transmit Data Output
enable 2)
Reserved O2 -
Reserved O3 -
D6 P0.11 I/O A2/ Port 0 General Purpose I/O Line 11
PU
T5INB I GPT120
T5INA I GPT121
TXENB O1 E-Ray Channel B transmit Data Output
enable 2)
Reserved O2 -
Reserved O3 -
C5 P0.12 I/O A2/ Port 0 General Purpose I/O Line 12
PU
T5EUDA I GPT120
T5EUDB I GPT121
TXDB O1 E-Ray Channel B transmit Data Output 2)
Reserved O2 -
Reserved O3 -

Data Sheet 15 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
D5 P0.13 I/O A1/ Port 0 General Purpose I/O Line 13
PU
RXDB0 I E-Ray Channel B Receive Data Input 0 2)
T5EUDB I GPT120
T5EUDA I GPT121
Reserved O1 -
Reserved O2 -
Reserved O3 -
A5 P0.14 I/O A2/ Port 0 General Purpose I/O Line 14
PU
T6INA I GPT120
T6INB I GPT121
TXDA O1 E-Ray Channel A transmit Data Output 2)
Reserved O2 -
Reserved O3 -
D4 P0.15 I/O A1/ Port 0 General Purpose I/O Line 15
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
Port 1
P3 P1.0 I/O A2/ Port 1 General Purpose I/O Line 0
PU
REQ0 I External trigger Input 0
EXTCLK1 O1 External Clock Output 1
Reserved O2 -
Reserved O3 -

Data Sheet 16 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
P2 P1.1 I/O A1/ Port 1 General Purpose I/O Line 1
PU
REQ1 I External trigger Input 1
CC60INA I CCU60
CC60INB I CCU61
CC60 O1 CCU60
Reserved O2 -
Reserved O3 -
P1 P1.2 I/O A1/ Port 1 General Purpose I/O Line 2
PU
REQ2 I External trigger Input 2
Reserved O1 -
Reserved O2 -
Reserved O3 -
N1 P1.3 I/O A1/ Port 1 General Purpose I/O Line 3
PU
REQ3 I External trigger Input 3
TREADY0B I MLI0 transmit Channel ready Input B
Reserved O1 -
Reserved O2 -
Reserved O3 -
N4 P1.4 I/O A2/ Port 1 General Purpose I/O Line 4
PU
TCLK0 O1 MLI0 transmit Channel Clock Output
Reserved O2 -
Reserved O3 -

Data Sheet 17 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
M4 P1.5 I/O A1/ Port 1 General Purpose I/O Line 35
PU
TREADY0A I MLI0 transmit Channel ready Input A
Reserved O1 -
Reserved O2 -
Reserved O3 -
N3 P1.6 I/O A2/ Port 1 General Purpose I/O Line 6
PU
TVALID0A O1 MLI0 transmit Channel valid Output A
SLSO10 O2 SSC1 Slave Select Output Line 10
COUT60 O3 CCU60
N2 P1.7 I/O A2/ Port 1 General Purpose I/O Line 7
PU
CC61INB I CCU60
CC61INA I CCU61
TData0 O1 MLI0 transmit Channel Data Output
CC61 O2 CCU61
T3OUT O3 GPT120
M3 P1.8 I/O A1/ Port 1 General Purpose I/O Line 8
PU
RCLK0A I MLI0 Receive Channel Clock Input A
OUT64 O1 OUT64 Line of GPTA0
OUT64 O2 OUT64 Line of GPTA1
OUT88 O3 OUT88 Line of LTCA2
M2 P1.9 I/O A2/ Port 1 General Purpose I/O Line 9
PU
RREADY0A O1 MLI0 Receive Channel ready Output A
SLSO11 O2 SSC1 Slave Select Output Line 11
OUT65 O3 OUT65 Line of GPTA0

Data Sheet 18 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
M1 P1.10 I/O A1/ Port 1 General Purpose I/O Line 10
PU
RVALID0A I MLI0 Receive Channel valid Input A
OUT66 O1 OUT66 Line of GPTA0
OUT66 O2 OUT66 Line of GPTA1
OUT90 O3 OUT90 Line of LTCA2
L4 P1.11 I/O A1/ Port 1 General Purpose I/O Line 11
PU
RDATA0A I MLI0 Receive Channel Data Input A
SLSI3 I SSC3 Input
OUT67 O1 OUT67 Line of GPTA0
OUT67 O2 OUT67 Line of GPTA1
OUT91 O3 OUT91 Line of LTCA2
P4 P1.12 I/O A2/ Port 1 General Purpose I/O Line 12
PU
EXTCLK0 O1 External Clock Output 0
OUT68 O2 OUT68 Line of GPTA0
OUT68 O3 OUT68 Line of GPTA1
L3 P1.13 I/O A1/ Port 1 General Purpose I/O Line 13
PU
RCLK0B I MLI0 Receive Channel Clock Input B
OUT69 O1 OUT69 Line of GPTA0
OUT69 O2 OUT69 Line of GPTA1
OUT93 O3 OUT93 Line of LTCA2
L2 P1.14 I/O A1/ Port 1 General Purpose I/O Line 14
PU
RVALID0B I MLI0 Receive Channel valid Input B
OUT70 O1 OUT70 Line of GPTA0
OUT70 O2 OUT70 Line of GPTA1
OUT94 O3 OUT94 Line of LTCA2

Data Sheet 19 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
L1 P1.15 I/O A1/ Port 1 General Purpose I/O Line 15
PU
RDATA0B I MLI0 Receive Channel Data Input B
OUT71 O1 OUT71 Line of GPTA0
OUT71 O2 OUT71 Line of GPTA1
OUT95 O3 OUT95 Line of LTCA2
Port 2
D3 P2.2 I/O A1+/ Port 2 General Purpose I/O Line 2
PU
SLSO02 O1 SSC0 Slave Select Output Line 2
SLSO12 O2 SSC1 Slave Select Output Line 12
SLSO02 O3 SSC0 & SSC1 Slave Select Output Line 2
AND AND Slave Select Output Line 12
SLSO12
D2 P2.3 I/O A1+/ Port 2 General Purpose I/O Line 3
PU
SLSO03 O1 SSC0 Slave Select Output Line 3
SLSO13 O2 SSC1 Slave Select Output Line 13
SLSO03 O3 SSC0 & SSC1 Slave Select Output Line 3
AND AND Slave Select Output Line 13
SLSO13
D1 P2.4 I/O A1+/ Port 2 General Purpose I/O Line 4
PU
SLSO04 O1 SSC0 Slave Select Output Line 4
SLSO14 O2 SSC1 Slave Select Output Line 14
SLSO04 O3 SSC0 & SSC1 Slave Select Output Line 4
AND AND Slave Select Output Line 14
SLSO14

Data Sheet 20 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
C1 P2.5 I/O A1+/ Port 2 General Purpose I/O Line 5
PU
SLSO05 O1 SSC0 Slave Select Output Line 5
SLSO15 O2 SSC1 Slave Select Output Line 15
SLSO05 O3 SSC0 & SSC1 Slave Select Output Line 5
AND AND Slave Select Output Line 15
SLSO15
B1 P2.6 I/O A1+/ Port 2 General Purpose I/O Line 6
PU
SLSO06 O1 SSC0 Slave Select Output Line 6
SLSO16 O2 SSC1 Slave Select Output Line 16
SLSO06 O3 SSC0 & SSC1 Slave Select Output Line 6
AND AND Slave Select Output Line 16
SLSO16
B2 P2.7 I/O A1+/ Port 2 General Purpose I/O Line 7
PU
SLSO07 O1 SSC0 Slave Select Output Line 7
SLSO17 O2 SSC1 Slave Select Output Line 17
SLSO07 O3 SSC0 & SSC1 Slave Select Output Line
AND 7AND Slave Select Output Line 17
SLSO17

Data Sheet 21 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
C2 P2.8 I/O A1/ Port 2 General Purpose I/O Line 8
PU
IN0 I IN0 Line of GPTA0
IN0 I IN0 Line of GPTA1
IN0 I IN0 Line of LTCA2
CCPOS0A I CCU62
T12HRB I CCU63
T3INB I GPT120
T3INA I GPT121
OUT0 O1 OUT0 Line of GPTA0
OUT0 O2 OUT0 Line of GPTA1
OUT0 O3 OUT0 Line of LTCA2
A2 P2.9 I/O A1/ Port 2 General Purpose I/O Line 9
PU
IN1 I IN1 Line of GPTA0
IN1 I IN1 Line of GPTA1
IN1 I IN1 Line of LTCA2
OUT1 O1 OUT1 Line of GPTA0
OUT1 O2 OUT1 Line of GPTA1
OUT1 O3 OUT1 Line of LTCA2

Data Sheet 22 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
B3 P2.10 I/O A1/ Port 2 General Purpose I/O Line 10
PU
IN2 I IN2 Line of GPTA0
IN2 I IN2 Line of GPTA1
IN2 I IN2 Line of LTCA2
T12HRE I CCU60
CC61INC I CCU60
CTRAPA I CCU61
CTRAPB I CCU63
CC60INC I CCU61
OUT2 O1 OUT2 Line of GPTA0
OUT2 O2 OUT2 Line of GPTA1
OUT2 O3 OUT2 Line of LTCA2
C3 P2.11 I/O A1/ Port 2 General Purpose I/O Line 11
PU
IN3 I IN3 Line of GPTA0
IN3 I IN3 Line of GPTA1
IN3 I IN3 Line of LTCA2
OUT3 O1 OUT3 Line of GPTA0
OUT3 O2 OUT3 Line of GPTA1
OUT3 O3 OUT3 Line of LTCA2

Data Sheet 23 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
C4 P2.12 I/O A1/ Port 2 General Purpose I/O Line 12
PU
IN4 I IN4 Line of GPTA0
IN4 I IN4 Line of GPTA1
IN4 I IN4 Line of LTCA2
T12HRB I CCU62
CCPOS0A I CCU63
T2INB I GPT120
T2INA I GPT121
OUT4 O1 OUT4 Line of GPTA0
OUT4 O2 OUT4 Line of GPTA1
OUT4 O3 OUT4 Line of LTCA2
A3 P2.13 I/O A1/ Port 2 General Purpose I/O Line 13
PU
IN5 I IN5 Line of GPTA0
IN5 I IN5 Line of GPTA1
IN5 I IN5 Line of LTCA2
OUT5 O1 OUT5 Line of GPTA0
OUT5 O2 OUT5 Line of GPTA1
OUT5 O3 OUT5 Line of LTCA2

Data Sheet 24 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
B4 P2.14 I/O A1/ Port 2 General Purpose I/O Line 14
PU
IN6 I IN6 Line of GPTA0
IN6 I IN6 Line of GPTA1
IN6 I IN6 Line of LTCA2
CCPOS0A I CCU60
T12HRB I CCU61
T3INA I GPT120
T3INB I GPT121
OUT6 O1 OUT6 Line of GPTA0
OUT6 O2 OUT6 Line of GPTA1
OUT6 O3 OUT6 Line of LTCA2
A4 P2.15 I/O A1/ Port 2 General Purpose I/O Line 15
PU
IN7 I IN7 Line of GPTA0
IN7 I IN7 Line of GPTA1
IN7 I IN7 Line of LTCA2
OUT7 O1 OUT7 Line of GPTA0
OUT7 O2 OUT7 Line of GPTA1
OUT7 O3 OUT7 Line of LTCA2
Port 3

Data Sheet 25 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
B12 P3.0 I/O A1/ Port 3 General Purpose I/O Line 0
PU
IN8 I IN8 Line of GPTA0
IN8 I IN8 Line of GPTA1
IN8 I IN8 Line of LTCA2
CTRAPA I CCU62
CTRAPB I CCU61
CC60INC I CCU62
T12HRE I CCU63
CC61INC I CCU63
T5INA I GPT120
T5INB I GPT121
OUT8 O1 OUT8 Line of GPTA0
OUT8 O2 OUT8 Line of GPTA1
OUT8 O3 OUT8 Line of LTCA2
A12 P3.1 I/O A1/ Port 3 General Purpose I/O Line 1
PU
IN9 I IN9 Line of GPTA0
IN9 I IN9 Line of GPTA1
IN9 I IN9 Line of LTCA2
OUT9 O1 OUT9 Line of GPTA0
OUT9 O2 OUT9 Line of GPTA1
OUT9 O3 OUT9 Line of LTCA2

Data Sheet 26 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
C13 P3.2 I/O A1/ Port 3 General Purpose I/O Line 2
PU
IN10 I IN10 Line of GPTA0
IN10 I IN10 Line of GPTA1
IN10 I IN10 Line of LTCA2
T13HRE I CCU63
OUT10 O1 OUT10 Line of GPTA0
OUT10 O2 OUT10 Line of GPTA1
OUT10 O3 OUT10 Line of LTCA2
B11 P3.3 I/O A1/ Port 3 General Purpose I/O Line 3
PU
IN11 I IN11 Line of GPTA0
IN11 I IN11 Line of GPTA1
IN11 I IN11 Line of LTCA2
OUT11 O1 OUT11 Line of GPTA0
OUT11 O2 OUT11 Line of GPTA1
OUT11 O3 OUT11 Line of LTCA2

Data Sheet 27 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
C12 P3.4 I/O A1/ Port 3 General Purpose I/O Line 4
PU
IN12 I IN12 Line of GPTA0
IN12 I IN12 Line of GPTA1
IN12 I IN12 Line of LTCA2
T12HRE I CCU62
CC61INC I CCU62
CTRAPA I CCU63
CTRAPB I CCU60
CC60INC I CCU63
OUT12 O1 OUT12 Line of GPTA0
OUT12 O2 OUT12 Line of GPTA1
OUT12 O3 OUT12 Line of LTCA2
A11 P3.5 I/O A1/ Port 3 General Purpose I/O Line 5
PU
IN13 I IN13 Line of GPTA0
IN13 I IN13 Line of GPTA1
IN13 I IN13 Line of LTCA2
OUT13 O1 OUT13 Line of GPTA0
OUT13 O2 OUT13 Line of GPTA1
OUT13 O3 OUT13 Line of LTCA2

Data Sheet 28 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
B10 P3.6 I/O A1/ Port 3 General Purpose I/O Line 6
PU
IN14 I IN14 Line of GPTA0
IN14 I IN14 Line of GPTA1
IN14 I IN14 Line of LTCA2
T13HRE I CCU62
T6EUDB I GPT120
T6EUDA I GPT121
OUT14 O1 OUT14 Line of GPTA0
OUT14 O2 OUT14 Line of GPTA1
OUT14 O3 OUT14 Line of LTCA2
C9 P3.7 I/O A1/ Port 3 General Purpose I/O Line 7
PU
IN15 I IN15 Line of GPTA0
IN15 I IN15 Line of GPTA1
IN15 I IN15 Line of LTCA2
OUT15 O1 OUT15 Line of GPTA0
OUT15 O2 OUT15 Line of GPTA1
OUT15 O3 OUT15 Line of LTCA2
D10 P3.8 I/O A1/ Port 3 General Purpose I/O Line 8
PU
IN16 I IN16 Line of GPTA0
IN16 I IN16 Line of GPTA1
IN16 I IN16 Line of LTCA2
T13HRE I CCU61
OUT16 O1 OUT16 Line of GPTA0
OUT16 O2 OUT16 Line of GPTA1
OUT16 O3 OUT16 Line of LTCA2

Data Sheet 29 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
C11 P3.9 I/O A1/ Port 3 General Purpose I/O Line 9
PU
IN17 I IN17 Line of GPTA0
IN17 I IN17 Line of GPTA1
IN17 I IN17 Line of LTCA2
OUT17 O1 OUT17 Line of GPTA0
OUT17 O2 OUT17 Line of GPTA1
OUT17 O3 OUT17 Line of LTCA2
C10 P3.10 I/O A1+/ Port 3 General Purpose I/O Line 10
PU
IN18 I IN18 Line of GPTA0
IN18 I IN18 Line of GPTA1
IN18 I IN18 Line of LTCA2
CCPOS1A I CCU62
T13HRB I CCU63
T3EUDB I GPT120
T3EUDA I GPT121
OUT18 O1 OUT18 Line of GPTA0
OUT18 O2 OUT18 Line of GPTA1
OUT18 O3 OUT18 Line of LTCA2
D13 P3.11 I/O A1/ Port 3 General Purpose I/O Line 11
PU
IN19 I IN19 Line of GPTA0
IN19 I IN19 Line of GPTA1
IN19 I IN19 Line of LTCA2
OUT19 O1 OUT19 Line of GPTA0
OUT19 O2 OUT19 Line of GPTA1
OUT19 O3 OUT19 Line of LTCA2

Data Sheet 30 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
D11 P3.12 I/O A1/ Port 3 General Purpose I/O Line 12
PU
IN20 I IN20 Line of GPTA0
IN20 I IN20 Line of GPTA1
IN20 I IN20 Line of LTCA2
CCPOS2A I CCU62
T12HRC I CCU63
T13HRC I CCU63
T4INB I GPT120
T4INA I GPT121
OUT20 O1 OUT20 Line of GPTA0
OUT20 O2 OUT20 Line of GPTA1
OUT20 O3 OUT20 Line of LTCA2
D12 P3.13 I/O A1/ Port 3 General Purpose I/O Line 13
PU
IN21 I IN21 Line of GPTA0
IN21 I IN21 Line of GPTA1
IN21 I IN21 Line of LTCA2
OUT21 O1 OUT21 Line of GPTA0
OUT21 O2 OUT21 Line of GPTA1
OUT21 O3 OUT21 Line of LTCA2

Data Sheet 31 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
A10 P3.14 I/O A1/ Port 3 General Purpose I/O Line 14
PU
IN22 I IN22 Line of GPTA0
IN22 I IN22 Line of GPTA1
IN22 I IN22 Line of LTCA2
T13HRE I CCU63
OUT22 O1 OUT22 Line of GPTA0
OUT22 O2 OUT22 Line of GPTA1
OUT22 O3 OUT22 Line of LTCA2
B9 P3.15 I/O A1/ Port 3 General Purpose I/O Line 15
PU
IN23 I IN23 Line of GPTA0
IN23 I IN23 Line of GPTA1
IN23 I IN23 Line of LTCA2
OUT23 O1 OUT23 Line of GPTA0
OUT23 O2 OUT23 Line of GPTA1
OUT23 O3 OUT23 Line of LTCA2
Port 4
AD10 P4.0 I/O A1+/ Port 4 General Purpose I/O Line 0
PU
IN24 I IN24 Line of GPTA0
IN24 I IN24 Line of GPTA1
IN24 I IN24 Line of LTCA2
MRST2A I SSC2 Master Receive Input A (Master Mode)
OUT24 O1 OUT24 Line of GPTA0
OUT24 O2 OUT24 Line of GPTA1
MRST2 O3 SSC2 Slave Transmit Output (Slave Mode)

Data Sheet 32 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
AE10 P4.1 I/O A1+/ Port 4 General Purpose I/O Line 1
PU
IN25 I IN25 Line of GPTA0
IN25 I IN25 Line of GPTA1
IN25 I IN25 Line of LTCA2
MTSR2A I SSC2 Slave Receive Input A (Slave Mode)
MRSTG2A I SSC Guardian 2 Master Receive Input A
(Master Mode)
OUT25 O1 OUT25 Line of GPTA0
OUT25 O2 OUT25 Line of GPTA1
MTSR2 O3 SSC2 Master Transmit Output (Master
Mode)3)
AD11 P4.2 I/O A1+/ Port 4 General Purpose I/O Line 2
PU
IN26 I IN26 Line of GPTA0
IN26 I IN26 Line of GPTA1
IN26 I IN26 Line of LTCA2
SCLK2 I SSC2 Input
OUT26 O1 OUT26 Line of GPTA0
OUT26 O2 OUT26 Line of GPTA1
SCLK2 O3 SSC2 Output
AE11 P4.3 I/O A1+/ Port 4 General Purpose I/O Line 3
PU
IN27 I IN27 Line of GPTA0
IN27 I IN27 Line of GPTA1
IN27 I IN27 Line of LTCA2
OUT27 O1 OUT27 Line of GPTA0
OUT27 O2 OUT27 Line of GPTA1
SLSO20 O3 SSC2 Output

Data Sheet 33 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
AC12 P4.4 I/O A1+/ Port 4 General Purpose I/O Line 4
PU
IN28 I IN28 Line of GPTA0
IN28 I IN28 Line of GPTA1
IN28 I IN28 Line of LTCA2
OUT28 O1 OUT28 Line of GPTA0
OUT28 O2 OUT28 Line of GPTA1
SLSO21 O3 SSC2 Output
AD12 P4.5 I/O A1+/ Port 4 General Purpose I/O Line 5
PU
IN29 I IN29 Line of GPTA0
IN29 I IN29 Line of GPTA1
IN29 I IN29 Line of LTCA2
OUT29 O1 OUT29 Line of GPTA0
OUT29 O2 OUT29 Line of GPTA1
SLSO22 O3 SSC2 Output
AF10 P4.6 I/O A1+/ Port 4 General Purpose I/O Line 6
PU
IN30 I IN30 Line of GPTA0
IN30 I IN30 Line of GPTA1
IN30 I IN30 Line of LTCA2
OUT30 O1 OUT30 Line of GPTA0
OUT30 O2 OUT30 Line of GPTA1
SLSO23 O3 SSC2 Output

Data Sheet 34 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
AE12 P4.7 I/O A1+/ Port 4 General Purpose I/O Line 7
PU
IN31 I IN31 Line of GPTA0
IN31 I IN31 Line of GPTA1
IN31 I IN31Line of LTCA2
T6INB I GPT120
T6INA I GPT121
OUT31 O1 OUT31 Line of GPTA0
OUT31 O2 OUT31 Line of GPTA1
SLSO24 O3 SSC2 Output
AC13 P4.8 I/O A1/ Port 4 General Purpose I/O Line 8
PU
IN32 I IN32 Line of GPTA0
IN32 I IN32 Line of GPTA1
CCPOS1A I CCU60
T13HRB I CCU61
T3EUDA I GPT120
T3EUDB I GPT121
OUT32 O1 OUT32 Line of GPTA0
OUT32 O2 OUT32 Line of GPTA1
OUT0 O3 OUT0 Line of LTCA2

Data Sheet 35 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
AB19 P4.9 I/O A1/ Port 4 General Purpose I/O Line 9
PU
IN33 I IN33 Line of GPTA0
IN33 I IN33 Line of GPTA1
CCPOS2A I CCU60
T12HRC I CCU61
T13HRC I CCU61
T4INA I GPT120
T4INB I GPT121
SLSI2 I SSC2
OUT33 O1 OUT33 Line of GPTA0
OUT33 O2 OUT33 Line of GPTA1
OUT1 O3 OUT1 Line of LTCA2
AF12 P4.10 I/O A1/ Port 4 General Purpose I/O Line 10
PU
IN34 I IN34 Line of GPTA0
IN34 I IN34 Line of GPTA1
T12HRB I CCU60
CCPOS0A I CCU61
T2INA I GPT120
T2INB I GPT121
OUT34 O1 OUT34 Line of GPTA0
OUT34 O2 OUT34 Line of GPTA1
OUT2 O3 OUT2 Line of LTCA2

