TI Designs

Isolated RS-232 With Integrated Signal and Power

Reference Design

Description Features
This TI Design provides a compact solution capable of • Smallest Combination Solution
generating isolated DC power while supporting (14.8 mm × 11.5 mm):
isolated RS-232 communication. The TIDA-01230 – Slightly Larger Than ISOW7842 Device
consists of a reinforced digital isolator with integrated Footprint
power combined with an RS-232 communication
module. The solution is designed in such a way as to • Single Input Power Supply Solution:
take up minimal area to achieve this solution. – No Separate Isolated Supply Required to Power
Interface-Side Components
Resources • Reduced BOM Cost; Solution Eliminates
Requirement for Separate Transformer
TIDA-01230 Design Folder
ISOW7842 Product Folder • Simpler Design
TRS3122E Product Folder • Extendable to Other RS-232 Transceivers

Applications
ASK Our E2E Experts • Grid Communication Modules
• Building Automation and HVAC
• Industrial Automation
• Remote Radio Unit (RRU) and Base Band
Unit (BBU)
• Medical Equipment
• Other Communication Modules Dealing With
High-Voltage Systems

Isolation
barrier
Input voltage 5 V VISO (3.3 V)

Tx1 Tx1 Tx1

Tx2
Reinforced digital isolator +
Tx2
RS-232 interface
Tx2 } RS-232
outputs

Rx1 DC-DC converter Rx1 Rx1

TRS3122E
ISOW7842
Rx2 Rx2 Rx2 } RS-232
inputs

Copyright © 2017, Texas Instruments Incorporated

An IMPORTANT NOTICE at the end of this TI reference design addresses authorized use, intellectual property matters and other
important disclaimers and information.

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System Overview www.ti.com

1 System Overview

1.1 Design Theory

1.1.1 Isolation in Data Communication

Most industrial interface systems are areas where noise can seriously affect the integrity of data transfer.
A tested method of improving noise performance for any interface circuit is galvanic isolation. Isolating the
low-voltage (LV) microcontroller (MCU) side from the high-voltage (HV) interface side has proven to be an
effective solution to protect from data corruption and to protect LV side components from seeing HV
stresses like electrostatic discharge (ESD), electrical fast transient (EFT), and surge.
Common-mode noise effects and many forms of radiated noise can affect the communication system.
Unwanted currents and voltages on a cable bus connecting multiple systems can cause severe problems.
These voltages and currents come primarily from two sources: ground loops and electrical line surges.
Ground loops occur when a bus or system uses multiple ground paths. Two system grounds connected to
the bus and separated by hundreds or thousands of meters may not have the same potential. Because of
this potential difference, current flows between these points. This unintended current flow can damage or
destroy components. Electrical surges can be caused by many sources, the result of currents coupled
onto cable lines through induction. Long cable lines in industrial environments are especially susceptible to
this phenomenon. The operation of electric motors, in particular, causes rapid changes in the ground
potential. These changes can generate a current flow through any nearby lines to equalize the ground
potential. Other HV stress voltage sources include ESDs, coupled transient noises (EFT) and lightning
strikes (surge). These induced surges can result in thousands of volts of potential on the line, and
manifest themselves as transient current and voltage surges. Thus, a remote node may receive a 5-V
switching signal superimposed on an HV level with respect to the local ground. These uncontrolled
voltages and currents can corrupt the signal and be catastrophic to the device and system, damaging or
destroying the components connected to the bus and resulting in system failure.

1.1.2 RS-232 Communication

The RS-232 communication protocol continues to withstand the test of time. Extensive use of the protocol
for PLCs in industrial environments have started demanding RS-232 transceivers with smaller form factor,
faster speed, lower power, cost efficiency, robustness, reliability, and ease of use. Higher speed and lower
power come with reducing RS-232 voltage levels from ±12 V to ±5.4 V
Majority of RS-232 transceivers require compatibility with power supplies down to 3.3 V and use charge
pumps to boost and invert that voltage to RS-232 voltage levels that are compatible with the standard
> ±5 V.
The trend in recent years is to reduce power dissipation, especially in portable applications. Therefore,
board designers have been reducing power-supply voltages or eliminating them altogether wherever
possible. Lowering supply-voltage levels is a trait common to the semiconductor industry. Consequently,
the burden of generating the necessary RS-232-compliant voltage swings is on the RS-232 driver IC. This
can be accomplished with an internal or external charge pump or DC-DC converter. TI devices incorporate
the RS-232 driver and charge pump in a single solution that makes it easy to design a circuit board using
only a single supply.

