sn74hct257
sn74hct257
VCC
A/B
NC
OE
1A
A/B 1 16 VCC
1A 2 15 OE 3 2 1 20 19
1B 4 18 4A
1B 3 14 4A
1Y 5 17 4B
1Y 4 13 4B
NC 6 16 NC
2A 5 12 4Y
2A 7 15 4Y
2B 6 11 3A
2B 8 14 3A
2Y 7 10 3B 9 10 11 12 13
GND 8 9 3Y
2Y
3Y
3B
GND
NC
NC − No internal connection
description/ordering information
The ’HCT257 devices are designed to multiplex signals from 4-bit data sources to 4-output data lines in
bus-organized systems. The 3-state outputs do not load the data lines when the output-enable (OE) input is at
the high logic level.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
ORDERABLE TOP-SIDE
TA PACKAGE†
PART NUMBER MARKING
PDIP − N Tube of 25 SN74HCT257N SN74HCT257N
Tube of 40 SN74HCT257D
−40°C to 85°C
SOIC − D Reel of 2500 SN74HCT257DR HCT257
Reel of 250 SN74HCT257DT
CDIP − J Tube of 25 SNJ54HCT257J SNJ54HCT257J
−55°C to 125°C
LCCC − FK Tube of 55 SNJ54HCT257FK SNJ54HCT257FK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
!"#$%&' #"'(' Copyright 2003, Texas Instruments Incorporated
')"*%("' #$**&' ( ") +$,-#("' !(&. *"!$# #"')"*% "
+&#)#("' +&* & &*% ") &/( '*$%&' ('!(*! 0(**('1.
*"!$#"' +*"#&'2 !"& '" '&#&(*-1 '#-$!& &'2 ") (--
+(*(%&&*.
FUNCTION TABLE
INPUTS
OUTPUT
SELECT DATA
OE Y
A/B A B
H X X X Z
L L L X L
L L H X H
L H X L L
L H X H H
1
A/B
2
1A
4
1Y
3
1B
5
2A
7
2Y
6
2B
11
3A
9
3Y
10
3B
14
4A
12
4Y
13
4B
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±35 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±70 mA
Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
50 pF
tpd or tt −− or Open Open
150 pF
LOAD CIRCUIT
3V Output
3V
Input 1.3 V 1.3 V Control
1.3 V 1.3 V
0V (Low-Level
Enabling) 0V
tPLH tPHL
tPZL tPLZ
In-Phase VOH ≈VCC
90% 90% Output
Output 1.3 V 1.3 V Waveform 1 1.3 V
10% 10% V
OL (See Note B) 10% VOL
tr tf
tPHL tPLH tPZH tPHZ
Out-of- VOH
90% 90% Output VOH
Phase 1.3 V 1.3 V 90%
Output 10% 10% Waveform 2 1.3 V
VOL (See Note B) ≈0 V
tf tr
www.ti.com 14-Oct-2022
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
SN74HCT257D ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HCT257 Samples
SN74HCT257DR ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HCT257 Samples
SN74HCT257N ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -40 to 85 SN74HCT257N Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 14-Oct-2022
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Jan-2022
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Jan-2022
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Jan-2022
TUBE
Pack Materials-Page 3
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