Data Sheet 36 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
AD13 P4.11 I/O A1/ Port 4 General Purpose I/O Line 11
PU
IN35 I IN35 Line of GPTA0
IN35 I IN35 Line of GPTA1
OUT35 O1 OUT35 Line of GPTA0
OUT35 O2 OUT35 Line of GPTA1
OUT3 O3 OUT3 Line of LTCA2
AC14 P4.12 I/O A1/ Port 4 General Purpose I/O Line 12
PU
IN36 I IN36 Line of GPTA0
IN36 I IN36 Line of GPTA1
T13HRB I CCU60
CCPOS1A I CCU61
T2EUDA I GPT120
T2EUDB I GPT121
OUT36 O1 OUT36 Line of GPTA0
OUT36 O2 OUT36 Line of GPTA1
OUT4 O3 OUT4 Line of LTCA2
AE13 P4.13 I/O A1/ Port 4 General Purpose I/O Line 13
PU
IN37 I IN37 Line of GPTA0
IN37 I IN37 Line of GPTA1
OUT37 O1 OUT37 Line of GPTA0
OUT37 O2 OUT37 Line of GPTA1
OUT5 O3 OUT5 Line of LTCA2

Data Sheet 37 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
AF13 P4.14 I/O A1/ Port 4 General Purpose I/O Line 14
PU
IN38 I IN38 Line of GPTA0
IN38 I IN38 Line of GPTA1
T12HRC I CCU60
T13HRC I CCU60
CCPOS2A I CCU61
T4EUDA I GPT120
T4EUDB I GPT121
OUT38 O1 OUT38 Line of GPTA0
OUT38 O2 OUT38 Line of GPTA1
OUT6 O3 OUT6 Line of LTCA2
AD14 P4.15 I/O A1/ Port 4 General Purpose I/O Line 15
PU
IN39 I IN39 Line of GPTA0
IN39 I IN39 Line of GPTA1
OUT39 O1 OUT39 Line of GPTA0
OUT39 O2 OUT39 Line of GPTA1
OUT7 O3 OUT7 Line of LTCA2
Port 5
B13 P5.0 I/O A1+/ Port 5 General Purpose I/O Line 0
PU
RXD0A I ASC0 Receiver Input/Output A
T6EUDA I GPT120
T6EUDB I GPT121
RXD0A O1 ASC0 Receiver Input/Output A
OUT72 O2 OUT72 Line of GPTA0
OUT72 O3 OUT72 Line of GPTA1

Data Sheet 38 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
A13 P5.1 I/O A1+/ Port 5 General Purpose I/O Line 1
PU
TXD0 O1 ASC0 Transmitter Output A
OUT73 O2 OUT73 Line of GPTA0
OUT73 O3 OUT73 Line of GPTA1
A14 P5.2 I/O A2/ Port 5 General Purpose I/O Line 2
PU
RXD1A I ASC1 Receiver Input/Output A
RXD1A O1 ASC1 Receiver Input/Output A
OUT74 O2 OUT74 Line of GPTA0
OUT74 O3 OUT74 Line of GPTA1
B14 P5.3 I/O A1+/ Port 5 General Purpose I/O Line 3
PU
TXD1 O1 ASC1 Transmitter Output A
OUT75 O2 OUT75 Line of GPTA0
OUT75 O3 OUT75 Line of GPTA1
C15 P5.4 I/O A2/ Port 5 General Purpose I/O Line 4
PU
T13HRB I CCU62
CCPOS1A I CCU63
T2EUDB I GPT120
T2EUDA I GPT121
EN00 O1 MSC0 Device Select Output 0
RREADY0B O2 MLI0 Receive Channel ready Output B
OUT76 O3 OUT76 Line of GPTA0

Data Sheet 39 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
C14 P5.5 I/O A1+/ Port 5 General Purpose I/O Line 5
PU
SDI0 I MSC0 Serial Data Input
T12HRC I CCU62
T13HRC I CCU62
CCPOS2A I CCU63
T4EUDB I GPT120
T4EUDA I GPT121
OUT77 O1 OUT77 Line of GPTA0
OUT77 O2 OUT77 Line of GPTA1
OUT101 O3 OUT101 Line of LTCA2
B15 P5.6 I/O A2/ Port 5 General Purpose I/O Line 6
PU
CC60INA I CCU62
CC60INB I CCU63
EN10 O1 MSC1 Device Select Output 0
TVALID0B O2 MLI0 transmit Channel valid Output B
CC60 O3 CCU62
A15 P5.7 I/O A1+/ Port 5 General Purpose I/O Line 7
PU
SDI1 I MSC1 Serial Data Input
CC61INA I CCU62
CC61INB I CCU63
OUT79 O1 OUT79 Line of GPTA0
OUT79 O2 OUT79 Line of GPTA1
CC61 O3 CCU62

Data Sheet 40 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
D17 P5.8 I/O F/ Port 5 General Purpose I/O Line 8
PU
CC62INA I CCU62
CC62INB I CCU63
SON0 O1 MSC0 Differential Driver Serial Data Output
Negative
OUT80 O2 OUT80 Line of GPTA0
CC62 O3 CCU62
C16 P5.9 I/O F/ Port 5 General Purpose I/O Line 9
PU
SOP0A O1 MSC0 Differential Driver Serial Data Output
Positive A
OUT81 O2 OUT81 Line of GPTA0
COUT60 O3 CCU62
C17 P5.10 I/O F/ Port 5 General Purpose I/O Line 10
PU
FCLN0 O1 MSC0 Differential Driver Clock Output
Negative
OUT82 O2 OUT82 Line of GPTA0
COUT61 O3 CCU62
C18 P5.11 I/O F/ Port 5 General Purpose I/O Line 11
PU
FCLP0A O1 MSC0 Differential Driver Clock Output
Positive A
OUT83 O2 OUT83 Line of GPTA0
COUT62 O3 CCU62
A16 P5.12 I/O F/ Port 5 General Purpose I/O Line 12
PU
SON1 O1 MSC1 Differential Driver Serial Data Output
Negative
OUT84 O2 OUT84 Line of GPTA0
OUT84 O3 OUT84 Line of GPTA1

Data Sheet 41 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
B16 P5.13 I/O F/ Port 5 General Purpose I/O Line 13
PU
SOP1A O1 MSC1 Differential Driver Serial Data Output
Positive A
OUT85 O2 OUT85 Line of GPTA0
OUT85 O3 OUT85 Line of GPTA1
B17 P5.14 I/O F/ Port 5 General Purpose I/O Line 14
PU
FCLN1 O1 MSC1 Differential Driver Clock Output
Negative
OUT86 O2 OUT86 Line of GPTA0
OUT86 O3 OUT86 Line of GPTA1
A17 P5.15 I/O F/ Port 5 General Purpose I/O Line 15
PU
FCLNP1A O1 MSC1 Differential Driver Clock Output
Positive A
OUT87 O2 OUT87 Line of GPTA0
OUT87 O3 OUT87 Line of GPTA1
Port 6
F3 P6.4 I/O A1+/ Port 6 General Purpose I/O Line 4
PU
MTSR1 I SSC1 Slave Receive Input (Slave Mode)
MRSTG1 I SSC Guardian 1 Master Receive Input
(Master Mode)
MTSR1 O1 SSC1 Master Transmit Output (Master
Mode)3)
Reserved O2 -
Reserved O3 -

Data Sheet 42 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
G4 P6.5 I/O A1+/ Port 6 General Purpose I/O Line 5
PU
MRST1 I SSC1 Master Receive Input (Master Mode)
MRST1 O1 SSC1 Slave Transmit Output (Slave Mode)
Reserved O2 -
Reserved O3 -
E3 P6.6 I/O A1+/ Port 6 General Purpose I/O Line 6
PU
SCLK1 I SSC1 Clock Input/Output
SCLK1 O1 SSC1 Clock Input/Output
Reserved O2 -
Reserved O3 -
G3 P6.7 I/O A1+/ Port 6 General Purpose I/O Line 7
PU
SLSI1 I SSC1 slave Select Input
T6OFL O1 GPT120
Reserved O2 -
Reserved O3 -
F4 P6.8 I/O A2/ Port 6 General Purpose I/O Line 8
PU
RXDCAN0 I CAN Node 0 Receiver Input 0
CAN Node 3 Receiver Input 1
RXD0B I ASC0 Receiver Input/Output B
CAPINB I GPT120
CAPINA I GPT121
Reserved O1 -
RXD0B O2 ASC0 Receiver Input/Output B
Reserved O3 -

Data Sheet 43 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
E4 P6.9 I/O A2/ Port 6 General Purpose I/O Line 9
PU
TXDCAN0 O1 CAN Node 0 Transmitter Output
TXD0 O2 ASC0 Transmitter Output B
T60FL O3 GPT120
F2 P6.10 I/O A2/ Port 6 General Purpose I/O Line 10
PU
RXDCAN1 I CAN Node 1 Receiver Input 0
CAN Node 0 Receiver Input 1
RXD1B I ASC1 Receiver Input/Output B
Reserved O1 -
RXD1B O2 ASC1 Receiver Input/Output B
TXENA O3 E-Ray Channel A transmit Data Output
enable 2)
E2 P6.11 I/O A2/ Port 6 General Purpose I/O Line 11
PU
TXDCAN1 O1 CAN Node 1 Transmitter Output
TXD1 O2 ASC1 Transmitter Output B
TXENB O3 E-Ray Channel B transmit Data Output
enable 2)
E1 P6.12 I/O A1/ Port 6 General Purpose I/O Line 12
PU
RXDCAN2 I CAN Node 2 Receiver Input 0
CAN Node 1 Receiver Input 1
RXDA1 I E-Ray Channel A Receive Data Input 1 2)
Reserved O1 -
Reserved O2 -
COUT61 O3 CCU60

Data Sheet 44 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
G2 P6.13 I/O A2/ Port 6 General Purpose I/O Line 13
PU
TXDCAN2 O1 CAN Node 2 Transmitter Output
TXDA O2 E-Ray Channel A transmit Data Output 2)
COUT62 O3 CCU60
F1 P6.14 I/O A1/ Port 6 General Purpose I/O Line 14
PU
RXDCAN3 I CAN Node 3 Receiver Input 0
CAN Node 2 Receiver Input 1
RXDB1 I E-Ray Channel B Receive Data Input 1 2)
Reserved O1 -
Reserved O2 -
COUT63 O3 CCU60
G1 P6.15 I/O A2/ Port 6 General Purpose I/O Line 15
PU
CC60INB I CCU60
CC60INA I CCU61
TXDCAN3 O1 CAN Node 3 Transmitter Output
TXDB O2 E-Ray Channel B transmit Data Output 2)
CC60 O3 CCU61
Port 7
R3 P7.0 I/O A1+/ Port 7 General Purpose I/O Line 0
PU
MRST3 I SSC3 Master Receive Input (Slave Mode)
REQ4 I External trigger Input 4
AD2EMUX2 O1 ADC2 external multiplexer Control Output 2
MRST3 O2 SSC3 Slave Transmit Output (Maste Mode)
Reserved O3 -

Data Sheet 45 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
R2 P7.1 I/O A1+/ Port 7 General Purpose I/O Line 1
PU
REQ5 I External trigger Input 5
MTSR3 I SSC3 Slave Receive Input (Slave Mode)
MRSTG3B I SSC Guardian 3 Master Receive Input B
(Master Mode)
AD0EMUX2 O1 ADC0 external multiplexer Control Output 2
MTSR3 O2 SSC3 Master Transmit Output (Master
Mode)3)
Reserved O3 -
U4 P7.2 I/O A1+/ Port 7 General Purpose I/O Line 2
PU
SCLK3 I SSC3 Input
AD0EMUX0 O1 ADC0 external multiplexer Control Output 0
SCLK3 O2 SSC3 Output
Reserved O3 -
U3 P7.3 I/O A1+/ Port 7 General Purpose I/O Line 3
PU
AD0EMUX1 O1 ADC0 external multiplexer Control Output 1
SLSO30 O2 SSC3 Output
Reserved O3 -
T3 P7.4 I/O A1+/ Port 7 General Purpose I/O Line 4
PU
REQ6 I External trigger Input 6
AD2EMUX0 O1 ADC2 external multiplexer Control Output 0
SLSO31 O2 SSC3 Output
Reserved O3 -

Data Sheet 46 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
T2 P7.5 I/O A1+/ Port 7 General Purpose I/O Line 5
PU
REQ7 I External trigger Input 7
AD2EMUX1 O1 ADC2 external multiplexer Control Output 1
SLSO32 O2 SSC3 Output
Reserved O3 -
T1 P7.6 I/O A1+/ Port 7 General Purpose I/O Line 6
PU
AD1EMUX0 O1 ADC1 external multiplexer Control Output 0
SLSO33 O2 SSC3 Output
Reserved O3 -
U2 P7.7 I/O A1+/ Port 7 General Purpose I/O Line 7
PU
AD1EMUX1 O1 ADC1 external multiplexer Control Output 1
SLSO34 O2 SSC3 Output
Reserved O3 -
Port 8
H2 P8.0 I/O A2/ Port 8 General Purpose I/O Line 0
PU
IN40 I IN40 Line of GPTA0
IN40 I IN40 Line of GPTA1
SENT0 I SENT Digital Input
OUT40 O1 OUT40 Line of GPTA0
COUT62 O2 CCU61
TCLK1 O3 MLI1 transmit Channel Clock Output

Data Sheet 47 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
H1 P8.1 I/O A1/ Port 8 General Purpose I/O Line 1
PU
IN41 I IN41 Line of GPTA0
IN41 I IN41 Line of GPTA1
TREADY1A I MLI1 transmit Channel ready Input A
SENT1 I SENT Digital Input
CC61INA I CCU60
CC61INB I CCU61
OUT41 O1 OUT41 Line of GPTA0
CC61 O2 CCU60
SENT1 O3 SENT Digital Output
J3 P8.2 I/O A2/ Port 8 General Purpose I/O Line 2
PU
IN42 I IN42 Line of GPTA0
IN42 I IN42 Line of GPTA1
SENT2 I SENT Digital Input
CAPINA I GPT120
CAPINB I GPT121
COUT63 O1 CCU61
OUT42 O2 OUT42 Line of GPTA1
TVALID1A O3 MLI1 transmit Channel valid Output A

Data Sheet 48 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
J2 P8.3 I/O A2/ Port 8 General Purpose I/O Line 3
PU
IN43 I IN43 Line of GPTA0
IN43 I IN43 Line of GPTA1
SENT3 I SENT Digital Input
CC62INA I CCU60
CC62INB I CCU61
OUT43 O1 OUT43 Line of GPTA0
CC62 O2 CCU60
TDATA1 O3 MLI1 transmit Channel Data Output A
J1 P8.4 I/O A1/ Port 8 General Purpose I/O Line 4
PU
IN44 I IN44 Line of GPTA0
IN44 I IN44 Line of GPTA1
RCLK1A I MLI1 Receive Channel Clock Input A
SENT4 I SENT Digital Input
CC62INB I CCU60
CC62INA I CCU61
OUT44 O1 OUT44 Line of GPTA0
CC62 O2 CCU61
T3OUT O3 GPT121

Data Sheet 49 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
K2 P8.5 I/O A2/ Port 8 General Purpose I/O Line 5
PU
IN45 I IN45 Line of GPTA0
IN45 I IN45 Line of GPTA1
SENT5 I SENT Digital Input
CTRAPA I CCU60
CTRAPB I CCU62
CC60INC I CCU60
T12HRE I CCU61
CC61INC I CCU61
OUT45 O1 OUT45 Line of GPTA0
OUT45 O2 OUT45 Line of GPTA1
RREADY1A O3 MLI1 Receive Channel ready Output A
K3 P8.6 I/O A1/ Port 8 General Purpose I/O Line 6
PU
IN46 I IN46 Line of GPTA0
IN46 I IN46 Line of GPTA1
RVALID1A I MLI1 Receive Channel valid Input A
SENT6 I SENT Digital Input
OUT46 O1 OUT46 Line of GPTA0
COUT60 O2 CCU61
T6OUT O3 GPT120

Data Sheet 50 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
K1 P8.7 I/O A1/ Port 8 General Purpose I/O Line 7
PU
IN47 I IN47 Line of GPTA0
IN47 I IN47 Line of GPTA1
RDATA1A I MLI1 Receive Channel Data Input A
SENT7 I SENT Digital Input
OUT47 O1 OUT47 Line of GPTA0
COUT61 O2 CCU61
T6OUT O3 GPT121
Port 9
A19 P9.0 I/O A2/ Port 9 General Purpose I/O Line 0
PU
IN48 I IN48 Line of GPTA0
IN48 I IN48 Line of GPTA1
COUT63 O1 CCU62
OUT48 O2 OUt48 Line of GPTA1
EN12 O3 MSC1 Device Select Output 2
B19 P9.1 I/O A2/ Port 9 General Purpose I/O Line 1
PU
IN49 I IN49 Line of GPTA0
IN49 I IN49 Line of GPTA1
CC60INB I CCU62
CC60INA I CCU63
CC60 O1 CCU63
OUT49 O2 OUT49 Line of GPTA1
EN11 O3 MSC1 Device Select Output 1

Data Sheet 51 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
B20 P9.2 I/O A2/ Port 9 General Purpose I/O Line 2
PU
IN50 I IN50 Line of GPTA0
IN50 I IN50 Line of GPTA1
CC61INB I CCU62
CC61INA I CCU63
CC61 O1 CCU63
OUT50 O2 OUT50 Line of GPTA1
SOP1B O3 MSC1 serial Data Output
A20 P9.3 I/O A2/ Port 9 General Purpose I/O Line 3
PU
IN51 I IN51 Line of GPTA0
IN51 I IN51 Line of GPTA1
CC62INB I CCU62
CC62INA I CCU63
CC62 O1 CCU63
OUT51 O2 OUT51 Line of GPTA1
FCLP1B O3 MSC1 Clock Output
D18 P9.4 I/O A2/ Port 9 General Purpose I/O Line 4
PU
IN52 I IN52 Line of GPTA0
IN52 I IN52 Line of GPTA1
COUT60 O1 CCU63
OUT52 O2 OUT52 Line of GPTA1
EN03 O3 MSC0 Device Select Output 3

Data Sheet 52 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
D19 P9.5 I/O A2/ Port 9 General Purpose I/O Line 5
PU
IN53 I IN53 Line of GPTA0
IN53 I IN53 Line of GPTA1
SENT1 I SENT Digital Input
COUT61 O1 CCU63
OUT53 O2 OUT53 Line of GPTA1
EN02 O3 MSC0 Device Select Output 2
C19 P9.6 I/O A2/ Port 9 General Purpose I/O Line 6
PU
IN54 I IN54 Line of GPTA0
IN54 I IN54 Line of GPTA1
SENT3 I SENT Digital Input
OUT54 O1 OUT54 Line of GPTA0
SENT3 O2 SENT Digital Output
EN01 O3 MSC0 Device Select Output 1
D20 P9.7 I/O A2/ Port 9 General Purpose I/O Line 7
PU
IN55 I IN55 Line of GPTA0
IN55 I IN55 Line of GPTA1
SENT4 I SENT Digital Input
OUT55 O1 OUT55 Line of GPTA0
SENT4 O2 SENT Digital Output
SOP0B O3 MSC0 serial Data Output
C20 P9.8 I/O A2/ Port 9 General Purpose I/O Line 8
PU
SENT6 I SENT Digital Input
COUT62 O1 CCU63
SENT6 O2 SENT Digital Output
FCLP0B O3 MSC0 Clock Output

Data Sheet 53 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
A21 P9.9 I/O A1/ Port 9 General Purpose I/O Line 9
PU
SENT0 I SENT Digital Input
Reserved O1 -
SENT0 O2 SENT Digital Output
Reserved O3 -
B21 P9.10 I/O A1/ Port 9 General Purpose I/O Line 10
PU
EMGSTOP I Emergency Stop
SENT7 I SENT Digital Input
COUT63 O1 CCU63
SENT7 O2 SENT Digital Output
Reserved O3 -
C21 P9.11 I/O A1/ Port 9 General Purpose I/O Line 11
PU
SENT2 I SENT Digital Input
Reserved O1 -
SENT2 O2 SENT Digital Output
Reserved O3 -
D21 P9.12 I/O A1/ Port 9 General Purpose I/O Line 12
PU
SENT5 I SENT Digital Input
Reserved O1 -
SENT5 O2 SENT Digital Output
Reserved O3 -

Data Sheet 54 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
C26 P9.13 I/O A2/ Port 9 General Purpose I/O Line 13
PU
BRKIN I OCDS Break Input
ECTT1 I TTCAN Input
Reserved O1 -
Reserved O2 -
Reserved O3 -
BRKOUT O OCDS Break Output
D26 P9.14 I/O A2/ Port 9 General Purpose I/O Line 14
PU
BRKIN I OCDS Break Input
ECTT2 I TTCAN Input
REQ15 I External trigger Input 15
Reserved O1 -
Reserved O2 -
Reserved O3 -
BRKOUT O OCDS Break Output
Port 10
AE15 P10.0 I/O A2/ Port 10 General Purpose I/O Line 0
PU
MRST0 I SSC0 Master Receive Input (Master Mode)
MRST0 O1 SSC0 Slave Transmit Output (Slave Mode)
Reserved O2 -
Reserved O3 -

Data Sheet 55 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
AF15 P10.1 I/O A2/ Port 10 General Purpose I/O Line 1
PU
MTSR0 I SSC0 Slave Receive Input (Slave Mode)
MRSTG0 I SSC Guardian 0 Master Receive Input
(Master Mode)
MTSR0 O1 SSC0 Master Transmit Output (Master
Mode)
Reserved O2 -
Reserved O3 -
AD15 P10.2 I/O A1/ Port 10 General Purpose I/O Line 2
PU
SLSI0 I SSC0 Slave Select Input
Reserved O1 -
Reserved O2 -
Reserved O3 -
AF14 P10.3 I/O A2/ Port 10 General Purpose I/O Line 3
PU
SCLK0 I SSC0 Clock Input/Output
SCLK0 O1 SSC0 Clock Input/Output
Reserved O2 -
Reserved O3 -
AE14 P10.4 I/O A1+/ Port 10 General Purpose I/O Line 4
PU
SLSO0 O1 SSC0 Slave Select Output Line 0
Reserved O2 -
Reserved O3 -
AC15 P10.5 I/O A1+/ Port 10 General Purpose I/O Line 5
PU
SLSO1 O1 SSC0 Slave Select Output Line 1
Reserved O2 -
Reserved O3 -

Data Sheet 56 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
Port 11
J26 P11.0 I/O B/ Port 11 General Purpose I/O Line 0
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
A0 O EBU Address Bus Line 0
K25 P11.1 I/O B/ Port 11 General Purpose I/O Line 1
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
A1 O EBU Address Bus Line 1
K26 P11.2 I/O B/ Port 11 General Purpose I/O Line 2
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
A2 O EBU Address Bus Line 2
J23 P11.3 I/O B/ Port 11 General Purpose I/O Line 3
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
A3 O EBU Address Bus Line 3
K24 P11.4 I/O B/ Port 11 General Purpose I/O Line 4
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
A4 O EBU Address Bus Line 4