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1.2 System Description

The TIDA-01230 reference design combines both data and power isolation along with RS-232
communication interface to provide a robust, low-cost, low footprint solution that customers can directly
place on their designs. This TI Design combines a High-Performance Reinforced Digital Isolator With
Integrated High-Efficiency, Low Emissions DC-DC Converter (ISOW784x) with a Robust 3.3-V Two-
Channel RS-232 Transceiver (TRS3122E).
The TIDA-01230 does not require any additional components to generate the isolated power. This makes
the solution less than a quarter of the size of all existing solutions using a discrete transformer to generate
the required isolated power. This TI Design takes a single power supply input (3 to 5.5 V) and digital
signals referred to the input supply level. The board generates an isolated power supply using an
integrated DC-DC converter. This isolated supply is used to power the RS-232 transceiver. The input
signals are isolated and connected to the transceiver, which converts the digital signals into its RS-232
counterpart. Similarly, RS-232 signals fed at the transceiver end are converted to corresponding digital
signals.
PLCs and grid communication systems have been an integral part of factory automation and industrial
process control. They use digital and analog I/O modules to interface to sensors, actuators, and other
equipment. Analog inputs for the PLC system include temperature sensors and transmitters, current
sensors, voltage sensors, and others that can convert a physical quantity to an electrical signal. Digital
inputs include push-buttons, proximity switches, photo sensors, pressure switches, and more. These
signals need to be either group isolated or per channel isolated. PLCs are expected to work in harsh
industrial environments. Hence sensor signals are converted to digital domain and coupled through a
digital isolator to control domain. For sensor signal conditioning, power is generated from the backplane
side by an isolated DC-DC converter. If multiple channels are present and all are isolated from each other,
then use multiple of these isolated power solutions, which increase solution size and cost and bring down
reliability due to increased component count. Fitting in the TIDA-01230 can significantly reduce the
required area and bring down the BOM cost by eliminating the requirement for discrete transformers.
Medical equipment need isolation patient safety. For ECG, multiple leads are connected to the patient.
The signal chain must be robust enough to capture very weak signals, digitize and process it, and pass it
to the system controller over the isolation barrier. The power for signal processing units is typically
generated by on board isolated DC-DC converters. This power can be replaced directly with the
TIDA-01230 to get both communication and power isolation with the RS-232 interface. Also any peripheral
connected to this equipment must be isolated from the controller. This solution makes sense to digitally
isolate the interface signals and also power up the transceivers.

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1.3 Key System Specifications

Table 1. Key System Specifications

FEATURE SPECIFICATION VALUE
Input supply Input voltage 3 to 5 V
Output voltage 3.3 V
Isolated output supply 75 mA (3.3 VIN)
Output current
130 mA (5 VIN)
Communication Max data rate 1 Mbps (four channels)
Clearance > 3 mm
Isolation Working voltage 300 VRMS
CMTI > 100 kV/µs
6 kV (across barrier)
ESD
EMI or EMC 8 kV (on RS-232 lines)
Radiated emissions CISPR22 (Class A)

1.4 Block Diagram

Isolation
barrier
Input voltage 5 V VISO (3.3 V)

