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mems question paper 2

This document outlines the examination structure for the B.Tech (ME) final year students at D.K.T.E. Society’s Textile and Engineering Institute. It includes instructions for the exam, a list of questions covering topics such as Microsystems, sensors, and material selection, along with their respective marks. The exam format emphasizes compulsory questions and prohibits the use of mobile phones and programmable calculators.

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Vijay Kamble
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0% found this document useful (0 votes)
8 views

mems question paper 2

This document outlines the examination structure for the B.Tech (ME) final year students at D.K.T.E. Society’s Textile and Engineering Institute. It includes instructions for the exam, a list of questions covering topics such as Microsystems, sensors, and material selection, along with their respective marks. The exam format emphasizes compulsory questions and prohibits the use of mobile phones and programmable calculators.

Uploaded by

Vijay Kamble
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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PRN QP Code

D.K.T.E. Society’s TEXTILE AND ENGINEERING INSTITUTE, ICHALKARANJI.


(An Autonomous Institute)
Semester End Examination –Winter/Summer/Makeup -20…
Class - Program Final YearB.Tech. (ME) Day &Date , / /
Course Code MEL428 Time to
Course Title MEMS Max.Marks 100

Instructions :
1. All Questions are compulsory; assume suitable data if necessary and mention it clearly.
2. Mobile phones and programmable calculators are strictly prohibited.
3. Writing anything on question paper(except PRN), exchange/sharing of stationery, calculator etc. are not allowed.

Que No Question Marks BL CO


1 A Distinguish between Microelectronics and Microsystems 8 1 1
B Explain how oxidation principle is used in Micro system fabrication. 7 2 2
2 A What are the applications of Microsystems 8 2 2
Attempt any one of B & C
B Differentiate CVD and PVD 7 3 3
C With neat labeled figures, demonstrate the steps involved in photolithography 7 2 2
3 A What are chemical sensors .Explain in detail 8 2 2
B Explain acoustic and biomedical sensors 7 3 3

4 A What are optical sensors .Explain in detail 8 3 3


Attempt any one of B & C
B Give short notes on Micro motors. And comb drive devices 7 3 3
C Describe the working principles of micro accelerometers and micro pumps 7 4 4
5 Attempt any one ofA&B
A Explain design constraint and selection of materials 8 4 4
B Explain signal transduction and packaging in mems design 8 3 3
Attempt any twoof C, D & E
C Explain bending stress and bending equation in detail 6 2E 2
D Explain torsional shear stress and torsion equation in detail 6 1 1
E Explain the Levels of Microsystems Packaging 6 3 3
6 Attempt any one ofA&B
A Explain sealing and encapsulatiol 8 3 3
B Explain torsional shear stress and torsion equation in detail 8 2 2
Attempt any twoof C, D & E
C Explain the Levels of Microsystems Packaging 6 1 1
D Explain static stresses, poissons ratio elastic limit in detail 6 1 1
E Explain wire Bonding 6 3 3

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