Data Sheet 57 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
L25 P11.5 I/O B/ Port 11 General Purpose I/O Line 5
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
A5 O EBU Address Bus Line 5
L26 P11.6 I/O B/ Port 11 General Purpose I/O Line 6
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
A6 O EBU Address Bus Line 6
K23 P11.7 I/O B/ Port 11 General Purpose I/O Line 7
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
A7 O EBU Address Bus Line 7
M26 P11.8 I/O B/ Port 11 General Purpose I/O Line 8
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
A8 O EBU Address Bus Line 8
M25 P11.9 I/O B/ Port 11 General Purpose I/O Line 9
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
A9 O EBU Address Bus Line 9

Data Sheet 58 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
M24 P11.10 I/O B/ Port 11 General Purpose I/O Line 10
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
A10 O EBU Address Bus Line 10
L24 P11.11 I/O B/ Port 11 General Purpose I/O Line 11
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
A11 O EBU Address Bus Line 11
N26 P11.12 I/O B/ Port 11 General Purpose I/O Line 12
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
A12 O EBU Address Bus Line 12
N23 P11.13 I/O B/ Port 11 General Purpose I/O Line 13
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
A13 O EBU Address Bus Line 13
N24 P11.14 I/O B/ Port 11 General Purpose I/O Line 14
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
A14 O EBU Address Bus Line 14

Data Sheet 59 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
N25 P11.15 I/O B/ Port 11 General Purpose I/O Line 15
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
A15 O EBU Address Bus Line 15
Port 12
P26 P12.0 I/O B/ Port 12 General Purpose I/O Line 0
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
A16 O EBU Address Bus Line 16
P24 P12.1 I/O B/ Port 12 General Purpose I/O Line 1
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
A17 O EBU Address Bus Line 17
P25 P12.2 I/O B/ Port 12 General Purpose I/O Line 2
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
A18 O EBU Address Bus Line 18
R24 P12.3 I/O B/ Port 12 General Purpose I/O Line 3
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
A19 O EBU Address Bus Line 19

Data Sheet 60 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
R26 P12.4 I/O B/ Port 12 General Purpose I/O Line 4
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
A20 O EBU Address Bus Line 20
R25 P12.5 I/O B/ Port 12 General Purpose I/O Line 5
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
A21 O EBU Address Bus Line 21
J24 P12.6 I/O B/ Port 12 General Purpose I/O Line 6
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
A22 O EBU Address Bus Line 22
J25 P12.7 I/O B/ Port 12 General Purpose I/O Line 7
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
A23 O EBU Address Bus Line 23
Port 13

Data Sheet 61 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
T26 P13.0 I/O B/ Port 13 General Purpose I/O Line 0
PU
AD0 I EBU Address/Data Bus Line 0
OUT88 O1 OUT88 Line of GPTA0
OUT88 O2 OUT88 Line of GPTA1
OUT80 O3 OUT80 Line of LTCA2
AD0 O EBU Address/Data Bus Line 0
T24 P13.1 I/O B/ Port 13 General Purpose I/O Line 1
PU
AD1 I EBU Address/Data Bus Line 1
OUT89 O1 OUT89 Line of GPTA0
OUT89 O2 OUT89 Line of GPTA1
OUT81 O3 OUT81 Line of LTCA2
AD1 O EBU Address/Data Bus Line 1
U26 P13.2 I/O B/ Port 13 General Purpose I/O Line 2
PU
AD2 I EBU Address/Data Bus Line 2
OUT90 O1 OUT90 Line of GPTA0
OUT90 O2 OUT90 Line of GPTA1
OUT82 O3 OUT82 Line of LTCA2
AD2 O EBU Address/Data Bus Line 2
T25 P13.3 I/O B/ Port 13 General Purpose I/O Line 3
PU
AD3 I EBU Address/Data Bus Line 3
OUT91 O1 OUT91 Line of GPTA0
OUT91 O2 OUT91 Line of GPTA1
OUT83 O3 OUT83 Line of LTCA2
AD3 O EBU Address/Data Bus Line 3

Data Sheet 62 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
V26 P13.4 I/O B/ Port 13 General Purpose I/O Line 4
PU
AD4 I EBU Address/Data Bus Line 4
OUT92 O1 OUT92 Line of GPTA0
OUT92 O2 OUT92 Line of GPTA1
OUT84 O3 OUT84 Line of LTCA2
AD4 O EBU Address/Data Bus Line 4
U25 P13.5 I/O B/ Port 13 General Purpose I/O Line 5
PU
AD5 I EBU Address/Data Bus Line 5
OUT93 O1 OUT93 Line of GPTA0
OUT93 O2 OUT93 Line of GPTA1
OUT85 O3 OUT85 Line of LTCA2
AD5 O EBU Address/Data Bus Line 5
U23 P13.6 I/O B/ Port 13 General Purpose I/O Line 6
PU
AD6 I EBU Address/Data Bus Line 6
OUT94 O1 OUT94 Line of GPTA0
OUT94 O2 OUT94 Line of GPTA1
OUT86 O3 OUT86 Line of LTCA2
AD6 O EBU Address/Data Bus Line 6
W26 P13.7 I/O B/ Port 13 General Purpose I/O Line 7
PU
AD7 I EBU Address/Data Bus Line 7
OUT95 O1 OUT95 Line of GPTA0
OUT95 O2 OUT95 Line of GPTA1
OUT87 O3 OUT87 Line of LTCA2
AD7 O EBU Address/Data Bus Line 7

Data Sheet 63 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
V25 P13.8 I/O B/ Port 13 General Purpose I/O Line 8
PU
AD8 I EBU Address/Data Bus Line 8
OUT96 O1 OUT96 Line of GPTA0
OUT96 O2 OUT96 Line of GPTA1
OUT88 O3 OUT88 Line of LTCA2
AD8 O EBU Address/Data Bus Line 8
U24 P13.9 I/O B/ Port 13 General Purpose I/O Line 9
PU
AD9 I EBU Address/Data Bus Line 9
OUT97 O1 OUT97 Line of GPTA0
OUT97 O2 OUT97 Line of GPTA1
OUT89 O3 OUT89 Line of LTCA2
AD9 O EBU Address/Data Bus Line 9
Y26 P13.10 I/O B/ Port 13 General Purpose I/O Line 10
PU
AD10 I EBU Address/Data Bus Line 10
OUT98 O1 OUT98 Line of GPTA0
OUT98 O2 OUT98 Line of GPTA1
OUT90 O3 OUT90 Line of LTCA2
AD10 O EBU Address/Data Bus Line 10
AA26 P13.11 I/O B/ Port 13 General Purpose I/O Line 11
PU
AD11 I EBU Address/Data Bus Line 11
OUT99 O1 OUT99 Line of GPTA0
OUT99 O2 OUT99 Line of GPTA1
OUT91 O3 OUT91 Line of LTCA2
AD11 O EBU Address/Data Bus Line 11

Data Sheet 64 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
W25 P13.12 I/O B/ Port 13 General Purpose I/O Line 12
PU
AD12 I EBU Address/Data Bus Line 12
OUT100 O1 OUT100 Line of GPTA0
OUT100 O2 OUT100 Line of GPTA1
OUT92 O3 OUT92 Line of LTCA2
AD12 O EBU Address/Data Bus Line 12
V24 P13.13 I/O B/ Port 13 General Purpose I/O Line 13
PU
AD13 I EBU Address/Data Bus Line 13
OUT101 O1 OUT101 Line of GPTA0
OUT101 O2 OUT101 Line of GPTA1
OUT93 O3 OUT93 Line of LTCA2
AD13 O EBU Address/Data Bus Line 13
Y25 P13.14 I/O B/ Port 13 General Purpose I/O Line 14
PU
AD14 I EBU Address/Data Bus Line 14
OUT102 O1 OUT102 Line of GPTA0
OUT102 O2 OUT102 Line of GPTA1
OUT94 O3 OUT94 Line of LTCA2
AD14 O EBU Address/Data Bus Line 14
AB26 P13.15 I/O B/ Port 13 General Purpose I/O Line 15
PU
AD15 I EBU Address/Data Bus Line 15
OUT103 O1 OUT103 Line of GPTA0
OUT103 O2 OUT103 Line of GPTA1
OUT95 O3 OUT95 Line of LTCA2
AD15 O EBU Address/Data Bus Line 15
Port 14

Data Sheet 65 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
W24 P14.0 I/O B/ Port 14 General Purpose I/O Line 0
PU
AD16 I EBU Address/Data Bus Line 16
CC60 O1 CCU60
OUT96 O2 OUT96 Line of GPTA1
OUT96 O3 OUT96 Line of LTCA2
AD16 O EBU Address/Data Bus Line 16
AA25 P14.1 I/O B/ Port 14 General Purpose I/O Line 1
PU
AD17 I EBU Address/Data Bus Line 17
CC61 O1 CCU60
OUT97 O2 OUT97 Line of GPTA1
OUT97 O3 OUT97 Line of LTCA2
AD17 O EBU Address/Data Bus Line 17
Y24 P14.2 I/O B/ Port 14 General Purpose I/O Line 2
PU
AD18 I EBU Address/Data Bus Line 18
CC62 O1 CCU60
OUT98 O2 OUT98 Line of GPTA1
OUT98 O3 OUT98 Line of LTCA2
AD18 O EBU Address/Data Bus Line 18
AA23 P14.3 I/O B/ Port 14 General Purpose I/O Line 3
PU
AD19 I EBU Address/Data Bus Line 19
COUT60 O1 CCU60
OUT99 O2 OUT99 Line of GPTA1
OUT99 O3 OUT99 Line of LTCA2
AD19 O EBU Address/Data Bus Line 19

Data Sheet 66 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
AB25 P14.4 I/O B/ Port 14 General Purpose I/O Line 4
PU
AD20 I EBU Address/Data Bus Line 20
COUT61 O1 CCU60
OUT100 O2 OUT100 Line of GPTA1
OUT100 O3 OUT100 Line of LTCA2
AD20 O EBU Address/Data Bus Line 20
AB24 P14.5 I/O B/ Port 14 General Purpose I/O Line 5
PU
AD21 I EBU Address/Data Bus Line 21
COUT62 O1 CCU60
OUT101 O2 OUT101 Line of GPTA1
OUT101 O3 OUT101 Line of LTCA2
AD21 O EBU Address/Data Bus Line 21
AA24 P14.6 I/O B/ Port 14 General Purpose I/O Line 6
PU
AD22 I EBU Address/Data Bus Line 22
COUT63 O1 CCU60
OUT102 O2 OUT102 Line of GPTA1
OUT102 O3 OUT102 Line of LTCA2
AD22 O EBU Address/Data Bus Line 22
AC26 P14.7 I/O B/ Port 14 General Purpose I/O Line 7
PU
AD23 I EBU Address/Data Bus Line 23
CC60 O1 CCU61
OUT103 O2 OUT103 Line of GPTA1
OUT103 O3 OUT103 Line of LTCA2
AD23 O EBU Address/Data Bus Line 23

Data Sheet 67 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
AD26 P14.8 I/O B/ Port 14 General Purpose I/O Line 8
PU
AD24 I EBU Address/Data Bus Line 24
CC61 O1 CCU61
T3OUT O2 GPT120
OUT104 O3 OUT104 Line of LTCA2
AD24 O EBU Address/Data Bus Line 24
AC25 P14.9 I/O B/ Port 14 General Purpose I/O Line 9
PU
AD25 I EBU Address/Data Bus Line 25
CC62 O1 CCU61
T3OUT O2 GPT121
OUT105 O3 OUT105 Line of LTCA2
AD25 O EBU Address/Data Bus Line 25
AE26 P14.10 I/O B/ Port 14 General Purpose I/O Line 10
PU
AD26 I EBU Address/Data Bus Line 26
COUT60 O1 CCU61
T6OUT O1 GPT120
OUT106 O3 OUT106 Line of LTCA2
AD26 O EBU Address/Data Bus Line 26
AD25 P14.11 I/O B/ Port 14 General Purpose I/O Line 11
PU
AD27 I EBU Address/Data Bus Line 27
COUT61 O1 CCU61
T6OUT O1 GPT121
OUT107 O3 OUT107 Line of LTCA2
AD27 O EBU Address/Data Bus Line 27

Data Sheet 68 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
AC24 P14.12 I/O B/ Port 14 General Purpose I/O Line 12
PU
AD28 I EBU Address/Data Bus Line 28
COUT62 O1 CCU61
OUT108 O2 OUT108 Line of GPTA1
OUT108 O3 OUT108 Line of LTCA2
AD28 O EBU Address/Data Bus Line 28
AE25 P14.13 I/O B/ Port 14 General Purpose I/O Line 13
PU
AD29 I EBU Address/Data Bus Line 29
COUT63 O1 CCU61
OUT109 O2 OUT109 Line of GPTA1
OUT109 O3 OUT109 Line of LTCA2
AD29 O EBU Address/Data Bus Line 29
AE24 P14.14 I/O B/ Port 14 General Purpose I/O Line 14
PU
AD30 I EBU Address/Data Bus Line 30
T3INC I GPT120
T3IND I GPT121
OUT110 O1 OUT110 Line of GPTA0
OUT110 O2 OUT110 Line of GPTA1
OUT110 O3 OUT110 Line of LTCA2
AD30 O EBU Address/Data Bus Line 30

Data Sheet 69 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
AD24 P14.15 I/O B/ Port 14 General Purpose I/O Line 15
PU
AD31 I EBU Address/Data Bus Line 31
T3EUDC I GPT120
T3EUDD I GPT121
OUT111 O1 OUT111 Line of GPTA0
OUT111 O2 OUT111 Line of GPTA1
OUT111 O3 OUT111 Line of LTCA2
AD31 O EBU Address/Data Bus Line 31
Port 15
AE21 P15.0 I/O B/ Port 15 General Purpose I/O Line 0
PU
T4INC I GPT120
T4IND I GPT121
CCPOS2B I CCU60
Reserved O1 -
Reserved O2 -
Reserved O3 -
CS0 O Chip Select Output Line 0
AD21 P15.1 I/O B/ Port 15 General Purpose I/O Line 1
PU
T4EUDC I GPT120
T4EUDD I GPT121
CCPOS2B I CCU61
Reserved O1 -
Reserved O2 -
Reserved O3 -
CS1 O Chip Select Output Line 1

Data Sheet 70 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
AD20 P15.2 I/O B/ Port 15 General Purpose I/O Line 2
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
CS2 O Chip Select Output Line 2
AD19 P15.3 I/O B/ Port 15 General Purpose I/O Line 3
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
CS3 O Chip Select Output Line 3
AE17 P15.4 I/O B/ Port 15 General Purpose I/O Line 4
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
BC0 O Byte Control Line 0
AD17 P15.5 I/O B/ Port 15 General Purpose I/O Line 5
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
BC1 O Byte Control Line 1
AF18 P15.6 I/O B/ Port 15 General Purpose I/O Line 6
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
BC2 O Byte Control Line 2

Data Sheet 71 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
AE18 P15.7 I/O B/ Port 15 General Purpose I/O Line 7
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
BC3 O Byte Control Line 3
AF20 P15.8 I/O B/ Port 15 General Purpose I/O Line 8
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
RD O Read Control Line
AF21 P15.9 I/O B/ Port 15 General Purpose I/O Line 9
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
RD/WR O Write Control Line
AF22 P15.10 I/O B/ Port 15 General Purpose I/O Line 10
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
ADV O Address Valid Output
AE20 P15.11 I/O B/ Port 15 General Purpose I/O Line 11
PU
WAIT I Wait Input for inserting Wait-States
Reserved O1 -
Reserved O2 -
Reserved O3 -

Data Sheet 72 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
AF19 P15.12 I/O B/ Port 15 General Purpose I/O Line 12
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
MR/W O Motorola-style Read/Write Control Signal
AF23 P15.13 I/O B/ Port 15 General Purpose I/O Line 13
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
BAA O Burst Address Advance Output
AF24 P15.14 I/O B/ Port 15 General Purpose I/O Line 14
PU
BFCLKI I Burst FLASH Clock Input (Clock Feedback).
Reserved O1 -
Reserved O2 -
Reserved O3 -
AF25 P15.15 I/O B/ Port 15 General Purpose I/O Line 15
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
BFCLKO O Burst Mode Flash Clock Output (Non-
Differential)
Port 16

Data Sheet 73 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
AF17 P16.0 I/O B/ Port 16 General Purpose I/O Line 0
PU
HOLD I Hold Request Input
Reserved O1 -
Reserved O2 -
Reserved O3 -
AD18 P16.1 I/O B/ Port 16 General Purpose I/O Line 1
PU
HLDA I Hold Acknowledge Output
Reserved O1 -
Reserved O2 -
Reserved O3 -
HLDA O Hold Acknowledge Output
AD22 P16.2 I/O B/ Port 16 General Purpose I/O Line 2
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
BREQ O Bus Request Output
AE19 P16.3 I/O B/ Port 16 General Purpose I/O Line 3
PU
Reserved O1 -
Reserved O2 -
Reserved O3 -
CSCOMB O Combined Chip Select Output
Port 17
AC1 P17.0 I D/S Port 17 General Purpose I Line 04)
SENT0 I SENT Digital Input 0
AN8 I Analog Input : ADC0.CH8 5)

Data Sheet 74 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
AB2 P17.1 I D/S Port 17 General Purpose I Line 14)
SENT1 I SENT Digital Input 1
AN9 I Analog Input : ADC0.CH9 5)
Y3 P17.2 I D/S Port 17 General Purpose I Line 24)
SENT2 I SENT Digital Input 2
AN10 I Analog Input : ADC0.CH10 5)
AA2 P17.3 I D/S Port 17 General Purpose I Line 34)
SENT3 I SENT Digital Input 3
AN11 I Analog Input : ADC0.CH11 5)
AB1 P17.4 I D/S Port 17 General Purpose I Line 44)
SENT4 I SENT Digital Input 4
AN12 I Analog Input : ADC0.CH12 5)
W3 P17.5 I D/S Port 17 General Purpose I Line 54)
SENT5 I SENT Digital Input 5
AN13 I Analog Input : ADC0.CH13 5)
Y2 P17.6 I D/S Port 17 General Purpose I Line 64)
SENT6 I SENT Digital Input 6
AN14 I Analog Input : ADC0.CH14 5)
AA1 P17.7 I D/S Port 17 General Purpose I Line 74)
SENT7 I SENT Digital Input 7
AN15 I Analog Input : ADC0.CH15 5)
AE3 P17.8 I D/S Port 17 General Purpose I Line 84)
SENT0 I SENT Digital Input 0
AN36 I Analog Input : ADC2.CH4 5)

Data Sheet 75 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
AF2 P17.9 I D/S Port 17 General Purpose I Line 94)
SENT1 I SENT Digital Input 1
AN37 I Analog Input : ADC2.CH5 5)
AC4 P17.10 I D/S Port 17 General Purpose I Line 104)
SENT2 I SENT Digital Input 2
AN38 I Analog Input : ADC2.CH6 5)
AF3 P17.11 I D/S Port 17 General Purpose I Line 114)
SENT3 I SENT Digital Input 3
AN39 I Analog Input : ADC2.CH7 5)
AD4 P17.12 I D/S Port 17 General Purpose I Line 124)
SENT4 I SENT Digital Input 4
AN40 I Analog Input : ADC2.CH8 5)
AE4 P17.13 I D/S Port 17 General Purpose I Line 134)
SENT5 I SENT Digital Input 5
AN41 I Analog Input : ADC2.CH9 5)
AC5 P17.14 I D/S Port 17 General Purpose I Line 144)
SENT6 I SENT Digital Input 6
AN42 I Analog Input : ADC2.CH10 5)
AF4 P17.15 I D/S Port 17 General Purpose I Line 154)
SENT7 I SENT Digital Input 7
AN43 I Analog Input : ADC2.CH11 5)
Analog Input Port
AE1 AN0 I D Analog Input 0: ADC0.CH0 5)
AD2 AN1 I D Analog Input 1: ADC0.CH1 5)
AA4 AN2 I D Analog Input 2: ADC0.CH2 5)
AB3 AN3 I D Analog Input 3: ADC0.CH3 5)

Data Sheet 76 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
AC2 AN4 I D Analog Input 4: ADC0.CH4, ADC2.CH12 5)
AA3 AN5 I D Analog Input 5: ADC0.CH5, ADC2.CH13 5)
AD1 AN6 I D Analog Input 6: ADC0.CH6, ADC2.CH14 5)
AB4 AN7 I D Analog Input 7: ADC0.CH7, ADC2.CH15 5)
AC1 AN8 I D/S Analog Input 8: ADC0.CH8, SENT0 5)
AB2 AN9 I D/S Analog Input 9: ADC0.CH9, SENT1 5)
Y3 AN10 I D/S Analog Input 10: ADC0.CH10, SENT2 5)
AA2 AN11 I D/S Analog Input 11: ADC0.CH11, SENT3 5)
AB1 AN12 I D/S Analog Input 12: ADC0.CH12, SENT4 5)
W3 AN13 I D/S Analog Input 13: ADC0.CH13, SENT5 5)
Y2 AN14 I D/S Analog Input 14: ADC0.CH14, SENT6 5)
AA1 AN15 I D/S Analog Input 15: ADC0.CH15, SENT7 5)
V4 AN16 I D Analog Input 16: ADC1.CH0 5)
W2 AN17 I D Analog Input 17: ADC1.CH1 5)
Y1 AN18 I D Analog Input 18: ADC1.CH2 5)
V3 AN19 I D Analog Input 19: ADC1.CH3 5)
W1 AN20 I D Analog Input 20: ADC1.CH4 5)
V2 AN21 I D Analog Input 21: ADC1.CH5 5)
V1 AN22 I D Analog Input 22: ADC1.CH6 5)
U1 AN23 I D Analog Input 23: ADC1.CH7 5)
AC8 AN24 I D Analog Input 24: ADC1.CH8,
FADC_FADIN0P 6)
AD8 AN25 I D Analog Input 25: ADC1.CH9,
FADC_FADIN0N 6)
AC7 AN26 I D Analog Input 26: ADC1.CH10,
FADC_FADIN1P 6)

Data Sheet 77 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
AD7 AN27 I D Analog Input 27: ADC1.CH11,
FADC_FADIN1N 6)
AE6 AN28 I D Analog Input 28: ADC1.CH12,
FADC_FADIN2P 6)
AF6 AN29 I D Analog Input 29: ADC1.CH13,
FADC_FADIN2N 6)
AE7 AN30 I D Analog Input 30: ADC1.CH14,
FADC_FADIN3P 6)
AF7 AN31 I D Analog Input 31: ADC1.CH15,
FADC_FADIN3N 6)
AC3 AN32 I D Analog Input 32: ADC2.CH0 5)
AE2 AN33 I D Analog Input 33: ADC2.CH1 5)
AD3 AN34 I D Analog Input 34: ADC2.CH2 5)
AD5 AN35 I D Analog Input 35: ADC2.CH3 5)
AE3 AN36 I D/S Analog Input 36: ADC2.CH4, SENT0 5)
AF2 AN37 I D/S Analog Input 37: ADC2.CH5, SENT1 5)
AC4 AN38 I D/S Analog Input 38: ADC2.CH6, SENT2 5)
AF3 AN39 I D/S Analog Input 39: ADC2.CH7, SENT3 5)
AD4 AN40 I D/S Analog Input 40: ADC2.CH8, SENT4 5)
AE4 AN41 I D/S Analog Input 41: ADC2.CH9, SENT5 5)
AC5 AN42 I D/S Analog Input 42: ADC2.CH10, SENT6 5)
AF4 AN43 I D/S Analog Input 43: ADC2.CH11, SENT7 5)
System I/O
B22 PORST I PD Power-on Reset Input
A23 ESR0 I/O A2 External System Request Reset Input 0
Default configuration during and after reset is
open-drain driver. The driver drives low during
power-on reset.