Tx1 Tx1 Tx1

Tx2
Reinforced digital isolator +
Tx2
RS-232 interface
Tx2 } RS-232
outputs

Rx1 DC-DC converter Rx1 Rx1

TRS3122E
ISOW7842
Rx2 Rx2 Rx2 } RS-232
inputs

Copyright © 2017, Texas Instruments Incorporated

Figure 1. TIDA-01230 Block Diagram

Figure 1 shows the high-level block diagram of the TIDA-01230. As previously mentioned, this TI Design
can be broken down into two main sections: the isolation block (ISOW7842) and the interface block
(TRS3122E).
The TIDA-01230 works on a single input of 3 to 5.5 V. The integrated power supply can produce an
isolated output voltage of 3.3 V (for any input) or 5 V (for VCC1 ≥ 5 V). This can be used to power up the
RS-232 interface block. The TIDA-01230 communicates with digital signals on one side and gives the
RS-232 lines on the other. The design can be interfaced to an MCU transmitting and receiving data using
both channels (two for transmitting and two for receiving data). These signals are isolated from the RS-
232 lines available for communication to the field side. The side A of the isolator is powered from a 5-V or
3.3-V power supply, the secondary side of the isolator will be powered through the integrated isolated
power supply. The integrated power supply can produce two voltage configurations on side B: 5 V or 3.3 V
for the 5-V supply on side A, and 3.3 V for the 3.3-V supply on side A.
The load in this TI Design is the RS-232 transceiver. The design can interface with the MCU to transmit
and receive data and enable transmission and reception. The signals to and from the MCU are isolated
from the transceiver. The TIDA-01230 board can be broken down to two main sections: the isolation block
and the interface block.

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1.5 Highlighted Products

The TIDA-01230 features the following devices from Texas Instruments.

1.5.1 ISOW7842
The ISOW784x is a family of high-performance quad-channel reinforced digital isolators with an integrated
high-efficiency power convertor. The integrated DC-DC convertor provides up to 650 mW of isolated
power at high efficiency and can be configured for various input and output voltage configurations. These
devices eliminate the need for a separate isolated power supply in space-constrained isolated designs.
ISOW784x devices provide high electromagnetic immunity and low emissions, while isolating CMOS or
LVCMOS digital I/Os. The signal isolation channel has a logic input and output buffer separated by a
silicon dioxide (SiO2) insulation barrier, whereas power isolation uses on-chip transformers separated by a
thin film polymer as insulation material. These devices prevent noise currents on a data bus or other
circuits from entering the local ground and interfering with or damaging sensitive circuitry. Through
innovative chip design and layout techniques, the electromagnetic compatibility of the ISOW784x has
been significantly enhanced to ease system level ESD, EFT, surge, and emissions compliance. The high
efficiency of the power convertor allows operation at a higher ambient temperature. The ISOW784x family
of devices is available in a 16-pin SOIC wide-body (DWE) package.
• Integrated high efficiency DC-DC convertor with on-chip transformer
• Wide input supply range: 3 to 5.5 V
• Regulated 5- or 3.3-V output
• Up to 0.65-W output power
• 130-mA load current (5 VIN to 5 VISO; 5 VIN to 3.3 VISO;)
• 75-mA load current (3.3 VIN to 3.3 VISO)
• Soft start to limit inrush current
• Overload and short-circuit protection
• Thermal shutdown
• Signaling rate up to 100 Mbps
• Low prop-delay: 13 ns typical (5-V supply)
• High CMTI: ±100 kV/µs min)
• Robust electromagnetic compatibility (EMC)
– System level ESD, EFT, and surge immunity
– Low radiated emissions
• Safety-related certifications
– 7071-VPK Reinforced Isolation per DIN V VDE V 0884-10 (VDE V 0884-10): 2006-12
– 5000-VRMS Isolation for 1 Minute per UL 1577
– CSA Component Acceptance Notice 5A, IEC 60950-1 and IEC 60601-1 End Equipment Standards
– CQC Approval per GB4943.1-2011
– TUV Certification according to EN 60950-1 and EN 61010-1
– All agency certifications are planned
• Extended temperature range: –40°C to 125°C