Data Sheet 78 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
A22 ESR1 I/O A2/ External System Request Reset Input 1
PD
E24 TCK I PD JTAG Module Clock Input
DAP0 I Device Access Port Line 0
E25 TDI I A2/ JTAG Module Serial Data Input
PU
BRKIN I OCDS Break Input (Alternate Output)
BRKOUT O OCDS Break Output (Alternate Input)
B23 TESTMODE I PU Test Mode Select Input
F24 TMS I A2/ JTAG Module State Machine Control Input
PD
DAP1 I/O Device Access Port Line 1
F23 TRST I PD JTAG Module Reset/Enable Input
G26 XTAL1 I Main Oscillator/PLL/Clock Generator Input
G25 XTAL2 O Main Oscillator/PLL/Clock Generator Output
D25 TDO O A2/ JTAG Module Serial Data Output
PU
BRKIN I OCDS Break Input (Alternate Input)
BRKOUT O OCDS Break Output (Alternate Output)
DAP2 O Device Access Port Line 2
Power Supply
W4 VDDM - - ADC Analog Part Power Supply (3.3V - 5V)
Y4 VSSM - - ADC Analog Part Ground
AE5 VAREF0 - - ADC0 Reference Voltage
AF5 VAGND0 - - ADC0 Reference Ground
VAGND2 - - ADC2 Reference Ground
AD6 VAREF1 - - ADC1 Reference Voltage
AC6 VAGND1 - - ADC1 Reference Ground
AD9 VAREF2 - - ADC2 Reference Voltage

Data Sheet 79 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
AF8 VFAREF - - FADC Reference Voltage
AE8 VFAGND - - FADC Reference Ground
AE9 VDDMF - - FADC Analog Part Power Supply (3.3V)
AC9 VDDAF - - FADC Analog Part Logic Power Supply
(1.3V)
AF9 VSSMF - - FADC Analog Part Ground
VSSAF - - FADC Analog Part Logic Ground
A18, VDDFL3 - - Flash Power Supply (3.3V)
B18,
H3
F25 VSSOSC - - Main Oscillator Ground
VSS - - Digital Ground
F26 VDDOSC - - Main Oscillator Power Supply (1.3V)
E26 VDDOSC3 - - Main Oscillator Power Supply (3.3V)
G23 VDDPF - - E-Ray PLL Power Supply (1.3V)
G24 VDDPF3 - - E-Ray PLL Power Supply (3.3V)
AC11, VDD - - Digital Core Power Supply (1.3V)
AC20,
AB23,
V23,
P23,
E23,
D24,
C25,
B26,
D16,
D9,
H4,
R4

Data Sheet 80 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
AC16, VDDP - - Port Power Supply (3.3V)
AD16,
AE16,
AF16,
D22,
C23,
B24,
A25,
D14,
D7, K4
H23, VDDEBU - - EBU Port Power Supply (1.8V - 2.5V - 3.3V)
H24,
H25,
H26,
M23,
T23,
Y23,
AC18,
AC22
R1 VDDSB - - Emulation Stand-by SRAM Power Supply
(1.3V) (Emulation device only)
Note: This pin is N.C. in a productive device.
AC10, VSS - - Digital Ground (outer balls)
AC17,
AC19,
AC23,
W23,
R23,
L23,
D23,
C24,
B25,
A26,
D15,
D8,
J4, T4

Data Sheet 81 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
K10, VSS - - Digital Ground (center balls)
K11,
K12,
K13,
K14,
K15,
K16,
K17
L10, VSS - - Digital Ground (center balls cont’d)
L11,
L12,
L13,
L14,
L15,
L16,
L17
M10, VSS - - Digital Ground (center balls cont’d)
M11,
M12,
M13,
M14,
M15,
M16,
M17
N10, VSS - - Digital Ground (center balls cont’d)
N11,
N12,
N13,
N14,
N15,
N16,
N17

Data Sheet 82 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
P10, VSS - - Digital Ground (center balls cont’d)
P11,
P12,
P13,
P14,
P15,
P16,
P17
R10, VSS - - Digital Ground (center balls cont’d)
R11,
R12,
R13,
R14,
R15,
R16,
R17
T10, VSS - - Digital Ground (center balls cont’d)
T11,
T12,
T13,
T14,
T15,
T16,
T17
U10, VSS - - Digital Ground (center balls cont’d)
U11,
U12,
U13,
U14,
U15,
U16,
U17

Data Sheet 83 V 1.1.1, 2012-12

 TC1793

PinningTC1793 Pin Configuration

Table 2 Pin Definitions and Functions (cont’d)

Pin Symbol Ctrl. Type Function
A1, N.C. - - Not connected. These pins are reserved for
AF1, future extension and shall not be connected
AF26, externally.
A24,
C22,
AC21,
AD23,
AE22,
AE23
1) Only applicable in TC1793ED. Reserved in TC1793PD.
2) Only available for SAK-TC1793F-512F270EF, SAK-TC1793F-512F270EB, SAK-TC1793F-512F200EF, and
SAK-TC1793F-512F200EB.
3) The MTSR output of SSCx is overlayed with the MRSTG input of the related SSCGx
4) Analog Input overlayed with a SENT Digitial Input. The related port logic is used configure the input as either
analog input (default after reset) or digital input. The related port logic supports only the port input features as
the connected pads are input pads only.
5) IOZ1 valid for this pin is the parameter with overlayed = No in the ADC parameter table.
6) IOZ1 valid for this pin is the parameter with overlayed = Yes in the ADC parameter table.

Legend for Table 2

Column “Ctrl.”:
I = Input (for GPIO port lines with IOCR bit field selection PCx = 0XXXB)
O = Output
O0 = Output with IOCR bit field selection PCx = 1X00B
O1 = Output with IOCR bit field selection PCx = 1X01B (ALT1)
O2 = Output with IOCR bit field selection PCx = 1X10B(ALT2)
O3 = Output with IOCR bit field selection PCx = 1X11(ALT3)
Column “Type”:
A1 = Pad class A1 (LVTTL)
A1+ = Pad class A1+ (LVTTL)
A2 = Pad class A2 (LVTTL)
B = Pad class B(LVTTL)
F = Pad class F (LVDS/CMOS)
D = Pad class D (ADC)
S = Pad class S(SENT)
PU = with pull-up device connected during reset (PORST = 0)
PD = with pull-down device connected during reset (PORST = 0)
TR = tri-state during reset (PORST = 0)

Data Sheet 84 V 1.1.1, 2012-12

 TC1793

Identification Registers

4 Identification Registers
The Identification Registers uniquely identify the whole device.

Table 3 SAK-TC1793F-512F270EF Identification Registers

Short Name Value Address Stepping
CBS_JDPID 0000 6350H F000 0408H AB
CBS_JTAGID 1018 E083H F000 0464H AB
SCU_CHIPID 8700 9702H F000 0640H AB
SCU_MANID 0000 1820H F000 0644H AB
SCU_RTID 0000 0000H F000 0648H AB

Table 4 SAK-TC1793F-512F270EB Identification Registers

Short Name Value Address Stepping
CBS_JDPID 0000 6350H F000 0408H AB
CBS_JTAGID 1018 E083H F000 0464H AB
SCU_CHIPID 0700 9702H F000 0640H AB
SCU_MANID 0000 1820H F000 0644H AB
SCU_RTID 0000 0000H F000 0648H AB

Table 5 SAK-TC1793F-512F200EF Identification Registers

Short Name Value Address Stepping
CBS_JDPID 0000 6350H F000 0408H AB
CBS_JTAGID 1018 E083H F000 0464H AB
SCU_CHIPID 9700 9702H F000 0640H AB
SCU_MANID 0000 1820H F000 0644H AB
SCU_RTID 0000 0000H F000 0648H AB

Table 6 SAK-TC1793F-512F200EB Identification Registers

Short Name Value Address Stepping
CBS_JDPID 0000 6350H F000 0408H AB
CBS_JTAGID 1018 E083H F000 0464H AB
SCU_CHIPID 1700 9702H F000 0640H AB

Data Sheet 85 V 1.1.1, 2012-12

 TC1793

Identification Registers

Table 6 SAK-TC1793F-512F200EB Identification Registers (cont’d)

Short Name Value Address Stepping
SCU_MANID 0000 1820H F000 0644H AB
SCU_RTID 0000 0000H F000 0648H AB

Table 7 SAK-TC1793N-512F270EF Identification Registers

Short Name Value Address Stepping
CBS_JDPID 0000 6350H F000 0408H AB
CBS_JTAGID 1018 E083H F000 0464H AB
SCU_CHIPID 8700 B102H F000 0640H AB
SCU_MANID 0000 1820H F000 0644H AB
SCU_RTID 0000 0000H F000 0648H AB

Table 8 SAK-TC1793S-512F270EF Identification Registers

Short Name Value Address Stepping
CBS_JDPID 0000 6350H F000 0408H AB
CBS_JTAGID 1018 E083H F000 0464H AB
SCU_CHIPID 8700 AB02H F000 0640H AB
SCU_MANID 0000 1820H F000 0644H AB
SCU_RTID 0000 0000H F000 0648H AB

Data Sheet 86 V 1.1.1, 2012-12

 TC1793

Electrical ParametersGeneral Parameters

5 Electrical Parameters
This specification provides all electrical parameters of the TC1793.

5.1 General Parameters

5.1.1 Parameter Interpretation

The parameters listed in this section partly represent the characteristics of the TC1793
and partly its requirements on the system. To aid interpreting the parameters easily
when evaluating them for a design, they are marked with an two-letter abbreviation in
column “Symbol”:
• CC
Such parameters indicate Controller Characteristics which are a distinctive feature of
the TC1793 and must be regarded for a system design.
• SR
Such parameters indicate System Requirements which must provided by the
microcontroller system in which the TC1793 designed in.

Data Sheet 87 V 1.1.1, 2012-12

 TC1793

Electrical ParametersGeneral Parameters

5.1.2 Pad Driver and Pad Classes Summary

This section gives an overview on the different pad driver classes and its basic
characteristics. More details (mainly DC parameters) are defined in the Section 5.2.1.

Table 9 Pad Driver and Pad Classes Overview

Class Power Type Sub Class Speed Load Leakage Termination
Supply Grade 150oC
A 3.3 V LVTTL A1 6 MHz 100 pF 500 nA No
I/O, (e.g. GPIO)
LVTTL A1+ 25 50 pF 1 μA Series
outputs (e.g. serial MHz termination
I/Os) recommended
A2 40 50 pF 3 μA Series
(e.g. serial MHz termination
I/Os) recommended
B 3.3 V1) LVTTL 75 35 pF 6 μA Series
I/O MHz termination
2.5 V 75 35 pF recommended
1)
MHz
F 3.3 V LVDS – 50 – – Parallel
MHz termination,
100 Ω ± 10% 2)
CMOS – 6 MHz 50 pF –
DE 5V ADC – – – –
I 3.3 V LVTTL – – – –
(input
only)
1) Supplied via VDDEBU.
2) In applications where the LVDS pins are not used (disabled), these pins must be either left unconnected, or
properly terminated with the differential parallel termination of 100 Ω ± 10%.

Data Sheet 88 V 1.1.1, 2012-12

 TC1793

Electrical ParametersGeneral Parameters

5.1.3 Absolute Maximum Ratings

Stresses above the values listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional operation of
the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions may affect device reliability.

Table 10 Absolute Maximum Rating Parameters

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Con
dition
Storage temperature TST SR -65 – 150 °C –
Voltage at 1.3 V power supply VDD SR – – 2.0 V –
pins with respect to VSS
Voltage at 3.3 V power supply VDDP – – 4.33 V –
pins with respect to VSS SR
Voltage at 5 V power supply VDDM SR – – 7.0 V –
pins with respect to VSS
Voltage on any Class A input VIN SR -0.7 – VDDP + 0.7 V Whatever
pin and dedicated input pins or max. 4.33 is lower
with respect to VSS
Voltage on any Class D VAIN -0.6 – 7.0 V –
analog input pin with respect VAREFx
to VAGND SR
Voltage on any shared Class VAINF -0.6 – 7.0 V –
D analog input pin with VFAREF
respect to VSSAF, if the FADC SR
is switched through to the pin.
Input current on any pin IIN -10 – +10 mA
during overload condition
Absolute maximum sum of all IIN -25 – +25 mA
input circuit currents for one
port group during overload
condition1)
Absolute maximum sum of all ΣIIN -200 – 200 mA
input circuit currents during
overload condition

Data Sheet 89 V 1.1.1, 2012-12

 TC1793

Electrical ParametersGeneral Parameters

1) The port groups are defined in Table 15.

Data Sheet 90 V 1.1.1, 2012-12

 TC1793

Electrical ParametersGeneral Parameters

5.1.4 Pin Reliability in Overload

When receiving signals from higher voltage devices, low-voltage devices experience
overload currents and voltages that go beyond their own IO power supplies specification.
Table 11 defines overload conditions that will not cause any negative reliability impact if
all the following conditions are met:
• full operation life-time (24000 h) is not exceeded
• Operating Conditions are met for
– pad supply levels (VDDP, VDDM, or, VDDEBU)
– temperature
If a pin current is out of the Operating Conditions but within the overload parameters,
then the parameters functionality of this pin as stated in the Operating Conditions can no
longer be guaranteed. Operation is still possible in most cases but with relaxed
parameters.
Note: An overload condition on one or more pins does not require a reset.

Table 11 Overload Parameters

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Con
dition
Input current on any digital pin IIN -5 – +5 mA
during overload condition
except LVDS pins
Input current on LVDS pins IINLVDS -3 – +3 mA
Absolute sum of all input IING -20 – +20 mA
circuit currents for one port
group during overload
condition1)
Input current on analog pins IINANA -3 – +3 mA
Absolute sum of all analog IINSA -45 – +45 mA
input currents for analog
inputs during overload
condition
Absolute sum of all input ΣIINS -100 – 100 mA
circuit currents during
overload condition
1) The port groups are defined in Table 15.

Note: FADC input pins count as analog pin as they are overlayed with an ADC pins.

Data Sheet 91 V 1.1.1, 2012-12

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Table 12 PN-Junction Characteristics for positive Overload

Pad Type IIN = 3 mA IIN = 5 mA
A1 / A1+ / F UIN = VDDP + 0.6 V UIN = VDDP + 0.7 V
A2 UIN = VDDP + 0.5 V UIN = VDDP + 0.6 V
LVDS UIN = VDDP + 0.7 V -
D UIN = VDDM + 0.6 V -
S UIN = VDDM + 0.6 V -

Table 13 PN-Junction Characteristics for negative Overload

Pad Type IIN = -3 mA IIN = -5 mA
A1 / A1+ / F UIN = VSS - 0.6 V UIN = VSS - 0.7 V
A2 UIN = VSS - 0.5 V UIN = VSS - 0.6 V
LVDS UIN = VSS - 0.7 V -
D UIN = VSSM - 0.6 V -
S UIN = VSSM - 0.6 V -

Note: A series resistor at the pin to limit the current to the maximum permitted overload
current is sufficient to handle failure situations like short to battery without having
any negative reliability impact on the operational life-time.

Data Sheet 92 V 1.1.1, 2012-12

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5.1.5 Operating Conditions

The following operating conditions must not be exceeded in order to ensure correct
operation and reliability of the TC1793. All parameters specified in the following tables
refer to these operating conditions, unless otherwise noticed.
Digital supply voltages applied to the TC1793 must be static regulated voltages which
allow a typical voltage swing of ± 5 %.
All parameters specified in the following tables (Table 16 and following) refer to these
operating conditions (Table 14), unless otherwise noticed in the Note / Test Condition
column.
The Extended Range Operating Conditions did not increase area of validity of the
parameters defined in table 10 and later.

Table 14 Operating Conditions Parameters

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

Overload coupling factor KOVAN − − 0.0001 IOV≤ 0 mA;

for analog inputs, negative CC IOV≥ -1 mA;
analog
pad= 5.0 V
Overload coupling factor KOVAP − − 0.0000 IOV≤ 3 mA;
for analog inputs, positive CC 1 IOV≥ 0 mA;
analog
pad= 5.0 V
CPU Frequency fCPU SR − − 270 MHz SAK-TC1793F-
512F
270EB; SAK-
TC1793F-512F
270EF; SAK-
TC1793N-512F
270EF; SAK-
TC1793S-512F
270EF
− − 200 MHz SAK-TC1793F-
512F 200EF
SAK-TC1793F-
512F 200EB

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Table 14 Operating Conditions Parameters (cont’d)

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition
Modulated fCPU fCPU_mod − − 270 MHz SAK-TC1793F-
ulated SR 512F
270EB; SAK-
TC1793F-512F
270EF; SAK-
TC1793N-512F
270EF; SAK-
TC1793S-512F
270EF
− − 200 MHz SAK-TC1793F-
512F 200EF
SAK-TC1793F-
512F 200EB
FPI bus frequency fFPI SR − − 100 MHz
Modulated fFPI fFPI_modul − − 100- MHz MA = modulatio
ated SR 2*MA1) n amplitude
FSI frequency fFSI SR − − 150 MHz
Modulated fFSI fFSI_modul − − 150- MHz MA = modulatio
ated SR 2*MA1) n amplitude
PCP Frequency fPCP SR − − 200 MHz
Modulated fPCP fPCP_mod − − 200- MHz MA = modulatio
ulated SR 2*MA1) n amplitude
SRI Frequency fSRI SR − − 270 MHz SAK-TC1793F-
512F
270EB; SAK-
TC1793F-512F
270EF; SAK-
TC1793N-512F
270EF; SAK-
TC1793S-512F
270EF
− − 200 MHz SAK-TC1793F-
512F 200EF
SAK-TC1793F-
512F 200EB

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Table 14 Operating Conditions Parameters (cont’d)

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition
Modulated fSRI fSRI_modul − − 270 MHz SAK-TC1793F-
ated SR 512F
270EB; SAK-
TC1793F-512F
270EF; SAK-
TC1793N-512F
270EF; SAK-
TC1793S-512F
270EF
− − 200 MHz SAK-TC1793F-
512F 200EF
SAK-TC1793F-
512F 200EB
Inactive device pin current IID SR -1 − 1 mA All power
supply voltages
VDDx = 0
Short circuit current of ISC SR -5 − 5 mA
digital outputs2)
Absolute sum of short ΣISC_D − − 100 mA
circuit currents of the CC
device
Absolute sum of short ΣISC_PG − − 20 mA
circuit currents per pin CC
group
Ambient Temperature TA SR -40 − 125 °C
Junction temperature TJ SR -40 − 150 °C
Core Supply Voltage VDD SR 1.17 1.3 1.433) V for duration
limitation see
Section 5.1.5.1
EBU supply voltage VDDEBU 3.135 3.3 3.475) V
SR 2.375 2.5 2.625 V
5)
Flash supply voltage 3.3V VDDFL3 2.97 3.3 3.63 V for duration
SR limitation see
Section 5.1.5.1

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Table 14 Operating Conditions Parameters (cont’d)

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition
ADC analog supply VDDM 2.97 5 5.54) V
voltage SR
Oscillator core supply VDDOSC 1.17 1.3 1.433) V for duration
voltage SR limitation see
Section 5.1.5.1
Oscillator 3.3V supply VDDOSC3 2.97 3.3 3.635) V for duration
voltage SR limitation see
Section 5.1.5.1
Digital supply voltage for VDDP SR 2.97 3.3 3.63 5) V for duration
IO pads limitation see
Section 5.1.5.1
E-Ray PLL core voltage VDDPF 1.17 1.3 1.433) V for duration
supply SR limitation see
Section 5.1.5.1
E-Ray PLL 3.3V supply VDDPF3 2.97 3.3 3.635) V for duration
SR limitation see
Section 5.1.5.1
VDDP voltage to ensure VDDPPA 0.65 − − V
defined pad states6) CC
Digital ground voltage VSS SR 0 − − V
Analog ground voltage for VSSM SR -0.1 0 0.1 V
VDDM
Analog core supply VDDAF 1.17 1.3 1.433) V for duration
SR limitation see
Section 5.1.5.1
FADC / ADC analog VDDMF 2.97 3.3 3.635) V for duration
supply voltage SR limitation see
Section 5.1.5.1
Analog ground voltage for VSSAF -0.1 0 0.1 V
VDDMF SR
1) MA equals the modulation amplitude in percentage times the configured PLL clock out frequency.
2) Applicable for digital outputs.
3) Voltage overshoot to 1.7V is permissible at Power-Up and PORST low, provided the pulse duration is less
than 100 μs and the cumulated sum of the pulses does not exceed 1 h.

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4) Voltage overshoot to 6.5V is permissible at Power-Up and PORST low, provided the pulse duration is less
than 100 μs and the cumulated sum of the pulses does not exceed 1 h.
5) Voltage overshoot to 4.0V is permissible at Power-Up and PORST low, provided the pulse duration is less
than 100 μs and the cumulated sum of the pulses does not exceed 1 h.
6) This parameter is valid under the assumption the PORST signal is constantly at low level during the power-
up/power-down of VDDP.

5.1.5.1 Extended Range Operating Conditions

The following extended operating conditions are defined:
• 1.3V + 5% < VDD / VDDOSC / VDDPF / VDDAF < 1.3V + 7.5% (overvoltage condition):
– limited to 10000 hours duration cumulative in lifetime, due to the reliability
reduction of the chip caused by the overvoltage stress.
• 1.3V + 7.5% < VDD / VDDOSC / VDDPF / VDDAF < 1.3V + 10% (overvoltage condition):
– limited to 1000 hours duration cumulative in lifetime, due to the reliability reduction
of the chip caused by the overvoltage stress.
• 3.3V + 5% < VDDP / VDDOSC3 / VDDPF3 / VDDFL3 / VDDMF / VDDEBU< 3.3V + 10%
(overvoltage condition):
limited to 1000 hours duration cumulative in lifetime, due to the reliability reduction of
the chip caused by the overvoltage stress.

Table 15 Pin Groups for Overload / Short-Circuit Current Sum Parameter

Group Pins
1 P2.[4:2], P6.[6:9]
2 P6.[5:4], P6.[11:10]
3 P6.[15:12]
4 P8.[5:0]
5 P8.[7:6], P1.[15:13]
6 P1.5, P1.[11:8]
7 P1.[4:2], P1.6, P1.12
8 P1.[1:0], P7.[2:0]
9 P7.[7:3]
10 P4.[6:0]
11 P4.[10:7]
12 P4.[15:11]
13 P10.[5:0]
14 P15.[7:4], P16.[1:0]
15 P15.3, P15.[12:11], P16.[5:3]

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Table 15 Pin Groups for Overload / Short-Circuit Current Sum Parameter

Group Pins
16 P15.[2:0], P15.[9:8], P16.2, P16.8
17 P15.10, P15.[15:13], P16.[7:6]
18 P14.[15:12]
19 P14.[11:8], P16.12
20 P14.[7:3], P16.11
21 P13.15, P14.[2:0]
22 P13.[14:11]
23 P13.[10:8], P16.10
24 P13.[7:4], P16.9
25 P12.5, P13.[3:0]
26 P12.[4:0]
27 P11.[15:11]
28 P11.[10:6]
29 P11.[5:2]
30 P11.[1:0], P12.[7:6]
31 P9.10, P9.14
32 P9.7, P9.13
33 P9.[4:2], P9.6
34 P9.1, P9.5, P9.[9:8]
35 P9.0, P9.[12:11]
36 P5.[11:8]
37 P5.6, P5.[15:12]
38 P5.0, P5.[5:2], P5.7
39 P3.[5:0], P5.1
40 P3.[12:6]
41 P0.[3:0], P3.[15:13]
42 P0.[11:4]
43 P0.[14:12]
44 P0.15

Data Sheet 98 V 1.1.1, 2012-12

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Table 15 Pin Groups for Overload / Short-Circuit Current Sum Parameter

Group Pins
45 P2.[15:11]
46 P2.[10:5]

Data Sheet 99 V 1.1.1, 2012-12

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5.2 DC Parameters

5.2.1 Input/Output Pins

Table 16 Standard_Pads Parameters

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

Pin capacitance (digital CIO CC − − 10 pF TA= 25 °C;

inputs/outputs) f= 1 MHz
Pull-down current |IPDL| − − 150 μA Vi≥ 0.6 x VDDP V
CC 10 − − μA Vi≥ 0.36 x
VDDP V
Pull-Up current |IPUH| 10 − − μA Vi≤ 0.6 x VDDP V
CC − − 100 μA Vi≤ 0.36 x
VDDP V
Spike filter always blocked tSF1 CC − − 10 ns only PORST pin
pulse duration
Spike filter pass-through tSF2 CC 100 − − ns only PORST pin
pulse duration

Table 17 Standard_Pads Class_A1

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

Input Hysteresis for A1 HYSA1 0.1 x − − V

pads 1) CC VDDP
Input Leakage Current IOZA1 -500 − 500 nA Vi≥ 0 V;
Class A1 CC Vi≤ VDDP V
Ratio Vil/Vih, A1 pads VILA1 / 0.6 − −
VIHA1
CC
On-Resistance of the RDSONW − 450 600 Ohm IOH> -0.5 mA;
class A1 pad, weak driver CC P_MOS
− 210 340 Ohm IOL< 0.5 mA;
N_MOS

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Table 17 Standard_Pads Class_A1 (cont’d)

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition
On-Resistance of the RDSONM − − 155 Ohm IOH> -2 mA;
class A1 pad, medium CC P_MOS
driver − − 110 Ohm IOL< 2 mA;
N_MOS
Fall time, pad type A1 tFA1 CC − − 150 ns CL= 20 pF; pin
out
driver= weak
− − 50 ns CL= 50 pF; pin
out
driver= medium
− − 140 ns CL= 150 pF; pin
out
driver= medium
− − 550 ns CL= 150 pF; pin
out
driver= weak
− − 18000 ns CL= 20000 pF;
pin out
driver= medium
− − 65000 ns CL= 20000 pF;
pin out
driver= weak

Data Sheet 101 V 1.1.1, 2012-12

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Table 17 Standard_Pads Class_A1 (cont’d)

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition
Rise time, pad type A1 tRA1 CC − − 150 ns CL= 20 pF; pin
out
driver= weak
− − 50 ns CL= 50 pF; pin
out
driver= medium
− − 140 ns CL= 150 pF; pin
out
driver= medium
− − 550 ns CL= 150 pF; pin
out
driver= weak
− − 18000 ns CL= 20000 pF;
pin out
driver= medium
− − 65000 ns CL= 20000 pF;
pin out
driver= weak
Input high voltage class VIHA1 0.6 x − min(V V
A1 pads SR VDDP DDP+
0.3,3.6
)
Input low voltage class A1 VILA1 SR -0.3 − 0.36 x V
pads VDDP

Data Sheet 102 V 1.1.1, 2012-12

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Table 17 Standard_Pads Class_A1 (cont’d)

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition
Output voltage high class VOHA1 VDDP - − − V IOH≥ -1.4 mA;
A1 pads CC 0.4 pin out
driver= medium
2.4 − − V IOH≥ -2 mA; pin
out
driver= medium
VDDP - − − V IOH≥ -400 μA;
0.4 pin out
driver= weak
2.4 − − V IOH≥ -500 μA;
pin out
driver= weak
Output voltage low class VOLA1 − − 0.4 V IOL≤ 2 mA; pin
A1 pads CC out
driver= medium
− − 0.4 V IOL≤ 500 μA;
pin out
driver= weak
1) Hysteresis is implemented to avoid metastable states and switching due to internal ground bounce. It can´t be
guaranteed that it suppresses switching due to external system noise.

Table 18 Standard_Pads Class_A1+

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

Input Hysteresis for A1+ HYSA1 0.1 x − − V

pads 1) + CC VDDP
Input Leakage Current IOZA1+ -1000 − 1000 nA
Class A1+ CC
On-Resistance of the RDSONW − 450 600 Ohm IOH> -0.5 mA;
class A1+ pad, weak CC P_MOS
driver − 210 340 Ohm IOL< 0.5 mA;
N_MOS

Data Sheet 103 V 1.1.1, 2012-12

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Table 18 Standard_Pads Class_A1+ (cont’d)

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition
On-Resistance of the RDSONM − − 155 Ohm IOH> -2 mA;
class A1+ pad, medium CC P_MOS
driver − − 110 Ohm IOL< 2 mA;
N_MOS
On-Resistance of the RDSON1+ − − 100 Ohm IOH> -2 mA;
class A1+ pad, strong CC P_MOS
driver − − 80 Ohm IOL< 2 mA;
N_MOS
Fall time, pad type A1+ tFA1+ CC − − 150 ns CL= 20 pF; pin
out
driver= weak
− − 28 ns CL= 50 pF;
edge= slow ;
pin out
driver= strong
− − 16 ns CL= 50 pF;
edge= soft ; pin
out
driver= strong
− − 50 ns CL= 50 pF; pin
out
driver= medium
− − 140 ns CL= 150 pF; pin
out
driver= medium
− − 550 ns CL= 150 pF; pin
out
driver= weak
− − 18000 ns CL= 20000 pF;
pin out
driver= medium
− − 65000 ns CL= 20000 pF;
pin out
driver= weak

Data Sheet 104 V 1.1.1, 2012-12

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Table 18 Standard_Pads Class_A1+ (cont’d)

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

Rise time, pad type A1+ tRA1+ CC − − 150 ns CL= 20 pF; pin
out
driver= weak
− − 28 ns CL= 50 pF;
edge= slow ;
pin out
driver= strong
− − 16 ns CL= 50 pF;
edge= soft ; pin
out
driver= strong
− − 50 ns CL= 50 pF; pin
out
driver= medium
− − 140 ns CL= 150 pF; pin
out
driver= medium
− − 550 ns CL= 150 pF; pin
out
driver= weak
− − 18000 ns CL= 20000 pF;
pin out
driver= medium
− − 65000 ns CL= 20000 pF;
pin out
driver= weak
Input high voltage, Class VIHA1+ 0.6 x − min(V V
A1+ pads SR VDDP DDP+
0.3,3.6
)
Input low voltage Class VILA1+ -0.3 − 0.36 x V
A1+ pads SR VDDP
Ratio Vil/Vih, A1+ pads VILA1+ / 0.6 − −
VIHA1+
CC

Data Sheet 105 V 1.1.1, 2012-12

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Table 18 Standard_Pads Class_A1+ (cont’d)

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition
Output voltage high class VOHA1+ VDDP - − − V IOH≥ -1.4 mA;
A1+ pads CC 0.4 pin out
driver= medium
VDDP - − − V IOH≥ -1.4 mA;
0.4 pin out
driver= strong
2.4 − − V IOH≥ -2 mA; pin
out
driver= medium
2.4 − − V IOH≥ -2 mA; pin
out
driver= strong
VDDP - − − V IOH≥ -400 μA;
0.4 pin out
driver= weak
2.4 − − V IOH≥ -500 μA;
pin out
driver= weak
Output voltage low class VOLA1+ − − 0.4 V IOL≤ 2 mA; pin
A1+ pads CC out
driver= medium
− − 0.4 V IOL≤ 2 mA; pin
out
driver= strong
− − 0.4 V IOL≤ 500 μA;
pin out
driver= weak
1) Hysteresis is implemented to avoid metastable states and switching due to internal ground bounce. It can´t be
guaranteed that it suppresses switching due to external system noise.

Data Sheet 106 V 1.1.1, 2012-12

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Table 19 Standard_Pads Class_A2

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

Input Hysteresis for A2 HYSA2 0.1 x − − V

pads 1) CC VDDP
Input Leakage current IOZA2 -6000 − 6000 nA Vi< VDDP / 2 -
Class A2 CC 1 V; Vi> VDDP / 2
+ 1 V; Vi≥ 0 V;
Vi≤ VDDP V
-3000 − 3000 nA Vi> VDDP / 2 -
1 V; Vi< VDDP / 2
+1V
Ratio Vil/Vih, A2 pads VILA2 / 0.6 − −
VIHA2
CC
On-Resistance of the RDSONW − 450 600 Ohm IOH> -0.5 mA;
class A2 pad, weak driver CC P_MOS
− 210 340 Ohm IOL< 0.5 mA;
N_MOS
On-Resistance of the RDSONM − − 155 Ohm IOH> -2 mA;
class A2 pad, medium CC P_MOS
driver − − 110 Ohm IOL< 2 mA;
N_MOS
On-Resistance of the RDSON2 − − 28 Ohm IOH> -2 mA;
class A2 pad, strong driver CC P_MOS
− − 22 Ohm IOL< 2 mA;
N_MOS

Data Sheet 107 V 1.1.1, 2012-12

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Table 19 Standard_Pads Class_A2 (cont’d)

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition
Fall time, pad type A2 tFA2 CC − − 150 ns CL= 20 pF; pin
out
driver= weak
− − 7 ns CL= 50 pF;
edge= medium
; pin out
driver= strong
− − 10 ns CL= 50 pF;
edge= medium-
minus ; pin out
driver= strong
− − 3.7 ns CL= 50 pF;
edge= sharp ;
pin out
driver= strong
− − 5 ns CL= 50 pF;
edge= sharp-
minus ; pin out
driver= strong
− − 16 ns CL= 50 pF;
edge= soft ; pin
out
driver= strong
− − 50 ns CL= 50 pF; pin
out
driver= medium
− − 7.5 ns CL= 100 pF;
edge= sharp ;
pin out
driver= strong
− − 140 ns CL= 150 pF; pin
out
driver= medium

Data Sheet 108 V 1.1.1, 2012-12

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Table 19 Standard_Pads Class_A2 (cont’d)

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition
− − 550 ns CL= 150 pF; pin
out
driver= weak
− − 18000 ns CL= 20000 pF;
pin out
driver= medium
− − 65000 ns CL= 20000 pF;
pin out
driver= weak

Data Sheet 109 V 1.1.1, 2012-12

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Table 19 Standard_Pads Class_A2 (cont’d)

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition
Rise time, pad type A2 tRA2 CC − − 150 ns CL= 20 pF; pin
out
driver= weak
− − 7.0 ns CL= 50 pF;
edge= medium
; pin out
driver= strong
− − 10 ns CL= 50 pF;
edge= medium-
minus ; pin out
driver= strong
− − 3.7 ns CL= 50 pF;
edge= sharp ;
pin out
driver= strong
− − 5 ns CL= 50 pF;
edge= sharp-
minus ; pin out
driver= strong
− − 16 ns CL= 50 pF;
edge= soft ; pin
out
driver= strong
− − 50 ns CL= 50 pF; pin
out
driver= medium
− − 7.5 ns CL= 100 pF;
edge= sharp ;
pin out
driver= strong
− − 140 ns CL= 150 pF; pin
out
driver= medium

Data Sheet 110 V 1.1.1, 2012-12

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Table 19 Standard_Pads Class_A2 (cont’d)

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition
− − 550 ns CL= 150 pF; pin
out
driver= weak
− − 18000 ns CL= 20000 pF;
pin out
driver= medium
− − 65000 ns CL= 20000 pF;
pin out
driver= weak
Input high voltage, class VIHA2 0.6 x − min(V V
A2 pads SR VDDP DDP +
0.3,
3.6)
Input low voltage Class A2 VILA2 SR -0.3 − 0.36 x V
pads VDDP
Output voltage high class VOHA2 VDDP - − − V IOH≥ -1.4 mA;
A2 pads CC 0.4 pin out
driver= medium
VDDP - − − V IOH≥ -1.4 mA;
0.4 pin out
driver= strong
2.4 − − V IOH≥ -2 mA; pin
out
driver= medium
2.4 − − V IOH≥ -2 mA; pin
out
driver= strong
VDDP - − − V IOH≥ -400 μA;
0.4 pin out
driver= weak
2.4 − − V IOH≥ -500 μA;
pin out
driver= weak

Data Sheet 111 V 1.1.1, 2012-12

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Table 19 Standard_Pads Class_A2 (cont’d)

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition
Output voltage low class VOLA2 − − 0.4 V IOL≤ 2 mA; pin
A2 pads CC out
driver= medium
− − 0.4 V IOL≤ 2 mA; pin
out
driver= strong
− − 0.4 V IOL≤ 500 μA;
pin out
driver= weak
1) Hysteresis is implemented to avoid metastable states and switching due to internal ground bounce. It can´t be
guaranteed that it suppresses switching due to external system noise.

Table 20 Standard_Pads Class_B

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

Input Hysteresis, B class HYSB 0.08 x − − V VDDEBU= 2.5 V

pads1) CC VDDEBU
0.1 x − − V VDDEBU= 3.3 V
VDDEBU
Input Leakage Current, IOZB CC -6000 − 6000 nA else
class B pads -3000 − 3000 nA (VDDEBU/2 -
0.6 V) < Vi < (V
DDEBU/2 + 0.6 V)
Ratio between low and VILB / 0.6 − −
high input threshold VIHB CC
On-Resistance of the RDSONW − 450 600 Ohm IOH> -0.5 mA;
class B pad, weak driver CC P_MOS
− 210 340 Ohm IOL< 0.5 mA;
N_MOS
On-Resistance of the RDSONM − − 155 Ohm IOH> -2 mA;
class B pad, medium CC P_MOS
driver − − 110 Ohm IOL< 2 mA;
N_MOS

Data Sheet 112 V 1.1.1, 2012-12

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Table 20 Standard_Pads Class_B (cont’d)

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition
On-Resistance of the RDSON2 − − 28 Ohm IOH> -2 mA;
class B pad, strong driver CC P_MOS
− − 22 Ohm IOL< 2 mA;
N_MOS
Fall time, class B pads; tFB CC − − 3.7 ns CL= 35 pF;
edge= sharp ; pin out VDDEBU> 2.375 ;
driver= strong 2) VDDEBU≤ 2.625
− − 3.0 ns CL= 35 pF;
VDDEBU> 3.13 ;
VDDEBU≤ 3.47
− − 4.6 ns CL= 50 pF;
VDDEBU> 2.375 ;
VDDEBU≤ 2.625
− − 3.7 ns CL= 50 pF;
VDDEBU> 3.13 ;
VDDEBU≤ 3.47
− − 9.0 ns CL= 100 pF;
VDDEBU> 2.375 ;
VDDEBU≤ 2.625
− − 7.5 ns CL= 100 pF;
VDDEBU> 3.13 ;
VDDEBU≤ 3.47

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Table 20 Standard_Pads Class_B (cont’d)

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition
Rise time, class B pads; tRB CC − − 3.7 ns CL= 35 pF;
edge= sharp ; pin out VDDEBU> 2.375 ;
driver= strong 2) VDDEBU≤ 2.625
− − 3.0 ns CL= 35 pF;
VDDEBU> 3.13 ;
VDDEBU≤ 3.47
− − 4.6 ns CL= 50 pF;
VDDEBU> 2.375 ;
VDDEBU≤ 2.625
− − 3.7 ns CL= 50 pF;
VDDEBU 3.13 ;
VDDEBU≤ 3.47
− − 9.0 ns CL= 100 pF;
VDDEBU> 2.375 ;
VDDEBU≤ 2.625
− − 7.5 ns CL= 100 pF;
VDDEBU> 3.13 ;
VDDEBU≤ 3.47
Input high voltage, class B VIHB CC 0.6 x − max(V V
pads VDDEBU DDEBU
+ 0.3,
3.6)
Input low voltage, Class B VILB CC -0.3 − 0.36 x V
pads VDDEBU
Output voltage high, class VOHB VDDEBU − − V IOH -2 mA;
B pads CC - 0.4 VDDEBU> 2.375
V;
VDDEBU≤ 3.47 V
Output voltage low, class VOLB CC − − 0.4 V IOL= 2 mA
B pads
1) Hysteresis is implemented to avoid metastable states and switching due to internal ground bounce. It can´t be
guaranteed that it suppresses switching due to external system noise.
2) For non strong driver and sharp edge settings see the class A2 definitions.

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Table 21 Standard_Pads Class_F

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

Input Hysteresis F1) HYSF 0.05 x − − V

CC VDDP
Input Leakage Current IOZF CC -6000 − 6000 nA Vi< VDDP / 2 -
Class F 1 V; Vi> VDDP / 2
+ 1 V; Vi≥ 0 V;
Vi≤ VDDP V
-3000 − 3000 nA Vi> VDDP / 2 -
1 V; Vi< VDDP / 2
+1V
Ratio Vil/ Vih, F pads VILF / 0.6 − −
VIHF CC
On-Resistance of the RDSONM − − 170 Ohm IOH> -2 mA;
class F pad, medium CC P_MOS
driver − − 145 Ohm IOL< 2 mA;
N_MOS
Fall time, pad type F, tFF CC − − 60 ns CL= 50 pF
CMOS mode
Rise time, pad type F, tRF CC − − 60 ns CL= 50 pF
CMOS mode
Input high voltage, pad VIHF SR 0.6 x − min(V V
class F, CMOS mode VDDP DDP+
0.3,
3.6)
Input low voltage, Class F VILF SR -0.3 − 0.36 x V
pads, CMOS mode VDDP
Output high voltage, class VOHF VDDP- − − V IOH≥ -1.4 mA
F pads, CMOS mode CC 0.4
2.4 − − V IOH≥ -2 mA
Output low voltage, class VOLF CC − − 0.4 V IOL≤ 2 mA
F pads, CMOS mode
1) Hysteresis is implemented to avoid metastable states and switching due to internal ground bounce. It can´t be
guaranteed that it suppresses switching due to external system noise.

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Table 22 Standard_Pads Class_I

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

Input Hysteresis Class I1) HYSI 0.1 x − − V

CC VDDP
Input Leakage Current IOZI CC -1000 − 1000 nA
Ratio between low and VILI / VIHI 0.6 − −
high input threshold CC
Input high voltage, class I VIHI SR 0.6 x − min(V V
pins VDDP DDP+
0.3,
3.6)
Input low voltage, Class I VILI SR -0.3 − 0.36 x V
pads VDDP
1) Hysteresis is implemented to avoid metastable states and switching due to internal ground bounce. It can´t be
guaranteed that it suppresses switching due to external system noise.

Class S pad parameters are only valid for VDDM = 4.75 V to 5.25 V.

Table 23 Standard_Pads Class_S

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

Input Hysteresis for class HYSS 0.3 − − V

S pads1) CC
Input leakage current IOZS CC -300 − 300 nA
Input voltage high VIHS CC − − 3.6 V
Input voltage low VILS CC 2.1 − − V
VILS Delta 2) VILSD -50 − 50 mV Maximum input
CC low state
threshold
variation over
1ms
(VDDP = consta
nt)
1) Hysteresis is implemented to avoid metastable states and switching due to internal ground bounce. It can´t be
guaranteed that it suppresses switching due to external system noise.

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Electrical ParametersDC Parameters

2) VILSD is implemented to ensure J2716 specification. It can’t be guaranteed that it suppresses switching due to
external noise.

Table 24 LVDS_Pads Parameters

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

Output impedance, pad RO CC 40 − 140 Ohm

class F, LVDS mode
Fall time, pad type LVDS tFL CC − − 2 ns termination
100 Ω ± 1 %
Rise time, pad type LVDS tRL CC − − 2 ns termination
100 Ω ± 1 %
Pad set-up time tSET_LVD − − 13 μs termination
S CC 100 Ω ± 1 %
Output Differential Voltage VOD CC 150 − 400 mV termination
100 Ω ± 1 %
Output voltage high, pad VOH CC − − 1525 mV termination
class F, LVDS mode 100 Ω ± 1 %
Output voltage low, pad VOL CC 875 − − mV termination
class F, LVDS mode 100 Ω ± 1 %
Output Offset Voltage VOS CC 1075 − 1325 mV termination
100 Ω ± 1 %

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5.2.2 Analog to Digital Converters (ADCx)

ADC parameter are valid for VDD / DDAF = 1.235 V to 1.365 V; VDDM = 4.5 V to 5.5 V.