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1.5.2 TRS3122E
The TRS3122E is a two-driver and two-receiver RS-232 interface device, with split supply pins for mixed
voltage operation. All RS-232 inputs and outputs are protected to ±15 kV using the IEC 61000-4-2 Air-Gap
Discharge method, ±8 kV using the IEC 61000-4-2 contact discharge method, and ±15 kV using the
human-body model. The charge pump requires five small 0.1-μF capacitors for operation from as low as a
1.8-V supply. The TRS3122E is capable of running at data rates up to 1000 kbps, while maintaining RS-
232- compatible output levels.
• Extended VCC operating nodes: 1.8 V, 3.3 V, or 5.0 V
– Unique tripler charge pump architecture enables low VCC of 1.8 V while maintaining compatibility
with 3.3-V and 5-V supplies.
• Integrated level-shifting functionality eliminates the need for external power or additional level shifter
while interfacing with low-voltage MCUs
• Enhanced ESD protection on RIN inputs and DOUT outputs
– ±15-kV IEC 61000-4-2 air-gap discharge
– ±8-kV IEC 61000-4-2 contact discharge
– ±15-kV human-body model
• Specified 1000-kbps data rate
• Auto powerdown plus feature
• Low 0.5-µA shutdown supply current
• Meets or exceeds compatibility requirements of RS-232 interface

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www.ti.com Getting Started Hardware

2 Getting Started Hardware

2.1 Board Description

Figure 2 shows the size of the isolated RS-232 with an integrated power solution. The solution space
within the board has been marked in red and is slightly bigger than the ISOW7842 IC. The board including
all the connectors measures 21.1 × 12.7 mm while the actual solution space (marked in red) is 14.8 × 11.5
mm.

Figure 2. Solution Space

Figure 3 shows the locations of the connectors on the board for interfacing with the solution.

J1
J2
Digital and
RS-232 side
MCU side

Figure 3. Connectors

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2.2 Connectors Description

Table 2. Connectors
I/O OR
CONNECTOR PIN POSITION PIN NAME DESCRIPTION
POWER
1 VIN Power Input supply (3 to 5.5 V)
2 Tx1 I Digital driver input
3 Tx2 I Digital driver input
J1
4 Rx1 O Digital receiver output
5 Rx2 O Digital receiver output
6 GND1 Ground Input supply ground
1 VISO Power Isolated power output
2 TxD1 O RS-232 output
3 TxD2 O RS-232 output
J2
4 RxD1 I RS-232 receiver input
5 RxD2 I RS-232 receiver input
6 GND1 Ground Isolated output ground

The design comes pre-populated with two of the TI ICs (ISOW7842 and TRS3122E). VIN and GND1 are
connected at Pin 1 and Pin 6 of J1, respectively. Two channels are available for transmitting using RS-232
and two channels for receiving RS-232 signals. The digital inputs can be applied to Pin 2 and Pin 3 of J1
and the digital counterparts of the received RS-232 signals can be observed on Pin 4 and Pin 5 of J1. On
the other side of the board, the corresponding RS-232 signals for the digital inputs from the MCU side can
be observed at Pin 2 and Pin 3 of J2. Similarly, the RS-232 input signals can be given at Pin 4 and Pin 5
of J2. The boards include male berg heads to allow bus cables to be securely attached.
Connect MCU Tx lines to Pin 2 and Pin 3 of J1 and MCU Rx lines to Pin 4 and Pin 5 of J1. The
corresponding RS-232 lines are available as four separate connections at J2, which can be connected
directly to end system using required cables. The TI Design has four channels that can be used
depending on the connections from the MCU side.
This TI Design can be extended to other RS-232 transceivers by replacing the existing transceiver on the
board and selecting the right voltage configuration. The isolated output voltage configuration can be easily
changed by changing the resistor combination of R1 and R2. See Table 3 to understand how to realize
the required voltage configuration.

Table 3. Voltage Configurations

INPUT VOLTAGE (V) OUTPUT VOLTAGE (V) R1 (Ω) R2 (Ω)
5.0 Populate Do Not Populate
5.0
3.3 Do Not Populate Populate
3.3 Do Not Populate Populate
3.3
5.0 Invalid configuration Invalid configuration

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www.ti.com Testing and Results

3 Testing and Results

3.1 Test Setup

VCC 5V VISO

VIN
GND

Tx1 TxD1
INA OUTA DIN1 DOUT1
3k 500 pF

Tx2
INB OUTB DIN2 DOUT2 TxD2

Rx1 ISOW7842 TRS3122E

Signal Oscilloscope
generator OUTC INC ROUT1 RIN1 RxD1

Rx2
OUTD IND ROUT2 RIN2 RxD2

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Figure 4. Test Setup

3.2 Communication Functionality

Waveforms were captured at max data rate from digital to RS-232 side.