Table 25 ADC Parameters

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

Switched capacitance at CAINSW − 9 20 pF

the analog voltage inputs1) CC
Total capacitance of an CAINTOT − 20 30 pF
analog input CC
Switched capacitance at CAREFSW − 15 30 pF
the positive reference CC
voltage input2)3)
Total capacitance of the CAREFTO − 20 40 pF
voltage reference inputs2) T CC
Differential Non-Linearity EADNL -3 − 3 LSB ADC
Error4)5)6)7) CC resolution= 12-
bit 8) 9)
Gain Error4)5)6)7) EAGAIN -3.5 − 3.5 LSB ADC
CC resolution= 12-
bit 8) 9)
Integral Non- EAINL -3 − 3 LSB ADC
Linearity4)5)7)7) CC resolution= 12-
bit 8) 9)
Offset Error4)5)6)7) EAOFF -4 − 4 LSB ADC
CC resolution= 12-
bit 8) 9)
Converter clock fADC SR 4 − 100 MHz fADC= fFPI
Internal ADC clock fADCI CC 1 − 18 MHz ADC0
1 − 18 MHz ADC1
1 − 2010) MHz ADC2
11)
Charge consumption per QCONV 70 85 100 pC charge needs to
conversion CC be provided via
VAREF0

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Table 25 ADC Parameters (cont’d)

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition
Input leakage at analog IOZ1 CC -100 − 500 nA Vi≤ VDDM V;
inputs12) Vi≥ 0.97 x
VDDM V;
overlayed= No
-100 − 600 nA Vi≥ 0.97 x
VDDM V;
Vi≤ VDDM V;
overlayed= Yes
-500 − 100 nA Vi≤ 0.03 x
VDDM V;
Vi≥ 0 V;
overlayed= No
-600 − 100 nA Vi≤ 0.03 x
VDDM V;
Vi≥ 0 V;
overlayed= Yes
-100 − 200 nA Vi> 0.03 x
VDDM V;
Vi< 0.97 x
VDDM V;
overlayed= No
-100 − 300 nA Vi< 0.97 x
VDDM V;
Vi> 0.03 x
VDDM V;
overlayed= Yes
Input leakage current at IOZ2 CC -1 − 1 μA VAREFx≥ 0 V;
VAREF0 / VAREF2 VAREFx≤ VDDM V
Input leakage current at -2 − 2 μA VAREFx≥ 0 V;
VAREF1 VAREFx≤ VDDM V
Input leakage current at IOZ3 CC -2 − 2 μA VAGNDx≥ 0 V;
VAGNDx VAGNDx≤ VDDM V
ON resistance of the RAIN CC − 900 1500 Ohm
transmission gates in the
analog voltage path

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Table 25 ADC Parameters (cont’d)

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition
ON resistance for the ADC RAIN7T 180 550 900 Ohm
test (pull down for AIN7) CC
Resistance of the RAREF − 500 1000 Ohm
reference voltage input CC
path
Sample time tS CC 2 − 257 TADCI
Calibration time after bit tCAL CC − − 4352 cycle
ADC_GLOBCFG.SUCAL s
is set
Total Unadjusted TUE CC -4 − 414) LSB ADC
Error6)5)13) resolution= 12-
bit
Analog reference ground2) VAGND0 VSSM - − VAREFx V
SR 0.05 -1
Analog input voltage VAIN SR VAGNDx − VAREFx V
Analog reference voltage2) VAREFx VAGNDx − VDDM + V
SR +1 0.0515)
16)

Analog reference voltage VAREFx - VDDM/2 − VDDM + V

range6)5)2) VAGNDx 0.05
SR
1) The sampling capacity of the conversion C-network is pre-charged to VAREF/2 before the sampling moment.
Because of the parasitic elements the voltage measured at AINx can deviate from VAREF/2.
2) Applies to AINx, when used as auxiliary reference input.
3) This represents an equivalent switched capacitance. This capacitance is not switched to the reference voltage
at once. Instead smaller capacitances are successively switched to the reference voltage.
4) The sum of DNL/INL/GAIN/OFF errors does not exceed the related TUE total unadjusted error.
5) If a reduced analog reference voltage between 1V and VDDM / 2 is used, then there are additional decrease in
the ADC speed and accuracy.
6) If the analog reference voltage range is below VDDM but still in the defined range of VDDM / 2 and VDDM is used,
then the ADC converter errors increase. If the reference voltage is reduced by the factor k (k<1),
TUE,DNL,INL,Gain, and Offset errors increase also by the factor 1/k.
7) If the analog reference voltage is > VDDM, then the ADC converter errors increase.
8) For 10-bit conversions the error value must be multiplied with a factor 0.25.
9) For 8-bit conversions the error value must be multiplied with a factor 0.0625.
10) For fADCI between 18MHz and 20MHz the TUE and Gain Error can increase beyond the given limits. For
STC < 2 INL, DNL , and Offset errors can also increase.

Data Sheet 120 V 1.1.1, 2012-12

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11) For a conversion time of 1 µs a rms value of 85µA result for IAREF0.
12) The leakage current definition is a continuos function, as shown in figure ADCx Analoge Input Leakage. The
numerical values defined determine the characteristic points of the given continuous linear approximation -
they do not define step function.
13) Measured without noise.
14) For 10-bit conversion the TUE is ±2LSB; for 8-bit conversion the TUE is ±1LSB
15) A running conversion may become inexact in case of violating the normal conditions (voltage overshoot).
16) If the reference voltage VAREF increase or the VDDM decrease, so that VAREF = (VDDM + 0.05V to VDDM + 0.07V),
then the accuracy of the ADC decrease by 4LSB12.

Table 26 Conversion Time (Operating Conditions apply)

Parameter Symbol Values Unit Note
Conversion tC CC 2 × TADC + (4 + STC + n) × TADCI μs n = 8, 10, 12 for
time with n - bit conversion
post-calibration TADC = 1 / fFPI
Conversion 2 × TADC + (2 + STC + n) × TADCI TADCI = 1 / fADCI
time without
post-calibration

The power-up calibration of the ADC requires a maximum number of 4352 fADCI cycles.

Analog Input Circuitry

REXT RAIN, On
ANx

VAIN = CEXT CAINSW

CAINTOT - CAINSW
VAGNDx RAIN7T

Reference Voltage Input Circuitry

VAREFx RAREF, On

VAREF CAREFTOT - CAREFSW CAREFSW

VAGNDx

Analog_InpRefDiag

Figure 5 ADCx Input Circuits

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Electrical ParametersDC Parameters

Ioz1
Single ADC Input
500nA

200nA VIN[VDDM%]
100nA
-100nA
3% 97% 100%

-500nA

Ioz1
Overlayed ADC/FADC Input
600nA

300nA VIN[VDDM%]
100nA
-100nA
3% 97% 100%

-600nA

Figure 6 ADCx Analog Inputs Leakage

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5.2.3 Fast Analog to Digital Converter (FADC)

FADC parameter are vaild for VDD / DDAF = 1.235 V to 1.365 V; VDDMF = 2.97 V to 3.6 V.

Table 27 FADC Parameters

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

Input current at VFAREF IFAREF − − 120 μA

CC
Input leakage current at IFOZ2 -500 − 500 nA VFAREF≤ VDDMF
VFAREF1) CC V; VFAREF≥ 0 V
Input leakage current at IFOZ3 -500 − 500 nA
VFAGND CC
DNL error EFDNL -1 − 1 LSB VIN mode=
CC differential;
Gain = 1 or 2
-2 − 2 LSB VIN mode=
differential;
Gain = 4 or 82)
-1 − 1 LSB VIN mode=
single ended;
Gain = 1 or 2
-2 − 2 LSB VIN mode=
single ended;
Gain = 4 or 82)
GRADient error EFGRAD -5 − 5 % VIN mode=
CC differential ;
Gain≤ 4
-5 − 5 % VIN mode=
single ended ;
Gain≤ 4
-6 − 6 % VIN mode=
differential ;
Gain= 8
-6 − 6 % VIN mode=
single ended ;
Gain= 8

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Table 27 FADC Parameters (cont’d)

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

INL error EFINL -4 − 4 LSB VIN mode=

CC differential
-4 − 4 LSB VIN mode=
single ended
Offset error EFOFF -90 − 90 mV VIN mode=
CC differential ;
Calibration= No
-90 − 90 mV VIN mode=
single ended ;
Calibration= No
-20 − 20 mV VIN mode=
differential ;
Calibration= Ye
s 3)4)
-20 − 20 mV VIN mode=
single ended ;
Calibration= Ye
s 3)4)
Error of commen mode EFREF -60 − 60 mV
voltage VFAREF/2 CC
Channel amplifier cutoff fCOFF 2 − − MHz
frequency CC
Converter clock fFADC 1 − 100 MHz fFADC= fFPI
SR
Conversion time tC CC − − 21 1/ For 10-bit
fFADC conversion
Input resistance of the RFAIN 100 − 200 kOh
analog voltage path (Rn, CC m
Rp)
Settling time of a channel tSET CC − − 5 μs
amplifier after changing
ENN or ENP
Analog input voltage VAINF VFAGND − VDDMF V
range SR

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Table 27 FADC Parameters (cont’d)

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

Analog reference ground VFAGND VSSAF - − VSSAF V

SR 0.05 + 0.05
Analog reference voltage VFAREF 3.0 − 3.635) V
6)
SR
1) This value applies in power-down mode.
2) No missing codes.
3) Calibration should be preformed at each power-up. In case of a continous operation, it should be performed
minimium once per week.
4) The offser error voltage drifts over the whole temperature range maximum +-3LSB.
5) Voltage overshoot to 4V is permissible, provided the pulse duration is less than 100 μs and the cumulated sum
of the pulses does not exceed 1 h.
6) A running conversion may become inexact in case of violating the nomal operating conditions (voltage
overshoots).

The calibration procedure should run after each power-up, when all power supply
voltages and the reference voltage have stabilized.

Data Sheet 125 V 1.1.1, 2012-12

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FADC Analog Input Stage

RN
FAINxN -

+
VFAGND VFAREF /2

=
+
RP
FAINxP -

FADC Reference Voltage

Input Circuitry
VFAREF

IFAREF
VFAREF

VFAGND

FADC_InpRefDiag

Figure 7 FADC Input Circuits

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5.2.4 Oscillator Pins

Table 28 OSC_XTAL Parameters

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

Input current at XTAL1 IIX1 CC -25 − 25 μA VIN<VDDOSC3 ;

VIN>0 V
Input frequency fOSC SR 4 − 40 MHz Direct Input
Mode selected
8 − 25 MHz External Crystal
Mode selected
Oscillator start-up time1) tOSCS − − 10 ms
CC
Input high voltage at VIHX SR 0.7 x − VDDOS V
XTAL12) VDDOS C3 +
C3 0.5
Input low voltage at VILX SR -0.5 − 0.3 x V
XTAL1 VDDOS
C3
Input Hysteresis for HYSAX − − 200 mV
XTAL1 pad 3) CC
1) tOSCS is defined from the moment when VDDOSC3 = 3.13V until the oscillations reach an amplitude at XTAL1 of
0.3 * VDDOSC3. The external oscillator circuitry must be optimized by the customer and checked for negative
resistance as recommended and specified by crystral suppliers.
2) If the XTAL1 pin is driven by a crystal, reaching a minimum amplitude (peak-to-peak) of 0.4 * VDDOSC3 is
necessary.
3) Hysteresis is implemented to avoid metastable states and switching due to internal ground bounce. It can´t be
guaranteed that it suppresses switching due to external system noise.

Note: It is strongly recommended to measure the oscillation allowance (negative

resistance) in the final target system (layout) to determine the optimal parameters
for the oscillator operation. Please refer to the limits specified by the crystal or
ceramic resonator supplier.

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5.2.5 Temperature Sensor

Table 29 DTS Parameters

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

Measurement time tM CC − − 100 μs

Temperature sensor TSR SR -40 − 150 °C
range
Sensor Accuracy TTSA CC -6 − 6 °C
(calibrated)
Start-up time after resets tTSST SR − − 20 μs
inactive

The following formula calculates the temperature measured by the DTS in [oC] from the
RESULT bit field of the DTSSTAT register.
(1)

DTSSTAT RESULT – 596

Tj = -------------------------------------------------------------------
2, 03

Data Sheet 128 V 1.1.1, 2012-12

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5.2.6 Power Supply Current

The total power supply current defined below consists of leakage and switching
component.
Application relevant values are typically lower than those given in the following
two tables and depend on the customer's system operating conditions (e.g.
thermal connection or used application configurations).
The operating conditions for the parameters in the following table are:
VDD / VDDOSC / VDDAF / VDDPF = 1.365 V, VDDP / VDDOSC / VDDMF / VDDFL3 / VDDPF = 3.47 V,
VDDM = 5.25 V fSRI / CPU=270 / 200 MHz, fPCP=180 / 200 MHz, fSRI=90 / 100 MHz,
TJ=150 oC
The realisic power pattern defines the following conditions:
• TJ=150 oC
• fSRI = fCPU = 270 / 200 MHz
• fPCP = 180 / 200 MHz
• fFPI = 90 / 100MHz
• VDD = VDDOSC = VDDAF = VDDPF = 1.326 V
• VDDP = VDDOSC3 = VDDFL3 VDDPF3 = VDDMF = 3.366 V
• VDDM = 5.1 V
The max power pattern defines the following conditions:
• TJ=150 oC
• fSRI = fCPU = 270 / 200 MHz
• fPCP = 180 / 200 MHz
• fFPI = 90 / 100MHz
• VDD = VDDOSC = VDDAF = VDDPF = 1.43 V
• VDDP = VDDOSC3 = VDDFL3 VDDPF3 = VDDMF = 3.63 V
• VDDM = 5.5 V

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Table 30 Power Supply Parameters

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

Core active mode supply IDD CC − − 8403) mA power

current1)2) pattern= max;
fCPU=270 MHz
− − 621 mA power
pattern= realisti
c;
fCPU=270 MHz
− − 7354) mA power
pattern= max;
fCPU=200 MHz
− − 555 mA power
pattern= realisti
c;
fCPU=200 MHz
IDD current at PORST Low IDD_PORS − − 298 mA TJ=150 oC
T CC − − 249 mA TJ=140 oC
E-Ray PLL core supply IDDPF − − 4 mA
current CC
Oscillator core supply IDDOSC − − 3 mA
current CC
Analog core supply IDDAF − − 26 mA
current CC
Sum of all 1.3 V supply IDDSUM − − 654 mA power
currents CC pattern= realisti
c;
fCPU=270 MHz
− − 588 mA power
pattern= realisti
c;
fCPU=200 MHz
E-Ray PLL 3.3V supply IDDPF3 − − 4 mA
CC
Oscillator power supply IDDOSC3 − − 11 mA
current, 3.3V CC

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Table 30 Power Supply Parameters (cont’d)

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition
FADC analog supply IDDMF − − 15 mA
current, 3.3V CC
IDDP current at PORST IDDP_POR − − 7 mA
Low ST CC
IDDP current no pad IDDP CC − − IDDP_ mA including flash
activity, LVDS off 5) PORST read current
+ 25
− − IDDP_ mA including flash
PORST programming
+ 55 current 6)
− − IDDP_ mA including flash
PORST erase verify
7)
+ 40 current 6)
Flash memory current 5)
IDDFL3 − − 98 mA flash read
CC current
− − 29 mA flash
programming
current 6)
− − 98 mA flash erase
current 6)
Current Consumption of ILVDS − − 24 mA in total for all
LVDS Pad Pairs CC LVDS pairs
Sum of all 3.3 V supply IDD3SUM − − 160 8) mA including flash
currents, no pad activity, CC read current
LVDS off
ADC 5V power supply IDDM CC − − 6 mA
current

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Table 30 Power Supply Parameters (cont’d)

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition
Maximum power PD CC − − 1633 mW power
dissipation pattern= max;
fCPU=270 MHz
− − 1488 mW power
pattern= realisti
c;
fCPU=270 MHz
− − 1523 mW power
pattern= max;
fCPU=200 MHz
− − 1403 mW power
pattern= realisti
c;
fCPU=200 MHz
1) Infineon Power Loop: CPU and PCP running, all peripherals active. The power consumption of each customer
application will most probably be lower than this value, but must be evaluated seperately.
2) This current includes the E-Ray module power consumption, including the PCP operation component.
3) The IDD decreases typically by 97 mA if the fCPU decreases by 50MHz, at constant TJ
4) The IDD decreases typically by 105 mA if the fCPU decreases by 50MHz, at constant TJ
5) D-Flash read, write, or erase opoeration in parallel to P-Flash operations name in Test Condition is covered
already in the give current limits.
6) Relevant for the power supply dimensioning, not for thermal considerations.
7) In case of erase of Program Flash PFx, internal flash array loading effects may generate transient current
spikes of up to 15 mA for maximum 5 ms per flash module.
8) For power supply dimensioning of VDDP 30 mA have to added for flash programming case.

Note: In general current consumption for operations with data flash are always lower
than the defined values for program flash read operation.

5.2.6.1 Calculating the 1.3 V Current Consumption

The current consumption of the 1.3 V rail compose out of two parts:
• Static current consumption
• Dynamic current consumption
The static current consumption is related to the device temperature TJ and the dynamic
current consumption depends of the configured clocking frequencies and the software

Data Sheet 132 V 1.1.1, 2012-12

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application executed. These two parts needs to be added in order to get the rail current
consumption.
(2)

= 3, 75 --------- × e 0, 02041 × T J [ C ]
mA
I
0 C

(3)

= 18, 77 --------- × e 0, 01825 × T J [ C ]

mA
I
0 C

Function 2 defines the typical static current consumption and Function 3 defines the
maximum static current consumption. Both functions are valid for VDD = 1.326 V.
For the dynamic current consumption using the real pattern and fSRI
= 3 / 2 * fPCP = 3 * fFPI the function 4 applies:
(4)
mA
I D m = 1, 22 ------------- × f CPU [ MHz ]
y MHz

For the dynamic current consumption using the real pattern and fSRI = fPCP = 2 * fFPI the
function 5 applies:
(5)
mA
I D m = 1, 305 ------------- × f CPU [ MHz ]
y MHz

and this finally results in

(6)

I DD = I 0 + I DYM

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Electrical ParametersAC Parameters

5.3 AC Parameters
All AC parameters are defined with maximum driver strength unless otherwise noted.

5.3.1 Testing Waveforms

VD D P
90% 90%

10% 10%
VSS
tR tF
rise_fall

Figure 8 Rise/Fall Time Parameters

VD D P

VD D E / 2 Test Points VD D E / 2
VSS
mct04881_a.vsd

Figure 9 Testing Waveform, Output Delay

VLoad+ 0.1 V Timing VOH - 0.1 V

Reference
VLoad- 0.1 V Points VOL - 0.1 V

MCT04880_new

Figure 10 Testing Waveform, Output High Impedance

Data Sheet 134 V 1.1.1, 2012-12

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Electrical ParametersAC Parameters

5.3.2 Power Sequencing

V
5.25V
5V
4.75V
3.47V VAREF
3.3V
3.0V
-12%
1.365V
1.3V
1.235V -12%
0.5V 0.5V 0.5V

t
VDDP

PORST

power power t
down fail
Power-Up 10.vsd

Figure 11 5 V / 3.3 V / 1.3 V Power-Up/Down Sequence

The following list of rules applies to the power-up/down sequence:
• All ground pins VSS must be externally connected to one single star point in the
system. Regarding the DC current component, all ground pins are internally directly
connected.
• At any moment in time to avoid increased latch-up risk,
each power supply must be higher then any lower_power_supply - 0.5 V, or:
VDD5 > VDD3.3 - 0.5 V; VDD5 > VDD1.3 - 0.5 V;VDD3.3 > VDD1.3 - 0.5 V, see Figure 11.
– The latch-up risk is minimized if the I/O currents are limited to:
– 20 mA for one pin group
– AND 100 mA for the completed device I/Os
– AND additionally before power-up / after power-down:
1 mA for one pin in inactive mode (0 V on all power supplies)
• During power-up and power-down, the voltage difference between the power supply
pins of the same voltage (3.3 V, 1.3 V, and 5 V) with different names (for example
VDDP, VDDFL3 ...), that are internally connected via diodes, must be lower than 100 mV.
On the other hand, all power supply pins with the same name (for example all VDDP),

Data Sheet 135 V 1.1.1, 2012-12

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Electrical ParametersAC Parameters

are internally directly connected. It is recommended that the power pins of the same
voltage are driven by a single power supply.
1. The PORST signal may be deactivated after all VDD5, VDD3.3, VDD1.3, and VAREF power-
supplies and the oscillator have reached stable operation, within the normal
operating conditions.
2. At normal power down the PORST signal should be activated within the normal
operating range, and then the power supplies may be switched off. Care must be
taken that all Flash write or delete sequences have been completed.
3. At power fail the PORST signal must be activated at latest when any 3.3 V or 1.3 V
power supply voltage falls 12% below the nominal level. If, under these conditions,
the PORST is activated during a Flash write, only the memory row that was the target
of the write at the moment of the power loss will contain unreliable content. In order
to ensure clean power-down behavior, the PORST signal should be activated as
close as possible to the normal operating voltage range.
4. In case of a power-loss at any power-supply, all power supplies must be powered-
down, conforming at the same time to the rules number 2 and 4.
5. Although not necessary, it is additionally recommended that all power supplies are
powered-up/down together in a controlled way, as tight to each other as possible.
6. Additionally, regarding the ADC reference voltage VAREF:
– VAREF must power-up at the same time or later then VDDM, and
– VAREF must power-down either earlier or at latest to satisfy the condition
VAREF < VDDM + 0.5 V. This is required in order to prevent discharge of VAREF filter
capacitance through the ESD diodes through the VDDM power supply. In case of
discharging the reference capacitance through the ESD diodes, the current must
be lower than 5 mA.

Data Sheet 136 V 1.1.1, 2012-12

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5.3.3 Power, Pad and Reset Timing

Table 31 Reset Timings Parameters

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

Application Reset Boot tB CC − − 960 μs fCPU = 270 MHz

Time1)2) − − 1140 μs fCPU = 200 MHz
Power on Reset Boot tBP CC − − 2.5 ms
Time3)4)
HWCFG pins hold time tHDH SR 16 / − − ns
from ESR0 rising edge fFPI
HWCFG pins setup time to tHDS SR 0 − − ns
ESR0 rising edge
Ports inactive after ESR0 tPI CC − − 8/fFPI ns
reset active
Ports inactive after tPIP CC − − 150 ns
PORST reset active5)
Minimum PORST active tPOA SR 10 − − ms
time after power supplies
are stable at operating
levels
TESTMODE / TRST hold tPOH SR 100 − − ns
time from PORST rising
edge
PORST rise time tPOR SR − − 50 ms
TESTMODE / TRST tPOS SR 0 − − ns
setup time to PORST
rising edge
Application Reset inactive tPOR_APP − − 40 6) μs
after PORST deassertion SR
1) The duration of the boot time is defined between the rising edge of the internal application reset and the clock
cycle when the first user instruction has entered the CPU pipeline and its processing starts.
2) The given time includes the time of the internal reset extension for a configured value of
SCU_RSTCNTCON.RELSA = 0x05BE.
3) The duration of the boot time is defined between the rising edge of the PORST and the clock cycle when the
first user instruction has entered the CPU pipeline and its processing starts.
4) The given time includes the internal reset extension time for the System and Application Reset which is visible
through ESR0.

Data Sheet 137 V 1.1.1, 2012-12

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Electrical ParametersAC Parameters

5) This parameter includes the delay of the analog spike filter in the PORST pad.
6) Application Reset is assumed not to be extended from external, otherwise the time extends by the time the
Application Reset is extended.

VDD P -12%
VD D PPA
V D DPPA
VDDP

VDD
tPOA VD D -12%
tPOA
PORST
tPOH tPOH
TRST
TESTMODE
t hd t hd
ESR0
tHDH tHDH tHDH
HWCFG
t PIP t PIP
tPI tPI
Pads
tPI tPI tPI
t PIP
Pad-state undefined

Tri-state or pull device active

reset_beh2
As programmed

Figure 12 Power, Pad and Reset Timing

Data Sheet 138 V 1.1.1, 2012-12

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5.3.4 Phase Locked Loop (PLL)

Table 32 PLL_SysClk Parameters

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

Accumulated Jitter DP CC -7 − 7 ns
Modulation frequency fMOD SR 50 − 200 kHz
PLL base frequency fPLLBASE 50 200 320 MHz
CC
VCO input frequency fREF CC 8 − 16 MHz
VCO frequency range fVCO CC 400 − 720 MHz with inactive
modulation
400 − 600 MHz with active
modulation
Modulation jitter JMOD CC − − 2.5 ns
Total long term jitter JTOT CC − − 9.5 ns Sum of DP and
JMOD
Modulation Amplitude MA SR 0 − 2.5 % % of fVCO
PLL lock-in time tL CC 14 − 200 μs N > 32
14 − 400 μs N ≤ 32
System frequency fSYSD − − 0.01 % with active
deviation CC modulation

Phase Locked Loop Operation

When PLL operation is enabled and configured, the PLL clock fVCO (and with it the SRI-
Bus clock fSRI) is constantly adjusted to the selected frequency. The PLL is constantly
adjusting its output frequency to correspond to the input frequency (from crystal or clock
source), resulting in an accumulated jitter that is limited. This means that the relative
deviation for periods of more than one clock cycle is lower than for a single clock cycle.
This is especially important for bus cycles using wait states and for the operation of
timers, serial interfaces, etc. For all slower operations and longer periods (e.g. pulse train
generation or measurement, lower baudrates, etc.) the deviation caused by the PLL jitter
is negligible.