Figure 5. Digital to RS-232 Communication

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3.3 Propagation Delay

Figure 6. Propagation Delay (Low to High)

Figure 7. Propagation Delay (High to Low)

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3.4 IEC-ESD Performance (IEC-61000-4-2)

Contact discharge IEC-ESD testing was performed on the TIDA-01230 using a pointed contact discharge
tip. The board was subjected to mainly two kinds of ESD strikes. In the "Across barrier" row, the interface
side was struck with the reference ground or power earth connected at the MCU side ground (GND1).
Similarly for the "Same side" row, the interface lines were struck with the reference ground or power earth
connected to the interface side ground (GND2). Table 4 shows the IEC-ESD test results. Each of the
stressed pins were subjected to 10 strikes of each polarity of the corresponding stress voltage.

Table 4. IEC-ESD Results

NATURE OF STRIKE STRIKE POINT STRESS VOLTAGE RESULT
VISO ±8 kV Pass
TxD1 ±8 kV Pass
TxD2 ±8 kV Pass
Across barrier
RxD1 ±8 kV Pass
RxD2 ±8 kV Pass
GND2 ±8 kV Pass
TxD1 ±8 kV Pass
TxD2 ±8 kV Pass
Same side
RxD1 ±8 kV Pass
RxD2 ±8 kV Pass

3.5 Radiated Emissions (CISPR 22)

The emission measurements were done according to CISPR 22 standards in a certified facility.Figure 8
shows the emissions measurement for the TIDA-01230 when the communication lines were being
operated under a static high condition.

Figure 8. Radiated Emissions (CISPR 22)

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Design Files www.ti.com

4 Design Files

4.1 Schematics
To download the schematics, see the design files at TIDA-01230.

4.2 Bill of Materials

To download the bill of materials (BOM), see the design files at TIDA-01230.

4.3 PCB Layout Recommendations

4.3.1 Layout Prints

To download the layer plots, see the design files at TIDA-01230.

4.4 Altium Project

To download the Altium project files, see the design files at TIDA-01230.

4.5 Gerber Files

To download the Gerber files, see the design files at TIDA-01230.

4.6 Assembly Drawings

To download the assembly drawings, see the design files at TIDA-01230.

5 Related Documentation
1. Texas Instruments, ISOW784x High-Performance, 5000-VRMS Reinforced Quad-Channel Digital
Isolators With Integrated High-Efficiency, Low-Emissions DC-DC Converter, ISOW784x Datasheet
(SLLSEY2)
2. Texas Instruments, TRS3122E 1.8 V Low Power Dual RS-232 Transceiver, TRS3122E Datasheet
(SLLSET7)
3. Texas Instruments, Isolated RS-485 With Integrated Signal and Power Reference Design, TIDA-00892
Design Guide (TIDUCT4)

5.1 Trademarks
All trademarks are the property of their respective owners.

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www.ti.com About the Authors

6 About the Authors

ANAND REGHUNATHAN is an applications engineer at Texas Instruments, where he is responsible for
defining new high-performance products and providing application support on existing products for
industrial and automotive markets, specifically for isolation products. Anand brings to the role an
experience in EMC testing for both isolation and interface products. Anand earned his bachelor of
technology (B.Tech) in electronics and communications engineering from College of Engineering,
Trivandrum, India.
NEERAJ BHARDWAJ is an applications engineer at Texas Instruments, where he is responsible for
defining new high-performance analog products and application support on existing products for industrial
and automotive markets. He has a high level of experience in motor drive systems and high-voltage
systems with an emphasis in safety applications, standards, test and characterization of mixed signal
processors, and EMC cognizant systems design. In his previous role, he led the Systems and Applications
team in the Safety and Security Microcontroller Group in TI. He mentors teams on competitive robotics.
He has over 20 years of experience in the industry and has worked for TI since 2005. He has a B.E.
degree in electrical engineering specialized in high voltage and power electronics from the Government
Engineering College Jabalpur and an M.Tech. degree in aerospace engineering specialized in control and
guidance from the Indian Institute of Technology Bombay.

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