Data Sheet 139 V 1.1.1, 2012-12

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Electrical ParametersAC Parameters

Two formulas are defined for the (absolute) approximate maximum value of jitter Dm in
[ns] dependent on the K2 - factor, the SRI clock frequency fSRI in [MHz], and the number
m of consecutive fSRI clock periods.

for ( K2 ≤ 100 ) and ( m ≤ ( f SRI [ MHz ] ) ⁄ 2 )

( 1 – 0, 01 × K2 ) × ( m – 1 )
D m [ ns ] = ⎛⎝ ------------------------------------------ + 5⎞⎠ × ⎛⎝ ---------------------------------------------------------------- + 0, 01 × K2⎞⎠
740 (7)
K2 × f SRI [ MHz ] 0, 5 × f SRI [ MHz ] – 1

740 (8)
else D m [ ns ] = ------------------------------------------ + 5
K2 × f SRI [ MHz ]

With rising number m of clock cycles the maximum jitter increases linearly up to a value
of m that is defined by the K2-factor of the PLL. Beyond this value of m the maximum
accumulated jitter remains at a constant value. Further, a lower SRI-Bus clock frequency
fSRI results in a higher absolute maximum jitter value.
Note: The specified PLL jitter values are valid if the capacitive load per pin does not
exceed CL = 20 pF with the maximum driver and sharp edge.
Note: The maximum peak-to-peak noise on the pad supply voltage, measured between
VDDOSC3 and VSSOSC, is limited to a peak-to-peak voltage of VPP = 100 mV for noise
frequencies below 300 KHz and VPP = 40 mV for noise frequencies above
300 KHz.
The maximum peak-to peak noise on the pad supply voltage, measured between
VDDOSC and VSSOSC, is limited to a peak-to-peak voltage of VPP = 100 mV for noise
frequencies below 300 KHz and VPP = 40 mV for noise frequencies above
300 KHz.
These conditions can be achieved by appropriate blocking of the supply voltage
as near as possible to the supply pins and using PCB supply and ground planes.

Oscillator Watchdog (OSC_WDT)

The expected input frequency is selected via the bit field SCU_OSCCON.OSCVAL. The
OSC_WDT checks for too low frequencies and for too high frequencies.
The frequency that is monitored is fOSCREF which is derived for fOSC.
(9)
fO S C
f O S C R EF = ----------------------------------
-
OSCVAL + 1

The divider value SCU_OSCCON.OSCVAL has to be selected in a way that fOSCREF is

2.5 MHz.

Data Sheet 140 V 1.1.1, 2012-12

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Electrical ParametersAC Parameters

Note: fOSCREF has to be within the range of 2 MHz to 3 MHz and should be as close as
possible to 2.5 MHz.
The monitored frequency is too low if it is below 1.25 MHz and too high if it is above
7.5 MHz. This leads to the following two conditions:
• Too low: fOSC < 1.25 MHz × (SCU_OSCCON.OSCVAL+1)
• Too high: fOSC > 7.5 MHz × (SCU_OSCCON.OSCVAL+1)
Note: The accuracy is 30% for these boundaries.

Frequency Modulation
Frequency modulation defines a slow and predictable variation of the clock speed. The
modulation configuration itself is controlled via register SCU_PLLCON2 where the two
bit fields define the modulation properties.
(10)
f OSC MODFREQ × 31, 32
f MOD = -------------- × ----------------------------------------------------
P MODAMP

(11)
MODAMP
MA = ----------------------------
N × 161

Data Sheet 141 V 1.1.1, 2012-12

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Electrical ParametersAC Parameters

5.3.5 ERAY Phase Locked Loop (ERAY_PLL)

Table 33 PLL_ERAY Parameters

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

Accumulated jitter at DPP CC -0.8 − 0.8 ns

SYSCLK pin
Accumulated_Jitter DP CC -0.5 − 0.5 ns
PLL Base Frequency of fPLLBASE_ 50 250 360 MHz
the ERAY PLL ERAY CC
VCO input frequency of fREF CC 20 − 40 MHz
the ERAY PLL
VCO frequency range of fVCO_ERA 450 − 500 MHz
the ERAY PLL Y CC
PLL lock-in time tL CC 5.6 − 200 μs

Note: The specified PLL jitter values are valid if the capacitive load per pin does not
exceed CL = 20 pF with the maximum driver and sharp edge.
Note: The maximum peak-to-peak noise on the pad supply voltage, measured between
VDDPF3 and VSSPF, is limited to a peak-to-peak voltage of VPP = 100 mV for noise
frequencies below 300 KHz and VPP = 40 mV for noise frequencies above
300 KHz.
These conditions can be achieved by appropriate blocking of the supply voltage
as near as possible to the supply pins and using PCB supply and ground planes.

Data Sheet 142 V 1.1.1, 2012-12

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Electrical ParametersAC Parameters

5.3.6 JTAG Interface Timing

The following parameters are applicable for communication through the JTAG debug
interface. The JTAG module is fully compliant with IEEE1149.1-2000.
Note: These parameters are not subject to production test but verified by design and/or
characterization.

Table 34 JTAG Interface Timing Parameters

(Operating Conditions apply)
Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

TCK clock period t1 SR 25 – – ns –

TCK high time t2 SR 10 – – ns –
TCK low time t3 SR 10 – – ns –
TCK clock rise time t4 SR – – 4 ns –
TCK clock fall time t5 SR – – 4 ns –
TDI/TMS setup t6 SR 6 – – ns –
to TCK rising edge
TDI/TMS hold t7 SR 6 – – ns –
after TCK rising edge
TDO valid after TCK falling t8 CC – – 13 ns CL = 50 pF
edge1) (propagation delay) t CC 3 – – ns CL = 20 pF
8
TDO hold after TCK falling t18 CC 2 – – ns
edge1)
TDO high imped. to valid t9 CC – – 14 ns CL = 50 pF
from TCK falling edge1)2)
TDO valid to high imped. t10 CC – – 13.5 ns CL = 50 pF
from TCK falling edge1)
1) The falling edge on TCK is used to generate the TDO timing.
2) The setup time for TDO is given implicitly by the TCK cycle time.

Data Sheet 143 V 1.1.1, 2012-12

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Electrical ParametersAC Parameters

t1
0.9 VD D P
0.5 VD D P
0.1 VD D P
t5 t4
t2 t3

MC_ JTAG_ TCK

Figure 13 Test Clock Timing (TCK)

TCK

t6 t7

TMS

t6 t7

TDI

t9 t8 t1 0

TDO

t18
MC_JTAG

Figure 14 JTAG Timing

Data Sheet 144 V 1.1.1, 2012-12

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Electrical ParametersAC Parameters

5.3.7 DAP Interface Timing

The following parameters are applicable for communication through the DAP debug
interface.
Note: These parameters are not subject to production test but verified by design and/or
characterization.

Table 35 DAP Parameters

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

DAP0 clock period 1)

tTCK SR 12.5 − − ns
DAP0 high time t12 SR 4 − − ns
DAP0 low time 1)
t13 SR 4 − − ns
DAP0 clock rise time t14 SR − − 2 ns
DAP0 clock fall time t15 SR − − 2 ns
DAP1 setup to DAP0 t16 SR 6.0 − − ns
rising edge
DAP1 hold after DAP0 t17 SR 6.0 − − ns
rising edge
DAP1 valid per DAP0 t19 CC 8 − − ns CL= 20 pF;
clock period2) f= 80 MHz
10 − − ns CL= 50 pF;
f= 40 MHz
1) See the DAP chapter for clock rate restrictions in the Active:IDLE protocol state.
2) The Host has to find a suitable sampling point by analyzing the sync telegram response.

t11
0.9 VD D P
0.5 VD D P
0.1 VD D P
t1 5 t14
t1 2 t1 3

MC_DAP0

Figure 15 Test Clock Timing (DAP0)

Data Sheet 145 V 1.1.1, 2012-12

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Electrical ParametersAC Parameters

DAP0

t1 6 t1 7

DAP1

MC_ DAP1_RX

Figure 16 DAP Timing Host to Device

t1 1

DAP1

t1 9
MC_ DAP1_TX

Figure 17 DAP Timing Device to Host

5.3.8 Micro Link Interface (MLI) Timing

Data Sheet 146 V 1.1.1, 2012-12

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Electrical ParametersAC Parameters

MLI Transmitter Timing

t13 t14
t10
t12
TCLKx
t11
t15 t15
TDATAx
TVALIDx
t16
t17
TREADYx

MLI Receiver Timing

t23 t24
t20
t22
RCLKx
t21
t25
t26
RDATAx
RVALIDx

t27 t27
RREADYx

MLI_Tmg_2.vsd

Figure 18 MLI Interface Timing

Note: The generation of RREADYx is in the input clock domain of the receiver. The
reception of TREADYx is asynchronous to TCLKx.
The MLI parameters are vaild for CL = 50 pF and strong driver medium edge.

Data Sheet 147 V 1.1.1, 2012-12

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Electrical ParametersAC Parameters

Table 36 MLI Receiver

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

RCLK clock period t20 SR 1 / fFPI − − ns

RCLK high time1)2) t21 SR − 0.5 x − ns
t20
RCLK low time1)2) t22 SR − 0.5 x − ns
t20
RCLK rise time3) t23 SR − − 4 ns
RCLK fall time 3)
t24 SR − − 4 ns
RDATA/RVALID setup t25 SR 4.2 − − ns
time before RCLK falling
edge
RDATA/RVALID hold time t26 SR 2.2 − − ns
after RCLK falling edge
RREADY output delay t27 SR 0 − 16 ns
time
1) The following formula is valid: t21 + t22 = t20.
2) Min and Max values for this parameter can be derived from the typ. value by considering the other receiver
timing parameters.
3) The RCLK max. input rise/fall times are best case parameters for fSYS = 90 MHz. For reduction of EMI, slower
input signal rise/fall times can be used for longer RCLK clock periods.

Table 37 MLI Transmitter

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

TCLK clock period t10 CC 2x1/ − − ns

fFPI
TCLK high time1)2) t11 CC 0.45 x 0.5 x 0.55 x ns
t10 t10 t10
TCLK low time1)2) t12 CC 0.45 x 0.5 x 0.55 x ns
t10 t10 t10
TCLK rise time t13 CC − − 0.3 x ns
t103)
TCLK fall time t14 CC − − 0.3 x ns
t103)

Data Sheet 148 V 1.1.1, 2012-12

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Electrical ParametersAC Parameters

Table 37 MLI Transmitter (cont’d)

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition
TDATA/TVALID output t15 CC -3 − 4.4 ns
delay time
TREADY setup time t16 SR 18 − − ns
before TCLK rising edge
TREADY hold time after t17 SR -2 − − ns
TCLK rising edge
1) The following formula is valid: t11 + t12 = t10.
2) The min./max. TCLK low/high times t11/t12 include the PLL jitter of fSYS. Fractional divider settings must be
regarded additionally to t11 / t12.
3) For high-speed MLI interface, strong driver sharp or medium edge selection (class A2 pad) is recommended
for TCLK.

5.3.9 Micro Second Channel (MSC) Interface Timing

The MSC parameters are vaild for CL = 50 pF.

Table 38 MSC Parameters

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

FCLP clock period1)2) t40 CC 2x − − ns

TMSC3)
SOP4)/ENx outputs delay t45 CC -2 − 5 ns ENx with strong
from FCLP4) rising edge driver and
sharp (minus )
edge
-2 − 10 ns ENx with strong
driver and
medium
(minus) edge
0 − 21 ns ENx with strong
driver and soft
edge
SDI bit time t46 CC 8x − − ns
TMSC

Data Sheet 149 V 1.1.1, 2012-12

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Electrical ParametersAC Parameters

Table 38 MSC Parameters (cont’d)

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

SDI rise time t48 SR − − 100 ns

SDI fall time t49 SR − − 100 ns
1) FCLP signal rise/fall times are only defined by the pad rise/fall times.
2) FCLP signal high and low can be minimum 1xTMSC
3) TMSC = TSYS = 1 / fSYS.
4) SOP / FCLP either propagated by LVDS or by CMOS strong driver and non soft edge.

t40
0.9 VDDP
FCLP
0.1 VDDP
t45 t45
SOP
EN

t48 t49

0.9 VDDP
SDI
0.1 VDDP

t46 t46
MSC_Tmg_1.vsd

Figure 19 MSC Interface Timing

Note: The data at SOP should be sampled with the falling edge of FCLP in the target
device.

Data Sheet 150 V 1.1.1, 2012-12

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Electrical ParametersAC Parameters

5.3.10 SSC Master/Slave Mode Timing

The SSC parameters are vaild for CL = 50 pF and strong driver medium edge.

Table 39 SSC Parameters

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

SCLK clock period 1)2)3)

t50 CC 2x1/ − − ns
fFPI
MTSR/SLSOx delay form t51 CC 0 − 8 ns
SCLK rising edge
MRST setup to SCLK t52 SR 16.5 − − ns
latching edge3)
MRST hold from SCLK t53 SR 0 − − ns
latching edge3)
SCLK input clock t54 SR 4x1/ − − ns
period1)3) fFPI
SCLK input clock duty t55_t54 45 − 55 %
cycle SR
MTSR setup to SCLK t56 SR 1 / fFPI − − ns
latching edge3)4)
MTSR hold from SCLK t57 SR 1 / fFPI − − ns
latching edge +5
SLSI setup to first SCLK t58 SR 1 / fFPI − − ns
latching edge +5
SLSI hold from last SCLK t59 SR 7 − − ns
latching edge5)
MRST delay from SCLK t60 CC 0 − 16.5 ns
shift edge
SLSI to valid data on t61 CC − − 16.5 ns
MRST
1) SCLK signal rise/fall times are the same as the rise/fall times of the pad.
2) SCLK signal high and low times can be minimum 1xTSSC.
3) TSSCmin = TSYS = 1/fSYS.
4) Fractional divider switched off, SSC internal baud rate generation used.

Data Sheet 151 V 1.1.1, 2012-12

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Electrical ParametersAC Parameters

5) For CON.PH=1 slave select must not be removed before the following shifting edge. This mean, that what ever
is configured (shifting / latching first), SLSI must not be de-actived before the last trailing edge from the pair
of shifting / latching edges.

t50

SCLK1)2)
t51 t51
MTSR1)

t52
t53
1) Data
MRST
valid
t51
2)
SLSOn

1) This timing is based on the following setup: CON.PH = CON.PO = 0.

2) The transition at SLSOn is based on the following setup: SSOTC.TRAIL = 0

and the first SCLK high pulse is in the first one of a transmission.
SSC_TmgMM

Figure 20 SSC Master Mode Timing

Data Sheet 152 V 1.1.1, 2012-12

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Electrical ParametersAC Parameters

t54
First shift First latching Last latching
SCLK1) SCLK edge SCLK edge SCLK edge

t55 t55
t56 t56
t57 t57
MTSR 1) Data Data
valid valid

t60 t60
1)
MRST

t61 t59
SLSI
t58

1) This timing is based on the following setup: CON.PH = CON.PO = 0.

SSC_TmgSM

Figure 21 SSC Slave Mode Timing

Data Sheet 153 V 1.1.1, 2012-12

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Electrical ParametersAC Parameters

5.3.11 ERAY Interface Timing

The timings of this section are valid for the strong driver and either sharp edge or medium
edge settings of the output drivers with CL = 25 pF.
The ERAY interface is only available for the SAK-TC1793F-512F270EF / SAK-
TC1793F-512F270EB / SAK-TC1793F-512F200EF / SAK-TC1793F-
512F200EB / SAK-TC1793S-512F270EF.

Table 40 ERAY Parameters

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

Time span from last BSS t60 CC 997.75 − 1002.2 ns

to FES without the 5
influence of quartz
tolerancies (d10Bit_TX)1)
TxD data valid from t61-t62 − − 1.5 ns Asymmetrical
fsample flip flop txd_reg CC delay of rising
TxDA, TxDB and falling edge
(dTxAsym)2)3) (TxDA, TxDB)
Time span between last t63 SR 966 − 1046.1 ns
BSS and FES without
influence of quartz
tolerancies
(d10Bit_RX)1)4)5)
RxD capture by fsample t64-t65 − − 3.0 ns Asymmetrical
(RxDA/RxDB sampling CC delay of rising
flip-flop) (dRxAsym)6) and falling edge
(RxDA, RxDB)
TxD data delay from dTxdly − − 10.0 ns Px_PDR.PDy =
sampling flip-flop CC 000B
− − 15.0 ns Px_PDR.PDy =
001B
RxD capture delay by dRxdly − − 10.0 ns
sampling flip-flop CC
1) This includes the PLL_ERAY accumulated jitter.
2) Refers to delays caused by the asymmetries of the output drivers of the digital logic and the GPIO pad drivers.
Quarz tolerance and PLL_ERAY accumulated jitter are not included.
3) E-Ray TxD output drivers have an asymmetry of rising and falling edges of |tFA2 - tRA2| ≤ 1 ns.
4) Limits of 966ns and 1046.1ns correspond to (30%, 70%) * VDDP FlexRay standard input thresholds. For input
thresholds of this product, a correction of - 0.5 ns and +0.1 ns has to be applied.

Data Sheet 154 V 1.1.1, 2012-12

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Electrical ParametersAC Parameters

5) Valid for output slopes of the bus driver of dRxSlope ≤ 5ns, 20% * VDDP to 80% * VDDP, according to the
FlexRay Electrical Physical Layer Specification V2.1B. For A2 pads, the rise and fall times of the incoming
signal have to satisfy the following inequality: -1.6ns ≤ tFA2 - tRA2 ≤ 1.3ns.
6) Valid for output slopes of the bus driver of dRxSlope ≤ 5ns, 20% * VDDP to 80% * VDDP, according to the
FlexRay Electrical Physical Layer Specification V2.1B. For A2 pads, the rise and fall times of the incoming
signal have to satisfy the following inequality: -1.6ns ≤ tFA2 - tRA2 ≤ 1.3ns.

BSS Last CRC Byte FES

(Byte Start Sequence) (Frame End Sequence)

0.7 VDD
TXD 0.3 VDD

t60

tsample

TXD 0.9 VDD

0.1 VDD
t61 t62

BSS Last CRC Byte FES

(Byte Start Sequence) (Frame End Sequence)

0.7 VDD
RXD 0.3 VDD

t63

tsample

RXD 0.7 VDD

0.3 VDD
t64 t65
ERAY_TIMING

Figure 22 ERAY Timing

Data Sheet 155 V 1.1.1, 2012-12

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Electrical ParametersAC Parameters

5.3.12 EBU Timings

5.3.12.1 BFCLKO Output Clock Timing

VSS = 0 V;VDD = 1.3 V ± 5%; VDDEBU = 2.5 V ± 5% and 3.3 V ± 5%,;
CL = 35 pF

Table 41 BFCLK0 Output Clock Timing Parameters1)

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Con
dition
BFCLKO clock period tBFCLKO CC 13.332) – – ns –
BFCLKO high time t5 CC 3 – – ns –
BFCLKO low time t6 CC 3 – – ns –
BFCLKO rise time t7 CC – – 3 ns –
BFCLKO fall time t8 CC – – 3 ns –
BFCLKO duty cycle t5/(t5 + t6)3) DC 35 50 55 % –
1) Not subject to production test, verified by design/characterization.
2) The PLL jitter characteristics add to this value according to the application settings. See the PLL jitter
parameters.
3) The PLL jitter is not included in this parameter. If the BFCLKO frequency is equal to fCPU, the K divider has to
be regarded.

tBFCLKO
0.9 VDD
BFCLKO 0.5 VDDP05
0.1 VDD
t8 t7
t5 t6
MCT04883_mod

Figure 23 BFCLKO Output Clock Timing

5.3.12.2 EBU Asynchronous Timings

VSS = 0 V;VDD = 1.3 V ± 5%; VDDEBU = 2.5 V ± 5% and 3.3 V ± 5%, Class B pins;
CL = 35 pF for address/data; CL = 40pF for the control lines.
For each timing, the accumulated PLL jitter of the programed duration in number of clock
periods must be added separately. Operating conditions apply and CL = 35 pF.

Data Sheet 156 V 1.1.1, 2012-12

 TC1793

Electrical ParametersAC Parameters

Table 42 EBU Common Asynchronous Timings

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

Pulse wdih deviation from ta CC -0.8 − 0.8 ns edge= medium

the ideal programmed -0.8 − 0.8 ns edge= sharp
width due to B pad
asymmetry, rise delay - fall
delay1)
AD(31:0) output delay to t13 CC -5.5 − 2 ns
ADV# rising edge,
multiplexed read / write1)
AD(31:0) output delay to t14 CC -5.5 − 2 ns
ADV# rising edge,
multiplexed read / write1)
Address valid to CS falling t15 CC -2 − 2 ns
edge (deviation from
programmed value)1)
Address valid to ADV t16 CC -2 − 2 ns
falling edge (deviation
from programmed value)1)
ADV falling edge t17 CC -2 − 2 ns
-> CSfalling edge
(deviation from
programmed value)1)
1) Not subject to production test, verified by design/characterization.

Data Sheet 157 V 1.1.1, 2012-12

 TC1793

Electrical ParametersAC Parameters

Table 43 EBU Asynchronous Read Timings

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

A(23:0) output delay to RD t0 CC -2.5 − 2.5 ns

rising edge, deviation from
the ideal programmed
value1)
A(23:0) output delay to RD t1 CC -2.5 − 2.5 ns
rising edge, deviation from
the ideal programmed
value1)
CS rising edge to RD t2 CC -2 − 2.5 ns
rising edge, deviation from
the ideal programmed
value1)
ADV rising edge to RD t3 CC -1.5 − 4.5 ns
rising edge, deviation from
the ideal programmed
value1)
BC rising edge to RD t4 CC -2.5 − 2.5 ns
rising edge, deviation from
the ideal programmed
value1)
WAIT input setup to RD t5 SR 12 − − ns
rising edge, deviation from
the ideal programmed
value1)
WAIT input hold to RD t6 SR 0 − − ns
rising edge, deviation from
the ideal programmed
value1)
Data input setup to RD t7 SR 12 − − ns
rising edge, deviation from
the ideal programmed
value1)

Data Sheet 158 V 1.1.1, 2012-12

 TC1793

Electrical ParametersAC Parameters

Table 43 EBU Asynchronous Read Timings (cont’d)

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition
Data input hold to RD t8 SR -4 − − ns
rising edge, deviation from
the ideal programmed
value1)
MR / W output delay to t9 CC -2.5 − 1.5 ns
RD# rising edge, deviation
from the ideal
programmed value1)
Data input hold from CS t18 CC -4 − − ns
rising edge1)
Data input setup to CS t19 CC 12 − − ns
rising edge1)
1) Not subject to production test, verified by design/characterization.

Data Sheet 159 V 1.1.1, 2012-12

 TC1793

Electrical ParametersAC Parameters

EBU Address Address Hold Command Command Recovery New Addr.

STATE Phase Phase (opt.) Delay Phase Phase Phase (opt.) Phase

Control Bitfield: ADDRC AHOLDC CMDDELAY RDWAIT RDRECOVC ADDRC

Duration Limits in 1...15 0...15 0...7 1...31 0...15 1...15

EBU_CLK Cycles

A[23:0] Valid Address Next

Addr.
pv + t0 pv + t1
pv + ta t2
CS[3:0]
CSCOMB

pv + ta pv + t3
ADV

pv + ta
RD

pv + ta
pv + ta t4
BC[3:0]

pv + t5 t6
WAIT

pv + t13 pv + t14 t7
t8

AD[31:0] Address Out Data In

MR/W
pv + t9
pv = programmed value,
TEBU_CLK * sum (correponding bitfield values) new_MuxRD_Async_10.vsd

Figure 24 Multiplexed Read Access

Data Sheet 160 V 1.1.1, 2012-12

 TC1793

Electrical ParametersAC Parameters

EBU Address Address Hold Command Recovery New Addr.

STATE Phase Phase (opt.) Phase Phase (opt.) Phase

Control Bitfield: ADDRC AHOLDC RDWAIT RDRECOVC ADDRC

Duration Limits in 1...15 0...15 1...31 0...15 1...15

EBU_CLK Cycles

A[23:0] Valid Address Next

Addr.
pv + t0 pv + t1
pv + ta t2
CS[3:0]
CSCOMB

pv + ta pv + t3

ADV

pv + ta
RD

pv + ta
pv + ta t4
BC[3:0]

pv + t5 t6
WAIT

t7
t8

AD[31:0] Data In

MR/W
pv + t9

pv = programmed value,
TEBU_CLK * sum (correponding bitfield values) new_DemuxRD_Async_10.vsd

Figure 25 Demultiplexed Read Access

Data Sheet 161 V 1.1.1, 2012-12

 TC1793

Electrical ParametersAC Parameters

Table 44 EBU Asynchnronous Write Timings

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

A(23:0) output delay to t30 CC -2.5 − 2.5 ns

WR rising edge, deviation
from the ideal
programmed value1)
A(23:0) output delay to t31 CC -2.5 − 2.5 ns
WR rising edge, deviation
from the ideal
programmed value1)
CS rising edge to WR t32 CC -2 − 2 ns
rising edge, deviation from
the ideal programmed
value1)
ADV rising edge to WR t33 CC -2.5 − 2 ns
rising edge, deviation from
the ideal programmed
value1)
BC rising edge to WR t34 CC -2.5 − 2 ns
rising edge, deviation from
the ideal programmed
value1)
WAIT input setup to WR t35 SR 12 − − ns
rising edge, deviation from
the ideal programmed
value1)
WAIT input hold to WR t36 SR 0 − − ns
rising edge, deviation from
the ideal programmed
value1)
Data output delay to WR t37 CC -5.5 − 2 ns
rising edge, deviation from
the ideal programmed
value1)

Data Sheet 162 V 1.1.1, 2012-12

 TC1793

Electrical ParametersAC Parameters

Table 44 EBU Asynchnronous Write Timings (cont’d)

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition
Data output delay to WR t38 CC -5.5 − 2 ns
rising edge, deviation from
the ideal programmed
value1)
MR / W output delay to t39 CC -2.5 − 1.5 ns
WR rising edge, deviation
from the ideal
programmed value1)
1) Not subject to production test, verified by design/characterization.

Data Sheet 163 V 1.1.1, 2012-12

 TC1793

Electrical ParametersAC Parameters

EBU Address Address Hold Command Data Recovery New Addr.

STATE Phase Phase (opt.) Phase Hold Phase Phase (opt.) Phase

Control Bitfield: ADDRC AHOLDC RDWAIT DATAC RDRECOVC ADDRC

Duration Limits in 1...15 0...15 1...31 0...15 0...15 1...15

EBU_CLK Cycles

A[23:0] Valid Address Next

Addr.
pv + t30
pv + t31
pv + ta
CS[3:0] pv + t32
CSCOMB

pv + ta pv + t33

ADV

pv + ta
RD/WR

pv + ta
pv + ta
BC[3:0] t34

t35
WAIT
t36
pv + t37
t14
pv + t13 pv + t38

AD[31:0] Address Out Data Out

MR/W pv + t39

pv = programmed value,
TEBU_CLK * sum (correponding bitfield values) new_MuxWR_Async_10.vsd

Figure 26 Multiplexed Write Access

Data Sheet 164 V 1.1.1, 2012-12

 TC1793

Electrical ParametersAC Parameters

EBU Address Address Hold Command Data Recovery New Addr.

STATE Phase Phase (opt.) Phase Hold Phase Phase (opt.) Phase

Control Bitfield: ADDRC AHOLDC RDWAIT DATAC RDRECOVC ADDRC

Duration Limits in 1...15 0...15 1...31 0...15 0...15 1...15

EBU_CLK Cycles

A[23:0] Valid Address Next

Addr.
pv + t30
pv + t31
pv + ta
CS[3:0] pv + t32
CSCOMB

pv + ta pv + t33

ADV

pv + ta
RD/WR

pv + ta
pv + ta
BC[3:0] t34

t35
WAIT
t36

pv + t37 pv + t38

AD[31:0] Data Out

pv + t39
MR/W

pv = programmed value,
TEBU_CLK * sum (correponding bitfield values) new_DemuxWR_Async_10.vsd

Figure 27 Demultiplexed Write Access

5.3.12.3 EBU Burst Mode Access Timing

VSS = 0 V;VDD = 1.3 V ± 5%; VDDEBU = 2.5 V ± 5% and 3.3 V ± 5%, Class B pins;
CL = 35 pF;

Data Sheet 165 V 1.1.1, 2012-12

 TC1793

Electrical ParametersAC Parameters

Table 45 EBU Burst Read Timings

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

Output delay from t10 CC -2 − 2 ns

BFCLKO rising edge1)
RD and RD/WR t12 CC -2 − 2 ns
active/inactive after
BFCLKO active edge1)2)
CSx output delay from t21 CC -2.5 − 1.5 ns
BFCLKO active edge1)2)
ADV active/inactive after t22 CC -2 − 2 ns
BFCLKO active edge1)3)
BAA active/inactive after t22a CC -2.5 − 1.5 ns
BFCLKO active edge1)3)
Data setup to BFCLKI t23 SR 3 − − ns
rising edge1)
Data hold from BFCLKI t24 SR 0 − − ns
rising edge1)
WAIT setup (low or high) t25 SR 3 − − ns
to BFCLKI rising edge 1)
WAIT hold (low or high) t26 SR 0 − − ns
from BFCLKI rising edge1)
1) Not subject to production test, verified by design/characterization.
2) An active edge can be rising or falling edge, depending on the settings of bits BFCON.EBSE / ECSE and clock
divider ratio. Negative minimum values for these parameters mean that the last data read during a burst may
be corrupted. However, with clock feedback enabled, this value is oversampling not required for the LMB
transaction and will be discarded. If the clock feedback is not enabled, the input signals are latched using the
internal clock in the same way as at asynchronous access. So t14, t15, t16, t17, t18 and t19 from the
asynchronous timings apply.
3) For BUSCONx.EBSE=1B and BUSAPx.EXLCLK=00B, ADV will change normally on the clock edge so this
parameter is used directly.
For BUSCONx.EBSE=1B and other values of BUSAPx.EXTCLK, ADV and BAA add the high pulse width of
EBUCLK to this parameter.
For BUSCONx.EBSE=0B and BUSAPx.EXTCLK=00B add the high pulse width of EBUCLK to this parameter.
For BUSCONx.EBSE=0B and BUSAPx.EXTCLK=11B add two EBUCLK periodsto this parameter to get the
hold time from BFCLKO rising edge to the ADV.
For BUSCONx.EBSE=0B and BUSAPx.EXTCLK=01B or 10B add 1 EBUCLK period.
Please note that the high pulse width of EBUCLK is defined by the high pulse width of fVCO of the used PLL.

Data Sheet 166 V 1.1.1, 2012-12

 TC1793

Electrical ParametersAC Parameters

Address Command Burst Burst Recovery Next Addr.

Phase(s) Phase(s) Phase(s) Phase(s) Phase(s) Phase(s)
BFCLKI 1)
BFCLKO

t10 t10
A[23:0] Burst Start Address Next
Addr.

t22 t22 t22

ADV

t21 t21 t21

CS[3:0]
CSCOMB

t12 t12
RD
RD/WR

t22a t22a
BAA

t24 t24
t23 t23
D[31:0]
Data (Addr+0) Data (Addr+4)
(32-Bit)

D[15:0]
Data (Addr+0) Data (Addr+2)
(16-Bit)
t26
t25
WAIT

1) Output delays are always referenced to BCLKO. The reference clock for input
characteristics depends on bit EBU_BFCON.FDBKEN.
EBU_BFCON.FDBKEN = 0: BFCLKO is the input reference clock.
EBU_BFCON.FDBKEN = 1: BFCLKI is the input reference clock (EBU clock
feedback enabled). BurstRDWR_4.vsd

Figure 28 EBU Burst Mode Read / Write Access Timing

Data Sheet 167 V 1.1.1, 2012-12

 TC1793

Electrical ParametersAC Parameters

5.3.12.4 EBU Arbitration Signal Timing

VSS = 0 V;VDD = 1.5 V ± 5%; VDDEBU = 2.5 V ± 5% and 3.3 V ± 5%, Class B pins;
TA = -40°C to +125 °C; CL = 35 pF;

Table 46 EBU EBU Arbitration Timings

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

Output delay from t27 CC − − 3 ns

BFCLKO rising edge1)
Data setup to BFCLKO t28 SR 8 − − ns
falling edge1)
Data hold from BFCLKO t29 SR 2 − − ns
falling edge1)
1) Not subject to production test, verified by design/characterization.

BFCLKO

t27 t27
HLDA Output

t27 t27
BREQ Output

BFCLKO
t28
t28
t29 t29
HOLD Input
HLDA Input EBUArb_1

Figure 29 EBU Arbitration Signal Timing

Data Sheet 168 V 1.1.1, 2012-12

 TC1793

Electrical ParametersFlash Memory Parameters

5.4 Flash Memory Parameters

The data retention time of the TC1793’s Flash memory depends on the number of times
the Flash memory has been erased and programmed.

Table 47 FLASH32 Parameters

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition

Data Flash Erase Time tERD CC − − 4.21) s

per Sector
Program Flash Erase tERP CC − − 5 s
Time per 256 KByte
Sector
Program time data flash tPRD CC − − 5.3 ms without
per page2) reprogramming
− − 15.9 ms with two
reprogramming
cycles
Program time program tPRP CC − − 5.3 ms without
flash per page3) reprogramming
− − 10.6 ms with one
reprogramming
cycle
Data Flash Endurance NE CC 60000 − − cycle Min. data
4)
s retention time 5
years
Erase suspend delay tFL_ErSusp − − 15 ms
CC
Wait time after margin tFL_Margin 10 − − μs
change Del CC
Program Flash Retention tRET CC 20 − − year Max. 1000
Time, Physical Sector5)6) s erase/program
cycles
Program Flash Retention tRETL CC 20 − − year Max. 100
Time, Logical Sector5)6) s erase/program
cycles
UCB Retention Time5)6) tRTU CC 20 − − year Max. 4
s erase/program
cycles per UCB

Data Sheet 169 V 1.1.1, 2012-12

 TC1793

Electrical ParametersFlash Memory Parameters

Table 47 FLASH32 Parameters (cont’d)

Parameter Symbol Values Unit Note /
Min. Typ. Max. Test Condition
Wake-Up time tWU CC − − 270 μs
DFlash wait state WSDF 50 ns x − −
configuration CC fFSI
PFlash wait state WSPF 26 ns x − −
configuration CC fFSI
1) In case of wordline oriented defects (see robust EEPROM emulation in the User's Manual) this erase time can
increase by up to 100%.
2) In case the Program Verify feature detects weak bits, these bits will be programmed up to twice more. Each
reprogramming takes additional 5 ms.
3) In case the Program Verify feature detects weak bits, these bits will be programmed once more. The
reprogramming takes additional 5 ms.
4) Only valid when a robust EEPROM emulation algorithm is used. For more details see the User´s Manual.
5) Storage and inactive time included.
6) At average weighted junction temperature Tj = 100°C, or the retention time at average weighted temperature
of Tj = 110°C is minimum 10 years, or the retention time at average weighted temperature of Tj = 150°C is
minimum 0.7 years.

Data Sheet 170 V 1.1.1, 2012-12

 TC1793

Electrical ParametersPackage and Reliability

5.5 Package and Reliability

5.5.1 Package Parameters

Table 48 Thermal Characteristics of the Package

Device Package RΘJCT1) RΘJCB1) RΘJA Unit Note
TC1793 PG-BGA- 416 3,3 4,5 12,1 K/W
1) The top and bottom thermal resistances between the case and the ambient (RTCAT, RTCAB) are to be combined
with the thermal resistances between the junction and the case given above (RTJCT, RTJCB), in order to calculate
the total thermal resistance between the junction and the ambient (RTJA). The thermal resistances between
the case and the ambient (RTCAT, RTCAB) depend on the external system (PCB, case) characteristics, and are
under user responsibility.
The junction temperature can be calculated using the following equation: TJ = TA + RTJA × PD, where the RTJA
is the total thermal resistance between the junction and the ambient. This total junction ambient resistance
RTJA can be obtained from the upper four partial thermal resistances.
Thermal resistances as measured by the ’cold plate method’ (MIL SPEC-883 Method 1012.1).

Data Sheet 171 V 1.1.1, 2012-12

 TC1793

Electrical ParametersPackage and Reliability

5.5.2 Package Outline

Figure 30 Package Outlines PG-BGA- 416

You can find all of our packages, sorts of packing and others in our Infineon Internet
Page “Products”: http://www.infineon.com/products.

5.5.3 Quality Declarations

Table 49 Quality Parameters

Parameter Symbol Values Unit Note / Test Condition
Min. Typ. Max.
Operation tOP – – 24000 hours –2)
Lifetime1)
ESD susceptibility VHBM – – 2000 V Conforming to
according to JESD22-A114-B
Human Body
Model (HBM)
ESD susceptibility VHBM1 – – 500 V –
of the LVDS pins

Data Sheet 172 V 1.1.1, 2012-12

 TC1793

Electrical ParametersPackage and Reliability

Table 49 Quality Parameters

Parameter Symbol Values Unit Note / Test Condition
Min. Typ. Max.
ESD susceptibility VCDM – – 500 V Conforming to
according to JESD22-C101-C
Charged Device
Model (CDM)
Moisture MSL – – 3 – Conforming to Jedec
Sensitivity Level J-STD-020C for 240°C
1) This lifetime refers only to the time when the device is powered on.
2) For worst-case temperature profile equivalent to:
1200 hours at Tj = 125...150oC
3600 hours at Tj = 110...125oC
7200 hours at Tj = 100...110oC
11000 hours at Tj = 25...100oC
1000 hours at Tj = -40...25oC

Data Sheet 173 V 1.1.1, 2012-12

 TC1793

History

6 History
The following changes where done between Version 0.6 and 0.62 of this document:
• Change for port 1.7 the symbol from CC60INB to CC61INB for the CCU60 input
• Add footnote to port 4.1 alternate output 3 MTSR2
• change function description for port 4.1 alternate output 3 MTSR2 from Slave to
Master Transmit
• Add footnote to port 6.4 alternate output 1 MTSR1
• Add footnote to port 7.1 alternate output 2 MTSR3
• Change for port 8.2 the symbol from CC61 (CCU60) to COUT63 (CCU61)
• Change for port 8.3 the symbol from OUT43 (GPTA1) to CC62 (CCU60)
• correct typo for port 9.4 from COUT&= to COUT60
• correct typo for port 9.5 from COUT&! to COUT61
• Change for port 15.4 and 15.5 the type from B1 to B
• Change for port 15 the type from S to D / S
• add clarification that table 11 defines the conditions for all other parameters
• add conditions for MLI, MSC, SSC, parameters
• add parameters dTxdly and dRxdly to ERAY parameters
• correct footnotes for ERAY parameters
• split flash parameters tPRD and tPRP in two conditions
• add conditions to LVDS pad parameters
• remove Pin Reliability in Overload section
• add parameters IIN and Sum IIN to absolute ratings
• add parameter HYSX to PSC_XTAL
• added RDSON values for all driver settings (weak, medium, and strong)
• removed footnote 2 of table 10
• change load for timing of SSC, MSC, and MLI from CL = 25 pF to CL = 50 pF (typical)
• add to parameters tRF and tFF condition CL = 50 pF
• add new footnote 7) to ADC parameter table
• add min and max value for QCONV and adapt typ value
• add load conditions for tFF1 and tRF1
• add conditions to PLL parameter tL
• change DAP parameter t19 from SR to CC classification
• remove footnote 2 for the FADC
• adapt IDs for AB step
•
• removed footnote 2 in table 9
• change max value for ADC parameter tS from 255 to 257
•
The following changes where done between Version 0.62 and 0.63 of this document:
• shift Output function CC62 of CCU60 for P8.3 from O3 to O2
• remove output function OUT43 for GPTA1 for P8.3

Data Sheet 1 V 1.1.1, 2012-12

 TC1793

History

• add output function TData1 for MLI1 as O3 for P8.3

• remove O2 OUT105 for GPTA1 of P14.9
• add O2 T3OUt for GPT121 of P14.9
• changed the name for O3 from EVTO2 to EVTO1 for P0.5
• changed the name for O3 from EVTO3 to EVTO2 for P0.6
• changed the name for O3 from EVTO4 to EVTO3 for P0.7
• changed the name for O1 and O2 from OUT70 to OUT71 for P1.15
• add input function SLSI2 for SSC2 to P4.9
• change input function T13HRE from CCU60 to CCU63 for P3.14
• change for port 8.2 the symbol from CC61(CCU60) to COUT63(CCU61)
• change for port 14.10 the symbol from T3OUT(GPT120) to T6OUT(GPT121)
• add to all SSC signal the associated SSC module where is was missing in the pinning
• add section Pin Reliability in Overload
• increase values for absolute maximum parameters IIN and SumIIN
• correct P14.8 O2 as this was uncorrected label as O1
The following changes where done between Version 0.63 and 0.7 of this document:
• update value of RTID registers in section Identification Registers for AB step
• remove sentence ‘Exposure to conditions within the maximum ratings will not affect
device reliability. To replace this sentence section Pin Reliability in Overload was
added.
• add footnote 1 to table 12 (Operating Conditions)
• increase values for absolute maximum parameters IIN and SumIIN
• remove capacitance conditions for LVDS pad parameters as loads are defined by
interface (MSC) timings
• add parameter VILSD for class S pads
• add VDDM supply limitation for class S parameters
• add footnote 10 to table 23 (ADC parameters)
• remove old footnote 2 from table 24 (FADC parameters)
• remove term typical from load of Peripheral Timings
• add definition of driver strength settings for ERAY Interface Timing
• update formulas for frequency modulation
• change SSC parameter from t59 CC to SR
• add figures for EBU Multiplexer and Demultiplexed Write Access
• change footnote 4 wording for ERAY timing back to TC1797 wording
• increase flash parameters tPRD and tPRP values
• increase flash parameter tERD
• add section 5.2.6.1.
• change in legende of table 2 definition of class S pad
• remove condition for VDDEBU
• correct section Extended Range Operating Conditions for the 3.3 V area
• increase limit in Extended Range Operating Conditions from 1 hour to 1000 hours

Data Sheet 2 V 1.1.1, 2012-12

 TC1793

History

• specify wording for limitation of pad performance in section Extended Range

Operating Conditions
• remove incorrect test conditions for RDSONx parameters
• remove ADC 3 from ADC parameters
• adjust typo in temperature profile
• removed RDSON parameters for class F pads weak driver as only medium is
available
• add parameter fSYSD for the SYSPLL
• changed RDSON values for class F pads
• updated class B pads rise and fall times definitions
• add RDSON parameters to class B pads
• supply range of 1.8 V for VDDEBUwas removed
• update all current values of table 28 (Power Supply Parameters)
• rework the 3.3 V current part of the Power Supply Parameters for better description
and usage
– Parameters IDDP_FP, IDDFL3E and IDDFL3R are removed and replaced in the following
way
– IDDP_FP is replaced by IDDP with the condition including flash programming current
– IDDFL3E is replaced by IDDP with the condition including flash erase verify current
– IDDFL3R is replaced by IDDP with the condition including flash read current
– parameter IDDFL3R was renamed to IDDFL3
The rework of the 3.3 V current part of the Power Supply Parameters was done for
simplification and clarification. Former given values could still be used if liked, the new
definition results in the same resulting values or slightly better values. The flash module
is supplied via IDDFL3 and IDDP. For the different flash operating modes in worst case
different allocations for the two domains resulting.
The application typical case ‘flash read’ has max IDDP of 25 mA and max IDDFL3 of 98 mA
resulting is a sum of 123 mA.
The case ‘flash programming’ has max IDDP of 55 mA and max IDDFL3 of 29 mA resulting
is a sum of 84 mA.
The case ‘flash erase verify’ has max IDDP of 40 mA and max IDDFL3 of 98 mA resulting
is a sum of 138 mA.
So for the old parameter IDDP with 35 mA, the new version reads as
IDDP = 25+IDDP_PORST = 32 mA for the same application relevant case.
The following changes where done between Version 0.7 and 1.0 of this document:
• improve parameters IDDFL3
• change for parameter NE note from Max. data retention to Min.
• change description of parameter tCAL for the ADC
• correct typo for class D pads in tables 14 and 15
• adapt Absolute Maximun Rating
• add footnote to Flash parameter tERD

Data Sheet 3 V 1.1.1, 2012-12

 TC1793

History

• add note at the end of Pin Reliability in Overload section

• clearify pad supply levels in Pin Reliability in Overload section
• add footnote for D-Flash currents in power section
• clearify wording for valid operating conditions
• add negative limit for class S pad leakage
• increase max values for parameter tB
• change formula 10
• change MLI parameter t17 min value
• change footnote 3 for EBU parameter t22
• change package naming
• add products SAK-TC1793N-512F270EF and SAK-TC1793N-512F270EB
• split FADC DNL parameter into two conditions and change value for gain 4 and 8
• update footnote 10 for the ADC
• update package outline
• update parmeter description for SSC parameters t52 and t53
• change SSC parameters from CC to SR Symbol for t56, t57, t58 and t59
• increase value range for BFCLKO duty cycle
The following changes where done between Version 1.0 and 1.1 of this document:
• add product option SAK-TC1793S-512F270EF
• update block diagrams to cover new option
• add identification registers for new product option
• rework first sentence for chapter 5.3
• reduce min value for tL for both PLLs
• split fVCO for system PLL into two conditions
• add for MLI and SSC parameter: valid strong driver medium edge only
• add footnote 5) for SSC parameters
• add parameters t15, t16, t17, and t19 to the EBU
The following changes where done between Version 1.1 and 1.1.1 of this document:
• update the incoorect CHIPID values for copper and non copper bond options.
• product SAK-TC-1793N-512F270EB not longer supported and replaced by SAK-
TC1793N-512F270EF

Data Sheet 4 V 1.1.1, 2012-12

w w w . i n f i n e o n . c o m

Published by Infineon Technologies AG